Temperature control device and temperature control system that provide a temperature-controlled space for individual semiconductor products in the testing of semiconductor products.

Abstract

The present invention provides temperature control devices and temperature control systems for HBM or similar micro-sized semiconductor products. [Solution] In a test of a semiconductor product according to one embodiment of the present invention, a temperature control system that provides a temperature-controlled space for individual semiconductor products may include an insert for loading semiconductor products in a housing space with one side open, a test tray on which a plurality of the inserts are mounted, a tester for testing the semiconductor products through the inserts with the test tray mounted, and a temperature control device that is in close contact with one side of the test tray or the insert with the test tray mounted on the tester, and separates the housing space from the outside space to adjust the temperature of the housing space.

Description

Technical Field

[0001] The present invention relates to a temperature control device and a temperature control system that provide a temperature control space for individual semiconductor products in the test of semiconductor products.

Background Art

[0002] The background of the birth of HBM (High Bandwidth Memory) mainly started from the demand for an increase in memory bandwidth generated by high-performance application programs such as computers and graphics processing units. Existing GDDR (Graphics Double Data Rate) memory technology was widely used in high-performance graphics cards and systems, but it reached its limit due to the increasing bandwidth requirements. Therefore, memory manufacturers needed a new technology that could provide a higher bandwidth and process data more efficiently.

[0003] To meet such needs, HBM adopted an innovative design that forms a memory chip stack. HBM can achieve a high bandwidth by using vertically stacked memory chips and can provide the advantage of reducing power consumption while occupying less space. Such characteristics have become the background for HBM to attract attention as the importance of memory bandwidth and power efficiency in high-performance computing and graphics processing systems has become even greater.

[0004] On the other hand, considering the efficient aspect of testing, HBM needs to be tested in the die state before packaging. HBM dies are structurally equipped with far more contacts than existing memories, and have the characteristic that many contacts are provided with a fine pitch in a limited area.

[0005] Many such contacts of HBM require a high degree of accuracy in electrically connecting to the socket terminals of the tester, and it was difficult to keep the test environment constant due to a lot of heat generation caused by integration. [Overview of the project] [Problems that the invention aims to solve]

[0006] The problem that this invention aims to solve is to provide a temperature control device and temperature control system for HBM or similar micro-sized semiconductor products.

[0007] The problems addressed by the present invention are not limited to those mentioned above, and other problems not mentioned will be clearly understood by those skilled in the art from the following description. [Means for solving the problem]

[0008] In a test of a semiconductor product according to one embodiment of the present invention for solving the above problem, the temperature control system that provides a temperature-controlled space for individual semiconductor products may include an insert for loading semiconductor products in a housing space with one side open, a test tray on which a plurality of the inserts are mounted, a tester for testing the semiconductor products through the inserts with the test tray mounted, and a temperature control device that is in close contact with one side of the test tray or the insert with the test tray mounted on the tester, separating the housing space from the external space and adjusting the temperature of the housing space.

[0009] The temperature control device may include a packing block that is in close contact with the test tray or insert and has a discharge port for discharging a temperature-controlled test gas into the containment space, and an exhaust port for discharging the test gas from the containment space to the outside.

[0010] The temperature control device may further include an auxiliary fluid discharge pipe that is positioned through the packing block and discharges an auxiliary fluid for temperature control into the containment space.

[0011] The temperature control device may further include a gas circulator that circulates the test gas to adjust the temperature, and a duct block that distributes and transmits the test gas transmitted from the gas circulator to a plurality of packing blocks, and transmits the test gas exhausted through the plurality of packing blocks to the gas circulator.

[0012] The temperature control device may further include a temperature measuring sensor that is built into the packing block or the duct block and measures the temperature.

[0013] The temperature control device may further include a distribution plate that forms a circulation path for the test gas between a plurality of duct blocks and the gas circulator.

[0014] One side of the distribution plate facing the test tray is formed to have an area corresponding to the test tray, and each of the duct blocks can be arranged on the one side of the distribution plate so as to correspond to different areas on the test tray.

[0015] The temperature control device may further include a heat exchange unit that is positioned in the duct block and controls the temperature of the test gas distributed to the plurality of packing blocks.

[0016] The temperature control device may further include a circulation chamber in which the gas circulator is positioned so that the test gas is kept at a controlled temperature, and which provides a space through which the test gas is circulated.

[0017] The temperature control device may further include a dry chamber that houses the circulation chamber and maintains the temperature of the internal space within a predetermined range.

[0018] The temperature control device may further include a dry chamber in which the circulation chamber is placed and the humidity of the internal space is regulated.

[0019] In the duct block, a discharge flow path that extends linearly in the direction of the packing block and communicates with the discharge port, and an exhaust flow path that communicates with the exhaust port and is bent at least once inside the duct block can be formed.

[0020] The discharge port and the exhaust port can be formed so as to be located on the central axis of the upper surface of the accommodation space.

[0021] The temperature adjustment device can further include a packing member that shields a gap between the packing block and the insert in a state where the packing block is in close contact with the test tray or the insert.

[0022] A temperature adjustment device that provides a temperature adjustment space for a semiconductor product according to an embodiment of the present invention for solving the above problems includes a discharge port that is in close contact with a test tray on which the insert is mounted or the insert and discharges test gas having a temperature adjusted in the accommodation space, and a packing block in which an exhaust port for discharging the test gas from the accommodation space to the outside is formed.

[0023] Other specific matters of the present invention are included in the detailed description and the drawings.

Effects of the Invention

[0024] According to an embodiment of the present invention, there are at least the following effects.

[0025] A temperature adjustment space is formed for each semiconductor product, and temperature adjustment can be performed according to the test situation of each semiconductor product.

[0026] Since the space around the semiconductor product is used as a single chamber in a state where each semiconductor product is loaded on the insert, a configuration such as an existing preheating and heat removal chamber can be omitted, and the equipment can be miniaturized.

[0027] The gas used in the test can be circulated without being mixed with the outside air by a circulation chamber, maintaining the temperature, and the time to prepare the test environment can be minimized.

[0028] With a dry chamber incorporating a temperature control device, it may be easy to maintain the thermal environment for the test environment. Also, the dry chamber can prevent the occurrence of condensation during low-temperature tests.

[0029] The effects according to the present invention are not limited by the contents exemplified above, and various other effects are included in this specification.

