Crimping device and crimping method for components

Abstract

To provide a component crimping device capable of crimping components onto large circuit boards. [Solution] The component crimping device (component mounting line 1) comprises a transport unit 60 that transports a substrate 3 to a reference position, a stage 37 on which the substrate transported by the transport unit is placed, a moving unit (substrate moving mechanism 31) that moves the stage between a crimping position for crimping components 5 onto the substrate and the reference position, a crimping unit (crimping tool 34) that crimps components onto the substrate placed on the stage at the crimping position, and a control unit 2a that controls the transport unit, the moving unit and the crimping unit. The control unit causes the transport unit and the moving unit to perform a position change operation to change the relative position of the substrate with respect to the stage between a first crimping operation in which the crimping unit crimps components onto a first region 3b on the substrate, and a second crimping operation in which the crimping unit crimps components onto a second region 3c on the substrate that is different from the first region.

Description

Technical Field

[0001] The present disclosure relates to a component crimping device and a component crimping method.

Background Art

[0002] Conventionally, in a component crimping device for crimping a component to a substrate, it is a device that performs a process of placing a component on an ACF (Anisotropic Conductive Film) attached to the substrate. After aligning the component held by the component holding device with the side edge of the substrate, a process of temporarily crimping by attaching it to a predetermined position is performed.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] By the way, in reality, for a large substrate that exceeds the range in which the component can be aligned by the component holding device, the component cannot be crimped to the side edge of the substrate.

[0005] Therefore, an object of the present disclosure is to provide a component crimping device and the like that can crimp a component even to a large substrate.

Means for Solving the Problems

[0006] A component crimping apparatus according to one aspect of the present disclosure comprises a transport unit for transporting a substrate to a reference position, a stage on which the substrate transported by the transport unit is placed, a crimping position for crimping components onto the substrate, a move unit for moving the stage between the reference position and the crimping position, a crimping unit for crimping components onto the substrate placed on the stage at the crimping position, and a control unit for controlling the transport unit, the move unit and the crimping unit, wherein the control unit causes the transport unit and the move unit to perform a position change operation to change the relative position of the substrate with respect to the stage between a first crimping operation in which the crimping unit crimps the components onto a first region of the substrate and a second crimping operation in which the crimping unit crimps the components onto a second region of the substrate that is different from the first region.

[0007] A component crimping method according to one aspect of the present disclosure is a component crimping method performed by a component crimping apparatus comprising: a transport unit for transporting a substrate to a reference position; a stage on which the substrate transported by the transport unit is placed; a crimping position for crimping a component to the substrate; a move unit for moving the stage between the reference position and the crimping position; and a crimping unit for crimping a component to the substrate placed on the stage at the crimping position, wherein a position change operation is performed by the transport unit and the move unit to change the relative position of the substrate with respect to the stage between a first crimping operation in which the crimping unit crimps the component to a first region of the substrate and a second crimping operation in which the crimping unit crimps the component to a second region of the substrate that is different from the first region. [Effects of the Invention]

[0008] According to this disclosure, it is possible to provide a component crimping device, etc., that can crimp components even onto large substrates.

[0009] Further advantages and effects of one aspect of this disclosure will be made apparent from the specification and drawings. Such advantages and / or effects are provided by several embodiments and features described in the specification and drawings, but not all of them are necessarily provided in order to obtain one or more identical features. [Brief explanation of the drawing]

[0010] [Figure 1] Figure 1 is a diagram showing the schematic configuration of a component mounting line according to an embodiment. [Figure 2] Figure 2 is a plan view of the component mounting line in the embodiment. [Figure 3] Figure 3 is a block diagram showing a computer and the various components controlled by that computer, located on a component mounting line. [Figure 4] Figure 4 is an explanatory diagram showing one step of the component crimping method according to an embodiment. [Figure 5] Figure 5 is an explanatory diagram showing one step of the component crimping method according to an embodiment. [Figure 6] Figure 6 is an explanatory diagram showing one step of the component crimping method according to an embodiment. [Figure 7] Figure 7 is an explanatory diagram showing one step of the component crimping method according to an embodiment. [Figure 8] Figure 8 is an explanatory diagram showing one step of the component crimping method according to an embodiment. [Figure 9] Figure 9 is an explanatory diagram showing one step of the component crimping method according to an embodiment. [Figure 10] Figure 10 is an explanatory diagram showing one step of the component crimping method according to an embodiment. [Figure 11] Figure 11 is an explanatory diagram showing one step of a component crimping method according to an embodiment. [Modes for carrying out the invention]

