Sheets for semiconductor device manufacturing

Abstract

The present invention provides a sheet for semiconductor device manufacturing that suppresses the occurrence of winding marks (transfer marks) on the adhesive film when it is wound. [Solution] The semiconductor device manufacturing sheet 100 comprises a strip-shaped release liner 3, adhesive films with dicing tape 1 arranged in a row on one side of the release liner, and an outer film 4 positioned on one side of the release liner at a distance from the outer edge of the adhesive films with dicing tape. The dicing tape 20 is positioned to cover the adhesive film 10. The outer film has a first outer film 41 and a second outer film 42 spaced apart from each other in the width direction of the release liner. The first outer film and the second outer film have protrusions T that project inward in the width direction between adjacent adhesive films with dicing tape in the longitudinal direction, and the distance A between the ends of the protrusions facing each other is 145 mm or less.

Description

Technical Field

[0001] The present invention relates to a sheet for manufacturing a semiconductor device, which is used, for example, when manufacturing a semiconductor device or the like.

Background Art

[0002] Conventionally, a sheet for manufacturing a semiconductor device used in the manufacture of a semiconductor device or the like is known. This type of sheet for manufacturing a semiconductor device includes, for example, a dicing tape and an adhesive film laminated on the dicing tape and adhered to a semiconductor wafer. The dicing tape has a base material layer and an adhesive layer in contact with the adhesive film. The dicing tape and the adhesive film are laminated on each other to form a laminate (adhesive film with dicing tape).

[0003] This type of sheet for manufacturing a semiconductor device further includes, for example, a long strip-shaped release liner. Such a sheet for manufacturing a semiconductor device includes a plurality of the above-mentioned laminates overlapping one side of the release liner, and the plurality of laminates are arranged in the longitudinal direction of the release liner and spaced apart in the longitudinal direction. Such a sheet for manufacturing a semiconductor device can be stored in a wound state until it is used. Each of the above-mentioned adhesive film with dicing tape (the above-mentioned laminate) of such a sheet for manufacturing a semiconductor device is used as follows, for example, in the application of a dicing die bond sheet, in the manufacture of a semiconductor device. In this case, the adhesive film can have the function of a die bond sheet.

[0004] A method for manufacturing a semiconductor device generally includes a pre-step of forming a circuit surface on one side of a disk-shaped bare wafer by a highly integrated electronic circuit, and a post-step of cutting out semiconductor chips from the semiconductor wafer with the circuit surface formed and performing assembly.

[0005] For example, the post-processing steps include a mounting step in which the side of the semiconductor wafer opposite to the circuit surface is attached to an adhesive film and the semiconductor wafer is fixed to a dicing tape via the adhesive film; an expanding step in which the dicing tape is stretched in the radial direction of the semiconductor wafer to cleave the semiconductor wafer together with the adhesive film into small pieces and widen the spacing between adjacent semiconductor chips (dies); a pick-up step in which the semiconductor chips with the adhesive film attached are peeled off from between the adhesive film pieces and the adhesive layer and removed; and a die bonding step in which the semiconductor chips with the adhesive film pieces attached are bonded to a substrate via the adhesive film pieces. Semiconductor devices are manufactured, for example, through these steps.

[0006] Various problems can arise with the semiconductor device manufacturing sheets described above. For example, in semiconductor device manufacturing sheets that are wound as described above, one sheet, which is stacked by the winding, applies localized force to a part of the adhesive film of the other sheet, which can easily cause winding marks (transfer marks) to form on the adhesive film. If an adhesive film with winding marks is used as a component of a semiconductor device, the winding marks can cause air bubbles to form within the adhesive film. Such air bubbles can reduce the adhesive strength of the adhesive film provided in the semiconductor device, or cause cracks to form in the adhesive film, which can degrade the performance of the semiconductor device. In contrast, a sheet for manufacturing semiconductor devices in a wound state is known in which the occurrence of winding marks (transfer marks) on the adhesive film is suppressed (for example, Patent Document 1).

[0007] The semiconductor device manufacturing sheet described in Patent Document 1 has an adhesive film thickness of 80 to 150 μm in a wound state, and the number of adhesive films with dicing tape laminated on a release liner is 150 or less. [Prior art documents] [Patent Documents]

[0008] [Patent Document 1] Patent No. 5714091 [Overview of the Initiative] [Problems that the invention aims to solve]

[0009] However, sheets for semiconductor device manufacturing that suppress the formation of winding marks (transfer marks) on the adhesive film when wound have not yet been sufficiently investigated.

[0010] Therefore, the object of the present invention is to provide a sheet for manufacturing semiconductor devices in which the occurrence of winding marks (transfer marks) on the adhesive film when it is wound is suppressed. [Means for solving the problem]

[0011] To solve the above problems, the semiconductor device manufacturing sheet according to the present invention is A sheet for manufacturing semiconductor devices, comprising at least one strip-shaped structural unit, Each of the aforementioned strip-shaped structural units is: A strip-shaped release liner, Multiple adhesive films with dicing tape are arranged in a row, overlapping one side of the release liner and spaced apart in the longitudinal direction of the release liner, The release liner has an outer film that directly overlaps one of its surfaces and is spaced apart from each of the outer edges of the plurality of adhesive films with dicing tape, Each of the dicing tape-attached adhesive films comprises a dicing tape having a laminated structure of a base material layer and an adhesive layer, and an adhesive film disposed between the dicing tape and the release liner and in peelable contact with the adhesive layer. Each of the dicing tapes is positioned to extend beyond the outer edge of the adhesive film and cover the adhesive film. For each of the aforementioned strip-shaped structural units, the outer film comprises a first outer film and a second outer film, respectively, arranged on one side and the other side in the width direction of the release liner and spaced apart from each other in the width direction. Each of the strip-shaped structural units has a plurality of protrusions that project inward in the width direction and are arranged in the longitudinal direction between the adhesive films with dicing tape that are adjacent to each other in the longitudinal direction. The first outer film and the second outer film are arranged such that the tip portions of the protrusions face each other in the width direction, and the distance between the facing tip portions is 145 mm or less. [Effects of the Invention]

[0012] In the semiconductor device manufacturing sheet according to the present invention, the occurrence of winding marks (transfer marks) on the adhesive film when it is wound is suppressed. [Brief explanation of the drawing]

[0013] [Figure 1] A schematic diagram of a specific example of a semiconductor device manufacturing sheet according to this embodiment, viewed from one side in the thickness direction when not wound. [Figure 2] A schematic diagram showing an enlarged portion of Figure 1. [Figure 3] A schematic cross-sectional view of a specific example of the semiconductor device manufacturing sheet of this embodiment, obtained by cutting along the dashed lines in the width and thickness directions shown in Figure 1. [Figure 4] A schematic diagram showing a specific example of the semiconductor device manufacturing sheet of this embodiment when it is wound up. [Figure 5] A schematic cross-sectional view of a semiconductor device manufacturing sheet of this embodiment, obtained by cutting the sheet in the longitudinal and thickness directions when it is wound or otherwise stacked. [Figure 6] A schematic cross-sectional view of an adhesive film with dicing tape, a specific example of a semiconductor device manufacturing sheet according to this embodiment, cut in the thickness direction. [Figure 7] A schematic diagram of another specific example of the semiconductor device manufacturing sheet of this embodiment, viewed from one side in the thickness direction when not wound. [Modes for carrying out the invention]

[0014] Hereinafter, an embodiment of a sheet for manufacturing a semiconductor device according to the present invention will be described with reference to the drawings. Note that the figures in the drawings are schematic diagrams and are not necessarily the same as the aspect ratio of the vertical and horizontal lengths in actual objects. Also, the terms "longitudinal direction" and "width direction" respectively refer to the longitudinal direction and width direction of the sheet 100 for manufacturing a semiconductor device (or the release liner or the strip-shaped structural unit).

