Power converter

Abstract

To provide a power conversion device that can improve the accuracy of refrigerant temperature detection. [Solution] The laminate 30 includes a plurality of coolers 40 arranged in the Z direction and a plurality of semiconductor modules 50 placed between adjacent coolers 40, with the spaces between adjacent coolers 40 arranged in multiple stages along a predetermined direction. The temperature sensor module 60 for detecting the temperature of the refrigerant is configured such that the thermal conductivity of one surface 601 is smaller than that of the back surface. The temperature sensor module 60 is placed in a space on a different stage than the semiconductor modules 50. The temperature sensor module 60 is placed between a cooler 40S adjacent to a semiconductor module 50 and a cooler 40R not adjacent to a semiconductor module 50, such that one surface 601 faces the cooler 40S side and the back surface faces the cooler 40R side.

Description

Technical Field

[0001] The disclosure in this specification relates to a power conversion device.

Background Art

[0002] Patent Document 1 discloses a laminate including a semiconductor module and a cooler, and a power conversion device provided with a temperature sensor. The description of the prior art document is incorporated herein by reference as an explanation of the technical elements in this specification.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] The temperature sensor of Patent Document 1 detects the temperature of the refrigerant flowing through the flow path of the cooler. The temperature sensor is provided in a case that houses the laminate and is attached to a support wall that supports the laminate. The temperature sensor is affected by the influence of the atmosphere around the temperature sensor and the heat of the semiconductor module. There is a demand for further improvement in the temperature detection accuracy of the power conversion device.

[0005] One object of the present disclosure is to provide a power conversion device capable of improving the detection accuracy of the refrigerant temperature.

Means for Solving the Problems

[0006] A power conversion device which is one aspect of the disclosure is A laminate (30) comprising a plurality of coolers (40) arranged in a predetermined direction and having a flow path (401) through which a refrigerant flows, and a plurality of semiconductor modules (50) arranged between adjacent coolers and having semiconductor elements (51) that constitute a power conversion circuit, wherein the space between adjacent coolers is provided in multiple stages along a predetermined direction, A temperature sensor module (60) for detecting the temperature of the refrigerant, Equipped with, The temperature sensor module is In a predetermined direction, the thermal conductivity of one side (601) of the temperature sensor module is configured to be less than that of the back side (602). In a space on a different stage from the semiconductor module, between the first cooler (40S), which is adjacent to the semiconductor module, and the second coolers (40D, 40F, 40R), which are not adjacent to the semiconductor module, the cooler is positioned such that one side faces the first cooler and the other side faces the second cooler.

[0007] According to the disclosed power conversion device, the temperature sensor module is placed in the space between adjacent coolers, rather than outside the laminate. This reduces the influence of the atmosphere. Furthermore, the temperature sensor module is positioned so that the side with low thermal conductivity faces the first cooler adjacent to the semiconductor module, and the back side with high thermal conductivity faces the second cooler that is not adjacent to the semiconductor module. This reduces the influence of heat from the semiconductor module. Therefore, the accuracy of detecting the refrigerant temperature can be improved.

[0008] Another aspect of the disclosure is a power converter, A laminate (30) comprising a plurality of coolers (40) arranged in a predetermined direction and having a flow path (401) through which a refrigerant flows, and a plurality of semiconductor modules (50) arranged between adjacent coolers and having semiconductor elements (51) that constitute a power conversion circuit, wherein the space between adjacent coolers is provided in multiple stages along a predetermined direction, A temperature sensor module (60) for detecting the temperature of the refrigerant, Equipped with, The temperature sensor module is In a predetermined direction, the thermal conductivity of one side (601) of the temperature sensor module is configured to be less than that of the back side (602). In a space with a different layer than the semiconductor module, it is positioned such that one side faces the center (30C) of the stack and the other side faces the edges (30FE, 30RE) of the stack.

[0009] According to the disclosed power conversion device, the temperature sensor module is placed in the space between adjacent coolers, rather than outside the laminate. This reduces the influence of the atmosphere. Furthermore, the temperature sensor module is positioned so that the side with low thermal conductivity faces the center of the laminate, and the back side with high thermal conductivity faces the edge of the laminate. This reduces the thermal influence of the semiconductor module. Therefore, the accuracy of refrigerant temperature detection can be improved.

[0010] The various embodiments disclosed in this specification employ different technical means to achieve their respective objectives. The reference numerals in parentheses in the claims are illustrative in their correspondence with the embodiments described later and are not intended to limit the technical scope. The objectives, features, and effects disclosed in this specification will become clearer by referring to the subsequent detailed description and the accompanying drawings. [Brief explanation of the drawing]

[0011] [Figure 1] This figure shows an example of a drive system to which the power conversion device according to the first embodiment is applied. [Figure 2] This is a plan view showing an example of a power conversion device. [Figure 3] Figure 2 is a side view taken from the X1 direction. [Figure 4] This is a cross-sectional view along the line IV-IV in Figure 2. [Figure 5] This is a side view showing a modified example. [Figure 6] This is a cross-sectional view showing a modified example. [Figure 7]It is a side view showing an example of a power conversion device according to the second embodiment. [Figure 8] It is a cross-sectional view showing the periphery of the temperature sensor module. [Figure 9] It is a side view showing a modified example. [Figure 10] It is a cross-sectional view showing a modified example. [Figure 11] It is a side view showing an example of a power conversion device according to the third embodiment. [Figure 12] It is a cross-sectional view showing the periphery of the temperature sensor module.

Embodiments for Carrying Out the Invention

[0012] Hereinafter, a plurality of embodiments will be described based on the drawings. In each embodiment, corresponding components may be denoted by the same reference numerals, and redundant explanations may be omitted. When only a part of the configuration is described in each embodiment, the configurations of other previously described embodiments can be applied to the other parts of the said configuration. Also, not only the combinations of configurations explicitly shown in the description of each embodiment, but also the configurations of multiple embodiments can be partially combined with each other as long as there is no problem with the combination, even if not explicitly stated.

[0013] (First Embodiment) The semiconductor module of this embodiment is applied, for example, to a moving body having a rotating electric machine as a drive source. The moving body is, for example, an electric vehicle such as a battery electric vehicle (BEV), a hybrid electric vehicle (HEV), a plug-in hybrid electric vehicle (PHEV), an electric aircraft such as a drone or an electric vertical take-off and landing aircraft (eVTOL), a ship, construction machinery, or agricultural machinery. BEV is an abbreviation for Battery Electric Vehicle. HEV is an abbreviation for Hybrid Electric Vehicle. eVTOL is an abbreviation for electronic Vertical Take-Off and Landing aircraft. Hereinafter, an example applied to a vehicle will be described.

[0014] <Vehicle drive system> Figure 1 shows an example of a vehicle's drive system. The drive system 1 comprises a DC power supply 2, a rotating electric machine 3, and a power conversion circuit 4.

[0015] DC power supply 2 is a DC voltage source. DC power supply 2 may be a rechargeable secondary battery such as a lithium-ion battery or a nickel-metal hydride battery. DC power supply 2 may also be a device that converts AC power to DC power for output.

[0016] The rotating electric machine 3 is a three-phase AC rotating electric machine. At least one of the rotating electric machines 3 functions as a vehicle drive source, i.e., an electric motor. The rotating electric machine 3 generates torque to drive drive wheels (not shown). At least one of the rotating electric machines 3 may also function as a generator. At least one of the rotating electric machines 3 may be a motor generator having both electric motor and generator functions. For example, the rotating electric machine 3 may be operated as a generator by transmitting the rotation of the axle to the rotating electric machine 3 while the vehicle is running. If the vehicle is equipped with an engine, the rotating electric machine 3 may be operated as a generator by rotating the rotor of the rotating electric machine 3 with the engine.

