electronic machines

The electronic device simplifies heat dissipation by using a movable heat sink and cam groove mechanism to eliminate complex components, ensuring efficient heat transfer without sliding, thus reducing costs and complexity.

JP2026083720APending Publication Date: 2026-05-20JAPAN AVIATION ELECTRONICS IND LTD
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
JAPAN AVIATION ELECTRONICS IND LTD
Filing Date
2024-11-08
Publication Date
2026-05-20

AI Technical Summary

Technical Problem

Conventional electronic devices require complex configurations, such as compression springs and engaging projections, to ensure contact between a heat sink and a plug shell without sliding, leading to increased complexity and cost.

Method used

An electronic device design where a heat sink is supported to move relative to a receptacle housing, using inclined surfaces and a cam groove mechanism to facilitate contact between the heat sink and plug shell without sliding, eliminating the need for compression springs and engaging projections.

Benefits of technology

The design achieves efficient heat dissipation with a simple configuration, reducing manufacturing costs and minimizing sliding friction during insertion and removal of components.

✦ Generated by Eureka AI based on patent content.

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Abstract

The simple design ensures that the heatsink and plug shell make contact with almost no sliding. [Solution] The electronic device 10 has a heat sink 51 that is supported so as to be movable in a first direction relative to a receptacle shell 61, the contact surface 25 of the plug shell 21 and the heat dissipation surface of the heat sink 51 are formed as inclined surfaces, a pressing means 63 is arranged between the heat sink 51 and the receptacle shell 61, the receptacle shell 61 has a guide portion (cam groove 62) formed therein that restricts the movement of the heat sink 51 in the negative second direction when the heat sink 51 is positioned in the positive first direction relative to the receptacle shell 61, and restricts the movement of the heat sink 51 in the positive second direction when the heat sink 51 is positioned in the negative first direction relative to the receptacle shell 61, and the heat sink 51 has a guided portion (cylindrical projection 57) that is guided by the guide portion (cam groove 62) formed in the receptacle shell 61.
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Description

Technical Field

[0001] This disclosure relates to an electronic device.

Background Art

[0002] In recent years, due to requirements such as an increase in communication speed and an improvement in processing power, the power consumption of electronic components mounted in electronic devices has been increasing, and thus higher heat dissipation efficiency has been demanded. Therefore, there is a need for an electronic device that can reasonably obtain a high heat dissipation effect only by contact between solids, such as an optical transceiver provided with a heat sink.

[0003] The structure of this type of electronic device is disclosed in, for example, Patent Document 1 below. As an optical transceiver (10) as a conventional electronic device disclosed in Patent Document 1 below, as shown in FIGS. 31 and 32, the contact surfaces (15a, 14a) between the heat sink (15) and the transceiver housing (14) are inclined surfaces, and a soft thermal conduction sheet (18) is attached to either the contact surface (15a, 14a) of the heat sink (15) or the transceiver housing (14). The heat sink (15) is supported so as to be movable within a predetermined range in the front-rear direction and the vertical direction with respect to the cage (12) in response to the insertion of the transceiver housing (14), and the transceiver housing (14) is inserted without rubbing the contact surface of the thermal conduction sheet (18). At the final insertion position of the optical transceiver (13), the contact surfaces of the heat sink (15) and the transceiver housing (14) are pressed against each other with the thermal conductivity sheet (18) interposed therebetween. Regarding the reference numerals in the description of the prior art documents, parentheses are added to distinguish them from the embodiments of the present disclosure.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] However, in the optical transceiver (10) disclosed in Patent Document 1, the heat sink (15) is supported so as to be movable within a predetermined range in the front-rear and up-down directions relative to the cage (12) depending on the insertion position of the transceiver housing (14), so a compression spring (17a, 17b) is required, and further, in order to prevent the thermal conductive sheet (18) from rubbing, a configuration such as an engaging projection (19) or engaging hole (20) is required, resulting in a complex configuration.

[0006] Therefore, the present invention aims to provide an electronic device that, with a simple configuration, can bring a heat sink (or a thermal conductive sheet if one is attached) and a plug shell into contact with almost no sliding. [Means for solving the problem]

[0007] The electronic device according to this disclosure comprises a plug connector including a plug shell and a plug housing, a receptacle housing having an opening into which the plug connector can be inserted and removed, and a heat sink that is installed via a receptacle shell attached to the receptacle housing so as to be movable relative to the receptacle housing, wherein when the plug connector is inserted into the opening of the receptacle housing and is in a mated state, the contact surface of the plug shell and the heat dissipation surface of the heat sink come into contact, causing the heat sink to dissipate heat generated from the plug connector, wherein the insertion and removal direction of the plug connector to the opening of the receptacle housing is defined as the first direction, the removal direction of the plug connector to the opening is defined as the positive first direction, the insertion direction is defined as the negative first direction, the direction perpendicular to the first direction is defined as the second direction, and the direction in which the heat dissipation surface of the heat sink is positioned relative to the plug shell in the mated state is defined as the positive first direction. When the second direction and the direction in which the plug shell is positioned relative to the heat dissipation surface of the heat sink are defined as the negative second direction, the heat sink is supported so as to be movable in the first direction relative to the receptacle shell, the contact surface of the plug shell and the heat dissipation surface of the heat sink are both formed as inclined surfaces with an inclination with respect to the first direction, a pressing means is disposed between the heat sink and the receptacle shell to press the heat sink in the positive first direction relative to the receptacle shell, a guide portion is formed in the receptacle shell that restricts the movement of the heat sink in the negative second direction when the heat sink is positioned in the positive first direction relative to the receptacle shell, and restricts the movement of the heat sink in the positive second direction when the heat sink is positioned in the negative first direction relative to the receptacle shell, and the heat sink has a guided portion that is guided by the guide portion formed in the receptacle shell.

