Packages for mounting light-emitting elements, light-emitting devices, and light-emitting modules.

Abstract

To provide a package for mounting light-emitting elements that can improve the bonding strength with a wiring board. [Solution] The package for mounting the light-emitting element comprises a substrate having an upper surface having a mounting area for the light-emitting element and a lower surface opposite to the upper surface; a first pattern which is an electrode pattern, arranged on the lower surface of the substrate in an area other than the area that overlaps with the mounting area when viewed from below; and a second pattern, arranged on the lower surface of the substrate in an area other than the area that overlaps with the mounting area when viewed from below, wherein the second pattern is not electrically connected to the first pattern.

Description

Technical Field

[0001] The present disclosure relates to a package for mounting a light-emitting element, a light-emitting device, and a light-emitting module.

Background Art

[0002] There is known a package for a semiconductor device having a substrate having a front surface and a back surface, a rectangular planar shape, auxiliary solder pads provided on the back surface side of the substrate and formed separately at four corners of the outer periphery of the substrate, and at least a pair of solder pads for electrodes formed inside the auxiliary solder pads (see, for example, Patent Document 1). Such a package is joined to, for example, a wiring board.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] An object of the present disclosure is to provide a package for mounting a light-emitting element capable of improving the bonding strength with a wiring board. Another object is to provide a light-emitting device having this package for mounting a light-emitting element and a light-emitting module having this light-emitting device.

Means for Solving the Problems

[0005] A package for mounting a light-emitting element according to an embodiment of the present disclosure includes a base body having an upper surface with a mounting area for a light-emitting element and a lower surface opposite to the upper surface, a first pattern serving as an electrode pattern disposed in an area other than an area overlapping the mounting area in a bottom view on the lower surface of the base body, and a second pattern disposed in an area other than an area overlapping the mounting area in a bottom view on the lower surface of the base body, and the second pattern is not electrically connected to the first pattern.

[0006] A light-emitting device according to one embodiment of the present disclosure comprises: a package for mounting light-emitting elements according to one embodiment of the present disclosure; one or more light-emitting elements mounted in the mounting area and surrounded by the frame; and a lid that is joined to the upper surface of the frame and, together with the bottom and the frame, seals the space in which the light-emitting elements are arranged.

[0007] A light-emitting module according to one embodiment of the present disclosure is a light-emitting module having a wiring board and a light-emitting device according to one embodiment of the present disclosure mounted on the wiring board, wherein the wiring board includes a mounting portion on which the light-emitting device is mounted and a pair of outer regions located on both sides of the mounting portion in a first direction, wherein, in a top view, each of the outer regions includes a first through hole and a second through hole, the second through holes are arranged on both sides of a virtual line connecting the centers of the first through holes located in each of the outer regions, and, in a top view, the mounting portion includes a first metal portion, a first insulating portion, and an electrode portion separated from the first metal portion with the first insulating portion in between, the first pattern of the light-emitting device is joined to the electrode portion, and the heat dissipation portion and the second pattern are joined to the first metal portion. [Effects of the Invention]

[0008] According to one embodiment of this disclosure, a package for mounting a light-emitting element that can improve the bonding strength with a wiring board can be provided. Furthermore, a light-emitting device having this package for mounting a light-emitting element, and a light-emitting module having this device can also be provided. [Brief explanation of the drawing]

[0009] [Figure 1] This is a perspective view of the package 100 for mounting light-emitting elements. [Figure 2] This is a top view of the package 100 for mounting light-emitting elements. [Figure 3A] This is a bottom view of the package 100 for mounting a light-emitting element. [Figure 3B] This is a bottom view of the package 100 for mounting a light-emitting element. [Figure 4] Figure 2 is a cross-sectional view of the light-emitting element mounting package 100 along the IV-IV section. [Figure 5] This is a perspective view of the light-emitting device 200. [Figure 6] This is a top view of the light-emitting device 200. [Figure 7] Figure 6 is a top view of the light-emitting device 200 with the lens component and cover removed. [Figure 8] This is a cross-sectional view of the light-emitting device 200 along the VIII-VIII section in Figure 6. [Figure 9] This is a perspective view of the light-emitting module 300. [Figure 10] This is a top view of the light-emitting module 300. [Figure 11] This is a top view of the wiring board that makes up the light-emitting module 300. [Figure 12] Figure 11 is a cross-sectional view of the wiring board along the XII-XII section. [Figure 13] Figure 11 is a cross-sectional view of the wiring board along the XIII-XIII section. [Modes for carrying out the invention]

[0010] The following description will explain embodiments for carrying out the invention with reference to the drawings. In the following description, terms indicating specific directions or positions (e.g., "up," "down," and other terms including these) will be used as needed. However, the use of these terms is solely to facilitate understanding of the invention with reference to the drawings, and the meaning of these terms does not excessively limit the technical scope of the present invention. For example, if "top surface" is mentioned, the invention must not always be used in a way that it faces upwards. Also, parts with the same reference numerals appearing in multiple drawings indicate the same or equivalent parts or components.

[0011] In the present disclosure, with respect to polygons such as triangles and quadrilaterals, shapes subjected to processing such as rounding the corners, chamfering, corner cutting, and rounding of the corners of the polygon are also included in what is called a polygon. Also, not limited to the corners (ends of the sides), shapes subjected to processing in the middle part of the sides are likewise called polygons. That is, shapes subjected to partial processing while leaving the polygon as a base are included in the interpretation of "polygon" described in the present disclosure.

[0012] Moreover, not limited to polygons, the same applies to terms representing specific shapes such as trapezoids, circles, concavities and convexities, etc. Also, the same applies when dealing with each side forming the shape. That is, even if a side has been processed at the corner or the middle part, the processed part is included in the interpretation of "side". When distinguishing a "polygon" or a "side" without partial processing from the processed shape, "strict" is attached, for example, described as "strict quadrilateral", etc.

[0013] Furthermore, the embodiments shown below exemplify packages for mounting light-emitting elements and the like for embodying the technical idea of the present invention, and do not limit the present invention below. Also, the dimensions, materials, shapes, relative arrangements, etc. of the component parts described below are not intended to limit the scope of the present invention only to those, without specific description, but are intended to be illustrative. Also, the content described in one embodiment is applicable to other embodiments and modifications. Also, the sizes and positional relationships of the members shown in the drawings may be exaggerated for clarity of explanation. Furthermore, in order to avoid the drawings becoming overly complicated, schematic drawings omitting the illustration of some elements may be used, or end views showing only the cut surface as cross-sectional views may be used.

[0014] <First Embodiment> As a first embodiment of the package for mounting a light-emitting element according to the present disclosure, the package 100 for mounting a light-emitting element will be described. FIG. 1 is a perspective view of the package 100 for mounting a light-emitting element. FIG. 2 is a top view of the package 100 for mounting a light-emitting element. FIGS. 3A and 3B are bottom views of the package 100 for mounting a light-emitting element. FIG. 4 is a cross-sectional view of the package 100 for mounting a light-emitting element taken along the cross-sectional line IV-IV in FIG. 2.

[0015] The package 100 for mounting a light-emitting element includes a base 110, a first pattern 121, and a second pattern 122. Hereinafter, each component of the package 100 for mounting a light-emitting element will be described.

[0016] The base 110 includes one or more upper surfaces 110a and one or more lower surfaces 110b that are opposite to the upper surfaces 110a. At least one upper surface 110a has a mounting region 110r for the light-emitting element. The upper surface 110a having the mounting region 110r for the light-emitting element is referred to as a mounting surface. The lower surface 110b overlaps the entire mounting region 110r in a bottom view. In other words, the area of the lower surface 110b is the same as the area of the mounting region 110r or larger than the area of the mounting region 110r.

[0017] Here, the "mounting region 110r" refers to a region on the mounting surface where the light-emitting element 220 is scheduled to be mounted. When the light-emitting element 220 is not mounted on the mounting surface, the region on the mounting surface that does not overlap with other members in a top view is the "mounting region 110r".

