Cables and methods for manufacturing cables

The cable design addresses the issue of excessive thickness in miniaturized cables by using a flat-insulating protective body formed with controlled resin application, ensuring thinness and effective insulation.

JP2026090932APending Publication Date: 2026-06-03SUMITOMO ELECTRIC INDUSTRIES LTD

Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
SUMITOMO ELECTRIC INDUSTRIES LTD
Filing Date
2024-11-22
Publication Date
2026-06-03

AI Technical Summary

Technical Problem

Existing cable technologies fail to adequately control the thickness of the insulating protector at the connection point between the electric wire and the connection member, particularly in miniaturized and thin cables, leading to increased thickness due to non-flat protective agent application.

Method used

A cable design with a conductive portion covered by an insulating protective body, featuring a flat upper surface that overlaps with the conductive portion, formed by controlled application and compression of curable resin using a jig and pressing member to ensure thinness and adequate insulation.

Benefits of technology

Enables the production of thinner cables with controlled insulation thickness, preventing resin spread to unintended areas and maintaining productivity through precise resin application and curing.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure 2026090932000001_ABST
    Figure 2026090932000001_ABST
Patent Text Reader

Abstract

We offer slim cables. [Solution] A cable according to one embodiment of the present disclosure is a cable comprising a wire and a substrate, wherein the wire includes a conductor, a covering covering the conductor, and an exposed portion where the conductor is exposed when the covering is removed, the upper surface of the substrate is provided with a terminal that is electrically connected to the exposed portion, a conductive portion including the exposed portion and the terminal is formed, the conductive portion is covered with an insulating protective body, and when viewed parallel to the thickness direction of the substrate, at least the upper surface of the insulating protective body that overlaps with the conductive portion has a flat portion.
Need to check novelty before this filing date? Find Prior Art