Optimization of nitrogen diffusers for dross reduction in wave soldering machines

Abstract

To provide an apparatus and method for manufacturing printed circuit boards. [Solution] A wave soldering machine that performs a wave soldering operation on an electronic circuit board 12 comprises a wave soldering station having a solder pot 30 having a solder material reservoir 32, a flow conduit 34 positioned within the reservoir 32, and a nozzle assembly 36 coupled to the flow conduit 34 to generate a solder wave; a conveyor configured to deliver the electronic circuit board 12 to the station; at least one first gas diffuser configured to provide a gas blanket above the solder wave to supply gas to pass over the solder wave on both sides of the solder wave; and at least one second gas diffuser configured to provide a gas blanket below the solder wave to supply gas below the solder wave on both sides of the solder wave.

Description

【Technical Field】 【0001】 The present disclosure relates generally to apparatuses and methods for manufacturing printed circuit boards, and apparatuses and methods for assisting in the process of soldering metal to integrated circuit boards, and more particularly to a wave soldering machine having a wave soldering nozzle assembly with nitrogen diffusers strategically positioned within the wave soldering station to create a more complete inert atmosphere during the wave soldering process and related methods. 【Background Art】 【0002】 In the manufacture of printed circuit boards, electronic components can be mounted on the printed circuit boards by a process known as "wave soldering." In a conventional wave soldering machine, a conveyor moves a printed circuit board (sometimes referred to as a "PCB") through a flux application station, a preheating station, and finally a wave soldering station on an inclined path. In the wave soldering station, a wave of solder is ejected upward (by a pump) through a wave soldering nozzle and contacts the portion of the printed circuit board to be soldered. 【0003】 Printed wiring boards, circuit boards, and other components are preferably soldered in a gas atmosphere that at least partially reduces the oxygen content. The advantages of soldering in an atmosphere with reduced oxygen content are known. The use of nitrogen diffusers is known. FIG. 1 shows a wave soldering station 2 configured to generate a solder wave. The wave soldering station 2 includes three nitrogen diffusers 4, 6, 8 positioned at known locations within the wave soldering station 2. In such known systems, the nitrogen diffusers 4, 6, 8 are positioned above the solder wave generated by the wave soldering station 2. Thus, an inert atmosphere is created only within the space above the solder wave. 【Summary of the Invention】 【0004】 One aspect of the present disclosure relates to a wave soldering machine for performing a wave soldering operation on an electronic substrate. In one embodiment, the wave soldering machine comprises a wave soldering station comprising a solder pot having a reservoir of solder material, a flow conduit positioned within the reservoir of the solder pot, and a wave soldering nozzle assembly coupled to the flow conduit. The nozzle assembly is configured to generate a solder wave. The wave soldering machine further comprises a conveyor configured to deliver an electronic substrate to the wave soldering station, at least one first gas diffuser configured to supply gas on both sides of the solder wave so as to pass over the solder wave and provide a gas blanket above the solder wave, and at least one second gas diffuser configured to supply gas on both sides of the solder wave below the solder wave and provide a gas blanket below the solder wave. 【0005】 Embodiments of a wave soldering machine may further include configuring at least one first gas diffuser to include two gas diffusers positioned above the solder wave. One of the at least one first gas diffuser may be located on the input side of the solder wave, and another of the at least one first gas diffuser may be located on the discharge side of the solder wave. At least one second gas diffuser may include two gas diffusers positioned below the nozzle assembly and below the solder wave. One of the at least one second gas diffuser may be located below the nozzle assembly on the input side of the solder wave, and another of the at least one second gas diffuser may be located below the nozzle assembly on the discharge side of the solder wave. At least one second gas diffuser may include two gas diffusers positioned below the nozzle assembly and below the solder wave. One of at least one second gas diffuser may be located beneath the nozzle assembly on the solder wave input side, and another of at least one second gas diffuser may be located beneath the nozzle assembly on the solder wave discharge side. Each of the at least one first gas diffuser and the at least one second gas diffuser is coupled to a gas supply configured to deliver an inert gas to the gas diffuser among the at least one first gas diffuser and the at least one second gas diffuser. The nozzle assembly may further comprise a core frame supported by flow conduits and configured to support a solder distribution baffle. 