[0008] Furthermore, in the electronic device relating to this disclosure, the guide portion is formed as a cam groove having a groove shape, and the guided portion is formed as a cylindrical projection having a cylindrical projection shape that fits into the groove shape of the cam groove, and when the second direction dimension between the negative second direction portion on the positive first direction side of the cam groove and the positive second direction portion on the negative first direction side of the cam groove is α, and the second direction dimension which is the diameter dimension of the cylindrical projection shape constituting the cylindrical projection is β, α ≈ β It can be constructed such that the following mathematical formula holds true.

[0009] In other words, in the electronic device according to this disclosure, in the pre-mating state where the plug connector has not been inserted into the opening of the receptacle housing, the heat sink is pushed in the positive first direction by a pressing means that presses it in the positive first direction, which is the withdrawal direction, and the cylindrical projection is in contact with the negative second direction portion of the cam groove, and is in a position separated from the plug shell. When the plug connector is inserted into the opening of the receptacle housing in the negative first direction from this state, the inclined surfaces of the contact surface of the heat sink and the heat dissipation surface of the plug shell come into contact with each other during mating. When the plug connector is further pushed in the negative first direction from the state where the inclined surfaces are in contact, the heat sink is pressed against the negative second direction side, which is the plug shell side, with the cylindrical projection contacting the positive second direction portion of the cam groove. This configuration eliminates the need for components such as the compression spring (17a, 17b), engaging projection (19), and engaging hole (20) that were necessary in the conventional technology described above, so the configuration is simple and easy to manufacture, resulting in low cost. Furthermore, when removing the plug connector from the opening of the receptacle housing, the pressing mechanism presses the heatsink in the positive first direction, causing the inclined surfaces of the heatsink and the plug shell to separate. As a result, the cylindrical projection of the heatsink moves within the cam groove in the positive first direction, returning it to a position separated from the plug shell before mating.

[0010] Furthermore, in the electronic device relating to this disclosure, a locking portion is formed in the plug housing as a fixing means, and a locking portion is formed in the receptacle housing as a fixed means, and when the plug connector is inserted into the opening of the receptacle housing and is in a fitted state, the locking portion and the locking portion engage with each other, thereby maintaining the fitted state of the plug connector to the receptacle housing against the pressing force exerted by the pressing means.

[0011] Furthermore, in the electronic device relating to this disclosure, the pressing means can be configured as a component integrated with the receptacle shell.

[0012] Furthermore, in the electronic device relating to this disclosure, the pressing means may be configured as a component separate from the receptacle shell.

[0013] Furthermore, in the electronic device relating to this disclosure, the pressing means may be formed as a cantilever spring having a cantilever beam shape, or as a double-supported spring having a double-supported beam shape.

[0014] Furthermore, in the electronic device relating to this disclosure, a heat conductive sheet can be installed on the heat dissipation surface of the heat sink.

[0015] Furthermore, in the electronic device relating to this disclosure, the groove shape of the guide portion formed as a cam groove can be formed as a substantially L-shape. [Effects of the Invention]

[0016] According to this disclosure, it is possible to provide an electronic device that, with a simple configuration, can bring a heat sink (or a thermal conductive sheet if one is attached) and a plug shell into contact with almost no sliding. [Brief explanation of the drawing]