Brief Description of the Drawings

[0030] [Figure 1] It is a diagram schematically showing a temperature control system that provides a temperature control space for individual semiconductor products in the test of a semiconductor product according to an embodiment of the present invention. [Figure 2] It is a diagram showing a test tray and an insert according to an embodiment of the present invention. [Figure 3] It is a diagram conceptually showing a temperature control device according to an embodiment of the present invention. [Figure 4] It is a diagram showing a state in which one region temperature control part is separated in a distribution plate according to an embodiment of the present invention. [Figure 5] It is a diagram of each region temperature control part according to an embodiment of the present invention as viewed from above. [Figure 6] It is a diagram for explaining a state in which a packing block according to an embodiment of the present invention is coupled to a duct block. [Figure 7] It is a diagram showing a state in which the packing block according to an embodiment of the present invention is separated in FIG. 6. [Figure 8] It is a diagram showing the normal state of a packing block according to an embodiment of the present invention. [Figure 9] It is a diagram showing a state in which another packing block is adhered to a test tray in an embodiment of the present invention. [Figure 10]Figure 5 is a schematic diagram showing the situation when one of the regional temperature control units is in close contact with the test tray. [Figure 11] This figure illustrates the movement of a test gas through an expanded groove according to one embodiment of the present invention. [Figure 12] This figure shows a duct block in which multiple packing blocks are attached, according to another embodiment of the present invention. [Figure 13] Figure 12 shows that one of the packing blocks has been separated. [Figure 14] This is a schematic cross-sectional view of a duct block and a packing block according to another embodiment of the present invention. [Modes for carrying out the invention]

[0031] The advantages and features of the present invention, and methods for achieving them, will become apparent with reference to the embodiments described below in detail with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below and can be realized in a variety of different forms, and these embodiments are provided merely to complete the disclosure of the present invention and to fully inform a person ordinary skill in the art to which the invention belongs of the category of invention, and the present invention is defined only by the category of claims.

[0032] Furthermore, embodiments described herein are explained with reference to cross-sectional and / or schematic diagrams that are ideal illustrative representations of the present invention. Therefore, the forms in the illustrative diagrams may be modified due to manufacturing techniques and / or tolerances. Also, in the figures shown in the present invention, each component may be shown in a slightly enlarged or reduced manner for ease of explanation. Throughout the specification, the same reference numeral refers to the same component.

[0033] Hereinafter, the present invention will be described with reference to drawings illustrating temperature control devices and temperature control systems that provide temperature-controlled spaces for individual semiconductor products in the testing of semiconductor products according to embodiments of the present invention.

[0034] It is clear that the up, down, left, and right directions mentioned below may be changed during the process of carrying out the invention, and these directions are used solely to complete the disclosure of the present invention.

[0035] Figure 1 is a schematic diagram of a temperature control system that provides a temperature-controlled space for individual semiconductor products in the testing of semiconductor products according to one embodiment of the present invention. Figure 2 is a diagram of a test tray and insert according to one embodiment of the present invention. The temperature-controlled space referred to below means a space in which the temperature is controlled for testing of semiconductor products, and in the present invention, the containment space AS described later can correspond to the temperature-controlled space.

[0036] As shown in Figures 1 and 2, the temperature control system 1 according to one embodiment of the present invention includes a temperature control device 100, a tester 200, an insert 300, and a test tray 400.

[0037] The temperature control device 100 can create a test environment for the semiconductor product D loaded on the insert 300. For example, the semiconductor product D can transmit and receive signals with the tester 200 under high temperature, room temperature, and / or low temperature conditions, undergo performance checks, and be classified as good / defective / re-tested, etc. In this case, the temperature control device 100 can adjust the temperature atmosphere around the semiconductor product D to create the aforementioned high temperature, room temperature, and / or low temperature conditions. For example, the high temperature can be set in the range of 60 to 200 degrees Celsius, and the low temperature in the range of 0 to -100 degrees Celsius. However, the temperature range can be varied in various ways depending on the characteristics of the semiconductor product.

[0038] Such a temperature control device 100 may include a dry chamber 110, a circulation chamber 120, and a duct section 130.

[0039] The dry chamber 110 may be configured to help maintain the internal temperature of the circulation chamber 120 at a temperature suitable for the test environment and to prevent condensation formation during low-temperature tests. For this purpose, the internal temperature of the dry chamber 110 may be maintained within a predetermined range. Although not shown, the dry chamber 110 may be provided with a chamber temperature control unit to regulate the internal temperature to a constant level in order to maintain the internal temperature within a predetermined range. The chamber temperature control unit may be provided as various conventional heat exchangers that create a constant temperature environment inside the chamber. Also, although not shown, the dry chamber 110 may have a gate that allows the duct section 130 to enter and exit.

[0040] More specifically, the internal temperature of the dry chamber 110 can be maintained at approximately 60°C or higher. Such temperature conditions maintain an atmosphere warmer than ambient temperature around the circulation chamber 120, helping the circulation chamber 120 maintain a high temperature environment.

[0041] Furthermore, the dry chamber 110 may be configured to supply dry air at a predetermined temperature from which moisture has been removed, and to maintain and ventilate the internal space by exhausting the internal air to the outside to keep it dry. For example, the dry chamber 110 may have a fan on one side to supply dry air and a vent on the other side. As a result, when the internal temperature of the circulation chamber 120 is below freezing, the dry chamber 110 can regulate the humidity and / or temperature around the duct section 130 to prevent condensation.

[0042] The circulation chamber 120 is located inside the dry chamber 110 and may provide a space through which a test gas is circulated to create a test environment around the semiconductor product D. The circulation chamber 120 may have the effect of shortening the test time by ensuring that the test gas is circulated at a temperature adjusted to suit the test.

[0043] The duct section 130 may be positioned adjacent to one surface of the test tray 400 loaded into the tester 200. The duct section 130 may be configured to selectively inject the test gas circulating in the circulation chamber 120 toward the test tray 400. A detailed explanation of this will follow later.

[0044] The tester 200 may be designed to be electrically connected to the semiconductor product D loaded on the insert 300 when the test tray 400 is mounted, and to send and receive signals for testing with the semiconductor product D. For this purpose, the tester 200 may have a built-in main board designed to send and receive electrical signals for testing. The tester 200 may have sockets formed to correspond to the arrangement of the upper insert 300 of the test tray 400. When the test tray 400 is mounted on the tester 200, the semiconductor product D and the test terminals of the sockets can be electrically connected. The test terminals of the sockets may be implemented in various conventionally known configurations, such as pogo pins or conductive rubber pads.

[0045] The insert 300 has a stacking structure that corresponds to semiconductor product D, and multiple inserts can be mounted on the test tray 400. The stacking structure that corresponds to semiconductor product D can mean a structure that stacks semiconductor product D according to its shape and holds the stacked semiconductor product D in a position corresponding to the socket of the tester 200.

[0046] Such an insert 300 may include an insert body 310, a contact board 320, an interface board 330, and a latch 340. The insert body 310 may be a frame formed in a structure and shape that is mounted on a test tray 400, having a housing space AS with one side open, and on which a semiconductor product D is loaded. The contact board 320 may be in contact with the bottom surface of the semiconductor product D loaded on the insert 300. The contact board 320 may also have contact terminals that are in physical and electrical contact with the terminals of the loaded semiconductor product D. The interface board 330 may be located on the back surface of the contact board 320 and may have a wiring pattern that is electrically connected to the contact terminals and external terminals that are exposed to the outside so as to be electrically connected to a socket. The external terminals may have an expanded pitch compared to the contact terminals to facilitate alignment with the socket. The wiring pattern may be formed to electrically connect the external terminals and the contact terminals. The latch 340 can be implemented in various known configurations as a device for maintaining the position of the semiconductor product D loaded on the insert body 310. For example, the latch 340 may be a clamp-type member that can hold the semiconductor product D with elastic force.