【0006】 Another aspect of the present disclosure relates to a method for providing an inert blanket for a solder wave. In one embodiment, the method includes generating a solder wave in a wave soldering station of a wave soldering machine; delivering an electronic substrate over the solder wave; supplying an inert gas over the solder wave on both sides of the solder wave via at least one first gas diffuser to provide a gas blanket over the solder wave; and supplying an inert gas over the solder wave on both sides of the solder wave via at least one second gas diffuser configured to supply gas below the solder wave to provide a gas blanket below the solder wave. 【0007】 Embodiments of this method may further include delivering an electronic substrate onto a solder wave by moving the electronic substrate on a conveyor. The method may further include positioning two of at least one first gas diffuser above the solder wave. One of the at least one first gas diffuser may be located on the input side of the solder wave, and the other of the at least one first gas diffuser may be located on the discharge side of the solder wave. The method may further include positioning two of at least one second gas diffuser below the nozzle assembly and below the solder wave. One of the at least one second gas diffuser may be located below the nozzle assembly on the input side of the solder wave, and the other of the at least one second gas diffuser may be located below the nozzle assembly on the discharge side of the solder wave. The method may further include positioning two of the at least one second gas diffuser below the nozzle assembly and below the solder wave. One of the at least one second gas diffuser may be located below the nozzle assembly on the solder wave input side, and the other of the at least one second gas diffuser may be located below the nozzle assembly on the solder wave discharge side. Supplying inert gas through at least one first gas diffuser and supplying inert gas through at least one second gas diffuser may include coupling each of the at least one first gas diffuser and at least one second gas diffuser to a gas source configured to deliver inert gas to the gas diffuser among the at least one first gas diffuser and at least one second gas diffuser. 【0008】 A further aspect of the present disclosure relates to a wave soldering station for a wave soldering machine configured to perform a wave soldering operation on an electronic substrate. In one embodiment, the wave soldering station comprises a solder pot having a reservoir of solder material; a flow conduit positioned within the reservoir of the solder pot; a wave soldering nozzle assembly coupled to the flow conduit and configured to generate a solder wave; at least one first gas diffuser configured to supply gas on both sides of the solder wave so as to pass over the solder wave and to provide a gas blanket over the solder wave; and at least one second gas diffuser configured to supply gas on both sides of the solder wave below the solder wave and to provide a gas blanket below the solder wave. 【0009】 Embodiments of a wave soldering station may further include configuring at least one first gas diffuser to include two gas diffusers positioned above the solder wave, one of the at least one first gas diffuser located on the input side of the solder wave and the other of the at least one first gas diffuser located on the output side of the solder wave. At least one second gas diffuser may include two gas diffusers positioned below the nozzle assembly and below the solder wave, one of the at least one second gas diffuser located below the nozzle assembly on the input side of the solder wave and the other of the at least one second gas diffuser located below the nozzle assembly on the output side of the solder wave. 【0010】 The attached drawings are not intended to be drawn to exact scale. In the drawings, each identical or nearly identical component shown in various figures is represented by the same reference numeral. For clarity, not all components are labeled in all drawings. [Brief explanation of the drawing] 【0011】 [Figure 1] This is a cross-sectional view of a wave soldering station having a nitrogen diffuser positioned at a known location within the wave soldering station. [Figure 2] This is a perspective view of a wave soldering machine. [Figure 3] This is a side view of a wave soldering machine, with the outer packaging removed to reveal the internal components of the wave soldering machine. [Figure 4] This is a perspective view of a wave soldering station having a nitrogen diffuser positioned in the location of one embodiment of the present disclosure. [Figure 5] This is a disassembled perspective view of a wave soldering station. [Figure 6] This is a cross-sectional view of a wave soldering station. [Figure 7] This is a magnified cross-sectional view of a wave soldering station. [Figure 8] This is an exploded perspective view of the nitrogen diffuser before it is installed inside the wave soldering nozzle assembly. [Figure 