[0017] [Figure 1]It is an external perspective view showing the overall configuration of the electronic device according to this embodiment, and is a view when the receptacle connector and the plug connector constituting the electronic device are in a mated state as seen from the upper left front. [Figure 2] It is an external perspective view showing the overall configuration of the electronic device according to this embodiment, and is a view when the receptacle connector and the plug connector constituting the electronic device are in an unmated state as seen from the upper left front. [Figure 3] It is an external perspective view of the receptacle connector according to this embodiment as seen from the upper left front. [Figure 4] It is an exploded perspective view showing the state in which the constituent members of the receptacle connector according to this embodiment shown in Fig. 3 are disassembled. [Figure 5] It is an external perspective view of the heat sink which is a constituent member of the receptacle connector according to this embodiment as seen from the upper left front. [Figure 6] It is an external perspective view of the heat sink which is a constituent member of the receptacle connector according to this embodiment as seen from the lower left front. [Figure 7] It is a left side view of the heat sink which is a constituent member of the receptacle connector according to this embodiment. [Figure 8] It is an external perspective view of the receptacle shell which is a constituent member of the receptacle connector according to this embodiment as seen from the upper left front. [Figure 9] It is an external perspective view of the receptacle shell which is a constituent member of the receptacle connector according to this embodiment as seen from the lower left rear. [Figure 10] It is a left side view of the receptacle shell which is a constituent member of the receptacle connector according to this embodiment. [Figure 11] It is an external perspective view of the plug connector according to this embodiment as seen from the upper left front. [Figure 12] It is an external perspective view of the plug connector according to this embodiment as seen from the upper right rear. [Figure 13] It is a top view of the plug connector according to this embodiment. [Figure 14]This is a left side view of the longitudinal section showing the XIV-XIV line section in Figure 13. [Figure 15] This diagram illustrates the operation of the electronic device according to this embodiment, and shows the receptacle housing in an unmated state, with the plug connector not yet inserted into the opening, as viewed from the upper left front. [Figure 16] This diagram illustrates the operation of the electronic device according to this embodiment, and is a top view showing the receptacle housing in an unmated state where the plug connector is not inserted into the opening. [Figure 17] This diagram illustrates the operation of the electronic device according to this embodiment, and is a left side view showing the receptacle housing in an unmated state with the plug connector not inserted into the opening. [Figure 18] This is a left side view of the longitudinal section showing the section along line XVIII-XVIII in Figure 16. [Figure 19] This is a lower cross-sectional view showing the section along line XIX-XIX in Figure 17. [Figure 20] This diagram illustrates the operation of the electronic device according to this embodiment, and shows the state in which the plug connector is being inserted into the opening of the receptacle housing, as viewed from the upper left front. [Figure 21] This figure illustrates the operation of the electronic device according to this embodiment, and is a top view showing the plug connector in the process of being inserted into the opening of the receptacle housing. [Figure 22] This figure illustrates the operation of the electronic device according to this embodiment, and is a left side view showing the plug connector in the process of being inserted into the opening of the receptacle housing. [Figure 23] This is a left side view of the longitudinal section showing the cross-section along line XXIII-XXIII in Figure 21. [Figure 24] This is a lower cross-sectional view showing the section along line XXIV-XXIV in Figure 22. [Figure 25] This diagram illustrates the operation of the electronic device according to this embodiment, and shows the mated state in which the plug connector is fully inserted into the opening of the receptacle housing, as viewed from the upper left front. [Figure 26] This figure illustrates the operation of the electronic device according to this embodiment, and is a top view showing the mated state in which the plug connector is fully inserted into the opening of the receptacle housing. [Figure 27] This figure illustrates the operation of the electronic device according to this embodiment, and is a left side view showing the plug connector fully inserted into the opening of the receptacle housing in a mated state. [Figure 28] This is a left side view of the longitudinal section showing the cross-section along line XXVIII-XXVIII in Figure 26. [Figure 29] This is a lower cross-sectional view showing the section along line XXIX-XXIX in Figure 27. [Figure 30] This diagram illustrates the operation of the electronic device according to this embodiment, and shows the positional relationship of the cylindrical projection with respect to the cam groove. [Figure 31] This is a schematic diagram illustrating the general outline of the heat dissipation device of an optical transceiver, which is an electronic device based on conventional technology. [Figure 32] This diagram illustrates an example configuration for extracting an optical transceiver as an electronic device according to conventional technology. [Modes for carrying out the invention]

[0018] Hereinafter, preferred embodiments for carrying out the present disclosure will be described with reference to the drawings. For the sake of clarity, the drawings define a first direction, a second direction, and a third direction. In this specification, the first direction is the front-rear direction. In the drawings, the front-rear direction is indicated as the Y direction. Specifically, the front is the +Y direction and the rear is the -Y direction. The first direction is the insertion and removal direction of the receptacle housing 41 and the plug connector 20 that constitute the electronic device 10 according to this embodiment. That is, the direction in which the plug connector 20 is moved in the +Y direction (front) relative to the receptacle housing 41 is the removal direction, and the direction in which the plug connector 20 is moved in the -Y direction (rear) relative to the receptacle housing 41 is the insertion direction.

[0019] Furthermore, in this specification, the second direction is the vertical direction. In the figures, the vertical direction is shown as the Z direction. Specifically, the upward direction is the +Z direction and the downward direction is the -Z direction. The second direction is perpendicular to the first direction, and in the fitted state in which the plug connector 20 is inserted into the opening 42 of the receptacle housing 41 constituting the electronic device 10 according to this embodiment, the direction in which the heat dissipation surface of the heat sink 51 is positioned relative to the contact surface 25 of the plug shell 21 is the positive second direction (+Z direction (upwards)), and the direction in which the contact surface 25 of the plug shell 21 is positioned relative to the heat dissipation surface of the heat sink 51 is the negative second direction (-Z direction (downwards)).

[0020] Furthermore, in this specification, the third direction is the left-right direction. In the figures, the left-right direction is indicated as the X direction. In particular, the left is the +X direction and the right is the -X direction. However, the first direction, the Y direction, the second direction, the Z direction, and the third direction, the X direction, as defined herein, do not limit the direction in which the electronic device 10 of this embodiment can be used. The electronic device 10 of this embodiment can be used in any direction.

[0021] First, the overall configuration of the electronic device 10 according to this embodiment will be described with reference to Figures 1 to 14 and Figure 30. As shown in Figures 1 and 2, the electronic device 10 according to this embodiment is configured to have a plug connector 20 and a receptacle connector 30. The plug connector 20 is insertable into and removable from the receptacle connector 30.

