Power supply module

Abstract

This invention provides a power supply module that can improve the heat dissipation efficiency of busbars and reduce heat dissipation costs. [Solution] The heat dissipation structure of the power supply module is positioned between the two busbars of the power supply module or outside the busbars to dissipate heat from the busbars. In the embodiment, the heat dissipation structure is positioned between the two busbars, and a single heat dissipation structure is used to dissipate heat from both busbars simultaneously, reducing the cost of the heat dissipation structure. Furthermore, the insulating member of the power supply module is positioned between the two busbars and / or between the busbars and the heat dissipation structure to achieve electrical insulation.

Description

Technical Field

[0001] The present invention relates to a power supply module, and more particularly to a power supply module capable of improving the heat dissipation efficiency of a bus bar and reducing the heat dissipation cost.

Background Art

[0002] With the rise of big data, machine learning, Internet of Things (IoT), and various network platforms, the demand for servers in life is increasing. Generally, a server is connected to a bus bar behind a rack for power supply. The bus bar generates a lot of heat during operation. Therefore, how to effectively improve the heat dissipation efficiency of the bus bar and reduce the heat dissipation cost has become an important design issue.

Summary of the Invention

[0003] In order to solve the above problems, the present invention provides a power supply module capable of improving the heat dissipation efficiency of a bus bar and reducing the heat dissipation cost.

[0004] According to an embodiment of the present invention, the power supply module includes a first bus bar, a second bus bar, a heat dissipation structure, a first insulating member, and a second insulating member. The second bus bar is disposed opposite to the first bus bar. The heat dissipation structure is disposed between the first bus bar and the second bus bar. The first insulating member is disposed between the first bus bar and the heat dissipation structure. The second insulating member is disposed between the first bus bar and the second bus bar. The thickness of the first insulating member is greater than or equal to the thickness of the second insulating member.

[0005] In one embodiment, the first insulating member is formed in a single ring-shaped structure surrounding the heat dissipation structure such that the first insulating member is also disposed between the second bus bar and the heat dissipation structure.

[0006] In one embodiment, the thermal conductivity of the first insulating member is greater than that of the second insulating member.

[0007] In one embodiment, the material of the first insulating member is different from the material of the second insulating member.

[0008] In one embodiment, the resistivity of the second insulating member is greater than the resistivity of the first insulating member.

[0009] In one embodiment, the first insulating member partially overlaps with the second insulating member.

[0010] In one embodiment, the heat dissipation structure has a pipe with multiple fins formed inside.

[0011] In one embodiment, the heat dissipation structure has a pipe and a plurality of sub-tubes arranged inside the pipe.

[0012] In one embodiment, the heat dissipation structure has a pipe and two heat conduction blocks, the pipe being sandwiched between the two heat conduction blocks.

[0013] In one embodiment, the pipe is housed in a space formed between two heat conduction blocks, and the space is filled with a thermal interface material.

[0014] In one embodiment, the heat dissipation structure includes a pipe and a heat conduction plate, the pipe being embedded in the heat conduction plate and exposed from the side of the heat conduction plate.

[0015] In one embodiment, the heat dissipation structure includes a pipe and at least one corrugated plate placed inside the pipe.

[0016] In one embodiment, the heat dissipation structure has a plurality of corrugated plates arranged at intervals within a pipe.

[0017] In one embodiment, the heat dissipation structure has a plurality of corrugated plates, and the two corrugated structures of two adjacent corrugated plates are arranged in a staggered manner.

[0018] In one embodiment, at least one longitudinal groove is formed in the inner wall of the pipe, and at least one corrugated plate has at least one engaging portion that engages with at least one longitudinal groove.

[0019] In one embodiment, the first busbar and the second busbar have two recesses facing each other, and the heat dissipation structure is housed within the two recesses.

[0020] In one embodiment, the power supply module further includes a third insulating member and a fourth insulating member. The third insulating member is positioned between the second busbar and the heat dissipation structure. The fourth insulating member is positioned between the first busbar and the second busbar. The second and fourth insulating members are located on both sides of the heat dissipation structure.

