Dicing tape for semiconductor manufacturing processes, its composition, and method for manufacturing the same.

Abstract

This invention provides a dicing tape for semiconductor manufacturing processes, a composition thereof, and a method for producing the same. [Solution] The manufacturing method includes: a mixing step of forming a resin mixture by mixing a dicing tape composition containing polyethylene resin, polypropylene resin, and an antistatic agent in a mixer; a granulation step of preparing plastic particles by granulating the resin mixture in a twin-screw extruder; a casting film formation step of loading the plastic particles into a single-screw extruder and manufacturing a base film by casting; an adhesive layer application step of providing a release film and forming an adhesive layer on the release film; and a bonding step of forming a dicing tape by bonding the base film and the adhesive layer together.

Description

[Technical Field]

[0001] The present invention provides dicing tapes, and more particularly, dicing tapes for semiconductor manufacturing processes, compositions thereof, and methods for producing the same. [Background technology]

[0002] With the rapid development of the semiconductor industry, including foundries and integrated circuits (ICs), the types and importance of consumables required in each process are constantly increasing, and among them, dicing tape plays a crucial role in processes such as dicing and wafer expanding. The function of dicing tape is to improve process yield by protecting wafers from fragments and other factors generated during the dicing process. Dicing tape needs to possess excellent mechanical strength, elongation, flexibility, isotropy, and uniform thickness. Most dicing tapes currently on the market are made using flexible polyvinyl chloride (flexible PVC) as a base material and are manufactured with an adhesive layer and a release film.

[0003] Flexible polyvinyl chloride (PVC) requires the addition of plasticizers during processing to enhance its flexibility and improve its workability. However, plasticizers are prone to migrate from the inside to the outside of the material due to high temperatures, pressure, or solvents, leading to a decrease in the adhesive strength of the tape over time, resulting in problems such as peeling, detachment, softening of the adhesive layer, and adhesive residue. Furthermore, PVC film formulations contain various additives and processing aids, which may absorb ultraviolet light of specific wavelengths, potentially affecting the decomposition effect of the adhesive. In addition, PVC tape is prone to generating static electricity during dicing and wafer expanding processes, which can cause damage to circuits and crystal grains, affecting process yield.

[0004] Furthermore, PVC material itself contains chlorine, and stabilizers contain heavy metals, making it more likely to have a negative impact on the environment. As a result, end consumers are gradually shifting towards materials that comply with environmental protection trends.

[0005] Therefore, in light of the fact that the above-mentioned problems can be improved, the inventors diligently conducted research and, as a result of applying scientific principles, ultimately arrived at the present invention as a method that is rational in design and can effectively improve the aforementioned drawbacks. [Overview of the project] [Problems that the invention aims to solve]

[0006] The technological problem that this invention aims to solve is to provide a dicing tape for semiconductor manufacturing processes, its composition, and a method for manufacturing the same, in response to the shortcomings of the prior art. In this invention, by improving the selection of the substrate, its manufacturing process, and formulation, the dicing tape is given the desired good isotropy, mechanical strength, and elongation, and problems such as the precipitation of plasticizers present in PVC material, adhesive residue, incomplete decomposition of adhesive, and adverse environmental impacts due to chlorine and heavy metal components are solved. The dicing tape according to this invention conforms to the trend of environmental protection, has a simple manufacturing process, can be combined with existing film equipment technology, and possesses the potential and value for industrial production. [Means for solving the problem]

[0007] To solve the above technical problems, one of the technical means employed by the present invention is to provide a method for manufacturing dicing tape for semiconductor manufacturing processes. The method for manufacturing dicing tape for semiconductor manufacturing processes includes a mixing step of forming a resin mixture by mixing a dicing tape composition containing polyethylene resin, polypropylene resin, and an antistatic agent in a mixer; a granulation step of preparing plastic particles by granulating the resin mixture in a twin-screw extruder; a casting film formation step of loading the plastic particles into a single-screw extruder and manufacturing a base film by casting; an adhesive layer application step of providing a release film and forming an adhesive layer on one surface of the release film; and a bonding step of forming a dicing tape by bonding the base film and the adhesive layer on the surface of the release film, wherein the polyethylene resin is at least one selected from the group consisting of low-density polyethylene, medium-density polyethylene, high-density polyethylene, and linear low-density polyethylene, and the polypropylene resin is at least one selected from the group consisting of homopolypropylene (hPP), random copolymer polypropylene (rPP), and block copolymer polypropylene (bPP).

[0008] To solve the above technical problems, another technical means employed by the present invention is to provide a dicing tape composition for semiconductor manufacturing processes. The dicing tape composition for semiconductor manufacturing processes comprises a polyethylene resin and a polypropylene resin, wherein the polyethylene resin is at least one selected from the group consisting of low-density polyethylene, medium-density polyethylene, high-density polyethylene, and linear low-density polyethylene; the polypropylene resin is at least one selected from the group consisting of homopolypropylene, random copolymer polypropylene, and block copolymer polypropylene; the first weight-average molecular weight of the polyethylene resin is 100,000 g / mol to 500,000 g / mol; the first melt index of the polyethylene resin is 2 g / 10 min to 8 g / 10 min; the first melting point of the polyethylene resin is 110°C to 135°C; the second weight-average molecular weight of the polypropylene resin is 200,000 g / mol to 500,000 g / mol; the second melt index of the polypropylene resin is 2 g / 10 min to 10 g / 10 min; and the second melting point of the polypropylene resin is 130°C to 170°C.

[0009] To solve the above technical problems, yet another technical means employed by the present invention is to provide a dicing tape for semiconductor manufacturing processes. The dicing tape for semiconductor manufacturing processes comprises a base film manufactured from a dicing tape composition for semiconductor manufacturing processes, an adhesive layer formed on the base film, and a release film formed on the adhesive layer so as to be peelable, wherein the dicing tape composition for semiconductor manufacturing processes comprises a polyethylene resin, a polypropylene resin, and an antistatic agent, wherein the polyethylene resin is at least one selected from the group consisting of low-density polyethylene, medium-density polyethylene, high-density polyethylene, and linear low-density polyethylene, and the polypropylene resin is at least one selected from the group consisting of homopolypropylene (hPP), random copolymer polypropylene (rPP), and block copolymer polypropylene (bPP).

