Shielded connector

The shield connector addresses noise leakage in high-frequency signal transmission by using a dual-shell design with a partition wall and groove to extend the leakage path, enhancing shielding efficacy and reducing weight and size.

JP2026091575APending Publication Date: 2026-06-04SUMITOMO WIRING SYSTEMS LTD

Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
SUMITOMO WIRING SYSTEMS LTD
Filing Date
2024-11-25
Publication Date
2026-06-04

AI Technical Summary

Technical Problem

Existing shield terminals with thin metal plates for high-frequency signal transmission suffer from low electromagnetic noise shielding due to gaps between assembled components, creating leakage paths for noise.

Method used

The shield connector is designed with an outer conductor constructed by assembling a first and second shell, featuring a partition wall on one mating surface and a groove on the other to extend the leakage path, reducing noise leakage through the assembly of an L-shaped inner conductor and dielectric.

Benefits of technology

This configuration effectively suppresses electromagnetic noise leakage by extending the leakage path, reducing the weight and size of the connector while maintaining effective shielding.

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Abstract

This suppresses the leakage of electromagnetic noise from the outer conductor. [Solution] The shield connector A comprises an L-shaped inner conductor 21 connected to a circuit board P, and an outer conductor 30 having a housing space 43 for housing the inner conductor 21. The outer conductor 30 is constructed by assembling a first shell 31 and a second shell 36. A partition wall 50 is formed on one of the pair of mating surfaces 45, 46 of the first shell 31 and the second shell 36 that are close to each other and face each other, on the first mating surface 45, so as to separate the housing space 43 from the outer surface of the outer conductor 30. A groove 51 is formed on the other of the pair of mating surfaces 45, 46, on the second mating surface 46, into which the partition wall 50 is fitted.
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Description

Technical Field

[0001] This disclosure relates to a shield connector.

Background Art

[0002] Patent Document 1 discloses a shield terminal including a conductive inner conductor, an insulating dielectric, and a conductive outer conductor surrounding the dielectric. This shield terminal has a shape bent in an L shape when viewed from the side. The outer conductor is made of a single metal plate. By performing bending processing or the like while assembling the dielectric to the metal plate, the dielectric and the outer conductor are assembled in an L shape, and the outer conductor is formed in an L shape.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] When a shield terminal is used in a circuit for transmitting signals in a high-frequency band, in an outer conductor made of a thin metal plate that can be bent, the effect of shielding electromagnetic noise is low. Therefore, the outer conductor must be formed into a thick member by forging or the like. In order to surround the L-shaped dielectric with the outer conductor, it is necessary to configure the outer conductor with a plurality of components. However, in an outer conductor configured by assembling a plurality of components, it is inevitable that there is a gap between the opposing surfaces of the assembled components, which can serve as a leakage path for electromagnetic noise.

[0005] The shield connector of this disclosure has been completed based on the above circumstances, and aims to suppress the leakage of electromagnetic noise in the outer conductor.

Means for Solving the Problems

[0006] The shielded connector disclosed herein is An L-shaped inner conductor connected to the circuit board, The system comprises an outer conductor having a housing space for housing the inner conductor, The outer conductor is constructed by assembling a first shell and a second shell. On one of the pair of mating surfaces of the first shell and the second shell that are in close proximity to each other, a partition wall is formed that protrudes to separate the housing space from the outer surface of the outer conductor. A groove is formed in the other of the pair of mating surfaces into which the partition wall is fitted. [Effects of the Invention]

[0007] According to this disclosure, leakage of electromagnetic noise in the outer conductor can be suppressed. [Brief explanation of the drawing]

[0008] [Figure 1] Figure 1 is a perspective view showing the shield connector of Example 1 separated into the shield terminal and the housing. [Figure 2] Figure 2 is an exploded perspective view of the shield terminal. [Figure 3] Figure 3 is a perspective view of the first shell that constitutes the outer conductor. [Figure 4] Figure 4 is a perspective view of the second shell that constitutes the outer conductor. [Figure 5] Figure 5 is a side cross-sectional view of the shield connector. [Figure 6] Figure 6 is a cross-sectional view of the shield connector from the back. [Modes for carrying out the invention]

[0009] [Description of Embodiments in this Disclosure] First, embodiments of this disclosure will be listed and described. Any combination of the following embodiments, insofar as they do not contradict each other, is also included as a form for carrying out the invention.

