A notebook computer radiator using thermoelectric effect and phase change cold storage and a use method thereof

Abstract

The application discloses a notebook computer radiator based on thermoelectric effect and phase change cold storage and a use method, and relates to the field of notebook computer radiators. The notebook computer radiator comprises a main heat dissipation module, a thermoelectric refrigeration module and a phase change cold storage module, wherein the phase change cold storage module comprises a cold storage space filled with phase change medium, and the refrigeration surface of the thermoelectric refrigeration module is attached to the phase change cold storage module; the main heat dissipation module comprises an upper cover plate arranged on the top of the phase change cold storage module, and the upper cover plate is provided with heat dissipation holes, so that a main heat dissipation air duct is formed between the main heat dissipation module and the phase change cold storage module. When the notebook computer generates a large amount of heat during high-load work, the phase change material is used to store cold energy, and combined with air cooling and thermoelectric effect, the notebook computer can be cooled, and high-power and high-energy-efficiency heat dissipation of the notebook computer is realized.

Description

Technical Field

[0001] This invention belongs to the field of new energy utilization technology, and in particular relates to a laptop cooler with thermoelectric effect and phase change cold storage and its usage method. Background Technology

[0002] Compared to traditional desktop computers, laptops have the advantages of small size and portability, but this also results in very limited heat dissipation capabilities. Furthermore, with the rapid development of modern chip technology, the performance of core components in laptops, such as the CPU and GPU, is constantly improving, leading to greater heat generation. For electronic devices like laptops, high heat generation means rising device temperatures, CPU and GPU throttling, and performance degradation. In addition, high temperatures severely impact battery capacity and lifespan, thus heat dissipation efficiency is a major constraint on the development of laptops.

[0003] Due to the limited space and compact electronic components inside laptops, optimizing the internal cooling system is extremely difficult. External auxiliary cooling devices, which can improve heat dissipation efficiency without altering the laptop's structure, have become a research hotspot in this field. Currently, the market mainly offers laptop stands, air coolers, and other external auxiliary cooling devices. However, these devices suffer from low cooling power and efficiency, making it difficult to meet the cooling requirements of laptops under high loads. Summary of the Invention

[0004] Purpose of the invention: In order to solve the technical problem of low heat dissipation efficiency of current auxiliary heat dissipation devices for laptops, the present invention provides a laptop heat sink and its usage method based on thermoelectric effect and phase change cold storage. When the laptop is working under high load and generates a lot of heat, the heat sink can combine the cold storage of phase change material with air cooling and thermoelectric effect to achieve high power and high energy efficiency heat dissipation of the laptop.

[0005] Summary of the Invention: To achieve the above objectives, the present invention provides a laptop cooler based on thermoelectric effect and phase change cold storage, comprising a main heat dissipation module, a thermoelectric cooling module, and a phase change cold storage module. The phase change cold storage module includes a cold storage space filled with a phase change medium, and the cooling surface of the thermoelectric cooling module is in contact with the phase change cold storage module. The main heat dissipation module includes an upper cover plate arranged on top of the phase change cold storage module, and heat dissipation holes are distributed on the upper cover plate. A main heat dissipation airflow is formed between the main heat dissipation module and the phase change cold storage module.

[0006] Furthermore, the bottom of the upper cover plate is provided with main air duct heat dissipation fins, and the main air duct is provided with a main air duct axial fan to enhance heat dissipation efficiency.

[0007] Furthermore, the bottom of the upper cover is equipped with a lifting structure for adjusting the height of the upper cover, thereby selecting the appropriate cooling method according to the load status of the laptop. This lifting structure is a commonly used structure, such as a lifting stand, a flip stand, or a folding stand, which simply allows for height adjustment.

[0008] Furthermore, the upper cover is preferably set at an angle of 20 to 40 degrees to improve user comfort.