[0022] The plug connector 20 is composed of a plug shell 21 and a plug housing 22, as shown in Figures 11 to 14. The plug shell 21 is made of a conductive metal material, and a plug-side mating terminal 27 is located inside it, as shown in Figure 12. The plug housing 22, on the other hand, is made of a non-conductive material such as resin or elastomer, and is positioned to cover the outer circumference of the plug shell 21.

[0023] A cable attachment section 23 for attaching cables such as electrical cables and optical fibers is provided on the front side of the plug housing 22. By connecting cables (not shown) via the cable attachment section 23 to the plug-side mating terminal 27, it becomes possible to transmit electrical signals, power, optical information, etc.

[0024] Furthermore, the plug housing 22 has a locking portion 24 formed therein, which serves as a fixing means to maintain the mated state between the plug connector 20 and the receptacle housing 41 (described later) when the plug connector 20 and the receptacle connector 30 are mated together. The locking portion 24 in this embodiment has the shape of a double-supported beam and has a claw shape 24a formed in its center. Therefore, when the plug connector 20 is inserted into the receptacle housing 41 (described later), the claw shape 24a in the center bends downward upon contact with the locking portion 45 formed as a fixing means on the receptacle housing 41 (described later), and when it overcomes the locking portion 45, the claw shape 24a returns to its original position and engages with the locking portion 45, thus functioning as a fixing means. Conversely, when the connector is mated, the user can press the locking portion 24 downwards in the -Z direction from above, causing the claw shape 24a in the center to bend and move downwards, releasing the engagement with the locked portion 45 of the receptacle housing 41, which will be described later. In this state, the user can then remove the plug connector 20 from the receptacle housing 41, which will be described later, thereby releasing the plug connector 20 from the mated state with the receptacle connector 30.

[0025] Furthermore, a plug opening 26 is formed on the upper rear side of the plug connector 20, which is open upwards. This plug opening 26 exposes the plug shell 21, which is installed inside the plug housing 22, to the upper side. This exposed area becomes the contact surface 25 of the plug shell 21. The heat conductive sheet 56, which is installed on the heat dissipation surface of the heat sink 51 (described later), comes into contact with the contact surface 25 of the upper surface of the plug shell 21, which is open upwards due to the plug opening 26, so that the heat sink 51 can dissipate the heat generated from the plug connector 20.

[0026] Furthermore, as shown in Figure 14, the contact surface 25 of the plug shell 21 is formed as an inclined surface that is tilted with respect to the front-rear direction (±Y direction), which is the first direction of this disclosure. In this embodiment, the contact surface 25 of the plug shell 21 is formed as an inclined surface that slopes downward as it goes towards the rear (-Y direction).

[0027] As shown in Figures 3 and 4, the receptacle connector 30 comprises a substrate 31, a receptacle housing 41, a heat sink 51, and a receptacle shell 61.

[0028] The circuit board 31 includes printed circuits (not shown) and is configured to transmit electrical signals, power, optical information, etc., by being electrically connected to a receptacle housing 41 mounted on the upper surface of the circuit board 31.

[0029] Furthermore, the substrate 31 has a plurality of mounting holes 32, as shown in Figure 4 in particular. The legs, terminals, etc., of the receptacle housing 41 and receptacle shell 61 are inserted into the plurality of mounting holes 32, thereby fixing these components to the substrate 31.

[0030] The receptacle housing 41 has an opening 42 that opens to the front, and by inserting and removing the plug connector 20 into and out of this opening 42, it is possible to achieve a mated state and an unmated state between the plug connector 20 and the receptacle connector 30.

[0031] Furthermore, a receptacle-side mating terminal 43 is located inside the receptacle housing 41. As shown in Figures 18, 23, and 28, this receptacle-side mating terminal 43 is surface-mounted to the circuit board 31 by soldering, and can be electrically connected to the circuit board 31, which includes printed circuits (not shown). When the plug connector 20 and the receptacle connector 30 are mated, the receptacle-side mating terminal 43 and the plug-side mating terminal 27 come into contact, allowing electrical signals, power, optical information, etc., from cables (not shown) to be transmitted to the circuit board 31 via the plug connector 20 and the receptacle connector 30.

[0032] Furthermore, an upward-opening hole 44 is formed in the upper center of the receptacle housing 41, allowing it to exit upward. This upward-opening hole 44 is shaped to allow the contact surface 25 of the plug shell 21, which is inserted into the opening 42 of the receptacle housing 41, and the heat dissipation surface (thermal conductive sheet 56) of the heat sink 51, which will be described later, to face each other and make contact.

