Coating apparatus and coating system

Abstract

To provide a coating apparatus that can prevent uneven drying of a coating film formed on a substrate. [Solution] The coating apparatus 100 comprises a chamber 10 for housing a substrate 50, a coater 20 for applying a coating liquid 30 to the substrate housed in the chamber to form a coating film 51 on the substrate, and a supply means 60 for supplying a gas 32 obtained by vaporizing the solvent 31 contained in the coating liquid into the chamber. The formation of the coating film on the substrate is carried out in the chamber in a gas atmosphere of solvent supplied from the supply means.

Claims

1. A chamber for housing the circuit board, A coating device that applies a coating liquid to the substrate housed in the chamber to form a coating film on the substrate, A supply means for supplying a gas obtained by vaporizing the solvent contained in the coating liquid into the chamber. A coating apparatus equipped with, The coating apparatus is characterized in that the formation of the coating film on the substrate is carried out in the chamber in a gas atmosphere of the solvent supplied from the supply means.

2. The coating apparatus according to claim 1, wherein the formation of the coating film on the substrate is carried out by controlling the gas concentration of the solvent in the chamber to be above the upper limit of explosion.

3. The chamber further comprises a filling means for filling it with an inert gas. The coating apparatus according to claim 1, wherein the formation of the coating film on the substrate is performed in a gas atmosphere of the solvent supplied from the supply means, after the chamber has been filled with the inert gas by the filling means.

4. A coating method comprising applying a coating liquid to a substrate housed in a chamber to form a coating film on the substrate, A coating method comprising creating a gas atmosphere of the solvent contained in the coating liquid inside the chamber and forming the coating film on the substrate.

5. The coating method according to claim 4, wherein the gas concentration of the solvent in the chamber is above the upper limit of explosion.

6. The coating method according to claim 4, wherein the chamber is filled with an inert gas, and then the chamber is made into a gas atmosphere of the solvent to form the coating film on the substrate.

7. A coating system comprising a coating device for applying a coating solution to a substrate to form a coating film on the substrate, and a vacuum dryer for drying the coating film formed on the substrate, all housed in a chamber, The chamber is equipped with a supply means for supplying a gas obtained by vaporizing the solvent contained in the coating liquid, A coating system comprising: supplying the solvent gas from the supply means into the chamber to create a solvent gas atmosphere in the chamber; forming a coating film on the substrate with the coating device; and then transferring the substrate on which the coating film has been formed into the vacuum dryer to dry the coating film under reduced pressure.

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