[0009] Furthermore, the thermoelectric cooling module includes a Peltier module made of semiconductor material and insulating thermally conductive partitions located on both sides of the Peltier module, wherein the insulating thermally conductive partition on the cold side is attached to the phase change cold storage module, and the insulating thermally conductive partition on the hot side dissipates heat through heat dissipation fins in the secondary air duct.

[0010] Furthermore, the laptop cooler also includes a lower housing for accommodating the thermoelectric cooling module and the phase change cold storage module. The thermoelectric cooling module is arranged at the bottom of the phase change cold storage module, and a secondary air duct outlet is provided on one side of the lower housing, so that a secondary heat dissipation air duct is formed between the thermoelectric cooling module and the lower housing.

[0011] Furthermore, the bottom of the lower housing is provided with an air inlet that connects to the outside air, and the air inlet is connected to the secondary heat dissipation air duct and the main heat dissipation air duct respectively. The lower housing is provided with a secondary air duct outlet that connects to the secondary heat dissipation air duct, and a secondary air duct axial fan is provided in the secondary heat dissipation air duct to improve heat dissipation efficiency.

[0012] Furthermore, to ensure smooth air intake, a gasket is provided at the bottom of the lower housing.

[0013] Furthermore, the cold storage space has at least two heat exchange surfaces and several insulation surfaces, wherein the heat exchange surfaces of the cold storage space are respectively connected to the main heat dissipation module and the thermoelectric cooling module, and the insulation surfaces of the cold storage space are provided with an insulation layer to reduce the cold dissipation of the phase change cold storage module.

[0014] Furthermore, the present invention also provides a method of using the above-mentioned laptop cooler, comprising:

[0015] A. When the laptop is working under low to medium load, the top cover is raised by the lifting structure, so that an air layer is formed between the phase change cold storage module and the main heat dissipation module, reducing the cold dissipation of the phase change cold storage module. At this time, the thermoelectric cooling module cools, the phase change cold storage module stores cold, and the main heat dissipation module is isolated from the above two modules and is cooled by the main air duct axial fan.

[0016] B. When the laptop is under high load, the top cover is lowered by the lifting structure, so that the main heat dissipation module and the phase change cold storage module are in close contact. When the airflow generated by the axial fan of the main air duct passes through the main heat dissipation air duct, it extracts the cold energy in the phase change cold storage module to form low-temperature cold air, thereby achieving more efficient heat dissipation.

[0017] Beneficial effects:

[0018] 1. The composite structure of phase change cold storage and Peltier thermoelectric module is adopted. Its essential effect is that it realizes the series connection of phase change cold storage and Peltier thermoelectric module. When the laptop is under low load, the Peltier thermoelectric module realizes thermoelectric cooling and stores the cold energy in the phase change medium. When the laptop is under high load, the Peltier thermoelectric module and phase change material are coupled to quickly release the cold energy. The phase change cold storage and multiple heat dissipation methods are coupled to make up for the problem of insufficient power of existing laptop heat dissipation brackets.

[0019] 2. The design adopts a stepped adjustable heat dissipation structure. Its main effect is that the main heat dissipation module adopts a lifting structure, which realizes stepped adjustable heat dissipation. By lifting the main heat dissipation module and switching the axial fan, three levels of heat dissipation (low, medium and high) can be achieved (of course, more precise level adjustment can be achieved by adjusting the fan speed). This achieves efficient heat dissipation for the laptop. In addition, the lifting structure reduces the leakage of cold air from the heat dissipation port when there is no high power heat dissipation demand, and increases the cold storage efficiency. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the overall structure of the laptop heat sink in an embodiment of the present invention;

[0021] Figure 2 This is a cross-sectional schematic diagram of a laptop computer heat sink in an embodiment of the present invention;

[0022] Figure 3 This is a schematic diagram of the main heat dissipation module in an embodiment of the present invention;

[0023] Figure 4 This is a schematic diagram of the thermoelectric refrigeration module in an embodiment of the present invention;

[0024] Figure 5 The core temperature changes of the laptop computer under high load and the corresponding melting rate of the phase change medium are shown in the examples and control examples during the operation of the heat sink under high load.