[0021] According to another embodiment of the present invention, the power supply module includes a first busbar, a second busbar, a first heat dissipation structure, and an insulating member. The second busbar is positioned opposite the first busbar. The first heat dissipation structure is positioned outside the first busbar. The insulating member has a central portion and a first clamp portion. The central portion is connected to the first clamp portion and is sandwiched between the first busbar and the second busbar. The first clamp portion clamps the first heat dissipation structure with the first busbar.

[0022] In one embodiment, the first heat dissipation structure has a pipe with a plurality of fins formed inside.

[0023] In one embodiment, the first heat dissipation structure has a pipe and a plurality of sub-tubes arranged inside the pipe.

[0024] In one embodiment, the first heat dissipation structure includes a pipe and at least one corrugated plate placed inside the pipe.

[0025] In one embodiment, the first heat dissipation structure has a plurality of corrugated plates arranged at intervals within the pipe.

[0026] In one embodiment, the first heat dissipation structure has a plurality of corrugated plates, and the two corrugated structures of two adjacent corrugated plates are arranged with a shift.

[0027] In one embodiment, at least one longitudinal groove is formed in the inner wall of the pipe, and at least one corrugated plate has at least one engaging portion that engages with at least one longitudinal groove.

[0028] In one embodiment, the power supply module further has a second heat dissipation structure arranged outside the second bus bar. The insulating member further has a second clamping portion, the central portion is connected between the first clamping portion and the second clamping portion, and the second clamping portion clamps the second heat dissipation structure with the second bus bar.

[0029] As described above, the present invention can arrange the heat dissipation structure between the two bus bars or outside the bus bar so as to dissipate heat from the bus bar. In one embodiment, the heat dissipation structure is arranged between the two bus bars so that the present invention can use a single heat dissipation structure to dissipate heat from the two bus bars simultaneously in order to reduce the cost of the heat dissipation structure. Further, the present invention can arrange an insulating member between the two bus bars and / or arrange an insulating member between the bus bar and the heat dissipation structure in order to achieve electrical insulation.

[0030] These and other objects of the present invention will be undoubtedly clear to those skilled in the art upon reading the following detailed description of the preferred embodiments shown in various figures and drawings.

Brief Description of the Drawings

[0031] [Figure 1] It is a perspective view showing a power supply module according to an embodiment of the present invention. [Figure 2] Figure 1 is a cross-sectional view showing the power supply module. [Figure 3] This is a cross-sectional view showing a power supply module according to another embodiment. [Figure 4] This is a perspective view showing a heat dissipation structure according to another embodiment of the present invention. [Figure 5] Figure 4 is a front view showing the heat dissipation structure. [Figure 6] This is a perspective view showing a heat dissipation structure according to another embodiment of the present invention. [Figure 7] Figure 6 is a front view showing the heat dissipation structure. [Figure 8] A side view showing a heat dissipation structure according to another embodiment of the present invention. [Figure 9] This is a perspective view showing a heat dissipation structure according to another embodiment of the present invention. [Figure 10] This is a cross-sectional view showing a power supply module according to another embodiment of the present invention. [Figure 11] This is a cross-sectional view showing a power supply module according to another embodiment of the present invention. [Figure 12] This is a cross-sectional view showing a power supply module according to another embodiment of the present invention. [Modes for carrying out the invention]

[0032] Referring to Figures 1 and 2, Figure 1 is a perspective view showing a power supply module 1 according to an embodiment of the present invention, and Figure 2 is a cross-sectional view showing the power supply module 1 shown in Figure 1.

[0033] As shown in Figures 1 and 2, the power supply module 1 includes a housing 10, a first busbar 12, a second busbar 14, two ground busbars 16, a heat dissipation structure 18, a first insulating member 20, a second insulating member 22, a third insulating member 24, and a fourth insulating member 26. In practical applications, the power supply module 1 may be connected to an electronic device (e.g., a server) for power supply.

