Camera and its mounting method

Abstract

This provides a camera that ensures precise alignment between the optical system and the image sensor, and is not adversely affected by contact with connecting wires. [Solution] The vehicle camera of the present disclosure comprises a housing that forms a housing cavity, an image sensor substrate disposed within the housing cavity and dividing the housing cavity into a first housing portion and a second housing portion, an image sensor mounted on the first surface of the image sensor substrate, and a module securely fixed to the housing and / or the image sensor substrate. The module has an optical system, electronic components, and electrical connection lines connected to the electronic components, the connection lines being routed through or along the image sensor substrate within the housing cavity, and the connection lines being connected by a housing cover or contact substrate located on the second surface of the image sensor substrate or in the second housing portion.

Description

Technical Field

[0001] The present invention relates to a camera for a vehicle, particularly a commercial vehicle, and includes a housing forming a housing cavity, an image sensor substrate disposed within the housing cavity and dividing the housing cavity into a first housing portion and a second housing portion, an image sensor mounted on a first side surface of the image sensor substrate, and a module firmly fixed to the housing and / or the image sensor substrate. The module includes an optical system, electronic components, and electrical connection lines connected to the electronic components.

Background Art

[0002] Such a camera has already been described in Patent Document 1. In particular, this document discloses a camera mounted on a vehicle, particularly a commercial vehicle. This camera includes a housing, at least one optical element disposed within or on the housing, a circuit board group disposed within the housing and including at least one circuit board (each circuit board having at least one active circuit mounted thereon for performing a direct function of the camera), at least one heating element disposed and configured to heat the circuit board group, the optical element, and / or the housing, and at least one heat conduction element disposed between the at least one heating element and the housing and configured to transfer heat of the heating element and / or the circuit board group to the housing. Since the heating element is directly disposed on the circuit board, the optical element is heated through a thermal contact connection on the circuit board. However, such a structure may not have sufficient heating capacity for large optical elements, and thus is only suitable for small optical elements.

[0003] Furthermore, such cameras have already been described in Patent Document 2. In particular, this document discloses a vehicle camera system comprising a first printed circuit board equipped with a lens and an image sensor for capturing image information acquired through the lens, and at least one additional printed circuit board that provides predetermined basic functions to the camera system. The first printed circuit board and each additional printed circuit board each comprises at least one connection unit, through which the printed circuit boards are connected to each other in a modularly interchangeable manner, allowing the functional range of the camera system to be adjusted according to predetermined basic functions. This at least one connection unit includes a plurality of electrical connection groups, through which the first printed circuit board is connected to at least one additional printed circuit board, providing predetermined basic functions to the camera system.

[0004] Furthermore, Patent Document 3 discloses a lens assembly for a camera module, which comprises a lens and a heating assembly disposed on the lens. The heating assembly is configured to generate heat when an electric current flows through it. The heating assembly is connected to the lens-side surface of the image sensor substrate via a wire connected to the image sensor.

[0005] In such cameras, it is crucial that the optical system is precisely positioned or aligned with the image sensor to ensure focusing and the capture of sharp images. The optical system is fixed to the image sensor with adhesive. However, conventional techniques always have the drawback that during camera assembly, the structural arrangement of individual camera components can apply force to the adhesive joint, and if the adhesive is not sufficiently cured, this can critically affect the positional relationship between the optical system and the image sensor. In particular, tension applied to the image sensor substrate can cause the optimal focal position to shift.

[0006] In particular, if the connecting wires connected to the electronic components are fixed to the image sensor substrate, tensile force or pressure applied to the connecting wires may cause the optical system to move slightly relative to the image sensor substrate and, consequently, the image sensor itself. As a result, the focus may be shifted. [Prior art documents] [Patent Documents]

[0007] [Patent Document 1] European Patent Application Publication No. 2884736 [Patent Document 2] European Patent Application Publication No. 3035665 [Patent Document 3] U.S. Patent No. 11086092 [Overview of the project] [Problems that the invention aims to solve]

[0008] Therefore, the object of the present invention is to avoid, or at least mitigate, the drawbacks of the prior art. In particular, it is to provide a camera in which accurate alignment between the optical system and the image sensor is ensured and which is not adversely affected by contact of connecting wires. [Means for solving the problem]

[0009] The problem of the present invention is solved by a camera having the features described in claim 1, or a mounting method having the features described in the independent claim.

