Electrical equipment

Abstract

To provide an electrical device that can dissipate noise generated on the circuit board to the ground with a simple configuration without increasing its size. [Solution] The electrical device comprises a semiconductor module 100, a non-conductive frame 50, a metal housing 40, a substrate 20, and a conductive fixing member 60. The non-conductive frame 50 houses the semiconductor module. The housing has a bottom 44. The bottom is provided at one end of the non-conductive frame. The substrate is provided at the other end of the non-conductive frame. The fixing member fixes the bottom, the non-conductive frame, and the substrate. The bottom is connected to ground, and in addition to its role in fixing, the fixing member also serves as an electrical path between the substrate and the bottom.

Description

Technical Field

[0001] The disclosure in this specification relates to electrical equipment.

Background Art

[0002] The power conversion device described in Patent Document 1 includes a conductive housing, a resin case housed in the housing, a semiconductor element housed in the resin case, and a control circuit board disposed on the upper portion of the resin case. The control circuit board is constituted by a gate driver circuit that drives the gate of the semiconductor element. The control circuit board is fixed to the resin case via a fixing member.

[0003] The power conversion device also has a first conductive member that electrically connects the control circuit board and the housing. One end of the first conductive member is electrically connected to the frame ground terminal of the control circuit board, the other end is electrically connected to the housing, and it functions as a conductive member for frame ground.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] In Patent Document 1, the fixing member has the role of fixing the control circuit board and the resin case, and the first conductive member has the role of担う part of the current-carrying path between the control circuit board and the ground. In Document 1, the role of fixing and the role of担う part of the current-carrying path between the control circuit board and the ground are separated. Therefore, there is a risk that the physical size increases and the configuration becomes complicated because a separate configuration for securing the current-carrying path is required.

[0006] Therefore, the purpose of this disclosure is to provide an electrical device that can dissipate noise generated on the circuit board to the ground with a simple configuration without increasing its size. [Means for solving the problem]

[0007] An electrical device according to one aspect of this disclosure is Semiconductor module (100) and A non-conductive frame (50) for housing a semiconductor module, A metal housing (40) having a bottom (44) provided at one end of a non-conductive frame, A substrate (20) is provided at the other end of the non-conductive frame, It comprises a base, a non-conductive frame, and a conductive fixing member (60) for fixing the substrate, The bottom is connected to the ground, In addition to their primary function of securing the components, the fixing members also serve as the electrical pathway between the circuit board and the base.

[0008] According to the semiconductor device disclosed above, noise generated on the substrate can be discharged to the ground with a simple configuration without increasing the size.

[0009] The various embodiments disclosed in this specification employ different technical means to achieve their respective purposes. The claims and the reference numerals in parentheses in this section are illustrative in their correspondence with the embodiments described later and are not intended to limit the technical scope. The purposes, features, and effects disclosed in this specification will become clearer by referring to the subsequent detailed description and the accompanying drawings. [Brief explanation of the drawing]

[0010] [Figure 1] This is an electrical circuit diagram showing the circuit configuration of a power conversion device according to the first embodiment. [Figure 2] This is a perspective view of a power conversion device according to the first embodiment. [Figure 3] Figure 2 is a plan view of the power conversion device shown. [Figure 4] This is a plan view of the power converter, excluding the control circuit board. [Figure 5] This is a plan view of the power converter, excluding the control circuit board and brackets. [Figure 6] This is a plan view of the power converter, excluding the control circuit board, brackets, and drive circuit board. [Figure 7] This is a cross-sectional view along the line VII-VII in Figure 3. [Figure 8] This is a cross-sectional view of a power conversion device according to the second embodiment. [Figure 9] This is a perspective view of the connection terminal according to the second embodiment. [Figure 10] This is a cross-sectional view of a power conversion device according to the third embodiment. [Figure 11] This is a cross-sectional view of the drive circuit board according to the fourth embodiment. [Figure 12] This is a cross-sectional view of the drive circuit board according to the fifth embodiment. [Modes for carrying out the invention]

[0011] Several embodiments will be described below with reference to the drawings. In each embodiment, the same reference numerals are used for corresponding components, and redundant explanations may be omitted. If only a part of the configuration is described in each embodiment, the configuration of other embodiments described earlier can be applied to the other parts of that configuration. Furthermore, in addition to the combinations of configurations explicitly stated in the description of each embodiment, configurations from multiple embodiments can be partially combined even if not explicitly stated, as long as there are no particular problems with the combination.

[0012] The power conversion device 4 of the present embodiment is applied, for example, to power conversion of a moving body having a rotating electric machine as a drive source. The moving body is, for example, an electric vehicle such as a battery electric vehicle (BEV), a hybrid electric vehicle (HEV), a plug-in hybrid electric vehicle (PHEV), a flying body such as an electric vertical take-off and landing aircraft or a drone, a ship, a construction machine, an agricultural machine, etc. Hereinafter, an example applied to a vehicle will be described. The power conversion device 4 may also be referred to as an electric device.

[0013] (First Embodiment) First, based on FIG. 1, the schematic configuration of the drive system of the vehicle will be described.

[0014] (Drive System of Vehicle) As shown in FIG. 1, the drive system 1 of the vehicle includes a DC power source 2, a motor generator 3, and a power conversion device 4.

[0015] The DC power source 2 is a DC voltage source composed of a rechargeable secondary battery. The secondary battery is, for example, a lithium-ion battery or a nickel-metal hydride battery. The motor generator 3 is a three-phase AC rotating electric machine. The motor generator 3 functions as a driving source for the vehicle to travel, that is, as an electric motor. The motor generator 3 functions as a generator during regeneration. The power conversion device 4 performs power conversion between the DC power source 2 and the motor generator 3.

[0016] (Power Conversion Device) Next, based on FIG. 1, the circuit configuration of the power conversion device 4 will be described. The power conversion device 4 includes a power conversion circuit and a control unit. The power conversion device 4 includes a smoothing capacitor 5, an inverter 6 which is a power conversion circuit, and a drive circuit and a control circuit which are control units. The drive circuit is provided on a drive circuit board 20. The control circuit is provided on a control circuit board 30.

[0017] The smoothing capacitor 5 primarily smooths the DC voltage supplied from the DC power supply 2. The smoothing capacitor 5 is connected to the P line 7, which is the high-potential power line, and the N line 8, which is the low-potential power line. The P line 7 is connected to the positive terminal of the DC power supply 2, and the N line 8 is connected to the negative terminal of the DC power supply 2. The positive terminal of the smoothing capacitor 5 is connected to the P line 7 between the DC power supply 2 and the inverter 6. The negative terminal of the smoothing capacitor 5 is connected to the N line 8 between the DC power supply 2 and the inverter 6. The smoothing capacitor 5 is connected in parallel to the DC power supply 2.

[0018] The inverter 6 is a DC-AC conversion circuit. The inverter 6 converts the DC voltage to a three-phase AC voltage according to the switching control of the control unit and outputs it to the motor generator 3. This drives the motor generator 3 to generate a predetermined torque. During regenerative braking of the vehicle, the inverter 6 converts the three-phase AC voltage generated by the motor generator 3 in response to the rotational force from the wheels to a DC voltage according to the switching control of the control unit and outputs it to the P line 7. In this way, the inverter 6 performs bidirectional power conversion between the DC power supply 2 and the motor generator 3.