[0034] The first busbar 12 and the second busbar 14 are located within the housing 10, with the second busbar 14 positioned opposite the first busbar 12. The material of the first busbar 12 and the second busbar 14 may be copper or nickel-silver coated copper. In some embodiments, the material of the first busbar 12 and the second busbar 14 may be aluminum. In practical applications, one of the first busbar 12 and the second busbar 14 may be a positive busbar, and the other may be a negative busbar. Two ground busbars 16 are fixed to the two inner walls of the housing 10 and are located on either side of the first busbar 12 and the second busbar 14. The first busbar 12, the second busbar 14, and the two ground busbars 16 may be fixed to the housing 10 by bolts or the like.

[0035] The heat dissipation structure 18 is positioned between the first busbar 12 and the second busbar 14. In this embodiment, the heat dissipation structure 18 may have a pipe 180 and two heat conduction blocks 182. A coolant (e.g., water) may flow through the pipe 180 to exert a liquid cooling effect. The pipe 180 may be circular and sandwiched between the two heat conduction blocks 182 to simplify the manufacturing process. However, hollow pipe fittings of various shapes may be used for fluid circulation. Thus, the pipe 180 is not limited to a circular shape, and the shape of the pipe 180 may be determined according to the actual application. It should be noted that the pipe 180 may have a liquid inlet and outlet exposed from at least one side of the housing 10, and the end of the pipe 180 shown in Figure 1 is a closed end. Furthermore, the pipe 180 may have an internal structure such as a grid, microstructure (e.g., gears), or capillary structure on its inner surface to improve heat dissipation efficiency. The material of the two heat conduction blocks 182 may be aluminum, and the material of the pipe 180 may be copper, but the present invention is not limited thereto. Furthermore, the first busbar 12 and the second busbar 14 may have two recesses 120, 140 facing each other, and the heat dissipation structure 18 may be housed in the two recesses 120, 140 to reduce the overall thickness.

[0036] The first insulating member 20 is positioned between the first busbar 12 and the heat dissipation structure 18, and the third insulating member 24 is positioned between the second busbar 14 and the heat dissipation structure 18. The materials of the first insulating member 20 and the third insulating member 24 may be polyimide (PI), thermal tape, epoxy, etc., and depend on the actual application. The second insulating member 22 is positioned between the first busbar 12 and the second busbar 14, and the fourth insulating member 26 is also positioned between the first busbar 12 and the second busbar 14, with the second insulating member 22 and the fourth insulating member 26 located on both sides of the heat dissipation structure 18. The materials of the second insulating member 22 and the fourth insulating member 26 may be plastic materials such as polypropylene (PP), polyphthalamide (PPA), polyphenylene sulfide (PPS), polyamide (PA), acrylonitrile butadiene styrene (ABS), polyketone (PK), polycarbonate (PC), polybutylene terephthalate (PBT), liquid crystal polymer (LCP), etc., and depend on the actual application. The plastic material may also be filled with 10 to 40% by weight of glass fiber. Therefore, the materials of the first insulating member 20 and the third insulating member 24 are different from the materials of the second insulating member 22 and the fourth insulating member 26.

