IC chip movement detection system, IC chip movement detection method, and method for manufacturing an IC chip mounting substrate.

Abstract

The present invention provides an IC chip movement detection system comprising: an imaging unit that captures first and second images including an IC chip and a wiring board at first and second time points; a wiring position identification unit that identifies first and second wiring positions of the wiring board in the first and second images; a chip position identification unit that identifies first and second chip positions of the IC chip in the first and second images using feature points on the surface of the IC chip in the first and second images; a relative position calculation unit that calculates a first relative position, which is the relative position of the IC chip and the wiring board at first time point, and calculates a second relative position, which is the relative position of the IC chip and the wiring board at second time point; and a movement detection unit that detects changes in the relative positional relationship of the IC chip and the wiring board based on the first and second relative positions.

Description

Technical Field

[0001] The present invention relates to an IC chip movement detection system, an IC chip movement detection method, and a method for manufacturing an IC chip mounting substrate.

Background Art

[0002] Patent Document 1 describes "a semiconductor device including a support, an adhesive resin layer composed of two layers formed on the support, an insulating layer and a redistribution layer formed on the adhesive resin layer, a chip layer, and a mold resin layer, wherein the adhesive resin layer includes, in order from the support side, a resin layer A containing a resin decomposable by light irradiation and a resin layer B containing a non-silicone thermoplastic resin, the resin decomposable by light irradiation is a resin containing a condensed ring in the main chain, and the resin layer B has a storage elastic modulus E of 1 to 500 MPa and a tensile fracture strength of 5 to 50 MPa at 25°C." (Claim 1). Patent Document 2 describes a method for manufacturing a resin molded product, in which the inner surface of a cavity recess provided in a lower mold is covered with a process release film, and molding resin is supplied to the cavity recess, and the product to be molded is clamped and compression molded between an upper mold and a lower mold, comprising the steps of setting the process release film, the molding resin and the product to be molded in a mold, air sucking the process release film from the lower mold side to air-adhere to the inner surface of the cavity recess, and optionally bringing the upper mold and the lower mold into contact to form a cavity that is air-sealed from the outside, and using an air suction mechanism to remove air from the cavity through a flow path provided in communication with the cavity A method for manufacturing a resin molded product comprising the steps of: evacuating the vacuum; clamping the upper mold and the lower mold to the compression molding position; curing the resin for the mold; and, in this order, the tensile strength of the process release film in at least one direction when stretched by 37.5% at 100 mm / min at a temperature of 175°C is between 1.0 MPa and 10.0 MPa, and when the process release film is stretched by 37.5% in at least one direction under the same conditions, left to stand for 2 minutes, and then returned to the origin direction in the compression direction at 100 mm / min, the recovery rate (%) obtained from the return value, which is the displacement until the load becomes 0, according to the following formula (1), is 30 to 80 (%). Claim 1 states: "Return value / elongation length × 100 = recovery rate %...(1)." [Prior art document] [Patent] [Patent Document 1] Japanese Unexamined Patent Publication No. 2018-164002 [Patent Document 2] Japanese Unexamined Patent Publication No. 2020-19264 [Overview of the project]

[0003] In a first aspect of the present invention, an IC chip movement detection system is provided for detecting the movement of the relative position between an IC chip and a wiring board. The IC chip movement detection system comprises an imaging unit, a wiring position identification unit, a chip position identification unit, a relative position calculation unit, and a movement detection unit. The imaging unit may capture a first image including the IC chip and the wiring board at a first time point. The imaging unit may capture a second image including the IC chip and the wiring board at a second time point following the first time point. The wiring position identification unit may identify a first wiring position of the wiring board in the first image. The wiring position identification unit may identify a second wiring position of the wiring board in the second image. The chip position identification unit may use feature points on the surface of the IC chip in the first and second images to identify a first chip position of the IC chip in the first image and a second chip position of the IC chip in the second image. The relative position calculation unit may calculate a first relative position, which is the relative position of the IC chip and the wiring board at a first time point, based on the first wiring position and the first chip position. The relative position calculation unit may calculate a second relative position, which is the relative position of the IC chip and the wiring board at a second time point, based on the second wiring position and the second chip position. The movement detection unit may detect changes in the relative positional relationship of the IC chip and the wiring board based on the first relative position and the second relative position.

[0004] In the above, the wiring position identification unit may identify the first wiring position and the second wiring position by identifying the position of alignment marks provided on the wiring board.

[0005] In the above, the wiring position identification unit may identify the first wiring position and the second wiring position using the pixel values ​​of the alignment marks.

[0006] In the above, the wiring position identification unit may identify the first wiring position and the second wiring position using the difference in pixel values ​​of adjacent pixels of the alignment mark.

[0007] In the above, the alignment marks may have convex or concave angles. The wiring position identification unit may identify the first wiring position and the second wiring position by identifying the position of the convex or concave angle.

[0008] In the above, the chip position identification unit may include a feature point detection unit, a mapping unit, and a position identification unit. The feature point detection unit may detect feature points on the surface of the IC chip in the first image and the second image. The mapping unit may associate feature points in the first image with feature points in the second image. The position identification unit may identify the first chip position and the second chip position from the positions of the associated feature points.

[0009] In the above, the relative position calculation unit may calculate the first relative position and the second relative position by averaging the movements of a plurality of associated feature points.

[0010] In the above, the chip position identification unit may use an ORB (Oriented Fast Rotated Brief) to set feature points and identify the first chip position and the second chip position.

[0011] In the above, the first time point may be before the resin encapsulation process for the IC chip. The second time point may be after the resin encapsulation process for the IC chip.