[0010] The shielded connector disclosed herein is (1) The device comprises an L-shaped inner conductor connected to a circuit board and an outer conductor having a housing space for housing the inner conductor. The outer conductor is constructed by assembling a first shell and a second shell. A partition wall is formed on one of a pair of mating surfaces of the first shell and the second shell that are in close proximity to each other, so as to separate the housing space from the outer surface of the outer conductor. A groove is formed on the other mating surface of the pair of mating surfaces so as to allow the partition wall to be fitted. According to the configuration of this disclosure, radiated noise emitted from the inner conductor within the housing space leaks out to the outside of the outer conductor through the gap (leakage path) between the mating surfaces of the first shell and the second shell. The leakage path of radiated noise from the housing space to the outer surface of the outer conductor is extended by the length of the bent path formed by the partition wall and the groove, so that radiated noise can be prevented from penetrating the outer conductor and leaking out.

[0011] (2) In (1), the inner conductor is housed in a dielectric, the dielectric having a first housing portion extending away from the circuit board and a second housing portion extending from the end of the first housing portion opposite to the circuit board with a gap between it and the circuit board. Preferably, the partition wall and the groove are arranged between the circuit board and the second housing portion. With this configuration, since the partition wall and the groove are arranged in the dead space between the circuit board and the second housing portion, it is possible to avoid increasing the size of the shield connector due to the formation of the partition wall and the groove.

[0012] (3)(2) The first shell has a bottom wall portion that is positioned in close proximity to and facing the mounting surface of the circuit board. The bottom wall portion on the side opposite to the surface facing the circuit board includes a first mating surface, which is the mating surface on the first shell side. Preferably, the second shell has a front wall portion on which a second mating surface facing the first mating surface is formed. With this configuration, the gap between the first mating surface and the second mating surface on the outer surface of the outer conductor does not directly open to the circuit board. Therefore, electromagnetic noise leaking through the first mating surface and the second mating surface can be suppressed from affecting the mounted components on the circuit board.

[0013] In (4)(3), the front wall portion is the part that separates the housing space from the outside of the outer conductor. Preferably, the front surface of the front wall portion is located behind the front end of the bottom wall portion. If the front surface of the front wall portion is at the same position as the front end of the bottom wall portion, the thickness dimension of the front wall portion in the front-rear direction increases, and the outer conductor becomes heavier. In view of this, the front surface of the front wall portion is located behind the front end of the bottom wall portion, so that the front wall portion can be made thinner and the weight of the outer conductor can be reduced.

[0014] In (5)(4), it is preferable that the partition wall is formed on the first mating surface and the groove is formed on the second mating surface. When the partition wall is formed on the second mating surface, the bottom wall portion needs to be made thicker by the amount of the groove, which increases the weight of the outer conductor. In contrast, by forming the partition wall on the first mating surface, it is possible to make the bottom wall portion thinner, thus reducing the weight of the outer conductor.

[0015] (6) In (3) to (5), the second shell has a pair of side walls that cover the front wall and the bottom wall from both sides in the width direction, and it is preferable that the partition wall is formed over the entire width region of the first mating surface. With this configuration, since the partition wall is formed over the entire width of the first mating surface, electromagnetic noise traveling along the first mating surface will always pass through the partition wall. Therefore, the effect of suppressing electromagnetic noise leakage by the partition wall is excellent.

[0016] (7) In (1) to (5), the first shell and the second shell are assembled so as to approach each other while keeping the mating surfaces of both facing each other, and the partition wall preferably protrudes in a direction parallel to the assembling direction of the first shell and the second shell. According to this configuration, in the process of assembling the first shell and the second shell, the partition wall and the groove portion can be fitted to guide the first shell and the second shell.

[0017] [Details of Embodiments of the Present Disclosure] [Example 1] The shield connector A of Example 1 embodying the present disclosure will be described with reference to FIGS. 1 to 6. The present invention is not limited to these examples, but is shown by the claims, and includes all changes within the meaning and scope equivalent to the claims. In Example 1, for the front-rear direction, the F direction in FIGS. 1 to 5 is defined as the front. For the up-down direction, the H direction in FIGS. 1 to 6 is defined as the up. For the left-right direction, the R direction in FIGS. 1 to 4 and 6 is defined as the right. The left-right direction and the width direction are used synonymously.

