Three-dimensional heat dissipation device

Abstract

A three-dimensional heat dissipation device includes a flat plate type vapor chamber, a plurality of U-shaped heat pipes, and a plurality of I-shaped heat pipes. The plurality of U-shaped heat pipes are communicated with the flat plate type vapor chamber, and the plurality of I-shaped heat pipes are also communicated with the flat plate type vapor chamber. Wherein, along the direction from the air inlet to the air outlet, the I-shaped heat pipes are located in the middle of the U-shaped heat pipes to improve the heat dissipation efficiency.

Description

Technical Field

[0001] This invention relates to a heat dissipation device. In particular, it relates to a three-dimensional heat dissipation device. Background Technology

[0002] With the advancement of technology, electronic products have become increasingly widespread, gradually changing the lifestyles and work patterns of many people. As computer computing power continues to increase, temperature control of electronic components such as central processing units and graphics chips is becoming increasingly important.

[0003] Electronic components such as central processing units (CPUs) and graphics chips generate heat during operation and require proper cooling to achieve optimal performance. To ensure that these components operate at ideal temperatures, a suitable dual-cooling (air and liquid) three-dimensional heat dissipation system configuration will significantly impact the performance of these electronic devices.

[0004] Furthermore, as the number of cores in computing chips continues to increase, the heat generated by computing chips is also increasing.

[0005] Therefore, effectively improving the heat dissipation efficiency of heat dissipation devices to reduce the operating temperature of computing chips will help improve the overall operating efficiency of electronic devices. Utility Model Content

[0006] This novel content is intended to provide a simplified summary of the disclosure to enable the reader to have a basic understanding of it. This novel content is not a complete overview of the disclosure and is not intended to identify key / critical elements of the embodiments of the invention or to define the scope of the invention.

[0007] One objective of this invention is to provide a three-dimensional heat dissipation device that can effectively improve heat dissipation efficiency, thereby improving the overall working efficiency of electronic devices.

[0008] To achieve the above objectives, one embodiment of this disclosure provides a three-dimensional heat dissipation device comprising a flat vapor chamber, a plurality of U-shaped heat pipes, and a plurality of I-shaped heat pipes. The plurality of U-shaped heat pipes are connected to the flat vapor chamber, and the plurality of I-shaped heat pipes are also connected to the flat vapor chamber. The I-shaped heat pipes are located in the middle of the U-shaped heat pipes along the air inlet direction to the air outlet direction.

[0009] In some embodiments, the I-shaped heat pipe includes multiple circular heat pipes and multiple flat heat pipes.

[0010] In some embodiments, the circular heat pipes are positioned between the flat heat pipes along the air inlet direction to the air outlet direction.

[0011] In some embodiments, the three-dimensional heat dissipation device further includes a heat dissipation fin module, wherein U-shaped heat pipes and I-shaped heat pipes are inserted into the heat dissipation fin module.

[0012] In some embodiments, the heat dissipation fin module includes multiple intermediate heat dissipation fins and multiple side heat dissipation fins, with the side heat dissipation fins mounted on both sides of the intermediate heat dissipation fins.

[0013] In some embodiments, the intermediate heat dissipation fins include multiple openings, and I-shaped heat pipes pass through the openings.

[0014] In some embodiments, the side heat dissipation fins include multiple notches, and the U-shaped heat pipes are housed within the notches.

[0015] In some embodiments, the heat sink module further includes multiple top heat sink fins mounted above the middle heat sink fins.

[0016] In some embodiments, side heat dissipation fins are mounted on both sides of the middle heat dissipation fins and clamp the vertical section of the U-shaped heat pipe, while the top heat dissipation fins are mounted above the middle heat dissipation fins and below the horizontal section of the U-shaped heat pipe, wherein the side heat dissipation fins are stacked horizontally on each other, the middle heat dissipation fins are stacked horizontally on each other, and the top heat dissipation fins are arranged vertically on each other.