[0012] A second aspect of the present invention provides an IC chip movement detection method for detecting the movement of the relative position between an IC chip and a wiring board. The IC chip movement detection method comprises an image capture step, a wiring position identification step, a chip position identification step, a relative position calculation step, and a movement detection step. In the image capture step, a first image including the IC chip and the wiring board at a first time point may be captured. In the image capture step, a second image including the IC chip and the wiring board at a second time point following the first time point may be captured. In the wiring position identification step, a first wiring position of the wiring board in the first image may be identified. In the wiring position identification step, a second wiring position of the wiring board in the second image may be identified. In the chip position identification step, a first chip position of the IC chip in the first image and a second chip position of the IC chip in the second image may be identified using feature points on the surface of the IC chip in the first and second images. In the relative position calculation step, a first relative position, which is the relative position of the IC chip and the wiring board at a first time point, may be calculated based on the first wiring position and the first chip position. In the relative position calculation stage, a second relative position, which is the relative position of the IC chip and the wiring board at a second time point, may be calculated based on the second wiring position and the second chip position. In the movement detection stage, a change in the relative positional relationship of the IC chip and the wiring board may be detected based on the first relative position and the second relative position.

[0013] A third aspect of the present invention provides a method for manufacturing an IC chip mounting substrate. The method for manufacturing an IC chip mounting substrate comprises a mounting step, a first imaging step, a sealing step, a second imaging step, a wiring position identification step, a chip position identification step, a relative position calculation step, and a movement detection step. In the mounting step, an IC chip may be mounted on the wiring substrate. In the first imaging step, a first image including the IC chip and the wiring substrate may be captured at a first time. In the sealing step, the IC chip may be resin-sealed. In the second imaging step, a second image including the IC chip and the wiring substrate may be captured at a second time. In the wiring position identification step, the first wiring position of the wiring substrate in the first image may be identified. In the wiring position identification step, the second wiring position of the wiring substrate in the second image may be identified. In the chip position identification step, the first chip position of the IC chip in the first image and the second chip position of the IC chip in the second image may be identified using feature points on the surface of the IC chip in the first and second images. In the relative position calculation stage, a first relative position, which is the relative position of the IC chip and the wiring board at a first time, may be calculated based on the first wiring position and the first chip position. In the relative position calculation stage, a second relative position, which is the relative position of the IC chip and the wiring board at a second time, may be calculated based on the second wiring position and the second chip position. In the movement detection stage, a change in the relative positional relationship of the IC chip and the wiring board may be detected based on the first relative position and the second relative position.

[0014] It should be noted that the above summary of the invention does not enumerate all of its features. Furthermore, subcombinations of these features may also constitute an invention. [Brief explanation of the drawing]

[0015] [Figure 1] The configuration of the IC chip movement detection system according to this embodiment is shown. [Figure 2] An example of the configuration of the chip positioning unit 130 is shown. [Figure 3] An example of a flow chart for the manufacturing method of an IC chip mounting substrate according to this embodiment is shown. [Figure 4]An example of the wiring board 20 at the mounting stage is shown. [Figure 5] An example of the first image 500 according to the present embodiment is shown. [Figure 6] An example of the wiring board 20 at the sealing stage is shown. [Figure 7] An example of the second image 700 according to the present embodiment is shown. [Figure 8] An example of a method for specifying the first wiring position of the first image 500 in S500 is shown. [Figure 9] An example of a graph of pixel values on line B' - B in the first image 500 is shown. [Figure 10] An example of a graph of pixel values on line A' - A in the first image 500 is shown. [Figure 11] An example of the difference in pixel values in the graph of FIG. 9 is shown. [Figure 12] An example of the difference in pixel values in the graph of FIG. 10 is shown. [Figure 13] An example of a method for specifying the second wiring position of the second image 700 in S500 is shown. [Figure 14] An example of the sub - flow of S600 of the flow according to FIG. 3 is shown. [Figure 15] An example of the feature points detected in the first image 500 is shown. [Figure 16] An example of the feature points detected in the second image 700 is shown. [Figure 17] An example of the first relative position in the first image 500 is shown. [Figure 18] An example of the second relative position in the second image 700 is shown. [Figure 19] An example of the processing of S800 by the movement detection unit 150 is shown. [Figure 20] An example of an actual IC chip and an alignment - mark image is shown. [Figure 21] An example of a computer 2200 in which multiple aspects of the present invention may be embodied in whole or in part is shown.

Mode for Carrying Out the Invention

[0016] The present invention will be described below through embodiments of the invention, but these embodiments are not intended to limit the invention as defined in the claims. Furthermore, not all combinations of features described in the embodiments are necessarily essential to the solution of the invention.

[0017] Figure 1 shows the configuration of the IC chip movement detection system 10 according to this embodiment. The IC chip movement detection system 10 detects the movement of the relative position between the IC chip and the wiring board. After the IC chip is mounted on the wiring board, other processes such as resin encapsulation may be performed. For example, the IC chip movement detection system 10 detects whether or not the IC chip has moved relative to the wiring board in the other process. The IC chip movement detection system 10 includes an imaging unit 110, a wiring position identification unit 120, a chip position identification unit 130, a relative position calculation unit 140, and a movement detection unit 150.

[0018] The IC chip movement detection system 10 may be a computer such as a PC (personal computer), tablet computer, smartphone, workstation, server computer, or general-purpose computer, and may also be a computer system in which multiple computers are connected.

[0019] Alternatively, the IC chip movement detection system 10 may be a dedicated computer designed for IC chip movement detection, or dedicated hardware implemented by a dedicated circuit. The IC chip movement detection system 10 may be implemented by a single device (computer), or by multiple devices with assigned roles. In the IC chip movement detection system 10, although not specifically described below, memory / hard disk, etc., are provided, and information necessary for processing is stored as appropriate, and information is transmitted between each processing module such as the wiring position identification unit 120 and the chip position identification unit 130.

[0020] The imaging unit 110 captures images including the IC chip and wiring. For example, the imaging unit 110 captures a first image including the IC chip and wiring board at a first time point, and a second image including the same IC chip and wiring board at a second time point. The second time point may be a time after another process, such as resin encapsulation, has been performed after the first time point. The imaging unit 110 may be connected to an image sensor and acquire image data from the image sensor. The imaging unit 110 may perform image processing on the captured image data as necessary to acquire the first and second images.

[0021] The wiring position identification unit 120 identifies the first wiring position of the wiring board in the first image and the second wiring position of the wiring board in the second image. For example, the wiring position identification unit 120 may identify the first and second wiring positions by identifying the positions of alignment marks provided on the wiring board. A specific method will be described later.

