Plasma-assisted machining method and plasma-assisted machining apparatus
The plasma-assisted machining method with an uneven polishing plate and periodic dressing addresses the challenge of polishing diamond and other materials with high efficiency and precision, preventing scratches and maintaining surface quality.
JP2026085873APending Publication Date: 2026-05-25OSAKA UNIVERSITY
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Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- OSAKA UNIVERSITY
- Filing Date
- 2025-10-31
- Publication Date
- 2026-05-25
AI Technical Summary
Technical Problem
Existing methods for polishing diamond and other difficult-to-process materials fail to achieve high efficiency and precision without introducing scratches or processed heat-affected layers.
Method used
A plasma-assisted machining method using a polishing plate with an uneven surface, where oxygen-active species generated by plasma react with the workpiece surface atoms, and the plate's surface is periodically dressed to maintain evenness, preventing localized processing and scratches.
Benefits of technology
The method enables high-efficiency and accurate polishing of diamond and other materials without scratches or altered layers, improving processing rates and maintaining surface quality.
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Smart Images
Figure 2026085873000001_ABST
Abstract
We aim to provide a processing method that enables highly efficient and precise polishing of diamonds without introducing scratches or altered processing layers. [Solution] A plasma consisting of a reaction gas containing O2, H2O, or H2O2 gas is generated near the surface of a polishing plate 2 which has an uneven surface, thereby depositing oxygen-active species onto the surface. Next, the workpiece 9 is moved relative to the surface to which the oxygen-active species have been deposited, causing the atoms on the surface of the workpiece 9 to chemically react with the oxygen-active species and be extracted and removed as reaction products. In this way, the surface of the workpiece is chemically polished using the surface of the polishing plate 2 as the processing reference surface.
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