Multilayer electronic components

Abstract

This invention provides a multilayer electronic component that mitigates the occurrence of electrochemical ion migration in multilayer electronic components and improves moisture resistance reliability. [Solution] The stacked electronic component 100 includes a body 110 including a dielectric layer 111 and first internal electrodes 121 and second internal electrodes 122 arranged alternately with the dielectric layer, a first external electrode 130 disposed on the body and connected to the first internal electrode, and a second external electrode 140 disposed on the body and connected to the second internal electrode, and arranged at a distance from the first external electrode. The region of the body's surface located between the first external electrode and the second external electrode is defined as the first region R1, and the region of the body's surface in contact with the first external electrode and the second external electrode is defined as the second region R2. The first region includes an uneven shape with multiple peaks and multiple valleys, and when the average depth of the uneven shape in the central part of the first region is D1 and the average depth of the uneven shape in the outer part of the first region is D2, D1 and D2 may be different from each other.

Description

[Technical Field]

[0001] This invention relates to a stacked electronic component. [Background technology]

[0002] A multilayer ceramic capacitor (MLCC), a type of multilayer electronic component, is a chip-type capacitor that is mounted on the printed circuit boards of various electronic products, such as video equipment like liquid crystal displays (LCDs) and plasma display panels (PDPs), computers, smartphones and mobile phones, on-board chargers (OBCs) in electric vehicles, and DC-DC converters, and plays the role of charging or discharging electricity.

[0003] Electrochemical ion migration (ECM) is a type of failure that can occur during the operation of a multilayer crystal capacitor (MLCC). In this phenomenon, moisture is adsorbed on the surface of the MLCC, reacts with the external electrodes to form metal ions, and these ionized metal ions move towards the negative electrode due to an electric field. After reaching the negative electrode, the metal ions combine with electrons and deposit as metal, forming a plating bridge between the external electrodes. Such ion migration can cause a short circuit between the terminals of the external electrodes, potentially degrading the performance of the MLCC due to increased leakage current. When using MLCCs in high-temperature and high-humidity environments, this can shorten the lifespan of the MLCC.

[0004] Conventionally, a water-repellent coating was applied to the surface of the MLCC body to increase the wetting angle of water droplets, thereby preventing droplets from spreading too much across the MLCC surface and suppressing or delaying the formation of ion migration. However, since such water-repellent coating layers containing fluorine-based or silane-based compounds are equivalent to resin layers rather than particle-based coating layers, achieving a superhydrophobic surface with a wetting angle of 150 degrees or more may be difficult. [Overview of the Initiative] [Problems that the invention aims to solve]

[0005] One of the several objectives of the present invention is to mitigate the occurrence of electrochemical ion migration in multilayer electronic components and improve their moisture resistance reliability.

[0006] One of several objectives of the present invention is to realize a preferred droplet movement mode that can suppress the occurrence of ion migration according to the size of the stacked electronic component.

[0007] One of several objectives of the present invention is to provide a body surface structure for a multilayer electronic component that can have superhydrophobic properties.

[0008] However, the objectives of the present invention are not limited to those described above and can be more easily understood in the process of describing specific embodiments of the present invention. [Means for solving the problem]

[0009] A stacked electronic component according to one embodiment of the present invention includes a body including a dielectric layer and first and second internal electrodes arranged alternately with the dielectric layer; a first external electrode disposed on the body and connected to the first internal electrode; and a second external electrode disposed on the body and connected to the second internal electrode, and arranged separately from the first external electrode. The first region is defined as the area of ​​the body's surface located between the first and second external electrodes, and the second region is defined as the area of ​​the body's surface in contact with either the first or second external electrode. The first region includes an uneven surface shape with multiple peaks and valleys. When D1 is the average depth of the uneven surface shape in the central part of the first region and D2 is the average depth of the uneven surface shape in the outer part of the second region, D1 and D2 may be different.

[0010] A stacked electronic component according to one embodiment of the present invention includes a body including a dielectric layer and first and second internal electrodes arranged alternately with the dielectric layer; a first external electrode disposed on the body and connected to the first internal electrode; and a second external electrode disposed on the body and connected to the second internal electrode, and spaced apart from the first external electrode. The first region is defined as the area of ​​the body's surface located between the first and second external electrodes, and the second region is defined as the area of ​​the body's surface in contact with either the first or second external electrode. The first region includes an uneven shape with multiple peaks and valleys. The average value of the distance between any peak of the uneven shape and a peak adjacent to any peak is defined as the average pitch. The average pitch of the uneven shape in the central part of the first region is P1, and the average pitch of the uneven shape in the outer part of the first region is P2. P1 and P2 may be different. [Effects of the Invention]

[0011] One of the several effects of the present invention is to improve moisture resistance reliability by mitigating the occurrence of electrochemical ion migration in multilayer electronic components.

[0012] One of the effects of the present invention is to realize a preferable movement form of droplets that can suppress the occurrence of ion migration according to the size of the multilayer electronic component.

[0013] However, the various beneficial advantages and effects of the present invention are not limited to the above content, and can be more easily understood in the process of explaining the specific embodiments of the present invention.

Brief Description of the Drawings

[0014] [Figure 1] Schematically shows a perspective view of a multilayer electronic component according to an embodiment. [Figure 2] A cross-sectional view taken along the line I-I' of FIG. 1. [Figure 3] A plan view showing an enlarged concavo-convex shape of a first region according to an embodiment. [Figure 4] An enlarged view of the U region of FIG. 3. [Figure 5] A cross-sectional view showing another example of dividing a first region according to an embodiment. [Figure 6] A cross-sectional view taken along the line II-II' of FIG. 1. [Figure 7] An exploded perspective view of a main body according to an embodiment. [Figure 8] Schematically shows a perspective view of a multilayer electronic component according to an embodiment. [Figure 9] A cross-sectional view taken along the line III-III' of FIG. 8. [Figure 10] A plan view showing an enlarged shape of a first region and a coating layer of FIG. 9.