[0019] The inverter 6 is configured with three phase upper and lower arm circuits 9. The upper and lower arm circuits 9 are sometimes referred to as legs. The upper and lower arm circuits 9 each have an upper arm 9H and a lower arm 9L. The upper arm 9H and lower arm 9L are connected in series between the P line 7 and the N line 8, with the upper arm 9H on the P line 7 side.

[0020] The connection point between the upper arm 9H and the lower arm 9L is connected to the corresponding phase winding 3a in the motor generator 3 via the output line 10. Of the upper and lower arm circuits 9, the U-phase upper and lower arm circuit 9U is connected to the U-phase winding 3a via the corresponding output line 10. The V-phase upper and lower arm circuit 9V is connected to the V-phase winding 3a via the corresponding output line 10. The W-phase upper and lower arm circuit 9W is connected to the W-phase winding 3a via the corresponding output line 10. At least a portion of each of the P line 7, N line 8, and output line 10 is made up of conductive material such as a busbar.

[0021] The inverter 6 has six arms. Each arm is configured with a switching element. In this embodiment, one switching element is shown in each arm, but the number of switching elements constituting each arm is not particularly limited. There may be multiple switching elements. In the case of multiple switching elements, the multiple switching elements connected in parallel to each other are driven on and off at the same timing by a common gate drive signal (drive voltage).

[0022] In this embodiment, an n-channel type MOSFET 11 is used as the switching element constituting each arm. MOSFET is an abbreviation for Metal Oxide Semiconductor Field Effect Transistor. In the upper arm 9H, the drain of the MOSFET 11 is connected to the P line 7. In the lower arm 9L, the source of the MOSFET 11 is connected to the N line 8. The source of the MOSFET 11 in the upper arm 9H and the drain of the MOSFET 11 in the lower arm 9L are interconnected.

[0023] Each MOSFET 11 has a freewheeling diode 12 connected in antiparallel. Diode 12 may be a parasitic diode (body diode) of the MOSFET 11, or it may be a separate diode. The anode of diode 12 is connected to the source of the corresponding MOSFET 11, and the cathode is connected to the drain.

[0024] Note that the switching element is not limited to MOSFET11. For example, an IGBT may be used. IGBT is an abbreviation for Insulated Gate Bipolar Transistor. In the case of an IGBT, a freewheeling diode is also connected in antiparallel.

[0025] The power converter 4 may further include a converter as a power conversion circuit. The converter is a DC-DC converter circuit that converts a DC voltage to, for example, a DC voltage of a different value. The converter is provided between the DC power supply 2 and the smoothing capacitor 5. The converter is configured, for example, with a reactor and the above-described up-and-down arm circuit 9. With this configuration, step-up and step-down voltage conversion is possible. The power converter 4 may also include a filter capacitor to remove power supply noise from the DC power supply 2. The filter capacitor is provided between the DC power supply 2 and the converter.

[0026] The drive circuit supplies a drive voltage to the gate of the corresponding MOSFET 11 based on the drive command from the control circuit. The drive circuit drives the corresponding MOSFET 11, i.e., turns it on or off, by applying the drive voltage. The drive circuit is sometimes referred to as a gate driver. In the drawings, it is denoted as GD.

[0027] The control circuit generates drive commands to operate the MOSFET 11 and outputs them to the drive circuit. The control circuit generates drive commands based on, for example, torque requests input from a higher-level ECU (not shown) and signals detected by various sensors. ECU is an abbreviation for Electronic Control Unit. In the drawings, it is written as CNT.

[0028] Various sensors include, for example, current sensors, rotation angle sensors, and voltage sensors. The current sensor detects the phase current flowing through the windings 3a of each phase. The rotation angle sensor detects the rotation angle of the rotor of the motor generator 3. The voltage sensor detects the voltage across the smoothing capacitor 5. The signal circuit outputs, for example, a PWM signal as a drive command. The signal circuit is configured to include, for example, a processor and memory. PWM is an abbreviation for Pulse Width Modulation.

[0029] <Mechanical configuration of a power converter> Next, the mechanical configuration of the power converter 4 will be described. In addition to the components described above, the power converter 4 includes a metal housing 40, a non-conductive frame 50, a first fixing member 60, a second fixing member 70, a third fixing member 80, a stay 90, and a cable 120. The inverter 6 is provided by a semiconductor module 100.

[0030] The first fixing member 60 includes a bolt 61, a pin 64, and a connecting member 67. The connecting member 67 is a cylindrical metal member that electrically and mechanically connects the bolt 61 and the pin 64. The second fixing member 70 includes a first bolt 71 and a second bolt 74. The third fixing member 80 is a bolt. The bolts and pins included in the first fixing members 60 to the third fixing members 80 each have a head and a shaft. These shafts extend along the Z direction. The pin 64 is, for example, a flanged pin. Note that the first fixing member 60 is not limited to the bolt 61, pin 64, and connecting member 67. A bolt may be used instead of the pin 64. The form of the connecting member 67 is not limited to a cylinder.

[0031] The semiconductor module 100 is provided by three semiconductor devices 110. One of the semiconductor devices 110, semiconductor device 110U, provides a U-phase up and down arm circuit 9U. Another of the semiconductor devices 110, semiconductor device 110V, provides a V-phase up and down arm circuit 9V. Another of the semiconductor devices 110, semiconductor device 110W, provides a W-phase up and down arm circuit 9W. The semiconductor module 100 is housed inside a non-conductive frame 50.

[0032] Figure 2 is a perspective view of the power converter 4 according to the first embodiment. Figure 3 is a plan view of the power converter 4 shown in Figure 2. Figure 4 is a plan view of the power converter 4 excluding the control circuit board 30. Figure 5 is a plan view of the power converter 4 excluding the control circuit board 30 and the stay 90. Figure 6 is a plan view of the power converter 4 excluding the control circuit board 30, the stay 90 and the drive circuit board 20. Figure 7 is a cross-sectional view along the line VII-VII in Figure 3. Note that Figure 5 also has cross-sectional lines at the same positions as in Figure 3.

[0033] In the following, the thickness direction of the substrates 20 and 30 is defined as the Z direction, and the direction perpendicular to the Z direction is defined as the Y direction. The direction perpendicular to both the Z and Y directions is defined as the X direction. Unless otherwise specified, the shape viewed from the Z direction, in other words, the shape along the XY plane defined by the X and Y directions, is referred to as the planar shape. Also, the view from the Z direction is sometimes simply referred to as the planar view. With respect to the Z direction, the bottom 44 of the housing 40, the semiconductor module 100, the drive circuit board 20, the stay 90, and the control circuit board 30 are stacked in that order.

