Method for manufacturing bonding compositions

Abstract

To provide a method for manufacturing a bonding composition that exhibits excellent adhesion to other components during sintering. [Solution] The present invention relates to a method for manufacturing a bonding composition used to form a bonded structure by sintering, which is placed between two materials to be joined. This manufacturing method involves generating copper particles in a first liquid medium by a wet reduction method to prepare a dispersion of the copper particles. Then, while maintaining the wet state of the dispersion, the first liquid medium of the dispersion is replaced with another liquid medium (excluding the first and second liquid mediums) one or more times, and finally replaced with a second liquid medium. A bonding composition in which the copper particles are dispersed in the second liquid medium is obtained without drying the copper particles. It is also preferable to perform the liquid medium replacement at a temperature below 100°C. It is also preferable to use one or more of water, alcohol, ketone, ester, ether, and hydrocarbon as the second liquid medium.

Claims

1. A method for manufacturing a joining composition used to form a joined structure by joining two materials to be joined, which is placed between the materials to be joined, Copper particles are generated in the first liquid medium by a wet reduction method, and a dispersion of the copper particles is prepared thereafter. A method for producing a bonding composition, comprising: maintaining the wet state of the dispersion, replacing the first liquid medium of the dispersion with another liquid medium (excluding the first and second liquid mediums) one or more times, and finally replacing it with the second liquid medium, to obtain a bonding composition in which the copper particles are dispersed in the second liquid medium without drying the copper particles.

2. The manufacturing method according to claim 1, wherein the liquid medium replacement is performed at a temperature of less than 100°C.

3. The manufacturing method according to claim 1 or 2, wherein one or more of water, alcohol, ketone, ester, ether, and hydrocarbon are used as the second liquid medium.

4. The copper particles are measured by scanning electron microscopy, and the cumulative volume particle size D at 50% of the cumulative volume is measured. SEM50 The manufacturing method according to any one of claims 1 to 3, wherein the wavelength is 100 nm or more and 300 nm or less.

5. The manufacturing method according to any one of claims 1 to 4, wherein the first liquid medium is replaced with another liquid medium while maintaining the wet state of the dispersion.

6. The manufacturing method according to any one of claims 1 to 5, wherein the first liquid medium and the second liquid medium are different from each other.

7. A method for producing a conductive paste comprising a bonding composition obtained by the manufacturing method described in any one of claims 1 to 6.

8. A method for joining materials, comprising placing a joining composition obtained by a manufacturing method according to any one of claims 1 to 6 between two materials to be joined and sintering it to form a joined structure by joining by sintering.

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