[0010] Therefore, the problem of the present invention is solved by a camera. This camera is intended for use in vehicles, particularly commercial vehicles. For example, this camera can be used as part of a camera monitoring system, such as a mirror replacement system.

[0011] This camera features a housing structure that forms a housing cavity. This means that each component of the camera is located inside the housing, or at least partially covered by the housing.

[0012] This camera has an image sensor board in the housing cavity. This image sensor board is also called a sensor head board. The image sensor board divides the housing or housing cavity into a first housing section and a second housing section. In other words, the image sensor board, or the cross-section of the image sensor board, divides the cavity section inside the housing into two parts. Here, "division" or "separation" does not mean a sealed boundary, but rather a state in which the housing sections are connected to each other, for example, through free space. The first housing section is also called the front housing section, and the second housing section is also called the rear housing section.

[0013] This camera has an image sensor mounted on a first surface of an image sensor substrate. The first surface of the image sensor substrate is also called the front surface, and the second surface opposite the first surface is also called the back surface. The first surface of the image sensor substrate is located in or faces the first housing, and the second surface of the image sensor substrate is located in or faces the second housing. This means that the image sensor is located in or faces the first housing.

[0014] This camera includes a module permanently fixed to the housing and / or image sensor substrate. That is, the module is fixed to the housing and / or image sensor substrate, or positioned in a defined location. The module consists of an optical system, electronic components, and electrical connection lines connected to the electronic components. In particular, each component constituting the module may be firmly connected to one another. The optical system is also called a lens or lens array. The connection lines are used, in particular, for supplying power / voltage to the electronic components and / or transmitting data. The data may include, for example, control data / signals. The optical system is located in particular in the first part of the housing, or within the first part. This means that the first surface of the image sensor substrate faces the optical system. Therefore, the first surface of the image sensor substrate can be called the optical system side. Furthermore, even if it is located outside / above the first part of the housing or the first surface of the image sensor substrate, it can still be said to be on the optical system side. Electronic components can be located in particular in the area of ​​the optical system, in the first part of the housing, or on the optical system side. This means that the first surface of the image sensor substrate faces the electronic components.

[0015] According to one aspect of the present disclosure, the connecting wire penetrates or extends along the image sensor substrate within the housing cavity. In other words, the connecting wire extends along the image sensor substrate from a first housing portion to a second housing portion. Penetrating or extending along the image sensor substrate means, in particular, that the connecting wire is independent of the image sensor substrate and is not a component of the image sensor substrate, rather than being integrated with it. Specifically, this means that the connecting wire penetrates and / or extends along the image sensor substrate (as much as possible) without being subjected to force, i.e., it extends along the image sensor substrate without making electrical contact with it. This means that the first end or contact element of the connecting wire is located beyond the first side of the image sensor substrate (i.e., the optical system side, the front of the image sensor substrate, or the front surface of the image sensor substrate), and the second end or contact element of the connecting wire is located beyond the second side of the image sensor substrate (i.e., the rear of the image sensor substrate, or the back surface of the image sensor substrate). The (first or second) contact elements can be configured in particular as plugs, contact springs, and / or spring contacts. The first contact element is used to make (direct) contact with an electronic component. The first contact element may be integrally connected to an electronic component, for example, a heater, such as a (coated) wire connected to the heating foil of the heater. The first contact element is used to make contact with multiple electronic components or to form multiple contacts through (multi-component) electronic components. In particular, the fact that the connecting wire is through does not mean, for example, that a first wire is connected to the front of the image sensor substrate, a wire is formed inside the image sensor substrate (between the individual layers of the image sensor substrate), and the back of the image sensor substrate is connected to a second wire, which is used for contact in the second housing. However, this also means that the connecting wire is not limited to being integrally configured between the first and second contact elements.