Modes for Carrying Out the Invention

[0015] Hereinafter, embodiments of the present invention will be described with reference to specific embodiments and the accompanying drawings. However, the embodiments of the present invention can be modified into various other forms, and the scope of the present invention is not limited to the embodiments described below. Also, the embodiments of the present invention are provided to more fully explain the present invention to an ordinary technician. Therefore, the shape, size, etc. of the elements in the drawings can be exaggerated for a clearer explanation, and the elements indicated by the same reference numerals in the drawings are the same elements.

[0016] And, in order to clearly explain the present invention in the drawings, parts not related to the explanation are omitted, and the sizes and thicknesses of each configuration shown in the drawings are arbitrarily shown for the convenience of explanation, so the present invention is not necessarily limited to what is shown in the drawings. For components with the same function within the scope of the same concept, the same reference numerals are used for explanation. Further, throughout the specification, when a certain part says that a certain component "includes", this does not exclude other components unless there is a contrary description, and it means that other components can be further included.

[0017] Note that in the drawings, the x - direction can mean the thickness direction, the y - direction can mean the length direction, and the z - direction can mean the width direction, and the stacking direction of the internal electrodes or dielectric layers can be the thickness direction or the width direction.

[0018] FIG. 1 schematically shows a perspective view of a multilayer electronic component according to an embodiment. FIG. 2 is a cross - sectional view taken along the line I - I' of FIG. 1. FIG. 3 is a plan view showing an enlarged concavo - convex shape of a first region according to an embodiment. FIG. 4 is an enlarged view of the U region of FIG. 3. FIG. 5 is a cross - sectional view showing still another example of dividing the first region according to an embodiment. FIG. 6 is a cross - sectional view taken along the line II - II' of FIG. 1. FIG. 7 is an exploded perspective view of a main body according to an embodiment.

[0019] Hereinafter, with reference to FIGS. 1 to 7, a multilayer electronic component 100 according to an embodiment of the present invention and various embodiments thereof will be described in detail.

[0020] A stacked electronic component 100 according to one embodiment of the present invention includes a body 110 including a dielectric layer 111 and first internal electrodes 121 and second internal electrodes 122 arranged alternately with the dielectric layer 111, a first external electrode 130 disposed on the body 110 and connected to the first internal electrode 121, and a second external electrode 140 disposed on the body 110 and connected to the second internal electrode 122, and arranged separately from the first external electrode 130, wherein the surface of the body 110 includes the first external electrode 13 When the region located between 0 and the second external electrode 140 is defined as the first region R1, and the region of the surface of the main body 110 that is in contact with the first external electrode 130 or the second external electrode 140 is defined as the second region R2, the first region R1 includes an uneven shape with multiple peaks and multiple valleys, and when the average depth of the uneven shape in the central part rc of the first region R1 is D1, and the average depth of the uneven shape in the outer parts ro1 and ro2 of the first region R1 is D2, D1 and D2 may be different.

[0021] A stacked electronic component 100 according to one embodiment of the present invention includes a body 110 including a dielectric layer 111 and first internal electrodes 121 and second internal electrodes 122 arranged alternately with the dielectric layer 111, an external electrode 130 disposed on the body 110 and connected to the first internal electrode 121, and a second external electrode 140 disposed on the body 110 and connected to the second internal electrode 122, and disposed at a distance from the first external electrode 130, wherein the surface of the body 110 is divided into a region located between the first external electrode 130 and the second external electrode 140. When one region is defined as R1, and the region of the surface of the main body 110 that is in contact with the first external electrode 130 or the second external electrode 140 is defined as R2, the first region R1 includes an uneven shape with multiple peaks and multiple valleys, and the average value of the distance between any peak of the uneven shape and any peak adjacent to any peak is defined as the average pitch, and when the average pitch of the recessed shape in the central part rc of the first region R1 is defined as P1, and the average pitch of the uneven shape in the outer parts ro1 and ro2 of the first region R1 is defined as P2, P1 and P2 may be different.

[0022] Referring to Figure 2, the main body 110 includes a dielectric layer 111, and first internal electrodes 121 and second internal electrodes 122 arranged alternately with the dielectric layer 111.

[0023] There is no particular limitation on the specific shape of the main body 110. However, as shown in the figure, the main body 110 can be formed in a hexahedron shape or a shape similar thereto. Due to the shrinkage of the ceramic powder contained in the main body 110 during the firing process, the main body 110 is not in a hexahedron shape with perfect straight lines, but can have a substantially hexahedron shape.

[0024] The main body 110 can have a first surface 1 and a second surface 2 that face each other in a first direction, a third surface 3 and a fourth surface 4 that are connected to the first surface 1 and the second surface 2 and face each other in a second direction, and a fifth surface 5 and a sixth surface 6 that are connected to the first surface 1 and the second surface 2, are connected to the third surface 3 and the fourth surface 4, and face each other in a third direction.

[0025] The plurality of dielectric layers 111 forming the main body 110 are in a fired state, and the boundary between adjacent dielectric layers 111 can be integrated to such an extent that it is difficult to confirm without using a scanning electron microscope (SEM).

[0026] According to an embodiment of the present invention, the raw material for forming the dielectric layer 111 is not particularly limited as long as sufficient capacitance can be obtained. For example, a barium titanate-based material, a lead composite perovskite-based material, a strontium titanate-based material, or the like can be used. The barium titanate-based material can include BaTiO3-based ceramic powder. Examples of the ceramic powder include BaTiO3, (Ba 1-x Ca x )TiO3 (0 < x < 1), Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1), or Ba(Ti 1-y Zr y )O3 (0 < y < 1), etc.

[0027] Furthermore, the raw material for forming the dielectric layer 111 can be a powder such as barium titanate (BaTiO3) to which various ceramic additives, organic solvents, binders, dispersants, etc., can be added according to the purpose of the present invention.

[0028] On the other hand, since the dielectric layer 111 is in a fired state, the ceramic powder used as the material for the dielectric layer 111 can form dielectric crystal grains and crystal grain boundaries.

[0029] Furthermore, the average thickness td of the dielectric layer 111 is not particularly limited. For example, the average thickness td of the dielectric layer 111 may be 0.2 μm or more and 2 μm or less, and in order to more easily achieve higher capacitance and miniaturization of the multilayer electronic component 100, the average thickness td of the dielectric layer 111 may be 0.35 μm or less.