[0047] With this configuration, according to one embodiment of the present invention, the semiconductor product D can be electrically connected to the socket via the insert 300 and tested while the test tray 400 is mounted and / or in contact with the tester 200.

[0048] The test tray 400 can have grooves formed in it to accommodate individual insert bodies 310 at positions corresponding to the sockets. The general configuration of the test tray 400 is conventionally known, so a detailed description will be omitted.

[0049] The duct section 130 according to one embodiment of the present invention will be described below with reference to Figure 3. Figure 3 is a conceptual diagram of a temperature control device according to one embodiment of the present invention.

[0050] As shown in Figure 3, the duct section 130 according to one embodiment of the present invention may include a gas circulator 131, a distribution plate 132, a duct block 133, and a packing block 134.

[0051] The gas circulator 131 may be configured to circulate a test gas and regulate its temperature. For example, the test gas may be temperature-controlled air or gas. Such a gas circulator 131 may include a circulation housing 1311, a gas temperature controller 1312, a fan 1313, a supply pipe 1314, and a recovery pipe 1315.

[0052] The circulation housing 1311 is located inside the circulation chamber 120 and may be a housing that incorporates a fan 1313. The gas temperature controller 1312 may be incorporated into or adjacent to the circulation housing 1311 and may be configured to regulate the temperature atmosphere inside the circulation chamber 120. For example, the gas temperature controller 1312 may be comprised of various conventionally known heat exchangers. The fan 1313 may be a blower that circulates the test gas inside the circulation chamber 120. The supply pipe 1314 may be configured to transmit the test gas supplied from the fan 1313 to the distribution plate 132, and the recovery pipe 1315 may be configured to move the test gas exhausted from the distribution plate 132 back into the circulation chamber 120.

[0053] The distribution plate 132 can form a circulation path for test gas between the multiple duct blocks 133 and the gas circulator 131. This will be explained later with reference to Figure 4.

[0054] Multiple duct blocks 133 can be coupled on one surface of the distribution plate 132 to distribute and transmit the test gas transmitted from the gas circulator 131 to multiple packing blocks 134. Furthermore, the duct blocks 133 can be connected to the distribution plate 132 to deliver the test gas exhausted through the connected packing blocks 134 back to the distribution plate 132.

[0055] The packing block 134 can be placed in close contact with one side of the test tray 400 or insert 300 (see Figure 2) when the test tray 400 (see Figure 2) is mounted on the tester 200 (see Figure 1), thereby separating the containment space (AS; see Figure 2) from the external space. Furthermore, the packing block 134 can transmit the test gas supplied from the duct block 133 into the containment space AS, thereby regulating the internal temperature of the containment space AS.

[0056] The gas distribution structure of the distribution plate 132 and the areas covered by each duct block 133 will be described below with reference to Figures 4 and 5. For the sake of explanation, when referring to a single duct block 133 and the packing block 134 attached thereto, they will be referred to as the area temperature control units 1301, 1302, 1303, 1304, 1305, 1306, 1307, 1308, 1309, 1310, 1311, 1312, 1313, 1314, 1315, and 1316 (hereinafter referred to as 1301-1316).

[0057] Figure 4 shows a distribution plate according to one embodiment of the present invention, in which one region temperature control unit is separated. In contrast, Figure 5 is a top view of each region temperature control unit according to one embodiment of the present invention.

[0058] As shown in Figures 4 and 5, multiple region temperature control units 1301 to 1316 can be mounted on one side of the distribution plate 132. In this case, the distribution plate 132 is formed to have an area corresponding to the test tray 400 (see Figure 2), and each region temperature control unit 1301 to 1316 is responsible for controlling the temperature of one region on the test tray 400. This allows the packing block 134 of any one of the region temperature control units 1301 to 1316 to be responsible for adjacent inserts 300 (see Figure 2) on the test tray 400. This may take into account that the thermal environments of adjacent inserts 300 are similar while the test is being conducted by the tester 200 (see Figure 1). For this reason, each region temperature control unit 1301 to 1316 may have a built-in heat exchange unit so that its temperature is controlled independently of the other region temperature control units 1301 to 1316. The heat exchange unit will be described later.

[0059] Individual supply channels 1321 and a collective recovery channel 1322 can be formed on one surface of the distribution plate 132 for fluid communication with the respective region temperature control sections 1301 to 1316. The circulation path for the test gas between the duct block 133 and the gas circulator 131 (see Figure 1) can be formed by the individual supply channels 1321 and the collective recovery channel 1322.

[0060] The individual supply channels 1321 can form gas transfer paths perpendicular to the packing block 134 so that the temperature-controlled test gas is supplied to the containment space AS with minimal heat loss. To this end, the individual supply channels 1321 can pass through each packing block 134, one by one, corresponding to the discharge port, so as to have the same central axis as the discharge port of each packing block 134.

[0061] The collective recovery channel 1322 can form a gas transfer path that collects the test gas recovered from each packing block 134 and returns it to the gas circulator 131. Since the test gas that is recovered to the gas circulator 131 is collected and recovered in the collective recovery channel 1322, the transfer path of the test gas moving from the packing block 134 to the gas circulator 131 will bend at least once.

[0062] Specifically, the multiple individual supply channels 1321 connected to any one of the region temperature control units 1301-1316 can be positioned one by one along the edge of a virtual rectangle on one surface of the distribution plate 132. That is, when the central axes of the multiple individual supply channels 1321 are connected, a rectangle is drawn on one surface of the distribution plate 132. In contrast, the collective recovery channel 1322 connected to any one of the region temperature control units 1301-1316 can be positioned in the center of the rectangle formed by the individual supply channels 1321.

[0063] In the example shown in Figures 4 and 5, 16 regional temperature control units 1301 to 1316 are arranged in a 4x4 grid, and each of the regional temperature control units 1301 to 1316 is fitted with 8 packing blocks 134. In this case, the distribution plate 132 has 8 individual supply channels 1321 and 1 collective recovery channel 1322 at positions corresponding to each regional temperature control unit 1301 to 1316, allowing for a total of 128 individual supply channels 1321 and 16 collective recovery channels 1322.

[0064] However, the distribution plates 132 and / or regional temperature control units 1301 to 1316 according to the present invention are not limited to such a number and / or arrangement, and the aforementioned number and / or arrangement can be changed in various ways depending on the condition of the test tray 400, insert 300 and / or semiconductor product D.

[0065] At the end of the distribution plate 132 adjacent to the circulation chamber 120, a number of connecting ducts 1323, 1324 may be formed for connecting to the supply pipe 1314 (see Figure 3) and / or the recovery pipe 1315 (see Figure 3).

