Indication device

Abstract

Prevents damage to flexible displays. A display device that combines thickness and flexibility. To provide. [Solution] The display device has a display panel equipped with a display element. The display panel is a first It comprises a film, a second film, and an adhesive layer. The adhesive layer comprises the first film and the second film. A machine that is positioned between the first and second films and laminates them together. It has the ability. The display element is supported by the first film. The display panel has a bending modulus of elasticity of It is between 0.01 and 1 times the tensile modulus.

Description

[Technical Field]

[0001] One aspect of the present invention relates to a display device, particularly a display device comprising a flexible display. Regarding the device.

[0002] Furthermore, one aspect of the present invention is not limited to the above-mentioned technical field. One aspect of the technical field is semiconductor devices, display devices, light-emitting devices, energy storage devices, and memory devices. Electronic equipment, lighting equipment, input devices, input / output devices, methods for driving them, or methods for manufacturing them. Laws can be cited as one example. Semiconductor devices function by utilizing semiconductor properties. This refers to all devices that can do so. [Background technology]

[0003] The development of flexible displays, which can curve their display surface, is actively underway. Yes. Typical display elements used in flexible displays include organic EL ( Light-emitting elements such as electroluminescent elements, or liquid crystal elements, etc. These are some examples.

[0004] The basic structure of an organic EL element involves sandwiching a layer containing a light-emitting organic compound between a pair of electrodes. This element is constructed by applying a voltage to it, thereby obtaining light emission from a light-emitting organic compound. This is possible. Display devices to which such organic EL elements are applied can use light such as a backlight. Because it does not require a power source, it enables the creation of a thin, lightweight, high-contrast, and low-power display device. Cut.

[0005] For example, Patent Document 1 discloses a flexible light-emitting device to which an organic EL element is applied. It is being done. [Prior art documents]

Patent Document

[0006]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0007] Since a flexible display is extremely thin compared to conventional displays, there is a problem that it is difficult to increase mechanical strength. Especially when the flexible display functions as a touch panel, when a finger or a stylus touches the display surface strongly there is a risk that the flexible display will be damaged. Also, if a protective film or the like is attached to the display surface side of the flexible display to prevent damage, there is a problem that the flexibility decreases due to an increase in the overall thickness of the display.

[0008] One aspect of the present invention aims to prevent damage to a flexible display. Or, one of the problems is to provide a display device that achieves both thickness and flexibility. Or, one of the problems is to provide a highly reliable display device or electronic device. Or, one of the problems is to provide a display device or electronic device having a novel configuration.

[0009] Note that the description of these problems does not prevent the existence of other problems. Note that one aspect of the present invention is not required to solve all of these problems. Note that other problems can be extracted from the descriptions in the specification, drawings, claims, etc.

Means for Solving the Problems

[0010] One aspect of the present invention is a display device having a display panel equipped with a display element. It comprises a first film, a second film, and a first adhesive layer. The first adhesive layer is , located between the first film and the second film, and between the first film and the second film It has the function of bonding the film together. The display element is supported on the first film. Flannel has a flexural modulus that is between 0.01 and 1 times its tensile modulus.

[0011] Another aspect of the present invention is a display device having a display panel equipped with a display element. The flannel has a first film, a second film, and a first adhesive layer. The layer is located between the first film and the second film, and between the first film and the second It has the function of bonding with the film. The display element is supported by the first film. The panel has a flexural modulus that is 0.01 times or more and less than 1 time relative to its tensile modulus. The adhesive layer is viscoelastic and has higher elasticity than the first and second films. .

[0012] Another aspect of the present invention is a display device having a display panel equipped with a display element. The flannel has a first film, a second film, and a first adhesive layer. The layer is located between the first film and the second film, and between the first film and the second It has the function of bonding with the film. The display element is supported by the first film. The display panel has a flexural modulus that is between 0.01 and 1 times its tensile modulus. When a part of the flannel is curved, the end face of the first film and the end face of the second film It deforms so that it is relatively shifted.

[0013] Furthermore, in the above, the display panel has a bending modulus of elasticity that is 0.01 times that of the tensile modulus. Preferably, the ratio is 0.2 times or less.

[0014] Furthermore, in the above, the second film functions as a touch sensor or a circular polarizer. It is preferable that it has

[0015] Furthermore, in the above, the first film is made of epoxy resin, aramid resin, and acrylic resin. It contains one or more of the following: imide resin, amide resin, amide-imide resin, and glass. preferable.

[0016] Furthermore, in the above, the second film is made of urethane resin, acrylic resin, and silicone resin. Lipids, fluororesins, olefin resins, vinyl resins, styrene resins, amide resins, ester resins It is preferable that the mixture contains one or more of the following: fat and epoxy resin.

[0017] Furthermore, in the above, the first adhesive layer is made of silicone, acrylic resin, or urethane resin. It is preferable that the material contains a rubbery or gel-like substance that includes fat.

[0018] Furthermore, the above may also include a second adhesive layer and a third film. The adhesive layer overlaps with the first adhesive layer via the second film, and the second film and It has the function of bonding with a third film. Furthermore, the second adhesive layer has viscoelastic properties. Furthermore, it is preferable that the film has higher elasticity than the first and second films. The third film is made of urethane resin, acrylic resin, silicone resin, fluororesin, and olefin resin. Vinyl resin, styrene resin, amide resin, ester resin, and epoxy resin It is preferable that one or more of these be included.

[0019] Furthermore, one aspect of the present invention comprises the display device described in any one of the above and a protective cover. It is an electronic device. The protective cover has a first part with a flat surface and adjacent to the first part It has a second portion whose surface is curved, and is provided covering the display surface of the display panel. The display panel has a portion that is held in place by the protective cover, along the first and second parts. To possess.

[0020] Another aspect of the present invention is a display device according to any one of the above, and a first support, The electronic device has a second support and a connecting part. The first support and the second support are , connected by a connecting part. The display panel consists of a first part supported by a first support and a second part A second part supported by two supports, and a third part located between the first and second parts. It has a third part. The connecting part is such that the display surface is convex or concave. The structure is configured such that a portion is curved, allowing the first support and the second support to be superimposed. ru.

[0021] Another aspect of the present invention is a display device according to any one of the above, and a first support, Electronic device having a second support, a third support, a first connecting part, and a second connecting part. The first support and the second support are connected by the first connecting part. The body and the third support are connected by a second connecting part. The display panel is attached to the first support. A first part supported by a second support, a second part supported by a second support, and a third support supported by a third support The third part is, the fourth part is located between the first and second parts, and the second part It has a fifth part located between the third part and the first connecting part of the display panel. The part labeled 4 is curved in a convex shape so that the first support and the second support can be stacked on top of each other. It is configured as follows. The second connecting part curves the fifth part of the display panel into a concave shape, and the second support It is configured so that the main body and the third support can be superimposed on each other. [Effects of the Invention]

[0022] According to one aspect of the present invention, damage to a flexible display can be prevented. Alternatively, a display device that achieves both thickness and flexibility can be provided. Or, a highly reliable display device can be provided. , or electronic devices can be provided. Or, a display device or electronic device with a novel configuration. We can provide this.

[0023] Furthermore, the description of these effects does not preclude the existence of other effects. One embodiment does not necessarily have to possess all of these effects. Furthermore, other effects may be considered. This information can be extracted from descriptions such as specifications, drawings, and claims. [Brief explanation of the drawing]

[0024] [Figure 1] Figures 1A to 1C show examples of the display panel configuration. [Figure 2] Figures 2A to 2C show examples of the display panel configuration. [Figure 3] Figures 3A and 3B show examples of the display panel configuration. [Figure 4] Figures 4A to 4E show examples of the application of the display panel. [Figure 5] Figures 5A to 5D show examples of the application of the display panel. [Figure 6] Figures 6A and 6B show examples of the display panel's application. [Figure 7]Figures 7A and 7B show examples of the display panel's application. [Figure 8] Figures 8A and 8B show examples of the application of the display panel. [Figure 9] Figures 9A to 9C show examples of the configuration of a display device. [Figure 10] Figure 10 shows an example of a cross-sectional configuration of a display device. [Figure 11] Figure 11 shows an example of a cross-sectional configuration of a display device. [Figure 12] Figure 12A shows a block diagram of the display device. Figures 12B and 12C show the circuit diagrams. [Figure 13] Figures 13A, 13C, and 13D show the circuit diagram of the display device. Figure 13B shows the timing chart. [Figure 14] Figures 14A to 14E show examples of pixel configurations. [Figure 15] Figures 15A to 15C show examples of electronic device configurations. [Figure 16] Figures 16A to 16E show examples of electronic device configurations. [Figure 17] Figures 17A to 17G show examples of the configuration of electronic equipment. [Figure 18] Figures 18A to 18D show examples of electronic device configurations. [Figure 19] Figures 19A and 19B show the measurement results of the tensile modulus and flexural modulus according to the embodiment. [Figure 20] Figures 20A1 to 20C2 show micrographs of the samples according to the examples. [Modes for carrying out the invention]

[0025] The embodiments will be described below with reference to the drawings. However, many embodiments are described. It can be implemented in different ways, without deviating from its purpose and scope. Those skilled in the art will readily understand that the form and details can be modified in various ways. Therefore, the present invention This shall not be interpreted as being limited to the contents described in the following embodiments.

[0026] In the configuration of the invention described below, the same part or part having a similar function is The same reference numerals are used consistently across different drawings, and explanations of their repetition are omitted. When referring to the function of [this], the hatch pattern is the same, and sometimes no specific symbol is assigned.

[0027] In each figure described herein, the size, layer thickness, or area of ​​each component is not specified. This may be exaggerated for clarity. Therefore, it is not necessarily limited to that scale. I can't.

[0028] In this specification, ordinal numbers such as "the first," "the second," etc., are used to avoid confusion of constituent elements. This is added for the purpose of providing a numerical limit, and is not intended to limit the number of items.

[0029] In the following, expressions indicating direction, such as "up" and "down," generally correspond to the orientation shown in the drawing. It shall be used in this manner. However, for the purpose of making explanations easier, etc., the following may be included in the specification. The direction indicated by "up" or "down" may not always match that shown in the drawing. For example, When explaining the stacking order (or formation order) of a laminate, etc., the drawing should show the laminate as being constructed. The side being attacked (the surface to be formed, the support surface, the adhesive surface, the flat surface, etc.) is positioned above the laminate. Even when something is simply placed down, it may be described as having that orientation down, or the opposite orientation as up.

[0030] In this specification, a display panel, which is one form of a display device, displays an image or the like on its display surface. It has the function of (powering). Therefore, the display panel is one form of an output device.

[0031] Furthermore, in this specification, the substrate of the display panel may be, for example, FPC (Flexible Printed Circuit). (inted Circuit) or TCP (Tape Carrier Packa A connector such as a ge is attached, or the circuit board has a COG (Chip On A display panel module or display module is a device on which an IC is mounted using a glass or similar method. It may be called a display panel, or simply a display board.

[0032] In this specification, a touch panel, which is one form of a display device, displays images, etc. on its display surface. The display function detects when a finger, stylus, or other object touches, presses, or comes near the display surface. It has the function of a touch sensor that detects things like touching. Therefore, touch panel This is one form of an input / output device.

[0033] A touch panel is, for example, a display panel (or display device) with a touch sensor. It can also be called a display panel (or display device) with a touch function. It can also be configured to have a panel and a touch sensor panel. Alternatively, the display panel The configuration can also include a touch sensor functioning either internally or on its surface.

[0034] Furthermore, in this specification, etc., a touch panel circuit board with connectors and ICs mounted on it is considered to be a touch panel circuit board. It may be called a touch panel module, display module, or simply a touch panel. be.

[0035] (Embodiment 1) This embodiment describes a display device according to one aspect of the present invention.

[0036] A display device according to one aspect of the present invention has a display panel equipped with a display element. The display panel is It comprises a first film, a second film, and an adhesive layer positioned between them. The layer has the function of bonding the first film and the second film together.

[0037] The display element is provided to be supported by the first film. This can also be called a substrate or support that supports the display element.

[0038] The second film functions as a protective film to protect the display element. A portion of the second film can function as the display surface of the display panel. The film may also have the function of a sensor, such as a touch sensor. The film may also function as an optical component, such as a circular polarizer.

[0039] One embodiment of the present invention is a display panel characterized in that its flexural modulus is smaller than its tensile modulus. It shall be one. In particular, the flexural modulus is preferably 0.01 times or more and less than 1 time relative to the tensile modulus. The ratio is 0.01 times or more and 0.5 times or less, more preferably 0.01 times or more and 0.2 times or less. More preferably, the flexural modulus should be 0.01 times or more and 0.1 times or less. It is preferable that the flexural modulus is smaller than the tensile modulus, and that the flexural modulus is 0.01 relative to the tensile modulus. It can be less than double.

[0040] In this specification, the flexural modulus refers to the stress-strain curve (S-) measured by a bending test. This refers to the Young's modulus calculated from the S-curve. Furthermore, tensile modulus is calculated from a tensile test. This refers to the Young's modulus calculated from the measured stress-strain curve (SS curve).

[0041] Regarding bending tests, standards such as ISO178, JIS K7171, and ASTM D790 are used. It can be carried out based on or in reference to the standards. Furthermore, tensile testing is required under the IS standards. Based on or referencing standards such as O527, JIS K7161, and JIS K7127. This can be implemented.

[0042] First, let's consider a single flexible film. In principle, the flexural modulus and the tensile modulus are... The values ​​are the same. Next, multiple flexible films are bonded together with an adhesive to form a laminated film. In the case of film, the flexural modulus tends to be greater than the tensile modulus. That is, for the same thickness Even in that case, the laminated film is more flexible than a single flexible film. It tends to become more difficult.

[0043] However, in one embodiment of the present invention, the display panel has a flexural modulus that is smaller than the tensile modulus. To achieve this, it becomes possible to bend the display panel with a small force. Also, the tensile modulus is By making it larger, the display panel gains the characteristic of being less prone to stretching or expanding in the extension direction. This makes it possible. This means that even when bending and straightening movements are repeatedly performed on the display panel, Because the display panel is not easily expandable or contractible, the display elements and wiring that make up the display panel may be damaged. This can suppress the process, and as a result, the durability of the display panel can be increased.