[0033] Furthermore, as shown in Figure 4, a locking portion 45 is formed above and in front of the receptacle housing 41, serving as a means for fixing the locking portion 24 of the plug connector 20 to engage. The locking portion 45 is formed as a hole shape into which the claw shape 24a constituting the locking portion 24 can fit, and a horizontal wall surface in front of the hole shape. Therefore, when the plug connector 20 is inserted into the receptacle housing 41, the claw shape 24a constituting the locking portion 24 contacts the horizontal wall surface constituting the locking portion 45 of the receptacle housing 41 and bends downward. When it overcomes the horizontal wall surface constituting the locking portion 45, the claw shape 24a returns to its original position and engages with the hole shape constituting the locking portion 45, thus functioning as a fixing means. Conversely, when the connector is mated, the user can press the locking portion 24 downwards in the -Z direction from above, causing the claw shape 24a to bend and move downwards, disengaging from the hole shape that constitutes the locked portion 45 and releasing the engagement. In this state, the user can then remove the plug connector 20 from the receptacle housing 41, thereby releasing the plug connector 20 from the mated state with the receptacle connector 30.

[0034] The heat sink 51, as shown in Figures 5 to 7, has a base portion 52 that is flat at the bottom and multiple fin-shaped portions 53 that are formed as walls and extend upward from the base portion 52. The heat sink 51 is made of a metal material with high thermal conductivity, such as an aluminum alloy. Because the heat sink 51 has a large surface area due to the presence of the multiple fin-shaped portions 53 that are formed as walls, it is a component that has high heat dissipation efficiency.

[0035] Furthermore, since the plug shell 21, which is the target of heat dissipation by the heat sink 51, is located below the heat sink 51, a rectangular projection 54 is formed on the lower side of the base portion 52 that constitutes the heat sink 51. The lower side of this projection 54 is the heat dissipation surface of the heat sink 51, and therefore a thermal conductive sheet 56 is installed there. By installing the thermal conductive sheet 56 at the location that comes into contact with the plug shell 21, the thermal resistance (difficulty in transferring heat) can be reduced, and a higher heat dissipation effect can be achieved.

[0036] Furthermore, the lower surface of the heat sink 51 on which the heat conductive sheet 56, which serves as the heat dissipation surface, is installed, is formed as an inclined surface with an inclination with respect to the front-to-back direction (±Y direction), which is the first direction of this disclosure, as shown in Figure 7. In this embodiment, the heat dissipation surface constituting the lower side of the protrusion 54 of the heat sink 51 is formed as an inclined surface that slopes downward as it goes towards the rear (-Y direction). The heat dissipation surface of the heat sink 51 and the contact surface 25 of the plug shell 21 described above are inclined surfaces that are arranged facing each other in the fitted state, and their inclination angles are formed at approximately the same angle. Therefore, when the plug connector 20 is inserted into the opening 42 of the receptacle housing 41 and the fitted state is achieved, the heat dissipation surface (heat conductive sheet 56) of the heat sink 51 and the contact surface 25 of the plug shell 21 are configured to contact each other without any gaps.

[0037] Furthermore, cylindrical projections 57, consisting of four cylindrical protrusions projecting in the left-right direction, are formed on the left and right sides of the base portion 52 of the heat sink 51. These four cylindrical projections 57 are formed as guided portions of this disclosure. The four cylindrical projections 57 are components that fit into the cam grooves 62, which are guide portions of this disclosure formed in the receptacle shell 61, which will be described later.

[0038] The receptacle shell 61 is a component for mounting the heat sink 51 in a movable state relative to the receptacle housing 41. Specifically, the receptacle shell 61 has a total of four cam grooves 62, two on each of its left and right sides. These four cam grooves 62 are formed as guide portions in this disclosure. The four cylindrical projections 57 of the heat sink 51 are fitted into the four cam grooves 62, thereby supporting the heat sink 51 so that it can move relative to the receptacle shell 61 within the formation range of the four cam grooves 62. The groove shape of the four cam grooves 62 is formed to be approximately L-shaped.

[0039] Furthermore, as shown in Figures 8 to 10, the receptacle shell 61 has a pressing means 63 for pressing the heat sink 51, which is attached using the cam groove 62, forward (+Y direction), relative to the receptacle shell 61. In this embodiment, the pressing means 63 is formed as a cantilever spring with a cantilever beam shape, which is configured as an integral member with the receptacle shell 61.

[0040] Furthermore, as shown in Figures 8 to 10, the receptacle shell 61 has a stopper portion 65 that contacts the heat sink 51 when the heat sink 51, which is mounted using the cam groove 62, is pressed forward (+Y direction), which is the first positive direction, by the pressing force of the pressing means 63, thereby defining the stopping position of the heat sink 51. The stopper portion 65 defines the limit of the range of movement of the heat sink 51 in the forward (+Y direction), which is the first positive direction, as pressed by the pressing means 63.

[0041] The receptacle shell 61 of this embodiment has the above-described configuration, and is configured such that the receptacle connector 30 is completed by inserting it into the receptacle housing 41 from above downwards (-Z direction) with the heat sink 51 attached using the cam groove 62.