[0010] Preferably, the longitudinal elongation of the base film is 573% to 686%, the transverse elongation of the base film is 568% to 677%, and the error between the longitudinal elongation and the transverse elongation is within 2%.

[0011] Preferably, the longitudinal tensile strength of the base film is 226 kgf / cm². 2 ~374 kgf / cm² 2 The transverse tensile strength of the base film is 229 kgf / cm². 2 ~381 kgf / cm² 2 The error between the longitudinal tensile strength and the transverse tensile strength is within 3%. [Effects of the Invention]

[0012] One of the advantageous effects of the present invention is that the dicing tape according to the present invention overcomes the problem of plasticizer precipitation in conventional PVC dicing tapes, avoiding residual adhesive or incomplete decomposition due to plasticizer transfer, thereby further improving product stability and manufacturing process yield. Furthermore, the dicing tape does not contain harmful components such as halogens or heavy metals, meets international environmental standards and the needs of end consumers for environmentally friendly materials, and provides an environmentally friendly solution for semiconductor manufacturing processes. [Brief explanation of the drawing]

[0013] [Figure 1] This is a flowchart of a method for manufacturing dicing tape according to an embodiment of the present invention. [Modes for carrying out the invention]

[0014] To further understand the features and technical details of this invention, please refer to the following detailed description of the invention and the accompanying drawings. However, the accompanying drawings provided are for reference and illustrative purposes only and do not limit the scope of the claims of this invention.

[0015] The embodiments of the present invention will be described below according to certain specific embodiments, and those skilled in the art can understand the advantages and effects of the present invention based on the content disclosed in this specification. The present invention can be implemented or applied according to other different specific embodiments, and for each detail in this specification, various modifications and changes can be made based on different viewpoints and uses without departing from the concept of the present invention. It should be explained in advance that the attached drawings of the present invention are simple schematic descriptions and are not drawn based on actual sizes. The technical content of the present invention will be described in more detail based on the following embodiments, but the protection scope of the present invention is not limited by the disclosed content. It should be understood that in this specification, terms such as "first", "second", "third", etc. may be used to describe various materials or parameters, but these materials or parameters are not limited by these terms. These terms are mainly used to distinguish one material from another material, or one parameter from another parameter. Also, the term "or" used in this specification may include any one or a combination of multiple items listed in relation according to the actual situation.

[0016] In order to overcome the deficiencies of the prior art, the present invention improves the problems such as the residual problem of the adhesive due to the easy precipitation of the plasticizer in the dicing tape made of PVC material, the incomplete decomposition effect of the adhesive, and the generation of static electricity, and aims to avoid the adverse effects on the environment caused by additives containing heavy metals. In addition, the present invention also solves the problem that the dicing tapes of other materials are inferior to the dicing tape made of PVC material in terms of mechanical strength, elongation, flexibility, isotropy, etc. From the perspective of the manufacturing process, the present invention provides a combination of a base film and a dicing tape composition in a single manufacturing process, so there is no need to additionally coat or biaxially stretch an antistatic layer on the dicing tape, and it can be combined with the technology of existing film equipment, which has industrial value for efficient mass production.

[0017] To achieve the above object, the present invention provides a dicing tape for semiconductor manufacturing processes, a composition of the dicing tape (substrate film), and a method for manufacturing the dicing tape.

[0018] In the present invention, by improving the selection of the substrate, its manufacturing process, and formulation, the dicing tape is imparted with desired good isotropy, mechanical strength, and extensibility, and problems such as the precipitation of plasticizers present in PVC materials, the residue of adhesives, incomplete decomposition of adhesives, and the adverse environmental effects caused by chlorine and heavy metal components are solved. Further, the dicing tape according to the present invention conforms to the trend of environmental protection, has a simple manufacturing process, can be combined with existing film device technologies, and has the potential and value for industrial production.

[0019] [Dicing Tape Composition] More specifically, the composition of an embodiment of the present invention is a composition for manufacturing a substrate film of a dicing tape for semiconductor manufacturing processes. The composition is mainly composed of a polyolefin material and contains the following components.

[0020] (a) Polyethylene resin (b) Polypropylene resin (c) Toughness-enhancing resin, and (d) Antistatic additive.

[0021] In an embodiment of the present invention, the composition may selectively contain (e) trace amounts of additives.

[0022] Furthermore, the polyethylene resin (a) is at least one selected from the group consisting of low-density polyethylene (LDPE), medium-density polyethylene (MDPE), high-density polyethylene (HDPE), and linear low-density polyethylene (LLDPE). In a preferred embodiment of the present invention, the polyethylene resin is low-density polyethylene (LDPE).

[0023] Furthermore, the first weight-average molecular weight of the polyethylene resin (a) is 100,000 g / mol to 500,000 g / mol (for example, 300,000 g / mol), the first melt index is 2 g / 10 min to 8 g / 10 min (for example, 5 g / 10 min), and the first melting point is 110°C to 135°C (for example, 120°C).

[0024] It should be explained that "weight-average molecular weight (Mw)" is obtained by measuring using gel permeation chromatography (GPC).

[0025] The "Melt Index" (MI) was measured using a melt flow rate tester based on the ASTM D1238 standard. For example, the measurement conditions involved measuring the mass flow rate for 10 minutes at 190°C with a load of 2.16 kg. The result can be expressed in g / 10 min. The "Melting Point" was measured using Differential Scanning Calorimetry (DSC). The temperature corresponding to the endothermic melting peak shown in the test results is the melting point of the test resin sample.

[0026] Regarding the content, with the total weight of the dicing tape composition being 100% by weight, the content of the polyethylene resin (a) is 25% to 75% by weight, preferably 30% to 65% by weight, and particularly preferably 40% to 65% by weight.

[0027] Furthermore, the polypropylene resin (b) is at least one selected from the group consisting of homopolypropylene (hPP), random copolymer polypropylene (rPP), and block copolymer polypropylene (bPP).

[0028] Here, random copolymer polypropylene is formed by polymerizing propylene monomer and a small amount of ethylene monomer into random copolymers, and block copolymer polypropylene is formed by polymerizing propylene monomer and ethylene monomer into blocks.

[0029] In one preferred embodiment of the present invention, the polypropylene resin (b) is random copolymer polypropylene (rPP), and its weight ratio of ethylene is approximately 1% to 10%. This results in better compatibility between the polypropylene resin (b) and the polyethylene resin (a), making mixing and dispersion easier, but the present invention is not limited thereto.

