Substrate processing apparatus and substrate processing method

Abstract

By using the detection results from multiple pressure detection points using pressure sensors, abnormalities related to the forward and backward movement of the shaft can be detected with high accuracy. [Solution] The processing unit comprises a nozzle body (52) for performing a predetermined surface treatment on a substrate, a shaft (532) that moves back and forth in a predetermined direction by the drive of a motor (531), a pressure sensor (55) that acquires pressure values ​​generated between the motor (531) and the nozzle body (52) at a plurality of pressure detection points, and an abnormality detection unit that detects abnormalities related to the movement of the shaft based on the pressure values ​​at at least two of the pressure detection points included in the plurality of pressure detection points.

Description

Technical Field

[0001] The present invention relates to a substrate processing apparatus and a substrate processing method.

Background Art

[0002] As a process for a circular or substantially circular substrate such as a semiconductor wafer, there is a process for removing only the thin film at the peripheral portion of the substrate among the thin films formed on at least one main surface of the substrate. For example, there is a known technique in which an etching solution is supplied to the peripheral portion while rotating the substrate to remove only the thin film outside the supply position of the etching solution. The process of removing the thin film in this way is sometimes referred to as bevel etching.

[0003] For example, Patent Document 1 discloses a configuration in which a lower peripheral nozzle is provided below a substrate in a substrate processing apparatus housed in a processing chamber in order to perform an etching process on the lower peripheral portion of a substrate in a horizontal posture. In this lower peripheral nozzle, a plurality of nozzles are attached to a nozzle support member, and each of these nozzles discharges a processing solution such as a chemical solution or a rinse solution upward toward the lower peripheral portion of the substrate.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] However, Patent Document 1 does not disclose in detail the attachment structure of the nozzles to the nozzle support member. Therefore, in the substrate processing apparatus disclosed in Patent Document 1, it is unclear how to adjust the nozzle position. Further, in this substrate processing apparatus, if the nozzle position can be adjusted using a shaft, there is a possibility that an abnormality may occur in the forward and backward movement of the shaft.

[0006] One aspect of the present invention aims to accurately detect abnormalities related to the forward and backward movement of a shaft by using the detection results of multiple pressure detection points by a pressure sensor. [Means for solving the problem]

[0007] To solve the above problems, a substrate processing apparatus according to one aspect of the present invention comprises: a surface processing mechanism for performing a predetermined surface treatment on a substrate; a shaft having one end connected to the surface processing mechanism and the other end connected to an actuator, which moves back and forth in a predetermined direction by the drive of the actuator; a pressure sensor that acquires pressure values ​​generated between the actuator and the surface processing mechanism or the shaft at a plurality of pressure detection points as the surface processing mechanism moves in the predetermined direction guided by the shaft; and an abnormality detection unit that detects abnormalities related to the movement of the shaft based on the pressure values ​​at at least two of the plurality of pressure detection points.

[0008] A substrate processing apparatus according to one aspect of the present invention further comprises a rotation mechanism that holds a circular substrate in a horizontal position and rotates the substrate about a vertical axis passing through the center of the substrate, the surface processing mechanism is a nozzle body positioned below the substrate and discharging a processing liquid from a discharge port toward the lower peripheral edge of the substrate, and the shaft may move back and forth in the radial direction of the substrate as the predetermined direction.

[0009] In a substrate processing apparatus according to one aspect of the present invention, the abnormality detection unit may determine that there is an abnormality in the forward and backward movement of the shaft if there is a difference in the change over time of the pressure value detected at each of the plurality of pressure detection points.

[0010] In a substrate processing apparatus according to one aspect of the present invention, the abnormality detection unit may determine that there is an abnormality in the reciprocating movement of the shaft if a significant difference is observed between the pressure value detected at any of the plurality of pressure detection points and the pressure value detected at other pressure detection points at the same time.

[0011] In a substrate processing apparatus according to one aspect of the present invention, the abnormality detection unit may determine that there is an abnormality in the reciprocating movement of the shaft if a significant difference is found between the rate of change of the pressure value detected at any of the plurality of pressure detection points over a specific period and the rate of change of the pressure value detected at other pressure detection points over the same period.

[0012] In a substrate processing apparatus according to one aspect of the present invention, the pressure sensor may be provided at the end of the actuator through which the shaft protrudes, and through which a through hole is formed.

[0013] A substrate processing apparatus according to one aspect of the present invention further comprises a bearing that extends from the end of the actuator in the direction in which the shaft moves back and forth, and which houses the shaft inside and has an inner circumferential surface on which the surface treatment mechanism slides, and the pressure sensor may be housed within the bearing.

[0014] In a substrate processing apparatus according to one aspect of the present invention, the central axis of the actuator, the central axis of the shaft, and the central axis of the bearing may coincide.

[0015] A substrate processing method according to one aspect of the present invention is a substrate processing method in which a shaft, one end of which is connected to a surface processing mechanism for performing a predetermined surface treatment on a substrate and the other end of which is connected to an actuator, is moved back and forth in a predetermined direction by the drive of the actuator, and as the surface processing mechanism moves in the predetermined direction guided by the shaft, a pressure value generated between the actuator and the surface processing mechanism or the shaft is acquired at a plurality of pressure detection points of a pressure sensor, and an abnormality related to the back-and-forth movement of the shaft is detected based on the pressure values ​​at at least two of the plurality of pressure detection points. [Effects of the Invention]

[0016] According to one aspect of the present invention, by using the detection results of a plurality of pressure detection points by a pressure sensor, an abnormality related to the forward and backward movement of the shaft can be accurately detected.