[0044] A display panel having such characteristics is configured to have multiple neutral surfaces. This can be achieved by... More specifically, when the display panel is curved, the first F The neutral plane of the film is located within the first film, and the neutral plane of the second film is within the second film A display panel with a layered structure located inside would be suitable.

[0045] A more preferred form is an adhesive layer that bonds the first film and the second film together. Therefore, a material exhibiting viscoelasticity (a viscoelastic body) that possesses both viscosity and elasticity is applied. One example is the property of viscoelastic materials to deform when an external force is applied, and to maintain a constant external force. It has the property that the strain becomes constant and the stress disappears (becomes 0). In particular, elasticity It is preferable to use a material that is more viscous and can be deformed with a small force. For example If the adhesive layer has an elastic modulus of 1 kPa or more and 1 MPa or less, preferably 5 kPa or more and 500 A viscoelastic material with a pressure of kPa or less, more preferably 10 kPa or more and 200 kPa or less, is used. can.

[0046] Furthermore, it is preferable that the adhesive layer has higher elasticity than the first and second films. More specifically, the first film, the second film, and the adhesive layer are pulled with the same force. When this occurs, it is preferable that the adhesive layer has the property of being most easily stretchable.

[0047] By using such materials in the adhesive layer, an external force that causes the display panel to bend is applied. In this state, the adhesive layer bonded the first film and the second film together, and the stress was relieved. The adhesive layer distorts in this way. Therefore, the first film and the second film expand and contract. It can be curved on different neutral planes without any force. As a result, the display panel can be curved with very little force. It can be bent.

[0048] Furthermore, when the display panel is held in a curved position, the adhesive layer becomes distorted as described above. Because it remains constant, no restorative force is generated, and it maintains its shape without the need to apply a large force. This is possible, especially when the restorative force of the first and second films is negligibly small. In this case, the shape of the display panel is maintained.

[0049] Furthermore, in one embodiment of the present invention, a display panel can be bent from a flat state to a predetermined curvature by applying an external force. When the film is bent and held in that position for a certain period of time, and then the external force is removed, the first film and the second film Due to the film's restorative force, the curvature will decrease slowly over time (several seconds to several seconds). It has the characteristic of deforming (for about 10 seconds) and returning to its original flat state. It may not return to a normal state.

[0050] Furthermore, by using a viscoelastic material in the adhesive layer, external forces can be applied from the display surface side of the display panel. When it breaks, the adhesive layer deforms, which allows the stress to be effectively relieved. Furthermore, since the adhesive layer functions as an impact-absorbing layer, the display elements provided on the first film, This makes it possible to suppress damage to pixel circuits and other components.

[0051] On the other hand, when using the adhesive described above, the thicker the adhesive, the more difficult the laminate is to bend. However, in one aspect of the present invention, the flexural modulus can be reduced as the thickness of the adhesive layer increases. It has the following characteristics. The adhesive layer is provided covering the display elements of the display panel, so the adhesive layer By increasing the thickness, the protective function of the display element can be enhanced, resulting in a more reliable display. It can be implemented.

[0052] Below, we will explain more specific examples with reference to the diagrams.

[0053] [Example Configuration] Figure 1A shows a schematic cross-sectional view of a display panel 10 according to one embodiment of the present invention. The display panel 10 is It comprises a film 11, a film 12, and an adhesive layer 21 between them.

[0054] The film 11 is flexible in at least a portion thereof and can be bent. Room 11 has multiple pixels arranged in a matrix, allowing it to display an image.

[0055] The pixels provided on the film 11 are provided with at least one display element. The elements may include transistors, wiring, etc.

[0056] Typically, organic EL elements can be used as display elements. In addition, inorganic EL Light-emitting elements such as L elements and LED elements, liquid crystal elements, microcapsules, electrophoretic elements, etc. Electrowetting element, electrofluidic element, electrochromic element Various display elements can be used, such as sub-elements and MEMS elements.

[0057] The film 11 is not limited to being a single film, but may consist of multiple thin sheet-like components. They may be stacked. For example, pixels and drive circuits may be arranged between a pair of films. It may be a laminate in which display elements, transistors, wiring, electrodes, etc., are sealed. Here, the configuration including film 11, film 12, and adhesive layer 21 is referred to as the display panel 10. However, the film 11 may also have a function to display an image independently.

[0058] Specific examples of the sheet-like material that makes up the film 11 include, for example, epoxy resin, ara Resins such as mido resin, acrylic resin, imide resin, or amide-imide resin, or flexible Glass of a thickness having such properties can be used. Alternatively, polyethylene terephthalate can be used. Ester resins such as PET (polyethylene naphthalate), PE (PEN), and acrylonitrile Polyethylene resin, methyl methacrylate resin, polycarbonate (PC), polyethersulfone (PES), amide resins (nylon, aramid, etc.), siloxane resins, cycloolefins Resins, styrene resin, urethane resin, polyvinyl chloride resin, vinylidene chloride resin, propylene Resin, polytetrafluoroethylene (PTFE), ABS resin, cellulose nanofiber - and so on can be used.

[0059] The film 12 is flexible in at least a portion thereof and can be bent. The film 12 is located on the display surface side of the display panel 10 and contains display elements etc. provided on the film 11. It has the function of protecting the film 12. The film 12 is light-transmitting, and the user can see the film 12 and the contact The image displayed on the film 11 can be viewed through the film layer 21. The side opposite to film 11 functions as the display surface of display panel 10.

[0060] Furthermore, the film 12 also functions as a touch sensor panel and as an optical film. It may have the ability to do so. The touch sensor panel may include a capacitive touch sensor, an optical touch sensor, etc. The system can be configured to include sensor elements such as pressure-sensitive touch sensors. Examples of optical films include circular polarizers and anti-reflective films (AR (Anti-Ref Examples include election film and AG (Anti-Glare) film. It is possible.

[0061] Film 12 can be made from urethane resin, acrylic resin, silicone resin, fluororesin, Olefin resin, vinyl resin, styrene resin, amide resin, ester resin, epoxy resin It is preferable to use a sheet-like member having at least one of the following. In particular, urethane The resin has a relatively high dielectric constant, and when a capacitive touch sensor is applied, it increases sensitivity. It can be done. Furthermore, it is preferable because it can impart highly slippery and self-healing properties to the surface. stomach.

[0062] In particular, a self-healing organic resin is used as the material located on the outermost surface of the film 12. This prevents surface scattering caused by scratches and other damage, thus maintaining the quality of the display. Preferably, a resin having water-repellent or oil-repellent properties may be used as the organic resin, or a resin with filtration By performing a surface treatment on the outermost surface of film 12 to give it water-repellent and oil-repellent properties, This prevents dirt such as fingerprints from adhering to the surface of 2. Antifouling properties can be imparted to 12. Examples of self-healing materials include the above-mentioned In addition to urethane resin, polyrotaxane, cyclodextrin, and polyphenylene ether are also used. Materials including the above can be used. In this case, the film 12 may be the urethane mentioned above. A sheet-like member made of one or more of tan resin, acrylic resin, and silicone resin, It is more preferable to have a structure in which the self-healing organic resin is laminated.

[0063] Furthermore, in order to improve the slipperiness of the film 12, coatings, surface treatments, or It is preferable to apply a highly slippery film or similar material.

[0064] The adhesive layer 21 is located between film 11 and film 12 and has the function of bonding them together. It is preferable that the adhesive layer 21 be made of a material that transmits visible light and exhibits viscoelasticity. In particular, it is preferable to use a material with higher viscosity than elasticity for the adhesive layer 21.

[0065] The adhesive layer 21 deforms when an external force is applied, but maintains its shape through stress relaxation. It possesses the following properties. The relaxation time for stress relaxation of the adhesive layer 21 is 0.01 seconds or more and 10 seconds or less. Preferably, the relaxation time is 0.05 seconds or more and 5 seconds or less. Because the material becomes closer to a fluid, its ability to bond film 11 and film 12 deteriorates. On the other hand, if the relaxation time is longer than 10 seconds, it becomes closer to an elastic body, so the adhesive layer 21 itself It becomes difficult to bend. Furthermore, as will be described later, the film when the display panel 10 is curved. The neutral planes of 11 and film 12 shift towards the adhesive layer 21, causing film 11 and film 12 to shift. The stress on M12 becomes large.

[0066] It is preferable to use a viscoelastic material with relatively low viscosity as the adhesive layer 21. Viscoelastic materials with low viscosity can be used. Specific examples include silicone and acrylic. It is preferable to use a rubber-like material containing resin, urethane resin, or a gel-like material. In particular, silicone gels, silicone gels containing low molecular weight siloxanes, acrylic gels, It is preferable to use a urethane-based gel-like material.

[0067] For comparison, in Figure 2A, film 11 and film 12 are bonded together with high rigidity. The display panel 10R attached with agent 21R will be explained. Figure 2A shows the film 11 The neutral surface C1, the neutral surface C2 of the film 12, and the neutral surface C0 of the entire display panel 10R are, Each is shown by a dashed line. The neutral plane C0 is located inside the adhesive 21R. Panel 10R is bonded to film 11 and film 12 with a highly rigid adhesive 21R. Furthermore, the flexural modulus is higher than the tensile modulus.

[0068] Figure 2B shows the cross-sectional shape when the display panel 10R is curved so that the display surface is convex. A schematic diagram is shown. Because the neutral plane C0 of the display panel 10R is located inside the adhesive 21R. In order to curve the display panel 10R, as shown by the dashed arrow in Figure 2B, the film 11 needs to shrink, and film 12 needs to stretch. Also, Figure 2C shows that the display surface will be concave. This shows the case when the display panel 10R is curved. In this case, the film Film 11 needs to expand, and film 12 needs to contract.

[0069] The display panel 10R shown in Figure 2A prevents damage to the films 11 and 12. Therefore, the adhesive 21R is formed as thinly as possible, and the film 11 and the neutral surface C0, and the film It is necessary to bring M12 and the neutral plane C0 as close together as possible. Therefore, the adhesive 21R is thickened. This is difficult, and it is challenging to increase the mechanical strength of the display panel 10R itself.

[0070] Figure 1A shows the display panel 10, with the neutral surface C1 of film 11 and the middle of film 12. The elevation C2 and the neutral elevation C0 of the display panel 10 are shown, respectively. The neutral elevation C1 is a Fi Located within film 11, neutral surface C2 is located within film 12, and neutral surface C0 is located within adhesive layer 21. It is located in [location].

[0071] Figure 1B shows the display panel 10 when it is curved so that the display surface is convex. It is.

[0072] When the display panel 10 is curved, the adhesive layer 21 becomes neutral, as shown by the dashed arrow in Figure 1B. With the boundary near surface C0, the film stretches closer to film 11 and shrinks closer to film 12. It deforms into this shape. As a result, film 11 can be curved without shrinking, and film 12 It can bend without stretching.

[0073] In this way, the display panel 10 can be bent with a small force due to the deformation of the adhesive layer 21. This makes it possible to increase the thickness of the adhesive layer 21. This enhances the impact resistance of the display panel 10 and improves its reliability. The thickness of the adhesive layer 21 is, for example, 1 μm or more and 10 mm or less, preferably 5 μm or more and 5 mm. m or less, more preferably 10 μm to 3 mm, and even more preferably 20 μm to 2 mm The following is possible:

[0074] Figure 1C shows the display panel 10 when it is curved so that the display surface is concave. At this time, the adhesive layer 21 shrinks as it approaches the film 11, with the boundary being the vicinity of the neutral plane C0. Furthermore, the closer it is to film 12, the more it will deform and stretch.

[0075] Furthermore, focusing on the shape of the display panel 10 in Figure 1B, the edges of the film 12 located on the outside... The shape is such that the end face of the film 11 is located outside the straight line connecting the surface and the center of curvature O. In other words, near the edge of the film 12, the direction perpendicular to the surface of the film 12. When viewed from the front, the edge of film 11 protrudes outward more than the edge of film 12. This is how it works. In this way, as the display panel 10 is gradually curved from a flat state, The end face of the 11 and the end face of the film 12 shift so that they move away from each other, and the display panel 10 deforms. This is because the display panel 10 undergoes expansion and contraction of film 11 and film 12. This is due to a slight curvature.

[0076] On the other hand, in the case of the display panel 10R shown in Figure 2B, the adhesive 21R has rigidity, The inner film 11 shrinks and the outer film 12 stretches, resulting in the display panel 10R When curved, no displacement occurs at these ends.

[0077] In this case, the display panel 10 has a pair of films and one adhesive layer 21. Although an example has been shown, this is not limited to this, and a structure in which three or more films are laminated with an adhesive layer 21 in between. It can also be written as "completion".

[0078] Figure 3A shows a display panel having a film 13 between film 11 and film 12. An example of 10A is shown. An adhesive layer 21a is provided between film 11 and film 13. Furthermore, an adhesive layer 21b is provided between film 13 and film 12. Figure 3A shows The neutral plane C3 of film 13 is shown by a dashed line.

[0079] The adhesive layers 21a and 21b can be made from the same materials as the adhesive layer 21. Film 13 can be made of a material having the same light-transmitting properties as film 12. For example, the film 13 has the function of a touch sensor panel, and an optical film and A film having at least one of the following functions is applied, and the film 12 has high slipperiness and A film having at least one of the properties of self-healing can be applied.

[0080] Figure 3B shows the display panel 10A when it is curved so that the display surface is convex. This is shown. Similar to the display panel 10, the adhesive layers 21a and 21b deform as None of the films 11, 12, and 13 expand or contract, and the display panel The 10A can be curved. The display panel 10A in Figure 3B is located on the outside. The end face of film 13 is located outside the straight line connecting the end face of film 12 and the center of curvature O. The end face of film 11 is positioned further outward. In other words, film 1 Near the end face of 2, when viewed from a direction perpendicular to the surface of film 12, film 12 The end face of film 13 is offset outward relative to the end face of the film, and furthermore, the end face of film 13 is offset Similarly, the end face of film 11 is shifted outwards. In this way, the outermost position When using the film as a reference, the closer the film is to the center of curvature O, the greater the displacement of the edge face. .

