Nozzle polishing device
The nozzle polishing apparatus addresses the issue of worn-out component adsorption surfaces by polishing them into a flat plane perpendicular to the nozzle axis, enhancing accuracy and reducing errors in component mounting devices.
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD
- Filing Date
- 2024-11-29
- Publication Date
- 2026-06-10
AI Technical Summary
The component adsorption surface of nozzles in component mounting devices wears out over time, leading to irregularities that cause component adsorption errors and inaccurate recognition by cameras, particularly when smaller components are handled, due to specular reflection of illumination light.
A nozzle polishing apparatus comprising a base portion, a nozzle holding portion, a polishing member with a planar polishing surface, and a moving body that polishes the component suction surface into a highly flat plane perpendicular to the nozzle axis, ensuring accurate and stable component mounting.
The nozzle polishing apparatus effectively polishes the component adsorption surface to a highly flat plane, reducing errors and ensuring accurate component recognition and mounting by maintaining a flat, orthogonal surface to the nozzle axis.
Smart Images

Figure 2026094998000001_ABST
Abstract
Description
Technical Field
[0001] The present disclosure relates to a nozzle polishing device for polishing a component adsorption surface of a nozzle used in a component mounting device.
Background Art
[0002] Conventionally, a component mounting device includes a mounting head that mounts components on a positioned substrate. The mounting head includes a nozzle that extends downward, and components can be picked up by adsorbing the components on the component adsorption surface at the lower end of the nozzle. When mounting the component adsorbed by the nozzle on the substrate, the component mounting device images and recognizes the adsorbed component from below by a camera (see, for example, Patent Document 1 below).
Prior Art Documents
Patent Documents
[0003]
Patent Document 1
Summary of the Invention
Problems to be Solved by the Invention
[0004] By the way, when the nozzle repeatedly adsorbs components, the component adsorption surface gradually wears out. When the component adsorption surface of the nozzle wears out, the flat planar shape collapses and irregularities occur, and component adsorption errors may occur. Also, when the outer diameter of the component is smaller than the outer diameter of the component adsorption surface of the nozzle, the irregularities on the component adsorption surface of the nozzle specularly reflect the illumination light of the camera, and the recognition result of the component may become inaccurate, and there is also a risk of component mounting errors on the substrate. As a countermeasure to eliminate the irregularities generated on the component adsorption surface, it is conceivable to polish the component adsorption surface of the nozzle with a polishing member such as a file, but there is a problem that it is very difficult for an operator to perform this manually because the component adsorption surface needs to be polished as a flat plane with high flatness orthogonal to the axis of the nozzle.
[0005] Therefore, the present disclosure aims to provide a nozzle polishing apparatus that can polish the component adsorption surface of the nozzle into a highly flat plane perpendicular to the nozzle axis. [Means for solving the problem]
[0006] The nozzle polishing apparatus of the present disclosure is a nozzle polishing apparatus for polishing the component suction surface of a nozzle used in a component mounting apparatus, and comprises a base portion, a nozzle holding portion provided on the base portion for holding the nozzle, a polishing member having a planar polishing surface, and a moving body for moving the polishing member, which has its polishing surface in contact with the component suction surface of the nozzle held by the nozzle holding portion. [Effects of the Invention]
[0007] According to this disclosure, the component adsorption surface of the nozzle can be polished to a highly flat plane perpendicular to the nozzle axis. [Brief explanation of the drawing]
[0008] [Figure 1] This is a perspective view of a nozzle polishing apparatus in one embodiment of the present disclosure. [Figure 2] A side view of the main part of a component mounting device equipped with a nozzle to be polished, which is a nozzle polishing device in one embodiment of the present disclosure. [Figure 3] A front view showing a nozzle to be polished, along with a part of the shaft member to which it is attached, in a nozzle polishing apparatus according to one embodiment of the present disclosure. [Figure 4] A perspective view showing a nozzle to be polished in a nozzle polishing apparatus according to one embodiment of the present disclosure, together with a part of the shaft member to which it is attached. [Figure 5] A perspective view showing a nozzle to be polished in a nozzle polishing apparatus according to one embodiment of the present disclosure, together with a part of the shaft member to which it is attached. [Figure 6] This is a perspective view of a nozzle polishing apparatus in one embodiment of the present disclosure. [Figure 7]This is a partial perspective view of a nozzle polishing apparatus in one embodiment of the present disclosure. [Figure 8] This is a partial perspective view of a nozzle polishing apparatus in one embodiment of the present disclosure. [Figure 9] This is an exploded perspective view of a part of a nozzle polishing apparatus in one embodiment of the present disclosure. [Figure 10] This is a side cross-sectional view of a part of a nozzle polishing apparatus in one embodiment of the present disclosure. [Figure 11] This is an exploded perspective view of a part of a nozzle polishing apparatus in one embodiment of the present disclosure. [Figure 12] (a)(b) A perspective view of a nozzle polishing apparatus in one embodiment of the present disclosure. [Figure 13] This is a perspective view of a nozzle polishing apparatus in one embodiment of the present disclosure. [Figure 14] (a)(b)A side view of a nozzle polishing apparatus in one embodiment of the present disclosure. [Figure 15] (a)(b)A front view of a nozzle polishing apparatus according to one embodiment of the present disclosure. [Figure 16] (a)(b) These are bottom views of the polishing member and the polishing member holder before and after the position of the polishing member relative to the moving body of the nozzle polishing device in one embodiment of the present disclosure is changed. [Figure 17] (a)(b)(c) These are perspective views of a polishing member and a polishing member holder illustrating a procedure for changing the position of the polishing member relative to the moving body in a nozzle polishing device according to one embodiment of the present disclosure. [Modes for carrying out the invention]
[0009] Embodiments of the present disclosure will be described below with reference to the drawings. Figure 1 shows a nozzle polishing apparatus 11 in one embodiment of the present disclosure. The nozzle polishing apparatus 11 polishes a nozzle 13 used in a component mounting device 12, for example, as shown in Figure 2.