Brief Description of the Drawings

[0017] [Figure 1] It is a plan view showing a schematic configuration of a substrate processing system equipped with an embodiment of a processing unit which is one aspect of the substrate processing apparatus according to the present invention. [Figure 2] It is a side view showing the internal structure of the processing unit. [Figure 3] It is a plan view of the processing unit shown in FIG. 2. [Figure 4] It is a view showing the structure and arrangement of a processing mechanism provided in the processing unit. [Figure 5] It is a cross-sectional view of a nozzle block showing the structure of one processing liquid discharge nozzle portion provided in the processing mechanism, showing a state where the nozzle body is located at the origin. [Figure 6] It is a cross-sectional view of a nozzle block showing the structure of one processing liquid discharge nozzle portion provided in the processing mechanism, showing a state where the nozzle body has advanced the most. [Figure 7] It is a perspective view showing the configuration near a pressure sensor provided in the processing mechanism. [Figure 8] It is a flowchart showing an example of a process in which a control unit provided in the processing unit discharges a processing liquid to the nozzle body. [Figure 9] It is a flowchart showing an example of a process in which a control unit provided in the processing unit moves the nozzle body. [Figure 10] It is a graph showing an example of the relationship between time and the pressure value acquired by the pressure sensor. [Figure 11] It is a graph showing an example of the relationship between time and the pressure values at a plurality of pressure detection points acquired by the pressure sensor. [Figure 12] It is a cross-sectional view of a nozzle block provided in a processing unit according to Modification 1 of the present invention. [Figure 13]It is a cross-sectional view showing an example of an on-off valve included in a processing unit according to Modification 2 of the present invention.

Embodiments for Carrying Out the Invention

[0018] (Substrate Processing System) Hereinafter, an embodiment of the present invention will be described in detail. The following description mainly relates to a substrate processing system, but also includes an explanation of a substrate processing method for processing a substrate. FIG. 1 is a plan view showing a schematic configuration of a substrate processing system 100 equipped with an embodiment of a processing unit 1 which is an aspect of a substrate processing apparatus according to the present invention. FIG. 1 is a schematic diagram showing the internal structure of the substrate processing system 100 in an easy-to-understand manner by excluding the outer wall panel and some other components of the substrate processing system 100. This substrate processing system 100 is, for example, an in-sheet type apparatus installed in a clean room and processes substrates S one by one.

[0019] The substrate processing system 100 includes a plurality of processing units (substrate processing apparatuses) 1 each of which is a processing entity for the substrate S. In FIG. 1, a state in which four processing units 1 are arranged in the horizontal direction is shown, but each processing unit 1 can also be stacked in multiple stages in the vertical direction. In each of the plurality of processing units 1 equipped in the substrate processing system 100, substrate processing with a processing liquid is executed.

[0020] The substrate S is a circular substrate. In the present embodiment, the "circular substrate" includes not only a substrate whose main surface has a strict circular shape in plan view, but also a "substantially circular substrate" in which there are parts different from the circumference, such as an orientation flat or a notch, in a part of the outer periphery whose envelope outer shape is circular.

[0021] Furthermore, the "substrate" in this embodiment can be various types of substrates, including semiconductor wafers, photomask glass substrates, liquid crystal display glass substrates, plasma display glass substrates, FED (Field Emission Display) substrates, optical disk substrates, magnetic disk substrates, and magneto-optical disk substrates. The following explanation will primarily use a substrate processing apparatus used for processing semiconductor wafers as an example, with reference to the drawings, but the method can be similarly applied to processing the various types of substrates exemplified above.

[0022] The processing unit 1 of this embodiment receives a substrate S on which a thin film of metal or a metal compound is formed on one main surface, and performs a process of removing only the peripheral portion of the thin film formed on the substrate S by etching. Such etching is sometimes referred to as "bevel etching" or simply "beveling." It should be noted that all of the processing units 1 in the substrate processing system 100 may perform such bevel etching, or multiple types of processing units that perform different processes may be combined.

[0023] As shown in Figure 1, the substrate processing system 100 has a substrate processing area 110 for processing substrates S. An indexer unit 120 is provided adjacent to this substrate processing area 110. The indexer unit 120 has a container holding unit 121 that can hold a plurality of containers C for housing substrates S. The indexer unit 120 is equipped with an indexer robot 122 for accessing the containers C held by the container holding unit 121 to remove unprocessed substrates S from the containers C and store processed substrates S in the containers C. Each container C contains a plurality of substrates S in a nearly horizontal position.

[0024] In the substrate processing area 110, a mounting table 112 is provided to allow substrates S from the indexer robot 122 to be placed on it. In a plan view, a substrate transport robot 111 is positioned approximately in the center of the substrate processing area 110. Furthermore, multiple processing units 1 are arranged to surround this substrate transport robot 111.

[0025] The substrate transfer robot 111 randomly accesses the mounting table 112 for these processing units 1 and transfers the substrate S between the robot and the mounting table 112. Meanwhile, each processing unit 1 performs predetermined processing on the substrate S and corresponds to the substrate processing apparatus according to the present invention. In this embodiment, these processing units (substrate processing apparatus) 1 have the same function. Therefore, parallel processing of multiple substrates S is possible. In Figure 1, reference numeral 11 denotes a chamber which is a partition wall of the processing unit 1, and reference numeral 15 denotes a shutter provided in the chamber 11.

[0026] (Inside the processing unit) Figure 2 is a side view showing the internal structure of processing unit 1, and Figure 3 is a top view of processing unit 1 shown in Figure 2. In Figures 2 and 3, the dimensions and number of parts may be exaggerated or simplified for ease of understanding.

[0027] As shown in Figures 2 and 3, the processing unit 1 has a structure in which a substrate processing unit SP is arranged in the internal space 12 within the chamber 11. The substrate processing unit SP of the processing unit 1 is installed on the upper surface of a raised base member 17. Each part constituting the substrate processing unit SP is electrically connected to a control unit 10 that controls the entire apparatus and operates in accordance with instructions from the control unit 10.

[0028] In the following, a coordinate system is used where appropriate, with the Z direction being the vertical direction and the XY plane being the horizontal plane, in order to clarify the arrangement and operation of each part of the device. In the coordinate system in Figure 3, the horizontal direction corresponding to the vertical direction of the paper is defined as the "Y direction," and the horizontal direction perpendicular to it is defined as the "X direction."

[0029] The substrate processing unit SP includes a holding and rotating mechanism 2, a scattering prevention mechanism 3, an upper surface protection heating mechanism 4, a processing mechanism 5, an atmosphere separation mechanism 6, a lifting mechanism 7, a centering mechanism 8, and a substrate observation mechanism 9. These mechanisms are mounted on the base member 17.

[0030] The holding and rotating mechanism (rotating mechanism) 2 holds the substrate S in a horizontal position and rotates it around a vertical axis passing through the center of the substrate S. The holding and rotating mechanism 2 comprises a substrate holding section 2A that holds the substrate S in a substantially horizontal position with the film-forming surface of the substrate S facing downward, and a rotating mechanism section 2B that synchronously rotates the substrate holding section 2A holding the substrate S and the rotating cup section 31, which is part of the scattering prevention mechanism 3.