[0081] [Examples of application] A display panel according to one embodiment of the present invention can be applied to the display unit of an electronic device. The display panel is either in a form where the display surface is flat without curvature, or in a form where a part of it is curved. It can be incorporated into electronic devices in a fixed form. In particular, the display of one embodiment of the present invention An electronic device whose panel can be folded in half so that the display surface is on the inside or outside. or electronic devices that can fold their display panels into three or more sections, It can be suitably incorporated into foldable devices.

[0082] [Application Example 1] Figure 4A shows an example where the display panel 10 is used without curving. In Figure 4A, The display panel 10, the support 31, the FPC 26, and the connector 27 are shown. Figure 4A schematically shows the direction of light emission when the display panel 10 displays an image, indicated by dashed arrows. This is shown.

[0083] The support 31 is a member that supports the display panel 10. It is located on the opposite side from the display surface and supports the film 11. The support 31 is for electronic devices. It may be a part of the enclosure, or a component provided inside the enclosure of an electronic device.

[0084] The FPC26 is electrically connected to an external circuit, and power is supplied from that circuit to the display panel 10. It has the function of transmitting position and various signals. The FPC26 is connected to the film 11 by the connector 27. It is electrically connected to terminals and the like. The connecting body 27 is, for example, an anisotropic conductive fiber Films and the like can be used.

[0085] In one embodiment of the present invention, the display panel 10 has a viscoelastic adhesive layer 21 on the upper surface of the film 11. It is protected by [a certain material]. Therefore, it has excellent mechanical strength such as impact resistance, as shown in Figure 4A. Furthermore, it can be suitably used in applications where the display panel 10 does not need to be curved.

[0086] [Application Example 2] Figures 4B and 4C show an example using a support 31 with a curved surface. Figure B is an example in which the display panel 10 is supported on the convex side of the support 31. Figure 4C is This is an example in which the display panel 10 is supported on the concave side of the support 31.

[0087] In Figure 4B, the display panel 10 is curved so that the display surface is convex. Focusing on the vicinity of the end of 12, the adhesive layer 21 is deformed so that its end face stretches, and the surface When viewed from the indicator side, the end face of film 11 protrudes outward from the end face of film 12. It has that shape.

[0088] In Figure 4C, the display surface of the display panel 10 is curved so that it is concave. Film 12 Focusing on the vicinity of the edge, the adhesive layer 21 is deformed so that its end surface stretches, and the display surface When viewed from the side, the end face of film 12 protrudes outward from the end face of film 11. It is in that state.

[0089] In this way, when the display panel 10 is fixed to the support 31 in a curved state, the display panel Because the restoring force that causes Nel 10 to return to a flat state is extremely small, the display panel from the support 31 This can suppress problems such as the Nel 10 peeling off.

[0090] [Application Example 3] Figures 4D and 4E show that the display panel 10 has a 180-degree curved portion and a flat portion. This shows an example of a case where it is present.

[0091] In the example shown in Figure 4D, the image can be displayed in opposite directions across the support 31. Furthermore, on the curved side portion of the support 31, an image can be displayed along the curved surface. Cut.

[0092] In the example shown in Figure 4E, the display panel 10 is attached to two supports, support 31a and support 31b. The support 31a mainly supports the display section of the display panel 10, and the support 31 b mainly supports the connection between the display panel 10 and the FPC26. The display panel 10 is folded back so that the connection point is located on the opposite side from the display surface. This reduces the space required when incorporating the display panel 10 into electronic devices. Cut.

[0093] In Figure 4E, the FPC26 has a bifurcated shape, with one part being the connector 27. The other part is electrically connected to the film 11 via a, and the other part is connected to the film via connector 27b. It is electrically connected to the film 12. Such a configuration is, for example, when the film 12 is touch-sensitive. This can be applied when it functions as a control panel or similar.

[0094] The support 31b, for example, when the FPC 26 is pressed onto the display panel 10, It may also be a protective member to prevent damage to it. Also, as shown in Figure 4E, The support 31b is fixed to the support 31a by the adhesive layer 32, thereby powering the FPC 26. This prevents physical stress from being applied to the display panel 10 during the process of integrating it into a sub-device. It is possible.

[0095] [Application Example 4] Figures 5A to 5D show an example in which the display surface side of the display panel 10 is supported by the support 33. Figures 5A and 5C are perspective views, and Figures 5B and 5D are cross-sectional views. A view drawing is shown. Note that FPCs, etc., are omitted in Figures 5A to 5D. Also, Figure 5 In Figures A and 5C, the support 33 is shown with a dashed line.

[0096] In the configuration shown in Figures 5A to 5D, the support 33 is made of a material that transmits at least visible light. Materials can be used. The support 33 can also be called a protective cover. Support 33 For example, if plastic or glass (preferably tempered glass) is used, the display This is preferable because it allows for effective protection of panel 10.

[0097] In the examples shown in Figures 5A and 5B, the surface of the support 33 on the display panel 10 side is flat. It has a flat portion and an adjacent, curved portion. The display panel 10 has a flat surface. It is provided along. That is, the display panel 10 has a pair of curved parts and these It has a flat part that is sandwiched between two curved parts. The display surface of each of the two curved parts is convex. It is curved in that way.

[0098] In the examples shown in Figures 5C and 5D, the curved portion of the display panel 10 is folded back 180 degrees. This allows images to be displayed not only in the front but also on both sides. .

[0099] [Application Example 5] Figures 6A and 6B show a configuration in which the display panel 10 can be folded into three sections. Figure 6A shows the display panel 10 folded into three sections, and Figure 6B shows the display panel This shows Nel 10 in a flattened state.

[0100] The configuration shown in Figures 6A and 6B consists of a display panel 10, support 34a, support 34b, and support It has a support body 34c, a connecting part 35, a connecting part 36, etc.

[0101] The display panel 10 has a portion supported by support 34a and a portion supported by support 34b. It has a part that is supported by the support 34c, and a part that is supported by the support 34c. Each part has a flat display surface. It is supported to do so.

[0102] The connecting part 35 connects the support 34b and the support 34c. The connecting part 35 is a display panel The display surface of 10 can be reversibly switched between a flat state and a curved state where the display surface is curved outwards. It has a mechanism for connecting support 34b and support 34c in such a way that they can be deformed.

[0103] The connecting portion 36 connects the support 34a and the support 34b. The connecting portion 36 is a display panel The display surface of 10 can be reversibly switched between a flat state and a curved state where the display surface is curved inward. It has a mechanism for connecting support 34a and support 34b in such a way that they can be deformed.

[0104] As shown in Figure 6A, the display panel 10 is connected by these connecting parts 35 and 36. The display panel 10 can be reversibly transformed between a folded state and a state in which it is approximately flat. It is possible.

[0105] In Figures 6A and 6B, the connecting portion 35 and the connecting portion 36 are structured in which multiple columnar bodies are connected. An example of a structure is shown. The display panel 10 is supported on one surface of the columnar body. The two adjacent columnar bodies are connected so that there is no gap between the surfaces supporting the display panel 10. It is preferable that it be provided in this manner. The columnar body of the connecting portion 35 has a substantially trapezoidal cross-sectional shape. Yes. On the other hand, the columnar body of the connecting portion 36 has a roughly rectangular cross-sectional shape.

[0106] Furthermore, the connecting portion 35 and the connecting portion 36 may be configured to operate in synchronous manner, or they may be configured to operate in synchronous manner. They may be configured to operate independently. The configuration of the connecting part 35 and the connecting part 36 is shown in Figures 6A and 6A. The configuration is not limited to the example shown in B, but can take on various forms. In particular, the display panel 10 It is preferable to have a mechanism that allows it to be bent without being extended or retracted.

[0107] Figures 6A and 6B also show the connector 27a and FP that are electrically connected to the film 11. C26a and the connectors 27b and FPC26b that are electrically connected to the film 12 are shown. ru.

[0108] [Application Example 6] Figures 7A and 7B show a mechanism that curves the display surface of the display panel 10 so that it faces outwards. An example with two configurations is shown. The configurations shown in Figures 7A and 7B include a display panel 10 and a support. It includes 34d, support 34e, support 34f, connecting part 35a, and connecting part 35b, etc.

[0109] The connecting portion 35a connects the support 34f and the support 34e. The connecting portion 35b connects the support 34e and support 34d are connected. The configuration of connecting parts 35a and 35b is as described above. The connecting portion 35 illustrated in Example 5 can be used as an example.

[0110] [Application Example 7] The configuration shown in Figures 8A and 8B allows the display panel 10 to be folded in half. This is an example of success.

[0111] Figure 8A shows an example of folding the display panel 10 in half so that the display surface faces outwards. The configuration shown in 8A includes a display panel 10, a support 34g, a support 34h, a connecting part 35, etc. The connecting portion 35 connects support 34g and support 34h.

[0112] Figure 8B shows an example of folding the display panel 10 in half so that the display surface faces inward. The configuration shown in 8B includes a display panel 10, a support 34j, a support 34k, a connecting part 36, etc. The connecting portion 36 connects the support 34j and the support 34k.

[0113] The configurations illustrated in Application Examples 5 to 7 offer portability and ease of use when the display panel 10 is folded. It offers excellent portability, and when the display panel 10 is opened, it offers excellent overview. Display panel according to one embodiment of the present invention Because flannel is highly reliable against repeated deformation, such foldable It can be suitably used in foldable (also called foldable) devices.

[0114] The above is an explanation of the application examples.

[0115] This embodiment may be appropriately combined with other embodiments described herein, at least in part. They can be implemented in combination.

[0116] (Embodiment 2) This embodiment describes an example of the configuration of a display panel applicable to a display device according to one aspect of the present invention. I will explain.

[0117] [Example Configuration] Figure 9A is a schematic top view of the display device 700. The display device 700 has a flexible base It has a board 762. The board 762 has a display unit 702, a pair of circuit units 763, and a circuit unit 764 Wiring 704, connection terminal 703a, and connection terminal 703b are provided.

[0118] Circuit sections 763 and 764 have the function of driving the display section 702. There are two 3s, flanking the display unit 702. The circuit unit 764 is wired to the display unit 702. It is located between 704 and 763. The circuit section 763 functions, for example, as a gate driver. The circuit section 764 has, for example, a source driver, or functions as part thereof. For example, circuit section 764 may include a buffer circuit or a demultiplexer circuit. .

[0119] Light-emitting elements such as light-emitting elements can be used as display elements provided in the display unit 702. Examples of such elements include LEDs (Light Emitting Diodes) and OLEDs (Orbital Microwave Oscillators). (Ganic LED), QLED (Quantum-dot LED), semiconductor laser Examples of self-illuminating light-emitting elements include transmissive liquid crystal elements and reflectors. Liquid crystal elements such as ray-type liquid crystal elements and semi-transmissive liquid crystal elements can also be used. Microelectromechanical Systems (MEMS) using either a photocopier or optical interferometry method. Cal Systems) elements, microcapsule method, electrophoresis method, electro Using a display element that employs a feeding method or an electronic powder fluid (registered trademark) method, etc. It is also possible to do so. In particular, it is preferable to use an organic EL element as the display element.

[0120] The circuit board 762 is the portion where the wiring 704, connection terminal 703a and connection terminal 703b are provided. However, it has a top surface shape that protrudes more than other parts (the part on which the display unit 702 is provided). When changed, the width of the relevant portion (also called the protruding portion) of the circuit board 762 is such that the display portion 702 is provided. It has a shape smaller than the width of the part.

[0121] Furthermore, the protruding portion of the substrate 762 can be curved in the area where it overlaps with the wiring 704. It has a curved region (curved portion 761a). The substrate 762 also has a region on which the display unit 702 is provided. In the region, there is a pair of regions (curved portion 761b) that can be curved. (Figure 9A) As shown, the substrate 762 has a protruding shape, which affects the curvature of the curved portion 761a. The direction and the curvature direction of the curved portion 761b can be in intersecting directions.

[0122] The connection terminal 703a is for FPC (Flexible Printed Circuit) It functions as a terminal to be connected, and terminal 703b functions as the terminal to which the IC is connected. .

[0123] Figures 9B and 9C show that in the curved portion 761a and curved portion 761b, opposite to the display surface side. Figure 9B shows a perspective view of the display device 700 when the substrate 762 is curved on the opposite side. Figure 9C is a perspective view including the display side, while Figure 9C is a perspective view including the side opposite to the display side. In Figure 9C, the FPC 706 is connected to connection terminal 703a, and the FPC 706 is connected to connection terminal 703b. It explicitly identifies the IC707.

[0124] As shown in Figure 9B, by curving both sides of the display unit 702, the electronic device When incorporating the display device 700, curved display sections can be provided on both sides of the electronic device. This makes it possible to create highly functional electronic devices.

[0125] Furthermore, as shown in Figures 9B and 9C, the curved portion 761a is used to partially form the substrate 762. It can be folded back to the opposite side from the display side. Specifically, so that wiring 704 is on the outside. The protruding portion of the substrate 762 can be folded back. This allows the connection terminal 703a and the connection The connection terminal 703b can be positioned on the opposite side from the display side, and furthermore, the FPC 706 It can be positioned on the opposite side from the display surface. This allows the display device 700 to be connected to an electronic device. When integrating the system, it becomes possible to reduce the area of ​​the non-displayed parts.

[0126] Furthermore, the substrate 762 is provided with a notch 765. The notch 765 is, for example, Portions where various sensors such as the lens and optical sensor of a camera, a lighting device, or a design of an electronic device can be arranged. By cutting out a part of the display unit 702, a more aesthetically pleasing electronic device can be realized. Also, thereby, the occupancy rate of the screen with respect to the housing surface can be increased.

[0127] [Cross-sectional configuration example] Hereinafter, a cross-sectional configuration example of the display device will be described.

[0128] [Configuration example 1] FIG. 10 shows a schematic cross-sectional view of the display device 700. FIG. 10 shows a cross-section including the display unit 702 of the display device 700 shown in FIG. 9A, the circuit unit 763, the curved portion 761a, and the connection terminal 703a. Transistors 750 and a capacitive element 790 are provided in the display unit 702. A transistor 752 is provided in the circuit unit 763.