[0066] For example, multiple connecting ducts 1323, 1324 may be configured such that some parts connect the individual supply channels 1321 of the distribution plate 132 to the supply pipe 1314, and other parts connect the collective collection channel 1322 to the collection pipe 1315.

[0067] As another example, connecting ducts 1323 and 1324 can connect the individual supply channels 1321 and supply pipes 1314 of adjacent temperature control units 1301 to 1316, and connect the collective recovery channel 1322 and recovery pipe 1315 of adjacent temperature control units 1301 to 1316, so as to be responsible for supplying and recovering gas to adjacent temperature control units 1301 to 1316. For example, in the example shown in Figures 4 and 5, the left connecting duct 1323 can construct the gas circulation path for the eight temperature control units 1303, 1304, 1307, 1308, 1311, 1312, 1315, and 1316 on the left side, and the right connecting duct 1324 can construct the gas circulation path for the eight temperature control units 1301, 1302, 1305, 1306, 1309, 1310, 1313, and 1314 on the right side.

[0068] The packing block 134 and duct block 133 according to one embodiment of the present invention will be further described below with reference to Figures 6 and 7. In order to briefly show the coupling structure of both components, Figures 6 and 7 separately show only the portion of the duct block 133 that is coupled to either one of the packing blocks 134. First, Figure 6 is a diagram illustrating the state in which the packing block according to one embodiment of the present invention is coupled to the duct block. In contrast, Figure 7 is a diagram showing the state in which the packing block according to one embodiment of the present invention is separated in Figure 6.

[0069] Referring to Figures 6 and 7, the packing block 134 can be coupled to one side of the duct block 133 so as to be able to move back and forth. For this purpose, the packing block 134 includes a push end 1343 and a guide end 1344 that project toward the back surface of the packing plate 1340, and the duct block 133 can have through holes that accommodate the push end 1343 and the guide end 1344, respectively.

[0070] The packing plate 1340 may be a plate-shaped member that is in close contact with the test tray 400 (see Figure 2) and separates the containment space (AS; see Figure 2) from the external space. The packing plate 1340 may have a stepped shape with its edges recessed in the back direction. In this case, the recessed portion can push the test tray 400 during the testing process, and the central protrusion can act as the ceiling of the containment space AS.

[0071] The packing plate 1340 may have an outlet 1341 and an exhaust port 1342. The outlet 1341 is connected to a discharge channel 1331, which will be described later, and can discharge the test gas into the containment space AS. The exhaust port 1342 is connected to an exhaust channel 1332, which will be described later, and can exhaust the test gas that is discharged from the containment space AS to the outside. The outlet 1341 and the exhaust port 1342 may be formed in part on the packing plate 1340 and in other parts on the push end 1343. For example, the outlet 1341 and the exhaust port 1342 may be formed by penetrating substantially vertically from one surface of the packing plate 1340 to the end of the push end 1343.

[0072] The packing plate 1340 is formed in a roughly rectangular parallelepiped shape, and the discharge port 1341 and exhaust port 1342 can be aligned on a central axis passing through the center of the short side of the packing plate 1340. This allows the discharge port 1341 and exhaust port 1342 to be located on the central axis of the upper surface of the containment space AS when the packing plate 1340 is in close contact with the test tray 400. On the other hand, the discharge port 1341 can be located in the center of one surface of the packing plate 1340, and the exhaust port 1342 can be located eccentrically on one side of the packing plate 1340.

[0073] The push end 1343 may be a cylindrical member having a through hole extending in the direction of the duct block 133 on the back surface of the packing plate 1340. In this case, the through hole passing through one end and the other end of the push end 1343 may become a discharge port 1341 or an exhaust port 1342. The discharge port 1341 and the exhaust port 1342 may be formed by passing through along the central axis of the push end 1343. The circulation path of the test gas is changed as the push end 1343 moves forward and backward, and this will be explained later with reference to Figures 8 and 9. Of the two push ends 1343, the push end 1343 that forms the discharge port 1341 is located on the central side of the back surface of the packing plate 1340, and the push end 1343 that forms the exhaust port 1342 may be eccentric to one side on the back surface of the packing plate 1340.

[0074] The guide ends 1344 may be axial members extending in the direction of the duct block 133 at each of the four corners located on the back surface of the packing plate 1340. Multiple guide ends 1344 may extend along the reciprocating direction of the packing block 134 to guide its reciprocating motion. In this case, it is sufficient that the guide ends 1344 are formed to extend along the reciprocating motion direction and guide the direction of motion, and their arrangement and number may be modified depending on the embodiment.

[0075] Multiple push ends 1343 can be housed in the discharge channel 1331 and exhaust channel 1332, respectively, within through-holes formed in the duct block 133. Push ends 1343 located behind the discharge port 1341 can be inserted into the discharge channel 1331, and push ends 1343 located behind the exhaust port 1342 can be inserted into the exhaust channel 1332. In this case, the discharge channel 1331 is connected to the aforementioned individual supply channel 1321 (see Figure 4) to allow fluid communication, enabling the test gas to be transmitted to the discharge port 1341. On the other hand, the exhaust channel 1332 is connected to the aforementioned collective recovery channel 1322 to allow fluid communication, enabling the test gas to be transmitted to the collective recovery channel 1322.

[0076] Guide holes 1334 can be formed through the duct block 133 at positions corresponding to each guide end 1344. The depth of the guide holes 1334 may be similar to, or slightly longer than, the protruding length of the guide end 1344. The guide holes 1334 can accommodate the guide end 1344 with a small amount of play. The guide end 1344 can move back and forth along the inner wall of the guide hole 1334, guiding the direction of movement of the packing block 134.

[0077] The following describes the changes in the gas circulation path related to the position of the packing block 134 according to one embodiment of the present invention, with reference to Figures 8 to 9. Figure 8 is a diagram showing the normal state of the packing block according to one embodiment of the present invention. In contrast, Figure 9 is a diagram showing the state in which another packing block is in close contact with the test tray according to one embodiment of the present invention.

[0078] As shown in Figures 8 and 9, a push end 1343 according to one embodiment of the present invention may have a gas communication groove 1343a formed at its free end. Thus, the discharge port 1341 and exhaust port 1342 communicate with the gas communication groove 1343a at their end portions, enabling fluid communication with the outside through the gas communication groove 1343a. The gas communication groove 1343a may be a groove formed by recessing the packing plate 1340 toward the back surface at the free end of the push end 1343. More specifically, multiple gas communication grooves 1343a may be formed at equal intervals along the outer circumference of the push end 1343. As an example, the gas communication groove 1343a may penetrate through a substantially rectangular groove. However, the shape of such a gas communication groove 1343a is exemplary, and the gas communication groove 1343a may be provided as a groove of various shapes penetrating the end portion of the push end 1343.