[0031] The substrate holding section 2A includes a spin chuck 21, which is a disc-shaped member smaller than the substrate S. The spin chuck 21 is positioned so that its central axis coincides with the rotation axis AX, and it holds the substrate S from below by the suction force of the pump 26. Nitrogen gas at room temperature is supplied to the spin chuck 21 from the nitrogen gas supply section 29.

[0032] A cylindrical rotating shaft portion 22 is connected to the lower surface of the spin chuck 21. The rotating shaft portion 22 extends vertically in the Z direction with its axis aligned with the rotation axis AX. A rotating mechanism portion 2B is also connected to the rotating shaft portion 22.

[0033] The rotating mechanism section 2B includes a motor 23 that generates rotational driving force to rotate the substrate holding section 2A and the rotating cup section 31 of the anti-scattering mechanism 3, and a power transmission section 27 for transmitting said rotational driving force.

[0034] The rotating mechanism 2B not only rotates the spin chuck 21 integrally with the substrate S, but also has a power transmission unit 27 to rotate the rotating cup unit 31 in synchronization with the rotation. The power transmission unit 27 has a disc member 27a made of a non-magnetic material or resin. The disc member 27a is mounted coaxially with the rotating shaft unit 22 and is rotatable together with the rotating shaft unit 22 around the rotating shaft AX.

[0035] The splash prevention mechanism 3 prevents the etching solution discharged during the etching process from splashing and also recovers the treated solution. The splash prevention mechanism 3 has a rotating cup portion 31 that can rotate around the rotation axis AX while surrounding the outer circumference of the substrate S held by the spin chuck 21, and a fixed cup portion 34 that is fixedly provided so as to surround the rotating cup portion 31. The rotating cup portion 31 is a connected body in which a lower cup 32 and an upper cup 33 are connected. The droplets collected by the rotating cup portion 31 are recovered together with the gaseous components and collected in the fixed cup portion 34. The droplets are drained, and the gaseous components are efficiently exhausted when the pressure in the fixed cup portion 34 is adjusted by the operation of the exhaust portion 38.

[0036] The top surface protection heating mechanism 4 protects the top surface of the substrate S by preventing it from being exposed to the ambient atmosphere. The top surface protection heating mechanism 4 has a shielding plate 41 positioned above the top surface of the substrate S held by the spin chuck 21, and the shielding plate 41 has a disc portion 42 held in a horizontal position. The disc portion 42 incorporates a heater (not shown) that is driven and controlled by a heater drive unit 422.

[0037] The top surface protection heating mechanism 4 positions the disc portion 42 in a processing position close to the substrate S, and supplies heating gas from the heating gas supply unit 47 between the substrate S and the disc portion 42. The heating gas is supplied from the center of the disc portion 42 and flows toward the periphery. This prevents the surrounding atmosphere from entering the top surface of the substrate S.

[0038] The atmosphere separation mechanism 6 separates the internal space 12 within the chamber 11 into a sealed space 12a where beveling of the substrate S can be performed and an outer space 12b of the sealed space 12a. The atmosphere separation mechanism 6 is positioned to completely surround the spin chuck 21, the substrate S held by the spin chuck 21, the rotating cup portion 31, and the upper surface protection heating mechanism 4 from above. The atmosphere separation mechanism 6 has a lower sealed cup member 61 and an upper sealed cup member 62. The lower sealed cup member 61 is provided to be movable in the vertical direction (movable up and down).

[0039] As shown in Figure 2, when the lower sealing cup member 61 descends and is positioned at its lower limit, the upper sealing cup member 62, the lower sealing cup member 61, and the fixed cup portion 34 are connected in the vertical direction, and a sealed space 12a is formed by the upper sealing cup member 62, the lower sealing cup member 61, and the fixed cup portion 34.

[0040] Although not shown in the diagram, when the lower sealing cup member 61 rises and moves to the retracted position, the upper cup 33 also rises together with it in engagement with the lower sealing cup member 61. This causes the upper cup 33 and the upper surface protection heating mechanism 4 to move upward away from the spin chuck 21. The movement of the lower sealing cup member 61 to the retracted position creates a transport space for the hand of the substrate transport robot 111 to access the spin chuck 21.

[0041] The lifting mechanism 7 moves the lower sealed cup member 61 up and down. The lifting mechanism 7 has two lifting drive units, namely a first lifting drive unit 71 and a second lifting drive unit 72. The first lifting drive unit 71 and the second lifting drive unit 72 move vertically along the side surface of the lower sealed cup member 61 while synchronizing two different points in its circumferential direction. Therefore, the upper surface protection heating mechanism 4 and the lower sealed cup member 61 can be raised and lowered stably. In addition, the lifting mechanism 7 raises and lowers the upper cup 33, which is connected to the lower cup 32 to form the rotating cup portion 31, in conjunction with the raising and lowering of the lower sealed cup member 61.

[0042] The centering mechanism 8 performs a centering process to eliminate the eccentricity of the substrate S and align the center of the substrate S with the rotation axis AX. The centering mechanism 8 has a single contact portion 81 and a multi-contact portion 82 that are positioned on opposite sides of the rotation axis AX of the spin chuck 21, and a centering drive unit 83 that moves the single contact portion 81 and the multi-contact portion 82 in the contact movement direction.

[0043] The substrate observation mechanism 9 is a mechanism for optically observing the peripheral portion of the substrate S being processed, for the purpose of confirming whether the processing is being carried out properly. The substrate observation mechanism 9 includes a light source unit 91, an imaging unit 92, an observation head 93, and an observation head drive unit 94.

[0044] The processing mechanism 5 performs a process in which only the peripheral portion of a thin film formed on the substrate S is removed by etching. As shown in Figure 3, the processing mechanism 5 has a nozzle block 50 positioned on the lower side of the substrate S and a processing liquid supply unit 59 that supplies processing liquid to the nozzle block 50. As will be described later, the nozzle block 50 has a plurality of processing liquid discharge nozzle units 51 (see Figure 4), and the processing liquid supply unit 59 is connected to each processing liquid discharge nozzle unit 51.