[0011] A component crimping apparatus according to a first aspect of the present disclosure comprises a transport unit for transporting a substrate to a reference position, a stage on which the substrate transported by the transport unit is placed, a crimping position for crimping components onto the substrate, a move unit for moving the stage between the stage and the reference position, a crimping unit for crimping components onto the substrate placed on the stage at the crimping position, and a control unit for controlling the transport unit, the move unit and the crimping unit, wherein the control unit causes the transport unit and the move unit to perform a position change operation to change the relative position of the substrate with respect to the stage between a first crimping operation in which the crimping unit crimps the components onto a first region of the substrate and a second crimping operation in which the crimping unit crimps the components onto a second region of the substrate that is different from the first region.

[0012] According to this, a position change operation is performed between the first and second crimping operations, changing the relative position of the substrate with respect to the stage. This allows the second region of the substrate on the stage to be positioned within a movable range for the crimping area. In other words, it becomes possible to crimp components to the second region of the substrate, which cannot be crimped in the first crimping operation, during the second crimping operation. Therefore, it becomes possible to crimp components even to large substrates that have a second region where components cannot be crimped in the first crimping operation.

[0013] The component crimping device according to the second embodiment is a component crimping device according to the first embodiment, wherein the control unit performs the following as the position change operation: a first operation in which the stage on which the substrate is placed is moved to the reference position by the moving unit; a second operation in which the substrate is transferred from the stage to the transport unit after the first operation; a third operation in which the stage is brought closer to the second area by the moving unit after the second operation; and a fourth operation in which the substrate is transferred from the transport unit to the stage after the third operation.

[0014] According to this, the position change operation is performed in the order of the first, second, third, and fourth operations, so that the relative position of the substrate with respect to the stage can be changed smoothly.

[0015] The component crimping method according to the third aspect of the present disclosure includes a transport unit that transports a substrate to a reference position, a stage on which the substrate transported by the transport unit is placed, a crimping position where a component is crimped to the substrate, a moving unit that moves the stage between the reference position, and a crimping unit that crimps a component to the substrate placed on the stage at the crimping position. The component crimping method is executed by a component crimping device, and includes a first crimping operation in which the crimping unit crimps the component to a first region on the substrate, and a second crimping operation in which the crimping unit crimps the component to a second region different from the first region on the substrate. Between the operations, a position changing operation for changing the relative position of the substrate with respect to the stage is performed by the transport unit and the moving unit.

[0016] According to this, since a position changing operation is executed between the first crimping operation and the second crimping operation, and the relative position of the substrate with respect to the stage is changed, the second region of the substrate can be arranged within a range where it can be moved to the crimping unit on the stage. That is, it becomes possible to crimp the component in the second crimping operation to the second region of the substrate where the component cannot be crimped in the first crimping operation. Therefore, it becomes possible to crimp a component to a large substrate having a second region where the component cannot be crimped in the first crimping operation.

[0017] (Embodiment) Hereinafter, embodiments will be specifically described with reference to the drawings.

[0018] Note that all of the embodiments described below show comprehensive or specific examples. The numerical values, shapes, materials, components, arrangement positions and connection forms of the components, steps, order of steps, etc. shown in the following embodiments are merely examples and are not intended to limit the present disclosure. In addition, among the components in the following embodiments, components not described in the independent claims indicating the most general concept are described as optional components. Also, each figure is a schematic diagram and is not necessarily drawn precisely. Also, in each figure, the same constituent members are denoted by the same reference numerals.

[0019] [Overall configuration of the component mounting line] Figure 1 shows a schematic configuration of a component mounting line 1 according to an embodiment. The component mounting line 1 in this embodiment is a system that produces products such as display panels (i.e., mounted substrates) by mounting components 5 onto substrates 3 such as liquid crystal panels and organic EL (Electro-Luminescence) panels. The components 5 are, for example, electronic components such as drive circuits. Furthermore, the component mounting line 1 is an example of a component crimping device according to this disclosure.