[0016] According to one aspect of this disclosure, the connection line contacts a second surface of the image sensor substrate, or a housing cover or contact substrate located in a second housing portion. This means that the second contact element contacts (directly or indirectly) the second surface of the image sensor substrate (i.e., the back side of the image sensor substrate), the housing cover (the surface facing the back side of the image sensor substrate), or the contact substrate (the surface facing the back side of the image sensor substrate). In other words, the connection point of the second contact element is located in a second housing portion and is formed, for example, by the back of the image sensor substrate itself, a housing component, in particular the housing cover, or the contact substrate. In particular, the second contact element functions as a voltage connection and / or data connection to an electronic component. That is, the electronic component is supplied with voltage and / or data via the image sensor substrate, the housing cover, or the contact substrate.

[0017] Therefore, the essence of this disclosure is that electronic components located in the optical region, i.e., the front region of the housing or camera, are connectable via connecting wires located in the rear region of the housing or camera. These connecting wires are routed through (physically / space-wise / mechanically, or without electrical contact with) the image sensor substrate (which separates the front and rear regions) or along the image sensor substrate. In other words, the camera has connection points in another region of the housing for supplying power and / or data to electronic components, and the connection between the electronic components and these connection points is made via connecting wires that pass through the image sensor substrate or between the image sensor substrate and the inner wall of the housing.

[0018] The advantage of this method lies particularly in the fact that the connecting wires no longer come into contact with the front of the image sensor substrate. Since the front of the image sensor substrate is inaccessible after assembly, contact with the front of the image sensor substrate must be made during the assembly process to align the optical system with the image sensor. However, when contact is made or when the camera is moved (even after assembly), force is applied to the connecting wires, which can affect the alignment of the optical system and the image sensor, potentially leading to a shift in the focal point. By routing the connecting wires through the image sensor substrate or along the image sensor substrate, the connecting wires become accessible from the back of the housing, and the alignment of the optical system and the image sensor can be performed after the assembly process. Therefore, after the adhesive has cured, the connection can be established by connecting the connecting wires to the back of the image sensor substrate, the housing cover, or the connecting substrate. This improves or ensures the alignment of the optical system and the image sensor.

[0019] According to one embodiment, the connecting wire may be flexible, such as in the form of a cable, wire, or flexible printed circuit board connection, or it may be rigid.

[0020] According to one embodiment, the component forming the connection point, namely the image sensor substrate, housing cover, or contact substrate, may have a connection portion, particularly a plug connection portion, for connecting to another component, in particular a plug connection. This means that the component forming the connection point itself does not need to ensure the supply of voltage and / or data, and the supply is provided only through the component forming the connection point, allowing for downstream connections.

[0021] According to a preferred embodiment, a recess can be formed within the image sensor substrate or between the inner wall of the housing and the image sensor substrate for connecting wires to extend. Furthermore, additional components such as cable guides connected to the housing can also be placed between the inner wall of the housing and the image sensor substrate, or in the recess formed therein. This recess can be formed, for example, by a hole penetrating in the thickness direction of the substrate. Alternatively, a recess can be formed between the inner wall of the housing and the image sensor substrate by matching the cross-sectional shapes of the image sensor substrate and the housing in the region of the image sensor substrate, particularly by making the cross-section of the image sensor substrate smaller than the cross-section of the housing, or by reducing the filling density. This means that the recess is formed within the image sensor substrate and is completely surrounded by the material of the image sensor substrate. Alternatively, the recess between the inner wall of the housing and the image sensor substrate can be formed so that it is partially surrounded by the inner wall of the housing and the image sensor substrate. In other words, the image sensor substrate can have a smaller cross-section than the housing (in the region of the image sensor substrate). This means that the recess allows the connecting wire to extend through the image sensor substrate (perpendicular to the cross-section of the image sensor substrate) or along the image sensor substrate.

[0022] According to a further development of the preferred embodiment, the recess may have a larger cross-sectional area than the connecting wire. In particular, the connecting wire may be positioned to be widely or completely separated from the housing and / or image sensor substrate on the periphery side. This provides the advantage of allowing the connecting wire to be guided as smoothly as possible.

