Film deposition apparatus, transfer apparatus, film deposition method, and method for manufacturing electronic devices
The film deposition apparatus addresses height and deposition accuracy issues by using expandable atmospheric pressure spaces and bellows to house wiring and piping, ensuring precise and efficient film deposition.
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- CANON TOKKI CORP
- Filing Date
- 2024-12-09
- Publication Date
- 2026-06-19
AI Technical Summary
Existing film deposition apparatuses face challenges in reducing height, deposition accuracy, and preventing twisting of wiring and piping due to multi-joint arm configurations, which are prone to vibration and impurity particle generation.
A film deposition apparatus with a vacuum chamber design that includes expandable and contractible atmospheric pressure spaces for housing wiring and piping, connected by expandable and contractible bellows, allowing the deposition source to move in multiple directions within the chamber.
The apparatus achieves reduced height, enhanced deposition accuracy, and minimizes twisting of wiring and piping, thereby improving the efficiency and precision of film deposition processes.
Smart Images

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