[0020] As shown in Figure 1, such a component mounting line 1 includes a substrate loading section 10, an adhesive section 20, a temporary crimping section 30, a main crimping section 40, and a substrate unloading section 50. The substrate loading section 10, adhesive section 20, temporary crimping section 30, main crimping section 40, and substrate unloading section 50 are arranged in this order.

[0021] The substrate receiving section 10 receives rectangular substrates 3 that are brought in by an operator or other equipment upstream. The substrates 3 are then transported to the bonding section 20 downstream.

[0022] The adhesive section 20 receives the substrate 3 discharged from the substrate loading section 10 and adheres ACF or the like as an adhesive material to each of the multiple electrode sections 4 located on the periphery of the substrate 3. The substrate 3 with the adhesive material attached is then discharged to the temporary pressure bonding section 30. Each of the multiple electrode sections 4 is, for example, composed of multiple electrodes.

[0023] The temporary crimping section 30 receives the substrate 3 that has been discharged from the adhesive section 20, and places the component 5 on the portion of the substrate 3 to which the adhesive material is attached, and performs temporary crimping. Then, the substrate 3 with the component 5 temporarily crimped is discharged to the main crimping section 40.

[0024] The main crimping unit 40 receives the substrate 3 that has been discharged from the temporary crimping unit 30 and performs main crimping (also called heat crimping) on ​​the components 5 that have been temporarily crimped to the substrate 3. The substrate 3 that has undergone main crimping is then discharged to the substrate discharge unit 50.

[0025] The substrate discharge unit 50 receives the substrate 3 discharged from the main crimping unit 40. The substrate 3 received by the substrate discharge unit 50 is then discharged downstream.

[0026] In this manner, the component mounting line 1 performs component mounting work, mounting components 5 to each of the multiple electrode portions 4 provided on the periphery of the incoming substrate 3, and then discharges the substrate 3 with the components 5 mounted as a mounted substrate from the substrate discharge section 50.

[0027] [Detailed configuration of the component mounting line] Figure 2 is a plan view of the component mounting line 1 in this embodiment. Specifically, Figure 2 shows the configuration of the component mounting line 1 as viewed from above. In this embodiment, the transport direction of the substrate 3, i.e., the left-right direction, is referred to as the X-axis direction, the vertical direction, i.e., the up-down direction, is referred to as the Z-axis direction, and the direction perpendicular to the X-axis and Z-axis directions, i.e., the depth direction, is referred to as the Y-axis direction. Furthermore, the negative X-axis direction and the positive X-axis direction correspond to the upstream and downstream sides of the transport direction of the substrate 3, respectively, the negative Z-axis direction and the positive Z-axis direction correspond to the downward and upward directions in the vertical direction, respectively, and the negative Y-axis direction and the positive Y-axis direction correspond to the front and back sides, or the front and rear sides, respectively, in the depth direction.

[0028] The substrate loading section 10 is equipped with a base 1a for placing the substrates 3 to be loaded. The base 1a of the substrate loading section 10 is provided with a stage 11 on which the substrates 3 are placed. The stage 11 moves up and down in the Z-axis direction relative to the base 1a. In addition, the upper surface of the stage 11 is provided with a plurality of suction holes 11a. Such a stage 11 holds the substrates 3, which have been loaded by an operator or other upstream equipment and placed on the stage 11, by vacuum suction through the suction holes 11a using a suction device such as a pump (not shown).

[0029] The adhesive unit 20 has the function of performing the adhesive work of attaching ACF, which is an adhesive material, to the electrode portion 4 of the substrate 3. The adhesive unit 20 includes a substrate moving mechanism 21 and an adhesive mechanism 22.

[0030] The substrate moving mechanism 21 is a mechanism for moving the substrate 3. The substrate moving mechanism 21 includes, for example, an X-axis table that is movable in the X-axis direction, a Y-axis table that is movable in the Y-axis direction, a Z-axis table that is movable in the Z-axis direction, and a stage 23. The substrate moving mechanism 21 is mounted on a base 1b in the following order from bottom to top: the X-axis table, the Y-axis table, the Z-axis table, and the stage 23.