[0034] The drive circuit board 20 and the control circuit board 30 comprise printed circuit boards 21 and 31, semiconductor components 22 and 32, electrical components 24 and 34, and connectors 23 and 33. Printed circuit boards 21 and 31 consist of conductors arranged on an insulating substrate. The semiconductor components 22 and 32 and electrical components 24 and 34 are mounted on printed circuit boards 21 and 31. Connectors 23 and 33 connect the drive circuit board 20 and the control circuit board 30. The drawings show examples of the drive circuit board 20 and the control circuit board 30. The arrangement and number of semiconductor components 22 and 32 and electrical components 24 and 34 on the drive circuit board 20 and the control circuit board 30 are not limited to these examples. Printed circuit board 21 has a front surface 20B and a back surface 20A that are separated in the Z direction. Semiconductor components 22, connectors 23, and electrical components 24 are arranged on front surface 20B. Printed circuit board 31 has a front surface 30B and a back surface 30A that are separated in the Z direction. A semiconductor component 32, a connector 33, and an electrical component 34 are arranged on the surface 30B.

[0035] The conductors arranged on the printed circuit board 21 with respect to the drive circuit board 20 include wiring 25. The wiring 25 forms a circuit together with the semiconductor component 22 and the electrical component 24. The wiring 25 has connecting wiring 251 that connects the semiconductor component 22 and the electrical component 24, and ground wiring 252 that provides a ground potential which is the reference potential of the drive circuit board 20. The ground wiring 252 electrically connects the ground terminal of the semiconductor component 22 to the body ground. A portion of the connecting wiring 251 is illustrated in Figure 5. A portion of the ground wiring 252 is illustrated in Figure 7.

[0036] The wiring 25 is formed by patterning metal foil on the front surface 20B and the back surface 20A. For example, connection wiring 251 is located on the front surface 20B of the printed circuit board 21. Ground wiring 252 is located on the back surface 20A of the printed circuit board 21. The ground terminal of the semiconductor component 22 and the ground wiring 252 are electrically connected.

[0037] The arrangement pattern of the wiring 25 is not limited to this. For example, the ground wiring 252 may be placed on the front surface 20B, or on both the front surface 20B and the back surface 20A. The printed circuit board 21 may be a single-sided board, a double-sided board, or a multilayer board including three or more layers of wiring.

[0038] The drive circuit board 20 contains the drive circuit. The control circuit board 30 contains the control circuit. The drive circuit and the control circuit communicate with each other via cable 120. One end of cable 120 is connected to connector 23. The other end of cable 120 is connected to connector 33. Cable 120 connects connector 23 and connector 33 by straddling stay 90. Note that connectors 23, 33 and cable 120 are covered with resin on the outside, so resin hatching is shown in the drawing.

[0039] The housing 40 is made of a metal with excellent thermal conductivity, such as aluminum or copper. The housing 40 is electrically connected to the body ground of the chassis or other components. The housing 40 comprises a base 41, an upright section 42, a heat sink 43, and legs 45. The base 41, the upright section 42, and the heat sink 43 together are sometimes referred to as the bottom 44. The housing 40 comprises the bottom 44 and legs 45. The bottom 44 comprises the base 41, the upright section 42, and the heat sink 43. The base 41 is a thin base portion in the Z direction. The upright section 42 is erected from the base 41 in the Z direction. In a plan view, the upright section 42 extends in an annular shape around the Z direction. The upright section 42 opens in the Z direction at the end away from the base 41.

[0040] The heat sink 43 is a thin metal plate in the Z direction. The heat sink 43 is installed on the upright portion 42 so as to close the opening of the upright portion 42. In the Z direction, the heat sink 43 faces the base 41. Although not shown in the figure, the surface 43B facing the base 41 is provided with multiple protrusions that project toward the base 41, for example. The semiconductor module 100 is mounted on the back surface of the facing surface 43B. The surface on which the semiconductor module 100 is mounted is sometimes referred to as the mounting surface 43A.

[0041] The base 41, the upright section 42, and the heat sink 43 define a flow path 46 through which refrigerant can flow. The flow of refrigerant through the flow path 46 allows the heat sink 43 to function as a cooler for the semiconductor module 100. Therefore, the heat sink 43 is sometimes referred to as a cooler. It can also be said that the bottom 44 has a cooler, or that the housing 40 has a cooler.

[0042] The upright portion 42 and the heat sink 43 are located on the center side of the edge of the base 41 in a plan view. The legs 45 extend from the base 41 in the Z direction in the same direction as the upright portion 42 extends. In a plan view, the legs 45 are located closer to the edge of the base 41 than the upright portion 42. The length of the legs 45 in the Z direction is longer than the length of the upright portion 42 in the Z direction. A hole 45H is formed at the tip of the leg 45, into which a bolt 71, which is part of the second fixing member 70, is fixed. A stay 90 is provided at the tip. The stay 90 is fixed to the leg 45 via the first bolt 71.

[0043] The non-conductive frame 50 is formed using an electrically insulating material. The non-conductive frame 50 is, for example, a resin molded body. The non-conductive frame 50 comprises a frame body 51, a partition wall 56, and a plurality of fixed parts 59. The frame body 51 has a predetermined height in the Z direction and is annular in shape so as to surround the semiconductor module 100 in a plan view in the Z direction. The frame body 51 has a housing space 57 inside. The frame body 51 is sometimes referred to as an annular wall. The frame body 51 may be an approximately rectangular annular shape. A rectangular annular frame body 51 has four wall parts 52, 53, 54, 55.

[0044] The wall portions 52 and 53 extend in the X direction. Wall portions 52 and 53 are positioned opposite each other with a predetermined distance in the Y direction. Wall portion 52 is located on one end side of the semiconductor module 100 in the Y direction, and wall portion 53 is located on the other end side of the semiconductor module 100. Wall portions 52 and 53 include a wall that defines a region and an extension that extends outward from the wall in the Y direction. Wall portions 54 and 55 extend in the Y direction. Wall portion 54 is connected to wall portions 52 and 53 at one end side in the X direction. Wall portion 55 is connected to wall portions 52 and 53 at the other end side in the X direction.

[0045] The partition wall 56 has a predetermined height in the Z direction and is connected to the frame 51. The partition wall 56 extends in the X direction, which is perpendicular to the direction in which the semiconductor devices 110 are arranged, and both ends of the partition wall 56 are connected to the walls 54 and 55 of the frame 51. The partition wall 56 divides the area defined by the frame 51 into multiple areas. The partition wall 56 divides the area into areas corresponding to the number of semiconductor devices 110, for example. In the Y direction, which is the direction in which the semiconductor devices 110 are arranged, the partition wall 56 divides the housing space 57 into the same number of sections as the semiconductor devices 110. In this embodiment, each phase of the semiconductor device 110 is individually arranged in the three divided sections of the housing space 57. The non-conductive frame 50 and the semiconductor module 100 are mounted on the mounting surface 43A of the heat sink 43.

[0046] The frame 51 and partition wall 56 have one end 50A and the other end 50B separated in the Z direction. The one end 50A faces the heat sink 43 in the Z direction. The other end 50B faces the drive circuit board 20 in the Z direction. Openings are formed by the one end 50A and the other end 50B. The non-conductive frame 50 also has a protrusion 58 that projects in the Z direction from a part of the other end 50B. In the drawing, the boundary line between the frame 51 and the protrusion 58 is shown by a dashed line.