[0023] According to a preferred embodiment, the optical system may be fixed by an adhesive to the housing and / or the image sensor substrate, particularly to a region on the first side of the image sensor substrate. In other words, the lens assembly is connected to the housing and / or the image sensor substrate via at least one bonding point / bonding region. Thereby, the optical system can be accurately positioned with respect to the image sensor. Preferably, the bonding point (or the first bonding point) may be arranged on the first side of the image sensor substrate and may be configured to surround the image sensor circumferentially. For example, the bonding point may be formed in a (closed) annular shape. Thereby, the alignment can be securely fixed. Preferably, the bonding point (or the second bonding point) may be arranged on one end face of the housing. For example, the bonding point may be formed in a (closed) annular shape.

[0024] Specifically, the optical system is positioned or adjusted with respect to the distance and / or inclination with the image sensor so that a focused image can be obtained. The optical system can be centered or aligned at a position with an offset axis with respect to the image sensor.

[0025] According to a preferred embodiment, the image sensor substrate can be firmly fixed to the housing. Specifically, for example, it can be fitted through pins provided on the housing and holes provided on the image sensor substrate, and / or fixed by screwing and / or by an adhesive. Thereby, the positional relationship between the image sensor substrate and the housing is securely fixed. Such accurate positioning is particularly important when the optical system is also adhered to the image sensor substrate. Alternatively, the image sensor substrate may not be firmly fixed to the housing, and the optical system may be firmly fixed to the housing. In this case, the image sensor substrate is aligned with the optical system. That is, the image sensor substrate is indirectly connected to the housing via the optical system.

[0026] In a preferred embodiment, the housing may be provided with a (cable) guide for the connecting cable. This guide may be, for example, a clip or a frame.

[0027] According to a preferred embodiment, the electronic components may be a heater, a focusing device, a cleaning element, and / or an electric motor and / or a control element for controlling a light source. The heater may be configured, for example, as in the heating device described in Patent Document 3, and connected to an image sensor substrate. The focusing device may be used to adjust focus, filter, or aperture. The light source may be an infrared light source in particular. The electronic components may be located in the area of ​​the optical system in particular. The electronic components are preferably, though not necessarily, connected to the optical system. In particular, the electronic components are used to provide additional functionality to the optical system. This means that the electronic components are functionally associated with the optical system and / or located in close proximity to the optical system, i.e., they are not entirely arbitrary electronic components.

[0028] In a preferred embodiment, the connecting wire may be directly connected to a connection point formed on the second side of the image sensor substrate, the housing cover, or the contact substrate, and the connection between the connecting wire and the connection point is formed as a floating connection. In other words, when the connecting wire makes contact, a flexible connection is formed by means such as a spring, thereby reducing the force acting on the entire system. This means that there is some play between the connecting wire or the (second) contact element and the connection point. This has the advantage of reducing the force that may be generated by the connection between the (second) contact element and the connection point and may affect the alignment of the optical system and the image sensor.

[0029] In a preferred embodiment, the camera may be equipped with a voltage connection for connecting to a voltage source or an external voltage source. In this preferred embodiment, the voltage source or voltage connection is located in the housing cavity and connected to the electronic components via a connection line. This means that the component forming the connection point either directly incorporates the voltage source and functions to supply voltage directly to the electronic components, or the component forming the connection point itself functions as a direct connection to the voltage source and indirectly supplies voltage to the electronic components. In other words, the voltage source can be built into the camera or supplied using an external voltage source, which can be connected, for example, via a coaxial cable (Power over Coax), a data line (Power over Data Line), or another connection line.

[0030] According to a preferred embodiment, if the connecting line serves to supply data to an electronic component, it may be connectable to or connected to a microcontroller or a control element of a vehicle communication network such as a CAN bus (Controller Area Network Bus).

[0031] In a preferred embodiment, the housing cover may be partially made of plastic. In a preferred embodiment, the housing cover may have (metallic) contact elements. The contact elements of the housing cover can function in particular as connection points, i.e., contacts for contacting a second contact element of a connecting wire. These contact elements are preferably overmolded and may be formed in particular as insert parts. This allows for greater design flexibility in the housing cover while maintaining electrical contact.

