PCB transport device

Abstract

Reduce the installation area of ​​the circuit board transport device. [Solution] The substrate transport device 1 comprises a housing 10, a robot 2, and an aligner 5 located in the transport space 15 above specific regions 191, 192, 193, and 194 formed by the trajectory of projecting the communication openings 171, 172, 173, and 174 in a first direction, and at least a portion of which overlaps with the specific regions when viewed in the vertical direction.

Description

Technical Field

[0001] The technology disclosed herein relates to a substrate transfer device.

Background Art

[0002] Patent Document 1 describes a conventional semiconductor manufacturing apparatus. The conventional semiconductor manufacturing apparatus includes a housing and a transfer robot installed inside the housing. A clean downflow is generated inside the housing. The transfer robot transfers a substrate taken out from a cassette to a processing apparatus. The semiconductor manufacturing apparatus also includes an aligner device for aligning the substrate. In the conventional semiconductor device, the aligner device is arranged at a height outside the range of the height of the substrate accommodated in the lowermost stage of the cassette and the height of the substrate accommodated in the uppermost stage.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In a substrate transfer device including the above-described semiconductor manufacturing apparatus, reduction in footprint (i.e., installation area) may be required. In the conventional semiconductor manufacturing apparatus, the aligner device is installed so as to protrude outward from the side wall of the housing. The conventional semiconductor manufacturing apparatus has a large installation area by the amount of protrusion of the aligner device.

Means for Solving the Problems

[0005] The technology disclosed herein relates to a substrate transfer device. The substrate transfer device includes a housing that forms a transfer space for substrates, the housing having at least a first vertical wall that forms a part of the transfer space, A robot that transports the substrate in a horizontal first direction inside and outside the transport space through a communication opening formed in the first vertical wall, and also transports the substrate in the first direction, a horizontal second direction perpendicular to the first direction, and the vertical direction within the transport space, An aligner for aligning the substrate transported by the robot, comprising: an aligner located in the transport space above a specific region formed by the trajectory of the communication opening projected in the first direction, and which, when viewed in the vertical direction, at least a portion of which overlaps the specific region. [Effects of the Invention]

[0006] The aforementioned substrate transport device can have a reduced installation footprint. [Brief explanation of the drawing]

[0007] [Figure 1] Figure 1 shows the external appearance of the substrate transport device. [Figure 2] Figure 2 is a side view of the inside of the substrate transport device. [Figure 3] Figure 3 is a top-down view of the inside of the substrate transport device. [Figure 4] Figure 4 is a front view of the inside of the substrate transport device. [Figure 5] Figure 5 is a perspective view of the aligner device. [Figure 6] Figure 6 is a plan view of the aligner device. [Figure 7] Figure 7 is a cross-sectional view taken along line VII-VII in Figure 6. [Figure 8] Figure 8 shows the support of the aligner device by a bracket. [Figure 9] Figure 9 shows another example of the arrangement of the aligner device in a substrate transport system. [Figure 10] Figure 10 shows a modified substrate transport device. [Modes for carrying out the invention]

[0008] The following describes an embodiment of the substrate transport device with reference to the drawings. The substrate transport device described here is illustrative.

[0009] (Overall structure of the substrate transport device) Figure 1 shows the external appearance of the substrate transport device 1. Figure 2 is a side view of the inside of the substrate transport device 1. Figure 3 is a top view of the inside of the substrate transport device 1. Figure 4 is a front view of the inside of the substrate transport device 1.

[0010] The substrate transport device 1 transports the substrate 9. The substrate 9 is a semiconductor wafer or a glass substrate. Specifically, the substrate transport device 1 is, for example, a sorter. The substrate transport device 1 is, for example, an EFEM (Equipment Front End Module). The substrate transport device 1 is, for example, a stocker.

[0011] If the substrate transport device 1 is an EFEM, the substrate transport device 1 is incorporated into the substrate processing equipment 4, as virtually shown in Figure 3. The substrate processing equipment 4 is not an essential element of the substrate transport device 1. The substrate processing equipment 4 performs processes on the substrate 9, such as heat treatment, impurity introduction treatment, thin film formation treatment, lithography treatment, cleaning treatment, and planarization treatment. Alternatively, the substrate processing equipment 4 inspects the appearance or dimensions of the substrate 9. If the substrate transport device 1 is a stocker, the substrate processing equipment 4 provides temporary storage for the transfer of the substrate 9. Here, the storage of the substrate 9 by the substrate processing equipment 4 is also considered part of the processing of the substrate 9. The third vertical wall 13 of the substrate transport device 1, described later, separates the transport space 15 from the substrate processing equipment 4. The robot 2, described later, transports the substrate 9 to or from the substrate processing equipment 4 through the opening in the third vertical wall 13.