[0037] The first insulating member 20, the second insulating member 22, the third insulating member 24, and the fourth insulating member 26 are configured to insulate the power supply voltage between the first busbar 12 and the second busbar 14, and the power supply voltage may be between 0V and 800V. In this embodiment, the thickness of the first insulating member 20 and the third insulating member 24 is greater than or equal to the thickness of the second insulating member 22 and the fourth insulating member 26, respectively. For example, the thickness of the first insulating member 20 and the third insulating member 24 may be 2 mm, and the thickness of the second insulating member 22 and the fourth insulating member 26 may be between 0.02 mm and 2 mm, but the present invention is not limited thereto. Furthermore, the thermal conductivity of the first insulating member 20 and the third insulating member 24 is greater than the thermal conductivity of the second insulating member 22 and the fourth insulating member 26, respectively. For example, the thermal conductivity of the first insulating member 20 and the third insulating member 24 may be between 2 W / mk and 3.5 W / mk, and the thermal conductivity of the second insulating member 22 and the fourth insulating member 26 may be between 0.25 W / mk and 0.36 W / mk, but the present invention is not limited thereto. Furthermore, the resistivity of the second insulating member 22 and the fourth insulating member 26 is greater than the resistivity of the first insulating member 20 and the third insulating member 24. Furthermore, the insulation coefficient of the first insulating member 20 and the third insulating member 24 may be between 20 KV / mm and 50 KV / mm, and the insulation coefficient of the second insulating member 22 and the fourth insulating member 26 may be between 10 KV / mm and 50 KV / mm, but the present invention is not limited thereto. Therefore, the first insulating member 20 and the third insulating member 24 have better thermal conductivity than the second insulating member 22 and the fourth insulating member 26, and the second insulating member 22 and the fourth insulating member 26 have better insulation and heat resistance than the first insulating member 20 and the third insulating member 24.

[0038] In this embodiment, both ends of the first insulating member 20 may partially overlap with the second insulating member 22 and the fourth insulating member 26, respectively, in order to ensure an insulating effect between the first busbar 12 and the heat dissipation structure 18. Similarly, both ends of the third insulating member 24 may overlap with the second insulating member 22 and the fourth insulating member 26, respectively, in order to ensure an insulating effect between the second busbar 14 and the heat dissipation structure 18.

[0039] Referring to Figure 3, Figure 3 is a cross-sectional view showing a power supply module 1 according to another embodiment of the present invention.

[0040] As shown in Figure 3, the heat dissipation structure 18 of the power supply module 1 may have only a pipe 180, and the aforementioned heat conduction block 182 may be omitted. In this embodiment, the pipe 180 may be rectangular, but the present invention is not limited thereto. In other embodiments, the pipe 180 may be circular or other shapes depending on the actual application. Since the pipe 180 is in direct contact with the first insulating member 20 and the third insulating member 24, the heat generated in the first busbar 12 and the second busbar 14 can be directly conducted to the pipe 180 to improve heat dissipation efficiency.

[0041] Referring to Figures 4 and 5, Figure 4 is a perspective view showing a heat dissipation structure 18 according to another embodiment of the present invention, and Figure 5 is a front view showing the heat dissipation structure 18 shown in Figure 4.

[0042] As shown in Figures 4 and 5, the heat dissipation structure 18 may have a pipe 180 and at least one corrugated plate 184 disposed within the pipe 180. In this embodiment, the heat dissipation structure 18 may have multiple corrugated plates 184 spaced apart within the pipe 180. For example, as shown in Figure 4, the heat dissipation structure 18 may have two corrugated plates 184 spaced apart within the pipe 180 such that a region without corrugated plates lies between the two corrugated plates 184. It should be noted that the number of corrugated plates 184 may be determined according to the actual application, but the present invention is not limited to the embodiments shown in the figures. For example, the number of corrugated plates 184 may be one, which is the same length as the pipe 180, or multiple, which are separated across the pipe 180. The material of the pipe 180 and the corrugated plates 184 may be copper, aluminum, or other metals. The pipe 180 and the corrugated plates 184 may be assembled by welding, bonding, engaging, or other fastening methods. The shape of the corrugated plate 184 is not limited to this, but may be sawtooth-shaped, and the number of waves (folds) may be one or more.

[0043] The corrugated plate 184 is configured to divide the internal space of the pipe 180 into multiple liquid channels. Therefore, when the coolant flows through the liquid channels, turbulence is generated to remove more heat, thereby reducing the cost of the heat dissipation structure 18 and improving heat dissipation efficiency with the same or greater contact area.