[0022] The chip position identification unit 130 uses feature points on the surface of the IC chip in the first image and the second chip position of the IC chip in the second image to identify the first chip position in the first image and the second chip position of the IC chip in the second image. For example, the chip position identification unit 130 may use an ORB (Oriented Fast Rotated Brief) to set feature points and identify the first chip position and the second chip position.

[0023] Figure 2 shows an example of the configuration of the chip positioning unit 130. The chip positioning unit 130 includes a feature point detection unit 132, a matching unit 134, and a positioning unit 136.

[0024] The feature point detection unit 132 detects feature points on the surface of the IC chip in the first image and the second image.

[0025] The matching unit 134 associates the feature points in the first image detected by the feature point detection unit 132 with the feature points in the second image.

[0026] The position identification unit 136 identifies the first chip position and the second chip position from the positions of the feature points associated with the correspondence unit 134.

[0027] The relative position calculation unit 140 calculates a first relative position, which is the relative position of the IC chip and the wiring board at a first time, based on the first wiring position and the first chip position. The relative position calculation unit 140 calculates a second relative position, which is the relative position of the IC chip and the wiring board at a second time, based on the second wiring position and the second chip position.

[0028] The movement detection unit 150 detects changes in the relative positional relationship between the IC chip and the wiring board based on the first relative position and the second relative position. For example, the movement detection unit 150 may detect the difference between the first relative position and the second relative position as a change in positional relationship.

[0029] Figure 3 shows an example of a flow chart of the manufacturing method for an IC chip mounting substrate according to this embodiment. The IC chip movement detection system 10 manufactures the IC chip mounting substrate by executing each of the processes S100 to S800, for example. It also detects the movement of the IC chip by executing S200 to S800. The order of the processes S100 to S800 may be changed, and some processes may be omitted.

[0030] First, in S100, the mounting stage is performed in which the IC chip is mounted on the wiring board. The wiring board may be one on which rewiring for connection to the IC chip is provided. For example, the substrate may be a semiconductor wafer such as siliconware, a resin substrate, or a glass substrate. The substrate may function as a carrier in the fan-out package manufacturing process and be peeled off and removed later. The materials, formation methods, and designs of the substrate and rewiring layer are not particularly limited.

[0031] One or more IC chips may be mounted on the wiring board. The mounting stage may be performed so that the bumps on the IC chip are connected to the rewiring.

[0032] Figure 4 shows an example of a wiring board 20 during the mounting stage. As shown in the figure, the wiring board 20 includes a carrier 30 and a redistribution layer 40. The redistribution layer 40, on which redistribution is provided, is provided on one side of the carrier 30. The IC chip 50 is mounted and fixed onto the wiring board 20 via the redistribution layer 40.

[0033] Next, in S200, the imaging unit 110 performs a first imaging step in which it captures a first image including the IC chip and the wiring board. The first image is assumed to have been captured at the first time step.

[0034] The imaging unit 110 captures a first image such that at least a portion of the IC chip and at least a portion of the wiring board are included in the same image. The imaging unit 110 may capture the first image such that alignment marks provided on the wiring board are included in the image. Alignment marks are provided on the surface of the wiring board and are marks that serve as a reference for the position of the wiring board. Alignment marks may have convex or concave angles. For example, alignment marks may be triangles, quadrilaterals, polygons with pentagons or more, crosses, or star shapes. As an example, alignment marks may be shapes that include a pair of two orthogonal lines.

[0035] The imaging unit 110 may use an optical system such as a lens to magnify and image the area containing the IC chip and the wiring board. The imaging unit 110 may also use a sufficiently large field of view so that both the IC chip and the wiring board can be captured in a single image even if they move later.

[0036] The wavelength used by the imaging unit 110 for imaging is not particularly limited. For example, the imaging unit 110 may perform imaging using visible light, infrared light, or X-rays.

[0037] The imaging unit 110 may capture the first image from the IC chip side (upper side of Figure 4). Alternatively, the imaging unit 110 may capture the first image from the opposite side of the IC chip (lower side of Figure 4).

[0038] Figure 5 shows an example of the first image 500 according to this embodiment. As shown in the figure, the first image 500 includes a cross-shaped alignment mark 520 placed on the redistribution layer 530 of the wiring board 20, and a part of the IC chip 510 (for example, the lower left portion) in the image.

[0039] If multiple IC chips 510 are mounted on the wiring board 20, the S200 process may be performed on only one IC chip. Alternatively, the S200 process may be performed on all IC chips or on two or more selected IC chips. If the S200 process is performed on multiple IC chips, the subsequent S300 to S800 processes may be performed for each IC chip.

[0040] Next, in S300, a sealing step is performed in which the IC chip is sealed with resin. In the sealing step, the area around the IC chip is sealed with sealing resin. When the imaging unit 110 takes images from the IC chip side (upper side of Figure 4), the sealing resin is transparent to the wavelength used for imaging. For example, the sealing step may be performed by pouring molten resin around the IC chip using a mold, etc., and then cooling it. If necessary, a part of the sealing resin may be ground during sealing. If grinding exposes the area necessary for measuring the amount of IC chip movement, the sealing resin may be opaque to the wavelength used for imaging.

[0041] Figure 6 shows an example of a wiring board 20 during the encapsulation stage. As shown in the figure, a package containing the IC chip 50 is manufactured by forming a region of encapsulation resin 60 adjacent to the IC chip 50 on one surface of the redistribution layer 40.

[0042] Next, in S400, the imaging unit 110 performs a second imaging step in which it captures a second image including the IC chip and the wiring board. The second image is captured at a second time point following the first time point. In the second imaging step, the imaging unit 110 captures the second image so that it includes the IC chip and the wiring board captured in the first imaging step.

[0043] The imaging unit 110 may perform the second imaging stage under the same or similar conditions as the first imaging stage. For example, the imaging unit 110 may perform the second imaging stage by imaging the IC chip and wiring board that were imaged in the first imaging stage at the same distance (e.g., the distance between the wiring board 20 and the imaging unit 110) and the same imaging angle (e.g., the angle of attack of the imaging unit 110 with respect to the surface of the wiring board 20, and the rotation angle of the wiring board 20 in the plane, etc.) as in the first imaging stage.