[0018] The shield connector A of Example 1 is attached in a state of being placed on the mounting surface M of the circuit board P (see FIGS. 5 and 6), and is fitted with a mating connector (not shown) attached to the terminal portion of a wire harness (not shown). The shield connector A is configured by assembling a housing 10 and shield terminals 20. Inside the housing 10, a terminal accommodation chamber 11 for accommodating the shield terminals 20 is formed. The terminal accommodation chamber 11 is open to the rear surface and the lower surface of the housing 10.

[0019] The shield terminal 20 is constructed by assembling an inner conductor 21, a dielectric 24, and an outer conductor 30. In a side view of the shield terminal 20, the inner conductor 21 is a single component with an L-shaped bend. The inner conductor 21 has a vertically elongated substrate connection portion 22 and a terminal connection portion 23 extending forward from the upper end of the substrate connection portion 22. The lower end of the substrate connection portion 22 is connected to the circuit board P. The terminal connection portion 23 is connected to the terminal fitting (not shown) of the mating connector.

[0020] The dielectric 24, like the inner conductor 21, has an L-shaped bend. The dielectric 24 is a single component having a first housing portion 25 that houses the substrate connection portion 22 and a second housing portion 26 that houses the terminal connection portion 23. The first housing portion 25 is a vertically elongated rectangular prism shape. The second housing portion 26 is a cylindrical portion that protrudes forward from the upper end of the first housing portion 25. A press-fit hole 27 for housing the inner conductor 21 is formed inside the dielectric 24. The press-fit hole 27 opens on the rear and bottom surfaces of the first housing portion 25 and on the front end surface of the second housing portion 26. The inner conductor 21 is housed inside the dielectric 24 by press-fitting and is integrated with the dielectric 24.

[0021] The outer conductor 30 is constructed by assembling a first metal shell 31 and a second metal shell 36. The first shell 31 and the second shell 36 are parts formed by casting, forging, machining, etc. As shown in Figure 3, the first shell 31 is a single part having a bottom wall portion 32 and a rear wall portion 33 that protrudes upward from the rear end of the bottom wall portion 32. A pair of protrusions 34 are formed in the rear end region on both the left and right outer surfaces of the bottom wall portion 32. The protrusions 34 protrude in the width direction more than the outer surface of the rear wall portion 33. A positioning hole 35 is formed in the bottom wall portion 32, penetrating the bottom wall portion 32 in the front-rear direction. The formation range of the protrusions 34 and the positioning hole 35 is the same region in the front-rear direction. The plan view shape of the positioning hole 35 is rectangular. The rear surface of the inner circumferential surface of the positioning hole 35 is flush and continuous with the front surface of the rear wall portion 33.

[0022] As shown in Figure 4, the second shell 36 is a single component having a box portion 37 and a cylindrical portion 42. The box portion 37 has a front wall portion 38, an upper wall portion 39, and a pair of left and right side wall portions 40. The upper wall portion 39 is a portion that extends rearward from the upper edge of the front wall portion 38. The pair of side wall portions 40 are portions that are connected perpendicularly to the left and right side edges of the front wall portion 38 and the left and right side edges of the upper wall portion 39. The wall thickness dimension of the front wall portion 38 is greater than the wall thickness of the upper wall portion 39 and the side wall portions 40. The side wall portions 40 have portions that extend downward from the lower end of the front wall portion 38. At the lower end of the side wall portion 40, a pair of recesses 41 are formed in the form of recesses on both the left and right inner surfaces of the side wall portion 40. The cylindrical portion 42 is a portion that protrudes forward from the front wall portion 38 with its axis in the front-rear direction. The internal space of the box section 37 and the internal space of the cylindrical section 42 are in communication with each other. The internal space of the box section 37 is open to the rear and bottom surfaces of the box section 37.

[0023] The outer conductor 30 is constructed by assembling the first shell 31 to the second shell 36 from below. The first shell 31 and the second shell 36 are integrated by press-fitting. The press-fitting locations are, for example, between the left and right outer surfaces of the rear wall portion 33 and the left and right inner surfaces of the side wall portion 40, between the left and right outer surfaces of the bottom wall portion 32 and the left and right inner surfaces of the side wall portion 40, and between the convex portion 34 and the concave portion 41. When the first shell 31 and the second shell 36 are assembled, the bottom wall portion 32 closes the opening on the lower surface of the box portion 37, the rear wall portion 33 closes the opening on the rear surface of the box portion 37, and the convex portion 34 is fitted into the concave portion 41. Inside the outer conductor 30, an L-shaped housing space 43 is formed for housing the dielectric 24. When the dielectric 24 is not housed, the front end of the housing space 43 opens to the front end surface of the cylindrical portion 42. The lower end of the storage space 43 opens to the lower surface of the bottom wall portion 32 at the positioning hole 35.