[0030] Furthermore, the second weight-average molecular weight of the polypropylene resin (b) is 200,000 g / mol to 500,000 g / mol (for example, 350,000 g / mol), the second melt index is 2 g / 10 min to 10 g / 10 min (for example, 6 g / 10 min), and the second melting point is 130°C to 170°C (for example, 150°C).

[0031] Regarding the content, with the total weight of the dicing tape composition being 100% by weight, the content of the polypropylene resin (b) is 20% to 70% by weight, preferably 20% to 50% by weight, and particularly preferably 20% to 35% by weight.

[0032] Notably, the polypropylene resin (b) provides mechanical strength and elongation, allowing the tape to effectively support the stresses required in processes such as dicing and wafer expanding. This ensures that the tape maintains stability during use, prevents breakage and deformation under high pressure, and improves the overall yield of the manufacturing process.

[0033] Furthermore, the flexibility and processing efficiency of the tape can be adjusted by the polyethylene resin (a). By adding polyethylene resin, the rigidity of the tape is reduced, making the material easier to process and contributing to improved production efficiency. Flexible polyethylene improves the adaptability of the tape and enhances adhesion during the manufacturing process, thereby reducing the risk of defects in the processing process and further improving product quality.

[0034] The above combination of materials offers high mechanical strength, flexibility, and ease of processing, providing the desired mechanical strength and elongation to dicing tape, and has the potential to be an alternative to PVC dicing tape.

[0035] Furthermore, the toughness-reinforcing resin (c) is at least one selected from the group consisting of polyolefin elastomer (POE), ethylene vinyl acetate (EVA), thermoplastic elastomer (TPE), ethylene propylene rubber (EPR), styrene-butadiene-styrene copolymer (SBS), and ethylene propylene diene monomer (EPDM).

[0036] The addition of the toughness-reinforcing resin (c) improves the toughness of the material, thereby making it more suitable for use as dicing tape in semiconductor manufacturing processes.

[0037] Regarding the content, with the total weight of the dicing tape composition being 100% by weight, the content of the toughness-reinforcing resin (c) is 1% to 25% by weight, preferably 3% to 25% by weight, and particularly preferably 5% to 20% by weight.

[0038] In one preferred embodiment of the present invention, the toughness-reinforced resin (c) is (c1) Ethylene vinyl acetate (EVA), and (c2) Contains polyolefin elastomer (POE) simultaneously.

[0039] The aforementioned ethylene vinyl acetate (EVA) is produced by copolymerizing two monomers, ethylene and vinyl acetate. In this invention, the weight ratio of vinyl acetate (VA) in the ethylene vinyl acetate is 10% to 15%. Furthermore, the third melt index of the ethylene vinyl acetate is 2 g / 10 min to 12 g / 10 min (for example, 7 g / 10 min), but the present invention is not limited thereto.

[0040] The ethylene vinyl acetate provides good impact resistance and stress cracking resistance, while simultaneously maintaining excellent processability and tackiness, making it suitable for semiconductor process dicing tapes. It also improves toughness and reduces the likelihood of material breakage during processes (e.g., wafer expander processes).

[0041] Regarding the content, with the total weight of the dicing tape composition being 100% by weight, the content of ethylene vinyl acetate (EVA) is preferably 1% to 10% by weight, more preferably 2% to 10% by weight, and particularly preferably 3% to 7% by weight, but the present invention is not limited thereto.

[0042] Furthermore, the polyolefin elastomer (POE) has ethylene as its main monomer and is formed by copolymerizing it with a small amount of copolymer monomer (e.g., octene, butene, or hexene). In this embodiment, the copolymer monomer of the polyolefin elastomer is octene, and the weight ratio of octene is 5% to 15%, thereby maintaining the mechanical strength of the material while simultaneously improving flexibility and achieving a balance in material properties.

[0043] Furthermore, while the fourth melt index of the polyolefin elastomer is 2g / 10min to 8g / 10min (for example, 5g / 10min), the present invention is not limited thereto.

[0044] Regarding the content, with the total weight of the dicing tape composition being 100% by weight, the content of the polyolefin elastomer (POE) is preferably 2% to 20% by weight, more preferably 5% to 15% by weight, and particularly preferably 8% to 12% by weight, but the present invention is not limited thereto.

[0045] Furthermore, the antistatic agent (d) is at least one selected from the group consisting of ester compounds, ethoxyl compounds, polymer antistatic agents, amphoteric antistatic agents, and special functional antistatic agents. The ester compound includes at least one of glyceryl stearate (GS) and alkyl phosphate ester (APE). The ethoxyl compound includes at least one of ethoxylated alkyl acid amide (EAA), ethoxylated lauryl amine (ELA), and alkylphenol polyoxyethylene ether sulfate (AES). The polymer antistatic agent includes at least one of polyamine compounds (PA), polyester polyether compounds (PPE), and polyurethane-based compounds (PU). The amphoteric antistatic agent contains at least one of the betaine-based (Betaines, BET) and imidazoline-based (Imidazoline Compounds, IMZ) compounds. The special-function antistatic agent contains at least one of the triazine-based (Triazine Compounds, TAC) and aminocarboxylic acid-based (Amino Carboxylic Acid, ACA) compounds.

[0046] In preferred embodiments of the present invention, the polymeric antistatic agent is an ester compound, and is particularly preferably glyceryl stearate (GS). Specifically, the antistatic agent is glyceryl monostearate (GMS), but the present invention is not limited thereto.

[0047] Regarding the content, with the total weight of the dicing tape composition being 100% by weight, the content of the antistatic agent (d) is 0.1% to 4% by weight, preferably 0.3% to 3% by weight, and particularly preferably 0.5% to 1.5% by weight.

[0048] The surface resistivity of the antistatic agent (d) is 10 6 ~10 9 The value is Ω / sq (ohms per square). Here, surface resistivity can be measured using a surface resistance meter according to the ASTM D257 standard test method under standard environmental conditions such as 23°C ± 2°C and relative humidity 50% ± 5%, but the present invention is not limited thereto.