[0012] The substrate transfer device 1 includes a housing 10. The housing 10 has a first vertical wall 11, a second vertical wall 12, a third vertical wall 13, and a fourth vertical wall 14. The first vertical wall 11, the second vertical wall 12, the third vertical wall 13, and the fourth vertical wall 14 are each walls perpendicular to the floor. The first vertical wall 11 and the third vertical wall 13 face each other in the first direction. The second vertical wall 12 and the fourth vertical wall 14 face each other in the second direction. Both the first direction and the second direction are horizontal directions, and the second direction is orthogonal to the first direction. Hereinafter, the first direction is referred to as the X direction, and the second direction is referred to as the Y direction. Also, the vertical direction orthogonal to the X direction and the Y direction is referred to as the Z direction. Note that the X direction, the Y direction, and the Z direction are used for the description of the substrate transfer device 1 and are not used to limit the structure of the substrate transfer device 1.

[0013] The first vertical wall 11 is connected to the second vertical wall 12 and the first vertical wall 11 is connected to the fourth vertical wall 14, and the third vertical wall 13 is connected to the second vertical wall 12 and the third vertical wall 13 is connected to the fourth vertical wall 14. The first vertical wall 11, the second vertical wall 12, the third vertical wall 13, and the fourth vertical wall 14 form a closed transfer space 15. The substrate 9 is transferred within the transfer space 15.

[0014] The substrate transfer device 1 includes an FFU (Fan Filter Unit) 16. Note that the FFU 16 is not an essential element of the substrate transfer device 1. The FFU 16 is installed on the ceiling of the housing 10. The FFU 16 generates a clean downflow that flows from top to bottom within the transfer space (see the white arrows in FIG. 2 or FIG. 4).

[0015] Adjacent to the first vertical wall 11 of the housing 10, a load port is installed. Note that the load port is not an essential element of the substrate transfer device 1. In the illustrated substrate transfer device 1, three load ports, namely, a first load port 41, a second load port 42, and a third load port 43, are installed side by side in the Y direction. The tables of each load port 41, 42, and 43 support a FOUP (Front Opening Unified Pod) 44 as virtually shown in FIG. 2. The FOUP 45 accommodates a plurality of substrates 9 arranged in the Z direction.

[0016] The first vertical wall 11 has a communication port. The communication port communicates with the hoop 45. The first vertical wall 11 has a first communication port 171, a second communication port 172, and a third communication port 173. The first communication port 171, the second communication port 172, and the third communication port 173 are arranged in the Y direction. The first communication port 171, the second communication port 172, and the third communication port 173 are each individually opened and closed.

[0017] In addition, the second vertical wall 12 and the fourth vertical wall 14 each have doors 181, 182. The doors 181, 182 are maintenance doors. The doors 181, 182 communicate the inside and outside of the transport space 15. Note that the opening and closing directions of the doors 181, 182 are not limited to the directions in the illustrated example. The door 181 or 182 may open and close in the direction opposite to the illustrated example.

[0018] Note that the number of load ports installed in the substrate transfer device 1 is not limited to three. Also, any one of the first load port 41, the second load port 42, and the third load port 43 may be omitted.

[0019] The substrate transfer device 1 includes an aligner 5. The aligner 5 is located in the transfer space 15. The aligner 5 aligns the substrate 9. Details regarding the structure and installation of the aligner 5 will be described later.

[0020] The substrate transfer device 1 includes a robot 2. The robot 2 transfers the substrate 9 at least between the hoop 45 and the aligner 5. The robot 2 is located in the transfer space 15. The robot 2 is a horizontal articulated robot.

[0021] The robot 2 has a base 21. The base 21 is installed in the transfer space 15. More specifically, the base 21 is installed at a position close to the third vertical wall 13 in the transfer space 15 and at the central position in the Y direction. The base 21 is fixed in the transfer space 15. The base 21 does not move.

[0022] Robot 2 has a manipulator 22. The base 21 supports the manipulator 22. As shown by the dashed arrow in Figure 2 or Figure 4, the manipulator 22 is vertically movable in the Z direction relative to the base 21.

[0023] The manipulator 22 of the robot 2 in the illustration has two links, a first and a second. The ends of the two links are rotatable around an axis extending in the Z direction. Note that the number of links forming the manipulator 22 is not limited to two. The manipulator 22 may have three links.

[0024] The end of the first link of the manipulator 22 is supported by the base 21. This end is rotatable about an axis extending in the Z direction relative to the base 21.

[0025] The manipulator 22 includes a hand 3. The hand 3 is rotatable about an axis extending in the Z direction relative to the second link of the manipulator 22. The hand 3 is an end effector that holds the substrate 9. In plan view, the hand 3 is roughly Y-shaped. The hand 3 generally holds the substrate 9 in various ways, such as gripping, suction, placement, or fitting. In the illustrated example, the hand 3 is a passive hand. The passive hand holds the substrate 9 by placing the substrate 9 on the hand 3. As shown in an enlarged view in Figure 6, the hand 3 touches the outer edge of the substrate 9. The hand 3 does not touch the center of the substrate 9.

[0026] Robot 2 may have two or more hands. Robot 2 may have two or more manipulators. Also, one manipulator may include two or more hands.