[0030] On the other hand, the average thickness td of the dielectric layer 111 can mean the average thickness td of one or more of the multiple dielectric layers 111.

[0031] The average thickness td of the dielectric layer 111 can be calculated by taking the average of the thicknesses measured at the 1 / 4, 2 / 4, and 3 / 4 points, which divide the dielectric layer into four equal parts in the length direction, using one dielectric layer adjacent to the point where the longitudinal center line and the thickness center line of the capacitance-forming portion intersect as a reference. This measurement can be extended to the two upper and two lower dielectric layers that are equally spaced, using one dielectric layer adjacent to the point where the longitudinal center line and the thickness center line of the capacitance-forming portion intersect as a reference. The average thickness of the dielectric layer can be further generalized.

[0032] The internal electrodes 121 and 122 may be arranged alternately in the first direction with the dielectric layer 111 in between.

[0033] The internal electrodes 121 and 122 may include a first internal electrode 121 and a second internal electrode 122. The first internal electrode 121 and the second internal electrode 122 are arranged alternately facing each other across the dielectric layer 111 that constitutes the main body 110, and can be connected to the third surface 3 and the fourth surface 4 of the main body 110, respectively. Specifically, one end of the first internal electrode 121 can be connected to the third surface, and one end of the second internal electrode 122 can be connected to the fourth surface. That is, in one embodiment, the internal electrodes 121 and 122 can be in contact with the third surface 3 or the fourth surface 4.

[0034] As shown in Figure 2, the first internal electrode 121 can be separated from the fourth surface 4 and exposed via the third surface 3, and the second internal electrode 122 can be separated from the third surface 3 and exposed via the fourth surface 4. The first external electrode 130 can be placed on the third surface 3 of the main body and connected to the first internal electrode 121, and the second external electrode 140 can be placed on the fourth surface 4 of the main body and connected to the second internal electrode 122.

[0035] In other words, the first internal electrode 121 is not connected to the second external electrode 132, but is connected to the first external electrode 131, and the second internal electrode 122 is not connected to the first external electrode 131, but is connected to the second external electrode 132. Therefore, the first internal electrode 121 can be formed at a certain distance from the fourth surface 4, and the second internal electrode 122 can be formed at a certain distance from the third surface 3. In this case, the first internal electrode 121 and the second internal electrode 122 can be electrically separated from each other by the dielectric layer 111 placed in between.

[0036] The materials used to form the internal electrodes 121 and 122 are not particularly limited, and any material with excellent electrical conductivity can be used. For example, the internal electrodes 121 and 122 may include one or more of the following: nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0037] Furthermore, the internal electrodes 121 and 122 can be formed by printing a conductive paste for internal electrodes containing one or more of the following onto a ceramic green sheet: nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof. While screen printing or gravure printing can be used as the printing method for the conductive paste for internal electrodes, the present invention is not limited thereto.

[0038] On the other hand, there is no need to particularly limit the average thickness te of the internal electrodes 121 and 122. For example, the average thickness te of the internal electrodes 121 and 122 may be 0.2 μm or more and 2 μm or less, and in order to more easily achieve higher capacitance and miniaturization of the multilayer electronic component 100, the average thickness te of the internal electrodes 121 and 122 may be 0.35 μm or less.

[0039] Furthermore, the average thickness te of the internal electrodes 121 and 122 can refer to the average thickness te of one or more of the multiple internal electrodes 121 and 122.

[0040] The average thickness te of the internal electrodes 121 and 122 can be calculated by taking the thickness of the internal electrodes at points 1 / 4, 2 / 4, and 3 / 4 of the length of the internal electrode, which is divided into four equal parts along the length, using one internal electrode layer adjacent to the point where the longitudinal center line and the thickness center line of the capacitance forming section intersect as a reference. This average thickness can be further generalized by extending this measurement to two upper and two lower internal electrodes that are equally spaced relative to one internal electrode layer adjacent to the point where the longitudinal center line and the thickness center line of the capacitance forming section intersect as a reference.

[0041] The main body 110 may include a capacitance forming section Ac which is disposed inside the main body 110 and includes first internal electrodes 121 and second internal electrodes 122 which are alternately arranged with a dielectric layer 111 in between, and cover sections 112 and 113 which are disposed on one and the other surface of the capacitance forming section Ac in a first direction.

[0042] The capacitance-forming portion Ac is the part that contributes to the capacitance formation of the capacitor, and can be formed by repeatedly stacking multiple first internal electrodes 121 and second internal electrodes 122 with a dielectric layer 111 in between, as shown in Figure 7.

[0043] Referring to Figure 7, the cover portions 112 and 113 can be formed by stacking a single dielectric layer or two or more dielectric layers in the thickness direction on the upper and lower surfaces of the capacitance forming portion Ac, respectively, and can essentially serve to prevent damage to the internal electrodes due to physical or chemical stress.

[0044] The cover portions 112 and 113 do not contain internal electrodes and can contain the same material as the dielectric layer 111. That is, the cover portions 112 and 113 can contain ceramic materials, for example, barium titanate (BaTiO3) based ceramic materials.

[0045] On the other hand, the average thickness of the cover portions 112 and 113 is not particularly limited. However, in order to more easily achieve miniaturization and high capacitance of the stacked electronic component, the average thickness tc of the cover portions 112 and 113 may be 15 μm or less.

[0046] The average thickness of the cover portions 112 and 113 can represent the size in the first direction, and can be the average value of the sizes of the cover portions 112 and 113 in the first direction measured at five equally spaced points on the upper or lower part of the volume forming portion Ac.

[0047] Referring to Figure 6, in one embodiment, margin portions 114 and 115 may be arranged on one and the other surface of the volume forming portion Ac in the third direction.

[0048] Referring to Figure 6, the margin portions 114 and 115 can include a margin portion 114 located on the fifth surface 5 of the main body 110 and a margin portion 115 located on the sixth surface 6. That is, the margin portions 114 and 115 can be located on both end faces of the main body 110 in the third direction (width direction).