[0025] The diagram includes: 1-Main heat dissipation module, 2-Phase change cold storage module, 3-Thermoelectric cooling module, 4-Lower shell, 11-Upper cover plate, 12-Heat dissipation hole, 13-Main air duct heat dissipation fins, 14-Main air duct axial fan, 15-Lifting structure, 21-Phase change medium, 22-Insulation material, 31-Peltier module, 32-Secondary air duct heat dissipation fins, 33-Secondary air duct axial fan, 41-Lower bracket, 42-Air inlet, 43-Secondary air duct outlet, 44-Gasket. Detailed Implementation

[0026] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are some embodiments of the present invention, but not all embodiments.

[0027] like Figure 1-2 The image shows a laptop cooler that combines thermoelectric effect and phase change cold storage. It consists of three main parts: a main heat dissipation module 1, a thermoelectric cooling module 3, and a phase change cold storage module 2.

[0028] like Figure 1 As shown, the laptop cooler has a sloping overall shape, and its core consists of three modules: a main cooling module 1 at the top that is in direct contact with the laptop, a phase change cold storage module 2 in the middle that stores the phase change medium 21, and a thermoelectric cooling module 3 at the bottom that provides cooling to the device. The phase change cold storage module 2 and the thermoelectric cooling module 3 at the bottom form a series composite structure and are tightly fitted together. In addition, the laptop cooler also includes a lower housing 4 for housing the thermoelectric cooling module 3 and the phase change cold storage module 2.

[0029] like Figure 2 As shown, the phase change cold storage module 2 is composed of insulation material 22 and phase change medium 21. The insulation material 22 is preferably a low-density, low-thermal-conductivity foam material, and the phase change medium 21 is preferably a high-thermal-conductivity, high-energy-density composite phase change material. It is used to fill the reserved space at the top of the cold storage space of the phase change medium 21, and to reserve space for volume expansion of the phase change medium 21 for solid-liquid transformation.

[0030] like Figure 4 As shown, the thermoelectric cooling module 3 includes a Peltier module 31, a secondary air duct heat dissipation fin 32, and a secondary air duct axial fan 33. The Peltier module 31 is the core component of the thermoelectric cooling system. The Peltier module 31 is composed of positively and negatively doped semiconductor material particles, which are placed between two electrically insulating but thermally conductive ceramic plates. When a voltage is applied to the semiconductor, the heat is absorbed by one of the ceramic plates (cold side) and released by the other ceramic plate (hot side). In this embodiment, the cold side ceramic plate is closely connected to the phase change medium 21, and the hot side ceramic plate is connected to the secondary air duct heat dissipation fin 32.

[0031] Furthermore, a secondary air duct outlet 43 is provided on the rear side of the lower housing 4, so that a secondary heat dissipation air duct is formed between the thermoelectric cooling module 3 and the lower housing 4, and the secondary air duct axial fan 33 is arranged at the air inlet of the secondary heat dissipation air duct.

[0032] The maximum temperature difference between the two sides of the Peltier module 31 used in this example is 40℃. The secondary air duct fins in this example are made of copper fins, which can quickly dissipate heat through the secondary air duct axial fan 33, reduce the hot side temperature of the Peltier module 31, thereby reducing the cold side temperature, providing more cooling for the phase change medium 21, and providing long-term efficient heat dissipation for the laptop.

[0033] like Figure 3 As shown, the main heat dissipation module 1 consists of a main air duct axial fan 14, main air duct heat dissipation fins 13, an upper cover plate 11, and a lifting structure 15. The upper cover plate 11 is inclinedly arranged above the phase change cold storage module 2, and heat dissipation holes 12 are distributed on the upper cover plate 11, so that the upper cover plate 11 and the phase change cold storage module 2 form a main heat dissipation air duct. The main air duct heat dissipation fins 13 are made of copper fins and are connected to the bottom of the upper cover plate 11.