[0079] On the other hand, the discharge channel 1331 is divided into a first discharge channel 1331a and a second discharge channel 1331b. The first discharge channel 1331a receives the push end 1343, with one end facing the back surface of the packing plate 1340 and the other end extending toward the back surface of the duct block 133. One end of the second discharge channel 1331b is connected to the other end of the first discharge channel 1331a, and the other end can communicate with the individual supply channel 1321 (see Figure 4). In this case, the second discharge channel 1331b may be formed to have a slightly larger inner diameter than the first discharge channel 1331a and to have the same central axis.

[0080] Furthermore, the front end of the second discharge channel 1331b may be provided with a width that can accommodate the push body 1335, and the rear end may be provided with a width smaller than that of the push body 1335. The stepped shape of the second discharge channel 1331b may be a shape that prevents the push body 1335 from detaching from the front end of the second discharge channel 1331b. The front end of the second discharge channel 1331b may accommodate both the push body 1335 and an elastic member 1336 that supports the push body 1335. In this case, the elastic member 1336 may be supported by the inner wall of the stepped shape formed by the difference in inner diameter between the front and rear ends of the second discharge channel 1331b.

[0081] Similarly, the exhaust passage 1332 is divided into a first exhaust passage 1332a and a second exhaust passage 1332b. The first exhaust passage 1332a receives the push end 1343, with one end facing the back surface of the packing plate 1340 and the other end extending toward the back surface of the duct block 133. One end of the second exhaust passage 1332b is connected to the other end of the first exhaust passage 1332a, and the other end can communicate fluidly with the collection and recovery passage 1322 (see Figure 4). In this case, the second exhaust passage 1332b may be formed to have a slightly larger inner diameter than the first exhaust passage 1332a and to have the same central axis.

[0082] Furthermore, the front end of the second exhaust passage 1332b is provided to have a width that can accommodate the push body 1335, and the rear end is provided to have a width smaller than that of the push body 1335. The stepped shape of the second exhaust passage 1332b may be a shape that prevents the push body 1335 from detaching from the front end of the second exhaust passage 1332b. The front end of the second exhaust passage 1332b can accommodate both the push body 1335 and an elastic member 1336 that supports the push body 1335. In this case, the elastic member 1336 can be supported by the inner wall of the stepped shape formed by the difference in inner diameter between the front and rear ends of the second exhaust passage 1332b.

[0083] On the other hand, the first discharge passage 1331a and the first exhaust passage 1332a may be formed to the same or similar specifications. Similarly, the second discharge passage 1331b and the second exhaust passage 1332b may be formed to the same or similar specifications. A push body 1335 may be placed inside the second discharge passage 1331b and the second exhaust passage 1332b. The push body 1335 is provided such that the diameter of its bottom surface is larger than the inner diameter of the first discharge passage 1331a and the first exhaust passage 1332a, but corresponds to or is slightly smaller than the inner diameter of the front end of the second discharge passage 1331b and the second exhaust passage 1332b.

[0084] The elastic member 1336 may be formed to elastically support the push body 1335 in the direction of the packing plate 1340. For example, one end of the elastic member 1336 may be connected to the push body 1335 and the other end may be connected to the inner wall of the duct block 133 that forms the second discharge passage 1331b or the second exhaust passage 1332b. As an example, the other end of the elastic member 1336 may be supported by the inner wall of the duct block 133 using a stepped structure due to the difference in width between the front and rear ends of the second discharge passage 1331b (or the second exhaust passage).

[0085] Due to the elastic support of the elastic member 1336, the push body 1335 can be in close contact with one end of the second discharge passage 1331b or the second exhaust passage 1332b when no external force is applied. At this time, since the diameter of the bottom surface of the push body 1335 is larger than the inner diameters of the first discharge passage 1331a and the first exhaust passage 1332a, the push body 1335 cannot advance any further toward the first discharge passage 1331a and the first exhaust passage 1332a. Therefore, the push body 1335 can prevent fluid communication between the first discharge passage 1331a and the second discharge passage 1331b, and between the first exhaust passage 1332a and the second exhaust passage 1332b, when no external force is applied.

[0086] In the example described above, the push body 1335 is opened and closed in accordance with elastic force without external operation, but the present invention is not limited thereto. As an example, a reciprocating shaft (not shown) can be connected to the rear end of the push body 1335 according to the embodiment, which supports the push body 1335 so as to be located on the central axis of the second discharge passage 1331b or the second exhaust passage 1332b and moves back and forth in accordance with external operation.

[0087] The packing ring 1338 is positioned near the boundary of one end of the second discharge passage 1331b, and is provided to seal the minute gap between the push body 1335 and the first discharge passage 1331a when the push body 1335 is in close contact with the front end of the second discharge passage 1331b. For example, the packing ring 1338 is provided as an elastic ring-shaped member. As an example, the packing ring 1338 may be an O-ring. In this case, the inner diameter of the packing ring 1338 is provided to be slightly larger than the diameter of the push end 1343. Similar to the discharge passage 1331, a packing ring 1338 may also be provided between the first exhaust passage 1332a and the second exhaust passage 1332b.

[0088] A circulation channel 1339 may be further formed in the duct block 133, connecting the second discharge channel 1331b and the second exhaust channel 1332b. The circulation channel 1339 may be formed in a position where both ends are not hidden by the push body 1335 when it is in the most advanced position possible.

[0089] The packing block 134 may be formed to move together with the push body 1335. In this case, the push end 1343 may be formed to have a diameter corresponding to the first discharge passage 1331a or the first exhaust passage 1332a. Thus, as the push body 1335 moves backward, the push end 1343 can enter the second discharge passage 1331b or the second exhaust passage 1332b along the push body 1335, passing through the packing ring 1338. For this purpose, the push end 1343 and the push body 1335 may be aligned so that they have the same central axis.

[0090] A restoring force providing member (not shown) may be positioned inside the guide hole 1334 to elastically support the guide end 1344 in a direction that pulls it in, so that the packing block 134 moves together with the push body 1335. In this case, the restoring force providing member is provided to have a weaker restoring force than the elastic member 1336. This is to prevent the push end 1343 from pushing the push body 1335 and entering the second discharge passage 1331b or the second exhaust passage 1332b in the absence of external force. In one example, the elastic member 1336 is provided as a helical spring, and the restoring force providing member is provided as a helical spring positioned to surround the guide end 1344.

[0091] As another example, the push body 1335 and the push end 1343 may be integrally connected to each other so that the packing block 134 moves together with the push body 1335.

[0092] Based on the explanation above, the circulation path of the test gas in the absence of external force will be described below with reference to Figure 8.

[0093] As shown in Figure 8, in the absence of any external force, the packing plate 1340 can maintain its forward-protruding position due to the elastic force of the elastic member 1336. Although not shown, a stopper may be formed inside the guide hole 1334 to limit the forward distance of the guide end 1344 in order to prevent the packing block 134 from separating from the duct block 133 due to the elastic force of the elastic member 1336.