[0044] If the second shooting stage is performed under different conditions than the first shooting stage, the second image may be processed to obtain an image that would have been obtained if it had been shot under the same conditions as the first shooting stage. For example, if the distance between the wiring board 20 and the shooting unit 110 in the second shooting stage is greater than in the first shooting stage, the second image may be enlarged by a predetermined magnification to obtain an image that would have been obtained under the same conditions.

[0045] The first time point is before the resin encapsulation process is performed on the IC chip, and the second time point is after the resin encapsulation process is performed on the IC chip. In this way, the imaging unit 110 acquires images of the wiring board and IC chip before and after the encapsulation stage.

[0046] Figure 7 shows an example of a second image 700 according to this embodiment. As shown in the figure, the second image 700 includes a cross-shaped alignment mark 720 and an IC chip 710 placed on the redistribution layer 730. The cross-shaped alignment mark 720 corresponds to the alignment mark 520 in the first image 500 shown in Figure 5, and the IC chip 710 corresponds to the IC chip 510 in the first image 500 shown in Figure 5. As shown in Figures 5 and 7, the relative positional relationship between the alignment mark and the IC chip shifts before and after the sealing stage. Specifically, the IC chip moves relative to the alignment mark from the dotted line to the solid line position.

[0047] The imaging unit 110 may perform image processing on the first image and / or the second image as necessary. For example, the imaging unit 110 may apply a filter to the first image and / or the second image to improve sharpness, adjust the color tone, adjust the contrast, and perform other processing.

[0048] Next, in S500, the wiring position identification unit 120 performs the wiring position identification step. The wiring position identification unit 120 identifies the first wiring position, which is the position of the wiring board in the first image. The wiring position identification unit 120 identifies the second wiring position, which is the position of the wiring board in the second image. The wiring position identification unit 120 may identify the first wiring position and the second wiring position using alignment marks on the wiring board.

[0049] The wiring position identification unit 120 may identify the first wiring position and the second wiring position by identifying the position of a part of the alignment mark. For example, the wiring position identification unit 120 may identify the first wiring position and the second wiring position by identifying the position of a convex or concave angle of the alignment mark. As an example, the wiring position identification unit 120 may identify at least a part of the coordinates of two orthogonal lines passing through the convex or concave angle, and then identify the position of the convex or concave angle by combining the identified coordinates of the two lines.

[0050] The wiring position identification unit 120 may identify the first wiring position and the second wiring position using the pixel values ​​of the alignment marks. For example, the wiring position identification unit 120 may identify the first wiring position and the second wiring position using the difference in pixel values ​​of adjacent pixels of the alignment marks.

[0051] Figure 8 shows an example of a method for identifying the first wiring in the first image 500 in S500. Figure 8 shows the alignment mark 520 in the first image 500. Here, the wiring position identification unit 120 may identify the position of the concave angle 540 in the alignment mark 520 as the first wiring position. Here, the horizontal axis of Figure 8 is the X axis and the vertical axis is the Y axis, and the coordinates of the concave angle 540 are defined as (X1, Y1).

[0052] The wiring position identification unit 120 identifies the coordinates of points on two line segments (X-segment 550 parallel to the X-axis and Y-segment 560 parallel to the Y-axis) that pass through the concave angle 540 at the alignment mark 520 in order to identify the position of the concave angle 540. For example, the wiring position identification unit 120 identifies the X coordinate of point 565 on the Y-segment 560 parallel to the Y-axis. Furthermore, the wiring position identification unit 120 identifies the Y coordinate of point 555 on the X-segment 550 parallel to the X-axis. Note that in Figure 8, the X-segment 550 is separated into a left and right portion at the point where the cross shape intersects at the alignment mark 520, but the two are assumed to form a straight line. Similarly, the upper and lower portions of the Y-segment 560 are assumed to form a straight line.

[0053] Figure 9 shows an example of a graph of pixel values ​​along the line B'-B in the first image 500. The horizontal axis shows the position of the pixel along the line B'-B, and the vertical axis shows the pixel value. Pixel position 0 corresponds to the B' side, and as the pixel position increases, it moves towards the B side.

[0054] The pixel value may be, for example, the brightness value of the pixel. In Figure 9, the pixel value increases significantly at a specific pixel position (701) and decreases significantly at a specific pixel position (847). This indicates that the pixel value increases along the alignment mark 520 along line B'–B and decreases in other areas (i.e., the redistribution layer 530).

[0055] The wiring position identification unit 120 may gradually move from the B' side to the B side, detecting the difference (or its absolute value) of pixel values ​​between adjacent pixels, and detect the points where the maximum and minimum values ​​of the pixel value difference are taken. The wiring position identification unit 120 may use the pixel position (701) of the fluctuation point 910 where the difference in pixel values ​​is largest as the X coordinate X1 of the concave angle 540. The fluctuation point 910 corresponds to point 565 on the Y line segment in Figure 8. Alternatively, the wiring position identification unit 120 may determine whether the difference, etc., exceeds a threshold and / or falls below a threshold, and use the pixel position (701) of the fluctuation point 910 where the absolute value of the difference first exceeds the threshold as the X coordinate X1 of the concave angle 540.

[0056] Figure 10 shows an example of a graph of pixel values ​​along the line A'–A in the first image 500. The horizontal axis shows the position of the pixel along the line A'–A, and the vertical axis shows the pixel value. Pixel position 0 corresponds to the A' side, and as the pixel position increases, it moves towards the A side.

[0057] In Figure 10, the pixel value increases significantly at a specific pixel position (188) and decreases significantly at a specific pixel position (335). This indicates that the pixel value increases along the alignment mark 520 along line A'–A, while the pixel value decreases in other areas (i.e., the redistribution layer 530).