[0010] First, the component mounting device 12 will be described. The component mounting device 12 is a device for mounting components BH on a substrate KB. As shown in FIG. 2, it includes a conveyor 21, a parts feeder 22, a mounting head 23, and a camera 24. The conveyor 21 supports both ends of the substrate KB from below and conveys it in the horizontal direction (a direction perpendicular to the plane of FIG. 2), and positions it at a predetermined working position. The parts feeder 22 is composed of a tape feeder, pulls out a component supply tape BT containing the components BH from a reel RL, conveys it, and supplies the components BH to a predetermined component extraction position 22T. Note that the parts feeder 22 only needs to supply the components BH to a predetermined position and is not limited to a tape feeder.
[0011] The mounting head 23 includes a hollow shaft member 23S extending downward, and a nozzle 13 is detachably attached to the lower end of the shaft member 23S. The mounting head 23 is moved in the horizontal plane direction by a head movement mechanism 23K composed of, for example, an XY table mechanism. The mounting head 23 can generate a vacuum adsorption force at the lower end of the nozzle 13, and picks up the component BH by adsorbing the component BH supplied by the parts feeder 22 to the nozzle 13.
[0012] In FIGS. 3 and 4, a nozzle mounting portion 25 to which the nozzle 13 is detachably mounted is provided at the lower end of the shaft member 23S. The nozzle mounting portion 25 includes a receiving portion 26, a pair of engaging protrusions 27, two regulating claws 28, and an annular spring 29.
[0013] In FIG. 5, the receiving portion 26 has a hollow cylindrical shape that opens downward. The pair of engaging protrusions 27 are located at positions symmetric with respect to the central axis of the shaft member 23S, and each protrudes outward from the side surface of the receiving portion 26. The two regulating claws 28 each extend in the vertical direction along the side surface of the receiving portion 26 and have a hook-shaped claw portion 28T at the lower end. The annular spring 29 is attached so as to surround the side surface of the receiving portion 26 and biases the upper end side of each regulating claw 28 toward the side surface of the receiving portion 26. The internal space of the shaft member 23S and the internal space of the receiving portion 26 serve as a suction passage 30 for sucking and holding the component BH (FIG. 3).
[0014] In FIGS. 4 and 5, the nozzle 13 has a nozzle base portion 31 attached to the receiving portion 26 of the nozzle mounting portion 25, a tubular nozzle main body portion 32 extending downward from the nozzle base portion 31, and a flange portion 33 extending and spreading in a disk shape along the XY plane between the nozzle base portion 31 and the nozzle main body portion 32. Inside the nozzle main body portion 32, a suction pipe line 34 extending vertically through the nozzle 13 is provided. The flat surface at the lower end of the nozzle main body portion 32 serves as a component suction surface 13M that contacts the surface of the component BH when sucking the component BH.
[0015] In FIGS. 4 and 5, a pair of inclined surfaces 35 are formed on the side surface of the nozzle base portion 31. These pair of inclined surfaces 35 are located at positions facing each other with the axis JX of the nozzle 13 extending in the Z direction interposed therebetween. Further, on the side surface of the nozzle base portion 31, at two positions each shifted 90 degrees from each of the two inclined surfaces 35 in a plan view, U-shaped groove portions 36 opening upward are provided (see also FIG. 3).
[0016] The nozzle base portion 31 has a hollow cylindrical shape that opens upward, and its inner diameter is slightly larger than the outer diameter of the receiving portion 26. An annular recess 37 centered on the axis JX is provided at the lower portion of the side surface of the nozzle base portion 31 (the portion below the two inclined surfaces 35 and the two groove portions 36).
[0017] When attaching the nozzle 13 to the nozzle mounting portion 25, the cylindrical nozzle base 31 is fitted onto the lower end of the receiving portion 26 (arrow A shown in Figure 5). At this time, the two engaging protrusions 27 of the nozzle mounting portion 25 are positioned to fit into the two grooves 36 formed in the nozzle 13. During this process, the claw portions 28T of each of the two restricting claws 28 are pushed outward by the two inclined surfaces 35 formed in the nozzle 13, and then, having overcome the inclined surfaces 35, engage with the recesses 37 by the biasing force of the annular spring 29. At the same time, the two engaging protrusions 27 also fit into the two grooves 36.
[0018] When the two claw portions 28T engage with the recess 37 and the two engaging projections 27 enter the two groove portions 36, the nozzle 13 is attached to the nozzle mounting portion 25, and the suction passage 34 inside the nozzle 13 is connected to the suction passage 30 inside the shaft member 23S (Figure 4). Furthermore, since the nozzle 13 is held between the two restricting claws 28, it is prevented from coming out of the nozzle mounting portion 25 (i.e., from the shaft member 23S), and since the engaging projections 27 enter the groove portions 36, rotational displacement around the axis JX relative to the nozzle mounting portion 25 is prevented.
[0019] In Figure 2, the camera 24 is positioned with its imaging field of view facing upward. The camera 24 recognizes the component BH picked up by the mounting head 23 and nozzle 13 by imaging it from below before the component BH is mounted on the substrate KB.