[0094] In this state, the test gas moving along the second discharge channel 1331b is blocked by the push body 1335 and the packing ring 1338 and cannot flow in the direction of the first discharge channel 1331a. Therefore, in the state shown in Figure 8, the test gas can enter the second exhaust channel 1332b via the circulation guide channel 1339 through the second discharge channel 1331b, as in the direction of the arrow in Figure 8, and be recovered as a gas circulator 131 (see Figure 3).

[0095] The state shown in Figure 8 represents a standby state where no testing is being performed on the semiconductor product. In this state, the test gas inside the gas circulator 131 can be preheated to a temperature suitable for the test and then circulated while waiting. Therefore, according to one embodiment of the present invention, the time required for testing can be shortened by preparing the test gas to a suitable temperature in advance before the test is performed.

[0096] Meanwhile, as the test progresses, an external movable device can be used to bring the test tray 400 into close contact with the packing block 134, as shown in Figure 9. This allows the packing flock 134 to overcome the elastic force of the elastic member 1336 and be inserted into the duct block 133. As a result, multiple push ends 1343 can enter the second discharge passage 1331b and the second exhaust passage 1332b, respectively. This positions the rear end of each push end 1343 inside the second discharge passage 1331b or the second exhaust passage 1332b, allowing the gas communication groove 1343a to communicate with the fluid inside the second discharge passage 1331b or the second exhaust passage 1332b. At this time, an expansion groove EG (see Figure 11) can be formed inside the second discharge passage 1331b or the second exhaust passage 1332b to facilitate the flow of gas into the gas communication groove 1343a. This will be described later with reference to Figure 11.

[0097] The test gas flowing between the push body 1335 and the inner wall of the duct block 133 forming the second discharge channel 1331b can proceed along the existing flow direction, as shown by the arrow in Figure 9, enter the discharge port 1431 via the gas communication groove 1343a, and finally be discharged into the containment space AS. Similarly, the test gas that has passed through the containment space AS can be recovered into the gas circulator 131 via the gas communication groove 1343a through the exhaust port 1342 located at the top of the insert 300 and through the second exhaust channel 1332b.

[0098] On the other hand, as the push end 1343 moves, the push body 1335 also moves backward by the same amount, so that the push body 1335 can be positioned on both sides of the circulation guide channel 1339. This prevents the flow of test gas through the circulation guide channel 1339, and the test gas can be circulated along a path like the arrow in schematic Figure 9.

[0099] Therefore, according to the present invention, there is an advantage in that the gas circulation path can be changed simply by attaching the insert 300 or test tray 400 to the outside in close contact.

[0100] The region-specific temperature control function according to one embodiment of the present invention will now be described with reference to Figure 10. Figure 10 is a schematic diagram showing the situation in which one of the region temperature control units is in close contact with the test tray in Figure 5.

[0101] As shown in Figure 10, individual region temperature control units 1301-1316 (see Figure 5) may include a heat exchange unit 135 that is elongated between multiple packing blocks 134. The heat exchange unit 135 may be located in a duct block 133 and configured to regulate the temperature of the test gas distributed to the multiple packing blocks 134. For example, the heat exchange unit 135 may extend elongated into the space between rows of packing blocks 134 arranged in multiple rows. As an example, the heat exchange unit 135 may be provided as a conventionally known temperature control unit such as a heater or thermoelectric element.

[0102] The discharge channels 1331 and outlets 1341 for each packing block 134 are positioned close to the heat exchange unit 135, while the exhaust channels 1332 and outlets 1342 may be positioned relatively far from the heat exchange unit 135. This may be to allow heat from the heat exchange unit 135 to be transferred to the discharge channels 1331 more quickly.

[0103] Since the discharge channel 1331 extends linearly toward the packing block 134 and communicates with the discharge port 1341, the test gas can rapidly pass through the inside of the duct block 133. Therefore, in order to increase the heat exchange efficiency for the test gas, the heat exchange unit 135 and each discharge channel 135 must be arranged adjacent to each other.

[0104] On the other hand, the exhaust passage 1332 may be bent at least once inside the duct block 133 so that the second exhaust passage 1332b (see Figures 8-9) connects to the collection and recovery passage 1322 (see Figure 4). Such a bent path in the exhaust passage 1332 can improve the energy efficiency for temperature preservation of the duct block 133 by increasing the time that the test gas, which is exhausted after heat exchange, passes through the inside of the duct block 133. In other words, increasing the residence time of the test gas passing through the inside of the duct block 133 can have the effect of preventing the temperature of the duct block 133 from dropping below a certain temperature by inducing sufficient heat exchange between the duct block 133 and the test gas.

[0105] Each packing block 134 may have a temperature measuring sensor 136 built into it. For example, the temperature measuring sensor 136 may be located in a region of the packing block 134 adjacent to the discharge port 1341. This is possible because, in order to grasp the temperature of the region adjacent to the semiconductor product D, the temperature measuring sensor 136 is positioned in the packing block 134 adjacent to the discharge port 1341, which is located directly above the semiconductor product D. The temperature measuring sensor 136 can be provided by various conventionally known sensors. As an example, the temperature measuring sensor 136 may be an RTD sensor that utilizes the fact that its resistance value changes according to temperature.

[0106] In the example mentioned above, the temperature measuring sensor 136 was built into the packing block 134, but the present invention is not limited to such examples. For example, the temperature measuring sensor 136 may also be installed in a duct block 133 in an area adjacent to the packing block 134.

[0107] On the other hand, the heat exchange unit 135 and temperature measuring sensor 136 built into the duct block 133 may have the following effects.

[0108] During the test process, an insert 300 located in the center of the test tray 400 may be more prone to heating up than an insert 300 located on the outer edge, because it is surrounded by other inserts 300 undergoing testing. In other words, the temperature environment of different areas within the test tray 400 may differ from one another during the test process.

[0109] In this case, the heat exchange unit 135 can be minimized by arranging the heat exchange unit 135 in a duct block 133 that is in close contact with the inserts 300 which are positioned adjacent to each other. Furthermore, the temperature measurement sensor 136 provides actual temperature readings at positions adjacent to each semiconductor product D, allowing the user to recognize the current test status and understand the temperature status of each insert 300.

[0110] The following describes an expanded groove EG according to one embodiment of the present invention with reference to Figure 11. Figure 11 is a diagram illustrating the movement of a test gas through an expanded groove according to one embodiment of the present invention.

[0111] As shown in Figure 11, at least one expansion groove EG may be formed along the edge of the second discharge passage 1331b and / or second exhaust passage 1332b at the ends of the second discharge passage 1331b and / or second exhaust passage 1332b, in a direction that expands the inner diameter of the second discharge passage 1331b and / or second exhaust passage 1332b. The expansion groove EG may be formed to have a constant distance from the push body 1335, regardless of the state of the push body 1335.

