Conveying equipment and processing equipment

Abstract

We propose a novel configuration for a device that removes and transports workpieces from a chuck table. [Solution] The conveying device removes a workpiece from a holding table of a processing device by holding the workpiece placed on the table and moving it to a predetermined position. The conveying device also includes a holding mechanism for holding the upper surface of the workpiece held on the holding table, and a moving mechanism for moving the holding mechanism to a predetermined position. Furthermore, the conveying device also includes an inversion mechanism for inverting the holding mechanism so that the lower surface of the workpiece is exposed on the upper side.

Description

Technical Field

[0001] The present invention relates to an apparatus for removing a workpiece from a chuck table and transporting it.

Background Art

[0002] Conventionally, as disclosed in, for example, Patent Document 1, a workpiece housed in a cassette is transported to a chuck table, and the workpiece held by the chuck table is fed for processing and cut with a cutting blade to divide it into rectangular chips. A processing apparatus (cutting apparatus) for this purpose is known.

[0003] In this type of processing apparatus, a series of operations such as transporting the workpiece from the cassette to the chuck table, processing (cutting) the workpiece, cleaning the workpiece, and transporting the workpiece from the chuck table to the cassette after processing are controlled to be automatically performed, so that it can be configured to operate in a so-called full-auto (fully automatic) manner.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] In a processing apparatus that operates in full-auto, for example, when a problem occurs during processing, it is necessary to temporarily stop various operating parts and remove the workpiece from the chuck table.

[0006] In this process, it becomes necessary to manually lift the workpiece from the chuck table. However, if the workpiece is large, such as a rectangular plate measuring 700mm x 700mm or a circular disc measuring 12 inches (300mm in diameter), manual handling by the operator becomes difficult, and there is a concern that the workpiece may be damaged during the process. Furthermore, since various devices are intricately arranged within the processing equipment, the ease of manual operation must also be considered.

[0007] In view of the above problems, the present invention proposes a novel configuration for a device for removing and transporting a workpiece from a chuck table. [Means for solving the problem]

[0008] The problems that this invention aims to solve are as described above, and the means for solving these problems will now be explained.

[0009] According to one aspect of the present invention, the present invention provides a conveying device that removes a workpiece from a holding table of a processing device by holding the workpiece placed on the holding table and moving it to a predetermined position.

[0010] Furthermore, according to one aspect of the present invention, the conveying device includes a holding mechanism for holding the upper surface of a workpiece held on the holding table, and a moving mechanism for moving the holding mechanism to a predetermined position.

[0011] Furthermore, according to one aspect of the present invention, the conveying device has an inversion mechanism for inverting the holding mechanism so that the lower surface of the workpiece is exposed on the upper side.

[0012] Furthermore, according to one aspect of the present invention, the holding mechanism has at least one suction cup for adsorbing and holding a workpiece, and is configured to release air from the suction cup when the holding mechanism is inverted upside down and the lower surface of the workpiece is exposed on the upper side.

[0013] Furthermore, according to one aspect of the present invention, the predetermined location is the area outside the processing chamber surrounded by a partition wall surrounding the processing unit provided in the processing apparatus, or the area outside the apparatus that is outside the outer wall of the processing apparatus.

[0014] Furthermore, according to one aspect of the present invention, the workpiece is a disc-shaped semiconductor wafer, a glass wafer, a bonded wafer made by bonding multiple wafers together, or a rectangular semiconductor package substrate.

[0015] Furthermore, according to one aspect of the present invention, the processing apparatus comprises a processing unit for processing the workpiece and a conveying device. [Effects of the Invention]

[0016] The present invention provides the following effects: In other words, according to one aspect of the present invention, there is no need to manually lift the workpiece from the chuck table, and even when the workpiece is large, such as a rectangular plate measuring 700mm x 700mm or a disc shape measuring 12 inches (300mm in diameter), it is easy for the operator to handle and prevents damage to the workpiece during operation. Furthermore, even when various devices are complexly arranged within the processing equipment, the workpiece is moved to a predetermined position, improving the efficiency of manual work. [Brief explanation of the drawing]

[0017] [Figure 1] A perspective view showing an example of a processing apparatus. [Figure 2] A diagram illustrating the general layout of the conveying device. [Figure 3] A diagram illustrating an example of a moving mechanism. [Figure 4] (A) is a diagram illustrating the lowering of the holding mechanism. (B) is a diagram illustrating how the wafer is held in place by the suction cups of the holding mechanism. (C) is a diagram illustrating the raising of the holding mechanism. (D) is a diagram illustrating how the holding mechanism is inverted. [Figure 5] A diagram for explaining the state of receiving a wafer as a workpiece.

Embodiments for Carrying out the Invention

[0018] Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a diagram showing an example of a processing apparatus to which the present invention is applied. The processing apparatus 2 includes a holding table 8 that holds a wafer W as a workpiece, and processing units 21 and 22 that form processing grooves along a planned dividing line of the wafer W held by the holding table 8.