[0020] When the component mounting device 12 performs component mounting work to mount component BH onto a circuit board KB, first, the conveyor 21 operates to bring in the circuit board KB sent from the outside and position it at a predetermined work position. Once the circuit board KB is positioned at the work position, the parts feeder 22 performs a component supply operation to supply component BH to the component pick-up position 22T, and the mounting head 23 moves back and forth between the parts feeder 22 and the circuit board KB, repeatedly performing mounting turns. A mounting turn consists of an operation to move to the parts feeder 22 and pick up the component BH supplied by the parts feeder 22 by picking it up with the component suction surface 13M of the nozzle 13, and a mounting operation to move above the circuit board KB and mount the component BH picked up in the pickup operation onto the circuit board KB.
[0021] As the mounting head 23 repeatedly performs the above mounting turns, once all the components BH to be mounted on the circuit board KB have been mounted, the conveyor 21 activates and transports the circuit board KB to the outside. This completes the component mounting process for one circuit board KB.
[0022] Next, the nozzle polishing device 11 will be described. The nozzle polishing device 11 polishes the part suction surface 13M of the nozzle 13 that has been removed from the mounting head 23 of the part mounting device 12. As shown in Figures 1 and 6, it comprises a base portion 41, a nozzle holding portion 42, a moving body 43, a polishing member holder 44, a polishing member 45, and a lifting portion 46. In this embodiment, for the sake of explanation, the left-right direction as seen from the operator OP in Figures 1 and 6 is defined as the X direction, the front-back direction as seen from the operator OP is defined as the Y direction, and the up-down direction is defined as the Z direction.
[0023] In Figures 6 and 7, the base portion 41 consists of a flat plate-shaped member that extends in the XY plane (horizontal plane). The base portion 41 is supported in a horizontal position on a workbench (not shown) by legs 41K provided at the four corners. A wall portion 41F that extends along the YZ plane is provided at one end of the base portion 41 (the left side as seen from the perspective of the worker OP).
[0024] In Figures 7 and 8, the nozzle holding portion 42 consists of a block-shaped member formed in the shape of a rectangular parallelepiped. The nozzle holding portion 42 is the part that holds the nozzle 13 to be polished and has an insertion hole 51 that opens on its upper surface. The inner surface of the insertion hole 51 has a cylindrical shape with an inner diameter slightly larger than the outer diameter of the nozzle base portion 31. The nozzle base portion 31 of the nozzle 13, which is inverted so that the part suction surface 13M faces upward, is inserted into the insertion hole 51 from above.
[0025] In Figure 8, the insertion hole 51 is provided with an upwardly extending cylindrical movement-restricting projection 52 and a rotation-restricting projection 53 that extends horizontally from a part of the cylindrical side surface. When the operator OP inserts the nozzle base 31 into the insertion hole 51, the movement-restricting projection 52 enters the nozzle base 31 (Figure 7), and the rotation-restricting projection 53 engages with (enters into) the groove 36 of the nozzle 13.
[0026] In this embodiment, the nozzle holding portion 42 has an insertion hole 51 into which a cylindrical nozzle base portion 31 located on the opposite side of the part suction surface 13M of the nozzle 13, which is positioned so that the part suction surface 13M faces upward, is inserted from above. The nozzle 13 is held by the nozzle holding portion 42 with the nozzle base portion 31 inserted into the insertion hole 51.
[0027] In Figures 7 and 8, a rectangular plate member 54 extending along the XY plane is provided on the upper surface of the base portion 41. As also shown in Figure 9, the plate member 54 is attached to the base portion 41 by four plate member mounting screws 55 inserted from above at its four corners.
[0028] In Figures 7 and 8, the nozzle holding portion 42 is provided on the upper surface of the plate member 54. As shown in Figure 9, two liner bush insertion holes 56 are provided in each of the two opposing regions of the nozzle holding portion 42 in the Y direction, penetrating the nozzle holding portion 42 in the Z direction. A liner bush 57 extending in the vertical direction is press-fitted into each liner bush insertion hole 56, and a guide rod 58 extending in the Z direction is inserted through the liner bush 57.
[0029] In Figure 9, a screw hole 58H is provided at the lower end of each of the two guide rods 58, and a guide rod mounting screw 59 is screwed into the screw hole 58H from below, with the plate member 54 inserted through it from below. As a result, each guide rod 58 is attached to the upper surface of the plate member 54 by the guide rod mounting screw 59.
[0030] In Figure 9, a circlip 60 is attached to the upper end of each guide rod 58 that protrudes upward from the upper end of each of the two liner bushings 57 (see also Figures 7 and 8). The circlip 60 prevents the upper end of the guide rod 58 from entering the liner bushing 57.
[0031] In Figure 10, the screw head 59T at the lower end of the guide rod mounting screw 59 is located within the screw head storage space 54S formed in the plate member 54 (see also Figure 9). Of the allowable vertical movement range of the nozzle holding portion 42, the lower limit is the position where the screw head 59T of the guide rod mounting screw 59 abuts against the upper surface of the base portion 41 from above, and the upper limit is the position where the screw head 59T of the guide rod mounting screw 59 abuts against the stepped portion 54D of the screw head storage space 54S from below (Figure 10).
[0032] In Figure 9, two spring housing holes 54H are provided at two locations on the plate member 54 that are opposite each other in the Y direction, penetrating the plate member 54 in the thickness direction (Z direction). A biasing spring 61, which serves as a biasing means, is housed in each spring housing hole 54H (Figures 9 and 10).
[0033] In Figures 9 and 10, each of the two biasing springs 61 has a spring insertion portion 42S that extends downward from the lower surface of the nozzle holding portion 42 and is inserted from above. The upper end of each biasing spring 61 abuts against the lower surface of the nozzle holding portion 42, and the lower end abuts against the upper surface of the base portion 41.