[0018] As will be described later, when the base 110 has a bottom portion 111 and a frame portion 112, the region defined by one or more inner surfaces of the frame portion 112 in a top view among the mounting surfaces of the base 110 is referred to as the "mounting region 110r".

[0019] When one light-emitting element 220 is mounted on the mounting surface, the "mounting area 110r" refers to the area defined by each edge of that light-emitting element 220. When multiple light-emitting elements 220 are mounted on the mounting surface, each light-emitting element 220 will have an edge. In this case, the area defined by the imaginary straight lines extending the outermost edges of these edges is called the "mounting area 110r". When multiple light-emitting elements 220 are mounted on the mounting surface, the "mounting area 110r" is, for example, the area 110r1 enclosed by the dashed line in Figure 7 described later. Note that in Figure 7, multiple submounts 210 on which one or more light-emitting elements 220 are arranged are mounted on the mounting surface, but the "mounting area 110r" is illustrated as a reference for the mounting area when these multiple submounts 210 are not present.

[0020] When one submount 210, on which one or more light-emitting elements 220 are arranged, is mounted on the mounting surface, the area defined by each side of that submount 210 is called the "mounting area 110r". When multiple submounts 210, each on which one or more light-emitting elements 220 are arranged, are mounted on the mounting surface, each submount 210 will have sides. In this case, the area defined by the imaginary straight lines extending the outermost sides of these sides is called the "mounting area 110r". When multiple submounts 210, each on which one or more light-emitting elements 220 are arranged, are mounted on the mounting surface, the mounting area is, for example, the area of ​​the mounting area 110r enclosed by the dashed line in Figure 7, described later.

[0021] The light-emitting element 220 may be mounted on a heat dissipation section that dissipates the heat generated when the light-emitting element 220 is operating. In this case, the upper surface of the heat dissipation section is the mounting surface.

[0022] In the illustrated example, the base body 110 has a bottom portion 111 and a frame portion 112 joined to the bottom portion 111. The bottom portion 111 has an upper surface 111a and a lower surface 111b. The upper surface 111a of the bottom portion 111 is the mounting surface. The bottom portion 111 can also be called the heat dissipation portion of the base body 110. Furthermore, the lower surface 111b of the bottom portion 111 is one of the lower surfaces 110b of the base body 110.

[0023] The base 111 has a rectangular shape when viewed from above. This rectangle may have a long side and a short side. In this case, the ratio of the length of the long side to the length of the short side is, for example, 1.4 times or more and 1.5 times or less. Note that the shape of the base 111 when viewed from above does not have to be rectangular. Unless otherwise specified, a rectangle may include a square.

[0024] The frame portion 112 has an upper surface 112a, a lower surface 112b, one or more inner surfaces, and one or more outer surfaces. The upper surface 112a of the frame portion 112 is the upper surface 110a of the base body 110. The lower surface 112b of the frame portion 112 is one of the lower surfaces 110b of the base body 110. The base body 110 may have multiple lower surfaces 110b, including at least the lower surface 111b and the lower surface 112b. The lower surface 112b of the frame portion 112 is located on the same plane as the lower surface 111b of the bottom portion 111. The lower surface 112b of the frame portion 112 is not necessarily located on the same plane as the lower surface 111b of the bottom portion 111.

[0025] The frame portion 112 is, for example, rectangular in shape when viewed from above. One or more inner surfaces of the frame portion 112 intersect with the upper surface 112a and extend downward from the upper surface 112a. One or more outer surfaces of the frame portion 112 intersect with the upper surface 112a and the lower surface 112b of the frame portion 112. The frame portion 112 surrounds the mounting area 110r of the mounting surface of the bottom portion 111 when viewed from above, and surrounds the lower surface 111b of the bottom portion 111 when viewed from below.

[0026] The frame portion 112 may further have a stepped portion 113 having an upper surface 113a located above the mounting surface of the bottom portion 111 and below the upper surface 112a of the frame portion 112. The upper surface 113a of the stepped portion 113 is one of the upper surfaces 110a of the base body 110. The base body 110 may have a plurality of upper surfaces 110a, including at least the upper surface 111a and the upper surface 113a. The stepped portion 113 further has an inner surface that intersects with the upper surface 113a and extends downward.

[0027] The upper surface 113a intersects with one or more inner surfaces of the frame portion 112. The upper surface 113a may be parallel to, for example, the mounting surface of the bottom portion 111. The inner surface of the stepped portion 113 intersects with, for example, the mounting surface of the bottom portion 111.

[0028] The stepped portion 113 may further have a lower surface 113b that intersects with the inner surface of the stepped portion 113. Of the lower surface 113b of the stepped portion 113, the portion that overlaps with other lower surfaces 110b (for example, the lower surface 110b of the bottom) in a view from below is not the lower surface 110b of the base 110. The lower surface 113b of the stepped portion 113 may have a portion that corresponds to the lower surface 110b of the base 110 and a portion that does not correspond to it. The lower surface 113b may be a plane parallel to the upper surface 113a. The lower surface 113b is located above the lower surface 112b of the frame portion 112. The lower surface 113b of the stepped portion 113 is joined to the bottom 111. The lower surface 113b of the stepped portion 113 may be joined to the mounting surface of the bottom 111. In the illustrated example, the frame portion 112 has an inner surface that intersects with the lower surface 113b and extends downward. The inner surface intersects with the lower surface 112b of the frame portion 112. The inner surface may also be in contact with the side surface of the bottom portion 111.

[0029] In the illustrated example, the stepped portion 113 is provided along two opposing inner surfaces of the frame portion 112 when viewed from above. The stepped portion 113 may be provided along only one of the one or more inner surfaces of the frame portion 112, or along all of the inner surfaces. The frame portion 112 does not have to have a stepped portion.

[0030] The substrate 110 has a first region 110s on its lower surface 110b. The first region 110s is a part of the region on one or more lower surfaces 110b of the substrate 110 that does not overlap with the mounting region 110r when viewed from below. In other words, on one or more lower surfaces 110b of the substrate 110, there is a region that is not the first region 110s in the region that does not overlap with the mounting region 110r when viewed from below.

[0031] Here, the first region 110s is the region along two opposing sides of the rectangle when the base 110 is viewed from below. The direction in which the side (first side) along which the first region 110s extends is called the first region direction. In this case, the first region 110s can be defined as the region within, for example, 750 μm from each of the first sides. Alternatively, it can be defined as the regions at both ends when the other two opposing sides are divided into 11 equal regions by perpendicular lines. Note that if the base 110 is a rectangle with a long side and a short side when viewed from below, the first region 110s is the region along the short side. Furthermore, if the base 110 is rectangular in a view from below and has a bottom portion 111 and a frame portion 112, then in a view from below, the regions between the two opposing outer surfaces of the frame portion 112 and the imaginary straight lines that include the inner surfaces of the frame portion 112 that are opposite to each of the outer surfaces can be called the first region 110s.

[0032] One or more first patterns 121 are arranged in the first region 110s. The first patterns 121 may be arranged in a part of the first region 110s. On the lower surface 110b, the first patterns 121 are not arranged in any region other than the first region 110s. One or more first patterns 121 become electrode patterns. One or more first patterns 121 are electrically connected to patterns provided on one or more upper surfaces 110a. For example, one or more first patterns 121 are electrically connected to one or more third patterns 123 arranged on the upper surface 113a of the stepped portion 113.

[0033] In the illustrated example, three first patterns 121 are arranged in one of the first regions 110s along the two opposing outer surfaces of the frame portion 112. Note that the number of first patterns 121 arranged in this one first region 110s is not limited to three. Also in the illustrated example, three first patterns 121 are arranged in the other first region 110s along the two opposing outer surfaces. The number of first patterns 121 arranged in each of the first regions along the two opposing outer surfaces is the same. The number of first patterns 121 arranged in each first region 110s may be different.

[0034] In the illustrated example, in a bottom view, the first pattern 121 positioned along one outer surface of the frame portion 112 and the first pattern 121 positioned along the other outer surface of the frame portion 112 face each other with the bottom surface 111b of the bottom portion 111 in between. In a bottom view, each first pattern 121 is separated from the bottom surface 111b of the bottom portion 111. In a bottom view, each first pattern 121 is separated from the inner edge of the bottom surface 112b of the frame portion 112.

