Inspection apparatus, film deposition apparatus, inspection method, and method for manufacturing electronic devices

Abstract

To provide a technology that improves the convenience of measuring the film thickness of a deposited film on a substrate. [Solution] The inspection apparatus of the present invention comprises a measuring means for optically measuring the film thickness by irradiating a film formed on a substrate with light, and an electrostatic chuck for adsorbing the substrate by electrostatic force when the measuring means is used for measurement. The electrostatic chuck adsorbs the substrate such that a predetermined range located in the direction of the light irradiated by the measuring means does not overlap with the substrate when the measuring means is used for measurement.

Claims

1. An inspection device, A measuring means for optically measuring the film thickness by irradiating a film deposited on a substrate with light, An electrostatic chuck that attracts the substrate by electrostatic force during measurement by the aforementioned measuring means, Equipped with, The electrostatic chuck is characterized in that, during measurement by the measuring means, it attracts the substrate such that a predetermined range located in the direction of the light irradiated by the measuring means does not overlap with the substrate.

2. The electrostatic chuck has an opening, The inspection apparatus according to claim 1, characterized in that the electrostatic chuck holds the substrate such that, when measurement is performed by the measuring means, the predetermined range located in the direction of irradiation of light irradiated from the measuring means overlaps with the opening.

3. The inspection apparatus according to claim 2, characterized in that a stress distribution section for distributing stress is arranged at the end of the opening.

4. The aforementioned opening has a slit shape, The inspection apparatus according to claim 3, characterized in that the stress distribution portion is a cylindrical through-hole having a diameter larger than the slit width of the opening.

5. The inspection apparatus according to claim 3, characterized in that the stress distribution portion is an opening positioned on a plane parallel to the substrate adsorption surface of the electrostatic chuck and not overlapping with the opening.

6. The inspection apparatus according to claim 3, characterized in that the stress distribution portion is formed on the surface opposite to the substrate adsorption surface of the electrostatic chuck and is a recess having a larger area than the opening on a surface parallel to the substrate adsorption surface.

7. The electrostatic chuck has multiple openings, The inspection apparatus according to claim 1, characterized in that the electrostatic chuck holds the substrate such that, when measurement is performed by the measuring means, the predetermined range located in the direction of irradiation of light irradiated from the measuring means overlaps with one of the plurality of openings.

8. The system further comprises a support means for supporting the substrate, The inspection apparatus according to claim 7, characterized in that the support means supports the substrate such that the support means and the plurality of apertures do not overlap in the irradiation direction of the light irradiated by the measuring means.

9. The electrostatic chuck holds the substrate such that the substrate extends outside the adsorption surface of the electrostatic chuck. The inspection apparatus according to claim 1, characterized in that the electrostatic chuck irradiates the film formed on the substrate, which is stretched to the outside of the adsorption surface, with light when the measurement is performed by the measuring means.

10. The electrostatic chuck is connected to a frame that extends outward from the suction surface and faces the substrate. An opening is formed by the frame, or by the frame and the electrostatic chuck. The inspection apparatus according to claim 9, characterized in that the electrostatic chuck holds the substrate such that, when measurement is performed by the measuring means, the predetermined range located in the direction of irradiation of the light irradiated from the measuring means overlaps with the opening.

11. The inspection apparatus according to claim 1, characterized in that within the predetermined range, there is no layer with a higher reflectivity than the film to be measured whose film thickness is measured by the measuring means.

12. The electrostatic chuck has two electrodes, The inspection apparatus according to claim 2, characterized in that the opening is positioned between the two electrodes on a plane parallel to the adsorption surface of the electrostatic chuck.

13. The electrostatic chuck has electrodes, The inspection apparatus according to claim 2, characterized in that the opening is arranged so as to be surrounded by the electrodes on a plane parallel to the adsorption surface of the electrostatic chuck.

14. The electrostatic chuck holds the substrate downwards, The inspection apparatus according to claim 1, characterized in that the measuring means irradiates the substrate with light from below.

15. A film deposition chamber for depositing a film onto a substrate, The inspection apparatus according to claim 1, A film deposition apparatus characterized by comprising the following features.

16. The aforementioned film deposition apparatus is a cluster-type deposition apparatus. The film deposition apparatus according to claim 15, characterized in that the inspection device is provided in a transfer room to which substrates discharged from the film deposition chamber are transported.

17. An inspection method performed by an inspection device, The inspection apparatus includes an adsorption step in which the substrate is attracted by electrostatic force using an electrostatic chuck, The measurement step includes optically measuring the film thickness by irradiating light onto a film formed in a predetermined area of ​​the substrate adsorbed by the adsorption step, The inspection method is characterized in that the electrostatic chuck, in the measurement step, adsorbs the substrate such that the predetermined range located in the direction of the irradiated light does not overlap with the substrate.

18. The film deposition process involves forming a film on the substrate, The inspection method according to claim 17 includes an inspection step of inspecting the film formed in the film formation step, A method for manufacturing an electronic device characterized by the following:

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