[0034] Each biasing spring 61 is provided between the plate member 54 and the nozzle holding portion 42 in the retracted state. Therefore, the nozzle holding portion 42 is normally positioned so that the screw head 59T of the guide rod mounting screw 59 abuts against the stepped portion 54D of the screw head storage space 54S from below (Figure 10).
[0035] In Figures 1 and 6, a nozzle retainer 62 is provided on the upper surface of the nozzle holding portion 42. The nozzle retainer 62 has an overall L-shape and comprises a horizontal portion 71 that extends outward in the horizontal plane (XY plane) and a vertical portion 72 that extends downward from the right end of the horizontal portion 71 and extends outward in the YZ plane (Figure 6). The horizontal portion 71 of the nozzle retainer 62 is provided with a nozzle holding groove 73 that opens at the left edge and extends in the X direction (to the right) (Figure 6).
[0036] In Figure 6, the vertical portion 72 of the nozzle retainer 62 is provided with a notched groove 72K extending from below to above. A nozzle retainer mounting screw 74 extending in the X direction is inserted into the notched groove 72K. A male thread is formed on one end of the nozzle retainer mounting screw 74 (the left side as seen from the operator OP), and this male thread is screwed into a screw mounting hole 42J formed on the right side surface of the nozzle holding portion 42.
[0037] As shown in Figures 1, 6, and 10, a knob 74N is provided at the other end (right side as seen from the operator OP) of the nozzle retainer mounting screw 74. The knob 74N is located to the right of the vertical portion 72 of the nozzle retainer 62. By twisting the knob 74N, the operator OP can rotate the nozzle retainer mounting screw 74 around an axis along the X direction.
[0038] In Figures 1 and 6, two slide guides 81 extending in the X direction are provided at two positions in the Y direction that sandwich the nozzle holding portion 42 above the base portion 41. Each slide guide 81 is supported at one end (left side as viewed from the operator OP) by a wall portion 41F, and at the other end (right side as viewed from the operator OP) by a slide guide support portion 82 erected on the upper surface of the base portion 41. A block-shaped slider 83 is attached to each of the two slide guides 81 so as to be slidable in the X direction.
[0039] In Figures 1 and 6, the movable body 43 consists of a plate-shaped member extending in the Y direction. Each of the Y-direction ends of the movable body 43 is attached to the upper surface of each of the two sliders 83 by a plurality of slider mounting screws 84. Therefore, the movable body 43 moves in the Y direction by the movement (sliding) of the two sliders 83 along the two slide guides 81 in the Y direction.
[0040] In Figures 1 and 6, the polishing member holder 44 is attached to the lower side of the central part in the Y direction of the movable body 43. The polishing member holder 44 comprises an upper holder 91 attached to the lower side of the movable body 43 and a lower holder 92 provided on the lower side of the upper holder 91.
[0041] In Figure 11, the lower holder 92 is connected to the upper holder 91 by four connecting screws 93. The upper holder 91 has four elongated holes 91H extending in the Y direction at four locations corresponding to the four connecting screws 93, and each of the four connecting screws 93 is inserted through the corresponding elongated hole 91H in the Z direction and then screwed into the screw holes 92H of the lower holder 92.
[0042] In Figures 1 and 6, the polishing member 45 is held on the lower side of the polishing member holder 44. The polishing member 45 has a shape that extends along the XY plane, and its lower surface is a flat polishing surface 45M. In this embodiment, the polishing member 45 is made of extremely fine-grit sandpaper, and the upper side, which is not the polishing surface 45M, is attached to the lower holder 92 (Figure 11). The polishing member 45 needs to have a certain length in the X direction, but the dimension in the Y direction is sufficient if it is several times to more than ten times the diameter of the part suction surface 13M of the nozzle 13 that is to be polished.
[0043] In Figure 11, the lifting section 46 comprises two collar members 94, two return springs 95, two cap members 96, two upper retainer mounting screws 97, a nut member 98, a polishing member lifting screw 99, and a knob 100. The two collar members 94 each extend in the Z direction and are arranged side by side in the Y direction. The two collar members 94 each penetrate the movable body 43 in the thickness direction (Z direction). The two return springs 95 each consist of a coil spring and are inserted through the corresponding collar member 94.
[0044] Each of the two cap members 96 is attached to the upper end of the collar member 94. The cap members 96 prevent the return spring 95, which is inserted through the collar member 94, from coming out upward from the collar member 94. Each of the two upper retainer mounting screws 97 passes through the upper retainer 91 from below and is screwed into the lower end of each of the two collar members 94.
[0045] The lower end of the return spring 95 abuts against the upper surface of the movable body 43 from above, and the upper end abuts against the cap member 96 from below. As a result, the collar member 94 is biased upward by the biasing force of the return spring 95, and the polishing member holder 44 is pulled upward (towards the lower surface of the movable body 43) by the return spring 95. Therefore, when the polishing member holder 44 is pushed downward, the polishing member holder 44 will attempt to return to its original position (move upward) due to the biasing force of the return spring 95.
[0046] In Figure 11, the nut member 98 consists of a horizontally shaped disc and is located in the center of the upper surface of the movable body 43 in the Y direction. The polishing member lifting screw 99 extends in the Z direction, and a male screw formed on its outer surface engages with a female screw formed inside the nut member 98.
[0047] The lower end of the polishing member lifting screw 99 protrudes from the lower side of the movable body 43 and is positioned to contact the upper surface of the polishing member holder 44 (specifically the upper holder 91) located on the lower surface of the movable body 43. The knob 100 consists of a horizontal disc-shaped member and is attached to the upper end of the polishing member lifting screw 99. By twisting the knob 100, the operator OP can move the polishing member lifting screw 99 in the Z direction relative to the nut member 98.
