Location measurement method and location measurement system

Abstract

In a technique that uses collimated light to measure the position and vibration of an object, the goal is to ensure that the spot position of the collimated light can be reliably captured by a camera. [Solution] The measurement target area 30 formed on the surface of the object 12 includes a first area 31 that scatters incident light and a second area Ra, Rb that reflects light in the exit direction corresponding to the incident direction. Collimated light is irradiated onto the measurement target area 30 of the object 12. As a first measurement, the first area 31 is photographed by a camera 16, and the spot position of the collimated light is measured from the captured image. As a second measurement, reflected light from the second area Ra, Rb is received by a light receiving unit 18, and the vibration of the object 12 is measured using the change in the light reception intensity of the light receiving unit 18.

Description

Technical Field

[0001] The present disclosure relates to a method for measuring the position and vibration of an object using collimated light.

Background Art

[0002] Patent Document 1 discloses a mounting apparatus for mounting a semiconductor chip at a predetermined position on a substrate based on an alignment mark provided on one side of the semiconductor chip and an alignment mark provided on the substrate.

[0003] In this mounting apparatus, a two-field camera having an upward camera and a downward camera advances between a mounting head and a mounting stage that face each other in the vertical direction with a gap therebetween. The upward camera images the semiconductor chip adsorbed to the mounting head, and the downward camera images the substrate adsorbed to the mounting stage. Next, based on the image obtained by the upward camera, the position of the alignment mark of the semiconductor chip is detected, and based on the image obtained by the downward camera, the position of the alignment mark of the substrate is detected. Then, the positioning mechanism of the mounting stage is controlled so that the current value (current alignment mark position) of the alignment position of the semiconductor chip with respect to the alignment mark position of the substrate becomes the set value (set alignment mark position) stored in advance.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] The inventors of the present application have described in Japanese Patent Application No. 2023-156462 (hereinafter referred to as "Prior Application 1") an apparatus that performs such a series of alignments using a light distribution (spot) formed on a substrate by laser light emitted from a laser device attached to a head portion that holds a semiconductor chip.

[0006] However, in the apparatus described in Prior Application 1, the semiconductor chip may vibrate relative to the substrate. For example, when a moving mounting head reaches a target position and stops, the mounting head vibrates due to the inertial force acting on it, and as a result, the semiconductor chip attached to the mounting head vibrates relative to the substrate attached to the mounting stage. In order to properly adjust the position of the semiconductor chip and the substrate, it is important to detect the vibration of the semiconductor chip relative to the substrate. Prior Application 1 describes using a laser spot captured by a camera to detect and track such vibrations. This method is effective for low-speed vibrations. However, with high-speed vibrations, the image processing time is insufficient (processing time is slow) to extract vibrations from camera images using image processing, making vibration detection difficult.

[0007] Therefore, the inventors of the present application have described a vibration detection device capable of tracking high-speed vibrations in Japanese Patent Application No. 2023-200140 (hereinafter referred to as "Prior Application 2"). This vibration detection device comprises a light source (laser, etc.) that is set up to work in conjunction with a first object (semiconductor chip, etc.) and emits observation light, and an observation unit (reflector on a substrate, etc.) that is set up to work in conjunction with a second object (substrate, etc.) and emits response light when it receives observation light emitted from the light source, and is configured such that the intensity of the response light (reflected light, etc.) changes according to the movement of the first object in a predetermined direction relative to the second object. A light receiving unit receives the response light emitted from the observation unit, and a control unit performs vibration detection processing to detect vibrations of the first object in a predetermined direction relative to the second object based on the change in the intensity of the response light received by the light receiving unit. In this method, since cameras and image analysis are not used, high-speed vibrations can be tracked.

[0008] However, while Prior Application 2 describes using laser light as a light source and measuring vibrations using the reflected light, it does not specifically describe the path of light from the laser spot to the camera.