[0129] Transistors 750 and 752 are transistors in which an oxide semiconductor is applied to a semiconductor layer in which a channel is formed. Note that the present invention is not limited to this, and transistors using silicon (amorphous silicon, polycrystalline silicon, or single-crystalline silicon) or an organic semiconductor in the semiconductor layer can also be applied.

[0130] The transistor used in the present embodiment has an oxide semiconductor film with high purity and suppression of the formation of oxygen vacancies. The transistor can significantly reduce the off-current. Therefore, pixels to which such a transistor is applied can increase the holding time of electrical signals such as image signals, and the writing interval of image signals and the like can also be set long. Thus, the frequency of the refresh operation can be reduced, and the power consumption can be reduced. ​

[0131] Furthermore, the transistor used in this embodiment is capable of obtaining a relatively high field-effect mobility. Therefore, high-speed operation is possible. For example, a transistor capable of such high-speed operation can be used in a display device. By using it in place, the pixel switching transistor and the driver transistor used in the circuit section are used. The inverter can be formed on the same substrate, that is, formed on a silicon wafer or the like. A configuration that does not apply the specified drive circuit is also possible, which reduces the number of components in the display device. It is possible. Furthermore, by using transistors capable of high-speed operation in the pixels, high image quality can be achieved. I can provide images.

[0132] Capacitive element 790 is made from the same film as the first gate electrode of transistor 750. A lower electrode formed by processing a metal oxide film identical to the semiconductor layer, and an upper electrode formed by processing the same metal oxide film as the semiconductor layer. The upper electrode has the same characteristics as the source and drain regions of transistor 750. The resistance has been reduced. Also, between the lower electrode and the upper electrode, the first of transistor 750 A portion of the insulating film, which functions as the gate insulating layer, is provided. That is, the capacitive element 790 is It has a multilayer structure in which an insulating film, which functions as a dielectric film, is sandwiched between a pair of electrodes. Furthermore, the upper electrode was processed with the same film as the source and drain electrodes of transistor 750. The resulting wiring is connected.

[0133] Furthermore, on transistors 750, 752, and 790, planarization An insulating layer 770 that functions as a film is provided.

[0134] The display unit 702 has a transistor 750, and the circuit unit 763 has a transistor 75 For 2, transistors with different structures may be used. For example, a top-gate type transistor may be applied to one of them, and a bottom-gate type transistor may be applied to the other, and the same applies to the circuit section 764 as to the circuit section 763.

[0135] The connection terminal 703a has a part of the wiring 704. Also, as shown in FIG. 10, when the connection terminal 703a has a laminated structure in which a plurality of conductive films are laminated, it is preferable because the conductivity and mechanical strength of the connection terminal 703a are enhanced. The connection terminal 703a is electrically connected to the FPC 706 via the connection layer 780. As the connection layer 780, for example, an anisotropic conductive material or the like can be used.

[0136] The display device 700 includes a substrate 762 and a substrate 740 that each function as a support substrate. As the substrate 762 and the substrate 740, for example, a glass substrate or a flexible substrate such as a plastic substrate can be used.

[0137] Also, as shown in FIG. 10, the laminated structure from the substrate 762 to the substrate 740 is taken as the film 721. Also, a film 722 is bonded onto the substrate 740 via an adhesive layer 720. The adhesive layer 720, the film 721, and the film 722 respectively correspond to the adhesive layer 21, the film 11, and the film 12 in Embodiment 1.

[0138] The transistors 750, 752, the capacitor element 790, etc. are provided on the insulating layer 744. The substrate 762 and the insulating layer 744 are bonded together by an adhesive layer 742.

[0139] ​​​​​​​​Furthermore, the display device 700 includes a light-emitting element 782, a colored layer 736, a light-shielding layer 738, and the like.

[0140] The light-emitting element 782 has a conductive layer 772, an EL layer 786, and a conductive layer 788. 772 is electrically connected to the source or drain electrode of transistor 750. The conductive layer 772 is provided on the insulating layer 770 and functions as a pixel electrode. An insulating layer 730 is provided covering the end of layer 772, and E is applied to the insulating layer 730 and the conductive layer 772. The L layer 786 and the conductive layer 788 are laminated together.

[0141] The conductive layer 772 can be made of a material that is reflective to visible light. For example, Materials containing aluminum, silver, etc. can be used. In addition, the conductive layer 788 may contain visible Materials that are translucent to light can be used. For example, indium, zinc, tin It is preferable to use an oxide material containing such materials. Therefore, the light-emitting element 782 is on the opposite side from the surface to be formed. This is a top-emission type light-emitting element that emits light towards the substrate 740 side.

[0142] The EL layer 786 contains organic compounds or inorganic compounds such as quantum dots. 86 contains a light-emitting material that emits light when an electric current flows through it.

[0143] Examples of light-emitting materials include fluorescent materials, phosphorescent materials, and thermally activated delayed fluorescence (A ctivated delayed fluorescence (TADF) materials, inorganic Compounds (such as quantum dot materials) can be used. The materials that can be used include colloidal quantum dot materials, alloy quantum dot materials, and core-shell type quantum dot materials. Examples include quantum dot materials and core-type quantum dot materials.

[0144] The light-shielding layer 738 and the colored layer 736 are provided on one side of the insulating layer 746. 736 is located in a position that overlaps with the light-emitting element 782. Also, the light-shielding layer 738 is In section 702, it is provided in an area that does not overlap with the light-emitting element 782. Also, the light-shielding layer 73 8 may also be provided on top of the circuit section 763, etc.

[0145] The substrate 740 is bonded to the other side of the insulating layer 746 by an adhesive layer 747. Furthermore, substrate 740 and substrate 762 are bonded together by a sealing layer 732.

[0146] Here, the EL layer 786 of the light-emitting element 782 is a light-emitting material that exhibits white light emission. This is applied. The white light emitted by the light-emitting element 782 is colored by the colored layer 736. It is then emitted to the outside. The EL layer 786 is provided across pixels exhibiting different colors. A colored layer 7 that transmits either red (R), green (G), or blue (B) is placed in part 702. By arranging the pixels with 36 in a matrix, the display device 700 displays full color It is possible to display this.

[0147] Furthermore, a conductive film having transparency and reflectivity may be used as the conductive layer 788. This enables the realization of a microcavity structure between conductive layer 772 and conductive layer 788. Furthermore, it is possible to configure it to intensify and emit light of a specific wavelength. Also, in this case, the conductive layer 7 An optical adjustment layer is placed between 72 and the conductive layer 788 to adjust the optical distance, and the optical adjustment By varying the thickness of the layer between pixels of different colors, the light emitted from each pixel... A configuration that enhances color purity is also acceptable.

[0148] Furthermore, the EL layer 786 is formed in an island-like pattern for each pixel or in a striped pattern for each row of pixels, i.e., color separation. When formed by this method, the colored layer 736 and the optical adjustment layer described above are not provided. That is also acceptable.

[0149] Here, insulating layer 744 and insulating layer 746 each function as a barrier film with low moisture permeability. It is preferable to use an inorganic insulating film. Between such insulating layer 744 and insulating layer 746 By having a configuration in which the light-emitting element 782 and transistor 750 are sandwiched, these inferior This suppresses degradation and enables the realization of highly reliable display devices.

[0150] [Configuration Example 2] Figure 11 shows a cross-sectional view of the display device 700, which has some configuration differences from Figure 10. Furthermore, in Figure 11, a part of the display device 700 is curved at the curved portion 761a, and the display surface side is curved. It clearly shows the form that has been folded back on the opposite side.

[0151] The display device 700 shown in Figure 11 has between the adhesive layer 742 and the insulating layer 744 shown in Figure 10. A resin layer 743 is provided. In addition, a protective layer 749 is provided instead of the substrate 740.

[0152] The resin layer 743 is a layer containing organic resins such as polyimide and acrylic. Insulating layer 744 This includes an inorganic insulating film such as silicon oxide, silicon oxide nitride, and silicon nitride. Resin layer 74 3 and the substrate 762 are bonded together by an adhesive layer 742. The resin layer 743 is the substrate It is preferable that it be thinner than 762.

[0153] The protective layer 749 is bonded to the sealing layer 732. The protective layer 749 is made of glass. A substrate or resin film can be used. Also, as the protective layer 749, a polarizing plate (circular Optical components such as polarizing plates, scattering plates, input devices such as touch sensor panels, or A configuration in which two or more of these are stacked may also be applied.

[0154] Here, the laminated structure from the substrate 762 to the protective layer 749 is made into a film 721. Yes, it is possible. Film 722 is bonded to protective layer 749 via adhesive layer 720.

[0155] Furthermore, the EL layer 786 of the light-emitting element 782 has islands on the insulating layer 730 and the conductive layer 772. It is arranged in a certain manner. The EL layer 786 is made so that the light-emitting color differs for each sub-pixel. Therefore, color display can be achieved without using the colored layer 736.

[0156] Furthermore, a protective layer 741 is provided covering the light-emitting element 782. The protective layer 741 emits light. The element 782 has a function to prevent impurities such as water from diffusing into it. The protective layer 741 is conductive. Insulating layer 741a, insulating layer 741b, and insulating layer 741c are laminated in this order from the layer 788 side. It has a laminated structure. At this time, the insulating layer 741a and insulating layer 741c are filled with water, etc. An inorganic insulating film with high barrier properties against impurities is used, and the insulating layer 741b functions as a planarization film. It is preferable to use organic insulating films for each. Also, the protective layer 741 is the circuit section 763 It is preferable that it extends to the following areas as well.

[0157] Furthermore, inside the sealing layer 732, transistors 750 and 752, etc. It is preferable that the organic insulating film covering the is formed in an island-like manner. In other words, the organic insulating film The end is located inside the sealing layer 732, or in a region that overlaps with the end of the sealing layer 732. Preferred. In Figure 11, insulating layer 770, insulating layer 730, and insulating layer 741b are added in an island-like manner. An example of the construction is shown. For example, in the part that overlaps with the sealing layer 732, the insulating layer 741c and An insulating layer 741a is provided in contact with the transistor 750 and the transistor The surface of the organic insulating film covering the sta 752 is configured so that it is not exposed to the outside of the sealing layer 732. As a result, water can enter transistors 750 and 752 from the outside through the organic insulating film. This effectively prevents hydrogen from diffusing. This improves the electrical characteristics of the transistor. This suppresses fluctuations and enables the creation of an extremely reliable display device.

[0158] Furthermore, in Figure 11, the curved portion 761a has an insulating layer in addition to the substrate 762 and adhesive layer 742. It has portions where inorganic insulating films such as 744 are not provided. Also, in the curved portion 761a, To prevent the wiring 704 from being exposed, an insulating layer 770 containing organic material covers the wiring 704. It has the following configuration. In the configuration shown in Figure 11, the curved portion 761a is made up of a resin layer 743 and wiring 7 It has a laminated structure in which 04 and an insulating layer 770 are stacked.

[0159] The curved portion 761a should have as little inorganic insulating film as possible, and should contain a conductive material including metal or alloy. By constructing a layer consisting only of layers containing organic material, cracks will occur when bent. This can prevent this. Also, by not providing the substrate 762 on the curved portion 761a, it is possible to make it extremely small The radius of curvature allows a portion of the display device 700 to be bent.

[0160] Furthermore, in the region overlapping with the connection terminal 703a, the resin layer 743 is connected via an adhesive layer 748. The support 725 is then bonded to it. The support 725 has higher rigidity than the substrate 762, etc. Materials can be used. Alternatively, the support 725 may be part of the housing of an electronic device, or It may be part of a component located inside a sub-device.

[0161] Furthermore, in Figure 11, a conductive layer 761 is provided on the protective layer 741. 61 can be used as wiring or an electrode.

[0162] Furthermore, the conductive layer 761 is used when a touch sensor is placed on top of the display device 700. Electrostatic shielding to prevent electrical noise generated during the operation of the element from being transmitted to the touch sensor. It can function as a protective film. At this time, a predetermined constant potential is applied to the conductive layer 761. It should be configured in such a way.

[0163] Alternatively, the conductive layer 761 can be used, for example, as an electrode for a touch sensor. This allows the display device 700 to function as a touch panel. For example, conductive layer 761 can be used as an electrode or wiring for a capacitive touch sensor. At that time, the conductive layer 761 is connected to the wiring or electrodes to which the detection circuit is connected, and to which the sensor signal is input. It can be used as wiring or electrodes that touch the light-emitting element 782. By developing sophisticated sensors, the number of parts can be reduced, thereby lowering the manufacturing costs of electronic devices and other equipment. It is possible.

[0164] The conductive layer 761 is preferably provided in a portion that does not overlap with the light-emitting element 782. The conductive layer 761 can be provided in a position that overlaps with the insulating layer 730. As layer 761, there is no need to use a transparent conductive film with relatively low conductivity, and a highly conductive metal is used instead. Because materials such as alloys can be used, the sensitivity of the sensor can be increased.

[0165] Furthermore, the types of touch sensors that can be constructed using the conductive layer 761 include electrostatic Not limited to capacitive methods, but also include resistive, surface acoustic wave, infrared, optical, and pressure-sensitive methods. Various methods can be used. Alternatively, two or more of these can be combined. stomach.

[0166] [About the components] The following describes the components, such as transistors, that can be applied to display devices.

[0167] [Transistor] A transistor consists of a conductive layer that functions as the gate electrode, a semiconductor layer, and a source electrode. A functional conductive layer, a conductive layer that functions as a drain electrode, and a gate insulating layer that functions as a gate insulating layer. It has an insulating layer.

[0168] The structure of the transistor in the display device according to one aspect of the present invention is not particularly limited. For example, it could be a planar transistor or a staggered transistor. It may also be an inverse staggered transistor. Alternatively, it can be a top-gate or bottom-gate transistor. Any type of transistor structure may be used. Alternatively, gate electrodes may be provided above and below the channel. It's okay to be kicked.

[0169] The crystallinity of semiconductor materials used in transistors is not particularly limited; amorphous semiconductors are also available. Single-crystal semiconductors, or semiconductors with crystalline properties other than single crystals (microcrystalline semiconductors, polycrystalline semiconductors) Either a single-crystal semiconductor or a semiconductor having a crystalline region in part may be used. Using a crystalline semiconductor is preferable because it suppresses the degradation of transistor characteristics.