[0017] The number of rotating electric machines 3 in the drive system 1 may be one or more. The example rotating electric machine 3 includes three rotating electric machines 3A, 3B, and 3C. Rotating electric machines 3A and 3B drive the front wheels of the vehicle. Rotating electric machine 3C drives the rear wheels of the vehicle. Rotating electric machines 3A, 3B, and 3C operate as generators during driving and perform regenerative power generation (regenerative braking).

[0018] The power conversion circuit 4 performs power conversion between the DC power supply 2 and the rotating electric machine 3. The power generated by the rotating electric machine 3 is supplied to, for example, the DC power supply 2 via the power conversion circuit 4. This charges the DC power supply 2.

[0019] The drive system 1 may include a power supply switch, such as an SMR (not shown), between the DC power supply 2 and the power conversion circuit 4. SMR stands for System Main Relay. For example, turning the power supply switch on enables power supply from the DC power supply 2 to the rotating electric machine 3, and turning the power supply switch off cuts off the power supply from the DC power supply 2 to the rotating electric machine 3.

[0020] <Power Conversion Circuit> Figure 1 shows an example of a power conversion circuit 4. The example power conversion circuit 4 includes a filter capacitor 5, a smoothing capacitor 6, a converter 7, and an inverter 8. In Figure 1, for convenience, elements that are present in multiple quantities are represented by a single reference numeral.

[0021] The power conversion circuit 4 is equipped with power lines. The P line, which is the high-potential power line, includes the VL line 9L and the VH line 9H. The VL line 9L is connected to the positive terminal of the DC power supply 2. A converter 7 is provided between the VL line 9L and the VH line 9H. The potential of the VH line 9H is set to be greater than or equal to the potential of the VL line 9L. The N line 10 is the low-potential power line connected to the negative terminal of the DC power supply 2.

[0022] The filter capacitor 5 is connected between the VL line 9L and the N line 10. The positive terminal of the filter capacitor 5 is connected to the VL line 9L between the DC power supply 2 and the converter 7. The negative terminal of the filter capacitor 5 is connected to the N line 10 between the DC power supply 2 and the converter 7. The filter capacitor 5 is connected in parallel with the DC power supply 2. The filter capacitor 5 removes power supply noise from, for example, the DC power supply 2. Because the filter capacitor 5 is located on the lower voltage side than the smoothing capacitor 6, it is sometimes referred to as a low-voltage side capacitor.

[0023] The smoothing capacitor 6 is connected between the VH line 9H and the N line 10. The positive terminal of the smoothing capacitor 6 is connected to the VH line 9H between the converter 7 and the inverter 8. The negative terminal of the smoothing capacitor 6 is connected to the N line 10 between the converter 7 and the inverter 8. The smoothing capacitor 6 is connected in parallel to the upper and lower arm circuits 7HL, 8AHL, 8BHL, and 8CHL, which will be described later. The smoothing capacitor 6 smooths the DC voltage boosted by the converter 7, for example. The voltage across the smoothing capacitor 6 becomes the high DC voltage for driving the rotating electric machine 3. The voltage across the smoothing capacitor 6 is set to be greater than or equal to the voltage across the filter capacitor 5. Because the smoothing capacitor 6 is located on the higher voltage side than the filter capacitor 5, it is sometimes called a high-voltage side capacitor.

[0024] Converter 7 is a DC-DC conversion circuit. Converter 7 converts, for example, a DC voltage to a DC voltage of a different value according to switching control by a control circuit (not shown). Converter 7 has the function of boosting the DC voltage supplied from the DC power supply 2. The example converter 7 also has a step-down function that charges the DC power supply 2 using the charge of the smoothing capacitor 6. Converter 7 has an upper and lower arm circuit 7HL and a reactor 7R.

[0025] The upper and lower arm circuit 7HL has an upper arm 7H and a lower arm 7L. The upper arm 7H and lower arm 7L are connected in series between the VH line 9H and the N line 10, with the upper arm 7H on the VH line 9H side. One terminal of the reactor 7R is connected to the connection point between the upper arm 7H and the lower arm 7L. The other terminal of the reactor 7R is connected to the VL line 9L. The example converter 7 has two phases of the upper and lower arm circuit 7HL and reactor 7R. Alternatively, the upper and lower arm circuit 7HL and reactor 7R may have three or more phases, or only one phase.

[0026] The inverter 8 is an AC-DC conversion circuit. The inverter 8 converts a DC voltage to a three-phase AC voltage according to switching control by the control circuit and outputs it to the rotating electric machine 3. This drives the rotating electric machine 3 to generate a predetermined torque. For example, during regenerative braking of the vehicle, the inverter 8 converts the three-phase AC voltage generated by the rotating electric machine 3 in response to rotational force from the wheels to a DC voltage according to switching control by the control circuit. In this way, the inverter 8 performs bidirectional power conversion between the DC power supply 2 and the rotating electric machine 3. The inverter 8 is configured with three phase upper and lower arm circuits. The example inverter 8 includes inverter 8A corresponding to the rotating electric machine 3A, inverter 8B corresponding to the rotating electric machine 3B, and inverter 8C corresponding to the rotating electric machine 3C.

[0027] Inverter 8A is configured with three phase upper and lower arm circuits 8AHL. The upper and lower arm circuits 8AHL have an upper arm 8AH and a lower arm 8AL. The upper arm 8AH and lower arm 8AL are connected in series between the VH line 9H and the N line 10, with the upper arm 8AH on the VH line 9H side. The connection point between the upper arm 8AH and the lower arm 8AL is connected to the winding of the corresponding phase in the rotating electric machine 3A via the output line 11A.

[0028] Inverter 8B is configured with three phase upper and lower arm circuits 8BHL. The upper and lower arm circuits 8BHL have an upper arm 8BH and a lower arm 8BL. The upper arm 8BH and lower arm 8BL are connected in series between the VH line 9H and the N line 10, with the upper arm 8BH on the VH line 9H side. The connection point between the upper arm 8BH and the lower arm 8BL is connected to the winding of the corresponding phase in the rotating electric machine 3B via the output line 11B.

[0029] Inverter 8C is configured with three phase upper and lower arm circuits 8CHL. The upper and lower arm circuits 8CHL have an upper arm 8CH and a lower arm 8CL. The upper arm 8CH and lower arm 8CL are connected in series between the VH line 9H and the N line 10, with the upper arm 8CH on the VH line 9H side. The connection point between the upper arm 8CH and the lower arm 8CL is connected to the winding of the corresponding phase in the rotating electric machine 3C via the output line 11C. Hereafter, the upper arms 7H, 8AH, 8BH, 8CH and the lower arms 7L, 8AL, 8BL, 8CL may be simply referred to as arms 7H, 7L, 8AH, 8AL, 8BH, 8BL, 8CH, 8CL.

[0030] The upper and lower arm circuits 7HL, 8AHL, 8BHL, and 8CHL are sometimes referred to as "legs." A single-phase upper and lower arm circuit has one upper arm and one lower arm, i.e., two arms. A three-phase upper and lower arm circuit has six arms. Each arm 7H, 7L, 8AH, 8AL, 8BH, 8BL, 8CH, and 8CL is equipped with a switching element. The number of switching elements constituting each arm 7H, 7L, 8AH, 8AL, 8BH, 8BL, 8CH, and 8CL is not particularly limited. There may be one or more. In the case of multiple switching elements, the multiple switching elements connected in parallel to each other are driven on and off at the same timing by a common gate drive signal (drive voltage).

[0031] In the example power conversion circuit 4, the upper arm 7H and lower arm 7L of the upper arm circuit 7HL each have a switching element Q1 and a freewheeling diode D1 connected in antiparallel to the switching element Q1. The upper arm 8AH and lower arm 8AL of the upper arm circuit 8AHL each have a switching element Q2 and a freewheeling diode D2 connected in antiparallel to the switching element Q2. The upper arm 8BH and lower arm 8BL of the upper arm circuit 8BHL each have a switching element Q3 and a freewheeling diode D3 connected in antiparallel to the switching element Q3. The upper arm 8CH and lower arm 8CL of the upper arm circuit 8CHL each have a switching element Q4 and a freewheeling diode D4 connected in antiparallel to the switching element Q4.