[0049] On the other hand, the margin portions 114 and 115 can refer to the regions between the interface between both ends of the first internal electrode 121 and the second internal electrode 122 and the main body 110, as shown in Figure 6.

[0050] The margins 114 and 115 can essentially serve to prevent damage to the internal electrodes due to physical or chemical stress.

[0051] The margin portions 114 and 115 may be formed by applying a conductive paste to the ceramic green sheet, except for the areas where the margin portions are formed, to form internal electrodes.

[0052] Furthermore, in order to suppress the step caused by the internal electrodes 121 and 122, after cutting the laminated internal electrodes so that they are exposed on the fifth and sixth surfaces 5 and 6 of the main body, a single dielectric layer or two or more dielectric layers can be laminated in the third direction (width direction) on both sides of the capacitance forming portion Ac to form margin portions 114 and 115.

[0053] The width of the margin portions 114 and 115 does not need to be particularly limited. However, in order to more easily achieve miniaturization and high capacitance of the multilayer electronic component, the average width of the margin portions 114 and 115 may be 15 μm or less.

[0054] The average width of the margin portions 114 and 115 can represent the average size of the margin portions 114 and 115 in the third direction, and can be the average value of the sizes of the margin portions 114 and 115 in the third direction measured at five equally spaced points on the side surface of the volume forming portion Ac.

[0055] Referring to Figure 1, external electrodes 130 and 140 are positioned on the main body 110.

[0056] Referring to Figures 1 and 2, the external electrodes 130 and 140 may include a first external electrode 130 which is positioned on the main body 110 and connected to a first internal electrode 121, and a second external electrode 140 which is positioned on the main body 110 and connected to a second internal electrode 122, and is positioned at a distance from the first external electrode 130.

[0057] In this case, the direction in which the first external electrode 130 and the second external electrode 140 are separated from each other can be considered as the second direction.

[0058] In this invention, a structure is described in which a stacked electronic component 100 has two external electrodes 130 and 140. However, the number and shape of the external electrodes 130 and 140 can be changed according to the form of the internal electrodes 121 and 122 or other purposes.

[0059] Referring to Figure 2, the external electrodes 130 and 140 may include electrode layers 131 and 141 that are in contact with the third surface 3 and fourth surface 4 of the main body, and plating layers 132, 133, 142, and 143 that are placed on the electrode layers.

[0060] To give a more specific example for the electrode layers 131 and 141, the electrode layers 131 and 141 may be fired electrodes containing a conductive metal and glass, or resin-based electrodes containing a conductive metal and resin.

[0061] Furthermore, the electrode layers 131 and 141 may be formed by sequentially forming a fired electrode and a resin-based electrode on the main body 110. Also, the electrode layers 131 and 141 may be formed by transferring a sheet containing a conductive metal onto the main body 110, or by transferring a sheet containing a conductive metal onto a fired electrode.

[0062] While any material with excellent electrical conductivity can be used as the conductive metal in the electrode layers 131 and 141, it is not particularly limited. For example, the conductive metal may be one or more of nickel (Ni), copper (Cu), and their alloys.

[0063] The plating layers 132, 133, 142, and 143 play a role in improving mounting characteristics. The types of plating layers 132, 133, 142, and 143 are not particularly limited and may be plating layers containing one or more of Ni, Sn, Pd, and their alloys, and may be formed in multiple layers.

[0064] To give a more specific example for the plating layers 132, 133, 142, and 143, the plating layers 132, 133, 142, and 143 may be Ni plating layers or Sn plating layers, and may be in a form in which Ni plating layers and Sn plating layers are sequentially formed on the electrode layers 131 and 141, or in a form in which Sn plating layers, Ni plating layers and Sn plating layers are sequentially formed. Furthermore, the plating layers may include multiple Ni plating layers and / or multiple Sn plating layers.

[0065] Electrochemical ion migration (ECM) is a type of failure that occurs during the operation of a multilayer electronic component 100. It is a phenomenon in which droplets spread across the surface of the main body 110, forming a plating bridge between the external electrodes 130 and 140. Such ion migration can cause short circuits between the external electrodes 130 and 140, increase leakage current, and reduce the moisture resistance reliability of the multilayer electronic component 100.

[0066] Conventionally, methods have been used to suppress or delay the formation of ion migration by forming a water-repellent coating layer on the surface of the main body 110, thereby increasing the wetting angle of water droplets and preventing them from spreading too much on the surface of the main body 110. Since such water-repellent coating layers are resin-based coating layers containing fluorine-based or silane-based compounds, excessive surface treatment may be required to give them physical water-repellent properties in addition to chemical water-repellent properties. In this process, problems may arise such as the water-repellent coating layer peeling off or the water-repellent coating layer having to be formed excessively thick.

[0067] Therefore, in a stacked electronic component 100 according to one embodiment of the present invention, the surface of the main body 110 is made to include an uneven shape with multiple peaks and multiple valleys, and by adjusting the specific microstructure of the uneven shape according to the position on the surface of the main body 110, the surface of the main body 110 can be made water-repellent without forming an excessively thick water-repellent coating layer, causing water droplets to move in a manner that minimizes the occurrence of ion migration, thereby improving the moisture resistance reliability of the stacked electronic component 100.

[0068] The following describes in detail the specific microstructure of the surface irregularities at different locations on the main body 110.

[0069] Referring to Figure 2, the surface of the main body 110 according to one embodiment can be divided into a first region R1 located between the first external electrode 130 and the second external electrode 140, and a second region in contact with either the first external electrode 130 or the second external electrode 140. The first region R1 may include a central portion rc and outer portions ro1 and ro2. In this case, the outer portions ro1 and ro2 may be regions located on both sides of the central portion rc in the second direction.

[0070] Referring to Figure 3, the first region R1 can include an uneven shape with multiple peaks and multiple valleys.

[0071] The uneven shape of the first region R1 according to one embodiment of the present invention can be adjusted to differ for each specific region of the first region R1. This allows for the formation of a gradient of the wetting angle depending on the location of a water droplet when it is located on the surface of the main body 110. This gradient can generate a driving force that moves the water droplet to the center of the surface of the main body 110 or to the outer edge of the surface of the main body 110. This suppresses the phenomenon of the water droplet spreading on the surface of the main body 110 and effectively prevents the occurrence of ion migration of the stacked electronic component 100.