[0034] Furthermore, the bottom of the lower housing 4 is provided with an air inlet 42 that connects to external air, and the air inlet 42 is connected to both the secondary cooling duct and the main cooling duct. The axial fan 14 of the main cooling duct is arranged at the air inlet 42. To ensure smooth air intake, a pad 44 is also provided at the bottom of the lower housing 4. In addition, the lower housing 4 also includes a lower stand 41 for supporting the laptop.

[0035] like Figure 2 As shown, this example achieves graded adjustment through the lifting of the main heat dissipation module 1. The lifting structure 15 is arranged at the bottom of the upper cover plate 11 to realize the lifting and adjustment of the upper cover plate 11. The lifting structure 15 here is a commonly used structure, such as a lifting bracket, a flip bracket, or a folding bracket. Therefore, the upper cover plate 11 and the lower shell 4 are not fixed, but movable structures. The upper cover plate 11 is mounted above the phase change cold storage module 2 through the lifting structure 15.

[0036] When the laptop is operating under low to medium load (30-50℃), the main heat dissipation module 1 is raised by the mechanical lifting structure 15, forming an air layer between the phase change medium 21 and the main heat dissipation module 1. This air layer, together with the rear insulation material 22, forms an insulation layer for the phase change medium 21, reducing the dissipation of cold energy within the phase change medium 21. At this time, the bottom heat sink thermoelectric cooling module 3 performs cooling, the middle cold storage module performs cold storage, and the main heat dissipation module 1 is isolated from the above two modules, operating as a regular air cooler. That is, the main airflow axial fan 14 generates airflow, which is channeled through the main heat dissipation vents to provide cooling for the laptop. By controlling the on / off state and speed of the main airflow axial fan 14, the system can switch from a stand to an air-cooled heat sink, allowing for stepless changes in cooling demand from low to medium, achieving high-efficiency cooling to meet specific cooling requirements.

[0037] When the laptop is under high load (80-100℃), the main heat dissipation module 1 is lowered by the mechanical lifting structure 15 so that it is in close contact with the phase change medium 21 area. When the airflow generated by the main air duct axial fan 14 passes through the main heat dissipation air duct, it will extract the cold energy in the phase change medium 21 to form low temperature cold air, which brings more efficient heat dissipation to the laptop.

[0038] In this embodiment, the laptop heat sink has external dimensions of 380*220*140mm and a slope angle of 30°. The phase change medium 21 has dimensions of 360*173.61*100.24mm, and the Peltier module 31 has dimensions of 360*184.35*5mm. The insulation material 22 used in this example is phenolic foam with a thermal conductivity of 0.025W / (m*K). The phase change medium 21 is a composite material formed by n-dodecane and a copper thermally conductive skeleton, wherein the phase change temperature of n-dodecane is -9.6℃ and the latent heat of phase change is 135kJ / kg.

[0039] Furthermore, in this example, the core temperature of the laptop under high load is 95℃. Under these conditions, the heat dissipation effect of this embodiment on the laptop is as follows: Figure 5 As shown, it can reduce the core temperature of a laptop under high load by about 45°C (initially through a combination of phase change cooling, thermoelectric cooling, and air cooling), providing better heat dissipation compared to common air-cooled heat sinks (control example). Subsequently, as the cold energy stored within the phase change material is continuously released, the phase change material gradually melts, and the heat dissipation effect gradually decreases. However, relying on the advantages of the combination of thermoelectric cooling module 3 and air cooling, it can still reduce the core temperature of the laptop by about 20°C, which is about 10°C lower than traditional air-cooled heat sinks.