[0015] The sheet 100 for manufacturing a semiconductor device of the present embodiment is a sheet for manufacturing a semiconductor device including at least one strip-shaped structural unit G, Each of the strip-shaped structural units G has a strip-shaped release liner 3, a plurality of dicing tape-attached adhesive films 1 that overlap one surface of the release liner 3 and are arranged in a row at intervals in the longitudinal direction of the release liner 3, and an outer film 4 that directly overlaps the one surface of the release liner 3 and is arranged at an interval from each outer peripheral edge of the plurality of dicing tape-attached adhesive films 1, Each of the dicing tape-attached adhesive films 1 has a dicing tape 20 having a laminated structure of a base material layer 21 and an adhesive layer 22, and an adhesive film 10 that is arranged between the dicing tape 20 and the release liner 3 and is detachably in contact with the adhesive layer 22, Each of the dicing tapes 20 is arranged so as to protrude from the outer peripheral edge of the adhesive film 10 and cover the adhesive film 10, For each strip-shaped structural unit G, the outer film 4 has a first outer film 41 and a second outer film 42 that are respectively arranged on one side and the other side in the width direction of the release liner 3 and are spaced apart from each other in the width direction, For each strip-shaped structural unit G, the first outer film 41 and the second outer film 42 each have a plurality of convex portions T that protrude inward in the width direction and are arranged in the longitudinal direction between the dicing tape-attached adhesive films 1 adjacent to each other in the longitudinal direction, The first outer film 41 and the second outer film 42 are arranged such that the tip portions of the protrusions T face each other in the width direction, and the distance between the facing tip portions is 145 mm or less.

[0016] The following will provide a detailed explanation of a specific example in which the semiconductor device manufacturing sheet 100 comprises only one strip-shaped structural unit G. In this specific example, since one strip-shaped structural unit G corresponds to the semiconductor device manufacturing sheet 100, the explanation of the semiconductor device manufacturing sheet 100 and the explanation of each strip-shaped structural unit G will be the same. The following will provide a detailed explanation of this specific example.

[0017] The semiconductor device manufacturing sheet 100 is strip-shaped, as shown in Figure 1. When viewing the semiconductor device manufacturing sheet 100 from one side of the release liner 3 where the multiple adhesive films with dicing tapes 1 overlap (hereinafter also simply referred to as "one side"), the multiple adhesive films with dicing tapes 1 are arranged at intervals along the longitudinal direction of the semiconductor device manufacturing sheet 100. The shape of each adhesive film with dicing tape 1 is, for example, circular, as shown in Figure 1. However, the circular shape is not limited to a perfect circle, and may be, for example, elliptical. Furthermore, the shape of each adhesive film with dicing tape 1 is not limited to a circular shape, and may be, for example, rectangular.

[0018] When the semiconductor device manufacturing sheet 100 is viewed from one side, the entire adhesive film 10 is covered by the dicing tape 20. More specifically, each dicing tape 20 is positioned on one side of the release liner 3 so as to cover the entire adhesive film 10 that overlaps with one side of the release liner 3. The entire surface of one side of each adhesive film 10 overlaps with one side of the release liner 3, and the entire other side of each adhesive film 10 overlaps with one side of the dicing tape 20 (adhesive layer 22) (see Figure 3).

[0019] On one side of the release liner 3, the outer edge of each dicing tape 20 extends outward from the outer edge of each adhesive film 10. In addition, a portion of one side of the release liner 3 is exposed outside the outer edge of each dicing tape 20 (hereinafter also referred to as the exposed side of the release liner).

[0020] When the semiconductor device manufacturing sheet 100 is viewed from one of the aforementioned sides, the exposed surface of the release liner 3 is positioned to surround each dicing tape 20. In other words, the exposed surface of the release liner 3 is positioned between the outer edge of each dicing tape 20 and the inner edge of the outer film 4.

[0021] When the semiconductor device manufacturing sheet 100 is viewed from one side, the outer film 4 is positioned to surround the plurality of dicing tapes 20 and to be spaced apart from the outer edges of any of the dicing tapes 20. In other words, the outer film 4 is positioned to surround the plurality of dicing tapes 20 from one side and the other side in the width direction, while being spaced apart from the outer edges of the plurality of dicing tapes 20. The outer film 4 covers all of the remaining portion of the release liner 3 on one side, excluding the exposed surface of the release liner and the portion covered by the dicing tapes 20.

[0022] The outer film 4 has a first outer film 41 arranged on one side in the width direction of the strip-shaped semiconductor device manufacturing sheet 100 (strip-shaped structural unit G), and a second outer film 42 arranged on the other side. The first outer film 41 and the second outer film 42 are spaced apart from each other in the width direction.

[0023] When the semiconductor device manufacturing sheet 100 is viewed from one side, the first outer film 41 and the second outer film 42 each have an end that extends in the longitudinal direction and is located on one side in the width direction, and a plurality of protrusions T that project inward from the end (see Figure 2). The plurality of protrusions T of the first outer film 41 and the second outer film 42 are spaced apart in the longitudinal direction. The protrusions T of the first outer film 41 and the second outer film 42 are arranged so that the tip directions of their leading edges face each other. Each dicing tape 20 is arranged to be surrounded by two protrusions T of the first outer film 41 that are adjacent in the longitudinal direction, and two protrusions T of the second outer film 42 that are adjacent in the longitudinal direction and face these two protrusions in the width direction. In another aspect, the protrusions T of the first outer film 41 and the protrusions T of the second outer film 42 facing the protrusions in the width direction are spaced apart from each other in the width direction and are arranged to fit into the area between adjacent dicing tapes 20 in the longitudinal direction.

[0024] When the semiconductor device manufacturing sheet 100 is viewed from one side, the first outer film 41 and the second outer film 42 are arranged to surround the plurality of dicing tapes 20 from one side and the other side in the width direction, respectively. In the region sandwiched between adjacent dicing tapes 20 in the longitudinal direction, the protrusions T of the first outer film 41 and the second outer film 42 are spaced apart in the width direction, with the tip directions of their respective tip portions facing each other, as shown in Figure 2, for example. A pair of protrusions T in the portion where the first outer film 41 and the second outer film 42 are close to each other both have a shape that protrudes inward in the width direction. In other words, the first outer film 41 and the second outer film 42 have protruding shapes such that their protruding directions face each other in the width direction.

[0025] When the semiconductor device manufacturing sheet 100 is viewed from one of the above-mentioned sides, the distance between the leading edges of the first outer film and the second outer film (indicated by A in Figure 2) is 145 mm or less. This configuration suppresses the occurrence of winding marks (transfer marks) on the adhesive film 10 when the semiconductor device manufacturing sheet is wound. The above-mentioned separation distance A is preferably 120 mm or less, and more preferably 100 mm or less. This more effectively suppresses the occurrence of winding marks (transfer marks) on the adhesive film 10.