9] Another disassembled perspective view of the nitrogen diffuser before it is installed within the wave soldering nozzle assembly. [Modes for carrying out the invention] 【0012】 This disclosure is not limited to the structural and arrangement details of the components shown in the following description or drawings, which may be used for applications. Other embodiments of this disclosure are possible and can be implemented or performed in various ways. Furthermore, the terms and technical terms used herein are for illustrative purposes only and should not be considered limiting. The use of “including,” “comprising,” “having,” “containing,” “involving,” and variations thereof in this application is intended to include additional items, along with the items listed above and their equivalents. 【0013】 Embodiments of the present disclosure relate to reducing the amount of dross generated during a wave soldering process. In certain embodiments, a nitrogen diffuser is positioned within the wave soldering station of a wave soldering machine, above and below the solder waves generated by the wave soldering station. 【0014】 For illustrative purposes, with reference to Figure 2, embodiments of the present disclosure are described below with respect to a wave soldering machine, shown collectively as 10, used for applying solder to a printed circuit board 12. In some embodiments, the printed circuit board 12 may be referred to as an electronic circuit board. The wave soldering machine 10 is one of several machines in a printed circuit board manufacturing / assembly line. As shown, the wave soldering machine 10 includes a housing or frame 14 adapted to accommodate the machine's components. A conveyor 16 is configured to deliver the printed circuit boards to be processed by the wave soldering machine 10. Upon entering the wave soldering machine 10, each printed circuit board 12 moves along an inclined path (e.g., 6 degrees to the horizontal) along the conveyor 16 through a tunnel 18, which includes a flux application station shown collectively as 20 and a preheating station shown collectively as 22, to prepare the printed circuit board for wave soldering. Once adjusted (i.e., heated), the printed circuit board 12 moves to a wave soldering station, shown collectively as 24, which applies solder material to the printed circuit board. A controller 26 is provided to automate the operation of several stations of the wave soldering machine 10, including, but not limited to, a flux application station 20, a preheating station 22, and a wave soldering station 24, in known ways. 【0015】 Referring to Figure 3, the flux application station 20 is configured to apply flux to printed circuit boards as they move along the conveyor 16 through the wave soldering machine 10. The preheating station includes several preheaters (e.g., preheaters 22a, 22b, and 22c) which are designed to gradually raise the temperature of the printed circuit boards as they move along the conveyor 16 through the tunnel 18 to prepare them for the wave soldering process. As shown in the figure and as will be described in more detail later, the wave soldering station 24 includes a wave soldering nozzle assembly that is in fluid communication with a solder material reservoir. A pump is provided in the reservoir to deliver molten solder material from the reservoir to the wave soldering nozzle assembly. Once soldered, the printed circuit boards move from the wave soldering machine 10 via the conveyor 16 to another station on the production line, such as a pick-and-place machine. 【0016】 In some embodiments, the wave soldering machine 10 may further include a flux management system, shown collectively as 28, which removes volatile contaminants from the tunnel 18 of the wave soldering machine. As shown in Figure 3, the flux management system 28 is located below the preheating station 22. In one embodiment, the flux management system is supported by a housing 14 within the wave soldering machine and is in fluid communication with the tunnel 18, which is schematically shown in Figure 3. The flux management system 28 is configured to receive contaminated gas from the tunnel 18, process the gas, and return clean gas to the tunnel. The flux management system 28 is particularly configured to remove volatile contaminants from the gas, especially in an inert atmosphere. 【0017】 Referring to Figures 4 and 5, in one embodiment, the wave soldering station 24 comprises a solder pot 30 defining a reservoir 32 configured to contain molten solder. In one embodiment, the solder pot 30 is a box-shaped structure supporting the components of the wave soldering station 24, including a flow conduit 34 configured to deliver pressurized molten solder to an opening or nozzle of a wave soldering nozzle assembly shown 36 as a whole. As will be described in more detail later, the wave soldering nozzle assembly 36 is configured to transport molten solder to the bottom of the printed circuit board 12 and to allow a smooth flow of solder back to the reservoir 32. Specifically, the wave soldering nozzle assembly 36 is capable of adjusting the height and width of the solder wave when performing a wave soldering operation. 