[0035] In the illustrated example, the first pattern 121 is not placed in the region between the imaginary line passing through the edge of the lower surface 111b opposite to the first pattern 121, which is positioned along one outer surface of the frame portion 112, and the imaginary line passing through the edge of the lower surface 111b opposite to the first pattern 121, which is positioned along the other outer surface.

[0036] The substrate 110 has a second region 110t on its lower surface 110b. The second region 110t is a part of the region on one or more lower surfaces 110b of the substrate 110 that does not overlap with the mounting region 110r when viewed from below. The second region 110t includes a region that is not the first region 110s. The second region 110t may have a portion that overlaps with the first region 110s.

[0037] Here, the second region 110t is the region along two opposing sides of the rectangle when the base body 110 is viewed from below, in the direction of the first region. The direction in which the side (second side) along which the second region 110t extends is called the second region direction. In this case, the second region 110t can be defined as the region within, for example, 750 μm or less from each of the second sides. Alternatively, it can be defined as the regions at both ends when the first side is divided into 10 equal parts by perpendicular lines. Note that if the base body 110 is a rectangle with a long side and a short side when viewed from below, the second region 110t is the region along the long side. Furthermore, if the base 110 is rectangular in a view from below and has a bottom portion 111 and a frame portion 112, the region between two opposing outer surfaces of the frame portion 112 in the first region direction and a hypothetical straight line that includes the inner surface of the frame portion 112 opposite to each of the outer surfaces can be called the second region 110t in a view from below.

[0038] One or more second patterns 122 are arranged in the second region 110t. The second patterns 122 may be arranged in a part of the second region 110t. In the illustrated light-emitting element mounting package 100, on the lower surface 110b, the second patterns 122 are not arranged in any area other than the second region 110t. By providing the second pattern 122 in addition to the first pattern 121, adhesive can be provided on the second pattern 122, leading to improved bonding strength. This improves the bonding strength between the light-emitting element mounting package 100 and the wiring board 310. Furthermore, if the base body 110 is a rectangle with long and short sides when viewed from below, providing the second pattern 122 in the direction along the long side, which is the direction in which stress is easily applied, can reduce stress and improve bonding strength.

[0039] The second pattern 122 is not electrically connected to the first pattern 121. In addition to patterns that serve the role of electrical connection, such as the first pattern 121, providing patterns that serve to increase bonding strength contributes to improving bonding strength. The second pattern 122 is positioned on the substrate 110 at a distance from the first pattern 121. For example, the first pattern 121 and the second pattern 122 are positioned at least 150 μm apart. By positioning the first pattern 121 and the second pattern 122 at a distance from each other, current leakage from the second pattern 122 to the first pattern 121 does not occur. Note that, as shown in Figure 3B, the second pattern 122 may be in physical contact with the first pattern 121 positioned along one of the two opposing outer surfaces. In this case, the second pattern 122 is not in physical contact with the first pattern 121 positioned along the other surface. The second pattern 122 may be electrically connected to the first pattern 121, which is positioned along one of the two opposing outer surfaces. In this case, the second pattern 122 is not electrically connected to the first pattern 121 positioned along the other surface. When the second pattern 122 is in contact with the first pattern 121, the pattern positioned in the first region 110s is the first pattern 121. This arrangement increases the contact area of ​​the second pattern 122. It also avoids the two first patterns 121 being electrically connected via the second pattern 122.

[0040] In the illustrated example, one second pattern 122 is placed in one of the second regions 110t along the two opposing outer surfaces of the frame portion 112. Note that the number of second patterns 122 placed in this one second region 110t is not limited to one. Also, in the illustrated example, one second pattern 122 is placed in the other second region 110t along the two opposing outer surfaces. The number of second patterns 122 placed in each second region 110t along the two opposing outer surfaces is the same. The number of second patterns 122 placed in each second region 110t may be different. From the viewpoint of increasing the joining area, it is preferable to provide a second pattern 122 in all second regions 110t. Furthermore, it is preferable to have only one second pattern 122 in each second region 110t, as this eliminates the need to secure an area to separate the second patterns 122 from each other.

[0041] In the illustrated example, in a bottom view, the second pattern 122 positioned along one outer surface of the frame portion 112 and the second pattern 122 positioned along the other outer surface of the frame portion 112 face each other with the bottom surface 111b of the bottom portion 111 in between. In a bottom view, each second pattern 122 is spaced apart from the bottom surface 111b of the bottom portion 111. In a bottom view, each second pattern 122 may also be spaced apart from the inner edge of the bottom surface 112b of the frame portion 112. The lengths of each second pattern 122 may be the same or different. The widths of each second pattern 122 may be the same or different.

[0042] The area occupied by the second pattern 122 relative to the lower surface 112b of the frame portion 112 is, for example, 29% or more. Compared to the case where only the first pattern 121 is provided on the lower surface 112b of the frame portion 112, the rate of increase in the area of ​​the pattern due to the provision of the second pattern 122 is, for example, 29% or more. The area of ​​the second pattern 122 relative to the area of ​​the second region 110t is, for example, 54% or more. The ratio of the area of ​​the second pattern 122 relative to the area of ​​the first pattern 121 is, for example, 117% or more. The area ratio of the first pattern 121 relative to the area of ​​the lower surface 111b of the bottom portion 111 is, for example, 12% or more. The area ratio of the second pattern 122 relative to the area of ​​the lower surface 111b of the bottom portion 111 is, for example, 34% or more.

[0043] The area occupied by the second pattern 122 relative to the lower surface 112b of the frame portion 112 is, for example, 39% or less. Compared to the case where only the first pattern 121 is provided on the lower surface 112b of the frame portion 112, the rate of increase in the area of ​​the pattern due to the provision of the second pattern 122 is, for example, 39% or less. The area of ​​the second pattern 122 relative to the area of ​​the second region 110t is, for example, 64% or less. The ratio of the area of ​​the second pattern 122 to the area of ​​the first pattern 121 is, for example, 127% or less. The area ratio of the first pattern 121 to the area of ​​the lower surface 111b of the bottom portion 111 is, for example, 22% or less. The area ratio of the second pattern 122 to the area of ​​the lower surface 111b of the bottom portion 111 is, for example, 44% or less.

[0044] When the base body 110 is rectangular in a view from below, in the first region direction, the length of the second pattern 122 on one side is less than the length of the first pattern 121 on one side. Also, in the second region direction, the length of the second pattern 122 on one side is greater than the length of the first pattern 121 on one side.

[0045] When the base 110 has a bottom portion 111 and a frame portion 112, in a view from below, the distance between the second pattern 122 and the inner edge of the frame portion 112 facing the second pattern 122 is smaller than the distance between the first pattern 121 and the inner edge of the frame portion 112 facing the first pattern 121. Since the second pattern 122 is not intended to be electrically connected to the light-emitting element, even if it is conductive with the bottom portion 111, it will not cause electrical leakage in the light-emitting element. Therefore, the second pattern 122 can be brought closer to the inner edge of the frame portion 112 than the first pattern 121, and the bonding area can be increased. Also, the width of the second pattern 122 in the first region direction is larger than the distance between the second pattern 122 and the inner edge of the frame portion 112 facing the second pattern 122.

[0046] In the illustrated example, the width of the second pattern 122 (width in the first region direction) is smaller than the width of the first pattern (width in the second region direction). By reducing the width of the second pattern 122, the width of the base 110 in the first region direction can be reduced.