[0026] More specifically, the semiconductor device manufacturing sheet 100 with the above configuration can be stored in a wound state until it is used. It can also be moved in a wound state. When the semiconductor device manufacturing sheet is wound, for example as shown in Figure 4, the release liner 3 is positioned on the outside and the adhesive film 1 with dicing tape of the semiconductor device manufacturing sheet 100 is positioned on the inside. When the semiconductor device manufacturing sheet with the above configuration is wound, it becomes a state in which sheet-like semiconductor device manufacturing sheets 100 are stacked in the thickness direction, as shown in Figure 5, for example. At this time, spaced portions of adhesive films 1 with dicing tape that are adjacent to each other in the longitudinal direction may be placed on the outside of the adhesive film 10 of the semiconductor device manufacturing sheet 100 that is placed on the inside (see arrows in Figure 5). In these spaced portions on the outside, the force supporting the inner semiconductor device manufacturing sheet 100 is weakened, so a localized force is applied to a part of the inner adhesive film 10, making it easy for winding marks (transfer marks) to occur. However, in the semiconductor device manufacturing sheet 100 with the above configuration, the distance A between the tips of the protrusions of the first outer film 41 and the second outer film 42 is 145 mm or less. Because the above distance A on the outside is relatively short, the adhesive film 10 of the inner semiconductor device manufacturing sheet 100 can be well supported by the outer semiconductor device manufacturing sheet 100. Therefore, the semiconductor device manufacturing sheet with the above configuration suppresses the occurrence of winding marks (transfer marks) on the adhesive film 10 when it is wound.

[0027] The spacing A in the width direction is preferably 30 mm or more. This makes handling the adhesive film 1 with dicing tape easier in the mounting process, which will be described in detail later.

[0028] When the semiconductor device manufacturing sheet 100 is viewed from one of the above-mentioned sides, it is preferable that the tip portions of the protrusions T of the first outer film 41 and the second outer film 42 are both rounded. In other words, it is preferable that the tip portions of the first outer film 41 and the second outer film 42 that are closest to each other in the width direction of the semiconductor device manufacturing sheet 100 are both rounded. With this configuration, the occurrence of winding marks (transfer marks) on the adhesive film 10 when it is wound is more effectively suppressed.

[0029] The rounded shape of the tip portion described above preferably has a radius of curvature of 1 mm or more, more preferably 3 mm or more, and even more preferably 6 mm or more. With this configuration, the occurrence of winding marks (transfer marks) on the adhesive film 10 when it is wound is more effectively suppressed.

[0030] The radius of curvature described above is preferably 30 mm or less. This makes handling the adhesive film 1 with dicing tape easier in the mounting process, which will be described in detail later.

[0031] The radius of curvature described above is the radius of curvature R at one half of the first outer film 41 and the second outer film 42 when their respective leading edges are divided into two halves by a virtual straight line extending in the width direction, as shown in the enlarged view on the right in Figure 2. Such a radius of curvature R can be measured using a general radius gauge.

[0032] In a semiconductor device manufacturing sheet 100, the distance between adjacent adhesive films 1 with dicing tape in the longitudinal direction (indicated as B in Figure 2) is preferably 15 mm or less. The above-mentioned distance B is preferably 12 mm or less, and more preferably 10 mm or less. With this configuration, the occurrence of winding marks (transfer marks) on the adhesive film 10 when it is wound is more effectively suppressed.

[0033] The longitudinal separation distance B described above is preferably 5 mm or more. This makes handling the adhesive film 1 with dicing tape easier in the mounting process, which will be described in detail later.

[0034] The longitudinal length of the semiconductor device manufacturing sheet 100 may be, for example, 35 m or more and 120 m or less. The width of the semiconductor device manufacturing sheet 100 may be, for example, 250 cm or more and 450 cm or less.

[0035] When semiconductor device manufacturing sheets are wound, the number of turns may be, for example, 100 to 400. In other words, in the winding state, 100 to 400 sheets of semiconductor device manufacturing sheets may be stacked in the thickness direction (the thickness direction in the radial direction outward from the winding axis).

[0036] When the semiconductor device manufacturing sheet 100 is viewed from one of the above-mentioned sides, the maximum diameter of the dicing tape 20 may be 250 cm or more and 390 cm or less. If the dicing tape 20 is, for example, a circular sheet, the above-mentioned maximum diameter refers to the diameter (or the major axis if it is elliptical), and if the dicing tape 20 is, for example, a rectangular sheet, the above-mentioned maximum diameter refers to the length of the diagonal. When the semiconductor device manufacturing sheet 100 is viewed from one of the above-mentioned sides, it is preferable that the outer edge of the dicing tape 20 and the inner edge of the outer film 4 are spaced at least 5 mm apart. When the semiconductor device manufacturing sheet 100 is viewed from one of the above-mentioned sides, the shortest length in the width direction between the outer edge of the semiconductor device manufacturing sheet 100 and the inner edge of the outer film 4 (the shortest length in the width direction of each end of the first outer film 41 and the second outer film 42) is preferably 4 mm or more and 12 mm or less.

[0037] <Removable Liner> The semiconductor device manufacturing sheet 100 of this embodiment includes a release liner 3 that covers one side of the adhesive film 10 (the side of the adhesive film 10 that does not overlap with the adhesive layer 22) before the adhesive film 1 with dicing tape is used. The release liner 3 is used to protect the adhesive film 10 and is peeled off immediately before the adhesive film 10 is attached to the adherend (e.g., a semiconductor wafer).

[0038] As the release liner 3, for example, a plastic film or paper that has been surface-treated with a release agent such as a silicone-based release agent, a long-chain alkyl-based release agent, a fluorine-based release agent, or molybdenum sulfide can be used. The release liner 3 can function as a support material for supporting multiple adhesive films 1 with dicing tape.

[0039] <Outer film> The outer film 4 can be made from a roll of dicing tape, as will be described later in the method for manufacturing sheets for semiconductor devices. Therefore, the first outer film 41 and the second outer film 42 of the outer film 4 may have the same material and thickness as the dicing tape 20 (see, for example, Figure 3). On the other hand, the outer film 4 may have a different material and thickness from the dicing tape 20. In order to more effectively suppress the occurrence of winding marks (transfer marks) on the adhesive film 10 during winding, it is preferable that the outer film 4 has the same thickness as the adhesive film 1 with dicing tape or the dicing tape 20.

[0040] <Adhesive film for adhesive film with dicing tape> The adhesive film 1 with dicing tape comprises, for example, a dicing tape 20 and an adhesive film 10 that overlaps the adhesive layer 22 (described later) of the dicing tape 20 and is adhered to an object such as a semiconductor wafer, as shown in Figure 3.

[0041] The adhesive film 10 can, for example, be a component of a dicing die bond film. In this case, the adhesive film 10 can function as a so-called die bond sheet.

[0042] The thickness of the adhesive film 10 is not particularly limited, but is, for example, 1 μm or more and 200 μm or less. Such a thickness may also be 3 μm or more and 150 μm or less, or 5 μm or more and 140 μm or less. If the adhesive film 10 is a laminate, the above thickness is the total thickness of the laminate.

[0043] The size of the adhesive film 10 is not particularly limited, but is large enough to adhere to, for example, an entire side of a plate-shaped adherend. The adhesive film 10 is large enough to adhere to, for example, an entire side of a disc-shaped semiconductor wafer with a diameter of 8 inches or 12 inches. If the adhesive film 10 is circular, its diameter is, for example, 200 cm or more and 350 cm or less.

[0044] The adhesive film 10 may have a single-layer structure. In this specification, a single layer means having only layers formed of the same composition. A configuration in which multiple layers formed of the same composition are laminated together is also considered a single layer. On the other hand, the adhesive film 10 may have a multilayer structure in which layers formed of two or more different compositions are laminated together.

[0045] The adhesive film 10 includes, for example, an organic component and an inorganic component. The organic component preferably includes at least one of a thermosetting resin and a thermoplastic resin. Thermosetting resins include, for example, epoxy resins or phenolic resins, which will be described in detail later. Thermoplastic resins include, for example, acrylic polymers in which at least (meth)acrylic acid ester monomers are polymerized.

