Film deposition apparatus, transfer apparatus, film deposition method, and method for manufacturing electronic devices

The film deposition apparatus addresses height and deposition accuracy issues by using expandable atmospheric pressure spaces and bellows to house wiring and piping, ensuring precise and efficient film deposition.

JP2026100348APending Publication Date: 2026-06-19CANON TOKKI CORP

Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
CANON TOKKI CORP
Filing Date
2024-12-09
Publication Date
2026-06-19

AI Technical Summary

Technical Problem

Existing film deposition apparatuses face challenges in reducing height, deposition accuracy, and preventing twisting of wiring and piping due to multi-joint arm configurations, which are prone to vibration and impurity particle generation.

Method used

A film deposition apparatus with a vacuum chamber design that includes expandable and contractible atmospheric pressure spaces for housing wiring and piping, connected by expandable and contractible bellows, allowing the deposition source to move in multiple directions within the chamber.

Benefits of technology

The apparatus achieves reduced height, enhanced deposition accuracy, and minimizes twisting of wiring and piping, thereby improving the efficiency and precision of film deposition processes.

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Abstract

In a film deposition apparatus having a deposition source that is movably supported relative to a substrate within a vacuum chamber, the generation of impurity particles within the vacuum chamber is suppressed. [Solution] A film deposition apparatus comprising: a vacuum chamber; a deposition source for depositing a deposition material; a scanning direction moving unit for moving the deposition source in the scanning direction; a first atmospheric box that supports the deposition source and has an atmospheric pressure space within the vacuum chamber for housing wiring that electrically connects the outside of the vacuum chamber to at least one of the deposition source and the scanning direction moving unit; a second atmospheric box that has an atmospheric pressure space within the vacuum chamber for housing wiring and is arranged alongside the first atmospheric box in the scanning direction; and a scanning direction connecting unit that has an atmospheric pressure space within the vacuum chamber for housing wiring and connects the atmospheric pressure space of the first atmospheric box and the atmospheric pressure space of the second atmospheric box in a manner that is expandable and retractable in the scanning direction.
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