A pick-and-place machine nozzle
By employing a flexible nozzle head and dynamic rigidity adjustment of the buffer medium in the pick-and-place machine nozzle, the problem of traditional nozzles being unable to buffer impacts is solved, enabling safe placement and precise adsorption of components, reducing damage rate and production costs.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- ANHUI LONGCHI QUANTUM TECHNOLOGY CO LTD
- Filing Date
- 2025-06-16
- Publication Date
- 2026-06-16
AI Technical Summary
Traditional pick-and-place machine nozzles cannot effectively buffer the impact and pressure changes caused by external factors during the placement process, leading to component damage and increased production costs.
The nozzle head is made of elastic material and combined with a buffer medium and control components. The flowability of the buffer medium is adjusted by the control components to achieve dynamic rigidity adjustment of the nozzle head and precise control of the suction force.
It reduced the component damage rate, lowered production costs, and improved mounting accuracy and production efficiency.
Smart Images
Figure CN224368211U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of pick and place machine technology, specifically to a pick and place machine nozzle. Background Technology
[0002] In the electronics manufacturing industry, pick-and-place machines are the core equipment in surface mount technology (SMT) production lines. Their function is to precisely mount various electronic components onto designated locations on printed circuit boards (PCBs). With the continuous upgrading and replacement of electronic products, moving towards miniaturization, high performance, and multi-functionality, the component density on PCBs is increasing, and the size of components is decreasing, placing extremely high demands on the precision and stability of the pick-and-place process.
[0003] Traditional pick-and-place machine nozzles mostly employ a rigid design, with the nozzle head making direct, rigid contact with the component. During the placement process, when the nozzle picks up the component and places it on the PCB, minor unevenness on the PCB surface or dimensional tolerances inherent in the component itself mean that the rigid nozzle cannot effectively buffer the impact and pressure changes caused by these external factors. This can lead to excessive stress on the component during placement, causing damage such as chip pin deformation or ceramic capacitor breakage, increasing the scrap rate and production costs. Utility Model Content
[0004] To address the aforementioned issues, this application provides a pick-and-place machine nozzle.
[0005] To achieve the above objectives, this application provides the following technical solution: a pick-and-place machine nozzle, comprising a main body, a nozzle disposed on the bottom of the main body, and a nozzle head disposed at the end of the nozzle, the nozzle head being connected to a buffer mechanism, the nozzle head being made of an elastic material, the nozzle head having a ring-shaped structure, and a buffer cavity being formed inside the ring-shaped structure;
[0006] The buffer mechanism includes a buffer medium connected to the buffer chamber, a control column connected to the nozzle head via a connecting pipe, and a control component mounted on the control column. The control column contains a control chamber, and the buffer medium can flow between the buffer chamber and the control chamber via the connecting pipe.
[0007] The control component controls the flow or fixation of the buffer medium located in the control chamber.
[0008] Preferably, the buffer medium is a magnetorheological fluid, and the control assembly includes a control ring fixedly sleeved on the control column, a spiral coil disposed within the control ring, and a sealing disc that slides through the control cavity via a sealing mechanism.
[0009] Preferably, the helical coil is connected to a current control component, which includes a power supply for providing current to the helical coil, a current controller for adjusting the current magnitude, and a current sensor for real-time monitoring of the current magnitude.
[0010] Preferably, the buffer medium is a flowing liquid, and the control component includes a sealing disc that slides through the control cavity, an iron block that passes through the sealing disc, and multiple miniature electromagnets that are evenly spaced along the length of the control column. By controlling the energization state of the miniature electromagnets, the iron block is attracted and fixed, and the sealing disc is fixed, thereby controlling the fixation of the flowing liquid in the control cavity.
[0011] Preferably, a first through hole is provided in the cavity wall of the control cavity away from the connection between the control column and the connecting pipe, and the first through hole communicates with a plurality of second through holes provided on the side of the control column.