[0044] As shown in Figure 5, the inner wall 1800 of the pipe 180 may have at least one longitudinal groove 1802 formed thereon, and at least one corrugated plate 184 may have at least one engaging portion 1840 that engages with at least one longitudinal groove 1802. In this embodiment, the inner wall 1800 of the pipe 180 may have three longitudinal grooves 1802 formed on both sides, and the corrugated plate 184 may have three engaging portions 1840 that engage with the three longitudinal grooves 1802. The corrugated plate 184 may slide inside the pipe 180 by aligning the engaging portion 1840 with the longitudinal groove 1802 so that the corrugated plate 184 is positioned and fixed inside the pipe 180 by the engagement between the engaging portion 1840 and the longitudinal groove 1802.

[0045] Referring to Figures 6 and 7, Figure 6 is a perspective view showing a heat dissipation structure 18 according to another embodiment of the present invention, and Figure 7 is a front view showing the heat dissipation structure 18 shown in Figure 6.

[0046] As shown in Figures 6 and 7, the heat dissipation structure 18 may have multiple corrugated plates 184, and two corrugated structures 1842 of two adjacent corrugated plates 184 may be arranged with a staggered arrangement. When the coolant flows through the staggered interface between the two adjacent corrugated plates 184, turbulence is generated to remove more heat, thereby reducing the cost of the heat dissipation structure 18 for the same or greater contact area and improving heat dissipation efficiency.

[0047] Referring to Figure 8, Figure 8 is a side view showing a heat dissipation structure 18 according to another embodiment of the present invention.

[0048] As shown in Figure 8, the heat dissipation structure 18 may have a pipe 180, two heat conduction blocks 182, and a plurality of sub-tubes 186. The sub-tubes 186 are arranged within the pipe 180. The pipe 180 is housed in a space 188 formed between the two heat conduction blocks 182. In this embodiment, the space 188 formed between the two heat conduction blocks 182 may be rectangular, but is not limited thereto. Furthermore, a thermal interface material (TIM) 190 is filled into this space 188. The arrangement of the heat dissipation structure 18 shown in Figure 8 improves heat dissipation efficiency.

[0049] Referring to Figure 9, Figure 9 is a perspective view showing a heat dissipation structure 18 according to another embodiment of the present invention.

[0050] As shown in Figure 9, the heat dissipation structure 18 may have a pipe 180 and a heat conduction plate 192. In this embodiment, the pipe 180 may be embedded in the heat conduction plate 192 and exposed from the side of the heat conduction plate 192.

[0051] Referring to Figure 10, Figure 10 is a cross-sectional view showing a power supply module 1 according to another embodiment of the present invention.

[0052] As shown in Figure 10, the first insulating member 20 may be formed as a single ring-shaped structure surrounding the heat dissipation structure 18, such that the first insulating member 20 is also positioned between the second busbar 14 and the heat dissipation structure 18. Therefore, the third insulating member 24 shown in Figures 2 and 3 may be omitted. Furthermore, the heat dissipation structure 18 may have only a pipe 180, and the pipe 180 may have a plurality of fins 1804 formed therein. The fins 1804 are configured to improve heat dissipation efficiency. In this embodiment, the pipe 180 may be a closed elliptical pipe, but is not limited thereto. In other embodiments, the pipe 180 may be square, rectangular, trapezoidal, or other shapes depending on the actual application. Furthermore, the material of the fins 1804 may be copper, aluminum, or copper / aluminum covered with insulating plastic.

[0053] Referring to Figure 11, Figure 11 is a cross-sectional view showing a power supply module 1 according to another embodiment of the present invention.

[0054] As shown in Figure 11, the first busbar 12 and the second busbar 14 may have the same shape. In this embodiment, the two recesses 120 and 140 are offset in position, and the two ends 122 and 142 of the first busbar 12 and the second busbar 14 are offset within the insertion opening 100 of the housing 10 so that the heat dissipation structure 18 abuts against the two edges 1200 and 1400 of the two diagonally opposite recesses 120 and 140. Since the first busbar 12 and the second busbar 14 have the same shape, they may be manufactured using a single mold to reduce manufacturing costs.