[0049] In the composition of the present invention, since an antistatic agent (e.g., glyceryl monostearate (GMS)) is added directly, there is no need to separately apply an antistatic layer to the dicing tape, and stable antistatic performance is achieved. This design simplifies the manufacturing process, reduces production costs, and avoids adhesion problems that occur when applying an antistatic layer. Furthermore, the addition of the antistatic agent effectively prevents static electricity buildup on the tape surface, further improving the stability of the dicing tape in the semiconductor manufacturing process. Compared to conventional tapes coated with an antistatic layer, the tape according to the present invention is less likely to attract fragments and dust, thus ensuring the cleanliness of the tape during dicing and wafer expanding processes while protecting precise semiconductor components from the effects of electrostatic discharge (ESD).

[0050] Furthermore, as described above, in the embodiment of the present invention, the composition may selectively contain (e) trace amounts of additives, which include at least one of the following components.

[0051] (e1) Antioxidant The antioxidant is at least one selected from the group consisting of hindered phenol antioxidants, phosphite antioxidants, thioether antioxidants, amine antioxidants, and organophosphorus antioxidants. Preferably, the antioxidant is a hindered phenol antioxidant. The content of the antioxidant is 0.2% to 4% by weight, and preferably 0.5% to 1.5% by weight. The antioxidant effectively prevents the polymer from decomposing due to thermal oxidation during high-temperature processing or long-term use, extends the service life of the material, and maintains the performance stability of the dicing tape.

[0052] (e2) Lubricant The lubricant is, for example, synthetic silica (SiO2). The lubricant content is preferably 0.2% to 2% by weight, and more preferably 0.3% to 1.3% by weight. The lubricant reduces friction of the material during processing, improves the processability of the tape, and prevents the tape from sticking or wrinkling during manufacturing and operation.

[0053] (e3) Dispersant The dispersant is, for example, low molecular weight polyethylene wax (PE-WAX). The dispersant content is 0.2% to 8% by weight, preferably 0.5% to 1.5% by weight. The dispersant promotes the uniform dispersion of other components within the substrate and can improve the compatibility of fillers and other additives in the polymer.

[0054] (e4) Filler The filler is, for example, talc powder. The filler content is 0.01% to 10% by weight, preferably 0.1% to 0.5% by weight. As an inorganic filler, talc powder can reduce costs while improving the hardness and dimensional stability of the material, and has a positive effect on the mechanical properties and processability of the dicing tape.

[0055] (e5) Processing aids The processing aid is, for example, methyl methacrylate (MMA). The content of the processing aid is preferably 0.01% to 5% by weight, and more preferably 0.5% to 1.5% by weight. The processing aid can adjust the fluidity and melt rheological properties of the material, improve processing efficiency, and enhance the smoothness and uniformity of the tape surface.

[0056] [Method for manufacturing dicing tape] The present invention provides a method for manufacturing dicing tape for semiconductor manufacturing processes. This method can produce environmentally friendly dicing tape suitable for semiconductor processes, and the dicing tape has good mechanical function, isotropy, and antistatic properties. As shown in Figure 1, a method for manufacturing dicing tape according to an embodiment of the present invention includes steps S110, S120, S130, S140, S150, S160, and S170.

[0057] It should be noted that the order of each step and the actual operating method in this embodiment can be adjusted as needed, and are not limited thereto.

[0058] The method for manufacturing dicing tape according to the present invention may include other operations before, between, or after each step, and some of the operations described may also be carried out by other means such as substitution, deletion, or rearrangement.

[0059] Step S110 may include a mixing step in which a composition to be used for the base film of the dicing tape (containing polyethylene resin (a), polypropylene resin (b), toughness-reinforcing resin (c), antistatic agent (d), and trace amounts of added auxiliary agents (e)) is weighed in the correct proportions and then mixed in a mixer to form a resin mixture. The mixing time is determined by the proportions and the model number of the mixer and is usually required to ensure uniformity of the mixture, ranging from several minutes to several hours.

[0060] Step S120 is a granulation process, which includes preparing plastic particles by granulating the resin mixture in a twin-screw extruder. Here, the screw temperature range of the extruder is 110°C to 240°C. During the granulation process, the material is melted by the extrusion and kneading action of the twin-screw to form a uniform molten material, which is then extruded from the die and prepared into plastic particles by a cooling pelletizer.

[0061] Step S130 is a casting film formation process that includes loading the plastic particles into a single-screw extruder and manufacturing a base film by casting.

[0062] In the process of forming the extruded film, the screw temperature range is set to 160°C to 300°C, and adjusted to a specific temperature according to the melting characteristics of the base film material. The pellets are melted again in a single-screw extruder, formed into a film through a casting die, and rapidly cooled and solidified by a cooling system to obtain a base film with a certain thickness and mechanical strength. The thickness of the base film is approximately 60 μm to 100 μm (e.g., 80 μm), and it has good isotropy, which ensures the stability of the material properties in the subsequent dicing process.

[0063] More specifically, in the embodiment of the present invention, a base film is manufactured by a casting method after loading plastic particles into a single-screw extruder. First, polyethylene resin, polypropylene resin, toughness-reinforcing resin, and an antistatic agent are mixed and granulated in a twin-screw extruder to obtain the plastic particles. These plastic particles are heated to 160°C to 300°C in a single-screw extruder, and after melting, are uniformly extruded through a casting die to form a film. Subsequently, the molten polymer thin layer is rapidly cooled and solidified by the rotating cooling rollers of the casting device, forming a base film with stable thickness and uniform surface quality. The casting method can ensure the isotropy and thickness uniformity of the film, which are important for use as dicing tape in subsequent semiconductor manufacturing processes. This method allows for high-precision control and can produce a film with good mechanical strength and appropriate flexibility.

[0064] Step S140 involves performing a corona treatment on the substrate film formed by casting. The purpose of the corona treatment is to improve the affinity and adhesion of the substrate film surface, enabling better bonding with the subsequent adhesive layer. The voltage per unit area for the corona treatment is 1000 Volts / cm². 2 ~10,000 Volts / cm² 2 In this process, the surface of the base film is subjected to a high-voltage electric field to generate active groups, thereby improving adhesion with the adhesive layer.

[0065] Step S150 is to provide a release film and perform an adhesive layer coating step, which includes forming an adhesive layer on one surface of the release film. Here, the release film may be, for example, a polyester (PET) release film or a fluoropolymer (e.g., PTFE) release film.