[0072] In the present invention, there can be various methods for forming the gradient of the wetting angle at different positions on the surface of the main body 110.

[0073] In one embodiment, when the average depth of the uneven shape in the central part rc of the first region R1 is D1, and the average depth of the uneven shape in the outer parts ro1 and ro2 of the first region R1 is D2, a gradient of the wetting angle at different positions on the surface of the main body 110 can be formed by adjusting D1 and D2 to be different from each other. Furthermore, in another embodiment, when the average value of the distance between any peak of the uneven shape and any peak adjacent to any peak is defined as the average pitch, and when the average pitch of the uneven shape in the central part rc of the first region R1 is P1, and the average pitch of the uneven shape in the outer parts ro1 and ro2 of the first region R1 is P2, a gradient of the wetting angle at different positions on the surface of the main body 110 can be formed by adjusting P1 and P2 to be different from each other.

[0074] In one embodiment of the present invention, the specific shape of the uneven surface of the first region R1 can be represented by one or more of the average depth and average pitch, and an example of a method for measuring the positional average depth and average pitch of the first region R1 is as follows.

[0075] First, the multilayer electronic component 100 is polished to the center in the third direction to obtain cross-sections in the first and second directions and then surface-treated. Then, a 50 μm × 30 μm region at the center of the second direction of the central part rc and the outer parts ro1 and ro2 is observed using a scanning electron microscope (SEM) at an acceleration voltage of 15 kV and a magnification of 3,000, and a roughness curve is formed using an image processing program such as ImageJ, with the valleys forming the lowest points within the region as the reference. After that, as shown in Figure 3, the arithmetic mean of the roughness curve is calculated to derive the average line m, and then the sizes in the first direction from each of the multiple peaks to the average line m are measured as Da, Db, Dc, Dd, De..., and the sizes in the second direction from any peak to an adjacent peak are measured as Pa, Pb, Pc, Pd.... At this time, the average depth D and average pitch P can be expressed as follows.

[0076] Average depth D = (Da + Db + Dc + Dd + De...) / (Number of peaks) Average pitch P = (Pa + Pb + Pc + Pd + Pe...) / (Number of peaks - 1)

[0077] The method for adjusting the positional average depth and average pitch of the first region R1 according to one embodiment of the present invention is not particularly limited and can be achieved, for example, by differentiating the driving force of the etching reaction for each region through selective wet etching. The adjustment variables for the reaction driving force can be adjusted by temperature, time, and concentration. In one embodiment, the immersion height (or removal speed / time) when the stacked electronic component 100 is immersed in the etching solution while it is loaded vertically can be specified and adjusted to adjust the time the component is immersed (reacted) in the etching solution for each region. In yet another embodiment, selective wet etching can also be performed by attaching (masking) a member made of a material such as rubber that does not react with the etching solution to a specific surface of the main body and adjusting the contact with the liquid.

[0078] In one embodiment, the average depth D2 of the uneven shape in the outer parts ro1 and ro2 may be smaller than the average depth D1 of the uneven shape in the central part rc. Specifically, D1 / D2 can satisfy the condition greater than 1.0 and less than 10.0. In this case, water droplets formed on the surface of the main body 110 can move from the central part rc, where the surface tension is relatively high, to the outer parts ro1 and ro2, where the surface tension is relatively low. This suppresses or mitigates ion migration that may occur due to the spreading of water droplets formed on the surface of the stacked electronic component 100.

[0079] On the other hand, if D1 / D2 is 1.0 or less, it may be difficult to form a sufficient driving force to induce the movement of water droplets. If D1 / D2 is 10.0 or more, the possibility of deterioration or cracking occurring in the stacked electronic component 100 during the process of forming the uneven shape of the first region R1 may increase. Therefore, in one embodiment, by adjusting D1 / D2 to satisfy a value greater than 1.0 and less than 10.0, it is possible to form a sufficient driving force to induce the movement of water droplets while suppressing or mitigating deterioration or cracking of the stacked electronic component 100.

[0080] In one embodiment, the average depth D2 of the uneven shape in the outer parts ro1 and ro2 may be greater than the average depth D1 of the uneven shape in the central part ro. Specifically, D2 / D1 can satisfy the condition greater than 1.0 and less than 10.0. In this case, water droplets formed on the surface of the main body 110 can move from the outer parts ro1 and ro2, where the surface tension is relatively high, to the central part rc, where the surface tension is relatively low. This suppresses or mitigates ion migration that may occur due to the spreading of water droplets formed on the surface of the stacked electronic component 100.

[0081] On the other hand, if D2 / D1 is 1.0 or less, it may be difficult to form a sufficient driving force to induce the movement of water droplets. If D2 / D1 is 10.0 or more, the possibility of deterioration or cracking occurring in the stacked electronic component 100 during the process of forming the uneven shape of the first region R1 may increase. Therefore, in one embodiment, by adjusting D2 / D1 to satisfy a value greater than 1.0 and less than 10.0, it is possible to form a sufficient driving force to induce the movement of water droplets while suppressing or mitigating deterioration or cracking of the stacked electronic component 100.

[0082] In one embodiment, the average pitch P2 of the uneven shape in the outer parts ro1 and ro2 may be greater than the average pitch P1 of the uneven shape in the central part rc. Specifically, P1 / P2 can satisfy the condition greater than 0.1 and less than 0.6. In this case, water droplets formed on the surface of the main body 110 can move from the central part rc, where the surface tension is relatively high, to the outer parts ro1 and ro2, where the surface tension is relatively low. This suppresses or mitigates ion migration that may occur due to the spreading of water droplets formed on the surface of the stacked electronic component 100.

[0083] If P1 / P2 is 0.1 or less, the process of excessively forming positional average pitch differences may increase the likelihood of degradation or cracking in the multilayer electronic component 100. If P1 / P2 exceeds 0.6 and approaches 1.0, it may become difficult to form a sufficient driving force to induce water droplet movement.