[0047] The protrusions 58 have a cylindrical shape with a predetermined height in the Z direction. The protrusions 58 are connected to a part of the other end 50B in the Z direction. The protrusions 58 are provided on the other end 50B so as to be located at the four corners of the semiconductor device 110. The number of protrusions 58 and their arrangement are not limited to this. Hereinafter, the protrusions 58 and the frame 51 or partition wall 56 connected to the protrusions 58 may be collectively referred to as the fixed part 59.

[0048] The non-conductive frame 50 has a plurality of fixed parts 59. In this embodiment, as an example, there are eight fixed parts 59. However, the number of fixed parts 59 is not limited to eight. There may be multiple fixed parts 59 or just one. The fixed parts 59 are the parts to which the first fixing member 60 is fixed. The fixed part 59 has one end 59A and the other end 59B that are spaced apart in the Z direction. One end 59A corresponds to a part of one end 50A. A hole 59H is formed in the fixed part 59 that penetrates one end 59A and the other end 59B in the Z direction.

[0049] A connecting member 67 is enclosed within the hole 59H. The connecting member 67 is a cylindrical metal member. The connecting member 67 is sometimes referred to as an insert nut. The connecting member 67 extends along the Z direction. The connecting member 67 has one end 67A, the other end 67B, and a side portion 67C that connects both ends in the Z direction. The side portion 67C extends in an annular shape along the hole 59H. The hole 67H is partitioned by the side portion 67C. The hole 67H communicates with the hole 59H of the fixed part 59.

[0050] The side portion 67C is covered by the fixed portion 59. One end portion 67A is exposed from one end portion 59A. One end portion 67A and one end portion 59A are flush in the planar direction. The other end portion 67B is exposed from the other end portion 59B. The other end portion 67B and the other end portion 59B are flush in the planar direction.

[0051] The heat sink 43 has a hole 431H through which the head 65 and shaft 66 of the pin 64 are inserted. The aforementioned hole 67H is a hole through which the shaft 66 can be inserted. Holes 67H and 431H are connected in the Z direction. The entire pin 64 is inserted through the connected holes 67H and 431H. The shaft 66 is fixed to the inner wall of the side portion 67C. The shaft 66 is electrically and mechanically connected to the side portion 67C. The non-conductive frame 50 is fixed to the heat sink 43 via the pin 64 and the connecting member 67. The opening of one end 50A is closed so that one end 50A is in close contact with the heat sink 43. In the planar direction, the head 65 and the opposing surface 43B are flush.

[0052] The heatsink 43 is electrically and mechanically connected to the tip of the upright portion 42 via a third fixing member 80. The third fixing member 80 has a head portion 81 and a shaft portion 82. A hole 42H is formed in the tip of the upright portion 42 through which the shaft portion 82 is inserted. A hole 432H is also formed in the heatsink 43 at a location corresponding to the hole 42H at the tip. Holes 42H and 432H are connected in the Z direction. The heatsink 43 and the upright portion 42 are electrically and mechanically connected by passing the shaft portion 82 through the connected holes 42H and 432H and fixing it in place. As described above, the head portion 65 and the opposing surface 43B are flush. The heatsink 43 and head portion 65 are in close contact with the upright portion 42 by fixing the shaft portion 82 in the holes 42H and 432H. The heatsink 43 and pins 64 are electrically connected to the housing 40.

[0053] A hole 20H is formed in the drive circuit board 20 through which the shaft portion 63 is inserted. The hole 67H of the fixed part and the hole 20H are connected in the Z direction. The shaft portion 63 of the bolt 61 is inserted through the connected holes 67H and 20H. The shaft portion 63 is fixed to the inner wall of the side portion 67C. The shaft portion 63 is electrically and mechanically connected to the side portion 67C. The drive circuit board 20 is fixed to the non-conductive frame 50 via the bolt 61 and the connecting member 67. The opening of the other end 50B is closed in such a manner that the other end 50B is in close contact with the drive circuit board 20. In this way, the drive circuit board 20 and the heat sink 43 are fixed to the non-conductive frame 50 via the first fixing member 60. Note that the shaft portion 63 and the shaft portion 66 are arranged coaxially with respect to the Z direction. The bolt 61 and the pin 64 are electrically and mechanically connected via the connecting member 67.

[0054] The legs 45 extend in the Z direction from the base 41 toward the drive circuit board 20. The tips of the legs 45 are positioned further away from the base 41 than the drive circuit board 20. A stay 90 is provided at the tip. The stay 90 is a metal plate that supports the control circuit board 30. The stay 90 has a base 91 and multiple bosses 92. The base 91 has a flattened shape with a thin thickness in the Z direction.

[0055] The base 91 has a lower surface 91A on the tip side and an upper surface 91B on the back side. The base 91 has a hole 91H formed in the base 91 at a location corresponding to the hole 45H provided at the tip. Holes 91H and 45H are connected in the Z direction. The shaft portion 73 of the first bolt 71, which is part of the second fixing member 70, is inserted through the connected holes 91H and 45H. The first bolt 71 has a head 72 and a shaft portion 73. By fixing the shaft portion 73 in holes 91H and 45H, the stay 90 and the housing 40 are electrically and mechanically connected.

[0056] The boss 92 is provided on the upper surface 91B. The boss 92 extends from the upper surface 91B in the Z direction. A hole 92H is formed at the tip of the boss 92 for the shaft portion 76 of the second bolt 74, which is part of the second fixing member 70, to pass through. A hole 30H is also formed in the control circuit board 30 at a location corresponding to the hole 92H. The holes 92H and 30H are connected in the Z direction. The shaft portion 76 is inserted through the connected holes 92H and 30H. The second bolt 74 has a head portion 75 and a shaft portion 76. By fixing the shaft portion 76 in the holes 92H and 30H, the control circuit board 30 and the stay 90 are electrically and mechanically connected. Note that the power conversion device 4 does not necessarily have to have a stay 90. In that case, the second fixing member 70 does not have the second bolt 74. The second fixing member 70 has only the first bolt 71. The control circuit board 30 may also be fixed to the legs 45 via the first bolt 71.

[0057] The semiconductor module 100 is mounted on the mounting surface 43A. The heat sink 43 cools the semiconductor module 100. A refrigerant flows through the flow path 46 to effectively cool the semiconductor module 100. As the refrigerant, a phase-changing refrigerant such as water or ammonia, or a non-phase-changing refrigerant such as ethylene glycol, can be used. An inlet pipe and an outlet pipe (not shown) are also connected to the flow path. The refrigerant is supplied to the refrigerant flow path via the inlet pipe. The refrigerant that has flowed through the refrigerant flow path is discharged outside the refrigerant flow path via the outlet pipe.