[0032] Therefore, the problems of the present invention can also be solved by a camera, and more particularly by a method for mounting the camera described above. This mounting method includes the following steps. • Use adhesive to connect the module to the housing and / or image sensor substrate so that the optical system is aligned with the image sensor, or the image sensor is aligned with the optical system. • Allow the adhesive to harden. Connect the connecting wires. The connection should be made after the adhesive has hardened.

[0033] In other words, the optical system is aligned to the image sensor (or the image sensor to the optical system) via at least one adhesive joint on the housing and / or image sensor substrate (this ensures focus), and the connecting wires are connected to the connection point after the adhesive at the adhesive joint has cured.

[0034] In a preferred embodiment, no external forces are applied to the bonded joint before the adhesive hardens. This means that the only forces applied during the assembly process are those from the joint's own weight and the positioning aids.

[0035] According to a preferred embodiment, the connecting wires can be brought into contact within the second housing portion.

[0036] According to a preferred embodiment, the adhesive can be temporarily fixed by ultraviolet light before curing. This allows for temporary fixing (by light) before curing.

[0037] According to a preferred embodiment, the adhesive can be fully cured in a temperature range of 25 to 200°C, particularly 60 to 100°C, preferably 80 to 90°C, and more preferably 85°C. This means that curing takes place at a high temperature, which can increase its strength. [Brief explanation of the drawing]

[0038] [Figure 1] The camera according to the present invention and its components are shown in perspective views from different viewpoints. [Figure 2] The camera according to the present invention and its components are shown in perspective views from different viewpoints. [Figure 3] The camera according to the present invention and its components are shown in perspective views from different viewpoints. [Figure 4] The camera according to the present invention and its components are shown in perspective views from different viewpoints. [Figure 5] The camera according to the present invention and its components are shown in perspective views from different viewpoints. [Figure 6] This shows the different stages in the camera assembly process. [Figure 7] This shows the different stages in the camera assembly process. [Figure 8] A side view of the camera is shown. [Figure 9] Figure 8 shows a longitudinal cross-sectional view of the camera according to the present invention, cut along the line IX-IX. [Modes for carrying out the invention]

[0039] Figures 1-5 show perspective views of the camera 1 and its components according to this disclosure. The camera 1 is intended for use in vehicles, particularly commercial vehicles. For example, the camera 1 can be used as part of a camera monitoring system, such as a mirror replacement system.

[0040] Camera 1 is equipped with a housing 2. The housing 2 forms or defines a housing cavity. One side of the housing 2 can be called the front of the housing, and the opposite side can be called the back of the housing.

[0041] Camera 1 includes an image sensor substrate 3 located in a housing cavity. The image sensor substrate 3 is surrounded by the housing 2. The edges of the image sensor substrate 3 are in direct contact with the housing 2 in at least part of the area, or are separated from the housing 2 through a surrounding gap 15 (see Figure 9). The image sensor substrate 3 is particularly firmly fixed to the housing 2, and may be caulked to the housing 2.

[0042] The image sensor substrate 3 divides the housing 2, i.e., the housing cavity, into a first housing portion 2a and a second housing portion 2b. The first housing portion 2a is located on the first side of the image sensor substrate 3. The second housing portion 2b is located on the second side (the side opposite the first side) of the image sensor substrate 3. The first housing portion 2a is also called the front housing portion. The first side of the image sensor substrate 3 is also called the front. The second housing portion 2b is also called the rear housing portion. The second side of the image sensor substrate 3 is also called the back. Figures 1 and 2 show the rear side of the housing and the rear side of the image sensor substrate 3.

[0043] In the illustrated embodiment, the front housing portion 2a is provided with a front opening. This means that components can be accessed from the front of the housing 2 for insertion into the housing 2. In the illustrated embodiment, the rear housing portion is provided with a rear opening. This means that components can be accessed from the rear of the housing 2 for insertion into the housing 2. At least one of the openings, the rear opening in the illustrated embodiment, is larger than the image sensor substrate 3 so that the image sensor substrate 3 can be inserted into the housing 2.