[0055] Referring to Figure 12, Figure 12 is a cross-sectional view showing a power supply module 1' according to another embodiment of the present invention.

[0056] As shown in Figure 12, the power supply module 1' comprises a housing 10, a first busbar 12, a second busbar 14, two ground busbars 16, a first heat dissipation structure 18a, a second heat dissipation structure 18b, and an insulating member 21. In practical applications, the power supply module 1' may be connected to an electronic device (e.g., a server) for power supply.

[0057] The first busbar 12 and the second busbar 14 are located within the housing 10, with the second busbar 14 positioned opposite the first busbar 12. The first busbar 12 and the second busbar 14 may be copper or nickel-silver coated copper. In some embodiments, the first busbar 12 and the second busbar 14 may be aluminum. In practical applications, one of the first busbar 12 and the second busbar 14 may be a positive busbar, and the other may be a negative busbar. Two ground busbars 16 are fixed to the two inner walls of the housing 10 and are located on either side of the first busbar 12 and the second busbar 14. The first busbar 12, the second busbar 14, and the two ground busbars 16 may be fixed to the housing 10 by bolts or the like.

[0058] The first heat dissipation structure 18a is located outside the first busbar 12, and the second heat dissipation structure 18b is located outside the second busbar 14. In this embodiment, the first heat dissipation structure 18a and the second heat dissipation structure 18b may be designed as any of the heat dissipation structures 18 shown in Figures 1 to 10, depending on the actual application, and the relevant explanations are not given again here.

[0059] The insulating member 21 has a central portion 210, a first clamp portion 212, and a second clamp portion 214, the central portion 210 being connected between the first clamp portion 212 and the second clamp portion 214. The central portion 210 is sandwiched between the first busbar 12 and the second busbar 14, and the two ends 122, 142 of the first busbar 12 and the second busbar 14 are offset within the insertion opening 100 of the housing 10. The first clamp portion 212 clamps the first heat dissipation structure 18a with the first busbar 12. The second clamp portion 214 clamps the second heat dissipation structure 18b with the second busbar 14. Therefore, the power supply voltage between the first busbar 12 and the second busbar 14 is insulated by the central portion 210 of the insulating member 21, and the first heat dissipation structure 18a and the second heat dissipation structure 18b are fixed to the outside of the first busbar 12 and the second busbar 14 by the first clamp portion 212 and the second clamp portion 214 of the insulating member 21, respectively. The material of the insulating member 21 can be a plastic material such as polypropylene (PP), polyphthalamide (PPA), polyphenylene sulfide (PPS), polyamide (PA), acrylonitrile butadiene styrene (ABS), polyketone (PK), polycarbonate (PC), polybutylene terephthalate (PBT), liquid crystal polymer (LCP), etc., and depends on the actual application. The plastic material may also be filled with 10 to 40% by weight of glass fiber.

[0060] As described above, the present invention may position a heat dissipation structure between two busbars or outside the busbars to dissipate heat from the busbars. In one embodiment, the heat dissipation structure may be positioned between two busbars so that the present invention can use a single heat dissipation structure to dissipate heat from both busbars simultaneously in order to reduce the cost of the heat dissipation structure. Furthermore, the present invention may position an insulating member between the two busbars and / or between the busbars and the heat dissipation structure to achieve electrical insulation.

[0061] Those skilled in the art will readily understand that many modifications and changes can be made to the apparatus and method while maintaining the teachings of the present invention. Accordingly, the above disclosure should be construed as being limited only to the scope of the appended claims.

Claims

1. First bus bar; A second bus bar positioned opposite the first bus bar; A heat dissipation structure disposed between the first busbar and the second busbar; A first insulating member disposed between the first busbar and the heat dissipation structure; and A second insulating member positioned between the first busbar and the second busbar; It has, The thickness of the first insulating member is equal to or greater than the thickness of the second insulating member. Power supply module.