[0009] In view of the above, this disclosure aims to enable a camera to reliably capture the spot position of collimated light in a technology that measures the position and vibration of an object using collimated light such as laser light. [Means for solving the problem]

[0010] This disclosure relates to a method for measuring the position and vibration of an object using collimated light, wherein a measurement target area is formed on the surface of the object, including a first area that scatters incident light and a second area that reflects the light in an exit direction corresponding to the incident direction; collimated light is irradiated onto the measurement target area of ​​the object; as a first measurement, the first area is photographed by a camera and the spot position of the collimated light is measured from the captured image; as a second measurement, reflected light from the second area is received by a light receiving unit and the vibration of the object is measured using the change in the light receiving intensity of the light receiving unit. [Effects of the Invention]

[0011] This disclosure enables the reliable capture of the spot position of collimated light by a camera in a technique for measuring the position and vibration of an object using collimated light. [Brief explanation of the drawing]

[0012] [Figure 1] Overall configuration example of a position measuring device according to an embodiment [Figure 2] Examples of the arrangement of each element on the substrate surface [Figure 3] Laser light intensity distribution on the substrate surface [Figure 4] (a) and (b) are diagrams illustrating the issues of this disclosure. [Figure 5] (a) and (b) are diagrams illustrating the key points of this disclosure. [Figure 6] Configuration example of the camera pattern according to Example 1 [Figure 7] Values of each parameter used in the ray tracing simulation [Figure 8] (a) and (b) are the results of the ray tracing simulation according to Example 1 [Figure 9] Results of the ray tracing simulation according to the modified example of Example 1 [Figure 10] Configuration example of the camera pattern according to Example 2 [Figure 11] (a) and (b) are the results of the ray tracing simulation according to Example 2 [Figure 12] (a) and (b) are configuration examples of the camera pattern and the reflection part for micro-vibration measurement according to Example 3

Mode for Carrying Out the Invention

[0013] (Overview) In the method for measuring the position and vibration of an object using collimated light according to an aspect of the present disclosure, a measurement target region including a first region that scatters incident light and a second region that reflects light in an emission direction corresponding to the incident direction is formed on the surface of the object. Collimated light is irradiated onto the measurement target region of the object. As a first measurement, the first region is photographed by a camera, and the spot position of the collimated light is measured from the photographed image. As a second measurement, the reflected light from the second region is received by a light receiving unit, and the vibration of the object is measured using the change in the light receiving intensity of the light receiving unit.

[0014] According to this configuration, the measurement target region formed on the surface of the object includes a first region that scatters incident light and a second region that reflects light in an emission direction corresponding to the incident direction. When collimated light is irradiated onto the measurement target region of the object, the collimated light scatters in the first region, so the spot position of the collimated light can be reliably measured from the image photographed by the camera. In addition, the vibration of the object can be measured using the change in the light receiving intensity of the reflected light from the second region received by the light receiving unit.

[0015] In the position measurement method according to the above aspect, the first region may include a plurality of triangular reflecting surfaces.

[0016] Thereby, by appropriately setting the inclination angles of the plurality of triangular reflecting surfaces, the first region can be configured such that the scattered light in the first region is directed toward the position of the camera.

[0017] Furthermore, the plurality of triangular reflecting surfaces may include triangular reflecting surfaces with different reflection angles.

[0018] Thereby, an appropriate angular width can be given to the scattered light, so that the degree of freedom in camera placement can be increased, and the ease of adjusting the camera placement can be improved.

[0019] In the position measurement method according to the above aspect, the first region may include a plurality of circular reflecting surfaces.

[0020] Thereby, by appropriately setting the radii of the plurality of circular reflecting surfaces, the first region can be configured such that the scattered light in the first region is directed toward the position of the camera.

[0021] In the position measurement method according to the above aspect, the first region may be divided into a grid pattern in plan view.

[0022] Thereby, it becomes easy to specify the spot position of the collimated light in the camera image.

[0023] In the position measurement method according to the above aspect, the second measurement may have higher measurement accuracy than the first measurement.

[0024] In the position measurement method according to the above aspect, the second measurement may have a shorter measurement time than the first measurement.

[0025] A system for measuring the position and vibration of an object using collimated light according to an aspect of the present disclosure includes a measurement target area formed on the surface of the object, which includes a first area that scatters incident light and a second area that reflects the light in an exit direction corresponding to the incident direction, and comprises a light source that irradiates the measurement target area of ​​the object with collimated light, a camera that photographs the first area, a light receiving unit that receives reflected light from the second area, an image processing unit that measures the spot position of the collimated light from the image taken by the camera, and an intensity processing circuit that measures the vibration of the object using the change in light intensity received by the light receiving unit.

[0026] In this configuration, the measurement target area formed on the surface of the object includes a first area that scatters incident light and a second area that reflects the light in an exit direction corresponding to the incident direction. When collimated light is shone from a light source onto the measurement target area of ​​the object, the collimated light is scattered in the first area, allowing the image processing unit to reliably measure the spot position of the collimated light from the image captured by the camera. Furthermore, the intensity processing circuit can measure the vibration of the object using the change in the received light intensity received by the light receiving unit from the reflected light from the second area.