【0018】 The wave soldering station 24 further comprises two pump impellers, each indicated by 38, positioned within the reservoir 32 of the solder pot 30, adjacent to an inlet provided within the flow conduit 34. The pump impellers 38 pressurize the molten solder in the reservoir 32 and pump the molten solder into the flow conduit 34, which flows vertically through the reservoir toward the wave soldering nozzle assembly 36. In one embodiment, each pump impeller 38 is a centrifugal pump of a suitable size for pumping the molten solder toward the nozzle of the wave soldering nozzle assembly 36. The wave soldering nozzle assembly 36 is configured to generate solder waves provided for mounting components onto the circuit board 12 by the method described herein and to optimize residence time during processing. 【0019】 Referring to Figure 6, the flow conduit 34 comprises two chambers, each chamber having an inlet connected to its respective pump impeller 38. The flow of molten solder to the solder distribution baffle 50 is controlled by controlling the pump impeller 38. The flow of molten solder through the chambers can be controlled independently by controlling the pump impeller 38. As a result, the solder wave can be controlled by operating the pump impeller 38. For example, by blocking one of the pump impellers 38, the solder wave can be controlled so that it extends through the solder distribution baffle 50 at the center of the solder distribution baffle. This configuration significantly reduces the width of the solder wave, thus reducing dross. 【0020】 Referring further to FIG. 7, the wave soldering nozzle assembly 36 includes a nozzle core frame 40 having two end walls 42, 44 and a first longitudinal support element 46 and a second longitudinal support element 48 extending between the end walls 42, 44. The nozzle core frame 40 can further include several transverse support elements extending between the first longitudinal support element 46 and the second longitudinal support element 48. Also, the nozzle core frame 40 guides the solder flow through a nozzle throat defined between the first longitudinal support element 46 and the second longitudinal support element 48. The wave soldering nozzle assembly 36 further includes an elongated solder distribution baffle 50 fixed to the first longitudinal support element 46 of the nozzle core frame 40. The solder distribution baffle 50 is fixed to the first longitudinal support element 46 by screws, for example, through an opening located on the loading side of the solder distribution baffle 50. In one embodiment, one side of the solder distribution baffle 50, i.e., the loading side, is fixed to the first longitudinal support element 46 or formed integrally with the first longitudinal support element 46, and the opposite side of the solder distribution baffle 50, i.e., the discharge side, is fixed to the second longitudinal support element 48 or formed integrally with the second longitudinal support element 48. In one embodiment, the solder distribution baffle 50 has a unique pattern of elongated openings that allow molten solder to flow through the solder distribution baffle 50. 【0021】 In some embodiments, the wave soldering nozzle assembly 36 can further include a dross box configured to be fixed to the nozzle core frame 40 and reduce solder balls that can be formed in the reservoir 32 by reducing the disturbance when the solder returns to the reservoir 32 of the solder pot 30. 【0022】 Aspects of the present disclosure relate to a system that creates a nitrogen or inert blanket above and below a solder wave generated by a wave soldering nozzle assembly 36, shown by dashed line 52 in FIGS. 6 and 7. In one embodiment, the system includes a number of gas diffusers, which may also be referred to as nitrogen tubes or diffusers, and are provided within a reservoir 32 of a solder pot 30 of a wave soldering station 24 to provide an inert atmosphere for the wave soldering process. As shown in FIG. 6, the system includes two gas diffusers 54, 56 positioned on both sides of the solder wave 52 below the cover plate 58 and above the solder wave 52. The two gas diffusers 54, 56 provide an inert blanket above the solder wave 52. One gas diffuser 54 is provided directly below the cover plate 58 on the input side of the solder wave 52. The other gas diffuser 54 is provided directly below the cover plate 58 on the discharge side of the solder wave 52. 【0023】 The system further includes two additional gas diffusers 60, 62 positioned on both sides of the solder wave 52 below the nozzles of the nozzle assembly 36 and below the solder wave 52 to provide an inert blanket below the solder wave 52. One gas diffuser 60 is provided directly below the first longitudinal support element 46 on the input side of the solder wave 52. The other gas diffuser 62 is provided directly below the exit wing 64 of the nozzle assembly 36 on the discharge side of the solder wave 52. By providing the gas diffusers 60, 62 below the solder wave 52, it is ensured that an inert atmosphere exists when the molten solder is returned to the reservoir 32 of the solder pot 30. 