2. The first insulating member is formed in a single ring-shaped structure surrounding the heat dissipation structure such that the first insulating member is also positioned between the second busbar and the heat dissipation structure. The power supply module according to claim 1.

3. The thermal conductivity of the first insulating member is greater than the thermal conductivity of the second insulating member. The power supply module according to claim 1.

4. The material of the first insulating member is different from the material of the second insulating member. The power supply module according to claim 1.

5. The resistivity of the second insulating member is greater than the resistivity of the first insulating member. The power supply module according to claim 1.

6. The first insulating member partially overlaps with the second insulating member. The power supply module according to claim 1.

7. The heat dissipation structure has a pipe with multiple fins formed inside, The power supply module according to claim 1.

8. The heat dissipation structure has a pipe and a plurality of sub-tubes arranged inside the pipe. The power supply module according to claim 1.

9. The heat dissipation structure comprises a pipe and two heat conduction blocks, the pipe being sandwiched between the two heat conduction blocks. The power supply module according to claim 1.

10. The pipe is housed in the space formed between the two heat conduction blocks, and the thermal interface material is filled into the space. The power supply module according to claim 9.

11. The heat dissipation structure comprises a pipe and a heat conduction plate, the pipe being embedded within the heat conduction plate and exposed from the side of the heat conduction plate. The power supply module according to claim 1.

12. The heat dissipation structure comprises a pipe and at least one corrugated plate disposed inside the pipe. The power supply module according to claim 1.

13. The heat dissipation structure has a plurality of corrugated plates arranged at intervals within the pipe. The power supply module according to claim 12.

14. The heat dissipation structure has a plurality of corrugated plates, and the two corrugated structures of two adjacent corrugated plates are arranged with a staggered arrangement. The power supply module according to claim 12.

15. At least one longitudinal groove is formed in the inner wall of the pipe, and at least one corrugated plate has at least one engaging portion that engages with the at least one longitudinal groove. The power supply module according to claim 12.

16. The first busbar and the second busbar each have two recesses facing each other, and the heat dissipation structure is housed within the two recesses. The power supply module according to claim 1.

17. A third insulating member disposed between the second busbar and the heat dissipation structure; and A fourth insulating member disposed between the first busbar and the second busbar, wherein the second and fourth insulating members are located on both sides of the heat dissipation structure; further comprising: The power supply module according to claim 1.

18. First bus bar; A second bus bar positioned opposite the first bus bar; A first heat dissipation structure positioned outside the first busbar; and An insulating member having a central portion and a first clamp portion, wherein the central portion is connected to the first clamp portion and sandwiched between the first busbar and the second busbar, and the first clamp portion clamps the first heat dissipation structure with the first busbar; Power supply module.

19. The first heat dissipation structure has a pipe with a plurality of fins formed inside, The power supply module according to claim 18.

20. The first heat dissipation structure has a pipe and a plurality of sub-tubes arranged inside the pipe. The power supply module according to claim 18.

21. The first heat dissipation structure comprises a pipe and at least one corrugated plate disposed within the pipe. The power supply module according to claim 18.

22. The first heat dissipation structure has a plurality of corrugated plates arranged at intervals within the pipe, The power supply module according to claim 21.

23. The first heat dissipation structure has a plurality of corrugated plates, and the two corrugated structures of two adjacent corrugated plates are arranged with a staggered arrangement. The power supply module according to claim 21.

24. At least one longitudinal groove is formed in the inner wall of the pipe, and at least one corrugated plate has at least one engaging portion that engages with the at least one longitudinal groove. The power supply module according to claim 21.

25. The present invention further comprises a second heat dissipation structure positioned outside the second busbar, the insulating member further comprises a second clamp portion, the central portion of which is connected between the first clamp portion and the second clamp portion, and the second clamp portion clamps the second heat dissipation structure with the second busbar. The power supply module according to claim 18.

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