[0032] Switching elements Q1, Q2, Q3, and Q4 may have identical specifications. Some specifications of switching elements Q1, Q2, Q3, and Q4 may differ from some specifications of other switching elements. The example switching elements Q1, Q2, Q3, and Q4 are all n-channel type MOSFETs. MOSFET is an abbreviation for Metal Oxide Semiconductor Field Effect Transistor. The diode may be a parasitic diode (body diode) of the MOSFET, or it may be provided separately from the parasitic diode. The anode terminal of the diode is connected to the source terminal of the corresponding MOSFET, and the cathode terminal is connected to the drain terminal.

[0033] Note that the switching elements Q1, Q2, Q3, and Q4 are not limited to MOSFETs. For example, IGBTs may be used. IGBT stands for Insulated Gate Bipolar Transistor. In the case of IGBTs, a freewheeling diode is also connected in antiparallel.

[0034] In the upper and lower arm circuit 7HL, the drain terminal of the switching element Q1 on the upper arm 7H side is connected to the VH line 9H, and the source terminal of the switching element Q1 on the lower arm 7L side is connected to the N line 10. The source terminal of the switching element Q1 on the upper arm 7H side and the drain terminal of the switching element Q1 on the lower arm 7L side are interconnected. The upper and lower arm circuits 8AHL, 8BHL, and 8CHL have the same circuit configuration as the upper and lower arm circuit 7HL.

[0035] The illustrated power conversion circuit 4 further includes a temperature sensor 12. The temperature sensor 12 detects the refrigerant temperature of the cooler, which will be described later. The cooler, together with the semiconductor modules that make up the upper and lower arm circuits 7HL, 8AHL, 8BHL, and 8CHL, forms a laminate. Based on the refrigerant temperature detected by the temperature sensor 12, for example, the flow rate of the refrigerant may be controlled. Based on the detected refrigerant temperature, the driving of the switching elements Q1, Q2, Q3, and Q4 may be controlled.

[0036] The power conversion circuit 4 may include elements to remove high-frequency noise, such as a Y capacitor or an X capacitor. The power conversion circuit 4 may also include a snubber circuit to absorb transient high voltages, so-called switching surges, that occur when switching elements are switched. The power conversion circuit 4 may also include a discharge resistor that forcibly (rapidly) discharges the charge stored in the smoothing capacitor 6 when the power supply from the DC power supply 2 is interrupted.

[0037] The power conversion circuit 4 may include a drive circuit for the switching elements that constitute the power conversion circuit. The drive circuit supplies a drive voltage to the gates of the corresponding arm switching elements Q1, Q2, Q3, and Q4 based on a drive command from the control circuit. By applying the drive voltage, the drive circuit drives the corresponding switching elements Q1, Q2, Q3, and Q4, i.e., turns them on and off. The drive circuit is sometimes referred to as a driver.

[0038] The power conversion circuit 4 may include a control circuit for the switching elements. The control circuit generates drive commands for operating the switching elements Q1, Q2, Q3, and Q4 and outputs them to the drive circuit. The control circuit generates drive commands based on, for example, torque requests input from a higher-level ECU (not shown) and signals detected by various sensors. ECU is an abbreviation for Electronic Control Unit. The control circuit outputs, for example, a PWM signal as a drive command. The control circuit is configured, for example, to include a processor and memory. PWM is an abbreviation for Pulse Width Modulation.

[0039] The various sensors may include, for example, current sensors, rotation angle sensors, and voltage sensors. One current sensor detects the phase current flowing through the windings of each phase of the rotating electric machine 3. Another current sensor detects the current flowing through the reactor 7R. The rotation angle sensor detects the rotation angle of the rotor of the rotating electric machine 3. One voltage sensor detects the voltage across the smoothing capacitor 6. Another voltage sensor detects the voltage across the filter capacitor 5. The power conversion circuit 4 may include at least one of the various sensors.

[0040] <Power converter> Figure 2 is a plan view showing an example of a power converter. Figure 3 is a plan view taken from the X1 direction shown in Figure 2. In Figure 3, for convenience, elements other than the cooler, semiconductor module, and temperature sensor module are omitted. Figure 4 is a cross-sectional view taken along the line IV-IV in Figure 2. In Figure 4, for convenience, elements other than the cooler and temperature sensor module are omitted. In Figure 4, the external connection terminals of the temperature sensor module are omitted. In Figures 3 and 4, the structure of the cooler is shown in a simplified manner.

[0041] In the following, the stacking direction between the cooler and the semiconductor module is defined as the Z direction. The direction perpendicular to the Z direction is defined as the X direction. The direction perpendicular to both the Z and Y directions is defined as the Y direction. The X, Y, and Z directions are in a mutually orthogonal positional relationship. Unless otherwise specified, the shape viewed from the Z direction, in other words, the shape along the XY plane defined by the X and Y directions, is defined as the planar shape. The view from the Z direction is sometimes simply referred to as the planar view.

[0042] The power converter 20 constitutes at least a part of the power conversion circuit 4 described above. The power converter 20 may constitute, for example, only the upper and lower arm circuit 7HL of the converter 7, or only the inverter 8. The power converter 20 may constitute both the upper and lower arm circuit 7HL of the converter 7 and the inverter 8. The power converter 20 may constitute the entire power conversion circuit 4, including the filter capacitor 5, the smoothing capacitor 6, and the reactor 7R.

[0043] The power converter 20 comprises a laminate 30. The laminate 30 includes a plurality of coolers 40 and a plurality of semiconductor modules 50. The power converter 20 comprises at least the laminate 30 including the coolers 40 and semiconductor modules 50, and a temperature sensor module 60. The exemplary power converter 20 further comprises a case 70, a support wall 71, a pressurizing member 72, etc. The exemplary power converter 20 comprises a power conversion circuit consisting of upper and lower arm circuits 7HL, 8AHL, 8BHL, 8CHL, and a temperature sensor 12.

[0044] The laminate 30 is formed by stacking a plurality of coolers 40 and a plurality of semiconductor modules 50 along a predetermined direction, the Z direction. As shown in Figure 4, the cooler 40 has a flow channel 401 inside. A refrigerant 402 flows through the flow channel 401. The refrigerant 402 may be a phase-changing refrigerant such as water or ammonia, or a non-phase-changing refrigerant such as an ethylene glycol-based refrigerant. An example refrigerant is LLC. LLC is an abbreviation for Long Life Coolant.

[0045] The cooler 40 is formed using a metal material with excellent thermal conductivity, such as an aluminum-based material. The example cooler 40 is a flattened tubular body overall. For example, the cooler 40 is made by pressing at least one of a pair of plates (thin metal sheets) into a shape that bulges in the Z direction. Then, the outer edges of the pair of plates are fixed together by crimping or the like, and joined together all around by brazing or the like. This creates a flow path 401 through which the refrigerant 402 can flow between the pair of plates, making it possible to use it as a cooler 40.

[0046] The power converter 20 includes an inlet pipe 41 and an outlet pipe 42. Each of the inlet pipe 41 and the outlet pipe 42 may be made of a single component, or it may be made of multiple components joined together to form an integrated structure. The inlet pipe 41 and the outlet pipe 42 are connected to each of the coolers 40. By supplying refrigerant 402 to the inlet pipe 41 by a pump (not shown), refrigerant 402 flows in the flow path 401 in each of the coolers 40. The refrigerant 402 that has flowed through each of the coolers 40 is discharged through the outlet pipe 42. The example inlet pipe 41 and outlet pipe 42 extend in the Z direction and are drawn out to the outside of the case 70, which will be described later.