[0019] Inside the base 5, an X-axis moving mechanism (not shown) for feeding the holding table 8 in the X-axis direction is provided, and the holding table 8 is relatively moved in the X-axis direction with respect to the processing units 21 and 22.

[0020] The holding table 8 is connected to a suction source, and by generating a negative pressure on its upper surface, a suction holding surface is formed to suck and hold the wafer W. For example, a protective tape is attached to the lower surface of the wafer W, and the wafer W is sucked and held by the holding table 8 through the protective tape.

[0021] On a gantry column 6 erected on the base 5, YZ-axis moving mechanisms 31 and 32 for moving each processing unit 21 and 22 in the Y-axis direction and the Z-axis direction are provided, and each processing unit 21 and 22 is relatively moved in the YZ-axis direction with respect to the holding table 8.

[0022] Each processing unit 21 and 22 has a spindle that is rotationally driven by a motor (not shown) and a cutting blade fixed to the tip of the spindle, and a processing groove is formed in the wafer W by the cutting blade.

[0023] The workpiece may be, for example, a 12-inch disc-shaped semiconductor wafer, a glass wafer, or a bonded wafer made by bonding multiple wafers together, or it may be, for example, a rectangular semiconductor package substrate P. The size of the semiconductor package substrate P is, for example, 700mm x 700mm. The holding table 8 is designed according to the size and shape of the workpiece. The workpiece may also be integrated with a ring frame via tape and handled as a frame unit.

[0024] Multiple wafers W are stored in a cassette 9, for example, and transported to a holding table 8 by a transport device (not shown). After processing, they are transported to a cleaning device 4 by a transport device (not shown) for surface cleaning. After cleaning, they are transported back into the cassette 9 by a transport device (not shown).

[0025] The processing apparatus 2 is equipped with a control unit 10. The control unit 10 consists of hardware such as a CPU and memory, and software stored in the memory, and is configured to perform various controls on the processing apparatus 2. Under the control of the control unit 10, the following are performed fully automatically: transport of the wafer W from the cassette 9 to the holding table 8, processing of the wafer W held on the holding table 8 by the processing units 21 and 22, transport of the processed wafer W from the holding table 8 to the cleaning apparatus 4, cleaning in the cleaning apparatus 4, and transport of the wafer W from the cleaning apparatus 4 to the cassette 9.

[0026] The processing device 2 is equipped with a touch panel 12 for operator-performed setting operations and for displaying the operating status. Alternatively, the device may have separate interfaces for setting operations and for display.

[0027] The processing apparatus 2 includes a transport device 40 for removing the wafer W from the holding table 8 by holding the wafer W placed on the holding table 8 and moving the wafer W to a predetermined position.

[0028] This transport device 40 removes the wafer W from the holding table 8 under control by the control unit 10 when the control unit 10 detects some abnormality during fully automatic operation and stops operation, or when an operator performs a stop operation.

[0029] As shown in Figure 2, the transport device 40 is configured to include a holding mechanism 42 for holding the upper surface of the wafer W held on the holding table 8, an inversion mechanism 44 for inverting the holding mechanism 42 so that the lower surface of the wafer W is exposed on the upper side, a lifting mechanism 46 for moving the inversion mechanism 44 in the vertical direction, and a moving mechanism 48 for moving the lifting mechanism 46 to a predetermined position.

[0030] The holding mechanism 42 is constructed by providing a plurality of suction cups 42b, 42b on the lower surface of a plate-shaped holding frame 42a. The suction cups 42b, 42b are connected to a suction source (not shown), and the suction can be switched on and off by controlling a valve. The number of suction cups 42b, 42b is not limited and may be just one.

[0031] The holding frame 42a of the holding mechanism 42 is fixed to the lower end of the vertical portion 42d of the substantially L-shaped arm 42c. The end of the horizontal portion 42e of the arm 42c is connected to the up / down inversion mechanism 44.

[0032] The inversion mechanism 44 includes a motor 44a that rotates the horizontal portion 42e of the arm 42c about a horizontal axis H, and a bracket 44b for supporting the motor 44a and the horizontal portion 42e of the arm 42c.

[0033] The bracket 44b of the inversion mechanism 44 is connected to the upper and lower arm 46a of the lifting mechanism 46, and moves up and down by the motor 46b provided in the lifting mechanism 46.

[0034] The bracket 46c of the lifting mechanism 46 is supported by the moving mechanism 48 and moves horizontally by a motor provided in the moving mechanism 48. The moving mechanism 48 is configured as a two-axis rotary type having retractable arms 48a and 48b, as shown in Figure 3, thereby allowing the conveying device 40 to be moved to a predetermined position in the horizontal plane (XY plane). Note that the moving mechanism 48 is not limited to a two-axis rotary type and may move linearly in the XY axis direction.

[0035] With the above configuration, the control unit 10 starts control to remove the wafer W from the holding table 8 in response to an operation command from the operator. Specifically, as shown in Figure 4(A), the movement mechanism 48 (Figure 3) is controlled so that the center of the holding frame 42a aligns with the center of the holding table 8, thereby aligning the holding mechanism 42 and the holding table 8. In this process, the holding table 8 may be moved as appropriate.