【0024】 Figures 8 and 9 show two gas diffusers 60, 62 before they are inserted into the nozzle core frame 40 of the nozzle assembly 36. Each gas diffuser can be manufactured from a porous stainless steel tube. The porosity of the gas diffuser can be optimized to produce a laminar flow of gaseous nitrogen from the gas diffuser. In one embodiment, the gas diffusers 60, 62 are preferably supported by the end walls 42 of the nozzle core frame 40 of the nozzle assembly 36. As shown in the figure, a gas supply source 66 is connected to the gas diffusers 60, 62 by lines 68, 70, respectively. In one embodiment, the gas supply source 66 can be an in situ supply source. Nitrogen, carbon dioxide, and other inert gases can be supplied as shielding gases. An on-site non-cold nitrogen supply can be provided. There are various devices known to produce nitrogen with less than 10 volume percent oxygen present. Gas diffusers 54, 56 located above the solder wave 52 can be configured similarly. 【0025】 In one embodiment, particularly with reference to Figure 9, each gas diffuser 60, 62 is secured to the end wall 42 by a compression joint that rigidly secures the gas diffuser by a compression sleeve and / or ferrule. The compression joint is screw-removable to a threaded joint welded to the end wall 42 of the nozzle core frame 40 in order to secure the gas diffusers 60, 62 to the end wall 42 of the nozzle core frame 40. Gas diffusers 54, 56 are secured to the cover plate 58 in a similar manner. 【0026】 In one embodiment, an inert gas, such as nitrogen, passes through two flow control valves connected to gas diffusers 54 and 56, respectively. Similarly, the inert gas passes through two additional flow control valves connected to gas diffusers 60 and 62, respectively. The flow of the inert gas can range from 200 cubic feet (approximately 5.7 cubic meters) to 600 cubic feet (approximately 17.0 cubic meters) per hour from each set of gas diffusers. The gas supply to the diffusers can be varied by the flow control valves, which control the flow of gas out of slots in the cover plate 58 to both sides of the solder wave 52. In one embodiment, the nitrogen supply can be turned off except when the printed circuit board 12 is passing through the wave soldering station 24. This can be achieved by operating the flow control valves or by shutting off the gas supply. 【0027】 In some embodiments, the positions of the gas diffusers 54 and 56 above the solder wave 52 can be changed to optimize the coverage of the inert blanket above the solder wave 52. Similarly, the positions of the gas diffusers 60 and 62 below the solder wave 52 can be changed to optimize the coverage of the inert blanket below the solder wave 52. Furthermore, the number of gas diffusers provided above and below the solder wave 52 can be changed to optimize the coverage of the inert blanket above and below the solder wave 52. 【0028】 In some embodiments, the gas supply source 66 includes compressed air supplied into the membrane apparatus through a filter. The membrane apparatus includes a membrane that divides the airflow into two parts, one of which is a nitrogen-concentrated portion. In one embodiment, this portion continues along lines to gas diffusers 54, 56 and along another line to gas diffusers 60, 62. The other portion includes an oxygen-concentrated flow portion, which returns to the atmosphere through another line. In one embodiment, the membrane apparatus produces nitrogen with an oxygen content of less than 10 volume percent. 【0029】 Embodiments of this disclosure relate to minimizing dross associated with molten solder. A more complete blanket of inert gas ensures that the molten solder does not oxidize before returning to the reservoir 32 of the solder pot 30. Different combinations of tin, lead, and other metals are used to produce lead-based and lead-free solders. Dross is a mass of solid impurities that floats on the surface of the molten solder or is dispersed within the molten solder. In the case of solder, dross tends to form on the surface of the tin-based molten metal, and oxidized impurities create dross. 【0030】 In another embodiment, a two-stage membrane system can be provided. The oxygen content of the nitrogen is reduced to less than 5% by volume, and in another embodiment, to less than 1000 ppm. Systems for providing nitrogen-enriched airflow using membrane technology are known. When the demand for nitrogen is high, and this depends mainly on soldering conditions, the oxygen concentration will be high. However, when the demand is low, the oxygen concentration will be low. 【0031】 While nitrogen gas is mentioned as a preferred embodiment for the shielding gas, other inert gases can be provided, one example being carbon dioxide. In any case, it is preferable to keep the oxygen content below about 10% by volume. 