[0012] The beneficial effects of this utility model are:
[0013] 1. By using a flexible nozzle head in conjunction with a buffer medium to dynamically adjust rigidity, the impact force during placement is reduced, thus preventing damage to micro-components.
[0014] 2. By controlling the buffer medium rapidly through the control components, the adhesion rate of the nozzle head is ensured.
[0015] 3. It reduces the damage rate of adsorption elements and the frequency of nozzle replacement, thereby reducing production costs. Attached Figure Description
[0016] The accompanying drawings are provided to further illustrate the present invention and form part of the specification. They are used together with the embodiments of the present invention to explain the present invention, but do not constitute a limitation thereof. In the drawings:
[0017] Figure 1 This is a simplified structural diagram of the pick-and-place machine nozzle proposed in this utility model.
[0018] Figure 2 This is a schematic diagram of the cross-sectional structure of the control component of this utility model.
[0019] Figure 3 This is a schematic diagram of the cross-sectional structure of the nozzle head of this utility model.
[0020] In the diagram: 1. Main body; 2. Suction nozzle; 3. Spring; 4. Suction nozzle head; 5. Control column; 6. Connecting pipe; 7. Control ring; 8. Sealing plate; 9. First through hole; 10. Second through hole; 11. Buffer chamber. Detailed Implementation
[0021] To make the technical means, creative features, and achieved objectives and effects of this utility model easier to understand, the present utility model is further described below with reference to specific embodiments and accompanying drawings. However, the following embodiments are only preferred embodiments of this utility model and not all of them. Other embodiments obtained by those skilled in the art based on the embodiments described in the embodiments without creative effort are all within the protection scope of this utility model.
[0022] Given the problems of traditional pick-and-place machine nozzles and existing improvements, developing a pick-and-place machine nozzle with excellent buffering performance and precise suction force control is of significant practical importance. The pick-and-place machine nozzle proposed in this invention utilizes a nozzle head 4 made of elastic material to form a buffer cavity 11. Combined with a unique buffering mechanism and control components, it can actively adjust the flow of the buffer medium according to the actual situation during the placement process, achieving dynamic control of the buffering performance of the nozzle head 4. Simultaneously, by controlling the flow or fixation of the buffer medium through the control components, precise adjustment of the suction force is indirectly achieved. This effectively solves the problems of insufficient buffering capacity and inaccurate suction force control in traditional nozzles, better meeting the demands of high-speed, high-precision placement and improving production efficiency and product quality in electronic manufacturing.
[0023] Example 1: Reference Figures 1-3 The pick-and-place machine nozzle shown includes a main body 1, a nozzle 2 disposed on the bottom of the main body 1, and a nozzle head 4 disposed at the end of the nozzle 2. The nozzle head 4 is connected to a buffer mechanism. The nozzle head 4 is made of elastic material and has a ring-shaped structure, with a buffer cavity 11 formed inside the ring-shaped structure.
[0024] The buffer mechanism includes a buffer medium connected to the buffer chamber 11, a control column 5 connected to the nozzle head 4 via a connecting pipe 6, and a control component disposed on the control column 5. The control column 5 is provided with a control chamber, and the buffer medium can flow in the buffer chamber 11 and the control chamber via the connecting pipe 6.
[0025] The control component controls the flow or fixation of the buffer medium located in the control chamber.
[0026] In this embodiment, intelligent adsorption and mounting are achieved through the flexible suction head 4 in conjunction with a controllable buffer mechanism. The specific operation process is as follows:
[0027] 1. Adsorption element
[0028] First, the vacuum system and moving device are activated, moving the suction head 4 to the position of the element to be adsorbed. The annular contact surface of the suction head 4 adheres to the surface of the element, and the elastic material (preferably silicone rubber or rubber material) deforms slightly. At this time, because the buffer medium in the buffer chamber 11 is under low pressure and has high fluidity, the suction head 4 remains soft (as shown in the image). Figure 3(A)), during the contact between the nozzle head 4 and the component, the buffer medium in the buffer chamber 11 is compressed and pressurized (e.g., ...). Figure 3 (B) and such Figure 3 (C) forces the buffer medium in the buffer chamber 11 to flow into the control chamber, pushing the sealing disc 8 to slide in the control chamber, ensuring that the contact surface of the nozzle head 4 adapts to the slight unevenness of the component surface. On the one hand, this ensures that the contact surface of the nozzle head 4 and the adsorption surface of the component are closely attached, and on the other hand, it plays a buffering role when the nozzle head 4 contacts the component, avoiding damage to the component.