[0046] The adhesive film 10 preferably has a glass transition temperature of 25°C or higher, more preferably 28°C or higher, and even more preferably 31°C or higher. A higher glass transition temperature can lead to better breakability of the adhesive film 10 in the expansion process described later. The glass transition temperature mentioned above may be 50°C or lower. A lower glass transition temperature allows the adhesive film 10 to adhere more firmly to the adherend (such as a semiconductor wafer). Furthermore, it is preferable that the adhesive film 10 has a relatively low glass transition temperature. A relatively low glass transition temperature makes it easier for the winding marks (transfer marks) to disappear even if they initially form on the adhesive film 10 when the semiconductor device manufacturing sheet is wound.

[0047] The above glass transition point is determined from the results of dynamic viscoelasticity measurements performed under the following measurement conditions. Measurement device: Dynamic viscoelasticity measuring device (For example, "RSAIII" manufactured by TA Instruments) Sample size: 10mm wide, 40mm long (using uncured adhesive film) Measurement thickness: 200 μm (multiple adhesive films are laminated as needed) Measurement temperature: -40°C to 280°C (heating rate 10°C / min) Measurement mode: Tensile mode Chuck spacing: 22.5mm Vibration frequency: 10Hz Dynamic distortion: 0.005% Calculate tanδ (loss modulus / storage modulus) for each temperature from the storage modulus and loss modulus. The temperature at the peak of tanδ in a graph with temperature on the x-axis and tanδ on the y-axis is defined as the glass transition temperature.

[0048] The above glass transition temperature can be increased, for example, by reducing the molecular weight of the polymer compound (such as the resin mentioned above) contained in the adhesive film 10. Furthermore, if the polymer compound contained in the adhesive film 10 is crosslinked, the above glass transition temperature can also be increased by increasing the degree of crosslinking of such polymer compound. On the other hand, the glass transition temperature can be lowered by increasing the molecular weight of the polymer compound (such as the resin mentioned above) contained in the adhesive film 10, or, if the polymer compound contained in the adhesive film 10 is crosslinked, by lowering the degree of crosslinking of such polymer compound.

[0049] The components that make up the adhesive film 10 will be described below.

[0050] (thermoplastic resin) The acrylic polymer that may be included in the thermoplastic resin may be a crosslinkable group-containing acrylic polymer that has crosslinkable groups in its molecule that undergo a crosslinking reaction by thermosetting treatment.

[0051] The above-mentioned acrylic polymer containing a crosslinkable group typically has the above-mentioned crosslinkable group in its side chain. The above-mentioned acrylic polymer containing a crosslinkable group may also have the above-mentioned crosslinkable group at the end of its side chain. The crosslinkable group in the molecule of the above-mentioned acrylic polymer containing a crosslinkable group is not particularly limited as long as it is a functional group that undergoes a crosslinking reaction by thermal curing treatment.

[0052] Examples of crosslinkable groups include hydroxyl groups and carboxyl groups. These crosslinkable groups can undergo crosslinking reactions with glycidyl groups or isocyanate groups. For example, the above-mentioned acrylic polymer containing crosslinkable groups, which has at least one of a hydroxyl group or a carboxyl group in its molecule, can undergo crosslinking reactions with compounds that have a glycidyl group or an isocyanate group in their molecule.

[0053] Examples of crosslinkable groups include glycidyl groups and isocyanate groups. These crosslinkable groups can undergo crosslinking reactions with hydroxyl groups and carboxyl groups. For example, the above-mentioned acrylic polymer containing a crosslinkable group having at least one of a glycidyl group or an isocyanate group in its molecule can undergo crosslinking reactions with a compound having at least one of a hydroxyl group or a carboxyl group in its molecule (for example, a phenol resin, which will be described in detail later).

[0054] In this embodiment, it is preferable that the crosslinkable group-containing acrylic polymer contained in the adhesive film 10 contains at least one of a hydroxyl group or a carboxyl group as a crosslinkable group. This allows the adhesive film 10 to adhere to the adherend more effectively.

[0055] The above-mentioned acrylic polymers containing crosslinkable groups can be synthesized, for example, by a general polymerization method using a radical polymerization initiator.

[0056] The above-mentioned crosslinkable group-containing acrylic polymer preferably contains alkyl (meth)acrylate monomer components in the largest mass proportion among the constituent units of the molecule. Examples of such alkyl (meth)acrylate monomers include C1-C18 alkyl (meth)acrylate monomers having 1 to 18 carbon atoms in the alkyl group (hydrocarbon group). The alkyl (meth)acrylate monomer may be, for example, a C1-C12 alkyl (meth)acrylate monomer having 1 to 12 carbon atoms in the alkyl group (hydrocarbon group), a C1-C8 alkyl (meth)acrylate monomer having 1 to 8 carbon atoms in the alkyl group (hydrocarbon group), or a C1-C6 alkyl (meth)acrylate monomer having 1 to 6 carbon atoms in the alkyl group (hydrocarbon group).

[0057] The constituent units are the structures derived from each monomer (e.g., 2-ethylhexyl acrylate, hydroxyethyl acrylate, etc.) after polymerization when a crosslinkable group-containing acrylic polymer is polymerized. The same applies hereafter. Furthermore, in this specification, the term "(meth)acrylate" refers to at least one of methacrylate (methacrylic acid ester) and acrylate (acrylic acid ester). The same applies to the term "(meth)acrylic." In addition, the term "alkyl" refers to the hydrocarbon portion esterified to (meth)acrylic acid.

[0058] Examples of alkyl (meth)acrylate monomers include saturated linear alkyl (meth)acrylate monomers and saturated branched alkyl (meth)acrylate monomers.

[0059] Examples of saturated linear alkyl (meth)acrylate monomers include methyl (meth)acrylate, ethyl (meth)acrylate, n-propyl (meth)acrylate, n-butyl (meth)acrylate, n-heptyl (meth)acrylate, n-octyl (meth)acrylate, n-nonyl (meth)acrylate, n-decyl (meth)acrylate, tridecyl (meth)acrylate, lauryl (meth)acrylate, myristyl (meth)acrylate, palmityl (meth)acrylate, and stearyl (meth)acrylate. Preferably, the number of carbon atoms in the linear alkyl group is between 2 and 8. Examples of saturated branched alkyl (meth)acrylate monomers include isoheptyl (meth)acrylate, isooctyl (meth)acrylate, isononyl (meth)acrylate, isodecyl (meth)acrylate, and 2-ethylhexyl (meth)acrylate. The alkyl group portion may have an iso structure, sec structure, neo structure, or tert structure.

[0060] The above-mentioned crosslinkable group-containing acrylic polymer contains structural units derived from crosslinkable group-containing monomers that can copolymerize with alkyl (meth)acrylate monomers. The above-mentioned crosslinkable group-containing acrylic polymer is preferably an acrylic polymer copolymerized of at least an alkyl (meth)acrylate monomer and a crosslinkable group-containing monomer. In other words, the above-mentioned crosslinkable group-containing acrylic polymer preferably has a structure in which the constituent units of the alkyl (meth)acrylate monomer and the constituent units of the crosslinkable group-containing monomer are linked in a random order.

[0061] Examples of the above-mentioned crosslinkable group-containing monomers include carboxyl group-containing (meth)acrylic monomers, acid anhydride (meth)acrylic monomers, hydroxyl group-containing (meth)acrylic monomers, glycidyl group-containing (epoxy group)-containing (meth)acrylic monomers, isocyanate group-containing (meth)acrylic monomers, sulfonic acid group-containing (meth)acrylic monomers, phosphate group-containing (meth)acrylic monomers, and monomers containing functional groups such as acrylamide. The above-mentioned crosslinkable group-containing monomers may also contain ether groups or ester groups in their molecules.