[0031] The Y-axis table extends in the Y-axis direction and moves freely in the X-axis direction on the X-axis table. The Z-axis table moves freely in the Y-axis direction on the Y-axis table and raises and lowers the stage 23 located above it in the Z-axis direction and rotates it around the Z-axis.

[0032] Furthermore, the upper surface of the stage 23 is provided with multiple suction holes 23a, and the stage 23 holds the substrate 3 placed on its upper surface by vacuum suction. In this way, the substrate moving mechanism 21 holds the substrate 3 by suction and moves it in the horizontal plane (specifically, in the X-axis and Y-axis directions), raises and lowers it in the vertical direction (i.e., in the Z-axis direction), and rotates it around the Z-axis.

[0033] The adhesive mechanism 22 comprises, for example, two adhesive mechanism units arranged in the X-axis direction above the base 1b. Each adhesive mechanism unit includes an ACF supply unit for supplying ACF, an adhesive head for adhering the ACF to the substrate 3, and an adhesive backup stage located below the adhesive head. Each of these two adhesive mechanism units adheres the ACF supplied from the ACF supply unit to positions on the substrate 3, which is supported by the adhesive backup stage, by raising and lowering the adhesive head.

[0034] The temporary crimping unit 30 performs a temporary crimping operation by mounting the component 5 onto the area of ​​the substrate 3 to which the ACF is attached (i.e., the area to be crimped) and then temporarily crimping it. The temporary crimping unit 30 comprises a substrate moving mechanism 31, a component mounting mechanism 32, a component supply unit 33, and a component transfer unit 35.

[0035] The substrate moving mechanism 31 has a structure similar to that of the substrate moving mechanism 21 of the adhesive section 20. Specifically, the substrate moving mechanism 31 has a stage 37 for holding the substrate 3. Multiple suction holes 37a are provided on the upper surface of the stage 37. The substrate moving mechanism 31 holds the substrate 3 placed on the stage 37 by vacuum suction using the multiple suction holes 37a. The substrate moving mechanism 31 also has the function of moving the stage 37 that holds the substrate 3 in a horizontal plane, raising and lowering it in the vertical direction, and rotating it around the Z axis. By moving and rotating the stage 37, the substrate moving mechanism 31 positions the area of ​​the substrate 3 to which the ACF is attached above the backup section 36, which is the backup stage of the component mounting mechanism 32.

[0036] The parts supply unit 33 is provided extending from the rear of the base 1b at the rear side (i.e., in the positive Y-axis direction) of the parts mounting mechanism 32. For example, the parts supply unit 33 includes a supply reel 33a around which a tape material such as a TCP (Tape Carrier Package) with parts 5 incorporated is wound, a punching unit 33b, a movable stage 33c, and a rail 33d. Such a parts supply unit 33 sequentially supplies parts 5 from the tape material through the movement of its components.

[0037] The parts transfer unit 35 moves the parts 5 supplied from the parts supply unit 33 to the crimping tool 34 included in the parts mounting mechanism 32.

[0038] The component mounting mechanism 32 is provided on the base 1b and includes a crimping tool 34 and a backup unit 36.

[0039] The backup section 36 is a long, elongated member that supports the substrate 3 from below. In other words, the backup section 36 supports a predetermined area of ​​the substrate 3 held by the stage 37, which is the area to be crimped, from below. This crimping area is the area on the substrate 3 to which the ACF is attached.

[0040] The crimping tool 34 holds the component 5 and presses it onto the upper surface of the substrate 3, which is supported by the backup unit 36. In other words, the crimping tool 34 is an example of a crimping unit that presses the component 5 onto the target area of ​​the substrate 3. Specifically, the crimping tool 34 moves up and down in the Z-axis direction and picks up (i.e., picks up) the component 5 that has been moved by the component transfer unit 35 from above. Then, the crimping tool 34 places the picked-up component 5 on the ACF and presses the substrate 3 together with the backup unit 36, thereby temporarily crimping the component 5 to the substrate 3. The crimping tool 34 is fixed in the X-axis and Y-axis directions. This position of the crimping tool 34 is called the crimping position. The temporary crimping unit 30 may also include a mechanism to rotate the direction of the substrate 3, which is held by the substrate transfer mechanism 31, by 90 degrees.