[0066] The adhesive layer is composed of an acrylic adhesive and contains a certain proportion of an organic solvent (e.g., ethyl acetate EA, butyl acetate BA, methyl ethyl ketone MEK, isopropyl alcohol IPA, diethylene glycol monobutyl ether) to adjust its fluidity and adhesion.

[0067] Here, the thickness of the release film may be, for example, 30 μm to 50 μm (for example, 38 μm), and the thickness of the adhesive layer may be, for example, 5 μm to 20 μm (for example, 10 μm).

[0068] The adhesive layer has good adhesion and ease of peeling, and can maintain stability during the dicing and wafer expanding processes. To ensure uniform thickness of the adhesive layer, gravure coating, roller coating, or other suitable coating techniques may be used as the application method.

[0069] Step S160 is a lamination process that includes forming a dicing tape having a three-layer structure (including the base film, adhesive layer, and release film in that order) by laminating the corona-treated surface of the base film with the adhesive layer of the release film. During the lamination process, it is necessary to ensure good contact between the base film and the adhesive layer in order to avoid air bubbles and voids. During the lamination process, lamination can be performed using pressure roller equipment to uniformly bond the two layers of material and ensure that the surface of the tape is smooth and wrinkle-free.

[0070] Step S170 involves carrying out a dicing and molding process, which includes dicing and molding the dicing tape. Depending on the requirements of the specific application, the dicing tape can be diced into rolls or sheets of various widths. After the finished tape passes quality inspection, it is wound and packaged as a finished product.

[0071] The manufacturing method of the present invention provides dicing tapes with good isotropy, mechanical strength, and stable antistatic performance, while simultaneously avoiding problems such as dust adhesion due to static electricity buildup in conventional dicing tapes. The process can be carried out using existing film manufacturing equipment, making it suitable for large-scale industrial production and offering the value of efficient mass production.

[0072] [Dicing Tape] As described above, embodiments of the present invention also provide a dicing tape for semiconductor manufacturing processes. The dicing tape for semiconductor manufacturing processes has a three-layer structure in which a base film, an adhesive layer, and a release film are arranged in that order. Here, the base film is manufactured with a composition according to an embodiment of the present invention, and the composition comprises a polyethylene resin, a polypropylene resin, a toughness-reinforcing resin, and an antistatic agent, thereby ensuring good mechanical strength, elongation, and antistatic performance of the base film.

[0073] In semiconductor processes, the release film of the dicing tape can temporarily protect the adhesive layer. During the dicing process, the release film separates from the adhesive layer, allowing the wafer to be bonded to the substrate film via the adhesive layer. At this time, the high isotropy and mechanical stability of the substrate film effectively protect the wafer, preventing damage and defects to the wafer due to external forces and static electricity buildup during the dicing process, and further improving the yield of the dicing process.

[0074] Furthermore, when wafer expansion is performed after wafer dicing is complete, the substrate film, with its excellent stretchability and antistatic properties, can withstand the stress acting during the wafer expansion process, preventing wafer damage and displacement, and preventing dust and fragments from adhering to the tape surface due to the accumulation of static electricity. Therefore, the dicing tape according to the present invention provides a stable protective effect in the dicing process, effectively improves the yield of wafer expansion, is suitable for high-precision semiconductor manufacturing processes, and improves the overall stability and production efficiency of the manufacturing process.

[0075] [Experimental data and measurement results] To demonstrate the technical effects of the embodiments of this invention, experimental data and results will be explained below. However, the embodiments and comparative examples described below are provided to facilitate understanding of the present invention, and the scope of protection of the present invention is not limited to these embodiments.

[0076] Example 1: Based on the composition formulations shown in Table 1, a resin mixture was formed by mixing 50 parts by weight of polyethylene (LDPE), 30 parts by weight of polypropylene (rPP), 5 parts by weight of toughness-reinforced resin (a) (EVA), 10 parts by weight of toughness-reinforced resin (b) (POE), 1 part by weight of an antistatic agent (organic antistatic agent: glyceryl monostearate), 1 part by weight of an antioxidant (hindered phenol antioxidant, e.g., rganox1010), 0.8 parts by weight of a lubricant (synthetic silica), 1 part by weight of a dispersant (e.g., low molecular weight polyethylene wax), 0.2 parts by weight of a filler (talc powder), and 1 part by weight of a processing aid (methyl methacrylate) in a mixer. Next, plastic particles were prepared by granulating the resin mixture using a twin-screw extruder (the extruder screw temperature was 180°C). Subsequently, the plastic particles were loaded into a single-screw extruder (with the screw temperature set to 230°C during the extrusion film process), and a base film was manufactured using the casting method. The thickness of the base film was approximately 80 μm.

[0077] The method for manufacturing the base film in Example 2 was the same as in Example 1, the only difference being that the proportion of polypropylene in the composition was increased while the proportion of low-density polyethylene was decreased.

[0078] The method for manufacturing the base film in Example 3 was the same as in Example 1; the only difference was that no toughness-reinforcing resin component (such as EVA or POE) was added to the composition.

[0079] The manufacturing method of the base film of Comparative Example 1 was the same as that of Example 1, and the difference between them was that low-density polyethylene was not added to the composition.

[0080] The manufacturing method of the base film of Comparative Example 2 was the same as that of Example 1, and the difference between them was that the formulation of the composition of Example 1 was adopted, but the film was formed by rolling as the process of the base film.

[0081] The manufacturing method of the base film of Comparative Example 3 was the same as that of Example 1, and the difference between them was that an antistatic agent was not added to the composition.

[0082] The manufacturing method of the base film of Comparative Example 4 was the same as that of Example 1, and the difference between them was that the antistatic agent in the composition was a metal ion-based antistatic agent.

[0083] Thereafter, the physical properties of the samples of the base film were measured. For example, the longitudinal elongation rate (%), the transverse elongation rate (%), the longitudinal tensile strength (kgf / cm 2 ), the transverse tensile strength (kgf / cm 2 ), the surface resistivity (ohm / sq), and the ultraviolet transmittance (%) were measured, and the measurement results are as shown in Table 1.

[0084] The description of the above measurement method is as follows.

[0085] Longitudinal and transverse elongation rates (%): As the measurement standard, they were measured according to the ASTM D882 standard. The measurement method was to cut out a sample of the film as a spline of a predetermined size along the longitudinal and transverse directions and install it on a tensile testing machine. The testing machine stretched the spline at a controlled speed until the spline broke. The elongation rate was calculated as the percentage of the elongation amount of the spline when stretched until it broke with respect to the original length. As the test conditions, the test temperature was 23°C ± 2°C and the tensile speed was 50 mm / min. As the measurement results, the elongation rates in the longitudinal and transverse directions of the sample were each shown as a percentage (%), corresponding to the elongation properties in the longitudinal and transverse directions of the sample.