[0062] The above crosslinkable group-containing acrylic polymer is preferably, A crosslinkable group-containing monomer selected from the group consisting of carboxyl group-containing (meth)acrylic monomers, hydroxyl group-containing (meth)acrylic monomers, and glycidyl group-containing (meth)acrylic monomers, It is a copolymer of alkyl (meth)acrylate (especially alkyl (meth)acrylate with 10 or fewer carbon atoms in the alkyl portion).

[0063] Examples of carboxyl group-containing (meth)acrylic monomers include (meth)acrylic acid and mono(2-(meth)acryloyloxyethyl) succinate monomers. The carboxyl group may be located at the terminal end of the monomer structure or bonded to hydrocarbons other than the terminal end. Examples of hydroxyl group-containing (meth)acrylic monomers include hydroxyethyl (meth)acrylate monomer, hydroxypropyl (meth)acrylate monomer, and hydroxybutyl (meth)acrylate monomer. The hydroxyl group may be located at the terminal end of the monomer structure, or it may be bonded to hydrocarbons other than the terminal end. Examples of glycidyl group-containing (meth)acrylic monomers include glycidyl (meth)acrylate monomers and 4-hydroxybutyl (meth)acrylate glycidyl ether. The glycidyl group may be located at the terminal end of the monomer structure or bonded to hydrocarbons other than the terminal end.

[0064] The adhesive film 10 preferably contains a glycidyl group-containing acrylic polymer as the crosslinkable group-containing acrylic polymer. This has the advantage of making it easier to control the reactivity of the crosslinking reaction when the adhesive film 10 is cured.

[0065] The adhesive film 10 may also contain thermoplastic resins other than the crosslinkable group-containing acrylic polymer described above.

[0066] (thermosetting resin) Examples of thermosetting resins include epoxy resins, phenolic resins, amino resins, unsaturated polyester resins, polyurethane resins, silicone resins, and thermosetting polyimide resins. One or more of these thermosetting resins may be used.

[0067] Examples of the epoxy resins mentioned above include bisphenol A type, bisphenol F type, bisphenol S type, brominated bisphenol A type, hydrogenated bisphenol A type, bisphenol AF type, biphenyl type, naphthalene type, fluorene type, phenol novolac type, orthocresol novolac type, trishydroxyphenylmethane type, tetraphenyloleethane type, hydantoin type, trisglycidyl isocyanurate type, or glycidylamine type epoxy resins.

[0068] Phenolic resins can act as curing agents for epoxy resins. Examples of phenolic resins include novolac-type phenolic resins, resol-type phenolic resins, and polyoxystyrenes such as polyparaoxystyrene. Examples of novolac-type phenolic resins include phenol novolac resin, phenol aralkyl resin, cresol novolac resin, tert-butylphenol novolac resin, and nonylphenol novolac resin. The hydroxyl group equivalent [g / eq] of the phenol resin may be, for example, 90 to 220. The above-mentioned phenolic resin may be of one type or two or more types.

[0069] In this embodiment, the adhesive film 10 preferably contains the above-mentioned crosslinkable group-containing acrylic polymer and thermosetting resin that crosslink with each other. For example, the adhesive film 10 may contain a glycidyl group-containing acrylic polymer as a crosslinkable group-containing acrylic polymer, and a phenol resin as a thermosetting resin. This allows the glycidyl groups of the crosslinkable group-containing acrylic polymer and the hydroxyl groups of the phenol resin to undergo a crosslinking reaction, enabling the adhesive film 10 to be sufficiently cured.

[0070] The proportion of organic components in the adhesive film 10 is preferably 85% by mass or less, and more preferably 80% by mass or less. In other words, the adhesive film 10 preferably contains 85% by mass or less in total amount of organic components such as thermoplastic resin and thermosetting resin. This allows the adhesive film 10 to have better breakability in the expansion process described later. Furthermore, the proportion of organic components in the adhesive film 10 may be 40% by mass or more. Preferably, this proportion is 45% by mass or more.

[0071] In the adhesive film 10, the amount of the above-mentioned crosslinkable group-containing acrylic polymer in 100 parts by mass of the organic components (for example, the above-mentioned crosslinkable group-containing acrylic polymer, thermosetting resin, curing catalyst, silane coupling agent, dye, etc.) is preferably 30 parts by mass or more, and more preferably 50 parts by mass or more. The amount of the above-mentioned crosslinkable group-containing acrylic polymer in 100 parts by mass of the above-mentioned organic components is preferably 100 parts by mass or less. The adhesive film 10 preferably contains 10% by mass or more, and more preferably 20% by mass or more, of the above-mentioned crosslinkable group-containing acrylic polymer. The adhesive film 10 preferably contains 60% by mass or less, and more preferably 50% by mass or less, of the above-mentioned crosslinkable group-containing acrylic polymer. The above numerical range has the advantage of allowing for more reliable removal of voids in the sealing process described later.

[0072] In the adhesive film 10, the proportion of thermosetting resin in 100 parts by mass of organic components is preferably 80 parts by mass or less, and more preferably 10% by mass or more and 70% by mass or less.

[0073] The adhesive film 10 may or may not contain a filler. It is preferable that the adhesive film 10 contains a filler, as this improves its cleavability in the expansion process described later. By changing the amount of filler in the adhesive film 10, the elasticity and viscosity of the adhesive film 10 can be more easily adjusted. Furthermore, the physical properties of the adhesive film 10, such as electrical conductivity, thermal conductivity, and elastic modulus, can be adjusted.

[0074] Inorganic fillers are one type of inorganic component. Examples of inorganic fillers include aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, calcium silicate, magnesium silicate, calcium oxide, magnesium oxide, aluminum oxide, aluminum nitride, boron nitride, and silica such as crystalline silica and amorphous silica. The materials of inorganic fillers include elemental metals such as aluminum, gold, silver, copper, and nickel, as well as alloys. Fillers such as aluminum borate whiskers, amorphous carbon black, and graphite may also be used. Silica filler is preferred as the inorganic filler.

[0075] If the adhesive film 10 contains a filler, the filler content may be 50% by mass or less of the total mass of the adhesive film 10. Alternatively, the filler content may be, for example, 5% by mass or more. The amount of the filler may be 60 parts by mass or more and 120 parts by mass or less per 100 parts by mass of the organic component contained in the adhesive film 10.

[0076] The adhesive film 10 may contain additives as needed. Examples of additives include curing catalysts, crosslinking agents, silane coupling agents, flame retardants, dyes, etc. One or more of the above additives may be used.

[0077] The adhesive film 10 preferably contains the above-mentioned crosslinkable group-containing acrylic polymer, thermosetting resin, and filler, as it allows for easy adjustment of elasticity and viscosity.

[0078] Next, we will explain in detail the dicing tape 20 that constitutes the semiconductor device manufacturing sheet 100.

[0079] <Dicing tape for adhesive film with dicing tape> The dicing tape 20 is a sheet-like material having a larger surface area than the adhesive film 10. If the adhesive film 10 is in the shape of a circular sheet, the dicing tape 20 is usually also formed in the shape of a circular sheet. The dicing tape 20 is used, for example, when dicing a semiconductor wafer, as will be described in detail later. The dicing tape 20 is stretched over an annular frame having an inner diameter slightly larger than the disc-shaped silicon wafer to be diced, and then cut for use.

[0080] The dicing tape 20 described above comprises, for example, a base layer 21 and an adhesive layer 22 superimposed on the base layer 21, as shown in Figure 6. The adhesive layer 22 of the dicing tape 20 is, for example, a pressure-sensitive adhesive layer.