[0045] The processing liquid supply unit 59 is configured to supply chemical solutions such as SC1 liquid and DHF (dilute hydrofluoric acid), as well as functional water (such as CO2 water), as processing liquids, and SC1 liquid, DHF, and functional water can be discharged independently from each processing liquid discharge nozzle unit 51.

[0046] As shown in Figure 2, a nozzle support portion 57 that supports the nozzle block 50 is provided below the substrate S held by the spin chuck 21 in order to discharge the processing liquid toward the peripheral edge of the lower surface of the substrate S. The nozzle support portion 57 has a thin-walled cylindrical portion 571 that extends vertically and a flange portion 572 that has an annular shape and is folded radially outward at the upper end of the cylindrical portion 571.

[0047] The cylindrical portion 571 has a shape that allows it to be freely inserted into the air gap formed between the disc member 27a and the lower cup 32. The nozzle support portion 57 is fixedly positioned such that the cylindrical portion 571 is freely inserted into the air gap and the flange portion 572 is positioned between the substrate S held by the spin chuck 21 and the lower cup 32. The nozzle block 50 is attached to a part of the upper peripheral edge of the flange portion 572.

[0048] (Processing mechanism) Next, the processing mechanism 5 will be described in detail using Figures 4 to 6. Figure 4 is a diagram showing the structure and arrangement of the processing mechanism 5 provided in the processing unit 1. Figure 5 is a cross-sectional view of a nozzle block showing the structure of one processing liquid discharge nozzle section provided in the processing mechanism 5, showing the state in which the nozzle body is at the origin. Figure 6 is a cross-sectional view of a nozzle block showing the structure of one processing liquid discharge nozzle section provided in the processing mechanism 5, showing the state in which the nozzle body is extended to its furthest extent.

[0049] As shown in Figure 4, the nozzle block 50 has three sets of processing liquid discharge nozzles 51A, 51B, and 51C, each of which discharges processing liquid, and a support base 54 that supports them. Each processing liquid discharge nozzle 51A to 51C has the same shape. Here, the nozzle block 50 is shown as having three processing liquid discharge nozzles 51, but it is sufficient to have two or more.

[0050] The support base 54 is attached to a roughly annular flange portion 572 located on the upper part of the nozzle support portion 57 (see Figure 2). The support base 54 supports three processing liquid discharge nozzle portions 51A to 51C. Hereinafter, the direction in which the three processing liquid discharge nozzle portions 51A to 51C are aligned will be referred to as the lateral direction of the support base 54.

[0051] The support base 54 has lugs 542 with screw holes formed at both lateral ends. The support base 54 is fixed to the flange portion 572 by screws 543 inserted into the screw holes formed in the lugs 542, with both lugs 542 in contact with the upper surface of the flange portion 572.

[0052] The upper surface 541 of the support base 54 between the two lugs 542 serves as a support surface for the three processing liquid discharge nozzles 51A to 51C. The three processing liquid discharge nozzles 51A to 51C are fixed to the support base 54 using screws or the like.

[0053] Here, we will take one processing liquid discharge nozzle section 51A as an example and explain its structure with reference to Figures 5 and 6. In the following, when it is not necessary to distinguish between each processing liquid discharge nozzle section 51A to 51C, they will simply be referred to as "processing liquid discharge nozzle section 51".

[0054] As shown in Figures 5 and 6, the processing liquid discharge nozzle unit 51 comprises a nozzle body 52, which is the main part of the processing liquid discharge nozzle unit 51, and a nozzle drive unit 53 that reciprocates the nozzle body 52 in the radial direction of the substrate S. The nozzle body 52 is positioned below the substrate S and discharges the processing liquid from the discharge port 521 toward the lower peripheral edge of the substrate S. The nozzle body 52 is an example of a surface treatment mechanism for performing a predetermined surface treatment on the substrate S.

[0055] The nozzle body 52 has an elongated shape along the radial direction of the substrate S, with a nozzle head portion 52a on the radially outer side and an axial portion 52b on the radially inner side. An outlet 521 for discharging the processing liquid is provided at the tip, which is the radially outer end of the nozzle head portion 52a. The outlet 521 discharges the processing liquid supplied from the processing liquid supply unit 59 (see Figure 3) via the internal manifold portion 522 at an upward angle of 45 degrees and outward when viewed from the rotation axis AX. The processing liquid is discharged toward the peripheral edge of the lower surface of the substrate S.

[0056] If a thin metal film or a thin metal compound film is formed on the underside of the substrate S, and the discharged processing solution is soluble in this film, the thin film in the area of ​​the underside of the substrate S where the processing solution adheres will be etched away. If the substrate S is rotating, the processing solution will spread outward from the point of contact due to centrifugal force, and as a result, the thin film outside the point of contact will be removed.

[0057] The shaft-shaped portion 52b is located radially inward of the substrate S in the nozzle body 52, that is, on the opposite side from the discharge port 521, and extends radially inward. The shaft-shaped portion 52b is inserted into and supported by a bearing 533 provided in the nozzle drive unit 53.

[0058] The nozzle drive unit 53 includes a motor (actuator) 531, a shaft 532, a bearing 533 that supports the axial portion 52b of the nozzle body 52, and a housing 534. The motor 531 is held in a motor holder 535, except for the radially outward-facing side to which the shaft 532 is attached. The motor 531 is, for example, a stepping motor.

[0059] The shaft 532 is cantilevered to the motor 531 and is integrally provided with the motor 531. One end of the shaft 532 is connected to the axial portion 52b of the nozzle body 52, and the other end of the shaft 532 is connected to the motor 531. In addition, one end of the shaft 532 is engaged with the axial portion 52b.

[0060] Specifically, the axial portion 52b of the nozzle body 52 has an axial hole 523 into which the shaft 532 is inserted. The axial hole 523 opens radially inward and extends radially outward, and a nut 524 is fixed to this axial hole 523. On the other hand, the shaft 532 has a thread on its outer circumference that screws onto the nut 524, and the shaft 532 and the axial portion 52b are engaged when the thread on the outer circumference of the shaft 532 is screwed onto the nut 524.

[0061] As a result, when the motor 531 drives the shaft 532 to rotate, the nut 524 screwed onto the outer circumference of the shaft 532 moves along the radial direction of the substrate S. The direction of movement is determined by the rotation direction of the shaft 532, and the amount of movement is determined by the amount of rotation of the shaft 532. As the nut 524 moves along the radial direction of the substrate S, the nozzle body 52 to which the nut 524 is fixed also moves along the radial direction of the substrate S.