[0027] (Embodiment) The embodiments will be described in detail below with reference to the drawings.

[0028] The embodiments described below are all comprehensive or specific examples. The numerical values, shapes, materials, components, arrangement and connection configurations of components, steps, and the order of steps shown in the following embodiments are examples only and are not intended to limit this disclosure. Furthermore, among the components in the following embodiments, those not described in the independent claim representing the highest-level concept will be described as optional components.

[0029] Figure 1 shows an example configuration of a position adjustment system including a position measurement system according to an embodiment. In the configuration of Figure 1, the positional relationship between a semiconductor chip 11 as a first object and a substrate 12 as a second object is adjusted. The positional relationship between the semiconductor chip 11 and the substrate 12 is adjusted so that the semiconductor chip 11 faces a predetermined area of ​​the substrate 12, and then the semiconductor chip 11 is mounted (bonded) to the predetermined area of ​​the substrate 12.

[0030] A laser light source 14 is provided on a head 13 that holds a semiconductor chip 11. A measurement target area 30 is formed on the surface of a substrate 12, and laser light is shone from the laser light source 14 onto the measurement target area 30 of the substrate 12. A camera 16 captures an image of the substrate 12 shone with laser light. An image processing unit 17 measures the spot position of the laser light from the image captured by the camera 16 (first measurement). A light receiving unit 18 has a light receiving element and receives reflected light from a specific reflective part in the measurement target area 30 and outputs a signal according to the received light intensity. An intensity processing circuit 19 receives the output signal from the light receiving unit 18 and measures the vibration of the substrate 12 from the change in the received light intensity by the light receiving unit 18 (second measurement). A controller 20 adjusts the position of the substrate 12 based on the outputs from the image processing unit 17 and the intensity processing circuit 19.

[0031] The position measurement system according to this embodiment comprises a laser light source 14, a light receiving unit 18, an image processing unit 17, and an intensity processing circuit 19. The camera 16 may be configured separately from the position measurement system or may be included in the position measurement system. The laser light source 14 is an example of a light source that emits collimated light.

[0032] The laser used in this disclosure may be any laser whose emission wavelength falls within the wavelength range to which the camera and photodetector are sensitive, such as an InGaAlP-based red laser or an AlGaN-based green laser. In this case, a camera for visible light can be used, and a silicon photodiode or the like can be used as the photodetector.

[0033] The second measurement measures vibration from changes in light intensity, resulting in higher measurement accuracy than the first measurement, which depends on the resolution of camera 16. Furthermore, since the second measurement does not involve image processing, the measurement time is shorter than that of the first measurement, which does.

[0034] As shown in Prior Application 2, for measuring minute vibrations, a narrower radiation angle of the laser light source results in higher sensitivity. Therefore, the laser light is collimated (narrowed radiation angle) by the laser light source itself or by a lens attached to the laser light source's output. For this reason, in many of the drawings shown below, the light from the laser light source is depicted as a collection of parallel beams. To be precise, the rays from the laser light source have slightly different angles from each other, but at the scale of the drawings shown below, it is acceptable to depict them as parallel beams.

[0035] Figure 2 shows an example of the arrangement of each element in the measurement target area 30 on the surface of the substrate 12, and Figure 3 shows the intensity distribution of laser light on the substrate surface. In Figure 2, the gradient area schematically shows the distribution of light on the substrate surface, with darker gray indicating stronger light intensity.

[0036] As shown in Figure 3, the intensity of laser light generally follows a Gaussian distribution, with maximum intensity at the center, gradually decreasing, and approaching zero intensity at the base. There are various definitions of the term "spot," but here, with A being the maximum intensity on the substrate surface, the spot is defined as the range of intensity from A / 2 to A. By capturing this spot with a camera and performing image analysis, for example, calculating the centroid position of the spot, the location of the spot can be determined. On the other hand, light also exists around the spot. A portion of this light is used as light for measuring minute vibrations.

[0037] In other words, as shown in Figure 2, the camera pattern 31 is formed in the area where the spot generally exists. Also, the reflective films Ra and Rb for measuring minute vibrations are formed in the area where the light for measuring minute vibrations generally exists.

[0038] The size of the spot can be adjusted (enlarged or reduced) by using a lens or other device attached to the emission part of the laser light source 14.