[0170] In the following, we will discuss transistors that use metal oxide films as the semiconductor layer in which channels are formed. I will explain about that.

[0171] For semiconductor materials used in transistors, an energy gap of 2 eV or more is preferable. A metal oxide with a voltage of 2.5 eV or higher, more preferably 3 eV or higher, can be used. Typical examples include indium-containing metal oxides, such as CAC-OS, which will be discussed later. These can be used.

[0172] Using metal oxides with a wider band gap and lower carrier density than silicon Due to its low off-current, the transistor can draw power from a capacitive element connected in series with it. It is possible to retain the accumulated charge over a long period of time.

[0173] The semiconductor layer is made of, for example, indium, zinc, and M (where M is aluminum, titanium, galvanic). M, germanium, yttrium, zirconium, lanthanum, cerium, tin, neodymium Alternatively, the film may be represented as an In-M-Zn oxide containing a metal such as hafnium. can.

[0174] When the metal oxide constituting the semiconductor layer is an In-M-Zn system oxide, In-M-Zn oxidation The atomic ratio of metal elements in a sputtering target used to deposit thin films is In≧M It is preferable that Zn≧M is satisfied. In terms of atomic ratio, In:M:Zn = 1:1:1, In:M:Zn = 1:1:1.2, In :M:Zn = 3:1:2, In:M:Zn = 4:2:3, In:M:Zn = 4:2:4. 1. In:M:Zn = 5:1:3, In:M:Zn = 5:1:6, In:M:Zn = 5: 1:7, In:M:Zn = 5:1:8, In:M:Zn = 10:1:3, In:M:Zn = 5:3:4 etc. are preferable. The atomic ratio of the semiconductor layer to be formed is within plus or minus 40% of the atomic ratio of the metal elements contained in the above sputtering target respectively. Including fluctuations of plus or minus 40% of the atomic ratio of the metal elements contained in the sputtering target. Included.

[0175] As the semiconductor layer, a metal oxide film with a low carrier density is used. For example, the semiconductor layer has a carrier density of 1×10 / cm 17 / cm 3 or less, preferably 1×10 15 / cm 3 or less, more preferably 1×10 13 / cm 3 or less, even more preferably 1×10 11 / cm 3 or less, still more preferably 1×10 10 / cm 3 less than, and metal oxides with a carrier density of 1×10 -9 / cm 3 or more can be used. Such metal oxides are called high-purity intrinsic or substantially high-purity intrinsic metal oxides. It can be said that the oxide semiconductor has a low density of defect levels and stable characteristics. characteristics. characteristics.

[0176] Note that it is not limited to these, and an oxide semiconductor with an appropriate composition may be used according to the required semiconductor characteristics and electrical characteristics (field effect mobility, threshold voltage, etc.) of the transistor. Also , in order to obtain the required semiconductor characteristics of the transistor, the carrier density and impurities of the semiconductor layer The concentration, defect density, atomic ratio of metal elements to oxygen, interatomic distance, density, etc., should be set appropriately. This is preferable.

[0177] In metal oxides that make up semiconductor layers, silicon and carbon, which are among the Group 14 elements, When included, it increases oxygen vacancies in the semiconductor layer, causing it to become n-type. Therefore, semiconductor The concentrations of silicon and carbon in the layer (concentrations obtained by secondary ion mass spectrometry) are measured by 2× 10 18 atoms / cm 3 The following is preferably 2 × 10 17 atoms / cm 3 The following ru.

[0178] Furthermore, alkali metals and alkaline earth metals produce carriers when they combine with metal oxides. This can occur, and the off-current of the transistor may increase. Alkali metals or alkaline earth metals obtained by secondary ion mass spectrometry in the body layer The concentration of 1 × 10 18 atoms / cm 3 The following is preferably 2 × 10 16 atom / cm 3 Do the following:

[0179] Furthermore, if nitrogen is present in the metal oxide that makes up the semiconductor layer, the electrons, which are carriers, This occurs, increasing carrier density and making it more likely to become n-type. As a result, nitrogen-containing metal oxidation occurs. Transistors made of materials tend to exhibit normally-on characteristics. Therefore, in the semiconductor layer The nitrogen concentration obtained by secondary ion mass spectrometry is 5 × 10⁻⁶ 18 atoms / cm 3 below It is preferable to do so.

[0180] Oxide semiconductors (metal oxides) include single-crystal oxide semiconductors and other non-single-crystal oxide semiconductors. It can be divided into conductors and non-single-crystal oxide semiconductors, for example, CAAC-OS(c- axis aligned crystalline oxide semiconductor ctor), polycrystalline oxide semiconductor, nc-OS (nanocrystalline oxide IDE semiconductor, pseudo-amorphous oxide semiconductor (a-like OS (amorphous-like oxide semiconductor), and Examples include amorphous oxide semiconductors.

[0181] CAAC-OS has c-axis orientation and multiple nanocrystals are linked in the ab-plane direction. It has a crystalline structure that is linked and distorted. Note that distortion refers to the linkage between multiple nanocrystals. Within a region, between a region with a aligned grid arrangement and another region with a aligned grid arrangement, the grid arrangement This refers to the point where the orientation has changed.

[0182] Nanocrystals are based on a hexagonal shape, but they are not necessarily regular hexagons; they can also be non-regular hexagonal. Furthermore, the distortion may have a grid arrangement such as a pentagon or heptagon. In CAAC-OS, even near strain, clear grain boundaries are present. It is also said that it is difficult to confirm the grain boundaries. In other words, due to the distortion of the lattice arrangement, It can be seen that the formation is suppressed. This is because CAAC-OS is in the ab plane direction The arrangement of oxygen atoms is not dense, and the bond distance between atoms changes due to the substitution of metal elements. This is because distortion can be tolerated by processes such as transformation. Crystal structures in which grain boundaries can be observed are known as polycrystalline structures. It is called a stal. The grain boundary becomes a recombination center, and carriers are trapped and the transition This is likely to cause a decrease in the on-current or a decrease in the field-effect mobility. Therefore, CAAC-OS, which lacks clearly defined grain boundaries, is a suitable crystal for the semiconductor layer of transistors. It is one of the crystalline oxides that has a structure. Note that Zn is required to constitute CAAC-OS. A configuration having the following is preferred. For example, In-Zn oxide and In-Ga-Zn oxide are It is preferable because it can suppress the generation of grain boundaries more effectively than in oxides.

[0183] Furthermore, CAAC-OS consists of a layer containing indium and oxygen (hereinafter referred to as the In layer), and A layered crystal in which layers containing element M, zinc, and oxygen (hereinafter referred to as (M,Zn) layers) are stacked. It tends to have a structure (also called a layered structure). Note that indium and element M are relative to each other. It is interchangeable, and if element M in the (M,Zn) layer is replaced with indium, then (In,M,Zn It can also be represented as a layer. Furthermore, if the indium in the In layer is replaced by element M, (In, It can also be represented as layer M.

[0184] CAAC-OS is a highly crystalline metal oxide. On the other hand, CAAC-OS has a clear bond. Because it is difficult to confirm grain boundaries, a decrease in electron mobility caused by grain boundaries is less likely to occur. It can be said that... Also, the crystallinity of metal oxides decreases due to the inclusion of impurities and the formation of defects. Because this can sometimes occur, CAAC-OS is a metal oxide with few impurities or defects (such as oxygen deficiencies). It can also be said that metal oxides containing CAAC-OS have stable physical properties. Therefore, metal oxides containing CAAC-OS are heat-resistant and highly reliable.

[0185] nc-OS is used in minute regions (for example, regions between 1 nm and 10 nm, especially regions larger than 1 nm). It has periodicity in the atomic arrangement in the region of 3 nm or less. Also, nc-OS has different na No regularity is observed in the crystal orientation between the crystals. Therefore, no orientation is observed throughout the entire film. Therefore, depending on the analytical method, nc-OS may be a-like OS or amorphous oxide semiconductor. It can sometimes be indistinguishable from the body.

[0186] Furthermore, In- is a type of metal oxide containing indium, gallium, and zinc. Ga-Zn oxide (hereinafter referred to as IGZO) adopts a stable structure when formed into the nanocrystals described above. In some cases, IGZO tends to have difficulty growing crystals in the atmosphere, so large bonds may form. Crystals smaller than crystals (here, crystals of several millimeters or several centimeters) (for example, as mentioned above) In some cases, forming the material into nanocrystals can result in a more structurally stable material.

[0187] a-like OS is a metallic acid having a structure between nc-OS and amorphous oxide semiconductors. It is a monster. a-like OS has porous or low-density regions. That is, a-li ke OS has lower crystallinity compared to nc-OS and CAAC-OS.

[0188] Oxide semiconductors (metal oxides) can take on diverse structures, each possessing different properties. An oxide semiconductor according to one aspect of the present invention is an amorphous oxide semiconductor, a polycrystalline oxide semiconductor, and a-li It may have two or more of the following: ke OS, nc-OS, and CAAC-OS.

[0189] Furthermore, the semiconductor layer of the transistor disclosed in one aspect of the present invention is the non-single-crystal oxide mentioned above. Monocrystalline semiconductors can be suitably used. In addition, as non-single-crystal oxide semiconductors, nc-O S or CAAC-OS can be preferably used.

[0190] Note that the semiconductor layer may be a mixed film having two or more of the regions of CAAC-OS, polycrystalline oxide semiconductor, nc-OS, pseudo-amorphous oxide semiconductor, and amorphous oxide semiconductor. The mixed film may have a single-layer structure or a laminated structure including two or more of the above-described regions. For example, the mixed film may have a single-layer structure or a laminated structure including two or more of the above-described regions. In the case of having a laminated structure, the laminated structure may be a structure in which two or more of the above-described regions are laminated.

[0191] In addition, it is preferable to use CAC-OS (Cl oud-Aligned Composite oxide semiconducto r) for the semiconductor layer of the transistor disclosed in one aspect of the present invention. oud-Aligned Composite oxide semiconducto By using CAC-OS, high electrical characteristics or high reliability can be imparted to the transistor.

[0192] <Configuration of CAC-OS> Hereinafter, the configuration of CAC (Cl oud-Aligned Composite)-OS that can be used for the transistor disclosed in one aspect of the present invention will be described.

[0193] CAC-OS has a conductive function in part of the material and an insulating function in part of the material, and has a semiconductor function as a whole. When CAC-OS is used for the active layer of a transistor, the conductive function is a function of flowing electrons (or holes) serving as carriers, and the insulating function is a function of not flowing electrons serving as carriers. By causing the conductive function and the insulating function to act complementarily, a switching function (On / Off function) can be imparted to CAC-OS. In CAC-OS, By separating each function, it is possible to maximize the performance of both.

[0194] Furthermore, CAC-OS has conductive regions and insulating regions. The conductive regions are as described above. It has conductive properties, and the insulating region has the aforementioned insulating properties. Furthermore, conductive and insulating regions may be separated at the nanoparticle level. Conductive and insulating regions may be unevenly distributed within the material. The affected area may appear blurred around the edges, creating a cloud-like, connected appearance.

[0195] Furthermore, in CAC-OS, the conductive region and the insulating region are each 0.5 nm or less. The particles are dispersed in the material with a size of 10 nm or less, preferably between 0.5 nm and 3 nm. There are cases where this is the case.

[0196] Furthermore, CAC-OS is composed of components with different band gaps. For example, CAC-OS has components with a wide gap due to the insulating region and components with a conductive region. It consists of a component having a resulting narrow gap, and a carrier. When flowing, the carrier mainly flows in the component with a narrow gap. - Components with a gap act complementaryly with components with a wide gap, and narrow gap In conjunction with the component having a gap, the carrier also flows to the component having a wide gap. Therefore, when the above CAC-OS is used in the channel formation region of a transistor, the transistor In the ON state, a high current driving force, i.e., a large ON current, and high field effect mobility are obtained. It is possible.

[0197] In other words, CAC-OS is a matrix composite ), or metal matrix composite It can also be called that.

[0198] Furthermore, it is preferable that the metal oxide contains at least indium. In particular, indium It is preferable to include zinc. In addition to these, aluminum, gallium, and t Thorium, copper, vanadium, beryllium, boron, silicon, titanium, iron, nickel, ginger Lumanium, Zirconium, Molybdenum, Lanthanum, Cerium, Neodymium, Hafnium, Contains one or more elements selected from tantalum, tungsten, or magnesium. It's okay if they're born.

[0199] Note that IGZO is a common name and refers to a single compound composed of In, Ga, Zn, and O. There are cases where this occurs. A typical example is InGaO3(ZnO). m1 (m1 is a natural number), or In (1+x0) Ga (1-x0) O3(ZnO) m0 (-1≦x0≦1, m0 is any number) Examples of crystalline compounds are shown.

[0200] The above-mentioned crystalline compounds have a single-crystal structure, a polycrystalline structure, or a CAAC structure. CAAC structure refers to a structure in which multiple IGZO nanocrystals have c-axis orientation and ab-plane orientation This is a crystal structure in which the elements are linked without orientation.

[0201] On the other hand, CAC-OS relates to the material composition of metal oxides. CAC-OS is In, G In a material composition containing a, Zn, and O, a portion of it is observed to be in the form of nanoparticles mainly composed of Ga. The region where the substance is suspected and the region where it is observed as nanoparticles mainly composed of In are, respectively This refers to a configuration in which elements are randomly dispersed in a mosaic-like manner. Therefore, in CAC-OS, crystals Structure is a secondary element.

[0202] Note that aluminum, yttrium, copper, vanadium, and beryllium can be used instead of gallium. Molybdenum, boron, silicon, titanium, iron, nickel, germanium, zirconium, molybdenum N, lanthanum, cerium, neodymium, hafnium, tantalum, tungsten, or magnesium If one or more species selected from Nesium etc. are included, CAC-OS will The region is observed to be in the form of nanoparticles mainly composed of the metal element, and the portion is mainly composed of In. The regions observed as nanoparticles are randomly dispersed in a mosaic-like manner. It refers to.