[0027] The robot controller controls robot 2. The robot controller may also control aligner 5. Alternatively, a controller other than the robot controller may control aligner 5.

[0028] (Alaina's positioning) The aligner 5 is located in the upper part of the transport space 15. The aligner 5 is located above the specific region 193. The specific region 193 is the area formed by the trajectory of the third communication opening 173 of the first vertical wall 11 projected in the X direction to the third vertical wall 13, as shown by the dashed line in Figures 2, 3, or 4. As virtually shown in Figure 2, the manipulator 22 and hand 3 of the robot 2 are located within the specific region 193 when they take out the substrate 9 from the hoop 45 of the third load port 43 or put the substrate 9 into the hoop 45 of the third load port 43. The specific region 193 may also be defined as the area within the transport space 15 where the transport of the substrate 9 through the third communication opening 173 takes place. The aligner 5 is located above the specific region 193, but more specifically, the housing 52 of the aligner 5, which will be described later, is located above the specific region 193. A portion of the connection section 524, which is an ancillary piece of the aligner 5 and will be described later, may be located within the specific area 193. Furthermore, the aligner 5, including the connection section 524, may be located above the specific area 193.

[0029] The third communication opening 173 is the communication opening closest to the second vertical wall 12 among the three communication openings arranged in the X direction in the housing 10 of the substrate transport device 1. The aligner 5 is located adjacent to the second vertical wall 12. In other words, the aligner 5 is located on the opposite side in the Y direction from the fourth vertical wall 14 which has the door 182.

[0030] As shown in Figure 3, when viewed in the vertical direction, the aligner 5 is positioned so that a portion of it overlaps with a specific region 193. More specifically, the aligner 5 is inclined horizontally with respect to the second vertical wall 12, which extends along the X direction. A gap 151 is formed between the aligner 5 and the second vertical wall 12, as shaded in Figure 3. When viewed from above, the gap 151 has a roughly triangular shape.

[0031] Bracket 8 supports the aligner 5. Bracket 8 is positioned to straddle the first vertical wall 11 and the third vertical wall 13, and is fixed to the first vertical wall 11 and the third vertical wall 13, respectively. Details of the shape of bracket 8 will be described later.

[0032] (Alainer structure) Figure 5 shows the entire aligner 5. Figure 6 is a top view of the aligner 5. Figure 7 is a cross-sectional view taken along line VII-VII of Figure 6. Hereafter, the direction connecting the front left and back right of Figure 5 will be referred to as the width direction, the direction connecting the front right and back left of Figure 5 will be referred to as the depth direction, and the vertical direction of the paper will be referred to as the height direction. Note that the width direction, depth direction, and height direction are used to describe the aligner 5 and are not used to limit the structure of the aligner 5.

[0033] The aligner 5 has a spindle 51. The spindle 51 holds the substrate 9 and rotates the held substrate 9. The spindle 51 is rotatably held in the housing 52. The spindle 51 protrudes upward from the housing 52. The spindle 51 is cylindrical with a first rotation axis Z1 extending in the height direction as its axis of rotation.

[0034] The aligner 5 has an arm 53. Note that the arm 53 is not an essential element of the aligner 5. The arm 53 extends radially outward from the spindle 51. As shown in Figure 6, the arm 53 supports the substrate 9 with its outer edge positioned radially inward from the pin 531 at the tip of the arm 53. The spindle 51 indirectly supports the substrate 9 via the arm 53. Like the hand 3, the arm 53 does not touch the central part of the substrate 9. The substrate 9, transported by the robot 2, is placed on the arm 53. The arm 53 includes a first arm 53, a second arm 53, and a third arm 53. The first arm 53, the second arm 53, and the third arm 53 are positioned at equal angular intervals in the circumferential direction. The first arm 53, the second arm 53, and the third arm 53 can stably support the substrate 9. Note that the arrangement of the first arm 53, the second arm 53, and the third arm 53 is not limited to equal angular intervals. As the spindle 51 rotates around the first rotation axis Z1, the substrate 9 held by the arm 53 rotates around the first rotation axis Z1. Note that there may be four arms 53. Also, the arms 53 may be omitted. Furthermore, the pins 531 at the tips of the arms 53 may be pins that contact the outer peripheral edge of the lower surface of the substrate 9 to support it.

[0035] The aligner 5 has an electric motor 54 that rotates a spindle 51. The electric motor 54 is a servo motor or a stepping motor. The second rotation axis Z2 of the electric motor 54 is offset in the width and depth directions relative to the first rotation axis Z1 of the spindle 51. The spindle 51 and the electric motor 54 are connected via a belt 55. More specifically, a first pulley 56 is attached to the lower end of the spindle 51. The first pulley 56 is housed in a housing 52. The shaft of the electric motor 54 is connected to a second pulley 58 via a reduction gear set 57. The second pulley 58 is also housed in a housing 52. The belt 55 is wrapped around the first pulley 56 and the second pulley 58 within the housing 52. The belt 55 extends in the width direction. The belt 55 transmits the rotational force of the electric motor 54 to the spindle 51.