[0041] The main crimping unit 40 performs the main crimping operation (also called the thermocompression operation) to permanently crimp (i.e., thermocompression) the component 5 that has been temporarily crimped to the substrate 3 by the temporary crimping unit 30 to the substrate 3. In this way, the electrode portion 4 formed on the substrate 3 and the component 5 are electrically connected via the ACF. Such a main crimping unit 40 includes a substrate moving mechanism 41 and a crimping mechanism 42.

[0042] The substrate moving mechanism 41 has the same structure as the substrate moving mechanism 21 of the adhesive section 20. Specifically, the substrate moving mechanism 41 has a stage 49. Multiple suction holes 49a are provided on the upper surface of the stage 49. The substrate moving mechanism 41 holds the substrate 3 placed on the stage 49 by vacuum suction using the multiple suction holes 49a. The substrate moving mechanism 41 also has the function of moving the stage 49 that holds the substrate 3 by suction in a horizontal plane, raising and lowering it in the vertical direction, and rotating it around the Z axis. By moving and rotating the stage 49, the substrate moving mechanism 41 positions the area where the components 5 of the substrate 3, which are being held by suction, are temporarily crimped above the crimping support section of the crimping mechanism 42.

[0043] The crimping mechanism 42 presses the component 5 on the substrate 3 toward the crimping support portion with a heated head. As a result, the component 5 is crimped, and the electrode portion 4 formed on the substrate 3 and the component 5 are electrically connected via the ACF. In other words, the crimping mechanism 42 is an example of a crimping portion. The crimping mechanism 42 is fixed in the X-axis and Y-axis directions.

[0044] The substrate unloading unit 50 has the function of vacuum-suctioning and holding the substrate 3 transported from the main crimping unit 40 onto the stage 51. The substrate 3 held in the substrate unloading unit 50 is either transported to another device downstream or removed from the stage 51 by an operator. The stage 51 moves up and down in the Z-axis direction relative to the base 1c. In addition, the upper surface of the stage 51 is provided with a plurality of suction holes 51a, and the stage 51 vacuum-suctions and holds the substrate 3 transported from the main crimping unit 40 on its upper surface.

[0045] The transport unit 60 is a device for transporting the substrate 3. Specifically, the transport unit 60 has the function of transferring (transporting) the substrate 3, which has been brought into the substrate loading unit 10, to the adhesive unit 20, the temporary crimping unit 30, the main crimping unit 40, and the substrate unloading unit 50 in that order. The transport unit 60 is located in the area in front of the adhesive unit 20, the temporary crimping unit 30, and the main crimping unit 40 (i.e., in the negative Y-axis direction).

[0046] The transport unit 60 includes substrate transport mechanisms 62A, 62B, 62C, and 62D, which are arranged in order from upstream on a movable base 61 that extends in the X-axis direction across bases 1a, 1b, and 1c. Each of the substrate transport mechanisms 62A to 62D includes a base 63 and one or more arm units 64. In this embodiment, the case in which each of the substrate transport mechanisms 62A to 62D includes two arm units 64 is illustrated. The base 63 is provided on the movable base 61 and can move freely in the X-axis direction. Two arm units 64 are provided side by side on the base 63 in the X-axis direction. The arm units 64 vacuum-suction the substrate 3 from above.

[0047] Each of the substrate transport mechanisms 62A to 62D moves the substrate 3 held by stages 11, 23, 37, 49, and 51 to a substrate transfer position where it is vacuum-suctioned from above, and receives or transfers the substrate 3 from the rising and falling stages 11, 23, 37, 49, and 51. For example, substrate transport mechanism 62A receives the substrate 3 placed on stage 11 of the substrate loading section 10 and transfers it to stage 23 of the bonding section 20. Also, for example, substrate transport mechanism 62B receives the substrate 3 from stage 23 of the bonding section 20 and transfers it to stage 37 of the temporary crimping section 30. Also, for example, substrate transport mechanism 62C receives the substrate 3 from stage 37 of the temporary crimping section 30 and transfers it to stage 49 of the main crimping section 40. Also, for example, substrate transport mechanism 62D receives the substrate 3 from stage 49 of the main crimping section 40 and transfers it to stage 51 of the substrate unloading section 50.