[0047] As will be described later, when the light-emitting element mounting package 100 is mounted on a wiring board and used, if the base body 110 has a bottom portion 111 and a frame portion 112, the bottom portion 111 and the frame portion 112 are separate components, so it is possible that one may be bonded to the wiring board while the other detaches from it. Also, in this case, since the bottom portion 111 and the frame portion 112 are separate components, the area of ​​the lower surface 112b of the frame portion 112 that can be used to bond with the wiring board is smaller compared to the case where the base body 110 is a single component. Therefore, when the base body 110 has a bottom portion 111 and a frame portion 112, it is preferable to increase the bonding area with the wiring board on the lower surface 112b of the frame portion 112 in order to improve the bonding strength between the entire base body 110 and the wiring board. Thus, the technical significance of providing the second pattern 122 becomes greater when the base body 110 has a bottom portion 111 and a frame portion 112.

[0048] Furthermore, the technical significance of providing the second pattern 122 becomes even greater when the lower surface 112b of the frame portion 112 is on the same plane as the lower surface 111b of the bottom portion 111, or when it is lower than the lower surface 111b of the bottom portion 111; in other words, when the lower surface 112b of the frame portion 112 is used as the bonding surface between the base body 110 and the wiring board.

[0049] It is preferable that the first pattern 121 is arranged symmetrically on the lower surface 110b with respect to a hypothetical line passing through the center of the lower surface 110b. Similarly, it is preferable that the second pattern 122 is arranged symmetrically on the lower surface 110b with respect to a hypothetical line passing through the center of the lower surface 110b. By arranging the first pattern 121 or the second pattern 122 in a balanced, symmetrical manner in this way, when the light-emitting element mounting package 100 is mounted on a wiring board and used as described later, the concentration of stress due to thermal shock on one of the first pattern 121 or the second pattern 122 can be reduced. Therefore, the occurrence of cracks or peeling at the joint between the light-emitting element mounting package 100 and the wiring board can be reduced, and the joint strength when the light-emitting element mounting package 100 is joined to the wiring board can be improved.

[0050] One or more third patterns 123 may be arranged on the upper surface 113a of the stepped portion 113. The third patterns 123 can be used as connection areas for wiring 250. The third patterns 123 and the first patterns 121 can be electrically connected, for example, through vias provided in the frame portion 112. At this time, the light-emitting element 220 and the first patterns 121 can be electrically connected by electrically connecting the light-emitting element 220 to the third patterns 123 with the wiring 250 (for example, by connecting one end of the wiring 250 to the third patterns 123 and the other end to the light-emitting element 220).

[0051] The bottom portion 111 and the frame portion 112 form a concave shape that is recessed from the upper surface 112a of the frame portion 112 toward the mounting surface of the bottom portion 111. The concave shape is formed inside the outer shape of the frame portion 112 when viewed from above. When viewed from above, the mounting surface of the bottom portion 111 is surrounded by a frame formed by one or more inner surfaces of the frame portion 112 and / or the inner surfaces of the stepped portion 113. The outer shape of this frame may be a rectangle with a long side and a short side. In the illustrated example, the bottom portion 111 and the frame portion 112 are formed separately and then joined together.

[0052] The bottom portion 111 can be formed primarily from a metal, for example. For example, copper, copper alloys, etc., can be used as the metal. By using a metal as the main material for the bottom portion 111, heat dissipation can be improved. However, it is preferable to use a material with high heat dissipation properties for the bottom portion 111, not limited to metal. The frame portion 112 can be formed primarily from a ceramic, for example. For example, aluminum nitride, silicon nitride, aluminum oxide, or silicon carbide can be used as the ceramic.

[0053] The first pattern 121 can be formed using, for example, a metal as the main material. For example, Ni / Au (metal films laminated in the order of Ni, Au) or Ti / Pt / Au (metal films laminated in the order of Ti, Pt, Au) can be used as the metal. The second pattern 122 can be formed using, for example, a metal as the main material. For the second pattern 122, for example, Ni / Au (metal films laminated in the order of Ni, Au) or Ti / Pt / Au (metal films laminated in the order of Ti, Pt, Au) can be used as the metal. The second pattern 122 may be formed using a different metal as the main material than the first pattern 121. The third pattern 123 can be formed using, for example, the same metal as the first pattern 121 or the second pattern 122 as the main material. The third pattern 123 may be formed using a different metal as the main material than both the first pattern 121 and the second pattern 122.

[0054] From the viewpoint of improving heat dissipation, it is preferable that the main material of the bottom portion 111, which serves as the heat dissipation section, be a material with high thermal conductivity. The thickness of the bottom portion 111 is, for example, 550 μm or more and 650 μm or less. The thickness of the first pattern 121 is, for example, 3 μm or more and 10 μm or less. The thickness of the second pattern 122 is, for example, 3 μm or more and 10 μm or less. The thicknesses of the first pattern 121 and the second pattern 122 may be the same. From the viewpoint of improving heat dissipation, it is preferable that the bottom portion 111, which serves as the heat dissipation section, is thicker than the first pattern 121 and the second pattern 122.

[0055] The light-emitting element mounting package 100 can be used by mounting the light-emitting element on a wiring board via a solder joint or similar connection. Since the wiring board on which the light-emitting element mounting package 100 is mounted is exposed to a wide range of temperatures from low to high, the connection joint is susceptible to thermal shock.

[0056] However, in the light-emitting element mounting package 100, the area of ​​the bonding pattern provided on the lower surface 112b of the frame portion 112 is increased by providing the first pattern 121 and the second pattern 122, thereby increasing the bonding strength. As a result, the area in contact between the light-emitting element mounting package 100 and the wiring board is increased, so that stress due to thermal shock is dispersed and the stress applied per unit area of ​​the bonding portion is reduced. Therefore, cracks and peeling are less likely to occur at the bonding portion, and the bonding strength when bonding the light-emitting element mounting package 100 to the wiring board can be improved.

[0057] <Second Embodiment> In the second embodiment, a light-emitting device 200 having a light-emitting element mounting package 100 according to the present disclosure will be described. Figure 5 is a perspective view of the light-emitting device 200. Figure 6 is a top view of the light-emitting device 200. Figure 7 is a top view of the light-emitting device 200 shown in Figure 6 with the lens member and lid removed. Figure 8 is a cross-sectional view of the light-emitting device 200 along the cross-sectional line VIII-VIII in Figure 6.

[0058] The light-emitting device 200 includes a light-emitting element mounting package 100, a submount 210, one or more light-emitting elements 220, one or more reflective members 230, wiring 250, a cover 260, and a lens member 280. Note that the light-emitting device 200 may omit some of these components. The individual components of the light-emitting device 200 will be described below.

[0059] (Submount 210) The submount 210 is, for example, configured in the shape of a rectangular parallelepiped and has a bottom surface, a top surface, and one or more sides. The submount 210 has the smallest width in the vertical direction. Note that the shape is not limited to a rectangular parallelepiped. The submount 210 is formed using, for example, aluminum nitride or silicon carbide, but other materials may be used. A metal film may or may not be provided on the top and / or bottom surface of the submount 210.

[0060] (Light-emitting element 220) The light-emitting device 200 can be equipped with one or more light-emitting elements 220. In the illustrated example of the light-emitting device 200, five light-emitting elements 220 are equipped. The light-emitting elements 220 are, for example, semiconductor laser elements. The light-emitting elements 220 are not limited to semiconductor laser elements, but may also be, for example, light-emitting diodes (LEDs) or organic light-emitting diodes (OLEDs). In the illustrated example of the light-emitting device 200, semiconductor laser elements are used as light-emitting elements 220.

[0061] The light-emitting element 220 has, for example, a rectangular shape when viewed from above. The side where it intersects with one of the two shorter sides of the rectangle becomes the light-emitting end face from the light-emitting element 220. The top and bottom surfaces of the light-emitting element 220 have a larger area than the light-emitting end face. A metal film may or may not be provided on the top surface of the light-emitting element 220.

[0062] As the light-emitting element 220, a light-emitting element that emits blue light can be used. "Light-emitting element that emits blue light" refers to a light-emitting element whose emitted light peak wavelength is in the range of 405 nm to 494 nm. Furthermore, it is preferable to use a light-emitting element 220 whose emitted light peak wavelength is in the range of 430 nm to 480 nm. Examples of such light-emitting elements 220 include semiconductor laser elements containing nitride semiconductors. For example, GaN, InGaN, or AlGaN can be used as nitride semiconductors.