[0036] The height of the electric motor 54 is relatively tall. The height of the electric motor 54 is greater than the height of the housing 52. The electric motor 54 is located above the housing 52, as shown in Figure 7. The electric motor 54 is housed in a casing 59. The casing 59 is located laterally in the width direction relative to the spindle 51 on the upper surface of the housing 52.

[0037] The aligner 5 has a sensor 510. The sensor 510 is used to check the eccentricity of the substrate 9, read the ID of the substrate 9, and detect and align notches or orientation flats of the substrate 9. The sensor 510 is located on the side of the casing 59. The sensor 510 is C-shaped (or inverted C-shaped) in side view. The outer edge of the substrate 9 held by the arm 53 passes between the sensors 510.

[0038] The aligner 5 has a lifter 6. The lifter 6 can lift the substrate 9 supported by the spindle 51 and arm 53. The lifter 6 supports the substrate 9 in place of the spindle 51 and arm 53.

[0039] The lifter 6 has a plurality of lift pieces 61, 62, and 63. The lift pieces 61, 62, and 63 protrude upward from the upper surface of the housing 52. As shown in Figure 6 or 7, the lift pieces 61, 62, and 63 strike the outer peripheral edge of the lower surface of the substrate 9 from below, lifting the substrate 9. Lift piece 61 is located on the opposite side of the casing 59 from the spindle 51. Lift pieces 62 and 63 are located on the opposite side of the spindle 51 from lift piece 61. As shown in Figure 6, with respect to the hand 3 that transfers the substrate 9 between the aligner 5 and the hand 3, lift piece 61 is located on the first side in the width direction of the hand 3, and lift pieces 62 and 63 are located on the second side in the width direction of the hand 3. Note that the arrangement of lift pieces 61, 62, and 63 shown in Figure 6 is merely an example, and the number of lift pieces located on the first side and the number of lift pieces located on the second side can be set as appropriate.

[0040] Lift pieces 61 and 62, 63 are positioned spaced apart from each other in the width direction. Lift pieces 62 and 63 are also positioned spaced apart from each other in the depth direction. As shown in Figure 6, lift pieces 62 and 63 are located on opposite sides in the depth direction, flanking the sensor 510. Lift pieces 62 and 63 are integrated via a connecting plate 66.

[0041] The lifter 6 has a lifting drive unit 64. The lifting drive unit 64 includes an air cylinder. The air cylinder extends and retracts vertically in response to the supply and discharge of air. The lifting drive unit 64 is relatively tall in the height direction. The height of the lifting drive unit 64 is greater than the height of the housing 52. The lifting drive unit 64 is housed in a casing 59. A link 65 is interposed between the lift pieces 61, 62, and 63 and the lifting drive unit 64. The link 65 is housed in the housing 52. The link 65 extends straight in the width direction from the lifting drive unit 64 to the lift piece 61. The lift pieces 61, 62, and 63 are connected to the link 65 directly or indirectly. As the air cylinder extends and retracts, the link 65 is displaced in the height direction. As the link 65 is displaced, the lift pieces 61, 62, and 63 are displaced in the height direction. The lift pieces 61, 62, and 63 are displaced between a standby position and a support position. The standby position is below the tip of the arm 53, as shown by the solid line in Figure 7. The support position is above the tip of the arm 53, as shown by the dashed line in Figure 7. When the arm 53 supports the substrate 9 and the lift pieces 61, 62, and 63 rise from the standby position to the support position, the substrate 9 is transferred from the arm 53 to the lift pieces 61, 62, and 63.

[0042] Robot 2 takes the circuit board 9, which has been aligned by the aligner 5. Robot 2's hand 3, in principle, takes the circuit board 9 from the arm 53, which is mounted on the arm 53. Robot 2 inserts hand 3 under the circuit board 9, which is supported by the arm 53, and supports the circuit board 9.

[0043] If, as a result of the alignment of the circuit board 9, the hand 3 and arm 53 interfere when the robot 2 picks up the circuit board 9, the relative orientation of the circuit board 9 and the hand 3 needs to be changed. When the relative orientation is changed, the lift pieces 61, 62, and 63 of the lifter 6 are displaced to their support positions, and the lift pieces 61, 62, and 63 support the circuit board 9 in place of the arm 53. The hand 3 can then pick up the circuit board 9 from the lift pieces 61, 62, and 63 without interfering with the arm 53. More specifically, the circuit board 9 is transferred from the lift pieces 61, 62, and 63 to the hand 3 as the lift pieces 61, 62, and 63 supporting the circuit board 9 descend.

[0044] The housing 52 has a flattened shape in which its height in the vertical direction is shorter than its length in the horizontal direction. The housing 52 has a main body 521 and a top plate 522. The main body 521 has a width that is longer than its depth. The main body 521 has a horizontally elongated rectangular shape. The main body 521 also has a height that is shorter than both its width and depth.