[0042] Referring to Figure 30, the dimensional conditions of the cam groove 62 formed in the receptacle shell 61 and the cylindrical projection 57 fitted into the cam groove 62 will be explained. In this embodiment, when the second directional dimension between the negative second directional portion (lower portion) on the positive first direction side (forward (+Y direction) side) of the cam groove 62 and the positive second directional portion (upper portion) on the negative first direction side (rear (-Y direction) side) of the cam groove 62 is α, and the second directional dimension (vertical direction (±Z direction) dimension), which is the diameter dimension of the cylindrical projection shape constituting the cylindrical projection 57, is β, α ≈ β The configuration is such that the following equation holds true. Therefore, the cam groove 62 formed in the receptacle shell 61 restricts the movement of the heat sink 51 in the negative second direction (downward (-Z direction)) when the heat sink 51 is positioned in the positive first direction (forward (+Y direction)) relative to the receptacle shell 61, and restricts the movement of the heat sink 51 in the positive second direction (upward (+Z direction)) when the heat sink 51 is positioned in the negative first direction (rearward (-Y direction)) relative to the receptacle shell 61. In other words, the heat sink 51 of this embodiment, which is supported so as to be movable in the first direction (front-back direction (±Y direction)) relative to the receptacle shell 61, is configured to move in a direction parallel to the first direction (front-back direction (±Y direction)).

[0043] The overall configuration of the electronic device 10 according to this embodiment has been described above with reference to Figures 1 to 14 and Figure 30. Next, the specific operation of the electronic device 10 according to this embodiment will be described in addition to the reference drawings in Figures 15 to 29. Here, Figures 15 to 19 show the un-mated state in which the plug connector 20 is not inserted into the opening 42 of the receptacle housing 41. Figures 20 to 24 show the state in which the plug connector 20 is partially inserted into the opening 42 of the receptacle housing 41. Furthermore, Figures 25 to 29 show the mated state in which the plug connector 20 is fully inserted into the opening 42 of the receptacle housing 41. Figure 30 shows the positional relationship of the cylindrical projection 57 with respect to the cam groove 62.

[0044] In the un-mated state, when the plug connector 20 is not inserted into the opening 42 of the receptacle housing 41 shown in Figures 15 to 19, the heat sink 51 is pressed forward (+Y direction), which is the first direction, by the pressing means 63 provided on the receptacle shell 61, particularly as shown in Figure 18. At this time, the front of the heat sink 51 is in contact with the stopper portion 65, and the cylindrical projections 57 provided on the left and right sides of the heat sink 51 are fitted into the cam grooves 62 provided on the receptacle shell 61. However, in the un-mated state, the lower (-Z direction) portion of the cylindrical projection 57 is inside the groove on the positive first direction side (forward (+Y direction) side) of the cam groove 62 provided on the receptacle shell 61, and is restricted from moving downward (-Z direction) from a predetermined vertical position (Z direction position).

[0045] As shown in Figure 18, the heat sink 51 has a protrusion 54 on its lower side, and a thermal conductive sheet 56 is installed on the heat dissipation surface that constitutes the lower side of the protrusion 54. The thermal conductive sheet 56 that constitutes the heat dissipation surface in this disclosure is formed as an inclined surface that slopes downward as it goes towards the rear (-Y direction). On the other hand, the plug connector 20 has a contact surface 25 of the plug shell 21 exposed upward so that the thermal conductive sheet 56 can make contact with it. The contact surface 25 of the plug shell 21 is also inclined in the same way as the heat dissipation surface (thermal conductive sheet 56) of the heat sink 51. The heat dissipation surface (thermal conductive sheet 56) of the heat sink 51 and the contact surface 25 of the plug shell 21 are formed with approximately the same inclination angle and are formed as inclined surfaces that face each other in the mated state, so that when the two inclined surfaces come into contact, they can make contact with each other without any gaps.

[0046] Figures 20 to 24 show the intermediate mating state, from the unmated state to the state in which the plug connector 20 is inserted into the opening 42 of the receptacle housing 41. In particular, Figure 23 shows the state in the intermediate mating state, where the contact surface 25 of the plug shell 21 and the heat conductive sheet 56, which is the heat dissipation surface of the heat sink 51, first come into contact as the plug connector 20 is being inserted into the opening 42 of the receptacle housing 41. At this point, the heat sink 51 is in the same position as in the unmated state. Also, in the state shown in Figure 23, the locking portion 24 of the plug connector 20 is in a state where the claw shape 24a is bent downward by contacting the horizontal wall surface that constitutes the locked portion 45, and the locking portion 24 and the locked portion 45 are not yet engaged.

[0047] Figures 25 to 29 show the mated state where the plug connector 20 is fully inserted into the opening 42 of the receptacle housing 41, after the mating process has been further deepened from the partially mated state described above. As the mating process is further deepened from the partially mated state described above, the heatsink 51 moves backward (-Y direction) together with the plug connector 20, while maintaining contact between the heat conductive sheet 56, which is the heat dissipation surface of the heatsink 51, and the contact surface 25 of the plug shell 21.

[0048] At this time, the cylindrical projection 57 of the heat sink 51 also moves backward (-Y direction) within the cam groove 62. However, as soon as it begins to move, the cylindrical projection 57 is restricted from moving upward (+Z direction) by the cam groove 62, and the heat sink 51 moves backward (-Y direction) in parallel with the plug connector 20. This operating mechanism is realized by making the vertical dimension (±Z direction dimension) α of the lower portion (-Z direction portion) on the front side (+Y direction side) and the upper portion (+Z direction portion) on the rear side (-Y direction side) of the cam groove 62 approximately the same as the diameter dimension β of the cylindrical projection 57 (α ≈ β), as shown in Figure 30.