[0063] The emission peak of the light emitted from the light-emitting element 220 is not limited to this. For example, the light emitted from the light-emitting element 220 may be blue light, as well as visible light including green light and red light having wavelengths outside the aforementioned wavelength range, ultraviolet light, and infrared light.

[0064] (Reflective member 230) The reflective member 230 comprises a bottom surface, a plurality of side surfaces, and a light-reflecting surface inclined with respect to the bottom surface. The plurality of side surfaces include two side surfaces that face each other across the light-reflecting surface. Preferably, the light-reflecting surface has a light reflectance of 90% or more with respect to the peak wavelength of the irradiated light. The light-reflecting surface is, for example, a flat surface. The inclination angle of the light-reflecting surface with respect to the bottom surface is in the range of 10 degrees to 80 degrees, for example, 45 degrees.

[0065] The reflective member 230 can use glass or metal as the main material that forms its outer shape. The main material is preferably a heat-resistant material, such as glass like quartz or BK7 (borosilicate glass), metals like aluminum, or Si. The light-reflecting surface can be formed using, for example, metals like Ag or Al, or dielectric multilayer films such as Ta2O5 / SiO2, TiO2 / SiO2, or Nb2O5 / SiO2.

[0066] (Wiring 250) The wiring 250 is composed of a conductor having a linear shape with joints at both ends. In other words, the wiring 250 has joints at both ends of the linear portion for joining with other components. The wiring 250 is used for electrical connection between two components. As the wiring 250, for example, a metal wire can be used. Examples of metals include gold, aluminum, silver, copper, and tungsten.

[0067] (Lid part 260) The lid 260 has an upper surface, a lower surface, and one or more sides that intersect the upper and lower surfaces. The one or more sides connect the outer edge of the upper surface to the outer edge of the lower surface. The lid 260 is, for example, a rectangular parallelepiped or a cube. In this case, both the upper and lower surfaces of the lid 260 are rectangular, and the lid 260 has four rectangular sides.

[0068] However, the lid 260 is not limited to a rectangular prism or a cube. In other words, the lid 260 is not limited to a rectangle when viewed from above, and can be any shape such as a circle, ellipse, or polygon.

[0069] The lid portion 260 has a light-transmitting region that transmits light of a predetermined wavelength. The light-transmitting region constitutes at least a part of the upper and lower surfaces of the lid portion 260. The light-transmitting region of the lid portion 260 can be formed using, for example, sapphire as the main material. Sapphire is a material with relatively high transmittance and relatively high strength. In addition to sapphire, other translucent materials such as quartz, silicon carbide, or glass may be used as the main material for the light-transmitting region of the lid portion 260. The parts of the lid portion 260 other than the light-transmitting region may be formed integrally with the light-transmitting region using the same material.

[0070] (Lens component 280) The lens member 280 has an upper surface, a lower surface, and side surfaces. The lens member 280 imparts optical effects such as focusing, diffusing, and collimating to incident light, and light with these optical effects is emitted from the lens member 280.

[0071] The lens member 280 has one or more lens surfaces. The one or more lens surfaces are provided on the upper side of the lens member 280. Alternatively, they may be provided on the lower side of the lens member 280. The lens member 280 has an upper surface and a lower surface, both of which are flat. The one or more lens surfaces intersect with the upper surface. The one or more lens surfaces are surrounded by the upper surface when viewed from above. When viewed from above, the lens member 280 has a rectangular outline. The lower surface of the lens member 280 is rectangular.

[0072] In the lens member 280, the portion that overlaps with one or more lens surfaces when viewed from above is designated as the lens portion, and the portion that does not overlap is designated as the non-lens portion. In the lens member 280, the portion that overlaps with the top surface when viewed from above is included in the non-lens portion. The lens portion can also be distinguished as a lens-shaped portion when the lens surface side is divided by a hypothetical plane including the top surface, and a flat plate-shaped portion when the lens surface side is divided. The bottom surface of the lens member 280 is composed of the bottom surface of the lens portion and the bottom surface of the non-lens portion.

[0073] In a lens member 280 having multiple lens surfaces, the multiple lens surfaces are formed in a continuous line in one direction. That is, the multiple lens surfaces are connected to each other and arranged in the same direction. The lens member 280 is formed such that the vertices of each lens surface lie on a hypothetical straight line. This hypothetical straight line is in the same direction as the longitudinal direction of the lens member 280.

[0074] Here, the direction in which multiple lens surfaces are aligned when viewed from above is called the connection direction. When viewed from above, the length of the multiple lens surfaces in the connection direction is greater than the length in the direction perpendicular to this direction. In the illustrated lens member 280, the connection direction is the same direction as the longitudinal direction of the lens member 280.

[0075] The lens member 280 is light-transmitting. Both the lens portion and the non-lens portion of the lens member 280 are light-transmitting. The lens member 280 can be formed using, for example, glass such as BK7.

[0076] (Light-emitting device 200) In the light-emitting device 200, one or more light-emitting elements 220 are mounted in the mounting area 110r and surrounded by the frame portion 112. A submount 210 and a reflective member 230 are arranged on the bottom portion 111, and the light-emitting elements 220 are positioned on the submount 210. For example, a metal film formed on the lower surface of the light-emitting element 220 and a metal film formed on the upper surface of the submount 210 are joined via Au-Sn or the like. The light-emitting element 220 may be positioned such that, for example, its emitting end face faces the light-reflecting surface side of the reflective member 230.

[0077] A submount 210 is placed on the bottom portion 111, and a light-emitting element 220 is placed on the submount 210. Therefore, the heat emitted by the light-emitting element 220 is dissipated through the submount 210 to the bottom portion 111 and to the outside of the light-emitting device 200. From the viewpoint of improving heat dissipation, it is preferable to use a material for the bottom portion 111 that is separate from the frame portion 112 and whose main material is a material with high thermal conductivity. Similarly, it is preferable to increase the area of ​​the bottom portion 111. If the bottom portion 111 is to be enlarged without changing the size of the light-emitting device 200, the frame portion 112 must be made smaller. In this case, the lower surface 112b of the frame portion 112 becomes smaller, so the technical significance of providing the second pattern 122 to increase the bonding area becomes greater.

[0078] In the illustrated light-emitting device 200, multiple light-emitting elements 220 are arranged in a line along the longitudinal direction of the bottom 111. Light is emitted from the light-emitting surface of each light-emitting element 220 in the same direction. Here, the same direction includes an angular difference of ±10 degrees. In the illustrated light-emitting device 200, each of the multiple light-emitting elements 220 emits light from its emission end face toward the light-reflecting surface of the reflecting member 230.

[0079] Each light-emitting element 220 is electrically connected to the light-emitting element mounting package 100 by a plurality of wires 250. Among the plurality of wires 250, there are wires 250 whose one end of the junction is connected to the light-emitting element mounting package 100. Among the plurality of wires 250, there are wires 250 whose one end of the junction is connected to the light-emitting element 220. In the illustrated example, each light-emitting element 220 is electrically connected in series by a plurality of wires 250.

[0080] The light-emitting element 220, located at one end of the bottom portion 111 in the longitudinal direction, is electrically connected via wiring 250 to a third pattern 123 provided on one upper surface 113a of the stepped portion 113. For example, one end of the wiring 250 is joined to a metal film provided on the upper surface of the light-emitting element 220, and the other end of the wiring 250 is joined to the third pattern 123 provided on one upper surface 113a of the stepped portion 113.

[0081] In the illustrated example, stepped portions 113 are provided along two opposing inner surfaces on the short side of the frame portion 112. From the viewpoint of miniaturizing the light-emitting device 200, it is preferable that the width of the side of the lower surface 112b of the frame portion 112 on which the stepped portion 113 is not provided (the long side) is smaller than the width of the side on which the stepped portion 113 is provided (the short side). This is because if the width of the side on which the stepped portion 113 is not provided (the long side) is the same as the width of the side on which the stepped portion 113 is provided (the short side), the size of the light-emitting device 200 will increase accordingly. In order to improve the bonding strength with the wiring board while preventing the light-emitting device 200 from becoming larger, it is necessary to make the area of ​​the second pattern 122 as large as possible on the side of the lower surface 112b of the frame portion 112 on which the stepped portion 113 is not provided (the long side), which has a smaller width.