[0112] As a result, the expansion groove EG can surround the space in which the gas communication groove 1343a is located, with the push end 1343 fully inserted into the second discharge passage 1331b and / or the second exhaust passage 1332b, as shown in Figure 11. Therefore, with the push body 1335 pushed by the push end 1343 and fully accommodated inside the second discharge passage 1331b and / or the second exhaust passage 1332b, as shown in Figure 11, the gas movement between the second discharge passage 1331b and / or the second exhaust passage 1332b and the gas communication groove 1343a can proceed smoothly through the expansion groove EG. Thus, the expansion groove EG has the effect of ensuring an appropriate flow rate of the test gas moving through the gas communication groove 1343a.

[0113] Hereinafter, with reference to Figures 12 and 13, a duct block and a packing block according to another embodiment of the present invention will be described. For the sake of convenience, the same reference numerals are used for parts that are the same as those in the previously described embodiments, and the description of common parts is omitted. Figure 12 shows a duct block according to another embodiment of the present invention with multiple packing blocks attached. In contrast, Figure 13 shows a duct block in Figure 12 with one of the packing blocks separated.

[0114] As shown in Figures 12-13, in another embodiment of the present invention, the packing block 234 may have an auxiliary fluid exhaust port 1345 formed on one surface in addition to the discharge port 1341 and exhaust port 1342. Furthermore, the duct block 233 in another embodiment may further include an auxiliary fluid discharge pipe 137 positioned through the auxiliary fluid exhaust port 1345. The auxiliary fluid discharge pipe 137 can discharge an auxiliary fluid into the containment space to regulate the temperature for each semiconductor product D. Here, the auxiliary fluid may be a fluid having a different temperature from the test gas. As an example, the auxiliary fluid may be liquid nitrogen (LN2). An auxiliary fluid supply pipe 138 may be further connected to the duct block 233 to supply the auxiliary fluid to the auxiliary fluid discharge pipe 137.

[0115] In further embodiments, the packing block 234 may further include a packing member 139 positioned along the edge. The packing member 139 can ensure a tight seal over the containment space by shielding the gap between the packing block 234 and the insert when the packing block 234 is in close contact with the test tray or insert. For example, the packing member 139 may be formed of sealing silicone, rubber, or the like having a generally shaped design.

[0116] Other embodiments of the present invention may have the following further effects. As described above, the thermal environment of each insert may vary slightly depending on its position in the test tray. Since the temperature control device according to other embodiments of the present invention further includes an auxiliary fluid discharge pipe 137, the temperature can be adjusted differently for each insert to ensure improved temperature uniformity for all inserts on the test tray.

[0117] The structure of a duct block and packing block according to yet another embodiment of the present invention will be described below with reference to Figure 14. Figure 14 is a schematic cross-sectional view of a duct block and packing block according to yet another embodiment of the present invention. In the following, the orientation will be described assuming that the duct block 333 is located below the packing block 334. To avoid redundant explanations, parts that are the same as or similar to the previously described embodiments will be omitted from the explanation, and the differences will be explained in detail.

[0118] As shown in Figure 14, in yet another embodiment of the present invention, a packing block 334 may be formed to correspond to a plurality of inserts 300 (see Figure 2). A pair of discharge ports 3341 and exhaust ports 3342 may be formed in the packing block 334, each corresponding to one insert 300. In this case, Figure 14 shows the discharge port 3341 positioned to the right of the exhaust port 3342, but the reverse is also possible. On the other hand, similar to the above embodiment, the discharge port 3341 and exhaust port 3342 may extend along the central axis of a push end 3343 that protrudes in one direction from the packing block 334.

[0119] A key feature of the temperature control device according to the embodiment shown in Figure 14 is that the circulation path of the test gas can be controlled by a single push body 3335. More specifically, according to this embodiment, the push body 3335 may be placed in a push body housing groove 333a formed by recessing the upper surface of a duct block 333. The push body housing groove 333a may be connected to a discharge passage 3331 and an exhaust passage 3332, respectively, through openings formed in its bottom surface.

[0120] In the connected state of the duct block 333 and the packing block 334, the push end 3343 of the packing block 334 is housed in the push body housing groove 333a, and the end portion can be in close contact with the push body 3335. Similar to the embodiment described above, in this embodiment as well, a gas communication groove 1343a (see Figure 7) can be formed in the push end 3343. Therefore, as in the embodiment described above, the discharge port 3341 and the exhaust port 3342 can communicate fluidly with the space inside the push body housing groove 333a via the gas communication groove 1343a (see Figure 7). Although not shown, similar to the embodiment described above, an expansion groove EG (see Figure 11) can be formed in the push body housing groove 333a in this embodiment. As in the embodiment described above, the expansion groove of the push body housing groove 333a may be a groove formed to facilitate fluid communication via the gas communication groove when the push end 3343 is maximally housed in the push body housing groove 333a.

[0121] In the absence of external forces, the push body 3335 according to the embodiment of Figure 14 can be in close contact with the upper surface of the push body housing groove 333a. For this purpose, an elastic member 3336 can be arranged inside the push body housing groove 333a to elastically support the push body 3335 in the direction of the packing block 334. The elastic member 3336 is positioned between the inner wall of the duct block 333 and the push body 3335, and may be the same as or similar to the elastic member 1336 in the previously described embodiment.

[0122] In this state, the test gas discharged through the discharge channel 3331 is blocked by the push body 3335 and not discharged to the outside, but can be moved through the available space in the push body housing groove 333a or a separate circulation channel 1339 (see Figure 8) and immediately exhausted into the exhaust channel 3332.

[0123] In contrast, when the packing block 334 or duct block 333 is pressurized by an external force, the elastic force of the elastic member 3336 is overcome, as shown in Figure 14, and the packing block 334 can be accommodated to its maximum extent inside the duct block 333. In this state, the test gas discharged in the discharge channel 3331 can sequentially pass through the expansion groove formed in the push body housing groove 333a and the gas communication groove of the push end 3343, and finally be discharged to the discharge port 3341. Similarly, the test gas exhausted to the exhaust port 3342 can, after passing through the exhaust port 3342, sequentially pass through the gas communication groove and the expansion groove, and finally be exhausted to the outside via the exhaust channel 3332.

[0124] In this case, the external force that moves the push body 3335 can be obtained through separate members that rise as the test tray approaches, or by a separate drive mechanism.

[0125] On the other hand, in the embodiment shown in Figure 14, the push body 3335 may be formed with an alignment projection end 3335a protruding from the surface facing the packing block 334. The alignment projection end 3335a may be inserted into the alignment groove 334a formed in the packing block 334 between the discharge port 3341 and the exhaust port 3342. The alignment projection end 3335a and the alignment groove 334a extend in a direction parallel to the relative access direction of the test tray to the packing block 334, and can guide the direction of movement when the packing block 334 and the duct block 333 are brought into close contact. Therefore, according to one embodiment of the present invention, even if the packing block 334 and the duct block 333 are slightly misaligned from their initial state due to thermal deformation, there is an effect of moving the packing block 334 in the correct direction relative to the duct block 333.