[0058] The wiring position identification unit 120 may gradually move from side A' to side A, detecting the difference (or its absolute value) of pixel values ​​between adjacent pixels, and detect the points where the maximum and minimum values ​​of the pixel value difference are taken. The wiring position identification unit 120 may use the pixel position (335) of the fluctuation point 1010 where the difference in pixel values ​​is smallest as the Y coordinate Y1 of the concave angle 540. The fluctuation point 1010 corresponds to point 555 on the X-ray segment in Figure 8. Alternatively, the wiring position identification unit 120 may determine whether the difference, etc., exceeds a threshold and / or falls below a threshold, and use the pixel position (335) of the fluctuation point 1010 where the absolute value of the difference first exceeds the threshold as the Y coordinate Y1 of the concave angle 540.

[0059] In this way, the wiring position identification unit 120 identifies the coordinates (X1, Y1) of the concave angle 540. The wiring position identification unit 120 may use the coordinates (X1, Y1) as the first wiring position. Instead of indirectly calculating the coordinates (X1, Y1) using the pixel values ​​of the pixels on line segment AA' and the pixels on line segment BB', the wiring position identification unit 120 may directly identify the coordinates (X1, Y1) using the pixel values ​​in the X-axis direction passing through the concave angle 540 and the pixel values ​​in the Y-axis direction passing through the concave angle 540. For example, after identifying the point 565 that gives X1, the direct coordinates (X1, Y1) may be identified by analyzing the pixel values ​​of the line parallel to the Y-axis direction passing through point 565.

[0060] Figure 11 shows an example of the difference in pixel values ​​in the graph of Figure 9. In Figure 11, large vertical peaks are detected at pixel positions (701) and (847) of the fluctuation point 910 in Figure 9, where the pixel value changes abruptly.

[0061] Figure 12 shows an example of the difference in pixel values ​​in the graph of Figure 10. In Figure 12, large vertical peaks are detected at the pixel position (188) where the pixel value changes abruptly in Figure 10, and at the pixel position (335) corresponding to the change point 1010.

[0062] The wiring location identification unit 120 may identify the wiring location by the pixel value itself rather than the difference in pixel values. For example, the wiring location identification unit 120 may identify the wiring location solely by whether the pixel value itself exceeds and / or falls below a threshold. However, with this method, depending on the image shooting conditions, the pixel value may be close to the threshold, and in such cases, there is a possibility of false detection of the wiring location. However, when using the difference in pixel values, the possibility of false detection can be reduced.

[0063] Figure 13 shows an example of a method for identifying the second wiring position in the second image 700 in S500. The wiring position identification unit 120 may identify the coordinates (X2, Y2) of the concave angle 740 of the alignment mark 720 in the second image 700 using the same method as described in Figures 8 to 12. The wiring position identification unit 120 may use the coordinates (X2, Y2) as the second wiring position.

[0064] Next, in S600, the chip positioning unit 130 performs a chip positioning step in which it identifies the first chip position of the IC chip in the first image and the second chip position of the IC chip in the second image. The chip positioning unit 130 may perform the chip positioning step using feature points on the surface of the IC chip in the first and second images.

[0065] Figure 14 shows an example of a subflow of S600 in the flow shown in Figure 3. The chip positioning unit 130 executes the process of S600 by executing the processes of S632 to S636. In addition to S632 to S636, other processes may be executed. Some of the processes of S632 to S636 may be omitted.

[0066] In S632, the feature point detection unit 132 of the chip position identification unit 130 detects feature points on the surface of the IC chip 510 in the first image 500 and the IC chip 710 in the second image 700. The feature point detection unit 132 may set feature points using the image features of the IC chip 510 and the IC chip 710. The feature point detection unit 132 may set feature points on the IC chip using a known algorithm. For example, the feature point detection unit 132 may set corner portions in the image as feature points using the FAST algorithm.

[0067] The feature point detection unit 132 may detect multiple feature points in both the first image 500 and the second image 700. The feature point detection unit 132 may select feature points with clearer characteristics from the multiple feature points using the HARRIS corner evaluation method.

[0068] Figure 15 shows an example of feature points detected in the first image 500. For example, the feature point detection unit 132 may have detected five feature points (feature points 572, 574, 576, 578, and 580) from the region of the IC chip 510 in the first image 500.

[0069] Figure 16 shows an example of feature points detected in the second image 700. For example, the feature point detection unit 132 may have detected five feature points (feature points 772, 774, 776, 778, and 780) from the region of the IC chip 710 in the second image 700.

[0070] Next, in S634, the matching unit 134 associates the feature points detected in the first image 500 with the feature points detected in the second image 700. For example, the matching unit 134 may associate the feature points using a known feature point matching method. As an example, the matching unit 134 may use ORB (Oriented Fast and Rotated Brief) to associate the feature points.

[0071] For example, the mapping unit 134 maps feature point 572 to feature point 772, feature point 574 to feature point 774, feature point 576 to feature point 776, feature point 578 to feature point 778, and feature point 580 to feature point 780.

[0072] Next, in S636, the position identification unit 136 calculates the first chip position and the second chip position from the positions of the associated feature points. For example, the position identification unit 136 may calculate the centroids of five locations in the first image 500: the positions of feature point 572 (xa1, ya1), feature point 574 (xb1, yb1), feature point 576 (xc1, yc1), feature point 578 (xd1, yd1), and feature point 580 (xe1, ye1), and use these as the first chip position (x1, y1).

[0073] For example, the position identification unit 136 may calculate the centroids of five locations in the second image 700: the positions of feature point 772 (xa2, ya2), feature point 774 (xb2, yb2), feature point 776 (xc2, yc2), feature point 778 (xd2, yd2), and feature point 780 (xe2, ye2), and use these as the second chip position (x2, y2).

[0074] Next, in S700, a relative position calculation step is performed to calculate the first relative position and the second relative position. The relative position calculation unit 140 calculates the first relative position, which is the relative position of the IC chip and the wiring board at the first time, based on the first wiring position and the first chip position. For example, the relative position calculation unit 140 may calculate the first relative position by calculating the difference between the first wiring position (X1, Y1) and the first chip position (x1, y1).

[0075] Figure 17 shows an example of a first relative position in the first image 500. As shown in the figure, the relative position calculation unit 140 may calculate the first relative position (x1-X1, y1-Y1) represented by vector 595 by calculating the vector difference between the first wiring position (X1, Y1) and the first chip position (x1, y1) represented by the centroid 590.