[0017] In some embodiments, the height of the top heat dissipation fins is less than the height between the bottom of the U-shaped heat pipe and the top of the I-shaped heat pipe.

[0018] In some embodiments, the three-dimensional heat dissipation device further includes a top heat dissipation fixing module for fixing the top heat dissipation fins to the U-shaped heat pipe.

[0019] In some embodiments, the top heat dissipation fixing module includes a top heat dissipation fin plate, a top base plate, and multiple fixing brackets. The top heat dissipation fin plate and the top base plate are used to clamp the U-shaped heat pipe, while the fixing brackets are fixed to the top heat dissipation fin plate and support the top heat dissipation fin plate.

[0020] In some embodiments, the top heat sink includes a top heat sink, a plurality of first top fins and a plurality of second top fins, the first top fins and the second top fins being respectively disposed on opposite sides of the top heat sink, extending vertically downward and arranged parallel to each other.

[0021] In some embodiments, the three-dimensional heat dissipation device further includes a bottom heat dissipation fin plate mounted above a flat vapor chamber to support the heat dissipation fin module above.

[0022] In some embodiments, the bottom heat sink includes a bottom heat sink and a plurality of bottom fins, the bottom fins extending vertically upward from the bottom heat sink and arranged parallel to each other.

[0023] Therefore, this novel three-dimensional heat dissipation device can utilize a flat heat spreader combined with U-shaped heat pipes and I-shaped heat pipes, and use the U-shaped heat pipes to cover the I-shaped heat pipes, thereby increasing the heat dissipation area and heat dissipation efficiency of the three-dimensional heat dissipation device. Furthermore, by utilizing the unidirectional flow of the heat dissipation fluid within the U-shaped heat pipes, the flow efficiency of the heat dissipation fluid in the heat pipes is effectively avoided by the liquid phase heat dissipation fluid, further increasing the heat dissipation efficiency of the three-dimensional heat dissipation device. Attached Figure Description

[0024] To make the above and other objects, features, advantages and embodiments of this disclosure more apparent and understandable, the accompanying drawings are described below:

[0025] Figure 1 This is a perspective view of a three-dimensional heat dissipation device according to an embodiment of the present invention.

[0026] Figure 2 This is a three-dimensional exploded view of a three-dimensional heat dissipation device according to an embodiment of the present invention.

[0027] Figure 3 This is a side view of a three-dimensional heat dissipation device with heat pipes and a flat vapor chamber, according to an embodiment of the present invention.

[0028] Figure 4 This is a top view schematic diagram of the heat pipes and bottom heat dissipation fins of a three-dimensional heat dissipation device according to an embodiment of the present invention.

[0029] Figure 5 This is a side view of the heat pipe and flat vapor chamber of a three-dimensional heat dissipation device according to an embodiment of the present invention.

[0030] The reference numerals in the attached figures are explained as follows:

[0031] 100: Three-dimensional heat dissipation device

[0032] 110: Flat plate heat exchanger

[0033] 120: U-shaped heat pipe

[0034] 121: Vertical segment

[0035] 122: Horizontal segment

[0036] 123: Connection end

[0037] 124: Connection end

[0038] 130: I-shaped heat pipe

[0039] 132: Circular heat pipe

[0040] 134: Flat heat pipe

[0041] 140: Heatsink fin module

[0042] 141: Altitude

[0043] 142: Middle heat dissipation fins

[0044] 143: Opening

[0045] 144: Side heat dissipation fins

[0046] 145: Notch

[0047] 146: Top heat dissipation fins

[0048] 150: Top heat dissipation mounting module

[0049] 151: Altitude

[0050] 152: Top heat dissipation fins

[0051] 154: Top substrate

[0052] 156: Fixed bracket

[0053] 160: Outer shell

[0054] 170: Bottom heat dissipation fins

[0055] 180: Fixture

[0056] 210: Top heat sink

[0057] 220: First top fin

[0058] 230: Second top fin

[0059] 240: Bottom heat sink

[0060] 250: Bottom fins

[0061] 301: Direction of heat dissipation fluid flow

[0062] 302: Direction of heat dissipation fluid flow

[0063] 303: Direction of heat dissipation fluid flow

[0064] 304: Air Inlet Direction

[0065] 305: Air outlet direction

[0066] 306: Altitude Detailed Implementation

[0067] The following is a detailed description of embodiments in conjunction with the accompanying drawings. However, the provided embodiments are not intended to limit the scope of this disclosure, and the description of the structural operation is not intended to limit the order of execution. Any structure resulting from the recombination of elements and producing an apparatus with equivalent functionality is within the scope of this disclosure. Furthermore, the drawings are for illustrative purposes only and are not drawn to their original dimensions. For ease of understanding, the same or similar elements will be designated with the same symbols in the following description.

[0068] Furthermore, the terms used throughout this specification and claims, unless otherwise specified, generally have their ordinary meaning in the context of this art, the content of this disclosure, and the specific content thereof. Certain terms used to describe this disclosure will be discussed below or elsewhere in this specification to provide additional guidance to those skilled in the art in describing this disclosure.

[0069] In the embodiments and claims, unless otherwise specified in the text, "a" and "the" may refer to one or more. The numbers used in the steps are only for indicating the steps for ease of description, and are not used to limit the order or implementation method.

[0070] Secondly, the terms “contains,” “includes,” “has,” “contains,” etc., used in this article are all open-ended terms, meaning that they include but are not limited to.

[0071] Figure 1 This is a three-dimensional schematic diagram of a heat dissipation device according to an embodiment of the present invention. Figure 2 Here is a 3D explosion diagram. Figure 3 , Figure 4 and Figure 5 These are side view diagrams, top view diagrams, and side view diagrams from another direction for some components of the three-dimensional heat dissipation device.

[0072] First refer to Figure 2 As shown in the figure, the three-dimensional heat dissipation device 100 includes a flat vapor chamber 110, multiple U-shaped heat pipes 120, and multiple I-shaped heat pipes 130. The flat vapor chamber 110 is used to directly or indirectly contact heat sources, such as central processing units or graphics chips. The U-shaped heat pipes 120 and I-shaped heat pipes 130 are connected to the flat vapor chamber 110 to facilitate the flow of heat dissipation fluid, thereby carrying heat away from the flat vapor chamber 110 to dissipate heat from the heat source. Specifically, the U-shaped heat pipe 120 includes a horizontal section 122 and two vertical sections 121. The two vertical sections 121 are respectively connected to the two opposite connecting ends 123 and 124 of the horizontal section 122, and the vertical sections 121 are positioned on the flat vapor chamber 110. The I-shaped heat pipes 130 are vertically positioned heat pipes on the flat vapor chamber 110.

[0073] It is worth noting that, see also Figure 3 Along the air inlet direction 304 to the air outlet direction 305, the I-shaped heat pipe 130 is preferably installed in the middle of the U-shaped heat pipe 120. In other words, when the cooling air enters the three-dimensional heat dissipation device 100, along the air inlet direction 304, it first passes through a vertical section 121 of the U-shaped heat pipe 120, then through the area of ​​the I-shaped heat pipe 130, then through the other vertical section 121 of the U-shaped heat pipe 120, and leaves the three-dimensional heat dissipation device 100 by the air outlet direction 305.

[0074] By covering the I-shaped heat pipe 130 with the U-shaped heat pipe 120, the effective heat dissipation area can be increased, while the flow efficiency of the heat dissipation fluid can be improved, and the interference between the gas phase and liquid phase of the heat dissipation fluid can be reduced, thereby effectively improving the heat dissipation efficiency of the three-dimensional heat dissipation device 100.

[0075] See also Figures 2 to 5 The aforementioned I-shaped heat pipe 130 includes a plurality of circular heat pipes 132 and a plurality of flat heat pipes 134.