[0203] CAC-OS is a material that can be molded by sputtering, for example, under conditions where the substrate is not intentionally heated. This can be achieved. Also, when forming CAC-OS by sputtering, the deposition gas The gases selected were inert gases (typically argon), oxygen gas, and nitrogen gas. You may use one or more of them. Also, the oxygen in relation to the total flow rate of the deposition gas during film formation. A lower gas flow rate ratio is preferable; for example, a flow rate ratio of oxygen gas of 0% or more and less than 30% is preferable. Alternatively, it is preferable to have a value of 0% or more and 10% or less.

[0204] Furthermore, semiconductor devices using CAC-OS have high reliability. Therefore, CAC-OS is, It is ideal for various semiconductor devices, including displays.

[0205] Furthermore, transistors with CAC-OS in the semiconductor layer have high field-effect mobility and drive Due to its high dynamic capability, the transistor is used in drive circuits, and typically in scanning circuits that generate gate signals. By using it in a line drive circuit, it is possible to provide a display device with a narrow bezel (also called a narrow bezel). Yes, it is possible. Furthermore, the transistor can be used in the signal line driving circuit of the display device (especially the signal line driving circuit). It is used in a demultiplexer connected to the output terminal of the shift register of the dynamic circuit. Therefore, it is possible to provide a display device with a small number of wires connected to it.

[0206] Furthermore, transistors with CAC-OS in the semiconductor layer use low-temperature polysilicon. Unlike radiators, it does not require a laser crystallization process. Therefore, it can be used with large-area substrates. Even for display devices, it is possible to reduce manufacturing costs. Furthermore, ultra-high-visibility ("4K resolution", "4K2K", "4K"), Super Hi-Vision ("8K resolution") High resolution such as "8K4K" and "8K" are used in large display devices. By using transistors having CAC-OS in the semiconductor layer in the drive circuit and display unit, It allows for writing in a short time and reduces display errors, which is preferable.

[0207] Furthermore, when focusing on the crystal structure, oxide semiconductors may be classified differently from those mentioned above. Here, we will explain the classification of crystal structures in oxide semiconductors. Typically, I This explains the classification of the crystal structure of GZO (metal oxides containing In, Ga, and Zn).

[0208] IGZO can be broadly divided into Amorphous and Crystalline. They are classified into (crystalline) and Crystal. Also, Amorphous Some of them are completely amorphous. Also, Crystal The line includes CAAC, nc, and CAC. Note that Crystalli The classification of ne includes single crystal, poly crystal, and co Completely amorphous is excluded. Also, within Crystal, there are s This includes ingle crystal and polycrystal.

[0209] Furthermore, structures classified as Crystalline are Amorphous and It is an intermediate state between a crystal and a new boundary region (New crystals This structure belongs to the talline phase. This structure is Amorphous and It lies in the boundary region between it and Crystal. In other words, the structure is energetically unstable. It is said to have a structure that is completely different from that of a fixed amorphous or crystal. It can be replaced.

[0210] The crystal structure of the film or substrate can be determined by X-ray diffraction (XRD). It can be evaluated using ion images.

[0211] For example, the peak shape of the XRD spectrum of quartz glass is almost symmetrical. On the other hand, crystalline IGZO exhibits asymmetrical peak shapes in its XRD spectrum. The asymmetrical shape of the D spectrum peaks clearly indicates the presence of a crystal. In other words, if the peak shape of the XRD spectrum is not symmetrical, it is amorphous. It cannot be said that it exists. Furthermore, in the XRD spectrum of crystalline IGZO, the shape of the peaks is The asymmetry is presumed to be due to the crystalline phase (microcrystals) in question.

[0212] Specifically, crystalline IGZO has an XRD spectrum with 2θ = 34° or It has a peak in the vicinity. Also, the microcrystals have a peak at 2θ=31° or in the vicinity of it. When evaluating oxide semiconductor films using X-ray diffraction, the peak of 2θ = 34° or near 34° The spectral width at lower angles is wider than at 2θ = 3. This suggests the presence of microcrystals with peaks at or near 1°.

[0213] Furthermore, the crystalline structure of the film is determined by nano-beam electron diffraction (NBED). Diffraction patterns observed by tron ​​diffraction (micro-electron diffraction) It can be evaluated using (also called a pattern). In microelectron diffraction, for example, the path Electron diffraction is performed with a beam diameter of 1 nm. The substrate temperature is set to room temperature and the sputtering method is used. The diffraction pattern of the deposited IGZO film showed a spot-like pattern rather than a halo. Therefore, the IGZO film deposited at room temperature is neither crystalline nor amorphous. It is presumed that this is an intermediate state and cannot be concluded to be an amorphous state.

[0214] Alternatively, silicon may be used as the semiconductor in which the transistor channel is formed. Amorphous silicon may be used as the substrate, but crystalline silicon is particularly preferred. It is preferable to use microcrystalline silicon, polycrystalline silicon, monocrystalline silicon, etc. It is preferable that polycrystalline silicon can be formed at a lower temperature compared to single-crystal silicon. Furthermore, it possesses higher field-effect mobility and greater reliability compared to amorphous silicon.

[0215] [Conductive layer] In addition to the gate, source, and drain of a transistor, various wiring components make up a display device. Materials that can be used for conductive layers such as electrodes include aluminum, titanium, and chromium. Molybdenum, nickel, copper, yttrium, zirconium, molybdenum, silver, tantalum, or tungsten. Examples include metals such as sten, or alloys in which these are the main component. The film containing the material can be used as a single layer or as a multilayer structure. For example, silicon A single-layer structure containing an aluminum film, a double-layer structure in which an aluminum film is laminated on a titanium film, and tan A two-layer structure consisting of an aluminum film laminated on a gusten film, and a copper-magnesium-aluminum alloy. A two-layer structure with a copper film laminated on a gold film, a two-layer structure with a copper film laminated on a titanium film, tungsten A two-layer structure with a copper film laminated on top of a film, a titanium film or titanium nitride film, and an aluminum film layered on top of that. A three-layer structure is formed by laminating a titanium film or copper film, and then forming a titanium film or titanium nitride film on top of it. A layered structure, a molybdenum film or a molybdenum nitride film, with an aluminum film or layered on top thereof. A three-layer structure in which copper films are stacked, and then a molybdenum film or molybdenum nitride film is formed on top of them. These include, for example. Furthermore, oxides such as indium oxide, tin oxide, or zinc oxide may also be used. Furthermore, using copper containing manganese is preferable because it improves the controllability of the shape through etching. .

[0216] [Insulating layer] Examples of insulating materials that can be used for each insulating layer include acrylic, epoxy, etc. In addition to resins and resins containing siloxane bonds, silicon oxide, silicon oxide nitride, and silicon nitride oxide are also used. Inorganic insulating materials such as silicon nitride and aluminum oxide can also be used.

[0217] Furthermore, it is preferable that the light-emitting element is provided between a pair of insulating films with low water permeability. This prevents impurities such as water from entering the light-emitting elements, thus reducing the reliability of the device. It can be suppressed.

[0218] Examples of insulating films with low water permeability include silicon nitride films and silicon nitride oxide films, which contain nitrogen and silicon. Examples include films containing nitrogen and aluminum, such as aluminum nitride films. Silicon oxide films, silicon oxide nitride films, aluminum oxide films, etc., may also be used.

[0219] For example, the amount of water vapor transmitted through a low-permeability insulating film is 1 × 10⁻⁶ -5 [g / (m 2 ·day) ] Preferably 1 × 10 -6 [g / (m 2 ·day)] Below, more preferably 1×1 0 -7 [g / (m 2 (day) More preferably 1 x 10 -8 [g / (m 2 ·d (ay) and below.

[0220] The above is an explanation of the constituent elements.

[0221] The configuration examples illustrated in this embodiment, and the corresponding drawings, etc., are at least a part of them. This can be implemented by combining it with other configuration examples or drawings as appropriate.

[0222] This embodiment may be appropriately combined with other embodiments described herein, at least in part. They can be implemented in combination.

[0223] (Embodiment 3) In this embodiment, an example of the configuration of the display device will be explained using Figure 12.

[0224] The display device shown in Figure 12A comprises a pixel unit 502, a drive circuit unit 504, and a protection circuit 506. It has a terminal section 507 and a protective circuit 506.

[0225] The pixel section 502 is arranged in X rows and Y columns (where X and Y are independent natural numbers greater than or equal to 2). It has several pixel circuits 501. Each pixel circuit 501 is a circuit that drives a display element. To possess.

[0226] The drive circuit section 504 outputs a scanning signal to the gate lines GL_1 to GL_X. Source driver 504a, which supplies data signals to data lines DL_1 to DL_Y. It has a drive circuit such as 04b. The gate driver 504a has at least a shift register The configuration should include, for example, multiple analog switches. It is constructed using switches, etc. Furthermore, it uses shift registers, etc., to configure the source driver 504 You may also construct b.

[0227] The terminal section 507 inputs power, control signals, and image signals, etc., from an external circuit to the display device. This refers to the part that is equipped with terminals for that purpose.

[0228] The protection circuit 506, when a potential outside a certain range is applied to the wiring to which it is connected, This is a circuit that creates a conductive state between two wires. The protection circuit 506 shown in Figure 12A is, for example, For example, the gate line GL, which is the wiring between the gate driver 504a and the pixel circuit 501, or - Various wirings such as data lines DL, which are the wiring between driver 504b and pixel circuit 501. It continues. Note that in Figure 12A, in order to distinguish between the protection circuit 506 and the pixel circuit 501, protection Circuit 506 is hatched.

[0229] Furthermore, the gate driver 504a and the source driver 504b are connected to the pixel section 502 and They may be provided on the same board, or the gate driver circuit or source driver circuit may be A separately formed substrate (for example, a drive circuit base formed from a single-crystal semiconductor or polycrystalline semiconductor) The board is made into a circuit board using COG or TAB (Tape Automated Bonding). It may also be implemented in this configuration.

[0230] Figures 12B and 12C show one of the pixel circuit configurations that can be applied to the pixel circuit 501. Here is an example.

[0231] The pixel circuit 501 shown in Figure 12B consists of a liquid crystal element 570, a transistor 550, and a capacitive element. It has a sub-unit 560 and a gate line GL_m. The pixel circuit 501 also has a data line DL_n and a gate line GL_m The potential supply line VL and other connections are connected.

[0232] The potential of one of the pair of electrodes of the liquid crystal element 570 is set appropriately according to the specifications of the pixel circuit 501. The orientation state of the liquid crystal element 570 is set according to the data being written to it. A common potential is set on one of the pairs of electrodes of the liquid crystal element 570 that each of the pixel circuits 501 possesses. (Common potential) may be applied. Also, a pair of liquid crystal elements 570 of the pixel circuit 501 in each row One of the electrodes may be given a different potential.

[0233] Furthermore, the pixel circuit 501 shown in Figure 12C includes transistor 552 and transistor 554 It also has a capacitive element 562 and a light-emitting element 572. The pixel circuit 501 also has data Line DL_n, gate line GL_m, potential supply line VL_a, and potential supply line VL_b are connected. It is being done.

[0234] Furthermore, a high power supply potential VDD is supplied to one of the potential supply lines VL_a and VL_b. On the other hand, a low power supply potential VSS is applied to the gate of transistor 554. Depending on the potential, the current flowing through the light-emitting element 572 is controlled, thereby controlling the light-emitting element 5 The luminescence is controlled from 72 onwards.

[0235] The configuration examples illustrated in this embodiment, and the corresponding drawings, etc., are at least a part of them. This can be implemented by combining it with other configuration examples or drawings as appropriate.

[0236] This embodiment may be appropriately combined with other embodiments described herein, at least in part. They can be implemented in combination.

[0237] (Embodiment 4) Below, we have a pixel circuit equipped with memory for correcting the gradation displayed in the pixel, and this The display device will be described below.

[0238] [Circuit Configuration] Figure 13A shows the circuit diagram of the pixel circuit 400. The pixel circuit 400 consists of transistor M1, It has a transistor M2, a capacitor C1, and a circuit 401. The pixel circuit 400 also has wiring S1, wiring S2, wiring G1, and wiring G2 are connected.

[0239] Transistor M1 has its gate connected to wiring G1, and one of its sources or drains connected to wiring S1. The other end is connected to one electrode of capacitance C1. Transistor M2 has a gate that is wired G2, one of the source and drain is connected to wiring S2, the other electrode is connected to capacitance C1, and rotation It connects to Route 401, respectively.

[0240] Circuit 401 is a circuit that includes at least one display element. Various elements can be used as the display element. While children can be used, typical examples include light-emitting elements such as organic EL elements and LED elements, and liquid crystals. Device, or MEMS (Micro Electro Mechanical System) EMS elements and the like can be applied.

[0241] The node connecting transistor M1 and capacitor C1 is node N1, and the node connecting transistor M2 and... Let node N2 be the node connecting to path 401.

[0242] The pixel circuit 400 maintains the potential of node N1 by turning off transistor M1. It can be maintained. Also, by turning off transistor M2, the power of node N2 can be controlled. It can maintain its position. Also, with transistor M2 in the OFF state, By writing a predetermined potential to node N1 via station M1, capacitive coupling via capacitor C1 is achieved. This allows the potential of node N2 to be changed in accordance with the potential displacement of node N1.

[0243] Here, in the embodiment, one or both of transistors M1 and M2 are The transistor using oxide semiconductors, as exemplified in 1, can be applied. Therefore, the extremely low off-current maintains the potential of nodes N1 and N2 for a long period of time. This is possible. However, if the period for which the potential of each node is maintained is short (specifically, the frame When the frequency is 30Hz or higher, a transistor using a semiconductor such as silicon is used. You may also use "ta".

[0244] [Example of driving method] Next, an example of how the pixel circuit 400 operates will be explained using Figure 13B. This is a timing chart related to the operation of the pixel circuit 400. For simplicity of explanation, this chart is presented here. Therefore, various resistors such as wiring resistance, parasitic capacitance of transistors and wiring, and transistors The effects of the threshold voltage of the staccato are not considered.

[0245] In the operation shown in Figure 13B, one frame period is divided into period T1 and period T2. Period T2 is the period during which the potential is written to node N2, and period N1 is the period during which the potential is written to node N1. That is the case.