[0048] When operator OP twists the knob 100 in one direction, the polishing member lifting screw 99 descends relative to the moving body 43. The polishing member lifting screw 99 compresses the return spring 95 (against the biasing force of the return spring 95) and causes the polishing member holder 44 to descend. As a result, the polishing member 45 held by the polishing member holder 44 descends relative to the moving body 43.
[0049] Conversely, when the operator OP twists the knob 100 in the other direction, causing the polishing member lifting screw 99 to rise relative to the moving body 43, the collar member 94 is pushed up by the biasing force of the return spring 95, and the polishing member holder 44, which is connected to the collar member 94, rises relative to the moving body 43. As a result, the polishing member 45 held by the polishing member holder 44 rises relative to the moving body 43. Since the polishing member lifting screw 99 is screwed into the nut member 98, even if the operator OP releases their hand after twisting the knob 100, the polishing member lifting screw 99 remains stationary in that position, and therefore the polishing member holder 44 (polishing member 45) also remains at the position (height) where the operator OP released their hand from the knob 100.
[0050] In Figures 1 and 6, an operating handle 101 is provided on the upper surface of the mobile body 43. The operating handle 101 extends in the Z direction, and its lower end is fixed to the mobile body 43. When operator OP grasps the operating handle 101 and moves it in the X direction, the mobile body 43 to which the operating handle 101 is attached moves in the X direction together with two sliders 83 connected to the mobile body 43, while maintaining a horizontal position with the two sliders 83.
[0051] In Figures 1 and 7, a movement range restricting bolt 102 is provided on the front left side of the upper surface of the base portion 41. As shown in Figure 9, the movement range restricting bolt 102 is screwed from above into a bolt mounting hole 41A provided on the base portion 41, and the amount of upward protrusion from the upper surface of the base portion 41 can be adjusted by the amount of screwing it in.
[0052] The movement range restricting bolt 102 can be switched between a "non-protruding position" in which the amount of protrusion from the upper surface of the base portion 41 is small and the height of the upper surface of its head 102H is lower than the height of the lower surface of the slider 83, and a "protruding position" in which the amount of protrusion from the upper surface of the base portion 41 is large and the height of the upper surface of its head 102H is higher than the height of the lower surface of the slider 83. When the movable body 43 moves from left to right, the position where the slider 83 contacts the slide guide support 82 from the left becomes the limit of the movable body 43's movement (Figure 12(a)). When the movable body 43 moves from right to left, with the movement range restricting bolt 102 in the protruding position, the position where the front slider 83 contacts the movement range restricting bolt 102 becomes the limit of the movable body 43's movement (Figure 12(b)). With the movement range restricting bolt 102 in the non-protruding position, the position where the slider 83 contacts the wall portion 41F (Figure 1) becomes the limit of movement.
[0053] With the movement range restricting bolt 102 in a non-protruding position, when the movable body 43 is positioned so that the slider 83 contacts the wall portion 41F, the movable body 43 is positioned to the left of the nozzle holding portion 42, and the nozzle holding portion 42 is opened upward (Figure 6). Therefore, if the nozzle retainer 62 is removed from the nozzle holding portion 42, when the movable body 43 is moved to its leftmost limit position, the insertion hole 51 of the nozzle holding portion 42 is exposed upward (Figure 6).
[0054] On the other hand, when the range of movement restricting bolt 102 is in the protruding position, regardless of the position of the movable body 43 in the X direction, the insertion hole 51 of the nozzle holding part 42 is not exposed upwards, but is located below the movable body 43 (abrasive member 45). Therefore, when the range of movement restricting bolt 102 is in the protruding position, the range of movement restricting bolt 102 functions as a range of movement restricting means that restricts the range of movement of the movable body 43 so that the abrasive surface 45M is located above the nozzle 13 held by the nozzle holding part 42, regardless of the position of the movable body 43.
[0055] When polishing the part suction surface 13M of the nozzle 13 with the nozzle polishing device 11 configured in this way, the operator OP first moves the movable body 43 to the right and positions the movement range restricting bolt 102 in a non-protruding position. Then, the movable body 43 is moved to the left and positioned at the leftmost limit position where the slider 83 contacts the wall portion 41F (Figure 6). Once the top of the nozzle holding portion 42 is open (Figure 6), the operator OP performs the task of holding the nozzle 13 to be polished in the nozzle holding portion 42.
[0056] When the nozzle 13 is to be held in the nozzle holding part 42, the operator OP first inverts the nozzle 13 from the position in which it is mounted on the mounting head 23 of the component mounting device 12 (specifically, the nozzle mounting part 25 at the lower end of the shaft member 23S). Once the nozzle 13 is in an inverted position with the component suction surface 13M facing upwards and the nozzle base 31 facing downwards, the nozzle base 31 of the nozzle 13 is inserted from above into the insertion hole 51 provided in the nozzle holding part 42 (Figures 6 and 7).
[0057] When operator OP inserts the nozzle base 31 into the insertion hole 51, as described above, the movement restricting projection 52 enters the cylindrical nozzle base 31 from below, and the rotation restricting projection 53 engages with the groove 36 provided in the nozzle base 31. The nozzle 13 is stably supported by the nozzle holder 42 when the nozzle base 31 is inserted into the insertion hole 51 of the nozzle holder 42. However, the movement of the nozzle 13 is restricted by the movement restricting projection 52 entering the nozzle base 31, thus further increasing the stability of the nozzle's posture. In addition, the rotation restricting projection 53 engages with the nozzle base 31 (enters the groove 36), restricting the rotational movement of the nozzle 13 around its axis JX, thus further increasing the stability of the nozzle's posture.
