Phenolic resin foam, and method for producing phenolic resin foam
By pre-coating a formaldehyde scavenger with an aliphatic compound to control its exposure during phenolic resin curing, the foam effectively suppresses formaldehyde release while maintaining physical properties and productivity, addressing emission issues in phenolic resin foams without facing materials.
JP2026089181APending Publication Date: 2026-06-01ASAHI KASEI CONSTRUCTION MATERIALS CO LTD
Patent Information
- Application Number
- JP2024202063
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2024-11-20
- Publication Date
- 2026-06-01
Smart Images
Figure 2026089181000005 
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Figure 2026089181000007
Abstract
To provide a phenolic resin foam that does not impair the physical properties of the phenolic resin foam and emits extremely little formaldehyde regardless of the presence or absence of a facing material or the surface area of the small endpiece. [Solution] A phenolic resin foam in which 100% of the upper and lower surface layers in the thickness direction have been removed, and the formaldehyde emission amount measured by the JIS A1460 desiccator method is 0.01 mg / L or more and 0.4 mg / L or less, and the closed-cell ratio is 85% or more, and the phenolic resin foam is such that
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Citation Information
Patent Citations
Foamable resol resin composition and method of making same
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Odorless phenolic foam
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Phenol resin foam
JP2000094620A