[0246] [Period T1] During period T1, a potential is applied to both wire G1 and wire G2 that turns the transistor ON. Also, the wiring S1 has a fixed potential V ref It supplies the first day to wiring S2. Potential V w To supply.

[0247] Node N1 receives a potential V from wiring S1 via transistor M1. ref It is given. Furthermore, node N2 receives the first data potential V from wiring S2 via transistor M2. w is given Therefore, a potential difference V can be obtained across capacitance C1. w -V ref This state is maintained.

[0248] [Period T2] Next, during period T2, a potential is applied to wiring G1 to turn on transistor M1, and The wire G2 is given a potential that turns off transistor M2. Also, the wiring S1 is supplied with the second diode DATA potential V data It supplies a predetermined constant potential to the wiring S2, or a floating It may also be in a ling state.

[0249] Node N1 receives a second data potential V from wiring S1 via transistor M1. data but Given. At this time, the second data potential V is generated by capacitive coupling with capacitance C1. data in response Then the potential of node N2 changes by a potential of dV. That is, circuit 401 receives the first data Potential V w The input will be the sum of the potential dV and the potential dV. Note that in Figure 13B, the potential dV Although it is shown to be a positive value, it may also be a negative value. That is, the second data potential. V data The potential is V ref It can be lower.

[0250] Here, the potential dV is roughly determined by the capacitance value of capacitor C1 and the capacitance value of circuit 401. If the capacitance value of capacitor C1 is sufficiently larger than the capacitance value of circuit 401, the potential dV is the second dV. DATA potential V data The potential will be close to that.

[0251] Thus, the pixel circuit 400 combines two types of data signals to form a display element. Since it is possible to generate the potential supplied to path 401, grayscale correction can be performed within the pixel circuit 400. It becomes possible to do so.

[0252] Furthermore, the pixel circuit 400 generates a potential that exceeds the maximum potential that can be supplied to wiring S1 and wiring S2. It also becomes possible to achieve this. For example, when using light-emitting elements, high dynamic range ( It can display HDR (High Dynamic Range) and other functions. Furthermore, when using liquid crystal elements, overdrying can be performed. It can implement features such as drive mechanisms.

[0253] [Examples of application] [Examples using liquid crystal elements] The pixel circuit 400LC shown in Figure 13C has circuit 401LC. Circuit 401LC is It has a liquid crystal element LC and a capacitance C2.

[0254] In a liquid crystal element (LC), one electrode is the electrode of node N2 and capacitance C2, and the other electrode is Potential V com2 Connect to the wiring provided. Capacitor C2 is connected when the other electrode is at potential V com1 Connect to the provided wiring.

[0255] Capacity C2 functions as the retention capacity. Note that capacity C2 can be omitted if it is not needed. Cut.

[0256] The pixel circuit 400LC can supply a high voltage to the liquid crystal element LC, for example High-speed display is achieved through overdrive operation, and high-voltage liquid crystal materials are applied. It is possible to do things like this. Also, by supplying a correction signal to wiring S1 or wiring S2, The gradation can also be corrected according to the operating temperature and the degradation state of the liquid crystal elements (LC).

[0257] [Examples using light-emitting elements] The pixel circuit 400EL shown in Figure 13D has circuit 401EL. Circuit 401EL is It has a light-emitting element EL, a transistor M3, and a capacitor C2.

[0258] Transistor M3 has a gate that connects to one electrode of node N2 and capacitance C2, and a source and a dot. One side of Rain has a potential of V H One is a wire that is given, and the other is one electrode of the light-emitting element EL, and They are connected. Capacitor C2 is connected when the other electrode is at potential V com Connect to the provided wiring. In the light-emitting element (EL), the other electrode is at potential V. L Connect to the provided wiring.

[0259] Transistor M3 has the function of controlling the current supplied to the light-emitting element EL. Capacitor C2 This functions as a holding capacity. Capacity C2 can be omitted if it is not needed.

[0260] Note that this configuration shows the anode side of the light-emitting element EL connected to transistor M3. However, transistor M3 may be connected to the cathode side. In that case, the potential V H and potential V L The value can be changed as needed.

[0261] The pixel circuit 400EL generates light by applying a high potential to the gate of transistor M3. Because it can supply a large current to the sub-EL, it can enable features such as HDR display. It can be done. Also, by supplying a correction signal to wiring S1 or wiring S2, transistor M3 and It is also possible to correct for variations in the electrical characteristics of light-emitting elements (ELs).

[0262] Note that the circuits are not limited to those exemplified in Figures 13C and 13D, and may also include transistors and capacitors. You may also use a configuration that includes additional elements.

[0263] This embodiment may be appropriately combined with other embodiments described herein, at least in part. They can be implemented in combination.

[0264] (Embodiment 5) The following describes an example of the pixel configuration of a display panel according to one embodiment of the present invention.

[0265] Figures 14A to 14E show examples of the configuration of pixel 300.

[0266] Pixel 300 has multiple pixels 301. Each of the multiple pixels 301 has sub-pixels and It functions as follows: A single pixel 300 is composed of multiple pixels 301, each exhibiting a different color. This configuration allows the display unit to show full color.

[0267] The pixel 300 shown in Figures 14A and 14B each has three subpixels. Figure 1 The color combination exhibited by pixel 301 of pixel 300 shown in 4A is red (R), green (G ), and blue (B). The set of colors exhibited by pixel 301 of pixel 300 shown in Figure 14B. The color combinations are cyan (C), magenta (M), and yellow (Y).

[0268] Each of the pixels 300 shown in Figures 14C to 14E has four subpixels. Figure 14 The color combination exhibited by pixel 301, which is part of pixel 300 shown in C, is red (R) and green (G). These are blue (B) and white (W). By using sub-pixels that exhibit white light, the brightness of the display area can be increased. This is possible. The color combination exhibited by pixel 301, which is part of pixel 300, as shown in Figure 14D. These are red (R), green (G), blue (B), and yellow (Y). Pixel 300 shown in Figure 14E has The color combination exhibited by pixel 301 is cyan (C), magenta (M), yellow (Y), white (W)

[0269] Increase the number of subpixels that function as one pixel, and add red, green, blue, cyan, magenta, and By appropriately combining sub-pixels that exhibit colors such as yellow, the reproduction of midtones can be improved. This allows for improved display quality.

[0270] Furthermore, a display device according to one embodiment of the present invention can reproduce a variety of color gamut standards. For example, PAL (Phase Alternating Line) is used in television broadcasting. ) standards and NTSC (National Television System Com) (Mittee) standard, personal computers, digital cameras, printers and other electronic devices The sRGB (standard RGB) standard is widely used in display devices and Adobe RGB standard, HDTV (High Definition Television) ITU-R BT.709 (Interna) used in ion (also known as high-definition) tional Telecommunication Union Radiocomm unication Sector Broadcasting Service(Te DCI-P3 (Division 709) standard, used in digital cinema projection. digital Cinema Initiatives P3) standard, UHDTV (Ult ra High Definition Television, Super Hi-Vision ITU-R BT.2020 (REC.2020 (Recomme) is used in (also known as) It can reproduce color gamuts such as those specified in the 2020 color gamut standard.

[0271] Furthermore, if 300 pixels are arranged in a 1920 x 1080 matrix, then what is known as full-frame In Vision (also known as "2K resolution," "2K1K," or "2K") A display device capable of full-color display can be realized. Also, for example, 300 pixels can be 3 When arranged in an 840x2160 matrix, it becomes what is known as ultra-high definition ("4K"). Capable of displaying full color at a resolution of "4K2K" or "4K". This makes it possible to realize a display device with 300 pixels at 7680 x 4320 resolution. When arranged in a matrix, it becomes what is known as Super Hi-Vision ("8K resolution", "8K4 This enables the creation of a display device capable of full-color display at a resolution of "K" (also known as "8K"). It is possible to increase the number of pixels by 300 to achieve full-color display at 16K or 32K resolution. It is also possible to realize a display device that can do this.

[0272] This embodiment may be appropriately combined with other embodiments described herein, at least in part. They can be implemented in combination.

[0273] (Embodiment 6) This embodiment describes an example of an electronic device to which a display device according to one aspect of the present invention can be applied. I will reveal it.

[0274] The electronic device 6500 shown in Figure 15A is a portable device that can be used as a smartphone. It is a news terminal device.

[0275] The electronic device 6500 consists of a housing 6501, a display unit 6502, a power button 6503, and a button 6 It includes 504, speaker 6505, microphone 6506, camera 6507, and light source 6508, etc. The display unit 6502 is equipped with a touch panel function.

[0276] A display device according to one aspect of the present invention can be applied to the display unit 6502.

[0277] The display unit 6502 has a notch, and the camera 6507 engages with the notch. And a light source 6508 is provided. With this configuration, the housing 6501 This allows for a larger occupied area of ​​the display unit 6502.

[0278] Furthermore, Figure 15B shows that the display unit 6502 has an opening, and inside the opening is the camera 6507 and This shows an example where a ring-shaped light source 6509 is arranged around camera 6507. Also, The speaker 6505 is provided so as to engage with the notch of the display unit 6502. The display unit 6502 may also be used as a light source to illuminate the subject. This allows the display unit 6502 to occupy a larger area relative to the housing 6501.

[0279] Figure 15C is a schematic cross-sectional view of the housing 6501, including the end on the microphone 6506 side.

[0280] A light-transmitting protective member 6510 is provided on the display surface side of the housing 6501, and the housing 650 Within the space surrounded by 1 and protective member 6510, display panel 6511, optical member 6512, The touch sensor panel 6513, printed circuit board 6517, battery 6518, etc. are arranged. Yes, they are.

[0281] The protective member 6510 includes a display panel 6511, an optical member 6512, and a touch sensor panel. Nel 6513 is fixed by an adhesive layer (not shown).

[0282] Furthermore, in the area outside the display unit 6502, a portion of the display panel 6511 is folded back. It is done. Furthermore, the FPC6515 is connected to the folded portion. IC6516 is mounted on the 6515. Also, the FPC6515 is printed circuit board 6 It is connected to the terminal provided at 517.

[0283] A flexible display panel according to one aspect of the present invention is applied to the display panel 6511. This makes it possible to create extremely lightweight electronic devices. Also, the display panel 651 Because it is extremely thin, it allows for a reduction in the thickness of electronic devices while incorporating a large-capacity 6518 battery. It is also possible to fold back a portion of the display panel 6511 and place an FPC on the back of the pixel area. By positioning the connection point with 6515, it is possible to realize electronic devices with narrow bezels.

[0284] This embodiment may be appropriately combined with other embodiments described herein, at least in part. They can be implemented in combination.

[0285] (Embodiment 7) In this embodiment, an electronic device equipped with a display device manufactured using one aspect of the present invention is provided. I will explain.

[0286] The electronic device described below is equipped with a display device according to one embodiment of the present invention in its display unit. Therefore, it is an electronic device that achieves high resolution. Also, high resolution and a large screen It can be made into an electronic device that is compatible with both systems.

[0287] The display unit of an electronic device according to one aspect of the present invention may display, for example, Full HD, 4K2K, 8K4 It can display video with resolutions of K, 16K, 8K, or higher.

[0288] Examples of electronic devices include television equipment, notebook personal computers, Equipped with relatively large screens such as monitors, digital signage, pachinko machines, and game machines. In addition to electronic devices, digital cameras, digital video cameras, digital photo frames, and portable devices are also available. Examples include mobile phones, portable game consoles, personal digital assistants, and audio playback devices.

[0289] An electronic device to which one aspect of the present invention is applied includes the interior or exterior walls of houses and buildings, the interior of automobiles, etc. It can be incorporated along the flat or curved surfaces of the fittings or exterior.

[0290] Figure 16A shows the external appearance of the camera 8000 with the viewfinder 8100 attached. That is the case.

[0291] The camera 8000 consists of a housing 8001, a display unit 8002, operation buttons 8003, and a shutter. It has buttons 8004, etc. The camera 8000 also has a detachable lens 8006. It is attached.

[0292] The camera 8000 may have the lens 8006 and the body integrated into a single unit.

[0293] Camera 8000 can be operated by pressing the shutter button 8004, or by using the touch panel function. Image capture can be performed by touching the display unit 8002.

[0294] The housing 8001 has a mount with electrodes, and in addition to the viewfinder 8100, it also has a strobe It can be connected to devices such as power supply units.

[0295] The viewfinder 8100 has a housing 8101, a display unit 8102, buttons 8103, etc. .

[0296] The housing 8101 engages with the mount of the camera 8000 via a mount, and the camera 800 It is attached to the 0. The viewfinder 8100 receives images and other data from the camera 8000. This can be displayed on the display unit 8102.

[0297] Button 8103 functions as a power button, etc.

[0298] The display unit 8002 of the camera 8000 and the display unit 8102 of the viewfinder 8100 are equipped with this A display device according to one embodiment of the invention can be applied. Note that a camera with a built-in viewfinder can also be used. It could also be 8000.

[0299] Figure 16B shows the external appearance of the head-mounted display 8200.

[0300] The head-mounted display 8200 consists of a mounting part 8201, lenses 8202, and a main body 82 03, it has a display unit 8204, a cable 8205, etc. Also, the mounting part 8201 has It has a built-in 8206 battery.

[0301] Cable 8205 supplies power from battery 8206 to main unit 8203. Unit 203 is equipped with a wireless receiver and can display the received video information on the display unit 8204. It can do that. Furthermore, the main unit 8203 is equipped with a camera that inputs information about the user's eyeball and eyelid movements. It can be used as a step.

[0302] Furthermore, the attachment part 8201 is positioned in a location that touches the user, and the flow follows the movement of the user's eyeballs. Multiple electrodes capable of detecting currents may be provided, and the device may also have a function to recognize line of sight. Furthermore, the device may have a function to monitor the user's pulse rate based on the current flowing through the electrode. Furthermore, the mounting section 8201 is equipped with various sensors such as a temperature sensor, a pressure sensor, and an acceleration sensor. It is also possible to have a function that displays the user's biometric information on the display unit 8204, and the user's head The display unit 8204 may also have a function to change the image displayed in accordance with the movement.

[0303] A display device according to one aspect of the present invention can be applied to the display unit 8204.

