Semiconductor equipment
JP2026094240APending Publication Date: 2026-06-09SEMICON ENERGY LAB CO LTD
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- SEMICON ENERGY LAB CO LTD
- Filing Date
- 2026-02-24
- Publication Date
- 2026-06-09
AI Technical Summary
Benefits of technology
【0016】 本発明の一態様により、微細化に適した半導体装置を提供することができる。また、回 路面積を縮小した半導体装置を提供することができる。
✦ Generated by Eureka AI based on patent content.
Smart Images

Figure 2026094240000001_ABST
Abstract
To provide semiconductor devices suitable for miniaturization. Or, to provide highly reliable semiconductor devices. do. [Solution] The transistor has a capacitive element, and the transistor has a semiconductor layer The semiconductor layer is located above the capacitive element, and the capacitive element is electrically connected to the transistor. This is a semiconductor device having electrodes.
Need to check novelty before this filing date? Find Prior Art