[0058] After inserting the nozzle base 31 into the insertion hole 51 as described above, the operator OP positions the nozzle retainer 62 above the nozzle holding part 42 so that the nozzle body 32 is inserted into the nozzle holding groove 73 of the nozzle retainer 62. Then, by twisting the knob 74N of the nozzle retainer mounting screw 74, the nozzle retainer mounting screw 74 is screwed into the screw mounting hole 42J provided on the side of the nozzle holding part 42.
[0059] At this time, the operator OP moves the nozzle holder 62 vertically so that the nozzle holder mounting screw 74 moves relative to it within the aforementioned notched groove 72K formed in the vertical portion 72 of the nozzle holder 62, so that the flange portion 33 of the nozzle 13 is pressed from above by the horizontal portion 71 of the nozzle holder 62. Once the nozzle holder 62 is attached to the nozzle holding portion 42, the nozzle 13 is held in place and the nozzle 13 is prevented from falling out of the nozzle holding portion 42 (Figure 1). In the state where the nozzle 13 is held in place, the component suction surface 13M of the nozzle 13 is positioned higher than the upper surface of the horizontal portion 71 of the nozzle holder 62, as shown in Figure 10.
[0060] Once the nozzle 13 is held in the nozzle holding part 42, the operator OP moves the movable body 43 to the right. When the polishing member 45 is positioned above the nozzle 13 and the movement range restricting bolt 102 is exposed, the operator OP twists the movement range restricting bolt 102 to position it in the protruding position (Figure 13).
[0061] Once the operator OP positions the range of motion restricting bolt 102 in a protruding position, the operator OP lowers the polishing member holder 44 using the lifting unit 46. Specifically, the operator OP lowers the polishing member lifting screw 99 by twisting the knob 100, and the lower end of the polishing member lifting screw 99 presses the polishing member holder 44 downward. As a result, the polishing member holder 44 descends against the biasing force of the return spring 95, and the polishing member 45 attached to the lower surface of the lower holder 92 comes into contact with the part suction surface 13M of the nozzle 13 from above (Figure 14(a) → Figure 14(b)).
[0062] In this embodiment, the movable body 43 is configured to include a polishing member holder 44 that holds the polishing member 45 and a lifting unit 46 that raises and lowers the polishing member holder 44 relative to the movable body 43. Therefore, by positioning the movable body 43 (i.e., the polishing member 45) above the nozzle 13 held by the nozzle holder 42, and then lowering the polishing member 45 with the lifting unit 46 to bring the polishing surface 45M into contact with the part suction surface 13M of the nozzle 13, the polishing surface 45M can be easily and reliably brought into contact with the part suction surface 13M.
[0063] Once the polishing surface 45M comes into contact with the part suction surface 13M of the nozzle 13 as described above, the operator OP further lowers the polishing member holder 44, and after the polishing member holder 44 pushes the tip of the nozzle 13 (part suction surface 13M) slightly downward (Figure 14(b)), the operator OP releases their hand from the knob 100. As a result, the part suction surface 13M maintains contact with the polishing surface 45M due to the biasing force of the biasing spring 61, which biases the nozzle 13 upward.
[0064] Once the polishing surface 45M is in contact with the part suction surface 13M as described above, the operator OP grasps the operating handle 101 and moves it back and forth in the X direction (Figure 12(a) → Figure 12(b) → Figure 12(a) → ..., Figure 15(a) → Figure 15(b) → Figure 15(a) → ...). As a result, the polishing member 45 moves relative to the nozzle 13 with the polishing surface 45M in contact with the part suction surface 13M, and the part suction surface 13M is polished to a plane parallel to the XY plane (a plane perpendicular to the axis JX of the nozzle 13).
[0065] In this embodiment, as described above, the polishing surface 45M is attached to a movable body 43 that moves in a horizontal position and moves accurately (reciprocating) within the XY plane. Furthermore, the nozzle 13, into which the nozzle base 31 is inserted in the insertion hole 51, has its horizontal movement restricted by the movement restricting projection 52 and its rotational movement around the axis JX of the nozzle 13 restricted by the rotation restricting projection 53, so that its position does not change relative to the nozzle holding part 42. Therefore, the part suction surface 13M of the nozzle 13 is polished by the nozzle polishing device 11 into a highly flat plane perpendicular to the axis JX of the nozzle 13.
[0066] Here, the nozzle holding portion 42 is biased upward relative to the base portion 41 by a biasing spring 61 acting as a biasing means, and the nozzle 13 held by the nozzle holding portion 42 is pushed upward by the biasing spring 61 together with the nozzle holding portion 42. Therefore, even if polishing progresses and the length (height) of the nozzle body portion 32 gradually decreases, the part suction surface 13M will not separate from the polishing surface 45M.
[0067] During the polishing operation of the nozzle 13 described above, the range of movement of the mobile body 43 is restricted to a range in which the polishing surface 45M is always located above the part suction surface 13M of the nozzle 13, regardless of the position of the mobile body 43. Therefore, during the polishing of the nozzle 13, the polishing surface 45M is always in contact with the part suction surface 13M, and the operator OP can perform the reciprocating movement operation of the mobile body 43 without having to worry about whether the polishing surface 45M will come into contact with the part suction surface 13M while moving the mobile body 43.