[0304] Figures 16C, 16D, and 16E show the appearance of the head-mounted display 8300. The diagram shows the head-mounted display 8300, which consists of a housing 8301 and a display unit 830 It comprises 2, a band-shaped fixing device 8304, and a pair of lenses 8305.

[0305] The user can view the display on the display unit 8302 through the lens 8305. Furthermore, by arranging the display unit 8302 in a curved shape, the user can experience a high level of realism. This is preferable. Also, another image displayed in a different area of ​​the display unit 8302 is displayed by the lens 8 By viewing through the 305, it is also possible to perform 3D displays using parallax. The configuration is not limited to having one display unit 8302, but can also have two display units 8302, allowing one of the users to... One display unit may be placed for each eye.

[0306] Furthermore, a display device according to one embodiment of the present invention can be applied to the display unit 8302. A display device having a semiconductor device according to one embodiment has extremely high resolution, as shown in Figure 16E. Even when magnified using lens 8305, the user cannot see the individual pixels, resulting in a more detailed view. It can display highly realistic images.

[0307] The electronic equipment shown in Figures 17A to 17G consists of a housing 9000, a display unit 9001, and a speaker 9 003, Operation key 9005 (including power switch or operation switch), Connection terminal 900 6. Sensor 9007 (force, displacement, position, velocity, acceleration, angular velocity, rotational speed, distance, light, liquid, Magnetism, temperature, chemicals, sound, time, hardness, electric field, electric current, voltage, power, radiation, flow rate, humidity (Including functions for measuring degrees, inclines, vibrations, odors, or infrared radiation), Microphone 900 8, etc.

[0308] The electronic devices shown in Figures 17A to 17G have various functions. For example, various information ( Functions to display still images, videos, text images, etc. on the display unit, touch panel function, calendar A function that displays the date or time, etc., through various software (programs) Functions that control processing, wireless communication functions, programs or data recorded on recording media It can have functions such as reading and processing data. Furthermore, the functions of electronic devices are related to these. It is not limited and can have a variety of functions. Even if an electronic device has multiple display units Good. Also, an electronic device can be equipped with a camera, etc., to take still images and videos, and the recording medium (external or It has features such as saving to the camera (built-in), and displaying the captured image on the display unit. That's good too.

[0309] The details of the electronic equipment shown in Figures 17A to 17G will be explained below.

[0310] Figure 17A is a perspective view showing the television equipment 9100. 0 is a display unit 9001 with a large screen, for example, 50 inches or larger, or 100 inches or larger. It is possible to insert it.

[0311] Figure 17B is a perspective view showing the personal digital assistant 9101. The personal digital assistant 9101 is, for example, For example, it can be used as a smartphone. Note that the mobile information terminal 9101 is a speed A connector (9003), connection terminal (9006), sensor (9007), etc. may be provided. Also, a portable information terminal may be provided. The 9101 can display text and image information on its multiple surfaces. Figure 17B shows three of them. This shows an example of displaying icon 9050. Also, information 9051, indicated by a dashed rectangle, is shown. The information can also be displayed on other sides of the display unit 9001. An example of information 9051 is electronic data. Notifications for incoming calls, SNS messages, and phone calls; subject, sender name, and date / time for emails and SNS messages. This includes the time, battery level, and antenna signal strength. Alternatively, information 9051 is displayed. You may display an icon such as 9050 in the indicated location.

[0312] Figure 17C is a perspective view showing the personal digital assistant 9102. The personal digital assistant 9102 is a table The display unit 9001 has the function of displaying information on three or more sides. Here, information 9052, information This shows an example where information 9053 and information 9054 are displayed on different sides. For example, the user With the mobile information terminal 9102 stored in the breast pocket of his clothing, the mobile information terminal 9102 Information 9053, displayed in a position visible from above, can also be viewed. The user can, You can check the display without taking the 9102 personal digital assistant out of your pocket, for example, to answer a phone call. It is possible to determine whether or not to do so.

[0313] Figure 17D is a perspective view showing a wristwatch-type portable information terminal 9200. Also, the display unit 90 01 has a curved display surface, and can display information along the curved surface. Furthermore, the portable information terminal 9200 can communicate with, for example, a wireless headset. This also allows for hands-free calling. Furthermore, the 9200 mobile information terminal is connected The connection terminal 9006 allows for mutual data transmission with other information terminals and for charging. It is also possible to charge it wirelessly.

[0314] Figures 17E, 17F, and 17G show a foldable portable information terminal 9201 from an oblique angle. This is a visual view. Figure 17E shows the mobile information terminal 9201 in its unfolded state, and Figure 17G shows it folded. Figure 17F is a perspective view of the state in which Figure 17E and Figure 17G are transitioning from one to the other. The portable information terminal 9201 is highly portable when folded, and when unfolded... The seamless, wide display area provides excellent readability. (Features of the 9201 mobile information terminal) The display unit 9001 is supported by three housings 9000 connected by hinges 9055. For example, the display unit 9001 can be bent with a radius of curvature of 1 mm or more and 150 mm or less. Cut.

[0315] Figure 18A shows an example of a television system. The television system 7100 has a housing 710 The display unit 7500 is incorporated into 1. Here, the stand 7103 connects to the housing 710. This shows the configuration that supports option 1.

[0316] The television device 7100 shown in Figure 18A is operated by the operation switches provided on the housing 7101. This can be done by using the remote control unit 7111 or by using the display unit 7500. A touch panel can be applied to it, allowing the television device 7100 to be operated by touching it. The remote control unit 7111 may have a display unit in addition to the operation buttons.

[0317] The television equipment 7100 is a television broadcast receiver and for network connectivity. It may have a communication device.

[0318] Figure 18B shows the 7200 notebook personal computer. The Computer 7200 consists of a casing 7211, a keyboard 7212, and a pointing device 7 It has external connection ports 7214, etc. The display unit 7500 is incorporated into the housing 7211. It is being made.

[0319] Figures 18C and 18D show digital signage. An example of an electronic sign is shown.

[0320] The digital signage 7300 shown in Figure 18C consists of a housing 7301, a display unit 7500, and It has a speaker 7303, etc. Furthermore, it has an LED lamp, operation keys (power switch, or It may include an operating switch, connection terminals, various sensors, a microphone, etc. .

[0321] Figure 18D shows a digital signage 7400 mounted on a cylindrical column 7401. Yes. The digital signage 7400 has a display unit 75 that is installed along the curved surface of the column 7401. It contains 00.

[0322] The larger the display unit 7500, the more information can be provided at once, and the more human eyes... Because it is easily absorbed, it can, for example, enhance the effectiveness of advertising.

[0323] It is preferable to apply a touch panel to the display unit 7500 so that the user can operate it. This allows for use not only in advertising, but also in route information, traffic information, and commercial facility information. It can also be used to provide information that users are seeking.

[0324] Also, as shown in Figures 18C and 18D, the digital signage 7300 or digital The Tal Signage 7400 is an information terminal 7311 such as a smartphone owned by the user. It is preferable that communication is possible via wireless communication. For example, the wide display shown on the display unit 7500 To display the information on the screen of the information terminal 7311, or to operate the information terminal 7311 This allows you to switch the display on the 7500 display unit.

[0325] Additionally, information terminals can be connected to the Digital Signage 7300 or Digital Signage 7400. It is also possible to run games using the 7311 as the control device (controller). This allows a large number of users to participate in and enjoy the game simultaneously.

[0326] A display device according to one embodiment of the present invention is applied to the display unit 7500 in Figures 18A to 18D. It is possible. [Examples]

[0327] In this example, samples with different laminated structures were prepared, and their tensile modulus and flexural modulus were measured. I will now explain the results.

[0328] [Rating 1] 〔sample〕 In this embodiment, we assume the film 11 and film 12 exemplified in Embodiment 1 above. As a film, a 100μm thick PEN (Polyethylene naphtha) A late film was used as the viscoelastic sheet intended for the adhesive layer 21. A gel sheet was used.

[0329] Table 1 shows the layered structure and the thickness of each layer of the five samples prepared.

[0330] [Table 1]

[0331] Samples A1, A2, and A3 each consist of a pair of PEN films attached to a viscoelastic sheet. It has a combined structure. Sample A1, Sample A2, and Sample A3 are in order of thickness of the viscoelastic sheet. The thickness was increased.

[0332] In addition, comparative samples Ref.1 and Ref.2 were prepared as comparative samples. Sample Ref.1 is a single PEN film. Comparison sample Ref.2 is a pair of PEN films. It is made by bonding films together with an adhesive primarily composed of epoxy resin. A two-part epoxy resin was used as the adhesive.

[0333] [Measurement of elastic modulus] The measurement of tensile modulus is based on Japanese Industrial Standards JIS 7127 and JIS K7161. The experiment was conducted. A Shimadzu EZ Graph was used as the measuring device. The sample gripping device... The spacing was set at 50 mm. Each sample was processed into a strip 10 mm wide.

[0334] The measurement of the flexural modulus was performed in reference to the Japanese Industrial Standard JIS 7171. The standard assumes a sample thickness of 1 mm or more, but the same applies to thinner samples. Measurements were taken using the following method. Each sample was prepared in the form of a strip 25 mm wide. A three-point bending test was conducted with a support distance of 40 mm.

[0335] The tensile modulus and flexural modulus are, respectively, among the strain-stress curves measured by the method described above. The stress was determined from the slope between two points: the stress at a strain of 0.05% and the stress at a strain of 0.25%.

[0336] 〔result〕 Figure 19A shows the measurement results for the tensile modulus and flexural modulus of each sample.

[0337] First, focusing on the comparative sample Ref.1, there is a tendency for the bending modulus to be greater than the tensile modulus. Yes. Also, the tensile modulus of comparative sample Ref.2 is lower than that of comparative sample Ref.1. However, the bending modulus of elasticity became greater. This is because two films are bonded together with adhesive. This suggests that it has become more difficult to bend.

[0338] Next, focusing on samples A1, A2, and A3, the comparison sample Ref.1 and the ratio Unlike comparative sample Ref.2, the flexural modulus was smaller than the tensile modulus. From this, it was found that samples to which the viscoelastic sheet was applied could be bent with a small force.

[0339] Furthermore, Figure 19A shows that the thicker the viscoelastic sheet, the smaller the flexural modulus. Confirmed.

[0340] Here, the value obtained by dividing the flexural modulus by the tensile modulus (when the tensile modulus is set to 1, the flexural modulus) The ratio of the rates was 1.17 for comparative sample Ref.1 and 1.36 for comparative sample Ref.2. While the values ​​exceed [value], sample A1 is 0.12, sample A2 is 0.10, and sample A3 is 0.0. The result was 6, an extremely small value.

[0341] [Rating 2] Next, samples with a different layered structure were prepared and evaluated in the same manner.

[0342] 〔sample〕 Table 2 shows the layered structure and the thickness of each layer of the three prepared samples.

[0343] [Table 2]

[0344] Sample B1 has a structure in which three PEN films are bonded together with two viscoelastic sheets. Furthermore, sample B2 is prepared by adding a urethane sheet to sample A2. It has a structure laminated with Clear Adhesive film. For the material, an acrylic resin material was used.

[0345] Furthermore, comparative sample Ref.3 was made by laminating three PEN films with epoxy resin. It is.

[0346] The tensile modulus and flexural modulus were measured in the same manner as described above.

[0347] 〔result〕 Figure 19B shows the measurement results for the tensile modulus and flexural modulus of each sample.

[0348] Comparative sample Ref.3, like comparative sample Ref.2 above, has a flexural elasticity that is greater than the tensile modulus. The ratio tended to be higher. Also, the value of the flexural modulus was larger than that of the comparative sample Ref.2. It was confirmed that it was working.

[0349] Next, focusing on sample B1, despite its extremely thick thickness of approximately 0.9 mm, the sample The result showed an even lower flexural modulus compared to A1 and sample A2.

[0350] Furthermore, like sample A1, sample B2 also has a flexural modulus that is more than an order of magnitude smaller than its tensile modulus. The results were positive. From these results, it can be seen that even just applying a viscoelastic sheet to a part of the laminated structure is effective. It was confirmed that it was effective.

[0351] [Observation of sample shape] The following describes the results of observing the edges of sample A1 while changing its shape. do.

[0352] Figure 20A1 is a micrograph of the edge of sample A1 when the sample A1 is flattened. Furthermore, Figure 20A2 is a photograph in which image processing has been applied to enhance the contours compared to Figure 20A1. As shown in Figures 20A1 and 20A2, when sample A1 is flat, a pair of PE The edges of the N film and the edges of the viscoelastic sheet are roughly in agreement.

[0353] Figures 20B1 and 20B2 show the result when sample A1 is curved 180 degrees with a diameter of 10 mm. These are microscopic images. From Figures 20B1 and 20B2, the upper PEN film is shown. The lower PEN film has a shape that protrudes outward, and the end face of the viscoelastic sheet is stretched. It can be confirmed that it is deformed in a stretching manner. Also, the end faces of the viscoelastic sheet are pair It is observed that the PEN film is inclined relative to its edge and has a gently curved shape. ru.

[0354] Figures 20C1 and 20C2 show the results when sample A1 is bent 180 degrees with a diameter of 3 mm. This is a microscopic image. It shows almost the same shape as when it is curved with a diameter of 10 mm. Thus, it was confirmed that the shape of the end of sample A1 hardly changes with curvature. [Explanation of symbols]

[0355] 10, 10A, 10R: Display panel; 11, 12, 13: Film; 21, 21a, 21 b: Adhesive layer: 21R: Adhesive: 26, 26a, 26b: FPC: 27, 27a, 27b: Connection body: 31, 31a, 31b: Support body: 32: Adhesive layer: 33, 34a, 34b, 34c , 34d, 34e, 34f, 34g, 34h, 34j, 34k: Support: 35, 35a, 35b, 36: Connection part

Claims

[Claim 1] A display device having a display panel equipped with display elements, The display panel comprises a first film, a second film, and a first adhesive layer. The first adhesive layer is located between the first film and the second film and has the function of bonding the first film and the second film together. The display element is supported by the first film, The aforementioned display panel has a flexural modulus that is 0.01 times or more and less than 1 time compared to the tensile modulus. Display device.

Images