[0029] 2. Moving components
[0030] When adsorbing the element, the control component controls the buffer medium to be fixed. At this time, the buffer medium in the buffer chamber is relatively stationary and cannot flow. The suction head 4 turns into a rigid state, which avoids the element from shifting when the adsorbing element moves at high speed.
[0031] 3. Component mounting
[0032] The moment the nozzle head 4 contacts the PCB, the pressure sensor detects an increase in the contact force between the nozzle head 4 and the component, and the control component gradually releases the fixing state of the buffer medium; the buffer medium regains its fluidity, and the buffer medium in the buffer cavity 11 flows back to the control cavity through the connecting pipe 6. The elastic nozzle head is deformed under pressure, and the volume of the buffer cavity 11 is reduced, absorbing the impact energy and avoiding damage to the component caused by the impact force generated during mounting.
[0033] like Figure 1 and Figure 2 As shown, the buffer medium is a magnetorheological fluid. The control components include a control ring 7 fixedly sleeved on the control column 5, a spiral coil disposed within the control ring 7, and a sealing disc 8 that slides through the control cavity via a seal. In this embodiment, the intelligent fluid composed of magnetic particles (carbonyl iron powder), carrier liquid (silicone oil), and additives can achieve a liquid-to-semi-solid transition in milliseconds (5-10 ms) under the action of a magnetic field. By controlling the spiral coil to be energized, a magnetic field is generated, which controls the viscosity of the magnetorheological fluid to increase, so that the buffer medium in the buffer cavity 11 is relatively fixed, ensuring the rigid transformation of the nozzle head 4 and ensuring the stability of the nozzle head 4 control element when it moves.
[0034] In this embodiment, the spiral coil is connected to a current control component, which includes a power supply providing current to the spiral coil, a current controller adjusting the current magnitude, and a current sensor monitoring the current magnitude in real time. The dynamic adjustment process of the pick-and-place machine nozzle is as follows: When the nozzle head 4 picks up a component, the control system immediately applies current to the spiral coil, causing the magnetorheological fluid to solidify instantly, and the nozzle head 4 becomes rigid to ensure stable component gripping; at the moment of placement, the system reduces or disconnects the current within milliseconds, the magnetorheological fluid returns to its liquid fluidity, and the nozzle head 4 absorbs impact energy through the elastic deformation of the buffer chamber 11; after placement is completed, the current is completely cut off, and the system automatically resets. The entire process is monitored in real time by a high-precision current sensor and dynamically adjusted by a PID controller, achieving a seamless switch from rigid gripping to flexible buffering, ensuring the stability of high-speed operation, effectively absorbing microscopic impacts, and significantly improving placement accuracy and component safety.
[0035] The buffer medium is a flowing liquid (water). The control components include a sealing disc 8 that slides through the control cavity, an iron block that passes through the sealing disc 8, and multiple miniature electromagnets that are evenly spaced along the length of the control column 5. By controlling the energization state of the miniature electromagnets, the iron block is attracted and fixed, thereby controlling the sealing disc 8 and fixing the flowing liquid in the control cavity.
[0036] In this embodiment, when using a water-based buffer, the operation process includes the following two stages:
[0037] 1. Pick-up and locking phase:
[0038] When the suction head 4 contacts the surface of the component, the suction head 4 is in a flexible state. Under the action of impact force, it will push water from the buffer chamber to the control chamber. After the component is adsorbed, the electromagnet located near the sealing plate 8 is energized to adsorb the iron block in the sealing plate 8, which ensures that the position of the sealing plate 8 in the control chamber is fixed, thus blocking the flow of water medium. The suction head 4 enters a rigid state, ensuring that the suction head 4 firmly grasps the component and moves it at high speed.