[0068] As described above, the nozzle polishing apparatus 11 in this embodiment includes a base portion 41, a nozzle holding portion 42 provided on the base portion 41 that holds the nozzle 13 in a position where the part suction surface 13M faces upward, a polishing member 45 having a flat polishing surface 45M on its lower side, and a moving body 43 that moves the polishing member 45, with its polishing surface 45M in contact with the part suction surface 13M of the nozzle 13 held by the nozzle holding portion 42, in the horizontal direction (X direction). By simply moving the moving body 43 (in this case, in the horizontal direction) with the polishing surface 45M in contact with the part suction surface 13M of the nozzle 13, the part suction surface 13M is polished into a planar shape perpendicular to the axis JX of the nozzle 13. Therefore, according to the nozzle polishing apparatus 11 in this embodiment, the part suction surface 13M of the nozzle 13 can be polished into a highly flat plane perpendicular to the axis JX of the nozzle 13.
[0069] Incidentally, after polishing the part suction surface 13M of the nozzle 13 with the nozzle polishing device 11 in this embodiment, the polishing marks KK remaining on the polished surface 45M, when viewed from below, have a linear shape (a long, narrow rectangle) extending in the X direction with a constant width equivalent to the diameter of the part suction surface 13M of the nozzle 13 (Figure 16(a)). These linear polishing marks KK extend along the relative movement path SL of the part suction surface 13M with respect to the polished surface 45M when the polished surface 45M moves in the X direction while in contact with the part suction surface 13M.
[0070] In this embodiment, after loosening the connecting screw 93 that connects the lower holder 92 to the upper holder 91 (Figure 17(a)), the lower holder 92 is moved in the Y direction relative to the upper holder 91 (Figure 17(b)), and then the connecting screws 93 are tightened again (Figure 17(c)). This allows the mounting position of the lower holder 92 relative to the upper holder 91, i.e., the mounting position of the polishing member 45 relative to the movable body 43, to be changed in the Y direction. By changing the mounting position of the polishing member 45 relative to the movable body 43 in this way, the polishing marks KK already formed on the polishing surface 45M can be shifted (offset) in the Y direction, thereby allowing a new (unused) area of the polishing surface 45M to be positioned along the relative movement path SL (Figure 16(b)).
[0071] Therefore, in this embodiment, when replacing the polishing surface 45M, it is only necessary to change the mounting position of the polishing member 45 on the movable body 43, eliminating the need for troublesome work such as removing the polishing member holder 44 from the movable body 43 or reattaching the polishing member 45 to the polishing member holder 44. Furthermore, this makes it possible to extend the lifespan of a single polishing member 45 by several times.
[0072] The embodiments of this disclosure are described above, and include the following technologies (component mounting devices).
[0073] (Item 1) A nozzle polishing device (nozzle polishing device 11) for polishing the component suction surface (component suction surface 13M) of a nozzle (nozzle 13) used in a component mounting device (component mounting device 12), comprising: a base portion (base portion 41); a nozzle holding portion (nozzle holding portion 42) provided on the base portion and holding the nozzle; a polishing member (polishing member 45) having a flat polishing surface (polishing surface 45M); and a moving body (moving body 43) for moving the polishing member, which has its polishing surface in contact with the component suction surface of the nozzle held by the nozzle holding portion.
[0074] According to the technology in item 1, the component adsorption surface of the nozzle can be polished into a highly flat plane perpendicular to the nozzle axis.
[0075] (Item 2) The nozzle polishing apparatus according to item 1, wherein the moving body comprises a polishing member holder (polishing member holder 44) for holding the polishing member, and a lifting unit (lifting unit 46) for raising and lowering the polishing member holder relative to the moving body.
[0076] According to the technology described in item 2, the polishing surface can be easily and reliably brought into contact with the part suction surface by first positioning the moving body above the nozzle held by the nozzle holding unit, and then lowering the polishing member by the lifting unit to bring the polishing surface into contact with the part suction surface of the nozzle.
[0077] (Item 3) The nozzle polishing apparatus according to item 1, wherein the nozzle holding portion has an insertion hole (insertion hole 51) into which a cylindrical nozzle base (nozzle base 31) located on the opposite side of the part suction surface of the nozzle, which is positioned so that the part suction surface faces upward, is inserted from above.
[0078] According to the technology of item 3, the nozzle is held with its base inserted into an insertion hole formed in the nozzle holder, so the position of the nozzle held in the nozzle holder can be made very stable.
[0079] (Item 4) The nozzle polishing apparatus according to item 3, wherein the nozzle holding portion has a movement-restricting projection (movement-restricting projection 52) inside the insertion hole that enters into the nozzle base inserted into the insertion hole and restricts the horizontal movement of the nozzle base.
[0080] According to the technology described in item 4, a movement-restricting projection enters the nozzle inserted into the insertion hole, thereby increasing the stability of the nozzle's posture held by the nozzle holder.
[0081] (Item 5) The nozzle polishing apparatus according to item 3, wherein the nozzle holding portion has a rotation restricting projection (rotation restricting projection 53) inside the insertion hole that engages with the nozzle base inserted into the insertion hole and restricts movement in the rotational direction about the axis (axis JX) of the nozzle.
[0082] According to the technology described in item 5, the rotational movement of the nozzle inserted into the insertion hole is restricted, thereby increasing the stability of the nozzle's posture held by the nozzle holder.
[0083] (Item 6) The nozzle polishing apparatus according to item 3, further comprising a nozzle holder (nozzle holder 62) that presses the nozzle toward the nozzle holding portion when the nozzle base is inserted into the insertion hole.
[0084] According to the technology in item 6, it is possible to prevent the nozzle from falling out of the nozzle holder or the nozzle's orientation from changing during nozzle polishing.
[0085] (Item 7) The nozzle polishing apparatus according to item 1, further comprising a biasing means (biasing spring 61) for biasing the nozzle holding portion in a direction that pushes it upward relative to the base portion.
