Temperature control method, computational control unit, and temperature control system in semiconductor wafer manufacturing processes

The temperature control method addresses stray light interference by converting optically detected temperatures into processing temperatures using a conversion model, enabling accurate and cost-effective temperature control in semiconductor wafer manufacturing.

JP2026093303APending Publication Date: 2026-06-08PREMTEK INT
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
PREMTEK INT
Filing Date
2025-02-26
Publication Date
2026-06-08

AI Technical Summary

Technical Problem

Existing temperature control methods in semiconductor wafer manufacturing are hindered by the influence of stray light on optical temperature detection, particularly when heating both sides of a semiconductor wafer, leading to inaccurate detection results, especially with highly transmissive materials like SiC or sapphire, and requiring expensive equipment for correction.

Method used

A temperature control method that uses a temperature conversion model to convert optically detected temperatures into processing temperatures, calculating heating control parameters based on temperature differences, and controlling optical heating modules to achieve accurate temperature control without expensive equipment.

Benefits of technology

The method effectively eliminates the influence of stray light on detection results with low computational cost, ensuring accurate temperature control in semiconductor wafer manufacturing processes.

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Abstract

To provide a temperature control method for semiconductor wafer manufacturing processes that can eliminate the influence of stray light on detection results with low computational cost. [Solution] A temperature control method in a semiconductor wafer manufacturing process, which controls an optical heating module that heats a semiconductor wafer to be processed based on a predetermined target temperature corresponding to each adjustment time, at multiple adjustment time points intervened at predetermined time intervals in the semiconductor manufacturing process, wherein at each adjustment time point, a calculation control device controls the optical heating module using a temperature conversion model based on the temperature difference between the processing temperature corresponding to the adjustment time and the target temperature corresponding to the adjustment time, thereby heating the semiconductor wafer to be processed.
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