[0062] At this time, the shaft 532 rotates under the drive of the motor 531 and moves back and forth in the radial direction of the substrate S as an example of a predetermined direction. Also, as the shaft 532 rotates, the nozzle body 52 fixed to the nut 524 moves in the radial direction of the substrate S, so the shaft 532 moves back and forth in the radial direction of the substrate S relative to the nozzle body 52. ​​In other words, the shaft 532 moves back and forth in the radial direction of the substrate S within the axial hole 523 of the axial portion 52b of the nozzle body 52. ​​The nozzle body 52 moves in the radial direction of the substrate S guided by the shaft 532.

[0063] The housing 534 secures and houses the motor 531 and the bearing 533. In addition to securing the motor 531 and the bearing 533, the housing 534 also houses at least the portion of the motor 531 from the side to which the shaft 532 is connected to the bearing 533.

[0064] The bearing 533 is provided so as to be able to support the shaft-shaped portion 52b when the nozzle body 52 is moved to its furthest radially outward position. The bearing 533 extends from the end portion 531E of the motor 531 in the direction in which the shaft 532 moves back and forth, and has an inner circumferential surface 533F that houses the shaft 532 and allows the nozzle body 52 to slide. The end portion 531E is the radially outer end of the base plate S in the portion surrounding the rotating shaft portion 531A of the motor 531. Note that some components of the bearing 533 are omitted in Figures 5 and 6.

[0065] The nozzle drive unit 53 adjusts the position of the nozzle body 52 by reciprocating the nozzle body 52 in the radial direction of the substrate S using the motor 531. This makes it possible to adjust the etching width by changing the point at which the processing liquid discharged from the discharge port 521 provided on the nozzle body 52 lands on the substrate S.

[0066] Furthermore, the bearing 533 is a sleeve-type bearing 533A that extends radially from the substrate S. The radially outer end of the sleeve-type bearing 533A is positioned to support the shaft-shaped portion 52b when the nozzle body 52 is moved to the outermost radial position of the substrate S, and extends radially inward from this position.

[0067] The shaft-shaped portion 52b is inserted from the radially outer end of the sleeve-type bearing 533A, and the shaft 532 is inserted from the radially inner end of the sleeve-type bearing 533A, and the shaft-shaped portion 52b and the shaft 532 are engaged in the sleeve-type bearing 533A.

[0068] As a sleeve-type bearing, for example, a sliding bearing such as iglidur G (product name: igus Corporation) can be used. However, while using a sleeve-type bearing as bearing 533 is preferable for the reasons mentioned above, it is not necessarily limited to this, and a configuration in which rolling bearings are arranged in multiple locations may also be used.

[0069] Furthermore, the motor 531 and bearing 533 are fixed to the housing 534 by interference fit. More precisely, since the motor 531 is held by the motor holder 535, the motor 531 is fixed to the housing 534 by interference fit together with the bearing 533 while being held by the motor holder 535.

[0070] Furthermore, a seal ring 536 is positioned radially outward of the bearing 533 to seal the ring-shaped space between the bearing 533 and the shaft-shaped portion 52b. A ring-shaped groove 534a is formed in the housing 534 for positioning the seal ring 536, and the seal ring 536 is fitted into this groove 534a. A ring-shaped retaining member 537 is fitted radially outward of the seal ring 536 to prevent the seal ring 536 from falling out.

[0071] The central axis of the motor 531, the central axis of the shaft 532, and the central axis of the bearing 533 coincide. In other words, the central axes of the motor 531, the central axis of the shaft 532, and the central axis of the bearing 533 are coaxially positioned.

[0072] The processing liquid discharge nozzle section 51 (51A~51C) and the support base 54 are made of a material with excellent chemical resistance, such as a resin material. For example, polyethylene resin, PTFE (polytetrafluoroethylene) resin, PEEK (polyetheretherketone) resin, etc., can be appropriately selected and used depending on the purpose.

[0073] (Pressure sensor) Figure 7 is a perspective view showing the configuration near the pressure sensor 55 provided in the processing mechanism 5. The nozzle block 50 has the pressure sensor 55 shown in Figures 5 to 7. The pressure sensor 55 acquires the pressure value generated between the motor 531 and the nozzle body 52 as the nozzle body 52 moves radially on the substrate S guided by the shaft 532. Specifically, the pressure sensor 55 acquires the pressure value generated between the end portion 531E of the motor 531 and the shaft-shaped portion 52b.

[0074] The pressure sensor 55 has a plane 55F perpendicular to the axial direction of the shaft 532, and has a plurality of pressure detection points on the plane 55F. The plane 55F is the radially outer plane of the substrate S in the pressure sensor 55. The plurality of pressure detection points are, for example, a plurality of pressure sensors. The plurality of pressure detection points may be arranged concentrically in the plane 55F, or they may be arranged in a matrix in the plane 55F.

[0075] The pressure sensor 55 acquires pressure values ​​at each of the multiple pressure detection points. In other words, the pressure sensor 55 acquires the pressure distribution relative to the plane 55F. Note that the pressure sensor 55 may have only one pressure detection point.

[0076] The pressure sensor 55 has a through hole 55H through which the shaft 532 passes, and is located at the end 531E of the motor 531 from which the shaft 532 protrudes. The pressure sensor 55 is also positioned near the boundary between the end 531E and the other end of the shaft 532. The pressure sensor 55 has a roughly annular shape and is positioned to surround the other end of the shaft 532. The pressure sensor 55 is located within the bearing 533 and is housed within the bearing 533.

[0077] (Control unit) As shown in Figure 2, the control unit 10 comprises a drive control unit 101, a data acquisition unit 102, and a origin position detection unit 103. The origin position detection unit 103 also includes an abnormality detection unit 104.

[0078] Figure 8 is a flowchart illustrating an example of the process by which the control unit 10 of the processing unit 1 discharges processing liquid from the nozzle body 52. ​​As shown in Figure 8, the control unit 10 performs initial setup (S1). Details of the initial setup will be described later. After the control unit 10 performs initial setup, the drive control unit 101 determines whether the substrate S has been loaded into the processing unit 1 (S2). If the drive control unit 101 determines that the substrate S has not been loaded (NO in S1), it continues the process in step S2.