[0082] A metal film formed on the upper surface of the submount 210, which mounts the light-emitting element 220 located at the other end of the longitudinal direction of the bottom portion 111, is electrically connected via wiring 250 to a third pattern 123 provided on the other upper surface 113a of the stepped portion 113. For example, one end of the wiring 250 is joined to the metal film provided on the upper surface of the submount 210, and the other end of the wiring 250 is joined to the third pattern 123 provided on the other upper surface 113a of the stepped portion 113.

[0083] In the light-emitting device 200, a reflective member 230 is provided to reflect light emitted from the light-emitting element 220. Light emitted from one or more light-emitting elements 220 is reflected by the light-reflecting surface of one or more reflective members 230. One reflective member 230 may reflect light emitted from multiple light-emitting elements 220, or the light-emitting elements 220 and reflective members 230 may be arranged in a one-to-one ratio.

[0084] The lid portion 260 is joined to the upper surface 112a of the frame portion 112 of the light-emitting element mounting package 100. More specifically, the lid portion 260 is supported by the upper surface 112a of the frame portion 112 and is positioned above the light-emitting element 220 surrounded by the frame portion 112. The outer periphery of the lower surface of the lid portion 260 is joined to, for example, the upper surface 112a of the frame portion 112. For example, a metal film provided on the outer periphery of the lower surface of the lid portion 260 and a metal film provided on the upper surface 112a of the frame portion 112 are joined and fixed via Au-Sn or the like.

[0085] The lid portion 260, by joining with the upper surface 112a of the frame portion 112, together with the bottom portion 111 and the frame portion 112, seals the space in which the light-emitting element 220 is arranged. This space may be formed in an hermetically sealed state. For example, when an end-face emitting laser is used as the light-emitting element 220, organic matter and the like tend to accumulate on the emission end surface, so it is preferable to arrange it in an hermetically sealed space. Also, when a light-emitting element 220 that emits light with a wavelength shorter than green is used, organic matter and the like tend to accumulate on the emission end surface, so it is preferable to arrange it in an hermetically sealed space. Therefore, when an end-face emitting laser that emits light with a wavelength shorter than green is used as the light-emitting element 220, it is particularly preferable to arrange it in an hermetically sealed space.

[0086] The lid portion 260 has a light-transmitting region that transmits light reflected upward from the light-reflecting surface of the reflective member 230 and emits it to the lens member 280. In other words, light reflected from the light-reflecting surface of the reflective member 230 toward the lid portion 260 passes through the light-transmitting region of the lid portion 260. The entire lid portion 260 may be a light-transmitting region. Preferably, the light-transmitting region of the lid portion 260 transmits 70% or more of the light reflected from the light-reflecting surface of the reflective member 230 toward the lid portion 260.

[0087] The lens member 280 is positioned on the lid 260. The lens member 280 is joined to the lid 260. One lens surface of the lens member 280 corresponds to the light emitted from one light-emitting element 220. The light emitted from each light-emitting element 220 is reflected upward by the light-reflecting surface of the reflecting member 230, and is sequentially transmitted through the lid 260 and the lens member 280 before being emitted to the outside of the light-emitting device 200.

[0088] The light-emitting element mounting package 100 can be used by mounting the light-emitting element onto a wiring board via a solder joint or the like. For example, when the light-emitting element mounting package 100 is used in automotive applications, the wiring board on which the light-emitting element mounting package 100 is mounted is exposed to a wide range of temperatures from low to high, making the joint susceptible to thermal shock.

[0089] As described above, the light-emitting element mounting package 100 that constitutes the light-emitting device 200 has a bottom surface 111b and a first pattern 121 that can be joined to the wiring board via a joint, and the second pattern 122 can also be joined to the wiring board via a joint. Therefore, the bonding strength when joining the light-emitting element mounting package 100 that constitutes the light-emitting device 200 to the wiring board can be improved.

[0090] <Third Embodiment> In the third embodiment, a light-emitting module 300 having a light-emitting device 200 according to the present disclosure will be described. Figure 9 is a perspective view of the light-emitting module 300. Figure 10 is a top view of the light-emitting module 300. Figure 11 is a top view of the wiring board constituting the light-emitting module 300. Figure 12 is a cross-sectional view of the wiring board along the cross-sectional line XII-XII in Figure 11. Figure 13 is a cross-sectional view of the wiring board along the cross-sectional line XIII-XIII in Figure 11.

[0091] For reference, Figures 9 to 12 show mutually orthogonal X, Y, and Z axes. The direction parallel to the X axis is called the first direction X, the direction parallel to the Y axis is called the second direction Y, and the direction parallel to the Z axis is called the third direction Z. However, these do not restrict the orientation of the light-emitting module 300 when it is in use, and the orientation of the light-emitting module 300 is arbitrary.

[0092] The light-emitting module 300 includes a wiring board 310, one or more light-emitting devices 200, a thermistor 370, and a connector 380. Note that the light-emitting module 300 may omit some of these components. The components of the light-emitting module 300 will be described below.

[0093] (Wiring board 310) The wiring board 310 is, for example, rectangular in top view. This rectangle has a long side and a short side. In the illustrated wiring board 310, the top surface of the wiring board 310 extends in a first direction X and a second direction Y.

[0094] The thickness (width in the third direction Z) of the wiring board 310 is, for example, 0.5 mm or more and 3.0 mm or less. Preferably, the thickness of the wiring board 310 is 1.0 mm or more and 2.0 mm or less. If the thickness of the wiring board 310 is 1 mm or more, the strength can be improved. On the other hand, if the thickness of the wiring board 310 is 2 mm or less, it can be made thinner.

[0095] The wiring board 310 has a first metal portion 321, an electrode portion 322, and a first insulating portion 331. The first insulating portion 331 is the portion shown as a dot pattern in Figure 11, etc.

[0096] The first metal part 321 has an upper surface 321a, a lower surface 321b, and a stepped surface 321c located on the lower surface 321b side of the upper surface 321a. The upper surface 321a, the lower surface 321b, and the stepped surface 321c are parallel. The upper surface 321a of the first metal part 321 is exposed from the first insulating part 331.

[0097] In the illustrated example, the wiring board 310 further includes a second metal portion 323, a first wiring portion 324, a second wiring portion 325, a metal layer 326, a second insulating portion 332, and a third insulating portion 333. The upper surfaces of the second metal portion 323, the first wiring portion 324, and the second wiring portion 325 are exposed from the first insulating portion 331.

[0098] The metal layer 326, the second insulating portion 332, and the third insulating portion 333 are located below the electrode portion 322 and the first insulating portion 331. Specifically, on the stepped surface 321c of the first metal portion 321, the layers are stacked from bottom to top in the order of the third insulating portion 333, the metal layer 326, and the second insulating portion 332. The electrode portion 322 and the first insulating portion 331 are positioned on the upper surface of the second insulating portion 332. The upper surface of the electrode portion 322 is exposed from the first insulating portion 331. In this way, the presence of the metal layer 326 improves the heat dissipation of the wiring board 310. The first wiring portion 324 and the second wiring portion 325 are on the same plane as the electrode portion 322. That is, the first wiring portion 324 and the second wiring portion 325 are positioned on the upper surface of the second insulating portion 332.

[0099] The second metal part 323 has an upper surface 323a, a lower surface 323b, and a stepped surface 323c located on the lower surface 323b side of the upper surface 323a. The upper surface 323a, the lower surface 323b, and the stepped surface 323c are parallel. The upper surface 323a of the second metal part 323 is exposed from the first insulating part 331. The stepped surface 321c of the first metal part 321 and the stepped surface 323c of the second metal part 323 are on the same plane, and the lower surface 321b of the first metal part 321 and the lower surface 323b of the second metal part 323 are on the same plane. The portion of the second metal part 323 below the stepped surface 323c is integrated with the portion of the first metal part 321 below the stepped surface 321c.