[0084] In one embodiment, the average pitch P2 of the uneven shape in the outer parts ro1 and ro2 may be smaller than the average pitch P1 of the uneven shape in the central part rc. Specifically, P2 / P1 can satisfy the condition greater than 0.1 and less than 0.6. In this case, water droplets formed on the surface of the main body 110 can move from the outer parts ro1 and ro2, which have relatively high surface tension, to the central part rc, which has relatively low surface tension. This suppresses or mitigates ion migration that may occur due to the spreading of water droplets formed on the surface of the stacked electronic component 100.

[0085] If P2 / P1 is 0.1 or less, the process of excessively forming positional average pitch differences may increase the likelihood of degradation or cracking in the multilayer electronic component 100. If P2 / P1 exceeds 0.6 and approaches 1.0, it may become difficult to form a sufficient driving force to induce water droplet movement.

[0086] On the other hand, the average depth and average pitch in the central part rc and the outer parts ro1 and ro2 of the first region R1 may exhibit opposite characteristics. Specifically, when D1 / D2 is greater than 1.0 and less than 10.0, P1 / P2 can be greater than 0.1 and less than 0.6, and when D2 / D1 is greater than 1.0 and less than 10.0, P2 / P1 can be greater than 0.1 and less than 0.6.

[0087] The outer portions ro1 and ro2 of the first region R1 can be divided into the first outer portion ro1 adjacent to the first external electrode 130 and the second outer portion ro2 adjacent to the second external electrode 140. The average depth and average pitch of the uneven shape in the first outer portion ro1 can be defined as D2a and P2a, respectively, and the average depth and average pitch of the uneven shape in the second outer portion ro2 can be defined as D2b and P2b, respectively.

[0088] In one embodiment, D2a < D1 < D2b can be satisfied. Thereby, the water droplet formed on the surface of the multilayer electronic component 100 can be moved toward the second external electrode 140, and thereby the ion migration that may occur due to the spreading of the water droplet formed on the surface of the multilayer electronic component 100 can be suppressed or alleviated.

[0089] In one embodiment, D2a > D1 and D2b > D1 can be satisfied. Thereby, the water droplet formed on the surface of the multilayer electronic component 100 can be moved toward the first external electrode 130, and thereby the ion migration that may occur due to the spreading of the water droplet formed on the surface of the multilayer electronic component 100 can be suppressed or alleviated.

[0090] In one embodiment, P2a < P1 < P2b can be satisfied. Thereby, the water droplet formed on the surface of the multilayer electronic component 100 can be moved toward the first external electrode 130, and thereby the ion migration that may occur due to the spreading of the water droplet formed on the surface of the multilayer electronic component 100 can be suppressed or alleviated.

[0091] In one embodiment, P2a > P1 and P2b > P1 can be satisfied. Thereby, the water droplet formed on the surface of the multilayer electronic component 100 can be moved toward the second external electrode 140, and thereby the ion migration that may occur due to the spreading of the water droplet formed on the surface of the multilayer electronic component 100 can be suppressed or alleviated.

[0092] Referring to Figure 2, in one embodiment, the central portion rc of the first region R1 may be the region located in the center when the first region R1 is divided into three equal parts in the direction in which the first external electrode 130 and the second external electrode 140 are separated, and the outer portions ro1 and ro2 of the first region R1 may be the regions located on both sides of the central portion rc when the first region R1 is divided into three equal parts in the direction in which the first external electrode 130 and the second external electrode 140 are separated.

[0093] The central portion rc and the outer portions ro1 and ro2 of the first region R1 can be defined differently depending on the separation distance between the first external electrode 130 and the second external electrode 140.

[0094] Referring to Figure 5, in one embodiment, in a stacked electronic component 100 of a size in which the distance between the first external electrode 130 and the second external electrode 140 is 0.1 mm or more and 1.0 mm or less, the outer portions ro1 and ro2 of the first region R1 may be the region from the end of the first external electrode 130 to 50 μm and the region from the end of the second external electrode 140 to 50 μm, and the central portion rc of the first region R1 may be the region located between the outer portions ro1 and ro2.

[0095] In a stacked electronic component 100 of a size in which the distance between the first external electrode 130 and the second external electrode 140 is 0.1 mm or more and 1.0 mm or less, if the distance between the first external electrode 130 and the second external electrode 130 is narrow and a water droplet moves to the center of the surface of the main body 110, the effect of suppressing ion migration may be insufficient depending on the size of the water droplet itself. Therefore, when the distance between the first external electrode 130 and the second external electrode 140 is 0.1 mm or more and 1.0 mm or less, it is preferable that the water droplet moves to the outer parts ro1 and ro2. That is, in one embodiment, when the distance between the first external electrode 130 and the second external electrode 140 is 0.1 mm or more and 1.0 mm or less, one or more of the conditions that D1 / D2 is greater than 1.0 and less than 10.0 and P1 / P2 is greater than 0.1 and less than 0.6 can be satisfied.

[0096] Referring to Figure 5, in one embodiment, in a stacked electronic component 100 in which the distance between the first external electrode 130 and the second external electrode 140 exceeds 1.00 mm, the outer portions ro1 and ro2 of the first region R1 may be the region from the end of the first external electrode 130 to 100 μm and the region from the end of the second external electrode 140 to 100 μm, and the central portion rc of the first region R1 may be the region located between the outer portions ro1 and ro2.

[0097] In a stacked electronic component 100 where the distance between the first external electrode 130 and the second external electrode 140 exceeds 1.00 mm, the gap between the first external electrode 130 and the second external electrode 130 is sufficiently large, so moving the water droplet to the central part rc rather than to the outer parts ro1 and ro2 is preferable from the viewpoint of preventing a decrease in moisture resistance reliability. That is, in one embodiment, when the distance between the first external electrode 130 and the second external electrode 140 exceeds 1.00 mm, one or more of the following conditions can be met: D2 / D1 is greater than 1.0 and less than 10.0, and P2 / P1 is greater than 0.1 and less than 0.6.

[0098] In one embodiment, D1 and D2 can each satisfy the requirement of being between 1 μm and 10 μm.