[0076] The relative position calculation unit 140 calculates the second relative position, which is the relative position of the IC chip and the wiring board at a second time point, based on the second wiring position and the second chip position. For example, the relative position calculation unit 140 may calculate the second relative position by calculating the difference between the second wiring position (X2, Y2) and the second chip position (x2, y2).

[0077] Figure 18 shows an example of a second relative position in the second image 700. As shown in the figure, the relative position calculation unit 140 may calculate the second relative position (x2-X2, y2-Y2) represented by vector 795 by calculating the vector difference between the second wiring position (X2, Y2) and the second chip position (x2, y2) represented by the centroid 790.

[0078] In this manner, the relative position calculation unit 140 calculates the first relative position and the second relative position by using the centroid position of the feature points of the IC chip and averaging the movement of multiple associated feature points. Alternatively, the first relative position and the second relative position may be calculated by calculating multiple difference vectors between each feature point of the IC chip and the wiring position, and averaging these multiple vectors.

[0079] Next, in S800, the movement detection unit 150 performs a movement detection step in which it detects a change in the relative positional relationship between the IC chip and the wiring board based on the first relative position and the second relative position. For example, the movement detection unit 150 may detect the difference between the first relative position and the second relative position as a change in positional relationship.

[0080] Figure 19 shows an example of the processing of S800 by the movement detection unit 150. The movement detection unit 150 may calculate a vector 990 which is the difference between a first relative position (X1-x1, Y1-y1) represented by vector 595 and a second relative position (X2-x2, Y2-y2) represented by vector 795. The movement detection unit 150 detects this vector 990 as the movement of the relative position between the IC chip and the wiring board.

[0081] The movement detection unit 150 may output the vector 990 itself, the direction of the vector 990, and / or the absolute value of the vector 990. The movement detection unit 150 may determine whether the absolute value of the vector 990 exceeds a threshold and output a warning if it does. This allows the IC chip movement detection system 10 to detect that the IC chip has moved before and after processes in which the IC chip may move, such as the sealing stage.

[0082] If the IC chip moves by more than a predetermined amount, the conditions of the process that caused the movement, such as the sealing stage, may be reviewed, the product being manufactured may be discarded, and / or the IC chip may be moved back to its original position.

[0083] After S800, further steps may be taken, such as peeling off the carrier 30, forming solder balls on the back side of the IC chip 50 in the redistribution layer 40, and (if multiple IC chips 50 are mounted) dicing to separate them into individual pieces. By performing these additional steps, a fan-out package with the IC chip 50 mounted can be manufactured.

[0084] According to this embodiment, the position of the IC chip could be determined more accurately by using feature points on the IC chip surface. Alternatively, the position of the IC chip can be determined using the coordinates of the outer edge of the IC chip in the image instead of using feature points. For example, the position of the IC chip can be determined using the pixel values ​​of the outer edge of the IC chip in the image or their differences, similar to the method described in S500.

[0085] On the other hand, when using such methods, IC chips have depth, and slight differences in shooting conditions such as focal point and shadows may prevent the outer edge of the IC chip from being accurately identified.

[0086] Figure 20 shows an example of an actual IC chip and alignment mark image. As shown, the portion corresponding to the outer edge of the IC chip 510 is blacked out in the image, making it not always easy to identify the outer edge. For example, line 1020 could be considered the outer edge of the IC chip, or line 1030 could be considered the outer edge. Identifying the IC chip based on the outer edge in this way can lead to positional errors.

[0087] On the other hand, according to this embodiment, the position of the wiring board can be accurately determined by using the difference in pixel values ​​to identify the position of the wiring board. Thus, according to this embodiment, by determining the position of both the wiring board and the IC chip in an appropriate manner, the movement of the IC chip can be detected with high accuracy.

[0088] The IC chip movement detection system 10 may calculate the amount of rotation of the IC chip in addition to the relative movement between the IC chip and the wiring position. For example, the wiring position identification unit 120 may identify two or more wiring positions in each of the first and second images, and determine the wiring angle of the wiring position (or alignment mark) from the positional relationship between the wiring positions, the chip position identification unit 130 may determine the chip angle of the IC chip from the positional relationship of multiple feature points, and the relative position calculation unit 140 may calculate the rotation of the IC chip from the difference between the wiring angle and the chip angle in the first image and the difference between the wiring angle and the chip angle in the second image.

[0089] The above description of the embodiment mainly describes the case in which a fan-out package is manufactured as an IC chip mounting substrate through steps S100 to S800, but it is not limited to this. The method described in this embodiment can be applied to a variety of other processes, including the step of aligning the wiring and the IC chip.

[0090] Various embodiments of the present invention may be described with reference to flowcharts and block diagrams, where a block may represent (1) a stage in a process in which an operation is performed or (2) a section of a device having the role of performing the operation. Specific stages and sections may be implemented by dedicated circuits, programmable circuits supplied with computer-readable instructions stored on a computer-readable medium, and / or processors supplied with computer-readable instructions stored on a computer-readable medium. Dedicated circuits may include digital and / or analog hardware circuits, and may include integrated circuits (ICs) and / or discrete circuits. Programmable circuits may include reconfigurable hardware circuits, including logical AND, logical OR, logical XOR, logical NAND, logical NOR, and other logic operations, flip-flops, registers, memory elements such as field-programmable gate arrays (FPGAs), programmable logic arrays (PLAs), etc.

[0091] Computer-readable media may include any tangible device capable of storing instructions to be executed by a suitable device, and as a result, computer-readable media having instructions stored therein will comprise a product containing instructions that can be executed to create means for performing operations specified in a flowchart or block diagram. Examples of computer-readable media may include electronic storage media, magnetic storage media, optical storage media, electromagnetic storage media, semiconductor storage media, etc. More specific examples of computer-readable media may include floppy disks, diskettes, hard disks, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), electrically erasable programmable read-only memory (EEPROM), static random access memory (SRAM), compact disk read-only memory (CD-ROM), digital multipurpose disc (DVD), Blu-ray® disc, memory stick, integrated circuit card, etc.