[0100] The first metal part 321 and the second metal part 323 can use a metallic material as their main material. For example, elemental metals such as Cu, Ag, Al, Ni, Rh, Au, Ti, Pt, Pd, Mo, Cr, and W, or alloys containing at least one of these metals, can be used as the main material for the first metal part 321 and the second metal part 323. It is preferable that the first metal part 321 and the second metal part 323 be formed from a material with excellent heat dissipation properties. The main material of the first metal part 321 and the second metal part 323 can be the material with the highest thermal conductivity among the main materials of the components constituting the wiring board 310. Cu is a suitable example of the main material for the first metal part 321 and the second metal part 323. The first metal part 321 and the second metal part 323 may be formed containing 95% by mass or more of Cu.

[0101] The electrode portion 322 can use a metallic material as its main material. For example, elemental metals such as Cu, Ag, Al, Ni, Rh, Au, Ti, Pt, Pd, Mo, Cr, and W, or alloys containing at least one of these metals, can be used as the main material of the electrode portion 322. Cu is a suitable example of the main material for the electrode portion 322. The electrode portion 322 may be formed containing 95% by mass or more of Cu. The first wiring portion 324, the second wiring portion 325, and the metal layer 326 can be formed using the same material as the electrode portion 322.

[0102] The first insulating portion 331, the second insulating portion 332, and the third insulating portion 333 are formed of an insulating material. For example, polyimide can be used as the main material for the first insulating portion 331, the second insulating portion 332, and the third insulating portion 333. Alternatively, for example, the main material for the first insulating portion 331, the second insulating portion 332, and the third insulating portion 333 can be glass epoxy, which is obtained by impregnating one or more sheets of glass cloth with a thermosetting insulating resin such as epoxy resin and curing the thermosetting insulating resin, or liquid crystal polymer, etc.

[0103] For example, a resist such as solder resist can be used for the first insulating portion 331. A film-like polyimide can be used for the second insulating portion 332. A bonding sheet such as a heat-resistant resin sheet or a UV-curing sheet can be used for the third insulating portion 333.

[0104] The wiring board 310 may have a plating layer on the upper surfaces of the first metal portion 321, electrode portion 322, second metal portion 323, first wiring portion 324, and second wiring portion 325 that are exposed from the first insulating portion 331. The plating layer can use a metallic material as its main material. For example, a single metal such as Au, Ag, Cu, Pt, Ni, or Pd, or an alloy containing at least one of these metals, can be used as the main material of the plating layer.

[0105] The wiring board 310 includes a mounting section 310R1 on which the light-emitting device 200 is mounted. Viewed from above, the mounting section 310R1 includes a first metal part 321, an electrode part 322, and a first insulating part 331 sandwiched between the first metal part 321 and the electrode part 322. The mounting section 310R1 can be described as the region of the wiring board 310 sandwiched between a first virtual line that includes the outermost edge of the first metal part 321 and the electrode part 322 in a top view in a first direction X, and a second virtual line that includes the outermost edge in the opposite direction to the first direction X in a top view. The wiring board 310 also includes a pair of outer regions 310R2 located on both sides of the mounting section 310R1 in the first direction X. In other words, the wiring board 310 includes an outer region 310R2 located on the outside in the first direction X relative to the mounting portion 310R1, and an outer region 310R2 located on the outside in the direction opposite to the first direction X.

[0106] In a top view, each outer region 310R2 includes a first through-hole 351 and a second through-hole 352. All first through-holes 351 and second through-holes 352 are located within the outer region 310R2. Within each outer region 310R2, the second through-holes 352 are positioned on both sides of a virtual line V connecting the centers of the first through-holes 351 located within each outer region 310R2. As shown in Figure 10, it is preferable that the virtual line V passes through the center of the light-emitting device 200. All second through-holes 352 are located within a predetermined distance from the virtual line V. Here, the predetermined distance is, for example, 4700 μm or more and 5700 μm or less.

[0107] The first through-hole 351 is a hole for fixing the wiring board 310 to another component. In addition, the two second through-holes 352 located on one side of the virtual line V in the second direction Y are holes for determining the position when fixing the wiring board 310 to another component. The first through-hole 351 and the second through-holes 352 can be formed, for example, by mold processing.

[0108] In the illustrated example, the first through-hole 351 penetrates from the upper surface 323a to the lower surface 323b of the second metal part 323. The shape of the first through-hole 351 is, for example, circular when viewed from above. In the illustrated example, the second through-hole 352 penetrates the first insulating part 331, the second insulating part 332, the metal layer 326, the third insulating part 333, and the portion of the second metal part 323 below the stepped surface 323c. The shape of the second through-hole 352 is, for example, circular or elliptical when viewed from above. When viewed from above, the size of the second through-hole 352 may be smaller than the size of the first through-hole 351.

[0109] (Thermistor 370) Thermistor 370 can be used as a temperature measuring element.

[0110] (Connector 380) Connector 380 has a socket into which a connector cable is inserted.

[0111] (Light-emitting module 300) In the light-emitting module 300, one or more light-emitting devices 200 are mounted on the wiring board 310. The one or more light-emitting devices 200 are mounted on the mounting section 310R1 of the wiring board 310. In the illustrated example, two light-emitting devices 200 are mounted on the mounting section 310R1. Each light-emitting device 200 is connected, for example, in series. Each light-emitting device 200 may also be connected in parallel.

[0112] The first pattern 121 of each light-emitting device 200 is joined to the electrode portion 322 via a conductive bonding material such as solder. The bottom portion 111 and the second pattern 122, which serve as heat dissipation portions, are joined to the upper surface 321a of the first metal portion 321 via a conductive bonding material such as solder. One or more light-emitting devices 200 may be mounted on the mounting portion 310R1.

[0113] Each light-emitting device 200 is electrically connected to the wiring board 310 by the first pattern 121, even if the second pattern 122, which extends from the second side of the base body 110 and is formed thereon, is not joined to the electrode portion 322 of the wiring board 310, and the second pattern 122 and the wiring board 310 are joined via an insulating member.

[0114] In the light-emitting module 300, a thermistor 370 may be placed on the wiring board 310. The thermistor 370 can be placed, for example, on the first wiring section 324 of the wiring board 310. The thermistor 370 is internally connected to the electrode section 322 that connects to each light-emitting device 200.

[0115] In the light-emitting module 300, a connector 380 may be placed on the wiring board 310. The connector 380 can be placed, for example, on the second wiring section 325 of the wiring board 310. The connector 380 is internally connected to the electrode section 322 that connects to each light-emitting device 200. By using the connector 380, power can be supplied to one or more light-emitting devices 200 using a connector cable.

[0116] Thus, in the light-emitting module 300, the light-emitting element mounting package 100 constituting the light-emitting device 200 has a first pattern 121 that is joined to the electrode portion 322 of the wiring board 310 via a joint, and the lower surface 111b of the bottom portion 111 and the second pattern 122 that are joined to the first metal portion 321 of the wiring board 310 via a joint. As a result, the area in contact between the light-emitting element mounting package 100 and the wiring board 310 and the joint is increased compared to when the second pattern 122 is not provided, so that stress due to thermal shock is distributed and the stress applied per unit area of ​​the joint is reduced. Therefore, cracks and peeling are less likely to occur at the joint, and the bonding strength between the light-emitting element mounting package 100 and the wiring board 310 constituting the light-emitting device 200 can be improved.

[0117] Furthermore, in the wiring board 310, when viewed from above, each outer region 310R2 includes a first through hole 351 and a second through hole 352, and the second through hole 352 is positioned on both sides of a virtual line V connecting the centers of the first through holes 351 located in each outer region 310R2. As a result, stress due to thermal shock is evenly distributed by the second through holes 352, and the stress per unit area of ​​the joint is reduced. Therefore, cracks and peeling are less likely to occur at the joint, and the joint strength between the light-emitting element mounting package 100 and the wiring board 310 that constitute the light-emitting device 200 can be further improved. In particular, a remarkable effect is obtained when, when viewed from above, the virtual line V connecting the centers of the first through holes 351 located in each outer region 310R2 passes through the center of the light-emitting device 200.