[0048] Figure 3 is a block diagram showing the computer and the components controlled by that computer, which are located on component mounting line 1.

[0049] The component mounting line 1 includes a computer 2, as shown in Figure 3. This computer 2 is connected to, for example, the adhesive section 20, the temporary crimping section 30, the main crimping section 40, and the transport section 60 via control lines, and controls each of these sections. The computer 2 includes a control unit 2a and a storage unit 2b.

[0050] The memory unit 2b stores various data necessary for component mounting operations, such as the size of the circuit board 3, the types of components 5 to be mounted on the circuit board 3, their mounting positions, mounting directions, and the timing for transporting the circuit board 3, as well as control programs executed by the control unit 2a. The memory unit 2b is implemented using ROM (Read Only Memory) or RAM (Random Access Memory), etc.

[0051] The control unit 2a controls the substrate moving mechanism 21 of the adhesive unit 20, the substrate moving mechanism 31 of the temporary crimping unit 30, the substrate moving mechanism 41 of the main crimping unit 40, and the transport unit 60 to perform a substrate transfer operation to move the substrate 3 between each unit to the next process. The transfer of the substrate 3 from the upstream side to the downstream side during the substrate transfer operation is performed synchronously between each unit.

[0052] For example, the control unit 2a controls the adhesive unit 20 to change the orientation and position of the substrate 3 held by the substrate moving mechanism 21, changes the spacing between the multiple adhesive heads using the head moving motor, and causes the adhesive unit 20 to perform the adhesive work of attaching ACF to the substrate 3 using the adhesive mechanism 22.

[0053] Furthermore, for example, the control unit 2a controls the temporary crimping unit 30 to change the orientation and position of the substrate 3 held by the substrate moving mechanism 31, causing the component mounting mechanism 32 to perform temporary crimping of the component 5 to the substrate 3. The control unit 2a also controls the component supply unit 33 and the component transfer unit 35 to move the component 5 to be temporarily crimped to the substrate 3 toward the component mounting mechanism 32.

[0054] Furthermore, for example, the control unit 2a controls the main crimping unit 40 to change the orientation and position of the substrate 3 held by the substrate moving mechanism 41, and causes the component 5 that has been temporarily crimped to the substrate 3 to be permanently crimped by the crimping mechanism 42.

[0055] Such a control unit 2a is implemented, for example, by a control program stored in a memory unit 2b for controlling each part and mechanism of the component mounting line 1, and a processor such as a CPU (Central Processing Unit) that executes the control program.

[0056] [Method for crimping components] Next, a component crimping method according to an embodiment will be described. Figures 4 to 11 are explanatory diagrams showing each step of the component crimping method according to the embodiment. In this embodiment, the operation of the temporary crimping unit 30 is illustrated, but the same operation may be performed in the main crimping unit 40. The component crimping method is executed by the control unit 2a controlling each part.

[0057] Figure 4 shows the state immediately after the substrate 3 has been placed on the stage 37 of the temporary crimping section 30 by the substrate transport mechanism 62B. In this state, the stage 37 is positioned at the reference position. The reference position is relative to the origin P1 of the temporary crimping section 30 (the intersection of the dashed lines Lx and Ly in Figure 4). Specifically, at the reference position, the center of the stage 37 in a plan view approximately coincides with the origin P1. The center of the crimping tool 34 in the X-axis direction is located in the positive Y-axis direction of the origin P1.

[0058] As shown in Figure 4, the substrate 3 is mounted on the stage 37, which is positioned at a reference location, with the substrate 3 positioned towards the negative X-axis and positive Y-axis directions. This state is referred to as the first mounting state. In the first mounting state, multiple ACFs are arranged along the X-axis direction on the edge 3a of the substrate 3 that protrudes from the stage 37 in the positive Y-axis direction. Here, the region of the edge 3a of the substrate 3 facing the stage 37 is referred to as the first region 3b, and the region of the edge 3a other than the first region 3b is referred to as the second region 3c.

[0059] The first region 3b is the long region in the X-axis direction enclosed by the dashed line in Figure 4. In the first mounting state, the first region 3b is within the movable range of the stage 37 by the substrate moving mechanism 31 and is included in the region that can be placed directly below the crimping tool 34. In other words, in the first mounting state, when the stage 37 is moved by the substrate moving mechanism 31, the first region 3b is placed directly below the crimping tool 34. Therefore, in the first mounting state, the ACF within the first region 3b is moved directly below the crimping tool 34 when the stage 37 is moved by the substrate moving mechanism 31.