[0076] It is worth noting that, along the air inlet direction 304 to the air outlet direction 305, the circular heat pipe 132 is preferably installed between the flat heat pipes 134. In other words, when the cooling air enters the three-dimensional heat dissipation device 100, along the air inlet direction 304, it first passes through a vertical section 121 of the U-shaped heat pipe 120, then through the area of ​​the flat heat pipe 134 of the I-shaped heat pipe 130, then through the area of ​​the circular heat pipe 132 of the I-shaped heat pipe 130, then through the area of ​​the flat heat pipe 134 of the I-shaped heat pipe 130, and finally through the other vertical section 121 of the U-shaped heat pipe 120, and leaves the three-dimensional heat dissipation device 100 by the air outlet direction 305.

[0077] In some embodiments, the U-shaped heat pipe 120 is a flat U-shaped heat pipe. Therefore, at the air outlet and air inlet of the three-dimensional heat dissipation device 100, the heat pipe is preferably formed by a flat heat pipe, while in the middle region of the three-dimensional heat dissipation device 100, the heat pipe is preferably formed by a circular heat pipe, so as to effectively reduce the resistance of air inlet and outlet, increase the flow rate of heat dissipation air, and improve the heat dissipation efficiency of the three-dimensional heat dissipation device 100.

[0078] In some embodiments, the three-dimensional heat dissipation device 100 further includes a heat dissipation fin module 140, and the U-shaped heat pipe 120 and the I-shaped heat pipe 130 are disposed in the heat dissipation fin module 140 to remove heat from the heat source in the heat pipe via the heat dissipation fin module 140.

[0079] The heat dissipation fluid in the U-shaped heat pipe 120 first moves upward along the heat dissipation fluid flow direction 301. At this time, the heat dissipation fluid is generally in the gas phase. Then, above the U-shaped heat pipe 120, it moves horizontally along the heat dissipation fluid flow direction 302. In addition, the condensed heat dissipation fluid can move downward along the heat dissipation fluid flow direction 303 or drip onto the flat plate heat exchanger 110 along the capillary structure in the U-shaped heat pipe 120 to recirculate heat dissipation.

[0080] In some embodiments, the heat dissipation fin module 140 includes a plurality of intermediate heat dissipation fins 142 stacked horizontally, a plurality of side heat dissipation fins 144 stacked horizontally, and a plurality of top heat dissipation fins 146 arranged vertically. The side heat dissipation fins 144 are mounted on both sides of the intermediate heat dissipation fins 142 and clamp the vertical section 121 of the U-shaped heat pipe 120, while the top heat dissipation fins 146 are mounted above the intermediate heat dissipation fins 142 and below the horizontal section 122 of the U-shaped heat pipe 120.

[0081] In some embodiments, the intermediate heat dissipation fin 142 includes a plurality of openings 143, and the I-shaped heat pipe 130 preferably passes through the openings 143.

[0082] In some embodiments, the side heat dissipation fins 144 include a plurality of recesses 145, and the U-shaped heat pipe 120 is preferably accommodated in the recesses 145.

[0083] In some embodiments, the intermediate heat dissipation fins 142 are preferably divided into multiple blocks, and the height 141 of each block is less than the height 306 between the bottom of the U-shaped heat pipe 120 and the top of the I-shaped heat pipe 130, so as to facilitate the phased installation of the intermediate heat dissipation fins 142 and allow the I-shaped heat pipe 130 to pass through the opening 143 of the intermediate heat dissipation fins 142. Each block preferably includes multiple intermediate heat dissipation fins 142.

[0084] In addition, the side heat dissipation fins 144 approach the U-shaped heat pipe 120 from both sides, and facilitate the placement of the vertical sections 121 on both sides of the U-shaped heat pipe 120 into the recesses 145 of the side heat dissipation fins 144.