[0024] When assembling shield connector A, first, the inner conductor 21 is press-fitted into the press-fit hole 27 from the rear of the dielectric 24. The dielectric 24 with the press-fitted inner conductor 21 is then housed in the internal space of the second shell 36 from the rear of the second shell 36. Next, the first shell 31 is assembled onto the second shell 36 so that the positioning hole 35 fits into the lower end of the first housing portion 25. Once the first shell 31 and the second shell 36 are assembled, the outer conductor 30 is formed, and at the same time, the dielectric 24 is housed in the housing space 43 of the outer conductor 30. This completes the assembly of the shield terminal 20. The assembly of shield connector A is completed by housing the assembled shield terminal 20 inside the housing 10.

[0025] The second shell 36 has multiple (two pairs in this embodiment 1) grounding connection parts 44 formed therein for connecting to the ground circuit (not shown) of the circuit board P. The grounding connection parts 44 protrude downward from both the front and rear ends on the lower surface of the left and right side wall parts 40. The first shell 31 and the second shell 36 are electrically connected at the press-fit portion described above. Electromagnetic noise generated from the inner conductor 21 within the housing space 43 is absorbed by the outer conductor 30 and flows through the grounding connection parts 44 to the ground circuit of the circuit board P.

[0026] Electromagnetic noise absorbed by the first shell 31 is grounded to the ground circuit of the circuit board P via the grounding connection 44. Unlike the first shell 31, the second shell 36 does not have a part that connects to the ground circuit. However, on the opposing surfaces of the first shell 31 and the second shell 36 that are parallel to the assembly direction of both shells 31 and 36 (facing surfaces in the direction intersecting the assembly direction), the first shell 31 and the second shell 36 are electrically connected by press-fitting. Therefore, electromagnetic noise absorbed by the second shell 36 flows through the press-fitting part, through the first shell 31, and to the ground circuit from the grounding connection 44.

[0027] On the other hand, at the mating surfaces 45 and 46 of the first shell 31 and the second shell 36 that face each other in the same direction as the assembly direction of both shells 31 and 36 (surfaces that intersect the assembly direction), a press-fit connection structure cannot be established. Therefore, there is a concern that a gap will be created between the mating surfaces 45 and 46 of the first shell 31 and the second shell 36, allowing radiated noise generated from the inner conductor 21 to leak to the outside of the outer conductor 30. The countermeasures for this will be explained below.

[0028] The region of the upper surface of the bottom wall 32 that faces the lower surface of the front wall 38 is defined as the first mating surface 45. The region of the lower surface of the front wall 38 that faces the upper surface of the bottom wall 32 (first mating surface 45) is defined as the second mating surface 46. The gap between the first mating surface 45 and the second mating surface 46 is defined as the leakage path 47 for radiated noise. The surface of the first shell 31 facing the leakage path 47 is defined as the first creepage leakage path 48 through which electromagnetic noise can leak from the containment space 43 toward the front surface 38F of the front wall 38. The surface of the second shell 36 facing the leakage path 47 is defined as the second creepage leakage path 49 through which electromagnetic noise can leak from the containment space 43 toward the front surface 38F of the front wall 38.

[0029] A partition wall 50 is formed in the bottom wall portion 32, projecting upward from the first mating surface 45. The partition wall 50 is positioned to separate the accommodation space 43 from the outer surface of the outer conductor 30 (the front surface 38F of the front wall portion 38) in the front-rear direction. In the width direction, the partition wall 50 rises continuously across the entire width of the bottom wall portion 32. A groove portion 51 is formed in the front wall portion 38, with the second mating surface 46 recessed. In the width direction, the groove portion 51 extends across the entire width of the front wall portion 38. The left and right inner surfaces of the groove portion 51 are continuous and flush with the inner surfaces of the side wall portion 40.