[0060] The second region 3c is the region with dot hatching in Figure 4, and is located in the negative X-axis direction of the first region 3b. In the first mounting state, the second region 3c is a region that is not located directly below the crimping tool 34 even if the stage 37 is moved by the substrate moving mechanism 31. Therefore, in the first mounting state, the ACF in the second region 3c is not moved directly below the crimping tool 34 even if the stage 37 is moved by the substrate moving mechanism 31.

[0061] The control unit 2a controls the substrate moving mechanism 31 to move the stage 37 in the first mounting state, thereby sequentially positioning the ACFs in the first region 3b directly under the crimping tool 34. This position is the crimping position for crimping the components 5 onto the substrate 3. Each time an ACF in the first region 3b is positioned directly under the crimping tool 34, the control unit 2a controls the component mounting mechanism 32 to temporarily crimp the components 5 onto the ACF using the crimping tool 34. This process of temporarily crimping the components 5 onto each ACF in the first region 3b is an example of the first crimping operation.

[0062] Figure 5 shows the state in the first crimping operation where the ACF at the end in the negative X-axis direction within the first region 3b is positioned directly below the crimping tool 34. Once temporary crimping is performed on this ACF, the control unit 2a performs a position change operation. The position change operation is the operation of changing the relative position of the substrate 3 with respect to the stage 37. The control unit 2a performs the first, second, third, and fourth operations in this order as part of the position change operation.

[0063] In the first operation, the control unit 2a controls the substrate moving mechanism 31 to return the stage 37 from the crimping position to the reference position, as shown in Figure 6. In other words, the substrate moving mechanism 31 is an example of a moving part that moves the stage 37 between the crimping position and the reference position.

[0064] In the second operation, the control unit 2a transfers the substrate 3 from the stage 37 to the transport unit 60 after the first operation. Specifically, the control unit 2a controls the substrate transport mechanism 62C of the transport unit 60 to receive the substrate 3, which is in the first placed state, from the stage 37 as shown in Figure 7, and moves the substrate 3 away from the stage 37 in the positive Z-axis direction, causing it to float. In Figure 7, the substrate 3, which has been lifted from the stage 37, is shown by a dashed line. The control unit 2a controls the substrate transport mechanism 62C to keep the substrate 3 stationary so that its position in the X-axis and Y-axis directions does not change.

[0065] In the third operation, after the second operation, the control unit 2a moves the stage 37 closer to the second region 3c using the substrate moving mechanism 31. Specifically, the control unit 2a controls the substrate moving mechanism 31 to move the stage 37 in the negative X-axis direction, as shown in Figure 8, thereby bringing the substrate 3, which is floating above the stage 37, closer to the second region 3c. This changes the relative position between the substrate 3 and the stage 37.

[0066] In the fourth operation, the control unit 2a transfers the substrate 3 from the transport unit 60 to the stage 37 after the third operation. Specifically, the control unit 2a controls the substrate transport mechanism 62C of the transport unit 60 to move the substrate 3 in the negative Z-axis direction, as shown in Figure 9, and places the substrate 3 on the stage 37. This state is called the second placement state. In the second placement state, the relative position between the substrate 3 and the stage 37 is changed compared to the first placement state. The second region 3c of the substrate 3 is included in the area that can be placed directly below the crimping tool 34, which is within the movable range of the stage 37 by the substrate moving mechanism 31. With this, the position change operation is completed.

[0067] Next, the control unit 2a controls the substrate moving mechanism 31 to move the stage 37, which is in the second mounting state, to the reference position, as shown in Figure 10.

[0068] Next, the control unit 2a controls the substrate moving mechanism 31 to move the stage 37 in the second mounting state as shown in Figure 11, thereby positioning the ACF in the second region 3c directly below the crimping tool 34 (crimping position). After that, the control unit 2a controls the component mounting mechanism 32 to temporarily crimp the component 5 onto the ACF in the second region 3c using the crimping tool 34. This process of temporarily crimping the component 5 onto the ACF in the second region 3c is an example of the second crimping operation.