[0085] In some embodiments, the height 151 of the top heat sink 146 is also less than the height 306 between the bottom of the U-shaped heat pipe 120 and the top of the I-shaped heat pipe 130. Therefore, when the middle heat sink 142 is installed in the area of ​​the I-shaped heat pipe 130, the top heat sink 146 can be installed laterally in the space between the bottom of the U-shaped heat pipe 120 and the top of the I-shaped heat pipe 130.

[0086] See also Figure 1 and Figure 2The three-dimensional heat dissipation device 100 further includes a top heat dissipation fixing module 150 to facilitate the installation and fixing of the top heat dissipation fins 146 to one side of the horizontal section 122 of the U-shaped heat pipe 120.

[0087] In some embodiments, the top heat dissipation fixing module 150 includes a top heat dissipation fin plate 152 having a top heat dissipation plate 210, a plurality of first top fins 220 and a plurality of second top fins 230, a top base plate 154, and a plurality of fixing brackets 156. The top heat dissipation fin plate 152 and the top base plate 154 are used to clamp the upper horizontal section of the U-shaped heat pipe 120. The first top fins 220 and the second top fins 230 are respectively disposed on opposite sides of the top heat dissipation plate 210, extending vertically downward and arranged parallel to each other. In addition, the fixing brackets 156 are preferably fixed to the top heat dissipation fin plate 152 from both sides and are used to support the top heat dissipation fins 146, so as to effectively fix the fixing brackets 156, the top heat dissipation fin plate 152, the top base plate 154, and the U-shaped heat pipe 120 by means of fixing devices, such as screws.

[0088] In some embodiments, the three-dimensional heat dissipation device 100 further includes a bottom heat dissipation fin plate 170 having a bottom heat dissipation plate 240 and a plurality of bottom fins 250, the bottom fins 250 extending vertically upward from the bottom heat dissipation plate 240 and arranged parallel to each other. In addition, the bottom heat dissipation fin plate 170 is mounted above the flat plate heat exchanger 110 to support the heat dissipation fin module 140 above it.

[0089] In some embodiments, the fins of the top heat dissipation fin 152 and the bottom heat dissipation fin 170 may be skived fins, die-casting fins, extrusion fins, machined fins, and / or forged fins, all of which do not depart from the spirit and protection scope of this invention.

[0090] In some embodiments, the three-dimensional heat dissipation device 100 further includes a fixing device 180 through which the bottom heat dissipation fins 170 are inserted to fix the three-dimensional heat dissipation device 100 to the circuit board and to make the three-dimensional heat dissipation device 100 contact the heat source so as to effectively dissipate the heat source.

[0091] In some embodiments, the three-dimensional heat dissipation device 100 further includes a housing 160 covering the flat heat spreader 110, the U-shaped heat pipe 120 and the I-shaped heat pipe 130, so as to guide the heat dissipation air from the air inlet direction 304 to the air outlet direction 305.

[0092] Therefore, the heat dissipation fluid flows unidirectionally in the U-shaped heat pipe 120, and the flow of heat dissipation vapor is not hindered by the condensed heat dissipation liquid.

[0093] In summary, the three-dimensional heat dissipation device disclosed in this invention can utilize a flat heat spreader combined with a U-shaped heat pipe and an I-shaped heat pipe, and use the U-shaped heat pipe to cover the I-shaped heat pipe, thereby increasing the heat dissipation area and heat dissipation efficiency of the three-dimensional heat dissipation device. Furthermore, by utilizing the unidirectional flow of the heat dissipation fluid in the U-shaped heat pipe, the flow efficiency of the heat dissipation fluid in the heat pipe is effectively avoided by the liquid phase heat dissipation fluid, further increasing the heat dissipation efficiency of the three-dimensional heat dissipation device.

[0094] Although this disclosure has been described above with reference to embodiments, it is not intended to limit this disclosure. Any person skilled in the art can make various modifications and refinements without departing from the spirit and scope of this disclosure. Therefore, the scope of protection of this disclosure shall be determined by the appended claims.

