Phenolic resin foam, and method for producing phenolic resin foam

By pre-coating a formaldehyde scavenger with an aliphatic compound to control its exposure during phenolic resin curing, the foam effectively suppresses formaldehyde release while maintaining physical properties and productivity, addressing emission issues in phenolic resin foams without facing materials.

JP2026089181APending Publication Date: 2026-06-01ASAHI KASEI CONSTRUCTION MATERIALS CO LTD

Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
ASAHI KASEI CONSTRUCTION MATERIALS CO LTD
Filing Date
2024-11-20
Publication Date
2026-06-01

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Abstract

To provide a phenolic resin foam that does not impair the physical properties of the phenolic resin foam and emits extremely little formaldehyde regardless of the presence or absence of a facing material or the surface area of ​​the small endpiece. [Solution] A phenolic resin foam in which 100% of the upper and lower surface layers in the thickness direction have been removed, and the formaldehyde emission amount measured by the JIS A1460 desiccator method is 0.01 mg / L or more and 0.4 mg / L or less, and the closed-cell ratio is 85% or more, and the phenolic resin foam is such that
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