[0086] Longitudinal and transverse tensile strength (kgf / cm 2 Measurements were taken according to the ASTM D882 standard. The test method involved performing a tensile test on a tensile testing machine, placing the sample in a clamp fixture, and applying tensile force until the spline fractured. The tensile strength was calculated by dividing the maximum stress value at spline fracture by the cross-sectional area of ​​the spline. The test conditions were the same: 23°C ± 2°C, with a tensile speed of 50 mm / min. The unit of tensile strength is kgf / cm. 2 The tensile properties of the samples were measured in both the longitudinal and transverse directions, respectively, to demonstrate the material's ability to resist tensile force.

[0087] Surface resistivity (ohm / sq): As a measurement standard, surface resistivity was measured according to the ASTM D257 standard. The test method involved using a surface resistance meter, placing a film sample on the test electrode, and measuring under standard conditions of 23°C ± 2°C and 50% ± 5% relative humidity. By applying a predetermined voltage, the resistance of the material surface was measured, and the test results were expressed in ohms per square meter (ohm / sq). This test apparatus used a four-probe surface resistance meter to measure surface resistivity. Surface resistivity, with units of ohm / sq, indicates the surface conductivity of the measured sample; a lower measurement value indicates better antistatic performance.

[0088] Measurement Method for UV Transmittance (%): Measurements were performed according to the ASTM D1003 standard. The test method involved placing a film sample in a UV-Vis spectrometer and measuring the transmittance of ultraviolet light (typically with wavelengths of 300 nm to 400 nm). The UV-Vis spectrometer measured the intensity of the ultraviolet light transmitted through the sample and calculated the UV transmittance by comparing it with the intensity of the incident light. The measurement process was carried out at room temperature, and the light source was ultraviolet light with wavelengths of 300 nm to 400 nm. The UV transmittance was expressed as a percentage (%).

[0089] [Table 1]

[0090] According to the measurement results, Example 1 showed longitudinal elongation (%), transverse elongation (%), and longitudinal tensile strength (kgf / cm²). 2 ), transverse tensile strength (kgf / cm 2 In measurements such as ), it exhibits excellent isotropy, and in surface resistivity (ohm / sq) measurements, it has excellent antistatic properties, making it suitable for use in wafer dicing processes.

[0091] In the composition of Example 2, the proportion of polypropylene was increased while the proportion of low-density polyethylene was decreased. The base film still retained isotropy, but the elongation decreased while the tensile strength improved. Compared to Example 1, it was slightly unsuitable for the wafer dicing process, but still within an acceptable range.

[0092] Although EVA and POE were not added to the composition of Example 3, and the base film still retained isotropy, the elongation of the base film was slightly lower than that of Example 1, while the tensile strength was slightly improved. Compared to Example 1, it was slightly unsuitable for the wafer dicing process, but still within an acceptable range.

[0093] Although the composition of Comparative Example 1 did not contain low-density polyethylene and the base film still retained isotropy, compared to Example 1, its elongation rate decreased significantly while its tensile strength increased significantly, making it less suitable for the wafer dicing process.

[0094] Although the composition of Comparative Example 2 adopted the formulation of Example 1, it was formed by rolling, and the resulting substrate film clearly lacked isotropy (the difference between longitudinal elongation and transverse elongation was large, and the difference between longitudinal tensile strength and transverse tensile strength was large), making it unsuitable for the wafer dicing process.

[0095] Since the composition of Comparative Example 3 does not contain an antistatic agent, its substrate film has a significantly improved surface resistivity compared to Example 1. Therefore, static electricity may be generated during the dicing and wafer expanding processes, potentially damaging circuits and crystal grains.

[0096] The composition of Comparative Example 4 does not contain a metal ion-based antistatic agent. Compared to Example 1, the UV transmittance of the base film is significantly lower (less than 70%), which affects the decomposition effect of the adhesive by UV light. As a result, the peeling force remains high even after exposure to UV light, and there is a possibility that adhesive residue may remain.

[0097] According to the measurement results of Examples 1 to 3 of the present invention, longitudinal elongation (%), transverse elongation (%), and longitudinal tensile strength (kgf / cm²) are as follows: 2 ), transverse tensile strength (kgf / cm 2 Detailed analysis was performed on the surface resistivity (ohm / sq) and surface resistivity. According to the measurement results, the base film of the dicing tape according to the present invention showed good isotropy and stability in various performance indicators.

[0098] Specifically, the range of longitudinal elongation (%) in Examples 1 to 3 was 573% to 686%, and the range of transverse elongation (%) was 568% to 677%. The error between longitudinal and transverse elongation was controlled to within 2%, and the elongation of the substrate film in the longitudinal and transverse directions showed high consistency, achieving an ideal isotropic effect. Such stable elongation can improve the application efficiency of dicing tape in semiconductor processes, and in particular, it can effectively avoid film tearing and stress concentration during wafer expansion.

[0099] At the same time, longitudinal tensile strength (kgf / cm 2 The range in Examples 1 to 3 is 226 kgf / cm². 2 ~374 kgf / cm² 2 Therefore, the tensile strength (kgf / cm 2 ) is 229 kgf / cm² 2 ~381 kgf / cm² 2 The error between the longitudinal tensile strength and the transverse tensile strength is controlled to within 3%, demonstrating a balance between the longitudinal and transverse mechanical properties of the base film. This provides stable support for wafer dicing and wafer expanding processes, effectively preventing wafer damage and deformation in high-pressure environments.

[0100] Furthermore, surface resistivity (ohm / sq) measurements showed that the surface resistivity of all three examples (1 to 3) remained within the range of 2.30E+09 ohm / sq to 3.50E+09 ohm / sq, demonstrating that the film possesses good antistatic properties, effectively preventing the accumulation of static electricity and avoiding potential damage due to electrostatic discharge (ESD) during the wafer dicing process.