[0086] According to the technology described in item 7, the nozzle held in the nozzle holder is pushed upward by the biasing means along with the nozzle holder. Therefore, even if polishing progresses and the length (height) of the nozzle body gradually decreases, the part suction surface does not separate from the polishing surface.
[0087] (Item 8) The nozzle polishing apparatus according to item 1, wherein the mounting position of the polishing member with respect to the moving body can be changed in a direction intersecting the direction of movement of the moving body.
[0088] According to the technology in item 8, when updating the polished surface, it is only necessary to change the mounting position of the polishing member on the moving body, eliminating the need for cumbersome work such as removing the polishing member holder from the moving body or reattaching the polishing member to the polishing member holder.
[0089] (Item 9) The nozzle polishing apparatus according to item 1, wherein the moving body is provided with an operating handle (operating handle 101).
[0090] According to the technology described in item 9, the operator can easily and smoothly move the mobile body back and forth.
[0091] (Item 10) The nozzle polishing apparatus according to item 1, further comprising a movement range restricting means (movement range restricting bolt 102) for restricting the movement range of the moving body so that the polishing surface is located above the part suction surface held by the nozzle holding part, regardless of the position of the moving body.
[0092] According to the technology described in item 10, during nozzle polishing, the polishing surface remains in constant contact with the part suction surface. Therefore, the operator can perform the reciprocating motion of the mobile body without having to worry about whether the polishing surface will lose contact with the part suction surface while the mobile body is moving.
[0093] While embodiments of the present disclosure have been described so far, the technology of the present disclosure is not limited to those described above, and various modifications are possible. For example, in the above-described embodiment, the polishing member holder 44 was made up of two relatively movable members (upper holder 91 and lower holder 92) in order to change the mounting position of the polishing member 45 with respect to the movable body 43 in the Y direction, but the configuration does not necessarily have to be like this. For example, the polishing member holder 44 that holds the polishing member 45 may consist of a single member, and the polishing member holder 44 may be configured to be movable in the Y direction with respect to the movable body 43.
[0094] Furthermore, in the above-described embodiment, the mobile body 43 was moved manually by the operator OP, but it may also be configured to move the mobile body 43 using the rotational power of a motor or the like. [Industrial applicability]
[0095] The present invention provides a nozzle polishing device that can polish the component suction surface of a nozzle into a highly flat plane perpendicular to the nozzle axis. [Explanation of symbols]
[0096] 11. Nozzle polishing device 12. Component mounting device 13 nozzles 13M parts suction surface 23 Mounted Heads 24 cameras 25 Nozzle mounting section 31 Nozzle base 32 Nozzle body 33. Tsuba (guard) 36 Groove 41 Base section 42 Nozzle holding part 42J Screw mounting hole 43 Mobile Unit 44 Polishing member holder 45 Abrasive parts 45M polished surface 46 Lifting section 51 Insertion hole 52 Movement-restricting protrusions 53 Rotation-restricting protrusions 55 Plate component mounting screws 59 Guide rod mounting screw 61. Biasing spring (biasing means) 62 Nozzle holder 73 Nozzle holding groove 74 Nozzle retainer mounting screw 74N Knob 83 Slider 91 Upper holding body 92 Lower holding body 93 Linked screws 95 Return spring 97 Upper retainer mounting screw 99 Polishing Member Lifting Screw 100 Knobs 101 Operating handle 102 Movement range restricting bolt (movement range restricting means) JX axis SL relative movement path OP (Operator)
Claims
1. A nozzle polishing device for polishing the component suction surface of a nozzle used in a component mounting device, The base part, A nozzle holding portion is provided on the base portion and holds the nozzle, A polishing member having a flat polishing surface, A moving body moves the polishing member, which has the polishing surface in contact with the component suction surface of the nozzle held in the nozzle holding portion, A nozzle polishing device equipped with [a specific feature].
2. The nozzle polishing apparatus according to claim 1, wherein the moving body comprises a polishing member holder for holding the polishing member, and a lifting unit for raising and lowering the polishing member holder relative to the moving body.
3. The nozzle polishing apparatus according to claim 1, wherein the nozzle holding portion has an insertion hole into which a cylindrical nozzle base portion located on the opposite side of the part suction surface of the nozzle, which is positioned so that the part suction surface faces upward, is inserted from above.
4. The nozzle polishing apparatus according to claim 3, wherein the nozzle holding portion has a movement-restricting projection inside the insertion hole that enters into the nozzle base inserted into the insertion hole and restricts the horizontal movement of the nozzle base.
5. The nozzle polishing apparatus according to claim 3, wherein the nozzle holding portion has a rotation restricting projection inside the insertion hole that engages with the nozzle base inserted into the insertion hole and restricts the movement of the nozzle in the rotational direction about the axis of the nozzle.
6. The nozzle polishing apparatus according to claim 3, further comprising a nozzle holder that presses the nozzle toward the nozzle holding portion while the nozzle base is inserted into the insertion hole.
7. The nozzle polishing apparatus according to claim 1, further comprising a biasing means for biasing the nozzle holding portion in a direction that pushes it upward relative to the base portion.
8. The nozzle polishing apparatus according to claim 1, wherein the mounting position of the polishing member with respect to the moving body can be changed in a direction intersecting the direction of movement of the moving body.
9. The nozzle polishing apparatus according to claim 1, wherein the movable body is provided with an operating handle.
10. The nozzle polishing apparatus according to claim 1, further comprising a movement range restricting means for restricting the movement range of the moving body so that the polishing surface is located above the part suction surface held by the nozzle holding part, regardless of the position of the moving body.