[0039] Figure 4 is a diagram illustrating the problems of this disclosure, and is a simplified representation of an example of the arrangement of the laser light source, light receiving unit, and camera in the configuration of Figure 1, where (a) is an overall view and (b) is a magnified view of the area around the measurement target region 30.

[0040] In Figure 4(b), IL1, IL2, and IL3 are shown as incident light IL of the collimated laser beam. Incident light IL1 is reflected by the reflector Ra to become emitted light OL1, which is incident on the light receiving unit 18. Incident light IL3 is reflected by the reflector Rb to become emitted light OL3, which is incident on the light receiving unit 18. The emitted light OL1 and OL3 incident on the light receiving unit 18 are used to measure minute vibrations.

[0041] Here, we assume that the camera pattern 31 is made of the same reflective film as the reflective sections Ra and Rb used for detecting minute vibrations. In this case, the incident light IL2 incident on the camera pattern 31 is reflected by the camera pattern 31 and becomes the emitted light OL2, which travels in the same direction as the emitted light OL1 and OL3. That is, the emitted light OL2 travels towards the light receiving section 18, not towards the camera 16. Therefore, as shown in Figure 4(a), no light comes to the camera 16 from the measurement target area 30, and the laser spot cannot be observed by the camera. As a result, the spot position cannot be determined, and the crucial alignment cannot be performed.

[0042] Alternatively, this problem can be solved by positioning the camera 16 in the same direction as the light-receiving unit 18, but in this case, the design flexibility of the mounting device is reduced.

[0043] Therefore, in this disclosure, a configuration that scatters light is used as the camera pattern 31.

[0044] Figure 5 is a diagram illustrating the key points of this disclosure, and, similar to Figure 4, is a simplified representation of an example of the arrangement of the laser light source, light receiving unit, and camera in the configuration of Figure 1, where (a) is an overall view and (b) is a magnified view of the area around the measurement target region 30.

[0045] As shown in Figure 5(b), in this disclosure, the region of the camera pattern 31 is provided with a member that diffuses (scatters) incident light in various directions, rather than the same reflective film as the reflective sections Ra and Rb for detecting minute vibrations. As a result, as shown in Figure 5(b), the light emitted from the region of the camera pattern 31 has a directional component other than the direction toward the light receiving section 18. If the camera 16 is placed at the position toward which that directional component is directed, as shown in Figure 5(a), light will enter the camera and can be imaged onto the image sensor surface using a lens or the like. Then, the laser spot can be detected as the shape of the image. In other words, the measurement target region 30 includes the camera pattern 31 as a first region that scatters incident light and the reflective sections Ra and Rb as a second region that reflects the light in the direction of emission corresponding to the direction of incidence.

[0046] Generally, "diffusion" means directing incident light in almost all directions. However, in this disclosure, the camera pattern 31 only needs to be able to direct at least a portion of the incident light rays in a direction different from the direction in which the "angle of incidence = angle of reflection" occurs. In other words, the camera pattern 31 only needs to have the function of scattering incident light. In this specification, although it is not "diffusion" in the strict sense, a state in which incident light is reflected in various directions in a way that causes light to scatter is called "pseudodiffusion".

[0047] The following describes an example of the configuration of a camera pattern in this disclosure.

[0048] (Example 1) Figure 6 shows a configuration using multiple triangular reflecting surfaces 32 as a camera pattern 31. In Figure 6, the light from the laser light source is defined as incident light IL1, IL2a, IL2b, IL2c, and IL3. Incident light IL1 and IL3 are used for measuring minute vibrations. Incident light IL1 is reflected by the reflecting surface Ra to become emitted light OL1, and incident light IL3 is reflected by the reflecting surface Rb to become emitted light OL3. On the other hand, incident light IL2a, IL2b, and IL2c are pseudo-diffused at the inclined reflecting surfaces of the triangular reflecting surfaces 32 and become emitted light OL2a, OL2b, and OL2c, which are directed in different directions from the emitted light OL1 and OL3. Note that the triangular reflecting surfaces 32 have the characteristic that pseudo-diffused light is directed in a specific direction, so the light intensity in that direction becomes stronger and it becomes more resistant to noise.