[0036] Next, as shown in Figure 4(A), the lifting mechanism 46 lowers the holding frame 42a, and as shown in Figure 4(B), the suction cups 42b, 42b on the lower surface of the holding frame 42a are brought into close contact with the wafer W.

[0037] Next, suction is initiated by the suction cups 42b, 42b to hold the wafer W in place, and as shown in Figure 4(C), the lifting mechanism 46 raises the holding frame 42a together with the wafer W, removing the wafer W from the holding table 8.

[0038] Next, as shown in Figure 4(D), the inversion mechanism 44 rotates the arm 42c to rotate the holding frame 42a by 180 degrees, so that the lower surface Wb of the wafer W, which was held on the holding table 8, is exposed upwards. In this state, the wafer W is supported from below by the holding frame 42a, so problems such as the wafer W falling out can be prevented. Note that this inversion may be performed after the wafer has been moved to a predetermined position by the moving mechanism 48 (Figure 3).

[0039] Next, as shown in Figure 5, the holding frame 42a is moved to a predetermined position by the moving mechanism 48 (Figure 3), and then the wafer W is received from the holding frame 42a by the operator. At this time, the suction of the suction cup 42b is stopped as appropriate and the suction holding is released as appropriate.

[0040] Furthermore, after the holding frame 42a has been moved to a predetermined position, the holding mechanism 42 may be inverted to expose the lower surface Wb of the wafer W upwards. Air may then be released from the suction cup 42b from an air source (not shown) to slightly lift the wafer W from the suction cup, making it easier for the operator to receive.

[0041] Furthermore, the designated location is the area where the operator receives the wafer, and is preferably an area that is easily accessible and easy for the operator to work in, or an area where the wafer is unlikely to interfere with other parts of the apparatus. Specifically, for example, in Figure 3, this could be the area 52 outside the processing chamber 51 surrounded by the partition walls surrounding the processing units 21 and 22, or the area outside the apparatus 54, which is outside the apparatus outer wall 53 surrounding the space above the base 5.

[0042] The present invention can be implemented in the manner described above. In other words, as shown in Figures 1 to 3, the transport device 40 removes the wafer W from the holding table 8 by holding the workpiece (wafer W) placed on the holding table 8 and moving it to a predetermined position.

[0043] This eliminates the need to manually lift the workpiece from the chuck table, making it easy for operators to handle even large workpieces, such as a rectangular plate measuring 700mm x 700mm or a circular disc measuring 12 inches (300mm in diameter), and preventing damage to the workpiece during operation. Furthermore, even when various devices are complexly arranged within the processing equipment, the ability to move the workpiece to its designated position improves manual work efficiency.

[0044] In the above embodiments, a cutting device equipped with a cutting unit that cuts a workpiece with a cutting blade was used as an example of a processing device. However, the present invention is not limited to this, and can be implemented with various processing devices, such as a laser processing device that laser processes a workpiece with a laser processing unit, a grinding device equipped with a grinding unit that grinds a workpiece with a grinding wheel, or a polishing device that polishes a workpiece. [Explanation of symbols]

[0045] 2 Processing equipment 4. Washing device 5 bases 6 Columns 8. Holding Table 9 Cassettes 10 Control Unit 12 Touch panel 21 Processing Units 22 Each processing unit 40 Conveying device 42 Retention mechanism 42a Retaining frame 42b sucker 42c arm 42d Vertical section 42e horizontal section 44 Up / Down Inversion Mechanism 44a motor 44b placket 46 Lifting mechanism 46a Up and down arm 46b Bracket 48 Moving mechanism 48a Arm 48b Arm 51 Processing room 52 areas 53 Equipment outer wall 54 Area outside the device H horizontal axis P Semiconductor Package Substrate W wafer Wb bottom surface

Claims

1. A conveying device that removes a workpiece from a holding table of a processing device by holding the workpiece on the table and moving it to a predetermined position.

2. The conveying device is A holding mechanism for holding the upper surface of a workpiece held on the holding table, The holding mechanism has a moving mechanism for moving it to a predetermined position, The conveying device according to feature 1.

3. The conveying device is The holding mechanism has an inversion mechanism for inverting it so that the lower surface of the workpiece is exposed on the upper side. The conveying device according to feature 2.

4. The holding mechanism has at least one suction cup for adsorbing and holding the workpiece, The holding mechanism is inverted so that the lower surface of the workpiece is exposed upwards, and air is released from the suction cup. The conveying device according to feature 3.

5. The predetermined position is, The area outside the processing chamber, which is enclosed by a partition wall surrounding the processing unit installed in the processing apparatus, Or, This is the area outside the device, which is the outer wall of the processing device. The conveying device according to any one of claims 1 to 4.

6. The workpiece is, A disc-shaped semiconductor wafer, a glass wafer, a bonded wafer made by bonding multiple wafers together, or a rectangular semiconductor package substrate. The conveying device according to feature 5.

7. A machining unit for machining the workpiece, The conveying device according to claim 5, A processing apparatus having the following features.

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