[0099] If D1 and D2 are each less than 1 μm, the water droplets formed on the surface of the main body 110 may not be able to form sufficient surface tension. If D1 and D2 are each greater than 10 μm, the likelihood of degradation or cracking of the stacked electronic component 100 may increase.

[0100] In one embodiment, P1 and P2 can each satisfy the condition of being between 1 μm and 30 μm. If P1 and P2 are each less than 1 μm, the likelihood of degradation or cracking of the stacked electronic component 100 may increase, and if P1 and P2 each exceed 10 μm, the water droplets formed on the surface of the main body 110 may not be able to form sufficient surface tension.

[0101] In one embodiment, the first region R1 can mean a region in which a plurality of peaks and a plurality of valleys are formed, and which has a specific depth from the outermost point of the outer surface of the main body 110. Specifically, in one embodiment, the first region R1 can mean a region having a depth of 10 μm or more and 30 μm or less in a first direction from the outermost point of the outer surface of the main body 110.

[0102] In one embodiment, the first region R1 may contain a plurality of dielectric particles, and the aspect ratio b / a of the plurality of dielectric particles contained in the first region R1 may be between 0.8 and 1.2. Here, the aspect ratio of the dielectric particles can mean the ratio b / a of the length of the minor axis b to the length a of the major axis of the dielectric particle.

[0103] In one embodiment, the average equivalent diameter of the multiple dielectric particles contained in the first region R1 may be between 50 nm and 400 nm. In this case, the average equivalent diameter may be calculated by the planimetric method after observing the first region R1 with an optical microscope (OM) or a scanning electron microscope (SEM), but is not limited to this, and may also be the average value of values ​​measured at two or more points that are equally spaced to the left and right in the second direction, with respect to the center of the second direction of the first region.

[0104] Referring to Figure 4, in one embodiment, the uneven shape can include columnar mp that continues continuously in the direction in which the dielectric layer 111 and the first internal electrode 121 and the second internal electrode 122 are alternately arranged, and branched bp from which the first external electrode 130 and the second external electrode 140 are arranged projecting in directions separated from each other. As a result, the uneven shape can secure a larger surface area than a shape without branched bp, and this can significantly enhance the effect of suppressing or mitigating ion migration according to the present invention.

[0105] On the other hand, branched bp may be a region branched from a columnar mp, and may be formed one or more times from a single columnar mp.

[0106] Referring to Figures 8 and 9, a coating layer 150 may be placed on the first region R1 of the multilayer electronic component 100' according to one embodiment. This can improve the moisture resistance reliability of the multilayer electronic component 100'. The components of the coating layer 150 for improving the moisture resistance reliability of the multilayer electronic component 100' are not particularly limited, and for example, the coating layer 150 may contain one or more of fluororesins and silane compounds.

[0107] The method for forming the coating layer 150 according to one embodiment is not particularly limited. For example, it can be formed by immersing the multilayer electronic component 100 in a solution for forming the coating layer 150, or by using a vapor deposition method.

[0108] Referring to Figure 10, in one embodiment, the coating layer 150 may be formed to conform to the uneven shape of the first region R1. Specifically, the coating layer 150 can have an uneven shape on the first region R1, thereby improving not only the water repellency due to the components of the coating layer 150 but also the water repellency due to the uneven shape of the surface of the coating layer 150. This further improves the moisture resistance reliability of the stacked electronic component 100 and also improves the driving force for moving water droplets that may form on the surface of the coating layer 150, thus further enhancing the effect of suppressing ion migration in the stacked electronic component 100.

[0109] As described above, embodiments of the present invention have been explained in detail, but the present invention is not limited by the embodiments described above and the accompanying drawings, but is limited by the claims provided. Therefore, within the scope of the technical idea of ​​the present invention as described in the claims, various forms of substitution, modification, and alteration are possible by persons with ordinary skill in the art, and these also fall within the scope of the present invention.

[0110] Furthermore, the expression “one embodiment” as used in this disclosure does not mean that each embodiment is the same as another, but is provided to highlight and illustrate the unique and distinct features of each embodiment. However, the embodiments presented above do not preclude their realization in combination with features of other embodiments. For example, even if a matter described in one embodiment is not described in another embodiment, it can be understood as a description related to the other embodiment unless there is a contradictory or contrary description of that matter in the other embodiment.

[0111] The terms used in this disclosure are used solely to illustrate one embodiment and are not intended to limit the disclosure. Where otherwise clearly indicated by context, singular expressions include plural expressions. [Explanation of symbols]

[0112] 100, 100': Multilayer electronic components 110: Main unit 111: Dielectric layer 121, 122: Internal electrode 112, 113: Cover section 114, 115: Margin section 130, 140: External electrode 131, 141: Electrode layer 132, 133, 142, 143: Plating layer 150: Coating layer

Claims

1. A body including a dielectric layer, and first and second internal electrodes arranged alternately with the dielectric layer, A first external electrode is disposed on the main body and connected to the first internal electrode, The body includes a second external electrode which is positioned on the main body and connected to the second internal electrode, and positioned at a distance from the first external electrode, When the region of the surface of the main body located between the first external electrode and the second external electrode is defined as the first region, and the region of the surface of the main body in contact with the first external electrode and the second external electrode is defined as the second region, The first region includes an uneven shape with multiple peaks and multiple valleys, When the average depth of the uneven shape in the central part of the first region is D1, and the average depth of the uneven shape in the outer part of the first region is D2, A multilayer electronic component in which D1 and D2 are different from each other.

2. The central part of the first region is the region located in the center when the first region is divided into three equal parts in the direction in which the first external electrode and the second external electrode are separated. The stacked electronic component according to claim 1, wherein the outer casing of the first region is the region located on both sides of the central portion when the first region is divided into three equal parts in the direction in which the first external electrode and the second external electrode are separated.

3. The distance between the first external electrode and the second external electrode is 0.1 mm or more and 1.0 mm or less. The outer boundary of the first region is the region from the end of the first external electrode to 50 μm, and the region from the end of the second external electrode to 50 μm. The stacked electronic component according to claim 1, wherein the central part of the first region is a region located between the outer parts.