[0047] As shown in Figures 2 and 3, the multiple coolers 40 are arranged side by side in the Z direction. The multiple coolers 40 are arranged such that there is space between adjacent coolers 40 for modules to be placed. The space between adjacent coolers 40 is provided in multiple stages along the Z direction. The exemplary stack 30 includes 13 coolers 40. The stack 30 has 12 stages of space, with the 13 coolers 40 arranged with spacing in the Z direction. The modules are in direct or indirect contact with adjacent coolers 40.

[0048] The cooler 40 includes cooler 40F, cooler 40R, and cooler 40S. Cooler 40F is the cooler 40 located at the front end of the laminate 30, which is the end on which the refrigerant 402 is introduced and discharged. Cooler 40R is the cooler 40 located at the rear end, which is the end opposite to the front end in the Z direction. Coolers 40F and 40R are coolers 40 on which modules are adjacent on only one of the two sides in the Z direction. Cooler 40S is the cooler 40 excluding coolers 40F and 40R, and is a cooler 40 on which semiconductor modules 50 are adjacent on at least one side. The outer surface of cooler 40F, which is the side on which modules are not adjacent, forms the front end 30FE of the laminate 30. The outer surface of cooler 40R, which is the side on which modules are not adjacent, forms the rear end 30RE of the laminate 30. The dashed line in Figure 3 indicates the center 30C of the laminate 30.

[0049] The semiconductor module 50 constitutes an upper and lower arm circuit. The semiconductor module 50 is sometimes referred to as a power module or semiconductor device. One semiconductor module 50 may constitute an upper and lower arm circuit for one phase, or it may constitute one arm. One semiconductor module 50 may constitute upper and lower arm circuits for multiple phases. In the example power converter 20, one semiconductor module 50 constitutes an upper and lower arm circuit for one phase. The semiconductor module has a so-called 2-in-1 package structure, with two arms forming a series circuit within a single module.

[0050] The illustrated power converter 20 comprises 11 semiconductor modules 50. The power converter 20 includes two semiconductor modules 50 that constitute the two-phase upper and lower arm circuits 7HL of the converter 7. The power converter 20 includes three semiconductor modules 50 that constitute the three-phase upper and lower arm circuits 8AHL of the inverter 8A. The power converter 20 includes three semiconductor modules 50 that constitute the three-phase upper and lower arm circuits 8BHL of the inverter 8B. The power converter 20 includes three semiconductor modules 50 that constitute the three-phase upper and lower arm circuits 8CHL of the inverter 8C.

[0051] Multiple semiconductor modules 50 are arranged in the Z direction. The semiconductor modules 50 are placed in the space between adjacent coolers 40. The semiconductor modules 50 are arranged in multiple layers in the Z direction. The stack 30 includes a portion in which semiconductor modules 50 and coolers 40 are arranged alternately. Each semiconductor module 50 is sandwiched between two coolers 40. Each semiconductor module 50 is cooled by the coolers 40 from both sides in the Z direction.

[0052] The example semiconductor modules 50 are individually arranged in the space between the coolers 40. One semiconductor module 50 is placed in each space. The 11 semiconductor modules 50 are arranged in 11 of the 12 spaces, starting from the front end 30FE side. Starting from the front end 30FE side, they are arranged in the following order: two semiconductor modules 50 that constitute the upper and lower arm circuit 7HL, three semiconductor modules 50 that constitute the upper and lower arm circuit 8AHL, three semiconductor modules 50 that constitute the upper and lower arm circuit 8BHL, and three semiconductor modules 50 that constitute the upper and lower arm circuit 8CHL.

[0053] In the case of a semiconductor module with a 1-in-1 package structure, the two semiconductor modules that constitute the upper and lower arm circuits for one phase may be placed in a single space, or they may be placed individually within the space.

[0054] The semiconductor module 50 comprises a semiconductor element 51. The exemplary semiconductor module 50 further comprises a main terminal 52 and a signal terminal 53, which are external connection terminals electrically connected to the semiconductor element 51, and a encapsulant 54. Multiple semiconductor modules 50 may have, for example, the same structure as one another.

[0055] The semiconductor element 51 is formed by creating a switching element on a semiconductor substrate made of materials such as silicon (Si) or a wide-bandgap semiconductor with a wider bandgap than silicon. The switching element has a vertical structure so that the main current flows in the thickness direction of the semiconductor substrate. Examples of wide-bandgap semiconductors include silicon carbide (SiC), gallium nitride (GaN), gallium oxide (Ga2O3), and diamond.

[0056] The semiconductor element 51 is formed by creating an n-channel MOSFET as a switching element on a semiconductor substrate, for example, made of SiC. The MOSFET has a vertical structure so that the main current flows in the thickness direction of the semiconductor element 51 (semiconductor substrate). The semiconductor element 51 has main electrodes on both sides in the thickness direction of its own surface. The semiconductor element 51 has a source electrode on one side and a drain electrode on the back side as its main electrodes. The source electrode is formed on a portion of the one side. The drain electrode is formed over almost the entire back surface.

[0057] The main current flows between the drain electrode and the source electrode. The semiconductor element 51 has a pad, which is a signal electrode, on the forming surface of the source electrode. The semiconductor element 51 is arranged such that its thickness direction is substantially parallel to the Z direction. One semiconductor module 50 includes at least one semiconductor element 51 that constitutes the upper arm and at least one semiconductor element 51 that constitutes the lower arm. The semiconductor elements 51 for the upper arm and the semiconductor elements 51 for the lower arm are aligned, for example, in the X direction. The semiconductor elements 51 are positioned so as to overlap with the cooler 40 in a plan view in the Z direction.

[0058] External connection terminals are terminals for electrically connecting the semiconductor element 51 to external equipment. The main terminal 52 is electrically connected to the main electrode of the semiconductor element 51. The example semiconductor module 50 includes a P terminal, an N terminal, and an output terminal as the main terminal 52. The P terminal is electrically connected to the drain electrode of the semiconductor element 51 for the upper arm. The N terminal is electrically connected to the source electrode of the semiconductor element 51 for the lower arm. The output terminal is electrically connected to the connection point (midpoint) between the source electrode of the semiconductor element 51 for the upper arm and the drain electrode of the semiconductor element 51 for the lower arm.

[0059] The signal terminal 53 is electrically connected to the pad of the corresponding semiconductor element 51. The illustrated signal terminal 53 protrudes out of the seal 54 from one side of the seal 54 in the Y direction. The three main terminals 52 protrude out of the seal 54 from the side opposite to the signal terminal 53.

[0060] The encapsulant 54 encapsulates some of the other elements that make up the semiconductor module 50. The remaining parts of the other elements are exposed outside the encapsulant 54. The illustrated encapsulant 54 encapsulates the semiconductor element 51, some of the external connection terminals, etc. Other parts of the external connection terminals protrude outside the encapsulant 54. The encapsulant 54 is made of, for example, resin. The illustrated encapsulant 54 is molded from epoxy resin by a transfer molding method. The encapsulant 54 has a substantially rectangular shape in plan.

[0061] The semiconductor module 50 includes, in addition to the elements described above, a wiring member (not shown). The wiring member provides a wiring function to electrically connect the main electrode and the main terminal 52 of the semiconductor element 51. The wiring member also provides a heat dissipation function to dissipate heat from the semiconductor element 51. The wiring member may be, for example, a substrate with a metal body arranged on one or both sides of an insulating substrate, or it may be a heat sink made of metal. The heat sink may be provided as part of the lead frame. The entire wiring member may be sealed by the sealant 54, or a part of it may be exposed from the sealant 54. Exposing the wiring member can improve heat dissipation.

[0062] For example, if a substrate is used in which the metal bodies on both sides are electrically insulated and separated by an insulating substrate, and the metal body on the back side is exposed from the sealant 54, and in such a configuration that insulation separation between the exposed portion of the wiring member and the cooler 40 is unnecessary, the exposed portion of the wiring member may be in contact with the cooler 40. A bonding material such as solder or sintered Ag may be placed between the exposed portion of the wiring member and the cooler 40. If electrical insulation between the semiconductor module 50 and the cooler 40 is necessary, an insulating member may be interposed between the semiconductor module 50 and the cooler 40. The insulating member may include, for example, a ceramic plate, or a thermal conductive member such as TIM. TIM is an abbreviation for Thermal Interface Material. GF may be used as the thermal conductive member. GF is an abbreviation for Gap Filler.