[0058] The semiconductor device 110 comprises a semiconductor element 101, a substrate 102, an external connection terminal 103, and a encapsulant. The semiconductor element 101 is formed by creating a vertical element on a semiconductor substrate made of materials such as silicon (Si) or a wide-bandgap semiconductor with a wider bandgap than silicon. Examples of wide-bandgap semiconductors include silicon carbide (SiC), gallium nitride (GaN), gallium oxide (Ga2O3), and diamond. The semiconductor element 101 is sometimes referred to as a power element or semiconductor chip. The vertical element is configured to carry the main current in the thickness direction of the semiconductor element 101 (semiconductor substrate). The semiconductor element 101 has main electrodes on both sides in the thickness direction. In this embodiment, the semiconductor element 101 is formed by creating an n-channel type MOSFET 11 as a vertical element on a substrate 102 made of SiC.

[0059] The substrate 102 has conductors arranged on one surface. The conductors are patterned. The patterned conductors provide a circuit. The conductors include P-wiring, N-wiring, and O-wiring. The P-wiring is connected to the drain electrode of the high-side semiconductor element 101. The P-wiring is connected to the P terminal, which is electrically connected to the positive terminal of the smoothing capacitor 5. The P-wiring electrically connects the drain electrode of the high-side semiconductor element 101 to the P terminal.

[0060] The N wiring is connected to the N terminal, which is electrically connected to the negative terminal of the smoothing capacitor 5. The source electrode of the low-side semiconductor element 101 is electrically connected to the N wiring. The N wiring electrically connects the source electrode of the low-side semiconductor element 101 to the N terminal. The N wiring is sometimes referred to as negative terminal wiring or low-potential power supply wiring.

[0061] The O wiring connects to the source electrode of the high-side semiconductor element and the drain electrode of the low-side semiconductor element. The O wiring electrically connects these electrodes to the O terminals, which are electrically connected to the opposing phase windings 3a of the motor generator 3. The O wiring is sometimes referred to as output wiring.

[0062] The external connection terminal 103 is a terminal for electrically connecting the semiconductor element 101 to an external device. The external connection terminal 103 is formed using a metal material with good conductivity, such as copper. The external connection terminal 103 includes a main terminal 104 and a signal terminal 105. The main terminal 104 is a terminal that is electrically connected to the main electrode of the semiconductor element. The main terminal 104 includes power terminals P terminal 104A and N terminal 104B, and O terminal 104C.

[0063] The main terminal 104 extends both inside and outside the frame 51. The main terminal 104 extends from the inside to the outside of the housing space 57 via the frame 51. The P terminal 104A and N terminal 104B extend in the X direction inside and outside the frame 51 via the wall portion 54. The O terminal 104C extends in the X direction inside and outside the frame 51 via the wall portion 55. The main terminal 104 and the fixed portion 59 are spaced apart in the Y direction. The connecting member 67 enclosed in the fixed portion 59 and the main terminal 104 are not in contact. The connecting member 67 and the main terminal 104 are not conductive.

[0064] The signal terminal 105 is a terminal electrically connected to the pad of the semiconductor element. The signal terminal 105 electrically connects the semiconductor element 101 and the drive circuit board 20. The signal terminal 105 extends in the Z direction from the semiconductor element 101 toward the drive circuit board 20. The signal terminal 105 is electrically and mechanically connected to the drive circuit board 20 via solder or the like. The number of signal terminals 105 is not particularly limited. The signal terminal 105 should include at least a terminal for applying a drive voltage to the gate electrode of the semiconductor element 101. The signal terminal 105 may include a terminal for detecting the source potential of the semiconductor element. The signal terminal 105 may include a terminal for detecting the drain potential of the semiconductor element. The signal terminal 105 may include a terminal for detecting the temperature of the semiconductor element 101.

[0065] <Noise propagation path> The power converter 4 has a configuration that generates, propagates, and radiates electromagnetic noise that interferes with electrical components, etc. Electromagnetic noise is sometimes simply referred to as noise. In the power converter 4, noise propagates due to the flow of high-frequency currents, etc., in the power path. For example, semiconductor components 22, 32 and semiconductor device 110 are sources of noise.

[0066] The semiconductor components 22, 32 and the semiconductor device 110 include electrical circuits that convert voltage and frequency by intermittently interrupting current using semiconductors. High-frequency energy is generated at these points where current is interrupted, and if this energy leaks to the outside through propagation or radiation, it can cause noise interference. While high-frequency energy is absorbed by smoothing capacitors 5 and other components, it may still leak to the outside. Electromagnetic noise can also be generated by a type of switching surge phenomenon caused by current interruption in commutators and other components.

[0067] In this embodiment, two noise propagation paths are formed between the semiconductor component 22 and the body ground. The noise propagation paths are sometimes simply referred to as current-carrying paths. One of the noise propagation paths between the semiconductor component 22 and the body ground is the first noise propagation path. The first noise propagation path includes the drive circuit board 20, the connecting member 67, and the bottom 44. The bottom 44 includes the heat sink 43.

[0068] Noise generated in the semiconductor component 22 propagates to the connecting member 67 via the ground wiring 252 located on the drive circuit board 20. The noise propagated to the connecting member 67 propagates to the heat sink 43. The noise propagated to the heat sink 43 propagates to the upright section 42 and the base 41, and then propagates to the chassis or other body ground. This allows the noise generated in the semiconductor component 22 to be released to the body ground. Alternatively, the noise propagated to the heat sink 43 may propagate to the upright section 42 and the base 41 via the third fixing member 80. In the drawing, the first noise propagation path is indicated by an arrow.

[0069] The first noise propagation path may also include bolts 61 and pins 64. Noise propagated to the ground wiring 252 may propagate to the connecting member 67 via bolts 61. Noise propagated to the connecting member 67 may propagate to the heat sink 43 via pins 64. In the first noise propagation path, the first fixing member 60 plays a role in part of the path that allows noise generated by the semiconductor component 22 to escape to the body ground. The first fixing member 60 serves both the role of fixing the drive circuit board 20 and the heat sink 43 and the role of playing a part in the first noise propagation path.

[0070] Furthermore, the semiconductor component 22 is a heat-generating component. It is desirable that the heat generated by the semiconductor component 22 be dissipated. In this embodiment, the heat generated by the semiconductor component 22 is dissipated to the heat sink 43 via the first fixing member 60. Because the first fixing member 60 is made of metal, the thermal resistance between the drive circuit board 20 and the heat sink 43 is small. The heat generated by the semiconductor component 22 is easily dissipated to the heat sink 43. In addition to the two roles described above, the first fixing member 60 also serves three roles in efficiently dissipating the heat from the semiconductor component 22.

[0071] Another noise propagation path between the semiconductor component 22 and the body ground is the second noise propagation path. The second noise propagation path includes the drive circuit board 20, the cable 120, the control circuit board 30, the second bolt 74, the stay 90, the first bolt 71, the leg 45, and the base 44. Noise generated in the semiconductor component 22 propagates from the drive circuit board 20 through the cable 120 to the control circuit board 30. Noise propagated to the control circuit board 30 propagates to the stay 90 via the second bolt 74. Noise propagated to the stay 90 propagates to the leg 45 via the first bolt 71. Noise propagated to the leg 45 propagates to the base 44 and then to the chassis, etc., which constitute the body ground.