[0044] Camera 1 is equipped with an image sensor 4. The image sensor 4 is firmly fixed to the front of the image sensor board 3. Figure 3 is a view of the image sensor board 3 from the front.

[0045] Camera 1 includes an optical system 5. The optical system 5 is firmly fixed to the housing 2 and / or the image sensor substrate 3. In particular, the optical system 5 may be bonded to the housing 2 and / or the image sensor substrate 3. The optical system 5 is located in the front housing portion 2a. In particular, the optical system 5 may be located so as to close the front opening of the housing 2 or the front housing portion 2a. The optical system 5 may be located both inside and outside the housing. In particular, the front of the image sensor substrate 3 may be located facing the optical system 5, or the optical system 5 may be located in the area of ​​the front of the housing. Figure 4 shows the optical system 5 already connected to the image sensor substrate 3.

[0046] Camera 1 includes an electronic component 6. The electronic component 6 is located within the area of ​​the optical system 5 or within the front area of ​​the housing. The optical system 5 may, for example, form a cavity for housing the electronic component 6. In the illustrated embodiment, the electronic component 6 is configured as a heater for the optical system 5. Alternatively, the electronic component 6 may be configured as a focusing device. Alternatively, the electronic component 6 may be configured as a cleaning element. Alternatively, the electronic component 6 may be configured as a control element for controlling an electric motor and / or a light source. Camera 1 may include multiple electronic components 6. Each of the multiple electronic components 6 may have a different function, in particular the functions described above.

[0047] Camera 1 is equipped with an electrical connection line 7. The connection line 7 is connected to an electronic component 6. Specifically, one end (first end) of the connection line 7 may be provided with a first contact element for contacting the electronic component 6. Furthermore, the other end (second end) of the connection line 7 may be provided with a second contact element for contacting a connection point for power supply and / or data supply of Camera 1.

[0048] According to this disclosure, the connection wire 7 in the housing cavity is routed to penetrate or along the image sensor substrate 3. The connection wire 7 (or second contact element) is contacted from the back side (not shown) of the image sensor substrate 3, or by a housing cover (not shown) located in the second housing portion 2b, or by a contact substrate 9 (see Figure 5) located in the second housing portion 2b. This means that the connection point between the electronic component 6 and the connection wire 7 is located in different housing portions. That is, the electronic component 6 is located in the first housing portion 2a, and the connection point is located in the second housing portion 2b.

[0049] For this purpose, the camera 1 is provided with a recess 8 formed inside the image sensor substrate 3 (not shown) or between the inner wall of the housing and the image sensor substrate 3 (see Figures 1 and 2). The connecting wire 7 extends through this recess 8. The recess 8 can be formed, for example, by a notch extending inward on the side opposite to the edge of the image sensor substrate 3 (see Figure 1). Alternatively, the recess 8 can be formed, for example, by adjusting or reducing the cross-section of the image sensor substrate 3 to create a gap, i.e., an unfilled portion, between the edge of the image sensor substrate 3 and the inner wall of the housing.

[0050] Furthermore, as shown in Figure 2, a connection portion can be formed on the back surface of the image sensor substrate 3, in the form of a plug connector, particularly a stack plug connection portion, for electronically connecting the image sensor substrate 3 to another substrate (e.g., a contact substrate 9) or another component.

[0051] Furthermore, as shown in Figure 3, the optical system 5 can be attached to the substrate by providing an adhesive area 11, particularly in the shape of (circular) adhesive beads, on the front surface of the image sensor substrate 3. This adhesive area 11 is positioned around the image sensor 4.

[0052] Furthermore, looking at Figures 1 to 5, it can be seen that the image sensor substrate 3 has a hole 12 and the housing 2 has a pin 13, and that the image sensor substrate 3 can be fixed to the housing 2 via these holes and pins.

[0053] Figures 6 and 7 illustrate different stages of camera assembly. Figure 6 shows the image sensor substrate 3 being inserted into the housing 2 from the rear. The adhesive area 11 is formed on the front surface of the image sensor substrate 3. Adhesive areas 14, particularly in the form of (circular) adhesive beads, are also formed on the end faces of the housing 2 or housing components and are used to secure the optical system 5.