[0063] The temperature sensor module 60 detects the temperature of the refrigerant 402 flowing through the cooler 40. The temperature sensor module 60 is located in the space between adjacent coolers 40. The temperature sensor module 60 is sandwiched between two coolers 40. The power converter 20 is equipped with one temperature sensor module 60. Details of the temperature sensor module 60 will be described later.

[0064] The case 70 houses at least some of the other elements that constitute the power converter 20. The case 70 supports at least some of the other elements that constitute the power converter 20. The case 70 may be formed from a metal material such as aluminum, or from a resin material. The case 70 may be made of a single component, or it may be made of a combination of multiple components. The example case 70 comprises a base and side walls connected to the base. The base may be, for example, the bottom wall of a box-shaped case 70, or a partition wall (intermediate wall) separating the first and second housing spaces of the case 70. The power converter 20 may include a cover that closes the opening of the case 70.

[0065] The support wall 71 is connected to the base and / or side walls of the case 70. The support wall 71 supports the laminate 30 in the Z direction. The support wall 71 supports the laminate 30 pressed in the Z direction by the pressurizing member 72. The exemplary support wall 71 is a protrusion projecting from the base. The support wall 71 is in contact with the front end 30FE (cooler 40F) of the laminate 30.

[0066] The pressurizing member 72 presses the laminate 30 in the Z direction. The exemplary pressurizing member 72 includes a column 73 and a leaf spring 74. The column 73 is provided in the case 70. The column 73 protrudes from the base. The column 73 is provided such that the laminate 30 is positioned between it and the support wall 71 in the Z direction. The exemplary column 73 is provided on the rear end 30RE side, and the support wall 71 is provided on the front end 30FE side. The pressurizing member 72 includes two columns 73. The two columns 73 are provided apart in the X direction.

[0067] The leaf spring 74 is positioned between the support column 73 and the laminate 30. Both ends of the leaf spring 74 are supported by the two support columns 73. The center of the leaf spring 74 is in direct or indirect contact with the rear end 30RE (cooler 40R) of the laminate 30. In its deformed state, the leaf spring 74 is sandwiched between the support column 73 and the laminate 30. The leaf spring 74 presses the laminate 30 in the Z direction. The pressure from the leaf spring 74 causes the cooler 40 and the semiconductor module 50 to come into close contact, increasing the efficiency of heat transfer from the semiconductor module 50 to the cooler 40. The pressure from the leaf spring 74 causes the cooler 40 and the temperature sensor module 60 to come into close contact, increasing the accuracy of temperature detection of the refrigerant 402 by the temperature sensor module 60.

[0068] In the example case 70, the base has a hole 75. The hole 75 is provided so as to enclose all of the semiconductor modules 50 and temperature sensor modules 60 in a plan view in the Y direction. The support wall 71 and support column 73 are provided outside the hole 75. This makes it possible to connect the signal terminals 53 of the semiconductor module 50 and the external connection terminals 63 of the temperature sensor module 60 to a circuit board or the like through the hole 75.

[0069] <Structure and arrangement of the temperature sensor module> As shown in Figures 2 and 3, the temperature sensor module 60 is aligned in the Z direction together with the semiconductor module 50. The temperature sensor module 60 is located in the space between the coolers 40 where the semiconductor module 50 is not located. It is located in a different row of space than the semiconductor module 50. The example temperature sensor module 60 is located in the 12th row from the front end 30FE and the 1st row from the rear end 30RE out of 12 rows of space. In other words, the temperature sensor module 60 is located in the last row of space. The temperature sensor module 60 is located between the cooler 40R which forms the rear end 30RE and the cooler 40S located next to cooler 40R. Modules including the temperature sensor module 60 and the semiconductor module 50 are arranged alternately with the coolers 40.

[0070] The temperature sensor module 60 is configured such that the thermal conductivity of the contact portion with the cooler 40 on one side 601 of the temperature sensor module 60 is smaller than the thermal conductivity of the contact portion with the cooler 40 on the back side 602. The back side 602 is the opposite side from the one side 601 in the Z direction. As shown in Figure 4, the exemplary temperature sensor module 60 includes a temperature detection element 61, a support 62, an external connection terminal 63, and a seal 64.

[0071] The temperature sensing element 61 is, for example, a thermistor. The temperature sensing element 61 is fixed to one surface of the support 62. The temperature sensing element 61 is positioned to overlap with the cooler 40 in a plan view in the Z direction. The support 62 supports the temperature sensing element 61. The support 62 includes a metal member 621. The metal member 621 is a metal plate made of a material with high thermal conductivity, such as aluminum. The exemplary support 62 has an insulating layer 622. The insulating layer 622 is interposed between the metal member 621 and the temperature sensing element 61 and forms one surface of the support 62. Other components may be arranged on the one surface of the support 62 together with the temperature sensing element 61. The insulating layer 622 may be provided when electrical insulation is required between the components including the temperature sensing element 61 and the metal member 621. The insulating layer 622 is formed using a material with higher thermal conductivity than the sealant 64. The insulating layer 622 is, for example, a high heat dissipation insulating resin sheet.

[0072] The external connection terminal 63 is electrically connected to the temperature sensing element 61. The external connection terminal 63 extends in the Y direction and protrudes outside the seal 64. In the example, the external connection terminal 63 extends in the same direction as the signal terminal 53. Alternatively, the external connection terminal 63 may be configured to extend in the opposite direction to the signal terminal 53, that is, to extend in the same direction as the main terminal 52. In the example, part of the external connection terminal 63 may extend in the same direction as the signal terminal 53, and another part of the external connection terminal 63 may extend in the same direction as the main terminal 52. The seal 64 seals the temperature sensing element 61. The seal 64 covers the temperature sensing element 61 along with one side of the support 62. In the example, the seal 64 also covers the side of the support 62. Almost the entire surface of the metal member 621 that forms the back surface of the support 62 is exposed from the seal 64.

[0073] In the temperature sensor module 60 described above, the sealing body 64 forms one surface 601. The metal member 621 forms the back surface 602. The one surface 601 is in contact with the cooler 40S. The back surface 602 is in contact with the cooler 40R. In other words, the sealing body 64 is in contact with the cooler 40S, and the metal member 621 is in contact with the cooler 40R.

[0074] Furthermore, the temperature sensor module 60 is positioned such that in the Z direction, one surface 601 faces the center 30C side of the laminate 30 and the back surface 602 faces the end side of the laminate 30. The end is either the front end 30FE or the rear end 30RE. As shown in Figures 3 and 4, the example temperature sensor module 60 is positioned such that one surface 601 faces the center 30C side of the laminate 30 and the back surface 602 faces the rear end 30RE side of the laminate 30.

[0075] <Summary of the First Embodiment> The power converter 20 of this embodiment comprises a laminate 30 and a temperature sensor module 60 for detecting the temperature of a refrigerant. The laminate 30 includes a plurality of coolers 40 arranged in a predetermined direction and a plurality of semiconductor modules 50 arranged between adjacent coolers 40. In the laminate 30, the space between adjacent coolers 40 is provided in multiple stages along the predetermined direction. The temperature sensor module 60 is configured such that, in the predetermined direction, the thermal conductivity of one surface 601 of the temperature sensor module 60 is smaller than the thermal conductivity of the back surface 602. The temperature sensor module 60 is arranged in a space of a different stage than the semiconductor modules 50. The temperature sensor module 60 is positioned between a first cooler, which is a cooler 40 adjacent to a semiconductor module 50, and a second cooler, which is a cooler 40 not adjacent to a semiconductor module 50, such that one surface 601 faces the first cooler and the back surface 602 faces the second cooler. In the exemplary power converter 20, the Z direction corresponds to the predetermined direction. Cooler 40S corresponds to the first cooler, and cooler 40R corresponds to the second cooler.