[0030] When the first shell 31 and the second shell 36 are assembled, the partition wall 50 is housed within the groove 51. In a cross-section of the shield connector A viewed from the side, the two flat regions at the front and rear of the leakage path 47, where the partition wall 50 and groove 51 are not formed, are straight lines extending in the front-rear direction, while the bent region where the partition wall 50 and groove 51 are formed has a rectangular (inverted U-shaped) bend. Therefore, the leakage path 47 in this embodiment 1 is longer than that of the configuration where the bent region is not formed. Thus, it is possible to suppress the leakage of radiated noise generated from the inner conductor 21 within the housing space 43 to the outside of the outer conductor 30 through the gap between the first mating surface 45 and the second mating surface 46 (leakage path 47).

[0031] Furthermore, since the first creepage leakage path 48 is composed of the first mating surface 45 and the partition wall 50, the path is longer compared to a configuration in which the partition wall 50 is not formed. Therefore, even if electromagnetic noise absorbed by the first shell 31 flows along the first creepage leakage path 48, leakage of that electromagnetic noise to the outside of the outer conductor 30 is suppressed. The second creepage leakage path 49 is composed of the second mating surface 46 and the groove 51, so the path is longer compared to a configuration in which the groove 51 is not formed. Therefore, even if electromagnetic noise absorbed by the second shell 36 flows along the second creepage leakage path 49, leakage of that electromagnetic noise to the outside of the outer conductor 30 is suppressed.

[0032] The shield connector A of this embodiment 1 comprises an L-shaped inner conductor 21 connected to a circuit board P, and an outer conductor 30 having a housing space 43 for housing the inner conductor 21. The outer conductor 30 is constructed by assembling a first shell 31 and a second shell 36. Of the pair of mating surfaces (first mating surface 45 and second mating surface 46) of the first shell 31 and the second shell 36 that are close to each other and facing each other, a partition wall 50 is formed on the first mating surface 45 so as to separate the housing space 43 from the outer surface of the outer conductor 30. Of the pair of mating surfaces 45 and 46, a groove 51 is formed on the second mating surface 46 so as to fit the partition wall 50. With this configuration, radiated noise emitted from the inner conductor 21 within the housing space 43 leaks out to the outside of the outer conductor 30 through the gap (leakage path 47) between the mating surfaces 45 and 46 of the first shell 31 and the second shell 36. The potential leakage path 47 for radiated noise from the containment space 43 to the outer surface of the outer conductor 30 is extended by the length of the bent path formed by the partition wall 50 and the groove 51. This suppresses the leakage of radiated noise through the outer conductor 30.

[0033] The inner conductor 21 is housed within the dielectric 24. The dielectric 24 has a first housing portion 25 and a second housing portion 26. The first housing portion 25 is a portion that extends away from the circuit board P. The second housing portion 26 is a portion that extends from the end of the first housing portion 25 opposite to the circuit board P, with a gap between it and the circuit board P. The partition wall 50 and groove portion 51 are arranged between the circuit board P and the second housing portion 26. With this configuration, since the partition wall 50 and groove portion 51 are arranged in the dead space between the circuit board P and the second housing portion 26, it is possible to avoid increasing the size of the shield connector A that would result from forming the partition wall 50 and groove portion 51.

[0034] The first shell 31 has a bottom wall portion 32 positioned to face and be in close proximity to the mounting surface M of the circuit board P. The upper surface of the bottom wall portion 32 opposite to the surface facing the circuit board P includes a first mating surface 45. The second shell 36 has a front wall portion 38 on which a second mating surface 46 facing the first mating surface 45 is formed. With this configuration, the gap (leakage path 47) between the first mating surface 45 and the second mating surface 46 on the outer surface of the outer conductor 30 does not directly open to the circuit board P. Therefore, electromagnetic noise leaking through the first mating surface 45 and the second mating surface 46 can be suppressed from affecting the mounted components on the circuit board P.

[0035] The front wall portion 38 is the part that separates the housing space 43 from the outside of the outer conductor 30. If the front surface 38F of the front wall portion 38 is at the same position as the front end of the bottom wall portion 32, the thickness dimension of the front wall portion 38 in the front-rear direction increases, and the outer conductor 30 becomes heavier. In view of this, the front surface 38F of the front wall portion 38 is positioned behind the front end 32F of the bottom wall portion 32. This makes it possible to thin the front wall portion 38 and reduce the weight of the outer conductor 30.