[0049] Furthermore, when the mating is deepened from the intermediate mating state described above, the load applied to the heat sink 51 from the pressing means 63 towards the front (+Y direction) increases in proportion to the amount the heat sink 51 moves backward (-Y direction). The load from the pressing means 63, the force that the cylindrical projection 57 of the heat sink 51 receives downward (-Z direction) from the cam groove 62, and the force that the heat dissipation surface (thermal conductive sheet 56) of the heat sink 51 receives from the contact surface 25 of the plug shell 21 balance each other, thereby maintaining contact between the thermal conductive sheet 56 and the plug shell 21.

[0050] When mated, as shown in Figure 29, the heat sink 51 flexes the pressing means 63, so a force acts on the plug connector 20 in a forward (+Y direction) direction that would cause it to detach. However, as shown in Figure 28, the hole shapes that make up the locking part 24 and the locked part 45 engage with each other, so the force acting on the plug connector 20 in the detachment direction is absorbed by the locking part 24 and the locked part 45, thus maintaining the mated state.

[0051] Furthermore, with this type of electronic device, variations in the dimensions of each component, including the locking portion 24, inevitably lead to variations in the mating depth. If the heat sink 51 is fixed to the receptacle shell 61 and cannot move in the front-back, up-down, or (YZ) directions, then each component will hardly undergo any elastic displacement, and this variation in mating depth will cause significant variations in the contact force between the thermal conductive sheet 56 and the plug shell 21.

[0052] However, in the case of the electronic device 10 according to this embodiment, the heat sink 51 is movable in the front-rear direction (±Y direction) together with the plug connector 20, so that the cantilever spring of the pressing means 63 undergoes elastic displacement, which reduces the variation in the contact force between the heat conductive sheet 56 and the plug shell 21 due to the aforementioned variations.

[0053] Furthermore, since both the heat sink 51 and the plug connector 20 move parallel to each other in the front-to-back direction (±Y direction) from the mating stage to the mated state, the thermal conductive sheet 56 and the plug shell 21 can be brought into contact with almost no sliding.

[0054] By operating as described above, a mating state is achieved in which the plug connector 20 is fully inserted into the opening 42 of the receptacle housing 41, as shown in Figures 25 to 29.

[0055] In this embodiment, the cam groove 62 is formed in a roughly L-shape. Although the relief of the groove shape below the cam groove 62 (in the -Z direction) is longer than necessary given the operation described above, this shape was adopted to facilitate the assembly of the heat sink 51 to the receptacle shell 61.

[0056] The above describes the operation of inserting the plug connector 20 into the opening 42 of the receptacle housing 41. Next, the operation of removing the plug connector 20 from the opening 42 of the receptacle housing 41 will be described.

[0057] When performing the detachment operation, the user presses the locking part 24 downwards (-Z direction) from above, causing the claw shape 24a to bend and move downwards, releasing the engagement between the locking part 24 and the locked part 45. While maintaining this state, the user can perform the detachment operation by pulling the plug connector 20 forward (+Y direction). At this time, the pressing means 63 pushes the heat sink 51 forward (+Y direction), and the cylindrical projection 57 of the heat sink 51 moves forward (+Y direction) within the groove of the cam groove 62, returning the heat sink 51 to its partially fitted state. In this detachment operation as well, when the heat conductive sheet 56, which is the heat dissipation surface, and the contact surface 25 of the plug shell 21 are in contact, the heat sink 51 moves forward (+Y direction) together with the plug connector 20, so the heat conductive sheet 56 and the plug shell 21 can be detached with almost no sliding.

[0058] As described above, with the electronic device 10 according to this embodiment, when the plug connector 20 is inserted into the opening 42 of the receptacle housing 41 and mated, the contact surface 25 of the plug shell 21 and the heat dissipation surface (thermal conductive sheet 56) of the heat sink 51 come into contact with almost no friction, allowing the heat sink 51 to efficiently dissipate the heat generated from the plug connector 20. Furthermore, according to this embodiment, a mechanism for the heat sink 51 to efficiently dissipate the heat generated from the plug connector 20 can be realized with a simple configuration.

[0059] While preferred embodiments of this disclosure have been described above, the technical scope of this disclosure is not limited to the embodiments described above. Various modifications or improvements can be made to the above embodiments.

[0060] For example, in the embodiment described above, the pressing means 63 was a cantilever spring with a cantilever beam shape formed on the receptacle shell 61. However, the pressing means of the present disclosure can be formed as a double-sided spring with a double-sided beam shape.

[0061] Furthermore, for example, in the embodiment described above, the pressing means 63 was configured as an integral component with the receptacle shell 61. However, the pressing means of this disclosure can also be configured as a separate component from the receptacle shell. Specifically, by forming the pressing means of this disclosure as a coil spring or leaf spring separate from the receptacle shell 61 and installing it between the receptacle shell 61 and the heat sink 51, it is possible to realize an electronic device that exhibits the same effects as the embodiment described above.

[0062] Furthermore, in the embodiment described above, a configuration was illustrated in which a thermal conductive sheet 56 is installed on the heat dissipation surface of the heat sink 51 that contacts the contact surface 25 of the plug shell 21. However, in the electronic device of this disclosure, the installation of the thermal conductive sheet 56 can be omitted.