[0076] In this way, the temperature sensor module 60 is placed in the space between adjacent coolers 40, rather than outside the stack 30. This reduces the influence of the atmosphere on the temperature sensor module 60. For example, the temperature of the air inside the case 70 may rise due to the heat generated by the semiconductor module 50, and the temperature sensor module 60 will be less affected by this.

[0077] Furthermore, the temperature sensor module 60 is positioned such that one side 601 with low thermal conductivity faces the first cooler adjacent to the semiconductor module 50, and the other side 602 with high thermal conductivity faces the second cooler not adjacent to the semiconductor module 50. This arrangement makes it difficult for heat from the semiconductor module 50 to be transferred to the temperature sensor module 60 via the first cooler. This allows the temperature sensor module 60 to be placed in the space between the coolers 40 while reducing the influence of heat from the semiconductor module. In addition, the temperature of the refrigerant 402 flowing through the flow path 401 of the second cooler is easily transferred to the temperature sensor module 60. As a result, the detection accuracy of the refrigerant temperature can be improved.

[0078] As illustrated, the second cooler may be provided at the end of a plurality of coolers 40 arranged in a predetermined direction, and the temperature sensor module 60 may be placed in the space at the end of the multi-stage configuration. The side of the second cooler opposite to the side in contact with the temperature sensor module 60 forms the end of the laminate 30 (front end 30FE or rear end 30RE). No semiconductor module 50 exists outside the second cooler in the lamination direction, and heat from the semiconductor module 50 is not transferred through the second cooler. Therefore, the detection accuracy of the refrigerant temperature can be further improved.

[0079] As illustrated, the temperature sensor module 60 may be placed in the last stage space opposite to the side where the refrigerant is introduced and discharged. In this case, the cooler 40R becomes a second cooler. Since there are no semiconductor modules 50 outside the stacking direction of the cooler 40R, heat from the semiconductor modules 50 is not transferred through the cooler 40R. Therefore, the accuracy of refrigerant temperature detection can be further improved. In addition, the semiconductor modules 50 to be cooled can be concentrated on the introduction and discharge side. For example, the distance from the semiconductor modules 50 to the pump can be shortened.

[0080] As illustrated, the temperature sensor module 60 may include a support 62 containing a metal member 621, a temperature detection element 61 disposed on one surface of the support 62, and a sealant 64 that seals the temperature detection element 61. The sealant 64 may form one surface 601, and the metal member 621 may form the back surface 602. Because the sealant 64 is interposed between the temperature detection element 61 and the first cooler, heat from the semiconductor module 50 is less likely to be transferred to the temperature detection element 61 via the first cooler. Because the metal member 621 is interposed between the temperature detection element 61 and the second cooler, the temperature of the refrigerant 402 flowing through the flow path 401 of the second cooler is more easily transferred to the temperature detection element 61. Therefore, the detection accuracy of the refrigerant temperature can be improved.

[0081] As illustrated, the power converter 20 may include a case 70, a pressurizing member 72 that presses the laminate 30 in a predetermined direction, and a support wall 71 that supports the laminate 30 pressed by the pressurizing member 72. This allows the cooler 40 and the semiconductor module 50 to be in close contact, thereby increasing the efficiency of heat transfer from the semiconductor module 50 to the cooler 40. Furthermore, because the cooler 40 and the temperature sensor module 60 are in close contact, the accuracy of detecting the refrigerant temperature can be improved.

[0082] The power converter 20 of this embodiment comprises a laminate 30 and a temperature sensor module 60 for detecting the temperature of the refrigerant. The laminate 30 includes a plurality of coolers 40 arranged in a predetermined direction and a plurality of semiconductor modules 50 arranged between adjacent coolers 40. In the laminate 30, the space between adjacent coolers 40 is provided in multiple stages along the predetermined direction. The temperature sensor module 60 is configured such that, in the predetermined direction, the thermal conductivity of one surface 601 of the temperature sensor module 60 is smaller than the thermal conductivity of the back surface 602. The temperature sensor module 60 is arranged such that, in the predetermined direction, one surface 601 is on the center 30C side of the laminate 30 and the back surface 602 is on the end side of the laminate 30. In the illustrated power converter 20, the Z direction corresponds to the predetermined direction. The rear end 30RE corresponds to the end of the laminate.

[0083] In this way, the temperature sensor module 60 is placed in the space between adjacent coolers 40, rather than outside the stack 30. This reduces the influence of the atmosphere on the temperature sensor module 60. For example, the temperature of the air inside the case 70 may rise due to the heat generated by the semiconductor module 50, and the temperature sensor module 60 will be less affected by this.

[0084] Furthermore, the temperature sensor module 60 is positioned such that one side 601 with low thermal conductivity faces the center 30C side of the laminate 30, and the back side 602 with high thermal conductivity faces the edge side of the laminate 30. In a laminate 30 containing multiple semiconductor modules 50, the temperature of the center 30C is higher than that of the edges. With the above-described arrangement, one side 601 faces the center 30C side where the temperature is higher, so the temperature sensor module 60 is less affected by the heat of the semiconductor modules 50. As a result, the detection accuracy of the refrigerant temperature can be improved.

[0085] <Variation> An example has been shown in which the temperature sensor module 60 is positioned adjacent to the cooler 40R that forms the rear end 30RE, but it is not limited to this. As a configuration to be placed in the end space of a multi-stage, the temperature sensor module 60 may be positioned adjacent to the cooler 40F that forms the front end 30FE, as shown in Figures 5 and 6. In other words, the temperature sensor module 60 may be placed in the foremost space on the side where the refrigerant is introduced and discharged. Figure 5 corresponds to Figure 3. Figure 6 corresponds to Figure 4. In this configuration, the cooler 40F corresponds to the second cooler.

[0086] As shown in Figure 5, the temperature sensor module 60 is positioned in the space between the cooler 40F and the cooler 40S located next to the cooler 40F. As shown in Figures 5 and 6, one side 601 is in contact with the cooler 40S, and the back side 602 is in contact with the cooler 40F. The sealant 64 is in contact with the cooler 40S, and the metal member 621 is in contact with the cooler 40F. Since there is no semiconductor module 50 outside the stacking direction of the cooler 40F, heat from the semiconductor module 50 is not transferred through the cooler 40F. Therefore, the detection accuracy of the refrigerant temperature can be further improved.

[0087] (Second Embodiment) This embodiment is a modification based on a prior embodiment, and the description of the prior embodiment can be incorporated by reference. In the prior embodiment, a semiconductor module and a temperature sensor module were placed in the space between the coolers. Alternatively, a semiconductor module, a temperature sensor module, and a dummy module may be placed in the space between the coolers.

[0088] Figure 7 shows an example of a power conversion device according to this embodiment. Figure 7 corresponds to Figure 4. Figure 8 is a cross-sectional view showing the area around the temperature sensor module. Figure 8 corresponds to Figure 5.

[0089] The power converter 20 includes a dummy module 80. Unlike the semiconductor module 50, the dummy module 80 is a module that does not constitute an upper and lower arm circuit. The dummy module 80 is a dummy of the semiconductor module 50. The dummy module 80 does not need to have a semiconductor element 51, and its other configurations are not particularly limited. The number of dummy modules 80 is not particularly limited. The power converter 20 may have multiple dummy modules 80 or only one.

[0090] The illustrated power converter 20 includes one dummy module 80. The stack 30 has space for 13 layers. The dummy module 80 has almost the same configuration as the semiconductor module 50, except that it does not have a semiconductor element 51. The dummy module 80 has approximately the same length, i.e., thickness, as the semiconductor module 50 in the Z direction. A dummy chip without switching functionality may be placed in place of the semiconductor element 51.