[0081] In the adhesive film 1 with dicing tape described above, the adhesive layer 22 is cured when exposed to active energy rays (e.g., ultraviolet light) during use. Specifically, an adhesive film 10 with a semiconductor wafer attached to one side and an adhesive layer 22 bonded to the other side of the adhesive film 10 are laminated together, and ultraviolet light or the like is irradiated onto at least the adhesive layer 22. For example, ultraviolet light or the like is irradiated from the side where the base layer 21 is located, and the ultraviolet light or the like passes through the base layer 21 and reaches the adhesive layer 22. The adhesive layer 22 is cured by the irradiation of ultraviolet light or the like. Since the adhesive layer 22 hardens after irradiation, its adhesive strength can be reduced, making it relatively easy to peel the adhesive film 10 (with the semiconductor chip attached) from the adhesive layer 22 after irradiation. The adhesive film 10 is attached to a substrate such as a circuit board or semiconductor chip in the manufacturing of semiconductor devices.

[0082] The dicing tape 20 described above preferably has a storage modulus of 10 MPa to 1000 MPa at 25°C. Such a storage modulus is preferably 30 MPa or more. Furthermore, such a storage modulus is preferably 500 MPa or less. Because the above storage modulus is within the above numerical range, when the adhesive film 10 is cut during the expansion process, the cutting stress can be more sufficiently transmitted from the dicing tape 20 to the adhesive film 10.

[0083] The storage modulus of the dicing tape 20 is the value of the storage modulus at 25°C, measured under the same measurement conditions as the dynamic viscoelasticity measurement used to determine the glass transition point described above.

[0084] The storage modulus of the dicing tape 20 can be increased, for example, by increasing the modulus of elasticity of the polymer constituting the dicing tape 20 (for example, by using a polyolefin with a higher modulus of elasticity as the polymer in the base layer), while the storage modulus can be decreased by decreasing the modulus of elasticity of the polymer constituting the dicing tape 20 (for example, by using a polyolefin with a lower modulus of elasticity as the polymer in the base layer).

[0085] Next, we will explain in detail the components that make up the dicing tape 20.

[0086] [The adhesive layer of dicing tape] The adhesive layer 22 includes, for example, an acrylic copolymer, an isocyanate compound, and a polymerization initiator. The adhesive layer 22 may have a thickness of 40 μm or less. Preferably, the thickness of the adhesive layer 22 is 20 μm or less, more preferably 10 μm or less, and even more preferably 5 μm or less. The adhesive layer 22 may have a thickness of 1 μm or more. The shape and size of the adhesive layer 22 may be the same as that of the base layer 21, except for the thickness.

[0087] Preferably, the adhesive layer 22 contains an acrylic copolymer having at least alkyl (meth)acrylate units and crosslinkable group-containing (meth)acrylate units as monomer units in its molecule. Note that "unit" refers to the structure derived from each monomer after polymerization of the monomers (e.g., 2-ethylhexyl acrylate, hydroxyethyl acrylate, etc.) during the polymerization of acrylic copolymers. The same applies hereafter.

[0088] The above-described acrylic copolymer contains at least alkyl (meth)acrylate units and crosslinkable group-containing (meth)acrylate units as monomer units in its molecule. Monomer units are the units that constitute the main chain of the acrylic copolymer. In other words, monomer units are derived from the monomers used to polymerize the acrylic copolymer. Each side chain in the above-described acrylic copolymer is contained within each monomer unit that constitutes the main chain.

[0089] The alkyl (meth)acrylate units described above originate from alkyl (meth)acrylate monomers. In other words, the alkyl (meth)acrylate unit is the molecular structure that remains after the polymerization reaction of alkyl (meth)acrylate monomers.

[0090] The alkyl portion (hydrocarbon) in the alkyl (meth)acrylate unit may be a saturated hydrocarbon or an unsaturated hydrocarbon. The alkyl portion (hydrocarbon) in the alkyl (meth)acrylate unit may be a linear hydrocarbon, a branched hydrocarbon, or may contain a cyclic structure. The number of carbon atoms in the alkyl portion (hydrocarbon) of the alkyl (meth)acrylate unit may be between 6 and 22.

[0091] The above acrylic copolymer more preferably contains saturated alkyl (meth)acrylate units as alkyl (meth)acrylate units, wherein the alkyl portion is a saturated hydrocarbon having 6 to 22 carbon atoms.

[0092] In the above-mentioned acrylic copolymer, it is preferable that the proportion (on a molar basis) of alkyl (meth)acrylate units with 6 or more carbon atoms in the alkyl portion is the highest among all monomer units in the molecule. For example, alkyl (meth)acrylate units with 6 or more carbon atoms (preferably 8 or more) in the alkyl portion may account for 50% to 90% on a molar basis among all monomer units.

[0093] The saturated alkyl (meth)acrylate unit of the alkyl portion preferably does not contain a benzene ring or any polar groups such as an ether linkage (-CH2-O-CH2-), an -OH group, or an -COOH group in the molecule. In saturated alkyl (meth)acrylate units with 6 or more carbon atoms in the alkyl portion, the alkyl portion may be a saturated linear hydrocarbon or a saturated branched hydrocarbon composed of 6 to 10 carbon atoms, without containing any atoms other than C and H.

[0094] The above-mentioned acrylic copolymer may contain one type of alkyl (meth)acrylate unit alone, or it may contain two or more types.

[0095] Crosslinkable group-containing (meth)acrylate units have either a hydroxyl group capable of forming urethane bonds through a urethane reaction, or a polymerizable group capable of polymerization through a radical reaction. More specifically, crosslinkable group-containing (meth)acrylate units have either an unreacted hydroxyl group or a radically polymerizable carbon-carbon double bond as a polymerizable group. In other words, some crosslinkable group-containing (meth)acrylate units have an unreacted hydroxyl group, while other parts (all others) do not have a hydroxyl group and have a radically polymerizable carbon-carbon double bond.

[0096] The above acrylic copolymer has hydroxyl group-containing (meth)acrylate units as crosslinkable group-containing (meth)acrylate units, in which a hydroxyl group is bonded to an alkyl portion having 4 or fewer carbon atoms. When the adhesive layer 22 contains an isocyanate compound, the isocyanate group of the isocyanate compound and the hydroxyl group of the hydroxyl group-containing (meth)acrylate unit can react readily. By having an acrylic copolymer containing hydroxyl group-containing (meth)acrylate units and an isocyanate compound coexist in the adhesive layer 22, the adhesive layer 22 can be moderately cured. As a result, the acrylic copolymer can gel sufficiently. Therefore, the adhesive layer 22 can exhibit adhesive properties while maintaining its shape.

[0097] The hydroxyl group-containing (meth)acrylate unit is preferably a hydroxyl group-containing C2-C4 alkyl (meth)acrylate unit in which an OH group is bonded to a hydrocarbon portion having 2 to 4 carbon atoms. The notation "C2-C4 alkyl" indicates the number of carbon atoms in the hydrocarbon portion ester-bonded to (meth)acrylic acid. In other words, a hydroxyl group-containing C2-C4 alkyl (meth)acrylic monomer refers to a monomer in which (meth)acrylic acid and an alcohol (usually a dihydric alcohol) having 2 to 4 carbon atoms are ester-bonded. The same applies hereafter in this specification. The C2-C4 alkyl hydrocarbon portion is usually a saturated hydrocarbon. For example, the C2-C4 alkyl hydrocarbon portion is a linear saturated hydrocarbon or a branched saturated hydrocarbon. It is preferable that the C2-C4 alkyl hydrocarbon portion does not contain polar groups such as oxygen (O) or nitrogen (N).

[0098] The above acrylic copolymer contains polymerizable (meth)acrylate units as crosslinkable group-containing (meth)acrylate units, which have radical polymerizable carbon-carbon double bonds (polymerizable unsaturated double bonds) in their side chains.