[0079] Meanwhile, if the drive control unit 101 determines that the substrate S has been loaded (YES in S1), it rotates the substrate S using the holding and rotating mechanism 2 (S3). While executing the process in step S3, the drive control unit 101 moves the nozzle body 52 from the origin position using the motor 531 and discharges the processing liquid from the nozzle body 52 (S4).

[0080] Next, the drive control unit 101 determines whether to terminate the process of discharging the processing liquid onto the substrate S (S5). If the drive control unit 101 determines to terminate the process of discharging the processing liquid onto the substrate S (YES in S5), it terminates the process of discharging the processing liquid onto the substrate S. On the other hand, if the drive control unit 101 determines not to terminate the process of discharging the processing liquid onto the substrate S (NO in S5), the drive control unit 101 proceeds to step S2.

[0081] (Move to the origin position) Figure 9 is a flowchart illustrating an example of the process by which the control unit 10 of the processing unit 1 moves the nozzle body 52. ​​In Figure 9, reference numeral A1 denotes a process executed by the control unit 10 as the initial setting of step S1, and is a flowchart illustrating an example of the process of returning the nozzle body 52 to its origin position. The origin position is the position where the axial portion 52b of the nozzle body 52 contacts the pressure sensor 55.

[0082] As shown by the symbol A1 in Figure 9, the control unit 10 outputs a command to move the nozzle body 52 to the origin position (S11). This command instructs the nozzle body 52 to move to the origin position.

[0083] After the control unit 10 outputs a command to move to the origin position, the data acquisition unit 102 starts acquiring data from the pressure sensor 55 (S12). At this time, the data acquisition unit 102 acquires pressure values ​​from multiple pressure detection points on the pressure sensor 55. After the data acquisition unit 102 starts acquiring data from the pressure sensor 55, the drive control unit 101 drives the motor 531 based on the movement command in step S11 (S13). In step S13, the motor 531 moves the nozzle body 52 to the origin position.

[0084] Next, the data acquisition unit 102 completes the acquisition of data from the pressure sensor 55 (S14). After the data acquisition unit 102 completes the acquisition of data from the pressure sensor 55, the origin position detection unit 103 determines whether the pressure values ​​at multiple pressure detection points of the pressure sensor 55 are above a preset threshold (S15). In step S15, the origin position detection unit 103 may also determine whether the pressure values ​​at at least two of the multiple pressure detection points are above a threshold.

[0085] If the origin position detection unit 103 determines that the pressure value at at least one of the multiple pressure detection points of the pressure sensor 55 is less than a threshold (NO in S15), the control unit 10 proceeds to the process of step S11. On the other hand, if the origin position detection unit 103 determines that the pressure values ​​at the multiple pressure detection points of the pressure sensor 55 are equal to or greater than a threshold (YES in S15), it detects that the nozzle body 52 has returned to the origin position (S16). After the origin position detection unit 103 detects that the nozzle body 52 has returned to the origin position, the control unit 10 proceeds to the process of step S2.

[0086] Figure 10 is a graph showing an example of the relationship between time and the pressure value acquired by the pressure sensor 55. In Figure 10, the horizontal axis represents time [sec] and the vertical axis represents the pressure value [Pa]. When the drive control unit 101 drives the motor 531 in step S13, the pressure value increases over time. In step S16, the origin position detection unit 103 detects that the nozzle body 52 has returned to the origin position when the pressure value becomes, for example, 45 Pa or more, as indicated by the symbol P1 in Figure 10.

[0087] As described above, the origin position detection unit 103 detects that the nozzle body 52 has returned to the origin when the pressure value acquired by the pressure sensor 55 exceeds a preset threshold. Here, since the space between the motor 531 and the nozzle body 52 is a space with a degree of design freedom, the pressure sensor 55 can be designed in any shape, and the configuration of the processing unit 1 can be made more compact. For example, the pressure sensor 55 can be designed to be thin and small.

[0088] Furthermore, in step S16, the origin position detection unit 103 detects that the nozzle body 52 has returned to the origin position when the pressure values ​​at at least two of the multiple pressure detection points exceed a preset threshold. By using the detection results of multiple pressure detection points, it is possible to accurately detect that the nozzle body 52 has returned to the origin position. In addition, it is possible to confirm whether the axial portion 52b of the nozzle body 52 is in even contact with the pressure sensor 55.

[0089] Furthermore, as described above, the pressure sensor 55 has a through hole 55H through which the shaft 532 passes, and is provided at the end 531E of the motor 531 from which the shaft 532 protrudes. As a result, in step S16, the origin position detection unit 103 can reliably detect that the nozzle body 52 has returned to the origin.

[0090] (Move to pressure detection position) In Figure 9, the symbol A2 is a flowchart illustrating an example of a process executed by the control unit 10 as the initial setting for step S1, which involves moving the nozzle body 52 to the pressure detection position. The pressure detection position is, for example, the origin position. The process in step S21 shown as symbol A2 in Figure 9 may be the same as the process in step S11 shown as symbol A1 in Figure 9.

[0091] The processes in steps S22 to S24, shown as indicated by the symbol A2 in Figure 9, are the same as the processes in steps S12 to S14, shown as indicated by the symbol A1 in Figure 9, in that order. In addition, the control unit 10 executes the processes in steps S25 to S27, shown as indicated by the symbol A2 in Figure 9, in parallel with the processes in steps S15 and S16, shown as indicated by the symbol A1 in Figure 9.

[0092] As shown by reference numeral A2 in Figure 9, in step S24, after the data acquisition unit 102 has completed acquiring data from the pressure sensor 55, the abnormality detection unit 104 of the origin position detection unit 103 determines whether there is a difference in the time-dependent change in the pressure value detected at each of the multiple pressure detection points (S25). In step S25, the abnormality detection unit 104 may also determine whether there is a difference in the time-dependent change in the pressure value at at least two of the multiple pressure detection points.

[0093] Figure 11 is a graph showing an example of the relationship between time and pressure values ​​at multiple pressure detection points acquired by the pressure sensor 55. In Figure 11, the horizontal axis represents time [sec] and the vertical axis represents pressure value [Pa].

[0094] Figure 11 also shows the pressure values ​​PV1 at the first pressure detection point, PV2 at the second pressure detection point, and PV3 at the third pressure detection point. The first, second, and third pressure detection points are included in the multiple pressure detection points of the pressure sensor 55. When the drive control unit 101 drives the motor 531 in step S23, the pressure value increases over time.