[0072] In the second noise propagation path, the path length is longer than the first noise propagation path because the noise travels through the cable 120, the control circuit board 30, the second fixing member 70, and the stay 90. First, the length of the cable 120 is longer than the current flow path between the first connection point P1, which is the connection point between the bolt 61 and the drive circuit board 20, and the second connection point P2, which is the connection point between the pin 64 and the heat sink 43. The current flow path between the first connection point P1 and the second connection point P2 is shorter than the length of the cable 120. The impedance of the first noise propagation path is lower than the impedance of the second noise propagation path. For this reason, much of the noise generated in the semiconductor component 22 propagates to the body ground via the first noise propagation path rather than the second noise propagation path. The noise generated in the semiconductor component 22 can be efficiently discharged to the ground via the first noise propagation path.

[0073] The noise that passes through the noise propagation path is not limited to noise generated by semiconductor component 22. Noise generated by semiconductor device 110 also enters the noise propagation path. The entry paths include radiation and propagation. A signal terminal 105 is electrically connected to the drive circuit board 20 by solder or the like. Noise generated by semiconductor device 110 propagates to the drive circuit board 20 via the signal terminal 105. In addition to the noise generated by semiconductor component 22, noise generated by semiconductor device 110 propagates to the body ground through the noise propagation path.

[0074] Unlike this embodiment, if the first fixing member 60 does not include a connecting member 67, the first noise propagation path is not formed. In this case, the noise propagates to the body ground via the second noise propagation path. In addition to the noise generated by the semiconductor component 32, the second noise propagation path includes noise generated by the semiconductor component 22 and the semiconductor module 100, as well as noise generated by surrounding electrical components. For this reason, in the case where the first fixing member 60 does not include a connecting member 67, it is necessary to mount a filter component for noise removal on the control circuit board 30. A capacitor 27 is one example of a filter component. In this embodiment, much of the noise generated by the semiconductor component 22 and the semiconductor module 100 flows through the first noise propagation path. The amount of noise propagating through the second noise propagation path can be suppressed. Consequently, there is no need to mount extra filter components on the control circuit board 30. In this embodiment, an increase in the size of the control circuit board 30 in the planar direction can be suppressed.

[0075] <Effects and Effects> The power converter 4 comprises a drive circuit board 20, a housing 40, a non-conductive frame 50, and a first fixing member 60. The bottom 44 is fixed to one end 50A via a pin 64, which is part of the first fixing member 60. The bottom 44 is connected to ground. The drive circuit board 20 is fixed to the other end 50B via a bolt 61, which is part of the first fixing member 60. The bolt 61 and the pin 64 are electrically and mechanically connected via a connecting member 67, which is part of the first fixing member 60. The drive circuit board 20, the non-conductive frame 50, and the bottom 44 are electrically and mechanically connected via the first fixing member 60. The first fixing member 60 serves both the role of fixing the drive circuit board 20, the non-conductive frame 50, and the bottom 44, and the role of providing an electrical path between the drive circuit board 20 and the bottom 44.

[0076] Unlike this embodiment, providing a separate component for the current path complicates the structure. For example, Patent Document 1 provides a first conductive member for the current path, separate from the fixing member. The first conductive member is soldered to the frame ground terminal of the substrate at one end and connected to the housing at the other end via wire bonding. Providing a separate component for the current path in this way requires new connection points on the substrate and housing. This increases the size and complexity of the structure. Increased size can restrict the placement of peripheral components or reduce design flexibility.

[0077] In this embodiment, since the first fixing member 60 serves two roles, no new connection points are required on the drive circuit board 20 and the bottom 44. As a result, noise generated on the drive circuit board 20 can be discharged to ground with a simple configuration without increasing the overall size. In a configuration where the first fixing member 60 serves two roles, there are no restrictions on the placement of surrounding components, and a decrease in design flexibility can be suppressed.

[0078] The base 44 has a heat sink 43 for cooling the semiconductor module 100. The heat sink 43 is fixed to the non-conductive frame 50 via pins 64. This allows the first fixing member 60 to dissipate noise generated in the drive circuit board 20 to the ground and efficiently dissipate heat from the drive circuit board 20 to the heat sink 43. This suppresses thermal damage to the drive circuit board 20. Semiconductor components 22 and electrical components 24 can be arranged more densely on the drive circuit board 20. Consequently, an increase in size in the planar direction can be suppressed.

[0079] The power converter 4 comprises a control circuit board 30, a second fixing member 70, and a cable 120. The control circuit board 30 is electrically connected to the drive circuit board 20 and controls the drive circuit board 20. The second fixing member 70 fixes the control circuit board 30 to the housing 40. The cable 120 electrically connects the drive circuit board 20 and the control circuit board 30.

[0080] As previously described, noise propagates through a first noise propagation path and a second noise propagation path. The first noise propagation path consists of the drive circuit board 20, the first fixing member 60, and the base 44. The second noise propagation path consists of the drive circuit board 20, the cable 120, the control circuit board 30, the second fixing member 70, the stay 90, the legs 45, and the base 44. In this embodiment, a portion of the noise generated on the drive circuit board 20 propagates to the ground through the first noise propagation path, which does not pass through the control circuit board 30. This suppresses the propagation of noise generated on the drive circuit board 20 to the control circuit board 30.

[0081] In this embodiment, the current path between the first connection point P1 and the second connection point P2 is shorter than the length of the cable 120. Much of the noise generated in the drive circuit board 20 propagates to the body ground via the first noise propagation path rather than the second noise propagation path. Propagation of noise generated in the drive circuit board 20 to the control circuit board 30 is easily suppressed. Noise generated in the drive circuit board 20 can be efficiently discharged to the ground.

[0082] The first fixing member 60 includes a bolt 61, a pin 64, and a connecting member 67. The connecting member 67 electrically and mechanically connects the bolt 61 and the pin 64. The connecting member 67 is enclosed within the fixed portion 59, which is part of the non-conductive frame 50. The connecting member 67 is not in contact with the main terminal 104 of the semiconductor module 100. This suppresses the flow of current through the main terminal 104 to ground via a noise propagation path. This can prevent unintended paths from occurring in the power conversion circuit.

[0083] (Second Embodiment) Figure 8 is a cross-sectional view of the power converter 4 of the second embodiment. Figure 9 is a perspective view of the connecting member 267 of the second embodiment. The power converter 4 of the second embodiment has a different shape from the connecting member 67 of the first embodiment. The connecting member 267 of the second embodiment has a terminal 268A at one end, a terminal 268B at the other end, and a connecting portion 269 that connects the two terminals 268A and 268B. The two terminals 268A and 268B are ring-shaped and flattened in the Z direction. The two terminals 268A and 268B are round terminals. The terminal 268A at one end has a hole 268AH that penetrates in the thickness direction of the plate. The terminal 268B at the other end has a hole 268BH that penetrates in the thickness direction of the plate.