[0101] In contrast, Comparative Examples 1 to 4 showed large performance deviations, particularly large differences in elongation and tensile strength in the longitudinal and transverse directions. These comparative examples lacked isotropy, indicating that they were unsuitable to meet the requirements of applications in semiconductor manufacturing processes. In contrast, the substrate film according to the embodiment of the present invention achieves high isotropy, high mechanical strength, and excellent antistatic properties through a rational formulation design. It is particularly suitable for use in semiconductor wafer dicing processes and can effectively improve overall process stability and product yield.

[0102] To further demonstrate the isotropy of the base film of the dicing tape of the present invention, in addition to mechanical property tests in the longitudinal and transverse directions, the coefficient of thermal expansion (CTE) of the base film was also measured to observe microscopic isotropy. The CTE of the base film of Example 1 was tested in a temperature range of 150°C to 300°C, and the longitudinal CTE value of the base film was 198.96 × 10⁻⁶. -6 The value is / K, and the lateral CTE value is 198.22 × 10⁻¹⁰. -6It was shown that the coefficient of thermal expansion of the substrate film is very close in the longitudinal and transverse directions, indicating that the thermal expansion properties of the film are very consistent in both directions. The close coefficient of thermal expansion in the longitudinal and transverse directions also means that the intermolecular bonding forces of the substrate film are equivalent in these two directions, indicating that the atomic arrangement density in the longitudinal and transverse directions of the material is consistent within the same film. As the temperature rises, molecules absorb energy, the vibrational range of the molecules expands, and furthermore, the distance between molecules increases, resulting in the same thermal expansion in the longitudinal and transverse directions of the material. These microscopic isotropy results are consistent with the mechanical property test data from experiments, proving that the substrate film of the present invention can maintain stable isotropy even under high-temperature conditions and has good thermal and dimensional stability.

[0103] [Advantageous effects of the embodiment] Embodiments of the present invention provide a dicing tape for semiconductor manufacturing processes, a composition for a dicing tape (substrate film), and a method for manufacturing a dicing tape. Embodiments of the present invention have significant technical advantages.

[0104] First, the dicing tape according to the present invention overcomes the problem of plasticizer precipitation in conventional PVC dicing tapes, avoids residual adhesive and incomplete decomposition due to plasticizer transfer, and further improves product stability and manufacturing process yield. Furthermore, the dicing tape does not contain harmful components such as halogens and heavy metals, meets international environmental standards and the needs of end consumers for environmentally friendly materials, and provides a more environmentally friendly solution for semiconductor manufacturing processes.

[0105] This invention achieves mechanical properties similar to conventional PVC dicing tapes by precisely controlling the resin composition and ratio in the base film, while eliminating the need to rely on environmentally harmful components. Because an antistatic agent is added to the base film, damage to circuits and crystal grains due to static electricity accumulated during dicing and wafer expanding processes can be effectively avoided, further improving process yield. Notably, this invention eliminates the need for an additional antistatic layer coating, significantly reducing manufacturing costs and energy consumption, while simultaneously avoiding environmental impacts from extra processing steps.

[0106] Regarding the manufacturing process, the present invention employs a casting method for film formation, resulting in films with excellent isotropy, consistent tensile strength and elongation in the longitudinal and transverse directions. This eliminates the uniaxial stretching problem that occurs during conventional film blowing or rolling processes, thereby improving the yield of dicing and wafer expanding processes. This technology not only simplifies the process but can also be combined with existing film production equipment technologies, offering high industrial mass production value.

[0107] Furthermore, the polyolefin substrate formulation of the present invention offers numerous environmental and performance advantages, including good mechanical stability, antistatic properties, and excellent ultraviolet transmittance (over 70%), ensuring that the decomposition effect of the adhesive is not affected after exposure to ultraviolet light, and that no adhesive residue remains on the tape. As described above, the present invention not only simplifies the manufacturing process and reduces manufacturing costs, but also offers good environmental protection and mass production value, making it particularly suitable for semiconductor wafer dicing process applications.

[0108] The information disclosed above represents only preferred and implementable embodiments of the present invention, and the claims of the present invention are not limited thereto. Therefore, any equivalent technical modifications made using the description and drawings of the present invention are all included within the scope of the claims of the present invention. [Explanation of Symbols]

[0109] S110... Project S110 S120... Project S120 S130... Project S130 S140...Project S140 S150... Project S150 S160...Project S160 S170...Project S170

Claims

1. A mixing step involves mixing a dicing tape composition containing polyethylene resin, polypropylene resin, and an antistatic agent using a mixer to form a resin mixture. A granulation step is performed to prepare plastic particles by granulating the resin mixture using a twin-screw extruder. A casting film formation process involves loading the aforementioned plastic particles into a single-screw extruder and manufacturing a base film by the casting method. Further providing a release film, and an adhesive layer coating step, which involves forming an adhesive layer on one surface of the release film, The process includes a bonding step of forming a dicing tape by bonding the base film and the adhesive layer on the surface of the release film, The polyethylene resin is at least one selected from the group consisting of low-density polyethylene, medium-density polyethylene, high-density polyethylene, and linear low-density polyethylene. A method for manufacturing dicing tape for semiconductor manufacturing processes, characterized in that the polypropylene resin is at least one selected from the group consisting of homopolypropylene (hPP), random copolymer polypropylene (rPP), and block copolymer polypropylene (bPP).

2. A method for manufacturing dicing tape for semiconductor manufacturing processes according to claim 1, wherein in the granulation step, the screw temperature of the twin-screw extruder is 110°C to 240°C, and in the casting film formation step, the screw temperature of the single-screw extruder is 160°C to 300°C.

3. The method for manufacturing the dicing tape for the semiconductor manufacturing process further includes a corona treatment step, in which the substrate film formed by the casting film formation is subjected to corona treatment after the casting film formation step. The voltage per unit area for corona treatment is 1000 Volts / cm². ２ ~10000Volt / cm ２ The method for manufacturing a dicing tape for a semiconductor manufacturing process according to claim 1.

4. A method for manufacturing a dicing tape for a semiconductor manufacturing process according to claim 1, wherein the thickness of the release film is 30 μm to 50 μm, the thickness of the adhesive layer is 5 μm to 20 μm, and the thickness of the base film is 60 μm to 100 μm.

5. The dicing tape composition further comprises a toughness-reinforcing resin, The method for manufacturing a dicing tape for a semiconductor manufacturing process according to claim 1, wherein the toughness-reinforcing resin is at least one selected from the group consisting of polyolefin elastomer, ethylene vinyl acetate, thermoplastic elastomer, ethylene propylene rubber, styrene-butadiene styrene copolymer, and ethylene propylene diene rubber.