[0069] [Effects, etc.] As described above, according to this embodiment, a position change operation is performed between the first and second crimping operations, changing the relative position of the substrate 3 with respect to the stage 37. This allows the second region 3c of the substrate 3 to be positioned within a range movable by the crimping tool 34 on the stage 37. In other words, it becomes possible to crimp the component 5 to the second region 3c of the substrate 3, which cannot be crimped in the first crimping operation, during the second crimping operation. Therefore, it becomes possible to crimp the component 5 even to a large substrate 3 that has a second region 3c where the component 5 cannot be crimped in the first crimping operation.

[0070] In particular, during the repositioning operation, the first, second, third, and fourth operations are executed in sequence, allowing for a smooth change in the relative position of the substrate 3 with respect to the stage 37.

[0071] (others) Although the component crimping device and the like have been described above based on the above embodiments, this disclosure is not limited to these embodiments. Various modifications to the above embodiments that a person skilled in the art could conceive of may also be included within the scope of this disclosure, as long as they do not depart from the spirit of this disclosure.

[0072] For example, in the above embodiment, the substrate 3 is a liquid crystal panel, and the components 5 are temporarily and permanently attached to the liquid crystal panel, but the substrate 3 may be a substrate other than a liquid crystal panel. [Industrial applicability]

[0073] This disclosure is applicable, for example, to component crimping devices that crimp components onto a substrate. [Explanation of Symbols]

[0074] 1. Component mounting line (component crimping machine) 1a, 1b, 1c base 2 Computers 2a Control section 2b Storage section 3 circuit boards 3a Edge 3b First area 3c Second area 4 Electrode part 5 parts 10. Circuit board loading section 11 stages 11a, 23a, 37a, 49a, 51a Adsorption holes 20 Adhesive part 21, 41 Substrate moving mechanism 22 Adhesion mechanism Stages 23, 37, 49, and 51 30 Temporary crimping section 31. Substrate moving mechanism (moving part) 32 Component mounting mechanism 33. Parts Supply Department 33a Supply Reel 33b Extraction section 33c Movable Stage 33d rail 34 Crimping tool (crimping part) 35. Parts Transfer Section 36 Backup section 40 crimped sections 42 Crimping mechanism 50. Substrate unloading section 60 Conveying section 61 Mobile Base 62A, 62B, 62C, 62D PCB transport mechanism 63 Base 64 Arm Unit Lx dash-dotted line Ly dashed line P1 Origin

Claims

1. A transport unit that transports the substrate to a reference position, A stage on which the substrate transported by the transport unit is placed, A pressing position for pressing components onto the substrate and a moving unit for moving the stage between these positions and a reference position, A crimping section for crimping components onto a substrate placed on the stage at the aforementioned crimping position, The system comprises a control unit that controls the transport unit, the moving unit, and the crimping unit, The control unit, Between a first crimping operation, in which the crimping unit crimps the component onto a first region of the substrate, and a second crimping operation, in which the crimping unit crimps the component onto a second region of the substrate that is different from the first region, a position change operation is performed by the transport unit and the moving unit to change the relative position of the substrate with respect to the stage. Parts crimping device.

2. The control unit performs the position change operation as follows: A first operation involves moving the stage on which the substrate is placed to the reference position using the moving part, After the first operation, a second operation is performed to transfer the substrate from the stage to the transport unit, After the second operation, the moving unit performs a third operation in which it moves the stage closer to the second region, After the third operation, a fourth operation is performed to transfer the substrate from the transport unit to the stage. The component crimping device according to claim 1.

3. A transport unit that transports the substrate to a reference position, A stage on which the substrate transported by the transport unit is placed, A pressing position for pressing components onto the substrate and a moving unit for moving the stage between these positions and a reference position, A component crimping method performed by a component crimping apparatus comprising a crimping section for crimping a component to a substrate placed on the stage at the aforementioned crimping position, Between a first crimping operation, in which the crimping unit crimps the component onto a first region of the substrate, and a second crimping operation, in which the crimping unit crimps the component onto a second region of the substrate that is different from the first region, a position change operation is performed by the transport unit and the moving unit to change the relative position of the substrate with respect to the stage. Crimping method for components.

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