[0091] The dummy module 80 is located in a different stage of space than the semiconductor module 50 and the temperature sensor module 60. The semiconductor module 50, the temperature sensor module 60, and the dummy module 80 are individually located in the multi-stage space. In the multiple modules arranged in the Z direction, the dummy module 80 is located next to the temperature sensor module 60. Of the coolers 40, the cooler 40D interposed between the dummy module 80 and the temperature sensor module 60 corresponds to a second cooler that is not adjacent to the semiconductor module 50. One side 601 of the temperature sensor module 60 is in contact with the cooler 40S, and the back side 602 is in contact with the cooler 40D.

[0092] The dummy module 80 in the example is positioned in the third space from the front end 30FE. The temperature sensor module 60 is positioned in the fourth space from the front end 30FE. The temperature sensor module 60 is positioned closer to the center 30C than the dummy module 80. The temperature sensor module 60 is positioned such that one side 601 with low thermal conductivity faces the center 30C side of the laminate 30, and the back side 602 with high thermal conductivity faces the edge side of the laminate 30. The other configurations are the same as those described in the prior embodiment.

[0093] <Summary of the second embodiment> As illustrated, a dummy module 80 may be provided, and the second cooler may be interposed between the temperature sensor module 60 and the dummy module 80. Since the dummy module 80 does not have a semiconductor element 51, it does not generate heat like the semiconductor module 50. The temperature sensor module 60 is positioned such that the semiconductor module 50 has one side 601 with low thermal conductivity facing the adjacent first cooler, and the dummy module 80 has one side 602 with high thermal conductivity facing the adjacent second cooler. This arrangement makes it difficult for heat from the semiconductor module 50 to be transferred to the temperature sensor module 60 via the first cooler. Also, the temperature of the refrigerant 402 flowing through the flow path 401 of the second cooler is easily transferred to the temperature sensor module 60. Therefore, the detection accuracy of the refrigerant temperature can be improved. Since the temperature sensor module 60 can be placed in spaces other than the ends of the multi-stage, the degree of freedom in the placement of the temperature sensor module 60 can be improved.

[0094] In the example configuration, the temperature sensor module 60 is positioned such that one side 601 with low thermal conductivity faces the center 30C side of the laminate 30, and the back side 602 with high thermal conductivity faces the edge side of the laminate 30. Because one side 601 faces the center 30C side where the temperature is higher, the temperature sensor module 60 is less affected by the heat of the semiconductor module 50. Therefore, the accuracy of detecting the refrigerant temperature can be improved.

[0095] <Variation> The arrangement of the dummy module 80 and the temperature sensor module 60 is not limited to the example described above. The dummy module 80 and the temperature sensor module 60 may be placed in a different row space than those illustrated.

[0096] For example, as shown in Figures 9 and 10, the dummy module 80 may be placed on the center 30C side of the laminate 30. The dummy module 80 is placed in the fourth space from the front end 30FE side. The temperature sensor module 60 is placed in the third space from the front end 30FE side. The temperature sensor module 60 is positioned such that one side 601 with low thermal conductivity faces the edge (front end 30FE) side of the laminate 30, and the back side 602 with high thermal conductivity faces the center 30C side of the laminate 30. With this arrangement, heat from the semiconductor module 50 is less likely to be transferred to the temperature sensor module 60 via the cooler 40S (first cooler). Also, the temperature of the refrigerant 402 flowing through the channel 401 of the cooler 40D (second cooler) is more easily transferred to the temperature sensor module 60. Therefore, the detection accuracy of the refrigerant temperature can be improved.

[0097] (Third embodiment) This embodiment is a modification based on a prior embodiment, and the description of the prior embodiment can be incorporated by reference. In the prior embodiment, the temperature sensor module was placed in the space between the first cooler and the second cooler. Alternatively, the temperature sensor module may be placed in the space between the first coolers such that the side with lower thermal conductivity is towards the center.

[0098] Figure 11 shows an example of a power conversion device according to this embodiment. Figure 11 corresponds to Figure 4. Figure 12 is a cross-sectional view showing the area around the temperature sensor module. Figure 12 corresponds to Figure 5.

[0099] The laminate 30 comprises a cooler 40, a semiconductor module 50, and a temperature sensor module 60, similar to the configuration shown in the first embodiment. The temperature sensor module 60 is located in the space excluding the first stage space adjacent to the cooler 40F and the twelfth stage space adjacent to the cooler 40R. The temperature sensor module 60 is sandwiched between two coolers 40S. The temperature sensor module 60 is positioned such that one side 601 faces the center 30C side of the laminate 30 and the back side 602 faces the edge side of the laminate 30.

[0100] The illustrated laminate 30 has 12 layers of space. The temperature sensor module 60 is located in the third layer of space from the front end 30FE. Of the two coolers 40S flanking the temperature sensor module 60, one side 601 is in contact with the cooler 40S on the center 30C side. The back surface 602 is in contact with the cooler 40S on the front end 30FE side. The other configurations are the same as those described in the prior embodiment.

[0101] <Summary of the third embodiment> In this embodiment, the temperature sensor module 60 is positioned in the space between the two coolers 40S such that one side 601 with low thermal conductivity faces the center 30C side of the laminate 30, and the back side 602 with high thermal conductivity faces the edge side of the laminate 30. Because one side 601 faces the center 30C side where the temperature is higher, the temperature sensor module 60 is less affected by the heat of the semiconductor module 50. Therefore, the detection accuracy of the refrigerant temperature can be improved.

[0102] <Variation> In the above configuration, the power converter 20 may include a dummy module 80. A semiconductor module 50 is interposed between the dummy module 80 and the temperature sensor module 60.

[0103] (Other embodiments) The disclosures in this specification and drawings are not limited to the exemplary embodiments. The disclosures include the exemplary embodiments and variations thereof by those skilled in the art. For example, the disclosures are not limited to combinations of parts and / or elements shown in the embodiments. The disclosures are implementable in a variety of combinations. The disclosures may have additional parts that can be added to the embodiments. The disclosures include those in which parts and / or elements of the embodiments have been omitted. The disclosures include substitutions or combinations of parts and / or elements between one embodiment and another. The scope of the disclosed technical areas is not limited to the descriptions of the embodiments. Some of the scope of the disclosed technical areas are indicated by the claims and should be understood to include all modifications within the meaning and scope equivalent to the claims.

[0104] The disclosures in the specification and drawings are not limited by the claims. The disclosures in the specification and drawings encompass the technical ideas described in the claims and extend to a wider and more diverse range of technical ideas than those described in the claims. Therefore, a variety of technical ideas can be extracted from the disclosures in the specification and drawings without being bound by the claims.

[0105] When an element or layer is referred to as “on top of,” “connected to,” “linked to,” or “joined,” it may be directly on top of, connected to, or joined to another element or layer, and there may also be an intervening element or layer. In contrast, when an element is referred to as “directly on top of,” “directly connected to,” “directly linked to,” or “directly joined to” another element or layer, there is no intervening element or layer. Other words used to describe relationships between elements should be interpreted in a similar manner (e.g., “between” vs. “directly between,” “adjacent” vs. “directly adjacent,” etc.). As used in this specification, the term “and / or” includes any combination and all combinations relating to one or more of the enumerated items relating to each other. That is, the statement A and / or B means at least one of A and B.

[0106] Spatially relative terms such as "inside," "outside," "back," "below," "low," "above," and "high" are used here to facilitate descriptions of the relationship between one element or feature and other elements or features, as illustrated. Spatially relative terms may be intended to encompass different orientations of the device in use or operation, in addition to the orientation depicted in the drawings. For example, if the device in the drawing is turned upside down, an element described as "below" or "directly below" another element or feature will be oriented "above" the other element or feature. Thus, the term "below" can encompass both up and down orientations. The device may also be oriented in other directions (it may be rotated 90 degrees or in other directions), and the spatially relative descriptors used in this specification will be interpreted accordingly.