[0054] Figure 8 shows a side view of the camera. Figure 9 shows a longitudinal cross-sectional view of the camera 1 along line IX in Figure 8. This figure particularly clearly shows that the image sensor substrate 3 forms a plane E that divides the housing 2, i.e., the internal space of the housing, into two parts, namely a first housing portion 2a and a second housing portion 2b. The front portion 7a of the image sensor 4, optical system 5, electronic components 6, and connecting wire 7 is located in the first housing portion 2a, and the rear portion 7b of the connecting wire 7 is located in the second housing portion 2b. The connecting wire 7 extends through or along a recess 8 provided in plane E, i.e., the image sensor substrate 3.

[0055] Figure 9 shows that a circumferential gap 15 is formed between the inner wall of the housing and the image sensor substrate, but this gap is smaller than the cross-sectional area of ​​the connecting wire 7.

[0056] Furthermore, Figure 9 shows the adhesive region 11 where the image sensor substrate 3 and the optical system 5 are connected to each other. [Explanation of Symbols]

[0057] 1 Camera 2 Housing 2a First Housing Section 2b Second Housing Section 3. Image sensor substrate 4 Image sensor 5 Optical system 6 Electronic Components 7 connecting wires 7a front 7b Rear 8 recesses 9 Contact substrate 10 Plug connection 11 Adhesive surface 12 holes 13 pins 14 Adhesive surface 15 Circumferential gap E plane

Claims

1. It is a camera for vehicles, The housing that forms the housing cavity, An image sensor substrate is disposed within the housing cavity and divides the housing cavity into a first housing portion and a second housing portion. An image sensor mounted on the first surface of the image sensor substrate, A module comprising an optical system, electronic components, and electrical connection lines connected to the electronic components, the module being firmly fixed to the housing and / or the image sensor substrate, A camera for a vehicle, characterized in that the connecting wires within the housing cavity are routed through or along the image sensor substrate, and the connecting wires are connected to a second surface of the image sensor substrate, or to a housing cover or contact substrate located in the second housing portion.

2. A camera according to claim 1, characterized in that a recess that serves as a passage for the connecting wire is formed inside the image sensor substrate or between the inner wall of the housing and the image sensor substrate.

3. A camera according to claim 1, characterized in that the optical system is bonded to the housing.

4. A camera according to claim 1, characterized in that the optical system is bonded to the image sensor substrate in a first-side region of the image sensor substrate.

5. A camera according to claim 1, characterized in that the image sensor substrate is firmly connected to the housing.

6. A camera according to claim 5, characterized in that the image sensor substrate is caulked and / or screwed and / or bonded to the housing.

7. A camera according to claim 5, characterized in that the image sensor substrate is connected to the housing via the optical system.

8. A camera according to claim 1, characterized in that the electronic component is a heater.

9. A camera according to claim 1, characterized in that the electronic component is a focus adjustment device.

10. A camera according to claim 1, characterized in that the electronic component is a cleaning element.

11. A camera according to claim 1, characterized in that the electronic component is a control element for controlling an electric motor.

12. A camera according to claim 1, characterized in that the electronic component is a light source.

13. A camera according to claim 1, wherein the connecting wire is directly connected to a connection point formed on the second side of the image sensor substrate, the housing cover, or the contact substrate, and the connection between the connecting wire and the connection point is formed as a floating connection.

14. A camera according to claim 1, wherein the camera comprises a voltage connection section for connecting to a voltage source or an external voltage source, the voltage source or the voltage connection section being located in the housing cavity and connected to the electronic component via a connection line.

15. A method for mounting a camera according to claim 1, comprising the following steps: - By connecting the module to the housing and / or the image sensor substrate via an adhesive joint, the optical system is aligned with the image sensor, or the image sensor is aligned with the optical system. - The adhesive joint is cured. - The connecting wire is brought into contact with the connecting wire, and this contact is made after the adhesive joint has hardened.

16. The mounting method according to claim 15, characterized in that the contact of the connecting wire is performed within the second housing portion.

17. The mounting method according to claim 15, characterized in that the adhesive joint is fixed by ultraviolet light before curing.

Images