[0092] Computer-readable instructions may include assembler instructions, instruction set architecture (ISA) instructions, machine instructions, machine-dependent instructions, microcode, firmware instructions, state setting data, or source code or object code written in any combination of one or more programming languages, including object-oriented programming languages ​​such as Smalltalk®, Java®, C++, and traditional procedural programming languages ​​such as the C programming language or similar programming languages.

[0093] Computer-readable instructions may be provided locally or via a wide area network (WAN) such as a local area network (LAN) or the internet to the processor or programmable circuit of a programmable data processing device such as a general-purpose computer, a special-purpose computer, or another computer, and the computer-readable instructions may be executed to create means for performing operations specified in a flowchart or block diagram. Examples of processors include computer processors, processing units, microprocessors, digital signal processors, controllers, microcontrollers, etc.

[0094] Figure 21 shows an example of a computer 2200 in which multiple aspects of the present invention may be embodied in whole or in part. A program installed on the computer 2200 can cause the computer 2200 to function as an operation or one or more sections of an apparatus according to an embodiment of the present invention, or to execute such operation or one or more sections, and / or to cause the computer 2200 to execute a process or a stage of such process according to an embodiment of the present invention. Such a program may be executed by the CPU 2212 to cause the computer 2200 to perform a particular operation associated with some or all of the blocks in the flowcharts and block diagrams described herein.

[0095] The computer 2200 according to this embodiment includes a CPU 2212, RAM 2214, a graphics controller 2216, and a display device 2218, which are interconnected by a host controller 2210. The computer 2200 also includes input / output units such as a communication interface 2222, a hard disk drive 2224, a DVD-ROM drive 2226, and an IC card drive, which are connected to the host controller 2210 via an input / output controller 2220. The computer also includes legacy input / output units such as a ROM 2230 and a keyboard 2242, which are connected to the input / output controller 2220 via an input / output chip 2240.

[0096] The CPU 2212 operates according to programs stored in the ROM 2230 and RAM 2214, thereby controlling each unit. The graphics controller 2216 retrieves image data generated by the CPU 2212 from a frame buffer provided in RAM 2214 or from itself, and displays the image data on the display device 2218.

[0097] The communication interface 2222 communicates with other electronic devices via a network. The hard disk drive 2224 stores programs and data used by the CPU 2212 in the computer 2200. The DVD-ROM drive 2226 reads programs or data from the DVD-ROM 2201 and provides them to the hard disk drive 2224 via the RAM 2214. The IC card drive reads programs and data from the IC card and / or writes programs and data to the IC card.

[0098] The ROM 2230 stores boot programs and / or programs that depend on the computer 2200's hardware, which are executed by the computer 2200 when activated. The input / output chip 2240 may also connect various input / output units to the input / output controller 2220 via parallel ports, serial ports, keyboard ports, mouse ports, etc.

[0099] The program is provided on a computer-readable medium such as a DVD-ROM 2201 or an IC card. The program is read from the computer-readable medium and installed on a hard disk drive 2224, RAM 2214, or ROM 2230, which are also examples of computer-readable medium, and executed by the CPU 2212. The information processing described within these programs is read by the computer 2200, resulting in coordination between the program and the various types of hardware resources described above. The apparatus or method may be configured to realize the manipulation or processing of information in accordance with the use of the computer 2200.

[0100] For example, when communication is performed between a computer 2200 and an external device, the CPU 2212 may execute a communication program loaded into RAM 2214 and, based on the processing described in the communication program, instruct the communication interface 2222 to perform communication processing. Under the control of the CPU 2212, the communication interface 2222 reads transmission data stored in a transmission buffer processing area provided in a recording medium such as RAM 2214, a hard disk drive 2224, a DVD-ROM 2201, or an IC card, transmits the read transmission data to the network, or writes received data received from the network to a reception buffer processing area provided on the recording medium.

[0101] The CPU 2212 reads all or necessary parts of a file or database stored on an external storage medium such as a hard disk drive 2224, a DVD-ROM drive 2226 (DVD-ROM 2201), or an IC card into the RAM 2214, and may perform various types of processing on the data in the RAM 2214. The CPU 2212 then writes the processed data back to the external storage medium.

[0102] Various types of information, such as various types of programs, data, tables, and databases, may be stored on the recording medium and subjected to information processing. The CPU 2212 may perform various types of processing on the data read from RAM 2214, including various types of operations, information processing, conditional judgments, conditional branching, unconditional branching, information retrieval / replacement, etc., as described throughout this disclosure and specified by the program instruction sequence, and write the results back to RAM 2214. The CPU 2212 may also retrieve information in files, databases, etc., within the recording medium. For example, if multiple entries are stored in the recording medium, each having an attribute value of a first attribute associated with an attribute value of a second attribute, the CPU 2212 may search among the multiple entries for an entry that matches the condition for which the attribute value of the first attribute is specified, read the attribute value of the second attribute stored in that entry, and thereby obtain the attribute value of the second attribute associated with the first attribute that satisfies a predetermined condition.

[0103] The programs or software modules described above may be stored on or near computer 2200 on a computer-readable medium. Alternatively, recording media such as hard disks or RAM provided within a server system connected to a dedicated communication network or the Internet can be used as computer-readable media, thereby providing programs to computer 2200 via the network.

[0104] Although the present invention has been described above using embodiments, the technical scope of the present invention is not limited to the scope described in the above embodiments. It will be apparent to those skilled in the art that various modifications or improvements can be made to the above embodiments. It will be clear from the claims that such modified or improved forms may also be included in the technical scope of the present invention.