[0045] The top plate 522 is a flat plate that closes the upper opening of the main body 521. The width of the top plate 522 is substantially the same as the width of the main body 521. The depth of the top plate is longer than the depth of the main body 521. The top plate 522 extends horizontally beyond the main body 521. As shown in Figure 5 or Figure 8, the housing 52 has steps 523 on each side in the depth direction.

[0046] Here, the installation structure of the aligner 5 within the transport space 15 will be described. Figure 8 shows the aligner 5 and the bracket 8 that supports the aligner 5. The bracket 8 is plate-shaped and has a support hole 81 in the center. The support hole 81 is rectangular when viewed from above, and its size corresponds to the size of the main body 521 of the housing 52 of the aligner 5. As shown by the white arrow in Figure 8, the aligner 5 is attached to the bracket 8 from above. The main body 521 is inserted into the support hole 81 of the bracket 8. As mentioned above, the top plate 522 of the housing 52 is wider horizontally than the main body 521. The step 523 between the main body 521 and the top plate 522 engages with the edge 82 of the support hole 81, and the aligner 5 is supported by the bracket 8.

[0047] The aligner 5, which has a lifter 6, may cause dust from the housing 52 to be blown upwards as the link 65 is displaced up and down within the housing 52. The aligner 5 has an exhaust fan 511. The exhaust fan 511 forcibly discharges dust from inside the housing 52 to the outside of the housing 52 (see the dashed arrow in Figure 7). The exhaust fan 511 is mounted on the bottom surface inside the housing 52. The bottom wall of the housing 52 has an exhaust port 525. The exhaust port 525 connects the inside and outside of the housing 52.

[0048] A connecting portion 524 is attached to the lower exterior surface of the housing 52. The connecting portion 524 covers the exhaust port 525. An exhaust duct 152 is connected to the connecting portion 524. As shown in Figure 2 or Figure 4, the exhaust duct 152 is arranged to extend vertically near the corner between the second vertical wall 12 and the third vertical wall 13 of the housing 10. The exhaust duct 152 guides the dust discharged to the outside of the housing 52 by the exhaust fan 511 to the lower part of the transport space 15.

[0049] (Effects and Benefits) The aligner 5 is positioned above the specific region 193 in the transport space 15 of the substrate transport device 1, and when viewed in the vertical direction, a portion of it overlaps with the specific region 193. Unlike aligners in conventional substrate transport devices, the aligner 5 is not installed to protrude outward from the second vertical wall 12 of the housing 10. This reduces the footprint of the substrate transport device 1. Also, because the aligner 5 is positioned above the specific region 193, the robot 2 can transport the substrate 9 through the third communication opening 173.

[0050] Because the aligner 5 has a flattened shape, even when it is installed above in the transport space 15, the mounting height H1 of the substrate 9 on the aligner 5 is relatively low (see Figure 2). The mounting height H1 of the substrate 9 is the position where the robot 2 that transports the substrate 9 hands over the substrate 9 to the aligner 5.

[0051] The bracket 8 of the aligner 5 has a support hole 81 into which the main body 521 is inserted, and the bracket 8 holds the aligner 5 by engaging the step 523 of the aligner 5 with the edge 82 of the bracket 8. The height H2 from the top surface of the bracket 8 to the mounting position of the substrate 9 in the aligner 5 is also set as low as possible (see Figure 8). The structure of the bracket 8 further lowers the mounting height H1 of the substrate 9 in the aligner 5. As shown in Figure 2, the mounting height H1 is not significantly different from the height of the substrate 9 at the highest position in the hoop 45.

[0052] Because the mounting height H1 of the substrate 9 in the aligner 5 is low, the maximum reach of the manipulator 22 of the robot 2 can be set to a relatively low position. The substrate transport device 1 has the advantage of not requiring a robot 2 with a special structure that has a high maximum reach.

[0053] Furthermore, the aligner 5 can achieve a flattened shape because the position of the second rotation axis Z2 of the electric motor 54 is horizontally offset from the first rotation axis Z1 of the spindle 51.

[0054] Since the exhaust fan 511 of the aligner 5 is connected to the exhaust duct 152, dust generated inside the housing 52 is guided from the exhaust duct 152 downwards into the transport space 15. The aligner 5 is located above a specific area 193, and the dust discharged from the aligner 5 may adhere to the substrate 9 in the specific area 193 due to the downflow within the transport space 15. The exhaust duct 152 suppresses the adhesion of dust to the substrate 9.

[0055] In particular, the aligner 5 has a lifter 6. When the lifter 6 is displaced vertically, dust inside the housing 52 may be discharged upwards from the aligner 5. The exhaust fan 511 and exhaust duct 152 effectively suppress the discharge of dust upwards from the aligner 5.