[0095] The abnormality detection unit 104 determines, for example, in the case shown by reference numeral B1 in Figure 11, that there is no difference in the time-dependent changes of the pressure values ​​PV1, PV2, and PV3 detected at the first pressure detection point, the second pressure detection point, and the third pressure detection point, respectively.

[0096] Furthermore, consider the case where, for example, as shown by symbol B2 in Figure 11, a significant difference D1 is observed between the pressure value PV2 detected at the second pressure detection point and the pressure values ​​PV1 and PV3 detected at the first and third pressure detection points at the same time. In this case, the abnormality detection unit 104 determines that there is a difference in the time-dependent changes of the pressure values ​​PV1, PV2, and PV3.

[0097] In other words, if the abnormality detection unit 104 finds a significant difference between the pressure value detected at any of the multiple pressure detection points and the pressure value detected at other pressure detection points at the same time, it determines that there is a difference in the time-dependent change of the pressure value detected at each of the multiple pressure detection points.

[0098] Furthermore, consider the case where, for example, as shown by symbol B3 in Figure 11, there is a significant difference between the rate of change of the pressure value PV2 detected at the second pressure detection point during a specific period T1 and the rate of change of the pressure values ​​PV1 and PV3 detected at the first and third pressure detection points during the same specific period T1. In this case, the abnormality detection unit 104 determines that there is a difference in the temporal changes of the pressure values ​​PV1, PV2, and PV3. The rate of change is the ratio of the pressure value to the specific period T1. The specific period T1 is, for example, the period between the acquisition timings of pressure values ​​that are adjacent to each other in time.

[0099] Thus, the abnormality detection unit 104 determines that there is a difference in the time-dependent changes in the pressure values ​​detected at each of the multiple pressure detection points if a significant difference is found between the rate of change of the pressure value detected at one of the multiple pressure detection points over a specific period and the rate of change of the pressure value detected at another pressure detection point over a specific period.

[0100] If the abnormality detection unit 104 determines that there is a difference in the time-dependent change in the pressure values ​​detected at each of the multiple pressure detection points (YES in S25), it determines that there is an abnormality in the forward and backward movement of the shaft 532 (S26). At this time, the control unit 10 causes an alarm to be output by an alarm output unit (not shown).

[0101] Steps S25 and S26 allow for accurate detection of abnormalities that occur during the forward and backward movement of the shaft 532. Examples of abnormalities related to the forward and backward movement of the shaft 532 include distortion of the shaft 532 and deviation of the shaft 532 from the central axis of the motor 531. This distortion and deviation are caused by aging of the shaft 532 or by the effects of heat applied to the shaft 532.

[0102] Furthermore, if the pressure detection position in step S21 is the origin position, and the answer in step S25 is YES, the abnormality detection unit 104 may determine that there is an abnormality in the return of the nozzle body 52 to the origin position. This allows for accurate detection of abnormalities that occur when the nozzle body 52 returns to the origin position.

[0103] On the other hand, if the abnormality detection unit 104 determines that there is no difference in the change over time of the pressure values ​​detected at each of the multiple pressure detection points (NO in S25), it determines that the forward and backward movement of the shaft 532 is normal (S27). Note that if the pressure detection position is the origin position in step S21 and NO in step S25, the abnormality detection unit 104 may determine that the return of the nozzle body 52 to the origin position is normal. After the abnormality detection unit 104 determines that the forward and backward movement of the shaft 532 is normal, the control unit 10 proceeds to step S2.

[0104] As described above, the abnormality detection unit 104 detects abnormalities related to the forward and backward movement of the shaft 532 based on the pressure values ​​at at least two of the multiple pressure detection points. In this way, by using the detection results from multiple pressure detection points, abnormalities related to the forward and backward movement of the shaft 532 can be detected with high accuracy.

[0105] (Variation 1) Figure 12 is a cross-sectional view of a nozzle block 50A included in a processing unit according to Modification 1 of the present invention. The processing unit of Modification 1 includes a nozzle block 50A as a configuration corresponding to the nozzle block 50. As shown in Figure 12, the nozzle block 50A includes a nozzle body 52, a motor 531, a shaft 532, a housing 534, and a support shaft 611. Note that in Figure 12, the support base 54, bearing 533, seal ring 536, and retaining member 537 are omitted.

[0106] The support shaft 611 provides auxiliary support to the nozzle body 52. ​​One end of the support shaft 611 is fixed to the axial portion 52b of the nozzle body 52, and the other end of the support shaft 611 is connected to the housing 534.

[0107] The housing 534 has a shaft hole 612, and the support shaft 611 has threads on its outer circumference. The threads on the support shaft 611 engage with the threads provided in the shaft hole 612, thereby engaging the support shaft 611 and the housing 534. Therefore, when the motor 531 rotates the shaft 532, causing the nozzle body 52 to move radially across the substrate S, the support shaft 611 also moves radially across the substrate S.

[0108] (Modification 2) Figure 13 is a cross-sectional view showing an example of an on-off valve VA provided in a processing unit according to a modified example 2 of the present invention. As shown in Figure 13, the on-off valve VA includes a housing 211, an on-off section 212, a shaft 213, an actuator 214, and a pressure sensor 56. The on-off valve VA is a needle valve.

[0109] The on / off valve VA is installed in the piping 217 and opens and closes the flow path 218 of the piping 217 through which the processing liquid flows in response to a control signal from a drive control unit 101 (described later) of a control unit (not shown) that is part of the processing unit. The piping 217 also leads the processing liquid to a supply unit (not shown) that supplies the processing liquid to the substrate S. This supply unit is, for example, a nozzle body 52.

[0110] The housing 211 houses the shaft 213, actuator 214, and pressure sensor 56. The opening / closing section 212 opens and closes the flow path 218 of the piping 217 that guides the processing liquid to the supply section that supplies the processing liquid to the substrate S. In other words, the opening / closing section 212 is an example of a surface treatment mechanism for performing a predetermined surface treatment on the substrate S. The opening / closing section 212 has a diaphragm 212a and a connecting section 212b. The diaphragm 212a is made of a plastic material such as resin.