[0118] The light-emitting module 300 can be used, for example, in automotive headlights. However, the light-emitting module 300 can be used as a light source for lighting, projectors, head-mounted displays, and other displays such as backlights.

[0119] Although preferred embodiments have been described in detail above, the invention is not limited to the embodiments described above, and various modifications and substitutions can be made to the embodiments described above without departing from the scope of the claims.

[0120] In addition to the embodiments described above, the following further notes are disclosed. (Note 1) A substrate having an upper surface having a mounting area for a light-emitting element, and a lower surface opposite to the upper surface, On the lower surface of the substrate, a first pattern which is an electrode pattern is arranged in a region other than the region that overlaps with the mounting region when viewed from below, The lower surface of the substrate has a second pattern, which is arranged in an area other than the area that overlaps with the mounting area when viewed from below, The second pattern is a package for mounting light-emitting elements, which is not electrically connected to the first pattern. (Note 2) The substrate has a heat dissipation section with a lower surface, The lower surface of the heat dissipation section includes an area that overlaps with the mounting area when viewed from below. The main material of the heat dissipation section is a light-emitting element mounting package as described in Appendix 1, wherein the main material has a higher thermal conductivity than the main material of the first pattern and the main material of the second pattern. (Note 3) The heat dissipation portion is thicker than the first pattern and the second pattern, and is a package for mounting light-emitting elements as described in Appendix 2. (Note 4) The aforementioned substrate is The bottom portion having the upper surface and the lower surface, It has a frame portion that is joined to the bottom portion, surrounds the mounting area of ​​the bottom portion when viewed from above, and surrounds the bottom surface of the bottom portion when viewed from below, The bottom portion is the heat dissipation portion, which is the package for mounting the light-emitting element as described in Appendix 3. (Note 5) The first pattern and the second pattern are packages for mounting light-emitting elements as described in Appendix 4, which are arranged on the lower surface of the frame portion. (Note 6) The lower surface of the bottom portion and the lower surface of the frame portion are located on the same plane. The package for mounting light-emitting elements as described in Appendix 4 or 5, wherein the thickness of the first pattern and the thickness of the second pattern are the same. (Note 7) A package for mounting a light-emitting element, as described in any one of appendices 4 to 6, wherein the bottom portion is mainly made of metal and the frame portion is mainly made of ceramic. (Note 8) A package for mounting light-emitting elements as described in any one of Appendix 4 to 7, One or more light-emitting elements are mounted in the aforementioned mounting area and surrounded by the aforementioned frame portion, A light-emitting device having a lid that is joined to the upper surface of the frame and, together with the bottom and the frame, seals the space in which the light-emitting element is arranged. (Note 9) A light-emitting module comprising a wiring board and a light-emitting device described in Appendix 8 mounted on the wiring board, The aforementioned wiring board is The mounting section on which the light-emitting device is mounted, Including a pair of outer regions located on both sides of the mounting portion in a first direction, In a top view, each of the aforementioned outer regions is, It includes a first through hole and a second through hole, The second through-holes are located on both sides of a virtual line connecting the centers of the first through-holes located in each of the outer regions. The aforementioned mounting unit is In a top view, it includes a first metal portion, a first insulating portion, and an electrode portion that is separated from the first metal portion with the first insulating portion in between. A light-emitting module in which the first pattern of the light-emitting device is joined to the electrode portion, and the heat dissipation portion and the second pattern are joined to the first metal portion. (Note 10) In a top view, the dashed line passes through the center of the light-emitting device, as described in Appendix 9, for the light-emitting module. (Note 11) The first through-hole is a hole for fixing the wiring board to another member, The light-emitting module according to Appendix 10, wherein, in a second direction perpendicular to the first direction, the two second through-holes located on one side of the virtual line are holes for determining the position when fixing the wiring board to another member. [Explanation of symbols]

[0121] Package for mounting 100 light-emitting elements 110 Base 110a,111a,112a,113a Top surface 110b,111b,112b,113b Bottom surface 110r Implementation Area 110s 1st area 110t 2nd area 111 Bottom 112 Frame section 113 Stepped section 121 Pattern 1 122 Pattern 2 123 Pattern 3 200 Light-emitting devices 210 Submount 220 light-emitting elements 230 Reflective material 250 Wiring 260 Lid 280 Lens components 300 Light-Emitting Modules 310 Wiring board 310R1 Implementation Section 310R2 outer area 321 1st metal part 321a,323a top surface 321b,323b Bottom surface 321c,323c Step surface 322 Electrode section 323 2nd metal part 324 1st wiring section 325 2nd wiring section 326 Metal layer 331 First insulating section 332 Second insulating section 333 Third insulating section 351 First through hole 352 Second through hole 370 Thermistor 380 connectors

Claims

1. A substrate having an upper surface having a mounting area for a light-emitting element, and a lower surface opposite to the upper surface, On the lower surface of the substrate, a first pattern which is an electrode pattern is arranged in a region other than the region that overlaps with the mounting region when viewed from below, The lower surface of the substrate has a second pattern, which is arranged in an area other than the area that overlaps with the mounting area when viewed from below, The second pattern is a package for mounting light-emitting elements, which is not electrically connected to the first pattern.

2. The substrate has a heat dissipation section with a lower surface, The lower surface of the heat dissipation section includes an area that overlaps with the mounting area when viewed from below. The package for mounting a light-emitting element according to claim 1, wherein the main material of the heat dissipation section has a higher thermal conductivity than the main material of the first pattern and the main material of the second pattern.

3. The heat dissipation portion is thicker than the first pattern and the second pattern, as described in claim 2 for the package for mounting light-emitting elements.

4. The aforementioned substrate is The bottom portion having the upper surface and the lower surface, It has a frame portion that is joined to the bottom portion, surrounds the mounting area of ​​the bottom portion when viewed from above, and surrounds the bottom surface of the bottom portion when viewed from below, The bottom portion is the heat dissipation portion, as described in claim 3, for mounting a light-emitting element.

5. The first pattern and the second pattern are arranged on the lower surface of the frame portion, as described in claim 4, for mounting a light-emitting element.

6. The lower surface of the bottom portion and the lower surface of the frame portion are located on the same plane. The package for mounting a light-emitting element according to claim 4, wherein the thickness of the first pattern and the thickness of the second pattern are the same.

7. The package for mounting a light-emitting element according to claim 4, wherein the bottom portion is mainly made of metal and the frame portion is mainly made of ceramic.

8. A package for mounting a light-emitting element according to any one of claims 4 to 7, One or more light-emitting elements are mounted in the aforementioned mounting area and surrounded by the aforementioned frame portion, A light-emitting device having a lid portion that is joined to the upper surface of the frame portion and, together with the bottom portion and the frame portion, seals the space in which the light-emitting element is arranged.

9. A light-emitting module comprising a wiring board and a light-emitting device according to claim 8 mounted on the wiring board, The aforementioned wiring board is The mounting section on which the light-emitting device is mounted, Including a pair of outer regions located on both sides of the mounting portion in a first direction, In a top view, each of the aforementioned outer regions is, It includes a first through hole and a second through hole, The second through-holes are arranged on both sides of a virtual line connecting the centers of the first through-holes located in each of the outer regions. The aforementioned mounting unit is In a top view, it includes a first metal portion, a first insulating portion, and an electrode portion that is separated from the first metal portion with the first insulating portion in between. A light-emitting module in which the first pattern of the light-emitting device is joined to the electrode portion, and the heat dissipation portion and the second pattern are joined to the first metal portion.

10. The light-emitting module according to claim 9, wherein, in a top view, the dashed line passes through the center of the light-emitting device.

11. The first through-hole is a hole for fixing the wiring board to another member, The light-emitting module according to claim 10, wherein the two second through-holes located on one side of the virtual line in a second direction perpendicular to the first direction are holes for determining the position when fixing the wiring board to another member.

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