6. A method for manufacturing a dicing tape for a semiconductor manufacturing process according to claim 1, wherein the polyethylene resin is low-density polyethylene, the first weight-average molecular weight of the polyethylene resin is 100,000 g / mol to 500,000 g / mol, the first melt index of the polyethylene resin is 2 g / 10 min to 8 g / 10 min, the first melting point of the polyethylene resin is 110°C to 135°C, the second weight-average molecular weight of the polypropylene resin is 200,000 g / mol to 500,000 g / mol, the second melt index of the polypropylene resin is 2 g / 10 min to 10 g / 10 min, and the second melting point of the polypropylene resin is 130°C to 170°C.

7. A method for manufacturing a dicing tape for a semiconductor manufacturing process according to claim 5, wherein, with the total weight of the dicing tape composition being 100% by weight, the content of the polyethylene resin is 25% to 75% by weight, the content of the polypropylene resin is 20% to 70% by weight, the content of the toughness-reinforcing resin is 1% to 25% by weight, and the content of the antistatic agent is 0.1% to 4% by weight.

8. A method for manufacturing a dicing tape for a semiconductor manufacturing process according to claim 7, wherein the polyethylene resin content is 30% to 65% by weight, the polypropylene resin content is 20% to 50% by weight, the toughness-reinforcing resin content is 3% to 25% by weight, and the antistatic agent content is 0.3% to 3% by weight.

9. The method for manufacturing a dicing tape for a semiconductor manufacturing process according to claim 5, wherein the toughness-reinforcing resin simultaneously contains ethylene vinyl acetate (EVA) and polyolefin elastomer (POE), the ethylene vinyl acetate (EVA) is copolymerized with ethylene and vinyl acetate (VA), the weight ratio of vinyl acetate in the ethylene vinyl acetate is 10% to 15%, and the weight ratio of octene in the polyolefin elastomer is 5% to 15%.

10. The antistatic agent is at least one selected from the group consisting of ester compounds, ethoxyl compounds, polymer antistatic agents, amphoteric antistatic agents, and special functional antistatic agents. The ester compound comprises at least one of glyceryl stearate and alkyl phosphate esters. The ethoxyl compound comprises at least one of ethoxylated alkyl acid amides, ethoxylated laurylamines, and alkylphenol polyoxyethylene ether sulfates. The aforementioned polymeric antistatic agent comprises at least one of polyamine-based, polyester polyether-based, and polyurethane-based materials. The aforementioned amphoteric antistatic agent comprises at least one of the betaine-based and imidazoline-based agents. The method for manufacturing a dicing tape for a semiconductor manufacturing process according to claim 1, wherein the special functional antistatic agent comprises at least one of a triazine-based and an aminocarboxylic acid-based agent.

11. The antistatic agent is glyceryl monostearate (GMS), and the surface resistivity of the antistatic agent is 10 ６ Ω / sq ~ 10 ９ A method for manufacturing a dicing tape for a semiconductor manufacturing process according to claim 1, wherein the ratio is Ω / sq.

12. The method for manufacturing a dicing tape for a semiconductor manufacturing process according to claim 1, wherein the dicing tape composition further comprises a trace amount of an additive, the trace amount of the additive comprising at least one selected from the group consisting of antioxidants, lubricants, dispersants, fillers, and processing aids.

13. The longitudinal elongation of the base film is 573% to 686%, the transverse elongation of the base film is 568% to 677%, the error between the longitudinal and transverse elongation is within 2%, and the longitudinal tensile strength of the base film is 226 kgf / cm². ２ ~374kgf / cm ２ The transverse tensile strength of the base film is 229 kgf / cm². ２ ~381kgf / cm ２ The method for manufacturing a dicing tape for a semiconductor manufacturing process according to claim 1, wherein the error between the longitudinal tensile strength and the transverse tensile strength is within 3%, and the surface resistivity of the base film is 2.30E+09ohm / sq to 3.50E+09ohm / sq.

14. A dicing tape composition for semiconductor manufacturing processes comprising polyethylene resin and polypropylene resin, The polyethylene resin is at least one selected from the group consisting of low-density polyethylene, medium-density polyethylene, high-density polyethylene, and linear low-density polyethylene. The polypropylene resin is at least one selected from the group consisting of homopolypropylene, random copolymer polypropylene, and block copolymer polypropylene. The first weight-average molecular weight of the polyethylene resin is 100,000 g / mol to 500,000 g / mol, the first melt index of the polyethylene resin is 2 g / 10 min to 8 g / 10 min, and the first melting point of the polyethylene resin is 110°C to 135°C. A dicing tape composition for semiconductor manufacturing processes, characterized in that the second weight-average molecular weight of the polypropylene resin is 200,000 g / mol to 500,000 g / mol, the second melt index of the polypropylene resin is 2 g / 10 min to 10 g / 10 min, and the second melting point of the polypropylene resin is 130°C to 170°C.

15. A dicing tape for semiconductor manufacturing processes comprising a base film formed from a dicing tape composition for semiconductor manufacturing processes, an adhesive layer formed on the base film, and a release film formed on the adhesive layer so as to be removable, The aforementioned dicing tape composition for semiconductor manufacturing processes comprises polyethylene resin, polypropylene resin, and an antistatic agent. The polyethylene resin is at least one selected from the group consisting of low-density polyethylene, medium-density polyethylene, high-density polyethylene, and linear low-density polyethylene. The polypropylene resin is characterized by being at least one selected from the group consisting of homopolypropylene (hPP), random copolymer polypropylene (rPP), and block copolymer polypropylene (bPP), in a dicing tape for semiconductor manufacturing processes.

16. The longitudinal elongation rate of the base film is 573% to 686%, the transverse elongation rate of the base film is 568% to 677%, the error between the longitudinal elongation rate and the transverse elongation rate is within 2%, and the longitudinal tensile strength of the base film is 226 kgf / cm ２ to 374 kgf / cm ２ and the transverse tensile strength is 229 kgf / cm ２ to 381 kgf / cm ２ and the error between the longitudinal tensile strength and the transverse tensile strength is within 3%. The dicing tape for semiconductor manufacturing processes according to claim 15.

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