[0049] This is demonstrated by a ray tracing simulation. The table in Figure 7 shows the values ​​used in the simulation, and the meaning of each symbol is shown in the figure on the right of Figure 7. The laser light from the light source is assumed to be uniformly distributed within the range of the total spread angle Δθ, and in the following graphs, this range is represented by 200 rays (that is, the angle of each beam is Δθ / 200 = 0.11 / 200 = 5.5 × 10⁻¹⁰). -4 (Different for each degree). The dotted lines pointing towards the non-reflective areas indicate, for example, light rays that reach the gap between the reflective areas Ra, Rb and the camera pattern from the light source, and enter the substrate without being reflected or diffused.

[0050] Figure 8 shows the results of a ray tracing simulation according to this embodiment. In Figure 8, (a) is the overall view, and (b) is a magnified view. Here, the results using three types of triangular reflecting surfaces with inclination angles of 10, 20, and 30 degrees are shown. The pitch of the triangular reflecting surfaces is 10 μm. Note that in Figure 8(b), the rays appear as a band because individual, nearly parallel rays gather together and appear as a single unit. The same applies to the following graphs.

[0051] As can be seen from the results in Figure 8, when the inclination angle of the triangular reflecting surface is 10 degrees, the scattered light from the camera pattern is directed in a different direction from the reflected light towards the light-receiving section, but it is not directed towards the camera. When the inclination angle of the triangular reflecting surface is 20 degrees, the scattered light from the camera pattern is directed towards the camera. When the inclination angle of the triangular reflecting surface is 30 degrees, the scattered light from the camera pattern is not directed towards the camera. In other words, there is an optimal inclination angle for the triangular reflecting surface that constitutes the camera pattern, depending on the position of the camera and light source. Therefore, by appropriately setting the inclination angle of the triangular reflecting surface, the camera pattern can be configured so that the scattered light from the camera pattern is directed towards the camera.

[0052] (Modified version of Example 1) Figure 9 shows the results of a ray tracing simulation for a modified example. Here, as in Figure 8, the camera pattern is composed of triangular reflective surfaces with a pitch of 10 μm, but the inclination angles of each reflective surface are different. Specifically, it is composed of triangular reflective surfaces with inclination angles of 25 degrees, 20 degrees, and 15 degrees.

[0053] In this case, since the pseudo-diffuse light from each reflective surface travels in different directions, the scattered light directed towards the camera has a certain degree of "sparse" angular width, as shown in Figure 9(a). That is, scattered light with a certain degree of spread is directed towards the camera. By giving the scattered light an appropriate angular width in this way, the degree of freedom in camera placement can be increased, and the ease of adjusting the camera's position can be improved.

[0054] While this example shows a configuration with three different triangular reflecting surfaces at varying inclination angles, it is not limited to this configuration. For example, by using multiple triangular reflecting surfaces with different inclination angles, it is possible to create a "dense" angular width in the scattered light.

[0055] (Example 2) Figure 10 shows a configuration using a circular reflective surface 33 as a camera pattern. Here, "circular" means that the cross-section of the reflective structure is circular, elliptical, etc. This circular reflective surface is a pseudo-diffusive surface with a continuously changing inclination angle. Therefore, the direction of the pseudo-diffusive light is also very broad (in other words, it has a variety of angles).

[0056] Figure 11 shows the results of a ray tracing simulation according to this embodiment. In Figure 11, (a) is an overall view and (b) is a magnified view. Here, the results are shown for a configuration in which three circular reflective surfaces, each with a cross-section of a perfect circle with radii of 20, 10, and 5 μm, are arranged in a row. The pitch of the circular reflective surfaces is 10 μm, with 80% of one pitch being a circular surface and the remaining 20% ​​being a flat surface.

[0057] As can be seen from the results in Figure 11, when the radius of the circular reflective surface is 20 μm, the scattered light from the camera pattern is almost entirely directed in the same direction as the detector. Therefore, the detector and camera must be positioned in the same direction, reducing the degree of freedom in placement. On the other hand, when the radius is 10 μm, the scattered light spreads out and also enters the camera. Therefore, the spot position can be detected by the camera. On the other hand, when the radius is 5 μm, the scattered light spreads out a little too much, resulting in a weaker signal strength and increased susceptibility to noise. In other words, there is an optimal radius for the circular reflective surface that constitutes the camera pattern, depending on the position of the camera and light source.

[0058] (Example 3) Furthermore, the camera pattern may be constructed by dividing it into sections.