4. The distance between the first external electrode and the second external electrode is greater than 1.0 mm. The outer boundary of the first region is the region from the end of the first external electrode to 100 μm, and the region from the end of the second external electrode to 100 μm. The stacked electronic component according to claim 1, wherein the central part of the first region is a region located between the outer parts.

5. When the average value of the distance between any peak of the uneven shape and a peak adjacent to that peak is defined as the average pitch, and the average pitch of the uneven shape in the central part of the first region is P1, and the average pitch of the uneven shape in the outer part of the first region is P2, A stacked electronic component according to claim 1, wherein P1 and P2 are different.

6. The stacked electronic component according to claim 1, wherein D1 / D2 is greater than 1 and less than 10.

7. When the average value of the distance between any peak of the uneven shape and a peak adjacent to that peak is defined as the average pitch, and the average pitch of the uneven shape in the central part of the first region is P1, and the average pitch of the uneven shape in the outer part of the first region is P2, The stacked electronic component according to claim 6, wherein P1 / P2 satisfies the condition greater than 0.1 and less than 0.

6.

8. The stacked electronic component according to claim 1, wherein D2 / D1 is greater than 1 and less than 10.

9. When the average value of the distance between any peak of the uneven shape and a peak adjacent to that peak is defined as the average pitch, and the average pitch of the uneven shape in the central part of the first region is P1, and the average pitch of the uneven shape in the outer part of the first region is P2, The stacked electronic component according to claim 8, wherein P2 / P1 satisfies the condition greater than 0.1 and less than 0.

6.

10. The outer perimeter of the first region adjacent to the first external electrode is defined as the first outer perimeter, and the outer perimeter of the first region adjacent to the second external electrode is defined as the second outer perimeter. When the average depth of the uneven shape in the first outer part is D2a and the average depth of the uneven shape in the second outer part is D2b, A stacked electronic component according to claim 1, satisfying D2a < D1 < D2b.

11. The outer perimeter of the first region adjacent to the first external electrode is defined as the first outer perimeter, and the outer perimeter of the first region adjacent to the second external electrode is defined as the second outer perimeter. When the average depth of the uneven shape in the first outer part is D2a and the average depth of the uneven shape in the second outer part is D2b, A stacked electronic component according to claim 1, satisfying D2a > D1 and D2b > D1.

12. The stacked electronic component according to claim 1, wherein D1 and D2 satisfy the condition of being 1 μm or more and 10 μm or less.

13. The stacked electronic component according to any one of claims 1 to 12, wherein the first region includes a plurality of dielectric particles having an aspect ratio of 0.8 or more and 1.2 or less.

14. The multilayer electronic component according to claim 13, wherein the equivalent circular diameter of the plurality of dielectric particles is 50 nm or more and 400 nm or less.

15. A stacked electronic component according to any one of claims 1 to 12, wherein a coating layer is disposed on the first region.

16. The multilayer electronic component according to claim 15, wherein the coating layer contains one or more of Si and F.

17. The laminated electronic component according to any one of claims 1 to 12, wherein the uneven shape includes a columnar shape that continues continuously in the direction in which the dielectric layer and the first internal electrode and the second internal electrode are alternately arranged, and a branch shape that protrudes from the columnar shape in a direction away from the first external electrode and the second external electrode.

18. A body including a dielectric layer, and first and second internal electrodes arranged alternately with the dielectric layer, A first external electrode is disposed on the main body and connected to the first internal electrode, The body includes a second external electrode which is positioned on the main body and connected to the second internal electrode, and positioned at a distance from the first external electrode, When the region of the surface of the main body located between the first external electrode and the second external electrode is defined as the first region, and the region of the surface of the main body in contact with the first external electrode and the second external electrode is defined as the second region, The first region includes an uneven shape with multiple peaks and multiple valleys, A stacked electronic component in which the average value of the distance between any peak of the uneven shape and a peak adjacent to that peak is defined as the average pitch, the average pitch of the uneven shape in the central part of the first region is P1, and the average pitch of the uneven shape in the outer part of the first region is P2, and P1 and P2 are different.

19. The stacked electronic component according to claim 18, wherein P1 / P2 satisfies the condition greater than 0.1 and less than 0.

6.

20. The stacked electronic component according to claim 18, wherein P2 / P1 satisfies the condition greater than 0.1 and less than 0.

6.

21. The outer perimeter of the first region adjacent to the first external electrode is defined as the first outer perimeter, and the outer perimeter of the first region adjacent to the second external electrode is defined as the second outer perimeter. When the average pitch of the uneven shape in the first outer casing is P2a, and the average pitch of the uneven shape in the second outer casing is P2b, A stacked electronic component according to claim 18, satisfying P2a < P1 < P2b.

22. The outer perimeter of the first region adjacent to the first external electrode is defined as the first outer perimeter, and the outer perimeter of the first region adjacent to the second external electrode is defined as the second outer perimeter. When the average depth of the uneven shape in the first outer part is P2a and the average depth of the uneven shape in the second outer part is P2b, A stacked electronic component according to claim 18, satisfying P2a > P1 and P2b > P1.

23. The stacked electronic component according to claim 18, wherein P1 and P2 satisfy the condition of being 1 μm or more and 30 μm or less.

24. The stacked electronic component according to any one of claims 18 to 23, wherein the first region includes a plurality of dielectric particles having an aspect ratio of 0.8 or more and 1.2 or less.

25. The multilayer electronic component according to claim 24, wherein the equivalent circular diameter of the plurality of dielectric particles is 50 nm or more and 400 nm or less.

26. A stacked electronic component according to any one of claims 18 to 23, wherein a coating layer is disposed on the first region.

27. The laminated electronic component according to claim 26, wherein the coating layer contains one or more of Si and F.

28. The laminated electronic component according to any one of claims 18 to 23, wherein the uneven shape includes a columnar shape that continues continuously in the direction in which the dielectric layer and the first internal electrode and the second internal electrode are alternately arranged, and a branch-like shape that protrudes from the columnar shape in a direction away from the first external electrode and the second external electrode.

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