[0126] In the embodiment shown in Figure 14, a single push body 3335 can adjust the fluid movement path for both the discharge channel 3331 and the exhaust channel 3332. This is particularly advantageous when the gap between the discharge channel 3331 and the exhaust channel 3332 is very narrow, due to the small size of the semiconductor product.

[0127] Furthermore, the temperature control device according to the above embodiment may have the following advantages. With the temperature control device according to the present invention, the packing blocks 134, 234, and 334 are in close contact with each individual insert, and a different thermal environment can be created for each semiconductor product. As a result, according to the present invention, it may have the same effect as forming an independent chamber for each semiconductor product within each insert of the test tray.

[0128] Therefore, when using the present invention, the existing soak chamber, test chamber, and desock chamber can be integrated into one chamber, and preheating, testing, and heat removal can be performed for each semiconductor product while the tester is seated.

[0129] A person with ordinary skill in the art to which the present invention pertains will understand that the present invention can be carried out in other specific forms without altering its technical idea or essential features. Therefore, the embodiments described above should be understood to be illustrative and not restrictive in all respects. The scope of the present invention is indicated more by the claims, which are set forth below, than by the detailed description above, and all modifications or altered forms derived from the meaning and scope of the claims and the concept of equivalents should be interpreted as being included within the scope of the present invention. [Explanation of Symbols]

[0130] 1: Temperature control system 100: Temperature control device 110: Dry chamber 120: Circulation chamber 130: Duct section 1301~1316: Area temperature control section 131: Gas circulator 1311: Circulation housing 1312: Gas temperature controller 1313: Fan 1314: Supply pipe 1315: Recovery pipe 132: Distribution plate 1321: Individual supply channel 1322: Collective collection channel 1323, 1324: Connecting ducts 133, 233, 333: Duct block; 1331, 3331: Discharge channel 1331a: First discharge channel 1331b: Second discharge channel 1332, 3332: Exhaust passage 1332a: First exhaust passage 1332b: Second exhaust passage 1334: Guide hole 1335, 3335: Push body 1336: Elastic member 1337: Retreat shaft 1338: Packing ring 1339: Circulation guide channel 134, 234, 334: Packing block 1340: Packing plate 1341, 3341: Discharge port 1342, 3342: Exhaust port 1343: Push end 1343a: Gas passage groove 1344: Guide end 1345: Auxiliary fluid exhaust port 135: Heat exchange unit 136: Temperature measurement sensor 137: Auxiliary fluid discharge pipe 138: Auxiliary fluid supply pipe 139: Packing member 200: Tester 300: Insert 310: Insert body 320: Contact board 330: Interface board 340: Latch 400: Test tray AS: Storage space

Claims

1. An insert for loading semiconductor products into a housing space with one side open, A test tray on which multiple inserts are mounted and With the test tray installed, a tester for testing the semiconductor product via the insert, A temperature control system for testing semiconductor products, comprising a temperature control device that, when the test tray is mounted on the tester, is in close contact with one side of the test tray or the insert, separating the containment space from the external space and adjusting the temperature of the containment space, thereby providing a temperature-controlled space for individual semiconductor products.

2. The temperature control device is A temperature control system for testing semiconductor products according to claim 1, comprising: a discharge port that is in close contact with the test tray or the insert and discharges a temperature-controlled test gas into the containment space; and a packing block having an exhaust port formed therein for the test gas to be discharged from the containment space to the outside.

3. The temperature control device is A temperature control system for providing a temperature-controlled space for individual semiconductor products in testing a semiconductor product according to claim 2, further comprising an auxiliary fluid discharge pipe positioned through the packing block and discharging an auxiliary fluid for temperature control into the containment space.

4. The temperature control device is A gas circulator that circulates the aforementioned test gas to adjust the temperature, A temperature control system for testing semiconductor products according to claim 2, further comprising a duct block that distributes and transmits the test gas transmitted from the gas circulator to a plurality of packing blocks, and transmits the test gas exhausted through the plurality of packing blocks to the gas circulator, the system providing a temperature-controlled space for individual semiconductor products.

5. The temperature control device is A temperature control system for providing a temperature-controlled space for individual semiconductor products in testing of semiconductor products according to claim 4, further comprising a temperature measuring sensor built into the packing block or the duct block for measuring temperature.

6. The temperature control device is A temperature control system for providing a temperature-controlled space for individual semiconductor products in the testing of semiconductor products according to claim 4, further comprising a distribution plate between a plurality of duct blocks and the gas circulator, which forms a circulation path for the test gas.

7. One side of the distribution plate facing the test tray is formed to have an area corresponding to the test tray. A temperature control system that provides temperature-controlled spaces for individual semiconductor products in testing a semiconductor product according to claim 6, wherein each of the duct blocks is arranged on one surface of the distribution plate so as to correspond to different areas on the test tray.

8. The temperature control device is A temperature control system for providing a temperature-controlled space for individual semiconductor products in the testing of a semiconductor product according to claim 7, further comprising a heat exchange unit arranged in the duct block and controlling the temperature of the test gas distributed to a plurality of packing blocks.

9. The temperature control device is A temperature control system for providing a temperature-controlled space for individual semiconductor products in testing of semiconductor products according to claim 4, further comprising: a gas circulator positioned such that the test gas is kept in a temperature-controlled state; and a circulation chamber providing a space through which the test gas is circulated.

10. The temperature control device is A temperature control system for providing a temperature-controlled space for individual semiconductor products in the testing of semiconductor products according to claim 9, further comprising a dry chamber having the circulation chamber located inside and maintaining the temperature of the internal space within a predetermined range.

11. The temperature control device is A temperature control system for providing a temperature-controlled space for individual semiconductor products in the testing of semiconductor products according to claim 9, further comprising a dry chamber having the circulation chamber located inside and the humidity of the internal space being controlled.

12. The duct block includes, A discharge channel extending linearly in the direction of the packing block and communicating with the discharge port, A temperature control system that provides a temperature-controlled space for individual semiconductor products in testing of semiconductor products according to claim 4, wherein an exhaust flow path is formed which is in communication with the exhaust port and is bent at least once inside the duct block.

13. A temperature control system for providing a temperature-controlled space for individual semiconductor products in the testing of semiconductor products according to claim 2, wherein the discharge port and the exhaust port are formed to be located on the central axis of the upper surface of the containment space.

14. The temperature control device is A temperature control system for testing a semiconductor product according to claim 1, further comprising a packing member that shields the gap between the packing block and the insert while the packing block is in close contact with the test tray or the insert, providing a temperature-controlled space for individual semiconductor products.

15. In a temperature control device that provides a temperature-controlled space for semiconductor products, which is located near an insert on which semiconductor products are loaded in a housing space with one side open, and separates the housing space from the external space, A temperature control device for providing a temperature-controlled space for a semiconductor product, comprising a test tray on which the insert is mounted or a packing block in close contact with the insert, which discharges a temperature-controlled test gas into the containment space and has an exhaust port formed therein for the test gas to be discharged from the containment space to the outside.

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