[0105] It should be noted that the execution order of operations, procedures, steps, and stages in the devices, systems, programs, and methods shown in the claims, specifications, and drawings is not explicitly stated as "before," "prior to," etc., and can be implemented in any order unless the output of a previous process is used in a later process. Even if the operation flow in the claims, specifications, and drawings is described using phrases such as "first," "next," etc. for convenience, it does not mean that it is essential to perform them in that order. The notation "A and / or B" may mean "A, B, or A and C." The notation "A, B and / or C" may mean "any one of A, B, and C, or any combination of two or more of these." [Explanation of symbols]

[0106] 10 IC Chip Movement Detection System 20 Wiring boards 30 Carriers 40 Redistribution layer 50 IC chips 60 Sealing resin 110 Photography Department 120 Wiring position identification part 130 Chip positioning unit 132 Feature Point Detection Unit 134 Correspondence section 136 Location identification part 140 Relative position calculation unit 150 Movement detection unit 500 Image 1 510 IC chips 520 Alignment Marks 530 Redistribution layer 540 Concave angle 550 X-rays 555 Point on the X-ray segment 560 Y line segment 565 Point on the Y line segment 572 characteristic points 574 characteristic points 576 characteristic points 578 characteristic points 580 characteristic points 590 Center of gravity 595 Vectors 700 Image 2 710 IC chips 720 Alignment Marks 730 Redistribution layer 740 Concave angle 772 Feature Points 774 Feature Points 776 Feature Points 778 Feature Points 780 feature points 790 Center of gravity 795 Vectors 910 fluctuation point 990 Vectors 1010 Fluctuation Point 1020 Line Line 1030 2200 Computers 2201 DVD-ROM 2210 Host Controller 2212 CPU 2214 RAM 2216 Graphics Controller 2218 Display Devices 2220 Input / Output Controller 2222 Communication Interface 2224 Hard Disk Drive 2226 DVD-ROM drive 2230 ROM 2240 Input / Output Chip 2242 keyboard

Claims

1. An IC chip movement detection system that detects the relative positional movement between an IC chip and a wiring board, A camera unit that captures a first image including the IC chip and wiring board at a first time point, and a second image including the IC chip and wiring board at a second time point following the first time point, A wiring position identification unit that identifies the first wiring position of the wiring board in the first image and the second wiring position of the wiring board in the second image, A chip position identification unit that uses feature points on the surface of the IC chip in the first image and the second image to identify the first chip position of the IC chip in the first image and the second chip position of the IC chip in the second image, A relative position calculation unit calculates a first relative position, which is the relative position of the IC chip and the wiring board at a first time, based on the first wiring position and the first chip position, and calculates a second relative position, which is the relative position of the IC chip and the wiring board at a second time, based on the second wiring position and the second chip position. A movement detection unit that detects changes in the relative positional relationship between the IC chip and the wiring board based on the first relative position and the second relative position, An IC chip movement detection system equipped with the following features.

2. The wiring position identification unit identifies the first wiring position and the second wiring position by identifying the position of the alignment marks provided on the wiring board. The IC chip movement detection system according to claim 1.

3. The wiring position identification unit identifies the first wiring position and the second wiring position using the pixel values ​​of the alignment marks. The IC chip movement detection system according to claim 2.

4. The wiring position identification unit identifies the first wiring position and the second wiring position using the difference in pixel values ​​of adjacent pixels of the alignment mark. The IC chip movement detection system according to claim 2.

5. The alignment marks have a convex or concave angle. The wiring position identification unit identifies the first wiring position and the second wiring position by identifying the position of the convex or concave angle. The IC chip movement detection system according to claim 2.

6. The chip position identification unit is, A feature point detection unit for detecting feature points on the surface of the IC chip in the first image and the second image, A matching unit that associates the feature points in the first image with the feature points in the second image, A position identification unit that identifies the first chip position and the second chip position from the positions of the associated feature points, The IC chip movement detection system according to claim 1, having the following features.

7. The relative position calculation unit calculates the first relative position and the second relative position by averaging the movements of a plurality of associated feature points. The IC chip movement detection system according to claim 6.

8. The chip position identification unit sets the feature points using ORB (Oriented Fast Rotated Brief) and identifies the first chip position and the second chip position. The IC chip movement detection system according to claim 6.

9. The first time is the point in time before the resin encapsulation process is performed on the IC chip. The second time point is the point in time after the resin encapsulation process has been performed on the IC chip. An IC chip movement detection system according to any one of claims 1 to 8.

10. An IC chip movement detection method for detecting the relative positional movement between an IC chip and a wiring board, A shooting step in which a first image including the IC chip and wiring board is taken at a first time point, and a second image including the IC chip and wiring board is taken at a second time point following the first time point, A wiring position identification step that identifies the first wiring position of the wiring board in the first image and the second wiring position of the wiring board in the second image, A chip position identification step in which the first chip position of the IC chip in the first image and the second chip position of the IC chip in the second image are identified using the feature points of the surface of the IC chip in the first image and the second chip position of the IC chip in the second image, A relative position calculation step, which involves calculating a first relative position, which is the relative position of the IC chip and the wiring board at a first time, based on the first wiring position and the first chip position, and calculating a second relative position, which is the relative position of the IC chip and the wiring board at a second time, based on the second wiring position and the second chip position, A movement detection step in which a change in the relative positional relationship between the IC chip and the wiring board is detected based on the first relative position and the second relative position, An IC chip movement detection method comprising the following features.

11. The mounting stage involves placing an IC chip on a wiring board, A first shooting step in which a first image including the IC chip and the wiring board is taken at a first time; The sealing step involves encapsulating the IC chip with resin, A second shooting step in which a second image including the IC chip and the wiring board is taken at a second time point, A wiring position identification step that identifies the first wiring position of the wiring board in the first image and the second wiring position of the wiring board in the second image, A chip position identification step in which the first chip position of the IC chip in the first image and the second chip position of the IC chip in the second image are identified using the feature points of the surface of the IC chip in the first image and the second chip position of the IC chip in the second image, A relative position calculation step, which involves calculating a first relative position, which is the relative position of the IC chip and the wiring board at a first time, based on the first wiring position and the first chip position, and calculating a second relative position, which is the relative position of the IC chip and the wiring board at a second time, based on the second wiring position and the second chip position, A movement detection step in which a change in the relative positional relationship between the IC chip and the wiring board is detected based on the first relative position and the second relative position, A method for manufacturing an IC chip mounting substrate.

12. An IC chip mounting substrate manufactured by the manufacturing method described in claim 11.

Images