[0056] The aligner 5, installed near the second vertical wall 12, is positioned with a gap 151 between it and the second vertical wall 12. Downflow can flow from top to bottom through the gap 151. As shown by the white arrows in Figure 2 or 4, downflow also occurs from top to bottom in a specific region 193 below the aligner 5. If there were no gap 151 between the aligner 5 and the second vertical wall 12, the downflow would collide with the aligner 5 and then flow around it, causing the airflow in the specific region 193 below the aligner 5 to stagnate.

[0057] Furthermore, the aligner 5 is positioned at an angle horizontally with respect to the second vertical wall 12. A roughly triangular gap 151 is formed between the aligner 5 and the second vertical wall 12 when viewed from above. Because the area of ​​the gap 151 is large, sufficient downflow can be ensured in the specific region 193. Note that the aligner 5 is not limited to being positioned at an angle with respect to the second vertical wall 12. The aligner 5 may also be positioned parallel to the second vertical wall 12.

[0058] Furthermore, the manipulator 22 of robot 2 has two links, a first and a second, and the length of one link is relatively long. In contrast, because the aligner 5 is tilted horizontally with respect to the second vertical wall 12, robot 2 has the advantage of being able to easily access the aligner 5 with the hand 3.

[0059] Furthermore, since the aligner 5 is installed near the second vertical wall 12, the robot 2 can efficiently transport the substrate 9. As mentioned above, because the mounting height H1 of the aligner 5 is low, the transport distance of the robot 2 in the Z direction is short. The robot 2 can efficiently transport the substrate 9. In addition, the robot 2 can transport the substrate 9 between the hoops 45 of all load ports 41, 42, and 43 and the aligner 5 while remaining fixed and not moving within the transport space 15.

[0060] Furthermore, a door 182 is located on the third vertical wall 13, which is on the opposite side in the Y direction from the aligner 5 installed near the second vertical wall 12. Since the aligner 5 does not obstruct entry and exit to the transport space 15 through the door 182, the person in charge can efficiently perform maintenance on the substrate transport device 1.

[0061] (modified version) Figure 9 shows a modified example of the arrangement of the aligner 5 in the substrate transport device 1. The aligner 5 is not limited to being installed above a specific area 193 near the second vertical wall 12. The aligner 5 may also be installed above a specific area 191 near the fourth vertical wall 14, as shown by the solid line in Figure 9. The specific area 191 is the area formed by the trajectory of the first communication opening 171 projected in the X direction. The first communication opening 171 is the communication opening closest to the fourth vertical wall 14 among the three communication openings arranged in the X direction in the housing 10 of the substrate transport device 1. The aligner 5 is located on the opposite side in the Y direction from the second vertical wall 12 which has the door 181. When viewed in the vertical direction, a part of the aligner 5 overlaps with the specific area 191.

[0062] Furthermore, as shown by the dashed line in Figure 9, the aligner 5 may be installed above the specific region 192. The specific region 192 is the region formed by the trajectory of the second communication opening 172 projected in the X direction. The second communication opening 172 is the central communication opening of the three communication openings arranged in the X direction in the housing 10 of the substrate transport device 1. When viewed in the vertical direction, a portion of the aligner 5 overlaps the specific region 192.

[0063] Figure 10 shows a modified example of a substrate transport device. The modified substrate transport device 1000 has four load ports, a first load port 41, a second load port 42, a third load port 43, and a fourth load port 44, which are arranged in the Y direction. The first vertical wall 11 has a first communication opening 171, a second communication opening 172, a third communication opening 173, and a fourth communication opening 174.

[0064] The aligner 5 may be installed above a specific area 194 near the second vertical wall 12, as shown by the solid line in Figure 10. The specific area 194 is the area formed by the trajectory of the fourth communication opening 174 projected in the X direction to the third vertical wall 13.

[0065] The aligner 5 may also be installed above a specific region 191 near the fourth vertical wall 14, as shown by the dashed line in Figure 10. The specific region 191 is the region formed by the trajectory of the first communication opening 171 projected in the X direction.

[0066] Furthermore, the aligner 5 may be installed in a specific area corresponding to the second communication opening 172 or above a specific area corresponding to the second communication opening 172.

[0067] The base 21 of robot 2 is fixed in place within the transport space 15 without moving. The manipulator 22 of robot 2 has two links, a first and a second. The length of one link is even longer. As before, since the aligner 5 is tilted horizontally with respect to the second vertical wall 12, robot 2 can easily access the aligner 5 with the hand 3. The manipulator 22 may have three or more links.

[0068] (Appearance) The embodiments described above are specific examples of the following embodiments.

[0069] (Aspect 1) A housing (10) that forms a transport space (15) for a substrate (9), the housing (10) having at least a first vertical wall (11) that forms a part of the transport space (15), A robot (2) transports the substrate (9) in a horizontal first direction inside and outside the transport space (15) through communication openings (171, 172, 173, 174) formed in the first vertical wall (11), and also transports the substrate (9) in the first direction, a horizontal second direction perpendicular to the first direction, and the vertical direction within the transport space (15), An aligner (5) for aligning the substrate (9) transported by the robot (2), the aligner (5) is located in the transport space (15) above a specific region (191, 192, 193, 194) formed by the trajectory of the communication opening (171, 172, 173, 174) projected in the first direction, and when viewed in the vertical direction, at least a portion of the aligner (5) overlaps with the specific region (191, 192, 193, 194), PCB transport device (1).