[0107] (Disclosure of technical ideas) This specification discloses several technical concepts, as listed in the following paragraphs. Some paragraphs are written in a multiple dependent form, where subsequent paragraphs optionally refer to preceding paragraphs. Furthermore, some paragraphs are written in a multiple dependent form, referring to other multiple dependent forms. These paragraphs written in multiple dependent forms define several technical concepts.

[0108] <Technical philosophy 1> A laminate (30) comprising a plurality of coolers (40) arranged in a predetermined direction and having a flow path (401) through which a refrigerant flows, and a plurality of semiconductor modules (50) arranged between adjacent coolers and having semiconductor elements (51) that constitute a power conversion circuit, wherein the space between adjacent coolers is provided in multiple stages along the predetermined direction, A temperature sensor module (60) for detecting the temperature of the refrigerant, Equipped with, The aforementioned temperature sensor module is In the predetermined direction, the thermal conductivity of one side (601) of the temperature sensor module is configured to be less than that of the back side (602). A power converter is located in the space of a different stage from the semiconductor module, between a first cooler (40S) adjacent to the semiconductor module and a second cooler (40D, 40F, 40R) not adjacent to the semiconductor module, such that one side faces the first cooler and the other side faces the second cooler.

[0109] <Technical philosophy 2> The second cooler (40F, 40R) is located at the end of the plurality of coolers arranged in the predetermined direction, The power conversion device according to technical concept 1, wherein the temperature sensor module is arranged in the space at the end of a multi-stage in the predetermined direction.

[0110] <Technical philosophy 3> The power conversion device according to technical concept 2, wherein the temperature sensor module is located in the last stage space opposite to the side from which the refrigerant is introduced and discharged.

[0111] <Technical philosophy 4> The power conversion device according to technical concept 2, wherein the temperature sensor module is located in the space at the very front of the side where the refrigerant is introduced and discharged.

[0112] <Technical philosophy 5> The system includes a dummy module (80) that does not have the aforementioned semiconductor element and is located in the space on a different stage from the semiconductor module and the temperature sensor module, The second cooler (40D) is interposed between the temperature sensor module and the dummy module in the power conversion device according to technical concept 1.

[0113] <Technical philosophy 6> The temperature sensor module comprises a support (62) including a metal member (621), a temperature detection element (61) disposed on one surface of the support, and a seal (64) that seals the temperature detection element. A power conversion device according to any one of technical concepts 1 to 5, wherein the sealing body forms one surface and the metal member forms the back surface.

[0114] <Technical philosophy 7> A case (70) housing the laminate and the temperature sensor module, A pressing member (72) presses the laminate in the predetermined direction, A support wall (71) is provided in the case and supports the laminate that is pressed by the pressurizing member, A power conversion device equipped with one of the technical concepts described in 1 to 6.

[0115] <Technical philosophy 8> A laminate (30) comprising a plurality of coolers (40) arranged in a predetermined direction and having a flow path (401) through which a refrigerant flows, and a plurality of semiconductor modules (50) arranged between adjacent coolers and having semiconductor elements (51) that constitute a power conversion circuit, wherein the space between adjacent coolers is provided in multiple stages along the predetermined direction, A temperature sensor module (60) for detecting the temperature of the refrigerant, Equipped with, The aforementioned temperature sensor module is In the predetermined direction, the thermal conductivity of one side (601) of the temperature sensor module is configured to be less than that of the back side (602). A power converter is arranged in the space of a different stage from the semiconductor module such that one side faces the center (30C) of the laminate and the back side faces the edges (30FE, 30RE) of the laminate. [Explanation of Symbols]

[0116] 1…Drive system, 2…DC power supply, 3,3A,3B,3C…Rotating electric machine, 4…Power conversion circuit, 5…Filter capacitor, 6…Smoothing capacitor, 7…Converter, 7HL…Upper and lower arm circuit, 7H…Upper arm, 7L…Lower arm, 7R…Reactor, 8,8A,8B,8C…Inverter, 8AHL,8BHL,8CHL…Upper and lower arm circuit, 8AH,8BH,8CH…Upper arm, 8AL,8BL,8CL…Lower arm, 9H…VH line, 9L…VL line, 10…N line, 11A,11B,11C…Output line, 12…Temperature sensor, 20…Power converter, 30…Laminate, 30C…Center, 30FE…Front end, 30 RE...rear end, 40, 40D, 40F, 40E, 40S...cooler, 401...flow channel, 402...refrigerant, 41...inlet pipe, 42...outlet pipe, 50...semiconductor module, 51...semiconductor element, 52...main terminal, 53...signal terminal, 54...encapsulant, 60...temperature sensor module, 601...one side, 602...back side, 61...temperature detection element, 62...support, 621...metal component, 622...insulating layer, 63...external connection terminal, 64...encapsulant, 70...case, 71...support wall, 72...pressure member, 73...support column, 74...leaf spring, 75...hole, 80...dummy module, D1, D2, D3, D4...diode, Q1, Q2, Q3, Q4...switching element

Claims

1. A laminate (30) comprising a plurality of coolers (40) arranged in a predetermined direction and having a flow path (401) through which a refrigerant flows, and a plurality of semiconductor modules (50) arranged between adjacent coolers and having semiconductor elements (51) that constitute a power conversion circuit, wherein the space between adjacent coolers is provided in multiple stages along the predetermined direction, A temperature sensor module (60) for detecting the temperature of the refrigerant, Equipped with, The aforementioned temperature sensor module is In the predetermined direction, the thermal conductivity of one side (601) of the temperature sensor module is configured to be less than that of the back side (602). A power converter is located in the space of a different stage from the semiconductor module, between a first cooler (40S) adjacent to the semiconductor module and a second cooler (40D, 40F, 40R) not adjacent to the semiconductor module, such that one side faces the first cooler and the other side faces the second cooler.

2. The second cooler (40F, 40R) is located at the end of the plurality of coolers arranged in the predetermined direction, The power conversion device according to claim 1, wherein the temperature sensor module is arranged in the space at the end of the multi-stage in the predetermined direction.

3. The power conversion device according to claim 2, wherein the temperature sensor module is located in the last stage space opposite to the side from which the refrigerant is introduced and discharged.

4. The power conversion device according to claim 2, wherein the temperature sensor module is located in the space at the very front of the side where the refrigerant is introduced and discharged.

5. The system includes a dummy module (80) that does not have the aforementioned semiconductor element and is located in the space on a different stage from the semiconductor module and the temperature sensor module, The power conversion device according to claim 1, wherein the second cooler (40D) is interposed between the temperature sensor module and the dummy module.

6. The temperature sensor module comprises a support (62) including a metal member (621), a temperature detection element (61) disposed on one surface of the support, and a seal (64) that seals the temperature detection element. The power conversion device according to any one of claims 1 to 5, wherein the sealing body forms one surface and the metal member forms the back surface.

7. A case (70) housing the laminate and the temperature sensor module, A pressing member (72) presses the laminate in the predetermined direction, A support wall (71) is provided in the case and supports the laminate that is pressed by the pressurizing member, The power conversion device according to claim 6, comprising:

8. A laminate (30) comprising a plurality of coolers (40) arranged in a predetermined direction and having a flow path (401) through which a refrigerant flows, and a plurality of semiconductor modules (50) arranged between adjacent coolers and having semiconductor elements (51) that constitute a power conversion circuit, wherein the space between adjacent coolers is provided in multiple stages along the predetermined direction, A temperature sensor module (60) for detecting the temperature of the refrigerant, Equipped with, The aforementioned temperature sensor module is In the predetermined direction, the thermal conductivity of one side (601) of the temperature sensor module is configured to be less than that of the back side (602). A power converter is arranged in the space of a different stage from the semiconductor module, such that one side faces the center (30C) of the laminate and the back side faces the edges (30FE, 30RE) of the laminate.

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