Method for manufacturing adhesive films and electronic devices

Abstract

This invention provides an adhesive film with improved performance balance in overall thickness accuracy, antistatic properties, and surface texture absorption. [Solution] An adhesive film comprising a base layer, an antistatic layer, a cross-linked surface-absorbing layer, and an adhesive layer in this order, wherein the combined thickness of the surface-absorbing layer and the adhesive layer is 40 μm or more, and at least one of the surface-absorbing layer and the adhesive layer contains an ion-conductive additive.

Claims

1. The material comprises, in this order, a base layer, an antistatic layer, a cross-linked layer that absorbs unevenness, and an adhesive layer. The sum of the thicknesses of the unevenness-absorbing layer and the adhesive layer is 40 μm or more. An adhesive film in which at least one of the unevenness-absorbing layer and the adhesive layer contains an ion-conductive additive.

2. The adhesive film according to claim 1, wherein the unevenness-absorbing layer includes a layer formed from a resin composition containing a (meth)acrylic resin.

3. The adhesive film according to claim 2, wherein the resin composition further comprises a crosslinking agent.

4. The adhesive film according to claim 3, wherein the content of the crosslinking agent is 0.01% by mass or more and 30.0% by mass or less, when the total solid content of the resin composition is considered to be 100% by mass.

5. The adhesive film according to any one of claims 1 to 4, wherein both the unevenness-absorbing layer and the adhesive layer contain the ion-conductive additive.

6. The adhesive film according to any one of claims 1 to 5, wherein the ion-conductive additive comprises one or more selected from the group consisting of cationic surfactants, anionic surfactants, amphoteric surfactants, and ionic liquids.

7. The adhesive film according to any one of claims 1 to 6, wherein the content of the ion conductive additive in the unevenness-absorbing layer and the adhesive layer is 0.01% by mass or more and 10.0% by mass or less when the total of the unevenness-absorbing layer and the adhesive layer is 100% by mass.

8. The adhesive film according to any one of claims 1 to 7, wherein the thickness of the adhesive layer is 1 μm or more and 50 μm or less.

9. The adhesive film according to any one of claims 1 to 8, wherein the adhesive layer comprises a (meth)acrylic adhesive.

10. The adhesive film according to any one of claims 1 to 9, wherein the thickness of the unevenness-absorbing layer is 30 μm or more and 500 μm or less.

11. The adhesive film according to any one of claims 1 to 10, wherein the resin constituting the base layer comprises one or more selected from the group consisting of polypropylene, polyethylene terephthalate, polyethylene naphthalate, polyamide, polyimide, and ethylene vinyl acetate copolymer.

12. The adhesive film according to any one of claims 1 to 11, wherein the thickness of the substrate layer is 10 μm or more and 500 μm or less.

13. The adhesive film according to any one of claims 1 to 12, wherein the antistatic layer comprises one or more selected from the group consisting of a polythiophene-based conductive polymer, a polypyrrole-based conductive polymer, a polyaniline-based conductive polymer, a poly(p-phenylenevinylene)-based conductive polymer, and a polyquinoxaline-based conductive polymer.

14. The adhesive film according to any one of claims 1 to 13, wherein the thickness of the antistatic layer is 0.01 μm or more and 10 μm or less.

15. A step of preparing a structure comprising an electronic component having a circuit-forming surface and an adhesive film bonded to the circuit-forming surface side of the electronic component, A step of back-grinding the side of the electronic component opposite to the circuit formation side, A method for manufacturing an electronic device comprising at least the following: A method for manufacturing an electronic device, wherein the adhesive film is the adhesive film described in any one of claims 1 to 14.

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