[0040] Therefore, this heat sink can dissipate heat using air cooling when the laptop is under low load or not in use, and at the same time achieve thermoelectric cooling through the Peltier effect, storing the cold energy in a high-energy-density phase change medium. Then, when the laptop is working under high load and generates a lot of heat, the cold energy stored in the phase change material is used in combination with air cooling and thermoelectric effect to achieve joint cooling, thus achieving high-power and high-efficiency heat dissipation for the laptop.

[0041] The above description is merely a preferred embodiment of the present invention and is not intended to limit the invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A laptop cooler utilizing thermoelectric effect and phase change cooling, characterized in that, It includes a main heat dissipation module, a thermoelectric cooling module, and a phase change cold storage module. The phase change cold storage module includes a cold storage space filled with a phase change medium, and the cooling surface of the thermoelectric cooling module is in contact with the phase change cold storage module. The main heat dissipation module includes an upper cover plate arranged on the top of the phase change cold storage module, and the upper cover plate is provided with heat dissipation holes, so that a main heat dissipation air duct is formed between the main heat dissipation module and the phase change cold storage module.

2. The laptop computer heat sink according to claim 1, characterized in that, The bottom of the upper cover plate is provided with main air duct heat dissipation fins, and the main air duct is provided with a main air duct axial fan.

3. The laptop computer heat sink according to claim 1, characterized in that, The bottom of the upper cover plate is equipped with a lifting structure for adjusting the height of the upper cover plate.

4. The laptop computer heat sink according to claim 1, characterized in that, The upper cover plate is set at an angle of 20 to 40 degrees.

5. The laptop computer heat sink according to claim 1, characterized in that, The thermoelectric cooling module includes a Peltier module made of semiconductor material and insulating thermally conductive partitions located on both sides of the Peltier module. The insulating thermally conductive partition on the cold side is attached to the phase change cold storage module, and the insulating thermally conductive partition on the hot side dissipates heat through heat dissipation fins in the secondary air duct.

6. The laptop computer heat sink according to claim 5, characterized in that, It also includes a lower housing for accommodating the thermoelectric cooling module and the phase change cold storage module, wherein the thermoelectric cooling module is arranged at the bottom of the phase change cold storage module, and a secondary heat dissipation air duct is formed between the thermoelectric cooling module and the lower housing.

7. The laptop computer heat sink according to claim 6, characterized in that, The bottom of the lower housing is provided with an air inlet that connects to the outside air, and the air inlet is connected to the secondary heat dissipation air duct and the main heat dissipation air duct respectively. The lower housing is provided with a secondary air duct outlet that connects to the secondary heat dissipation air duct, and a secondary air duct axial fan is provided inside the secondary heat dissipation air duct.

8. The laptop computer heat sink according to claim 7, characterized in that, The bottom of the lower housing is also provided with a gasket.

9. The laptop computer heat sink according to claim 1, characterized in that, The cold storage space has at least two heat exchange surfaces and several insulation surfaces. The heat exchange surfaces of the cold storage space are connected to the main heat dissipation module and the thermoelectric cooling module, respectively, and the insulation surfaces of the cold storage space are provided with insulation layers.

10. A method of using the laptop cooler as described in claim 3, characterized in that, include: A. When the laptop is working under low to medium load, the top cover is raised by the lifting structure, so that an air layer is formed between the phase change cold storage module and the main heat dissipation module, reducing the cold dissipation of the phase change cold storage module. At this time, the thermoelectric cooling module cools, the phase change cold storage module stores cold, and the main heat dissipation module is isolated from the above two modules and is cooled by the main air duct axial fan. B. When the laptop is under high load, the top cover is lowered by the lifting structure, so that the main heat dissipation module and the phase change cold storage module are in close contact. When the airflow generated by the axial fan of the main air duct passes through the main heat dissipation air duct, it extracts the cold energy in the phase change cold storage module to form low-temperature cold air, thereby achieving more efficient heat dissipation.

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