[0070] The aligner (5) is positioned above the specific areas (191, 192, 193, 194), and when viewed in the vertical direction, a portion of it overlaps with the specific areas (191, 192, 193, 194). Therefore, unlike aligners in conventional substrate transport devices, it is not installed protruding outward from the vertical walls of the housing (10). This reduces the footprint of the substrate transport device (1).

[0071] Furthermore, since the aligner (5) is located outside the specific areas (191, 192, 193, 194), it does not interfere with the transport of the substrate (9) by the robot (2).

[0072] (Aspect 2) The aligner (5) includes a spindle (51) for rotating the supported substrate (9) and a housing (52) for rotatably holding the spindle (51). The housing (52) has a flattened shape in which the height in the vertical direction is shorter than the length in the horizontal direction. A substrate transport device (1) as described in Embodiment 1.

[0073] Because the aligner (5) has a flattened shape, even if the aligner (5) is installed above, the mounting height (H1) of the substrate (9) on the aligner (5) can be kept relatively low. The maximum reach of the hand (3) required of the robot (2) can be set to a relatively low position.

[0074] (Aspect 3) The aligner (5) is, An electric motor (54) for rotating the spindle (51) has a second rotation axis (Z2) that is horizontally offset from the first rotation axis (Z1) of the spindle (51), The present invention further includes a belt (55) connecting the shaft of the electric motor (54) and the spindle (51), A substrate transport device (1) as described in Embodiment 2.

[0075] The position of the second rotation axis (Z2) of the electric motor (54) is horizontally offset from the first rotation axis (Z1) of the spindle (51). Because the spindle (51) and the electric motor (54) are not aligned in the direction in which their rotation axes extend, the aligner (5) can achieve a flattened shape.

[0076] (Aspect 4) The transport space (15) is further provided with a bracket (8) located above the specific regions (191, 192, 193, 194) and supporting the aligner (5), The housing (52) comprises a main body (521) and a top plate (522) that closes the upper opening of the main body (521), the top plate (522) being wider horizontally than the main body (521), The bracket (8) has a support hole (81) into which the main body (521) of the housing (52) is inserted. The step (523) between the main body (521) and the top plate (522) engages with the edge (82) of the support hole (81). A substrate transport apparatus (1) according to embodiment 2 or 3.

[0077] The step (523) of the aligner (5) engages with the edge (82) of the bracket (8), causing the bracket (8) to hold the aligner (5). The aligner (5) sinks into the bracket (8). The height (H2) from the top surface of the bracket (8) to the mounting position of the substrate (9) on the aligner (5) is also set as low as possible. The structure of the bracket (8) further lowers the mounting height (H1) of the substrate (9) on the aligner (5).

[0078] (Appendix 5) The aligner (5) further includes an exhaust fan (511) that discharges dust from inside the housing (52) to the outside of the housing (52). The exhaust fan (511) is connected to an exhaust duct (152) which guides the dust to the lower part of the transport space (15), A substrate transport device (1) according to any one of embodiments 2 to 4.

[0079] Since the exhaust fan (511) of the aligner (5) is connected to the exhaust duct (152), dust generated inside the housing (52) is guided from the exhaust duct (152) downward into the transport space (15). Even if the aligner (5) is located above a specific area (193), the exhaust duct (152) prevents dust from adhering to the substrate (9).

[0080] (Aspect 6) The housing (10) further has second vertical walls (12, 13) and third vertical walls (12, 13) that are opposite to the second direction and form part of the transport space (15), The aligner (5) is positioned above a specific region (191, 193, 194) adjacent to the second vertical wall (12, 13), and when viewed in the vertical direction, at least a portion of it overlaps with the specific region (191, 193, 194). A substrate transport device (1) according to any one of embodiments 1 to 5.

[0081] By installing the aligner (5) adjacent to the second vertical wall (12, 13) rather than the first vertical wall (11) which has communication openings (171, 172, 173, 174), the aligner (5) can be properly installed in the transport space (15). Furthermore, the transport efficiency of the substrate (9) by the robot (2) does not decrease.

[0082] (Aspect 7) The third vertical wall (12, 13) has doors (181, 182) that connect the inside and outside of the transport space (15). A substrate transport device (1) as described in Embodiment 6.

[0083] The position of the doors (181, 182) on the opposite side of the aligner (5) allows the person in charge to efficiently perform maintenance on the transport space (15).

[0084] (Pattern 8) A clean downflow is generated within the transport space (15). The aligner (5) is positioned with a gap (151) between it and the second vertical walls (12, 13). A substrate transport device (1) according to embodiment 6 or 7.

[0085] Downflow within the transport space (15) can flow from top to bottom through the gap (151). Downflow from top to bottom also occurs in specific regions (191, 193, 194) below the aligner (5).