[0099] Specifically, the polymerizable (meth)acrylate unit has a molecular structure in which the isocyanate group of an isocyanate group-containing (meth)acrylic monomer is urethane-bonded to the hydroxyl group in the hydroxyl group-containing (meth)acrylate unit described above.

[0100] The above-mentioned acrylic copolymer contains radically polymerizable carbon-carbon double bonds of crosslinkable group-containing (meth)acrylate units, which allows the adhesive layer 22 to be cured by irradiation with active energy rays (such as ultraviolet light) before the pickup step, which will be described in detail later. For example, irradiation with active energy rays such as ultraviolet light generates radicals from the photopolymerization initiator, and the action of these radicals causes the acrylic copolymer to crosslink with each other. This reduces the adhesive strength of the adhesive layer 22 before irradiation to a lower level after irradiation. As a result, the adhesive film 10 can be easily peeled off from the adhesive layer 22. Ultraviolet light, radiation, and electron beams are used as the active energy rays.

[0101] Polymerizable (meth)acrylate units can be prepared by a urethane reaction following the polymerization reaction of an acrylic copolymer. For example, polymerizable (meth)acrylate units can be obtained by copolymerizing an alkyl (meth)acrylate monomer with a hydroxyl group-containing (meth)acrylic monomer, and then urethane reacting the hydroxyl groups in a portion of the hydroxyl group-containing (meth)acrylate units with the isocyanate groups of the isocyanate group-containing polymerizable monomer.

[0102] The above-mentioned isocyanate group-containing (meth)acrylic monomer preferably has one isocyanate group and one (meth)acryloyl group in its molecule. An example of such a monomer is 2-methacryloyloxyethyl isocyanate.

[0103] In this embodiment, the isocyanate compound that may further be contained in the adhesive layer 22 of the dicing tape 20 has multiple isocyanate groups in its molecule. Having multiple isocyanate groups in its molecule allows the crosslinking reaction between acrylic copolymers in the adhesive layer 22 to proceed. Specifically, the crosslinking reaction mediated by the isocyanate compound can be carried out by reacting one isocyanate group of the isocyanate compound with a hydroxyl group of an acrylic copolymer and the other isocyanate group with a hydroxyl group of another acrylic copolymer. Furthermore, the isocyanate compound may be a compound synthesized via a urethane reaction or the like.

[0104] Examples of isocyanate compounds include diisocyanates such as aliphatic diisocyanates, alicyclic diisocyanates, or aromatic aliphatic diisocyanates. Furthermore, examples of isocyanate compounds include polymerized polyisocyanates such as dimers and trimers of diisocyanates, and polymethylene polyphenylene polyisocyanates. In addition, examples of isocyanate compounds include polyisocyanates obtained by reacting an excess amount of the above-mentioned isocyanate compound with an active hydrogen-containing compound. Examples of active hydrogen-containing compounds include active hydrogen-containing low molecular weight compounds and active hydrogen-containing high molecular weight compounds. The above-mentioned isocyanate compounds are preferably those having three or more isocyanate groups in their molecule. The above isocyanate compounds can be used individually or in combination of two or more.

[0105] In this embodiment, the polymerization initiator contained in the adhesive layer 22 is a compound that can initiate a polymerization reaction in response to applied heat or light energy. By containing the polymerization initiator in the adhesive layer 22, when thermal or light energy is applied to the adhesive layer 22, a crosslinking reaction between the acrylic copolymers can be promoted. Specifically, the polymerization reaction between polymerizable groups is initiated between acrylic copolymers having polymerizable (meth)acrylate units containing radical polymerizable carbon-carbon double bonds, thereby curing the adhesive layer 22. This reduces the adhesive strength of the adhesive layer 22, allowing the adhesive film 10 to be easily peeled off from the cured adhesive layer 22 during the pick-up process. For example, photopolymerization initiators or thermal polymerization initiators can be used as polymerization initiators. Commonly available commercially produced products can be used as polymerization initiators.

[0106] The adhesive layer 22 may further contain other components in addition to those described above. Examples of other components include tackifiers, plasticizers, fillers, anti-aging agents, antioxidants, UV absorbers, light stabilizers, heat stabilizers, antistatic agents, surfactants, and light release agents. The types and amounts of other components may be appropriately selected depending on the purpose.

[0107] [Base layer of dicing tape] The base layer 21 may have a single-layer structure or a laminated structure (for example, a two-layer or three-layer structure). The base layer 21 may consist of two layers or three layers. In such a laminated base layer 21, each layer may be manufactured by co-extrusion molding and multiple layers may be integrated together.

[0108] The thickness (total thickness) of the substrate layer 21 may be, for example, 80 μm or more and 150 μm or less.

[0109] Each layer of the base material layer 21 is, for example, a metal foil, a rubber sheet, or a resin film. Each layer of the base material layer 21 may contain, for example, polyolefins such as low-density polyethylene (LDPE), high-density polyethylene (HDPE), polypropylene (PP), and ethylene-propylene copolymer; ionomer resins; ethylene-vinyl acetate copolymer resins; ethylene copolymers such as ethylene-(meth)acrylic acid ester (random, alternating) copolymers; polyesters such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), and polybutylene terephthalate (PBT); polyacrylates; polyvinyl chloride (PVC); polyurethane; polycarbonate; polyphenylene sulfide (PPS); polyamides such as aliphatic polyamides and fully aromatic polyamides (aramids); polyether ether ketone (PEEK); polyimide; polyetherimide; polyvinylidene chloride; ABS (acrylonitrile-butadiene-styrene copolymer); cellulose or cellulose derivatives; silicone-containing polymers; fluorine-containing polymers, etc.

[0110] The back side of the base material layer 21 (the side where the adhesive layer 22 does not overlap) may be treated with a release agent (release agent) such as a silicone resin or a fluororesin to provide release properties.

[0111] On the other hand, the surface of the substrate layer 21 in contact with the adhesive layer 22 may be subjected to a surface treatment to enhance adhesion with the adhesive layer 22. Examples of surface treatments include oxidation treatments by chemical or physical methods such as chromic acid treatment, ozone exposure, flame exposure, high-voltage electric shock exposure, and ionization radiation treatment. Furthermore, the substrate may be coated with a coating agent such as an anchor coating agent, primer, or adhesive.

[0112] Although the case in which the semiconductor device manufacturing sheet 100 comprises only one strip-shaped structural unit has been described in detail, the semiconductor device manufacturing sheet of this embodiment may comprise multiple strip-shaped structural units G, for example, as shown in Figure 7. In this example, in the semiconductor device manufacturing sheet 100, multiple strip-shaped structural units G are arranged so that their longitudinal directions are aligned and their widthwise edges abut each other, stacking on top of each other in the widthwise direction. Adjacent strip-shaped structural units G are integrated because they share a single release liner. A semiconductor device manufacturing sheet 100 having multiple strip-shaped structural units G can be cut so that two adjacent strip-shaped structural units G in the width direction are divided into two along a straight line extending in the longitudinal direction, and then cut further as needed to form a single strip-shaped structural unit G, after which it can be used as described above.

[0113] Next, a specific example of a method for manufacturing a semiconductor device sheet according to this embodiment will be described. The following describes a method for manufacturing a semiconductor device sheet 100 comprising only one strip-shaped structural unit.

[0114] <Method for manufacturing sheets for semiconductor devices> The manufacturing method for the semiconductor device manufacturing sheet 100 of this embodiment is, for example, A process of creating multiple adhesive films 10 on one surface of a long strip-shaped release liner 3, The process of making the raw material for dicing tape, A process of overlapping the release liner 3 and the dicing tape roll so as to sandwich multiple adhesive films 10, The process includes a step of removing a portion of the dicing tape raw material to form multiple dicing tapes 20 and an outer film. In the semiconductor device manufacturing sheet 100 produced by carrying out these processes, both the dicing tape 20 and the outer film 4 are made from the raw material of the dicing tape, so the dicing tape 20 and the outer film 4 have the same material and thickness as each other.

