Camera device
The camera device uses conductive clips and flexible PCB segment arrangements to enhance image quality and resolution in compact spaces by grounding and aligning high-resolution sensors, addressing the compromise between size and performance.
JP2026086341APending Publication Date: 2026-05-26AXIS
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- AXIS
- Filing Date
- 2025-09-29
- Publication Date
- 2026-05-26
AI Technical Summary
Technical Problem
Camera devices in cramped spaces face a compromise between image quality and resolution due to limited component arrangement, restricting the use of high-resolution components.
Method used
A camera device design featuring conductive clips that snap-fit to a conductive chassis, grounding PCB segments and allowing flexible stacking, with inclined spring engagements to maintain electrical connections and enable active alignment of high-resolution image sensors.
Benefits of technology
Enhances image quality and resolution while maintaining compact size by protecting components from power spikes and allowing loose manufacturing tolerances, reducing costs.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure 2026086341000001_ABST
Abstract
We provide a compact camera device with improved image quality and resolution. [Solution] The camera device comprises a first printed circuit board (PCB) segment having a first ground contact surface, a second PCB segment having an opening defined by a portion of the second PCB segment forming a second ground contact surface, a chassis made of a conductive material, and a clip made of a conductive material that snaps to the chassis, wherein the chassis is configured to support an image sensor and the first and second PCB segments, the first PCB segment is positioned between the chassis and the second PCB segment, and the clip comprises a first contact portion that abuts the first ground contact surface of the first PCB segment and a second contact portion that extends through the opening of the second PCB segment and engages with the second ground contact surface of the second PCB segment.
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