【0032】 During operation, the circuit board 12 is transported by a conveyor 16 to a wave soldering station 24. The circuit board 12 may be pre-treated with flux at a flux application station 20 and heated at a preheating station 22. As the circuit board 12 moves through the wave soldering station 24, an inert gas curtain is generated by gas diffusers 54, 56 and 60, 62. Specifically, inert gas is supplied via gas diffusers 54, 56 on both sides of the solder wave 52 under the cover plate 58, providing a gas blanket over the solder wave 52. In addition, inert gas is supplied via gas diffusers 60, 62 below the solder wave 52 on both sides, providing a gas blanket below the solder wave 52. For each circuit board 12, the underside of the circuit board 12 moves through the solder wave 52 and is coated with solder in a conventional manner. The circuit board 12 leaves the wave soldering station and is further processed within the printed circuit board manufacturing line. Dross formation in the reservoir 32 of the solder pot 30 is minimized by effective measures taken to keep air away from the solder in the reservoir 32. 【0033】 Various controllers can perform the various operations discussed above. For example, as discussed above, a controller such as controller 26 can, among other operations, control components of the wave soldering machine 10, including the wave soldering station 24. Using data stored in associated memory and / or storage, a controller can execute one or more instructions stored in one or more non-temporary computer-readable media that the controller may have and / or be coupled with, thereby manipulating data. In some examples, a controller may include one or more processors or other types of controllers. In one example, a controller is or includes at least one processor. In another example, a controller uses, in addition to or instead of a general-purpose processor, an application-specific integrated circuit tuned to perform a particular operation to perform at least some of the operations discussed above. As these examples illustrate, the examples provided herein can perform the operations described herein using many specific combinations of hardware and software, and the disclosure is not limited to any specific combination of hardware and software components. Examples of the present disclosure may include computer program products configured to perform the methods, processes, and / or operations discussed above. These computer program products may be, or include, one or more controllers and / or processors configured to perform instructions for the methods, processes, and / or operations discussed above. 【0034】 According to each embodiment, the solder flow through the nozzle can be controlled to reduce and even prevent the recirculation of dross through the nozzle. Dross is reduced by reducing the width of the solder wave. Each embodiment makes it possible to reduce the width of the solder wave. 【0035】 In some embodiments, as described above, the wave soldering nozzle assembly further comprises a dross box fixed to the nozzle frame and configured to further reduce solder balls that may form in the reservoir by reducing disturbances as the solder returns to the reservoir. 【0036】 While several aspects of at least one embodiment of this disclosure have been described, it should be understood that various modifications, changes, and improvements will readily come to mind for those skilled in the art. Such modifications, changes, and improvements are intended to be part of this disclosure and to be within the spirit and scope of this disclosure. Accordingly, the above descriptions and drawings are merely illustrative.

Claims

[Claim 1] A wave soldering machine that performs a wave soldering operation on an electronic circuit board, A wave soldering station comprising: a solder pot having a solder material reservoir; a flow conduit positioned within the reservoir of the solder pot; and a wave soldering nozzle assembly coupled to the flow conduit, configured to generate solder waves; A conveyor configured to deliver electronic circuit boards to the wave soldering station, At least one first gas diffuser configured to supply gas on both sides of the solder wave so as to pass over the solder wave and to provide a gas blanket over the solder wave, At least one second gas diffuser configured to supply gas below the solder wave on both sides of the solder wave and to provide a gas blanket below the solder wave, A wave soldering machine equipped with [a specific feature / feature]. [Claim 2] The wave soldering machine according to claim 1, wherein the at least one first gas diffuser includes two gas diffusers positioned above the solder wave. [Claim 3] The wave soldering machine according to claim 2, wherein one of the at least one first gas diffuser is provided on the solder wave input side, and another of the at least one first gas diffuser is provided on the solder wave discharge side. [Claim 4] The wave soldering machine according to claim 2, wherein the at least one second gas diffuser includes two gas diffusers positioned below the nozzle assembly and below the solder wave. [Claim 5] The wave soldering machine according to claim 4, wherein one of the at least one second gas diffuser is provided below the nozzle assembly on the solder wave input side, and another of the at least one second gas diffuser is provided below the nozzle assembly on the solder wave discharge