[0086] (Aspect 9) The aligner (5) is positioned at an angle to the second vertical wall (12, 13) in the horizontal direction. A substrate transport device (1) as described in Embodiment 8.

[0087] When the aligner (5) is tilted, a roughly triangular gap (151) is formed between the aligner (5) and the vertical walls (12, 13) when viewed from above. Because the area of ​​the gap (151) is large, a sufficient flow rate can be ensured in specific regions (191, 193, 194).

[0088] (Aspect 10) The robot (2) is fixed within the transport space (15). A substrate transport device (1) according to any one of embodiments 1 to 9.

[0089] The robot (2) fixed within the transport space (15) can improve the transport efficiency of the substrate (9).

[0090] (Aspect 11) The robot (2) has a manipulator (22) consisting of a first link and a second link. A substrate transport device (1) according to any one of embodiments 1 to 10.

[0091] In a manipulator (22) having two links, the length of one link is relatively long, but because the aligner (5) is positioned in a predetermined location, the robot (2) can easily access the aligner (5).

[0092] (Aspect 12) The first vertical wall (11) has a first communication opening (171), a second communication opening (172), a third communication opening (173), and a fourth communication opening (174) arranged in the second direction. A substrate transport device (1) according to any one of embodiments 1 to 11.

[0093] The substrate transport device (1) may be a so-called 4FOUP substrate transport device (1). [Explanation of Symbols]

[0094] 1. Substrate transport device 2 Robots 5 Alaina 8 brackets 9 circuit boards 10 cabinets 11. First vertical wall 12. Second vertical wall 13. Third vertical wall 14. Fourth vertical wall 15. Transport space 51 Spindles 52 Housing 54 Electric motor 55 belt 81 Support hole 82 Edge 151 gap 152 Exhaust duct 181 doors 182 doors 191 Specific area 192 Specific area 193 Specific area 194 Specific area 511 Exhaust fan 521 Main Unit 522 Top plate 523 steps 525 Exhaust port Z1 First rotation axis Z2 Second rotation axis

Claims

1. A housing that forms a transport space for substrates, the housing having at least a first vertical wall that forms a part of the transport space, A robot that transports the substrate in a horizontal first direction inside and outside the transport space through a communication opening formed in the first vertical wall, and also transports the substrate in the first direction, a horizontal second direction perpendicular to the first direction, and the vertical direction within the transport space, An aligner for aligning the substrate transported by the robot, comprising: an aligner located in the transport space above a specific region formed by the trajectory of the communication opening projected in the first direction, and which, when viewed in the vertical direction, at least a portion of which overlaps the specific region; PCB transport device.

2. In the substrate transport apparatus according to claim 1, The aligner comprises a spindle for rotating the supported substrate and a housing for rotatably holding the spindle. The housing has a flattened shape in which the height in the vertical direction is shorter than the length in the horizontal direction. PCB transport device.

3. In the substrate transport apparatus according to claim 2, The aforementioned aligner is An electric motor for rotating the spindle, having a second rotation axis that is horizontally offset from the first rotation axis of the spindle, The electric motor further comprises a belt connecting the shaft and the spindle, PCB transport device.

4. In the substrate transport apparatus according to claim 2, The transport space further comprises a bracket located above the specific region and supporting the aligner, The housing comprises a main body and a top plate that closes the upper opening of the main body, and the top plate is wider horizontally than the main body. The bracket has a support hole into which the main body of the housing is inserted. The step between the main body and the top plate engages with the edge of the support hole. PCB transport device.

5. In the substrate transport apparatus according to claim 2, The aligner further includes an exhaust fan that discharges dust from inside the housing to the outside of the housing. The system further includes an exhaust duct connected to the exhaust fan and which guides the dust to the lower part of the transport space. PCB transport device.

6. In the substrate transport apparatus according to claim 1, The housing further has a second vertical wall and a third vertical wall that are opposite to the second direction and form part of the transport space, The aligner is positioned above a specific region adjacent to the second vertical wall, and when viewed in the vertical direction, at least a portion of it overlaps with the specific region. PCB transport device.

7. In the substrate transport apparatus according to claim 6, The third vertical wall has a door that connects the inside and outside of the transport space. PCB transport device.

8. In the substrate transport apparatus according to claim 6, A clean downflow is generated within the aforementioned transport space. The aligner is positioned with a gap between it and the second vertical wall. PCB transport device.

9. In the substrate transport apparatus according to claim 8, The aligner is positioned at an angle horizontally with respect to the second vertical wall. PCB transport device.

10. In the substrate transport apparatus according to claim 1, The robot is fixed within the transport space. PCB transport device.

11. In the substrate transport apparatus according to claim 10 The robot has a manipulator consisting of a first link and a second link. PCB transport device.

12. In the substrate transport apparatus according to claim 10, The first vertical wall has a first communication opening, a second communication opening, a third communication opening, and a fourth communication opening arranged in the second direction. PCB transport device.

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