[0111] The connector 212b connects the diaphragm 212a and the shaft 213. A seal ring 216 is provided in the groove formed in the connector 212b to seal the space between the connector 212b and the housing 211. A spring 215 is provided between the connector 212b and the housing 211. One end of the shaft 213 is connected to the connector 212b, and the other end of the shaft 213 is connected to the motor 214a of the actuator 214.

[0112] The actuator 214 includes a motor 214a, a connecting portion 214b, and a support portion 214c. The motor 214a is connected to the other end of the shaft 213 and moves the shaft 213 back and forth. Driven by the motor 214a, the shaft 213 moves back and forth in a direction that opens and closes the flow path 218 in the opening / closing portion 212, as an example of a predetermined direction. In other words, the shaft 213 moves back and forth in a direction in which the actuator 214 and the opening / closing portion 212 are aligned.

[0113] The connecting part 214b connects the motor 214a and the support part 214c. The support part 214c supports the pressure sensor 56. As the shaft 213 moves back and forth due to the drive of the motor 214a, the distance between the shaft 213 and the support part 214c changes.

[0114] The pressure sensor 56 acquires pressure values ​​at multiple pressure detection points as the opening / closing part 212 moves in the direction of opening the flow path 218, guided by the shaft 213. The pressure sensor 56 may differ from the pressure sensor 55 in that it does not have a through hole 55H and its shape is not substantially annular.

[0115] The control unit of the processing unit in Modified Example 2 includes a drive control unit 101, a data acquisition unit 102, and a origin position detection unit 103, similar to the control unit 10. In this case, the functions of the drive control unit 101, data acquisition unit 102, and origin position detection unit 103 in the control unit of Modified Example 2 may be the same as the functions of the drive control unit 101, data acquisition unit 102, and origin position detection unit 103 in the control unit 10.

[0116] [Examples of implementation using software] The function of processing unit 1 (hereinafter referred to as "device") is a program that causes the device to function as a computer, and can be realized by a program that causes each control block of the device (in particular each part included in control unit 10) to function as a computer.

[0117] In this case, the device includes a computer having at least one control device (e.g., a processor such as a CPU) and at least one storage device (e.g., memory) as hardware for executing the program. By executing the program using this control device and storage device, each of the functions described in the above embodiment is realized.

[0118] The above program may be recorded on one or more computer-readable recording media, not temporary ones. These recording media may or may not be provided by the above device. In the latter case, the program may be supplied to the above device via any wired or wireless transmission medium.

[0119] Furthermore, some or all of the functions of each of the above-mentioned control blocks can also be realized by logic circuits. For example, an integrated circuit in which logic circuits that function as each of the above-mentioned control blocks are formed is also included in the scope of the present invention.

[0120] [Additional Notes] The present invention is not limited to the embodiments described above, and various modifications are possible within the scope of the claims. Embodiments obtained by appropriately combining the multiple technical means disclosed in the embodiments are also included in the technical scope of the present invention. [Explanation of Symbols]

[0121] 1 Processing Unit 2. Holding and rotating mechanism 10 Control Unit 531 Motor 531E End 52 Nozzle body 55, 56 Pressure sensors 55F plane 55H through hole 103 Origin position detection unit 104 Anomaly detection unit 212 Opening / Closing Section 213,532 shafts 214 Actuator 533 Bearing 533F Inner surface D1 Significant difference T1 Specific period S substrate

Claims

1. A surface treatment mechanism for performing a predetermined surface treatment on a substrate, A shaft having one end connected to the surface treatment mechanism and the other end connected to an actuator, which moves back and forth in a predetermined direction when driven by the actuator, As the surface treatment mechanism moves in the predetermined direction guided by the shaft, a pressure sensor acquires the pressure value generated between the actuator and the surface treatment mechanism or the shaft at a plurality of pressure detection points. A substrate processing apparatus comprising: an abnormality detection unit that detects an abnormality related to the forward and backward movement of the shaft based on the pressure values ​​at at least two pressure detection points included in the plurality of pressure detection points.

2. The device further includes a rotation mechanism that holds a circular substrate in a horizontal position and rotates it around a vertical axis passing through the center of the substrate. The surface treatment mechanism is a nozzle body positioned below the substrate and discharging a treatment liquid from an outlet toward the lower peripheral edge of the substrate. The substrate processing apparatus according to claim 1, wherein the shaft moves back and forth in the radial direction of the substrate as the predetermined direction.

3. The substrate processing apparatus according to claim 1, wherein the abnormality detection unit determines that there is an abnormality in the reciprocating movement of the shaft if there is a difference in the change over time of the pressure value detected at each of the plurality of pressure detection points.

4. The substrate processing apparatus according to claim 3, wherein the abnormality detection unit determines that there is an abnormality in the reciprocating movement of the shaft if a significant difference is found between the pressure value detected at any of the plurality of pressure detection points and the pressure value detected at another pressure detection point at the same time.

5. The substrate processing apparatus according to claim 3, wherein the abnormality detection unit determines that there is an abnormality in the reciprocating movement of the shaft if a significant difference is found between the rate of change of the pressure value detected at any of the plurality of pressure detection points over a specific period and the rate of change of the pressure value detected at the other pressure detection points over the same period.

6. The substrate processing apparatus according to claim 1, wherein the pressure sensor has a through hole formed through which the shaft passes and is provided at the end of the actuator through which the shaft protrudes.

7. The actuator further comprises a bearing that extends from its end in the direction in which the shaft moves back and forth, houses the shaft inside, and has an inner circumferential surface on which the surface treatment mechanism slides, The substrate processing apparatus according to claim 6, wherein the pressure sensor is housed within the bearing.

8. The substrate processing apparatus according to claim 7, wherein the central axis of the actuator, the central axis of the shaft, and the central axis of the bearing coincide.

9. A shaft, one end of which is connected to a surface treatment mechanism for performing a predetermined surface treatment on a substrate and the other end of which is connected to an actuator, is moved back and forth in a predetermined direction by the drive of the actuator. A substrate processing method comprising acquiring, at multiple pressure detection points of a pressure sensor, the pressure value generated between the actuator and the surface processing mechanism or the shaft as the surface processing mechanism moves in a predetermined direction guided by the shaft, A substrate processing method for detecting an abnormality related to the forward and backward movement of the shaft based on the pressure values ​​at at least two pressure detection points included in the plurality of pressure detection points.

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