[0084] The connecting portion 269 is roughly U-shaped. The connecting portion 269 has a first extension portion 269A, a second extension portion 269B, and a third extension portion 269C that connects them. The third extension portion 269C extends in the Z direction. The third extension portion 269C has one end and the other end at its Z-direction end. The first extension portion 269A is connected to one end of the third extension portion 269C. The first extension portion 269A extends in the plane direction and connects the terminal 268A at one end to the third extension portion 269C. The second extension portion 269B extends in the plane direction and connects the terminal 268B at the other end to the third extension portion 269C.

[0085] A connecting member 267 is passed through hole 59H. One end 59A and the terminal 268A are flush in the planar direction. The other end 59B and the terminal 268B are flush in the planar direction. Hole 268AH communicates with hole 59H. Holes 268AH and 59H are connected in the Z direction to hole 431H of the heat sink 43. A pin 64 is inserted through the connected holes 268AH, 59H, and 431H. The shaft portion 66 is fixed to the terminal 268A and the inner wall of the heat sink 43. The pin 64 is electrically and mechanically connected to the terminal 268A. On the other end, hole 268BH communicates with hole 59H. Holes 268BH and 59H are connected in the Z direction to hole 20H of the drive circuit board 20. A bolt 61 is inserted through the consecutive holes 268BH, 59H, and 20H. The shaft portion 63 is fixed to the other end terminal 268B and the inner wall of the drive circuit board 20. The bolt 61 is electrically and mechanically connected to the other end terminal 268B.

[0086] The first noise propagation path of the second embodiment consists of the drive circuit board 20, the first fixing member 60, and the base 44. Noise generated in the semiconductor component 22 propagates to the other end terminal 268B via the ground wiring 252. Noise propagated to the other end terminal 268B propagates to the one end terminal 268A via the connecting part 269. Noise propagated to the one end terminal 268A propagates to the heat sink 43. Noise propagated to the heat sink 43 propagates to the upright part 42 and the base 41, and then propagates to the chassis, etc., which becomes the body ground. Noise propagated to the ground wiring 252 may also propagate to the other end terminal 268B via the bolt 61. Noise propagated to the one end terminal 268A may also propagate to the heat sink 43 via the pin 64. This also produces the same effects as the first embodiment.

[0087] Furthermore, the connecting portion 269 of the connecting member 267 is bendable. The connecting portion 269 bends in a direction different from the Z direction. Even if the shaft portion 63 and the shaft portion 66 cannot be arranged coaxially in the Z direction, the one-end fixing portion 64 and the other-end fixing portion 61 can be fixed to the fixed portion 59 with the connecting portion 269 bent. This allows the one-end terminal 268A to be electrically and mechanically connected to the shaft portion 66, and the other-end terminal 268B to the shaft portion 63.

[0088] (Third embodiment) Figure 10 is a cross-sectional view of the power converter 4 of the third embodiment. The power converter 4 of the third embodiment has a first fixing member 360 that is different from that of the first embodiment. The first fixing member 360 of the third embodiment has a bolt 361. The first fixing member 360 of the third embodiment does not have a pin 64 and a connecting member 67. The bolt 361 has a head 362 and a shaft portion 363. The shaft portion 363 extends along the Z direction. The length of the shaft portion 363 is longer than the length in the Z direction obtained by adding the thickness of the drive circuit board 20 to the fixed portion 59. A hole 359H is formed in the fixed portion 59 that penetrates in the Z direction. The diameter of the hole 359H is almost equal to the diameter of the hole 20H.

[0089] Holes 20H and 359H and hole 431H in the heat sink 43 are aligned in the Z direction. The shaft portion 363 is inserted through the aligned holes 20H, 359H, and 431H. The shaft portion 363 is fixed to the drive circuit board 20, the fixed portion 59, and the inner wall of the heat sink 43. In the third embodiment, the drive circuit board 20 and the heat sink 43 are integrally fixed to the fixed portion 59 via the head portion 362. This also produces the same effects as in the first embodiment. In the third embodiment, only the shaft portion 363 is enclosed within the fixed portion 59. In the third embodiment, since there is no connecting member 67, the diameter of the fixed portion 59 can be made smaller than in the first embodiment. A larger housing space 57 can be secured.

[0090] (Fourth Embodiment) Figure 11 is a cross-sectional view of the drive circuit board 20 of the fourth embodiment. The drive circuit board 20 of the fourth embodiment has wiring 25 and via conductors 26 as conductors. The via conductor 26 electrically connects the wiring 25 of different layers. In the fourth embodiment, ground wiring 252 is arranged on both the front surface 20B and the back surface 20A. The via conductor 26 is formed by placing a conductor, such as plating, in a through hole formed in the insulating layer constituting the insulating substrate. The via conductor 26 electrically connects the ground wiring 252B arranged on the front surface 20B and the ground wiring 252A arranged on the back surface 20A. The ground wiring 252B arranged on the front surface 20B may be referred to as the first wiring. The ground wiring 252A arranged on the back surface 20A may be referred to as the second wiring.

[0091] The ground wiring 252B on the front surface 20B is routed so as to overlap with the head 65 in the Z direction. The ground wiring 252B on the front surface 20B is in close contact with the head 65 in the Z direction. The ground wiring 252A on the back surface 20A is routed so as to overlap with the connecting member 67 in the Z direction. The ground wiring 252A on the back surface 20A is in close contact with the connecting member 67 in the Z direction. A via conductor 26 is arranged on the drive circuit board 20 in the area where it overlaps with the head 65 and the connecting member 67 in the Z direction. According to the fourth embodiment, noise propagating through the ground wiring 252B on the front surface 20B side is propagated to the connecting member 67 via the via conductor 26 and the ground wiring 252A on the back surface 20A side.

[0092] According to this, for example, the noise propagation path is shortened compared to a configuration in which the ground wiring 252B is located only on the surface 20B. When the ground wiring 252B is located only on the surface 20B, the noise propagates from the ground wiring 252B through the head portion 62 and then through the shaft portion 63 to the connecting member 67. In the fourth embodiment, the noise propagates from the ground wiring 252B located on the surface 20B to the connecting member 67 through the via conductor 26 and the ground wiring 252A on the back surface 20A without going through the bolt 61. According to this, the noise propagation path is shortened. The inductance of the noise propagation path is reduced. The impedance of the noise propagation path can be lowered.

[0093] (Fifth embodiment) Figure 12 is a cross-sectional view of the drive circuit board 20 of the fifth embodiment. The drive circuit board 20 of the fifth embodiment has a capacitor 27 in addition to semiconductor components 22 and electrical components 24. For example, the capacitor 27 is a ceramic capacitor that removes noise in a specific frequency range. The capacitor 27 is a different component from the electrical component 24. The capacitor 27 is connected to a ground wire 252. The ground wire 252 is connected at one end to the ground terminal of the semiconductor component 22. The other end of the ground wire 252 is connected to a bolt 61. The capacitor 27 is provided between the connection point with the semiconductor component 22 and the connection point with the bolt 61. The capacitor 27 is connected to the semiconductor component 22 and the bolt 61 via the ground wire 252. According to this, noise of a specific frequency among the noise passing through the first noise propagation path is removed by the capacitor 27. According to the fifth embodiment, the impedance of the noise propagation path is lowered at a specific frequency.