Claims

1. A three-dimensional heat dissipation device, characterized in that, Include: A flat-plate heat spreader; Multiple U-shaped heat pipes are connected to the flat vapor chamber; and Multiple I-shaped heat pipes are connected to the flat vapor chamber, wherein the multiple I-shaped heat pipes are located in the middle of the multiple U-shaped heat pipes along the air inlet direction to the air outlet direction.

2. The three-dimensional heat dissipation device as described in claim 1, characterized in that, These multiple I-shaped heat pipes include: Multiple circular heat pipes; and Multiple flat heat pipes.

3. The three-dimensional heat dissipation device as described in claim 2, characterized in that, Along the air inlet direction to the air outlet direction, the plurality of circular heat pipes are located between the plurality of flat heat pipes.

4. The three-dimensional heat dissipation device as described in claim 1, characterized in that, It also includes a heat dissipation fin module, in which the plurality of U-shaped heat pipes and the plurality of I-shaped heat pipes are inserted.

5. The three-dimensional heat dissipation device as described in claim 4, characterized in that, The heat sink module includes: Multiple intermediate heat dissipation fins; and Multiple side heat dissipation fins are installed on both sides of the multiple middle heat dissipation fins.

6. The three-dimensional heat dissipation device as described in claim 5, characterized in that, The multiple intermediate heat dissipation fins include: Multiple openings, through which multiple I-shaped heat pipes are inserted.

7. The three-dimensional heat dissipation device as described in claim 6, characterized in that, The multiple side heat dissipation fins include: Multiple notches, wherein the multiple U-shaped heat pipes are housed within the multiple notches.

8. The three-dimensional heat dissipation device as described in claim 5, characterized in that, The heat sink module further includes: Multiple top heat dissipation fins are mounted above the multiple middle heat dissipation fins.

9. The three-dimensional heat dissipation device as described in claim 8, characterized in that, The multiple side heat dissipation fins are installed on both sides of the multiple middle heat dissipation fins and clamp the vertical sections of the multiple U-shaped heat pipes, while the multiple top heat dissipation fins are installed above the multiple middle heat dissipation fins and below the horizontal sections of the U-shaped heat pipes. The multiple side heat dissipation fins are stacked horizontally on each other, the multiple middle heat dissipation fins are stacked horizontally on each other, and the multiple top heat dissipation fins are arranged vertically on each other.

10. The three-dimensional heat dissipation device as described in claim 9, characterized in that, The height of the multiple top heat dissipation fins is less than the height between the bottom of the U-shaped heat pipe and the top of the multiple I-shaped heat pipes.

11. The three-dimensional heat dissipation device as described in claim 9, characterized in that, It also includes a top heat dissipation fixing module for fixing the multiple top heat dissipation fins to the multiple U-shaped heat pipes.

12. The three-dimensional heat dissipation device as described in claim 11, characterized in that, The top heat dissipation mounting module includes: A top heat dissipation fin plate; A top substrate, wherein the top heat dissipation fins and the top substrate are used to clamp the plurality of U-shaped heat pipes; and Multiple mounting brackets are fixed to the top heat dissipation fin plate and support the multiple top heat dissipation fins.

13. The three-dimensional heat dissipation device as described in claim 12, characterized in that, The top heat dissipation fin plate includes a top heat dissipation plate, a plurality of first top fins and a plurality of second top fins. The plurality of first top fins and the plurality of second top fins are respectively disposed on opposite sides of the top heat dissipation plate, and extend vertically downward and are arranged parallel to each other.

14. The three-dimensional heat dissipation device as described in claim 13, characterized in that, It also includes: A bottom heat dissipation fin plate is installed above the flat heat spreader to support the heat dissipation fin module above.

15. The three-dimensional heat dissipation device as described in claim 14, characterized in that, The bottom heat dissipation fin plate includes a bottom heat dissipation plate and multiple bottom fins, which extend vertically upward from the bottom heat dissipation plate and are arranged parallel to each other.

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