[0039] 2. Placement buffer stage:
[0040] When mounting components onto the PCB, the current is interrupted the moment of contact with the PCB. At this moment, the water medium resumes its flow state, allowing the water medium to flow freely. This allows the nozzle head 4 to return to its flexible state. The flexible nozzle head 4 absorbs the impact energy, achieving a smooth transition from rigid to flexible reset preparation stage. This ensures stable component mounting and avoids damage caused by impact during component mounting.
[0041] This embodiment provides adjustable buffering performance while ensuring economy through precise control of water medium flow. Compared with traditional solutions, it has advantages such as simple structure, convenient maintenance, environmental protection and energy saving, and is particularly suitable for high-volume placement operations with medium precision.
[0042] In this embodiment, a first through hole 9 and a second through hole 10 are added. The first through hole 9 is provided on the cavity wall away from the connection between the control column 5 and the connecting pipe 6. The first through hole 9 is connected to a plurality of second through holes 10 provided on the side of the control column 5. The connection between the first through hole 9 and the second through hole 10 ensures that the inside of the control cavity is connected to the outside, so that the sealing plate 8 can slide and seal inside the control cavity.
[0043] like Figure 3 As shown, the state of the suction head 4 is illustrated. Figure (A) is a cross-sectional view of the suction head 4 when it is in a flexible state, and Figures (B) and (C) are cross-sectional views of the suction head 4 when it is in a state of contact and adsorption with the component.
[0044] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely preferred examples and are not intended to limit the utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model. The scope of protection of this utility model is defined by the appended claims and their equivalents.
Claims
1. A pick-and-place machine nozzle, comprising a main body (1), a nozzle (2) disposed on the bottom of the main body (1), and a nozzle head (4) disposed at the end of the nozzle (2), wherein the nozzle head (4) is connected to a buffer mechanism, characterized in that, The nozzle (4) is made of elastic material and has a ring-shaped structure, with a buffer cavity (11) formed inside the ring-shaped structure; The buffer mechanism includes a buffer medium connected to the buffer chamber (11), a control column (5) connected to the nozzle head (4) via a connecting pipe (6), and a control component disposed on the control column (5). The control column (5) is provided with a control chamber, and the buffer medium can flow in the buffer chamber (11) and the control chamber via the connecting pipe (6). The control component controls the flow or fixation of the buffer medium located in the control chamber.
2. The pick-and-place machine nozzle according to claim 1, characterized in that: The buffer medium is magnetorheological fluid, and the control components include a control ring (7) fixedly sleeved on the control column (5), a spiral coil set in the control ring (7), and a sealing disc (8) that slides through the control cavity through a seal.
3. A pick-and-place machine nozzle according to claim 2, characterized in that: The helical coil is connected to a current control component, which includes a power supply that provides current to the helical coil, a current controller that adjusts the current magnitude, and a current sensor that monitors the current magnitude in real time.
4. A pick-and-place machine nozzle according to claim 1, characterized in that: The buffer medium is a flowing liquid. The control components include a sealing disc (8) that slides through the control cavity, an iron block that passes through the sealing disc (8), and multiple miniature electromagnets that are evenly spaced along the length of the control column (5). By controlling the energization state of the miniature electromagnets, the iron block is attracted and fixed, and the sealing disc (8) is fixed, thereby controlling the fixation of the flowing liquid in the control cavity.
5. A pick-and-place machine nozzle according to any one of claims 2 to 4, characterized in that: A first through hole (9) is provided in the cavity wall away from the connection between the control column (5) and the connecting pipe (6), and the first through hole (9) is connected to a plurality of second through holes (10) opened on the side of the control column (5).