[0094] This disclosure is described in accordance with the embodiments, but it is understood that this disclosure is not limited to such embodiments or structures. This disclosure also includes various modifications and variations within the scope of equivalence. In addition, while various combinations and forms are shown in this disclosure, other combinations and forms that include one, more, or fewer of those elements also fall within the scope and concept of this disclosure.

[0095] (Disclosure of technical ideas) This specification discloses several technical concepts, as described in the following paragraphs. Some paragraphs are written in a multiple dependent form, where subsequent paragraphs optionally refer to preceding paragraphs. Furthermore, some paragraphs are written in a multiple dependent form, referring to other multiple dependent forms. These paragraphs written in multiple dependent forms define several technical concepts.

[0096] (Technical thought 1) Semiconductor module (100) and A nonconductive frame (50) housing the semiconductor module, A metal housing (40) having a bottom (44) provided at one end of the nonconductive frame, A substrate (20) is provided at the other end of the nonconductive frame, The system comprises the base, the non-conductive frame, and a conductive fixing member (60) for fixing the substrate, The bottom is connected to the ground, An electrical device in which the fixing member, in addition to its role in fixing, also serves as an electrical pathway between the substrate and the bottom.

[0097] (Technical thought 2) The bottom has a cooler (43) for cooling the semiconductor module, The electrical apparatus according to technical concept 1, wherein the non-conductive frame is fixed to the cooler via the fixing member.

[0098] (Technical Thought 3) The aforementioned fixing member is A one-end fixing portion (64) that fixes the non-conductive frame and the cooler, The other end fixing portion (61) that fixes the substrate and the nonconductive frame, It has a connecting member (67) that electrically and mechanically connects the one-end fixing portion and the other-end fixing portion, The electrical equipment according to technical concept 2, wherein the connecting member is enclosed within the non-conductive frame.

[0099] (Technical Thought 4) The aforementioned connecting member is The terminal (268A) on one end connects to the aforementioned fixed part on one end, The other end terminal (268B) connects to the other end fixing portion, An electrical device according to technical concept 3, having a flexible connecting portion (269) that connects the one-end terminal and the other-end terminal.

[0100] (Technical Thought 5) The aforementioned substrate is The printed circuit board (21) has a front surface (20B) and a back surface (20A) that are separated in the thickness direction, and a semiconductor component (22) mounted on the front surface. The aforementioned printed circuit board further, An electrical device according to any one of technical concepts 1 to 4, comprising: a first wiring (252B) that electrically connects the semiconductor component and the fixing member on the surface; a second wiring (252A) that electrically connects the fixing member on the back surface; and a via conductor (26) that electrically connects the first wiring and the second wiring.

[0101] (Technical Thought 6) The electrical device according to technical idea 5, wherein the substrate is mounted on the surface and electrically connected to the semiconductor component and the fixing member via the first wiring, and further comprises a filter component (27) that removes noise of a specific frequency.

[0102] (Technical Thought 7) The fixing member is an electrical device according to technical concept 2, having a bolt (361) that integrally fixes the substrate, the non-conductive frame, and the cooler.

[0103] (Technical Thought 8) A control circuit board (30) is connected to the aforementioned drive circuit board and controls the drive circuit board, A second fixing member (70), which is different from the first fixing member and fixes the control circuit board to the housing, An electrical device according to any one of technical ideas 2 to 7, further comprising a cable (120) connecting the drive circuit board and the control circuit board.

[0104] (Technical Thought 9) The electrical equipment according to technical concept 8, wherein the current path between the first connection point (P1), which is the connection point between the first fixing member and the drive circuit board, and the second connection point (P2), which is the connection point between the first fixing member and the bottom, is shorter than the length of the cable. [Explanation of Symbols]

[0105] 100 Semiconductor module, 120 Cable, 20 Drive circuit board, 20A Back side, 20B Front side, 21 Printed circuit board, 22 Semiconductor component, 252A Second wiring, 252B First wiring, 26 Via conductor, 268A One-end terminal, 268B Other-end terminal, 269 Connecting part, 27 Filter component, 30 Control circuit board, 361 Volt, 40 Housing, 43 Cooler, 44 Bottom, 50 Non-conductive frame, 60 Fixing member, First fixing member, 61 Other-end fixing part, 64 One-end fixing part, 67 Connecting member, 70 Second fixing member, P1 First connection part, P2 Second connection part.

Claims

1. A semiconductor module (100) and A non-conductive frame (50) housing the semiconductor module, A metal housing (40) having a bottom (44) provided at one end of the non-conductive frame, A substrate (20) is provided at the other end of the nonconductive frame, The system comprises the base, the non-conductive frame, and a conductive fixing member (60) for fixing the substrate. The bottom is connected to the ground, An electrical device in which the fixing member, in addition to its role in fixing, also serves as an electrical pathway between the substrate and the bottom.

2. The bottom has a cooler (43) for cooling the semiconductor module. The electrical apparatus according to claim 1, wherein the non-conductive frame is fixed to the cooler via the fixing member.

3. The aforementioned fixing member is A fixing portion (64) at one end that fixes the non-conductive frame and the cooler, The other end fixing portion (61) that fixes the substrate and the nonconductive frame, It has a connecting member (67) that electrically and mechanically connects the one-end fixing portion and the other-end fixing portion, The electrical device according to claim 2, wherein the connecting member is enclosed within the non-conductive frame.

4. The aforementioned connecting member is The terminal (268A) on one end connects to the aforementioned fixed part on one end, The other end terminal (268B) connects to the other end fixing portion, The electrical device according to claim 3, further comprising a flexible connecting portion (269) that connects the one-end terminal and the other-end terminal.

5. The aforementioned substrate is The printed circuit board (21) has a surface (20B) and a back surface (20A) that are separated in the thickness direction, and a semiconductor component (22) mounted on the surface. The aforementioned printed circuit board further, The electrical device according to any one of claims 1 to 4, further comprising: a first wiring (252B) that electrically connects the semiconductor component and the fixing member on the surface; a second wiring (252A) that electrically connects the fixing member on the back surface; and a via conductor (26) that electrically connects the first wiring and the second wiring.

6. The electrical device according to claim 5, wherein the substrate is mounted on the surface and electrically connected to the semiconductor component and the fixing member via the first wiring, and further comprises a filter component (27) that removes noise of a specific frequency.

7. The electrical apparatus according to claim 2, wherein the fixing member has a bolt (361) that integrally fixes the substrate, the non-conductive frame, and the cooler.

8. A control circuit board (30) is connected to the aforementioned drive circuit board and controls the drive circuit board, A second fixing member (70), which is different from the first fixing member and fixes the control circuit board to the housing, The electrical equipment according to any one of claims 2 to 4, further comprising a cable (120) connecting the drive circuit board and the control circuit board.

9. The electrical device according to claim 8, wherein the current path between the first connection portion (P1), which is the connection portion between the first fixing member and the drive circuit board, and the second connection portion (P2), which is the connection portion between the first fixing member and the bottom, is shorter than the length of the cable.

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