[0036] Unlike Embodiment 1, when the partition wall 50 is formed on the second mating surface 46, the bottom wall portion 32 needs to be made thicker by the amount of the groove portion 51, which increases the weight of the outer conductor 30. In view of this, the partition wall 50 is formed on the first mating surface 45 and the groove portion 51 is formed on the second mating surface 46. This makes it possible to make the bottom wall portion 32 thinner, thereby reducing the weight of the outer conductor 30.

[0037] The second shell 36 has a pair of side walls 40 that cover the front wall 38 and the bottom wall 32 from both sides in the width direction. The partition wall 50 is formed over the entire width direction of the first mating surface 45. With this configuration, electromagnetic noise traveling across the first mating surface 45 always passes through the partition wall 50, thus providing excellent electromagnetic noise leakage suppression by the partition wall 50.

[0038] The first shell 31 and the second shell 36 are assembled so that their mating surfaces face each other and they are brought close together. The partition wall 50 protrudes in a direction parallel to the assembly direction of the first shell 31 and the second shell 36. With this configuration, during the process of assembling the first shell 31 and the second shell 36, the partition wall 50 and the groove 51 fit together, thereby guiding the first shell 31 and the second shell 36.

[0039] [Other examples] The present invention is not limited to the embodiments described above and in the drawings, but is shown in the claims. The present invention includes the meaning of equivalents of the claims and all modifications within the claims, and also includes the following embodiments. The partition wall and groove may be placed in an area other than the dead space between the circuit board and the second housing. The gap between the first mating surface and the second mating surface on the outer surface of the outer conductor may be directly open to the circuit board. The front surface of the front wall may be in the same position as the front end of the bottom wall. A partition wall may be formed on the second mating surface, and a groove may be formed on the first mating surface. The assembly direction of the first shell and the second shell may be parallel to the mating surface. [Explanation of symbols]

[0040] A...Shielded connector M…Mounting surface P...Circuit board 10… Housing 11…Terminal housing room 20...Shield terminal 21...Inner conductor 22... Circuit board connection section 23...Terminal connection section 24…Dielectrics 25…First Detention Unit 26...Second Detention Unit 27…Press-fit hole 30…Outer conductor 31...First Shell 32...Bottom wall 32F... Front end of the bottom wall 33...Rear wall part 34…Convex part 35…Positioning hole 36…Second Shell 37…Hakobe 38...Front wall part 38F...Front of the front wall 39...Top wall part 40... Side wall section 41…recess 42...Cylindrical part 43…Containment space 44...Grounding connection 45...First joining surface 46...Second joining surface 47…Possible leakage routes 48…First surface leakage path 49...Second surface leakage path 50... Partition wall 51… Groove

Claims

1. An L-shaped inner conductor connected to the circuit board, The system comprises an outer conductor having a housing space for housing the inner conductor, The outer conductor is constructed by assembling a first shell and a second shell. On one of the pair of mating surfaces of the first shell and the second shell that are in close proximity to each other, a partition wall is formed that protrudes to separate the housing space from the outer surface of the outer conductor. A shield connector having a groove formed in the other mating surface of the pair of mating surfaces into which the partition wall is fitted.

2. The inner conductor is housed within the dielectric, The dielectric is A first housing section extending in a direction away from the circuit board, The first housing portion has a second housing portion that extends from the end opposite to the circuit board, with a gap between it and the circuit board, The shield connector according to claim 1, wherein the partition wall and the groove are arranged between the circuit board and the second housing.

3. The first shell has a bottom wall portion that is positioned in close proximity to and facing the mounting surface of the circuit board, The bottom wall portion, on the side opposite to the side facing the circuit board, includes the first mating surface, which is the mating surface on the first shell side. The shield connector according to claim 2, wherein the second shell has a front wall portion on which a second mating surface facing the first mating surface is formed.

4. The front wall portion is a part that separates the housing space from the outside of the outer conductor. The shield connector according to claim 3, wherein the front surface of the front wall portion is located behind the front end of the bottom wall portion.

5. The partition wall is formed on the first joint surface, The shield connector according to claim 4, wherein the groove portion is formed on the second mating surface.

6. The second shell has a pair of side walls that cover the front wall and the bottom wall from both sides in the width direction, The shield connector according to any one of claims 1 to 5, wherein the partition wall is formed over the entire widthwise region of the first mating surface.

7. The first shell and the second shell are assembled so that their mating surfaces face each other and are brought close together. The shield connector according to any one of claims 1 to 5, wherein the partition wall protrudes in a direction parallel to the assembly direction of the first shell and the second shell.