[0059] Figure 12 is a top view of the camera pattern and micro-vibration measurement reflective section formed on the substrate. In Figure 12(a), the micro-vibration measurement reflective section consists of two types: reflective sections RXa and RXb for measuring vibrations in the lateral direction (X direction) of the drawing, and reflective sections RYa and RYb for measuring vibrations in the vertical direction (Y direction) of the drawing. A single, seamless camera pattern 31 is positioned in the center of the reflective sections RXa, RXb, RYa, and RYb, and is illuminated with a strong spot.

[0060] In contrast, in Figure 12(b), the camera pattern 31A is divided into a grid. This makes it easier to identify the spot position of the laser beam in the camera image, improving the accuracy of spot recognition. If this grid-divided camera pattern 31A is drawn in one dimension, it corresponds to the configurations shown in the ray tracing simulations in Examples 1 and 2, for example.

[0061] As described above, according to this embodiment, the measurement target area 30 formed on the surface of the substrate 12 includes a camera pattern 31 that scatters incident light and reflective parts Ra and Rb that reflect the light in the exit direction corresponding to the incident direction. When laser light is irradiated onto the measurement target area 30 of the substrate 12, the laser light is scattered by the camera pattern 31, so the spot position of the laser light can be reliably measured from the image captured by the camera 16. Furthermore, the vibration of the substrate 12 can be measured using the change in the light reception intensity received by the light receiving unit 18 from the reflected light from the reflective parts Ra and Rb.

[0062] (Manufacturing method) The camera patterns shown in the above-described examples can be formed, for example, using nanoimprint lithography, with silicon or Ni electroformed as a mold, and using inorganic materials (such as sol-gel glass) or UV-curing resins. The pseudo-diffusion effect can be further enhanced by depositing an aluminum film on top of the resin.

[0063] Furthermore, the reflective portion for detecting minute vibrations can be formed, for example, by flatly depositing an aluminum film onto a substrate.

[0064] (Regarding the light source) Although the embodiments described above used a laser light source, the light source in this disclosure is not limited to a laser light source. This disclosure is applicable to any light source that emits so-called collimated light. "Collimated light" refers to light that is in a parallel state. In addition to a laser light source, other light sources that emit collimated light can be, for example, a superluminescent diode, an LED with a lens, etc. [Industrial applicability]

[0065] This disclosure enables reliable measurement of the position and vibration of an object using collimated light, and is therefore useful, for example, for positioning semiconductor chips when mounting them onto a substrate. [Explanation of symbols]

[0066] 11 Semiconductor chips 12. Substrate (object) 14. Laser light source (light source) 16 cameras 17 Image Processing Unit 18 Light receiving part 19. Intensity Processing Circuit 30 Measurement target area 31 Camera pattern (first region) 31A Camera Pattern 32 Triangular reflective surface 33. Circular reflective surface Ra,Rb reflective part (second area)

Claims

1. A method for measuring the position and vibration of an object using collimated light, A measurement target area is formed on the surface of the object, including a first area that scatters incident light and a second area that reflects the light in an exit direction corresponding to the incident direction. Collimated light is irradiated onto the measurement target area of ​​the object, As the first measurement, the first region is photographed with a camera, and the spot position of the collimated light is measured from the captured image. As a second measurement, the reflected light from the second region is received by the light receiving unit, and the vibration of the object is measured using the change in the light reception intensity of the light receiving unit. Position measurement method.

2. In the position measurement method according to claim 1, The first region comprises a plurality of triangular reflecting surfaces. Position measurement method.

3. In the position measurement method according to claim 2, The aforementioned plurality of triangular reflecting surfaces include triangular reflecting surfaces with different reflection angles. Position measurement method.

4. In the position measurement method according to claim 1, The first region comprises a plurality of circular reflective surfaces. Position measurement method.

5. In the position measurement method according to claim 1, The first region is divided into a grid pattern in a plan view. Position measurement method.

6. In the position measurement method according to claim 1, The second measurement has higher measurement accuracy than the first measurement. Position measurement method.

7. In the position measurement method according to claim 1, The second measurement has a shorter measurement time than the first measurement. Position measurement method.

8. A system that uses collimated light to measure the position and vibration of an object, A measurement target area is formed on the surface of the object, including a first area that scatters incident light and a second area that reflects the light in an exit direction corresponding to the incident direction. A light source that irradiates the measurement target area of ​​the object with collimating light, A light receiving unit that receives reflected light from the second region, An image processing unit measures the spot position of collimated light from an image captured by a camera that photographs the first region, The system includes an intensity processing circuit that measures the vibration of the object using the change in light intensity received by the light receiving unit. Position measurement system.

Images