side. [Claim 6] The wave soldering machine according to claim 1, wherein the at least one second gas diffuser includes two gas diffusers positioned below the nozzle assembly and below the solder wave. [Claim 7] The wave soldering machine according to claim 6, wherein one of the at least one second gas diffuser is provided below the nozzle assembly on the solder wave input side, and another of the at least one second gas diffuser is provided below the nozzle assembly on the solder wave discharge side. [Claim 8] The wave soldering machine according to claim 1, wherein each of the at least one first gas diffuser and the at least one second gas diffuser is coupled to a gas supply source configured to deliver an inert gas to the gas diffuser among the at least one first gas diffuser and the at least one second gas diffuser. [Claim 9] The wave soldering machine according to claim 1, wherein the nozzle assembly further comprises a core frame supported by the flow conduit, the core frame configured to support a solder distribution baffle. [Claim 10] A method for providing an inert blanket for solder waves, Generating the solder wave within the wave soldering station of the wave soldering machine, Delivering an electronic substrate onto the aforementioned solder wave, Supplying an inert gas via at least one first gas diffuser configured to supply gas on both sides of the solder wave so as to pass over the solder wave and to provide a gas blanket over the solder wave, Supplying an inert gas via at least one second gas diffuser configured to supply gas below the solder wave on both sides of the solder wave and to provide a gas blanket below the solder wave, Methods that include... [Claim 11] The method according to claim 10, wherein delivering the electronic substrate onto the solder wave includes moving the electronic substrate on a conveyor. [Claim 12] The method according to claim 10, further comprising positioning two of the at least one first gas diffusers on the solder wave. [Claim 13] The method according to claim 12, wherein one of the at least one first gas diffuser is provided on the solder wave input side, and another of the at least one first gas diffuser is provided on the solder wave discharge side. [Claim 14] The method according to claim 12, further comprising positioning two of the at least one second gas diffuser below the solder wave. [Claim 15] The method according to claim 14, wherein one of the at least one second gas diffuser is provided beneath the nozzle assembly on the solder wave input side, and another of the at least one second gas diffuser is provided beneath the nozzle assembly on the solder wave discharge side. [Claim 16] The method according to claim 10, further comprising positioning two of the at least one second gas diffuser below the solder wave. [Claim 17] The method according to claim 16, wherein one of the at least one second gas diffuser is provided beneath the nozzle assembly on the solder wave input side, and another of the at least one second gas diffuser is provided beneath the nozzle assembly on the solder wave discharge side. [Claim 18] The method according to claim 10, wherein supplying the inert gas through the at least one first gas diffuser and supplying the inert gas through the at least one second gas diffuser includes coupling each of the at least one first gas diffuser and the at least one second gas diffuser to a gas supply source configured to deliver the inert gas to the gas diffuser among the at least one first gas diffuser and the at least one second gas diffuser. [Claim 19] A wave soldering station for a wave soldering machine configured to perform wave soldering operations on an electronic circuit board, A soldering pot having a reservoir for soldering material, A flow conduit positioned within the reservoir of the solder pot, A wave soldering nozzle assembly coupled to the flow conduit, comprising a wave soldering nozzle assembly configured to generate solder waves, At least one first gas diffuser configured to supply gas on both sides of the solder wave so as to pass over the solder wave and to provide a gas blanket over the solder wave, At least one second gas diffuser configured to supply gas below the solder wave on both sides of the solder wave and to provide a gas blanket below the solder wave, A wave soldering station equipped with [specific feature]. [Claim 20] Wave soldering station according to claim 19, wherein the at least one first gas diffuser comprises two gas diffusers positioned above the solder wave, one of the at least one first gas diffuser provided on the input side of the solder wave, and the other of the at least one first gas diffuser provided on the discharge side of the solder wave; and the at least one second gas diffuser comprises two gas diffusers positioned below the nozzle assembly and below the solder wave, one of the at least one second gas diffuser provided below the nozzle assembly on the input side of the solder wave, and the other of the at least one second gas diffuser provided below the nozzle assembly on the discharge side of the solder wave.

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