[0063] Furthermore, in the embodiment described above, for example, the guide portion formed on the receptacle shell 61 is formed as a cam groove 62 having a groove shape, and the guided portion formed on the heat sink 51 is formed as a cylindrical projection 57 having a cylindrical projection shape that fits into the groove shape of the cam groove 62, which is the guide portion. However, regarding the shape of the guide portion and the guided portion in this disclosure, any shape can be adopted as long as it can achieve the same effects as in the embodiment described above.

[0064] Furthermore, although the above-described embodiment assumed that the electronic device 10 is an optical transceiver, such an embodiment is merely one example of the possible forms that the electronic device of this disclosure can take. The electronic device of this disclosure can be applied to all kinds of electronic devices, within the scope that it can exert effects similar to those that the above-described embodiment can exert.

[0065] It is clear from the claims that such modified or improved forms may also fall within the technical scope of this disclosure. [Explanation of Symbols]

[0066] 10 Electronic equipment 20 Plug Connectors 21 Plug Shells 22 Plug Housing 23 Cable mounting section 24 Locking mechanism (fixing means) 24a Claw shape 25 Contact surface 26 Plug opening 27 Plug-side mating terminal 30 Receptacle Connectors 31 circuit boards 32 mounting holes 41 Receptacle Housing 42 Opening 43 Receptacle-side mating terminal 44 Upper open hole 45 Locking portion (fixing means formed by a horizontal wall surface and a hole shape) 51 Heatsink 52 Base section 53 Fin-shaped section 54 Protrusion 56. Thermal conductive sheet (heat-dissipating surface) 57 Cylindrical protrusion (guided part) 61 Receptacle Shell 62 Cam groove (guide section) 63. Pressing means (cantilever spring with a cantilever beam shape) 65 Stopper section

Claims

1. A plug connector including a plug shell and a plug housing, A receptacle housing having an opening from which the plug connector can be inserted and removed, A heat sink is installed via a receptacle shell attached to the receptacle housing, thereby being movably installed relative to the receptacle housing, Equipped with, An electronic device in which, when the plug connector is inserted into the opening of the receptacle housing and mated, the contact surface of the plug shell and the heat dissipation surface of the heat sink come into contact, thereby causing the heat sink to dissipate heat generated from the plug connector, The insertion and removal direction of the plug connector into the opening of the receptacle housing is defined as the first direction, and the removal direction of the plug connector into the opening is defined as the positive first direction, and the insertion direction is defined as the negative first direction, When the direction perpendicular to the first direction is defined as the second direction, and the direction in which the heat dissipation surface of the heat sink is positioned relative to the plug shell in the fitted state is defined as the positive second direction, and the direction in which the plug shell is positioned relative to the heat dissipation surface of the heat sink is defined as the negative second direction, The heat sink is supported so as to be movable in a first direction relative to the receptacle shell, The contact surface of the plug shell and the heat dissipation surface of the heat sink are both formed as inclined surfaces with an inclination with respect to the first direction. A pressing means is positioned between the heat sink and the receptacle shell to press the heat sink in a positive first direction relative to the receptacle shell. The receptacle shell is provided with a guide portion that restricts the movement of the heat sink in the negative second direction when the heat sink is positioned in the positive first direction relative to the receptacle shell, and restricts the movement of the heat sink in the positive second direction when the heat sink is positioned in the negative first direction relative to the receptacle shell. The electronic device is characterized in that the heat sink has a guided portion that is guided by the guide portion formed on the receptacle shell.

2. The electronic device according to claim 1, The aforementioned guide portion is formed as a cam groove having a groove shape, The guided portion is formed as a cylindrical projection that fits into the groove shape of the cam groove, Let α be the second dimension between the negative second direction portion on the positive first direction side of the cam groove and the positive second direction portion on the negative first direction side of the cam groove. When the second directional dimension, which is the diameter dimension of the cylindrical projection shape constituting the aforementioned cylindrical projection, is denoted as β, α≒β An electronic device characterized by being configured such that the following mathematical formula holds true.

3. The electronic device according to claim 1 or 2, The plug housing is formed with a locking mechanism, The receptacle housing has a locking portion formed therein, which serves as a means of being fixed. An electronic device characterized in that, when the plug connector is inserted into the opening of the receptacle housing and mated, the locking portion and the locked portion engage, thereby maintaining the mated state of the plug connector with respect to the receptacle housing against the pressing force exerted by the pressing means.

4. The electronic device according to claim 1 or 2, The electronic device is characterized in that the pressing means is configured as a component integrated with the receptacle shell.

5. The electronic device according to claim 1 or 2, The electronic device is characterized in that the pressing means is configured as a separate component from the receptacle shell.

6. The electronic device according to claim 1 or 2, The electronic device is characterized in that the pressing means is formed as a cantilever spring having a cantilever beam shape, or as a double-sided spring having a double-sided beam shape.

7. The electronic device according to claim 1 or 2, An electronic device characterized in that a heat conductive sheet is installed on the heat dissipation surface of the heat sink.

8. The electronic device according to claim 2, An electronic device characterized in that the groove shape of the guide portion, which is formed as a cam groove, is formed in a substantially L-shape.