[0115] [Process for producing multiple adhesive films] The process of producing multiple adhesive films 10 is as follows: A resin composition preparation step for preparing a resin composition for forming an adhesive film 10, The process includes an adhesive film forming step of forming an adhesive film 10 from a resin composition.

[0116] In the resin composition preparation process, for example, the above-mentioned crosslinkable group-containing acrylic polymer, a phenolic resin, and a solvent are mixed to dissolve each resin in the solvent, thereby preparing the resin composition. The viscosity of the composition can be adjusted by changing the amount of solvent. Commercially available products can be used as these resins.

[0117] In the adhesive film formation process, for example, the resin composition prepared as described above is applied to one side of the release liner 3. Specifically, the resin composition is applied to one side of the release liner 3 at intervals. The application method is not particularly limited, and general application methods such as roll coating, screen coating, and gravure coating can be used. Next, if necessary, the applied composition is solidified by desolvation treatment, curing treatment, etc., to form the adhesive film 10.

[0118] <Process for producing dicing tape raw material> The process of producing the raw material for dicing tape is, for example, The synthesis process for synthesizing acrylic copolymers, A step to prepare an adhesive layer 22 by volatilizing the solvent from an adhesive composition containing the above-mentioned acrylic copolymer, an isocyanate compound, a polymerization initiator, a solvent, and other components added as appropriate depending on the purpose, A base layer manufacturing process for producing a long, strip-shaped base layer 21, The method includes a lamination step of creating an adhesive layer 22 on one side of a long, strip-shaped base material layer 21, thereby laminating the base material layer 21 and the adhesive layer 22.

[0119] In the synthesis process, for example, an acrylic copolymer intermediate is synthesized by radical polymerization of the alkyl (meth)acrylate monomer and the hydroxyl group-containing (meth)acrylic monomer mentioned above. Radical polymerization can be carried out by general methods. For example, an acrylic copolymer intermediate can be synthesized by dissolving each of the above monomers in a solvent, stirring while heating, and adding a polymerization initiator. Polymerization may be carried out in the presence of a chain transfer agent to adjust the molecular weight of the acrylic copolymer. Next, some of the hydroxyl groups in the hydroxyl group-containing (meth)acrylate units contained in the acrylic copolymer intermediate are bonded to the isocyanate groups of the isocyanate group-containing polymerizable monomer through a urethane reaction. As a result, some of the hydroxyl group-containing (meth)acrylate units become polymerizable (meth)acrylate units containing radical polymerizable carbon-carbon double bonds. The urethane reaction can be carried out by a general method. For example, an acrylic copolymer intermediate and an isocyanate-containing polymerizable monomer are stirred while heating in the presence of a solvent and a urethane catalyst. This allows for the urethane bonding of some of the hydroxyl groups of the acrylic copolymer intermediate to the isocyanate groups of the isocyanate-containing polymerizable monomer.

[0120] In the adhesive layer preparation process, for example, an acrylic copolymer, an isocyanate compound, and a polymerization initiator are dissolved in a solvent to prepare an adhesive composition. The viscosity of the composition can be adjusted by changing the amount of solvent. Next, the adhesive composition is applied to the entire surface of one side of a long strip of release sheet. Common application methods such as roll coating, screen coating, and gravure coating are used. The applied adhesive composition is solidified by desolvation treatment and solidification treatment, etc., to produce an adhesive layer 22.

[0121] In the substrate layer fabrication process, the substrate layer can be fabricated by general methods. Examples of film fabrication methods include calendering, casting in organic solvents, inflation extrusion in a closed system, T-die extrusion, and dry lamination. Co-extrusion molding may also be used. Commercially available films may be used as the substrate layer 21, or as each layer constituting the substrate layer 21.

[0122] In the lamination process, the adhesive layer 22 and the long strip-shaped base material layer 21 are stacked on top of each other and laminated together. Furthermore, in order to promote the reaction between the crosslinking agent and the acrylic copolymer, and to promote the reaction between the crosslinking agent and the surface portion of the substrate layer 21, an aging process may be carried out after the lamination process at a temperature of 50°C for 48 hours.

[0123] These processes enable the production of raw material for dicing tape.

[0124] [The process of overlapping the release liner and the dicing tape roll] In the process of overlapping multiple adhesive films 10 and a roll of dicing tape, the roll of dicing tape on a long strip-shaped release sheet manufactured as described above is overlapped with the multiple adhesive films 10 on a long strip-shaped release liner 3. Specifically, the adhesive layer of the roll of dicing tape is bonded to the multiple adhesive films 10 on the release liner 3.

[0125] Such bonding can be achieved, for example, by a crimping process. The temperature of the crimping process is not particularly limited, but is, for example, 30°C to 50°C, preferably 35°C to 45°C. The linear pressure of the crimping process is not particularly limited, but is preferably 0.1 kgf / cm to 20 kgf / cm, more preferably 1 kgf / cm to 10 kgf / cm.

[0126] [Process for forming multiple dicing tapes and outer films] In this process, a portion of the dicing tape raw material is peeled off from the release liner 3 to form multiple dicing tapes 20 and an outer film 4. Specifically, a portion of the dicing tape raw material is peeled off and removed from a laminated sheet consisting of a long strip-shaped release liner 3, a long strip-shaped dicing tape raw material, and multiple adhesive films placed between them. More specifically, the peripheral portions of the resulting multiple adhesive films 1 with dicing tapes are removed. The removed portions take on a shape resembling multiple rings connected in a row. As a result, a semiconductor device manufacturing sheet 100, such as the one shown in Figure 1, can be manufactured.

[0127] The semiconductor device manufacturing sheet 100, manufactured as described above through the process described above, can be used, for example, as an auxiliary tool for manufacturing semiconductor devices (semiconductor integrated circuits). Specifically, the adhesive film with dicing tape of the semiconductor device manufacturing sheet 100 can be used as a dicing die bond film.

[0128] A method for manufacturing a semiconductor device using the above semiconductor device manufacturing sheet is, for example, A method for manufacturing a semiconductor device, comprising using a dicing tape-attached adhesive film 1, which comprises the dicing tape 20 described above and the adhesive film 10 superimposed on the dicing tape 20, as a dicing die bond film to manufacture a semiconductor device having a semiconductor chip, The process involves placing the adhesive film 10 between the adhesive layer 22 of the dicing tape 20 and the semiconductor wafer, thereby fixing the semiconductor wafer to the dicing tape 20 via the adhesive film 10. The process includes the step of breaking the semiconductor wafer into smaller pieces together with the adhesive film 10 to obtain a plurality of semiconductor chips to which the pieces of the adhesive film 10 are attached.

[0129] The following provides a more detailed explanation of the manufacturing method for semiconductor devices (how to use sheets for semiconductor device manufacturing).

[0130] <Method of manufacturing semiconductor devices (Method of using adhesive film with dicing tape when manufacturing semiconductor devices)> In semiconductor device manufacturing methods, semiconductor chips are generally cut from a semiconductor wafer on which a circuit surface has been formed and then assembled. In this process, the adhesive film with dicing tape of this embodiment is used as a manufacturing aid.

[0131] An example of a method for manufacturing the semiconductor device of this embodiment is: This is a method for manufacturing a semiconductor device, which involves using a dicing tape-attached adhesive film 1 comprising a dicing tape 20 having a base layer 21 and an adhesive layer 22 superimposed on the base layer 21, and an adhesive film 10 superimposed on the dicing tape 20, to manufacture a semiconductor device having a semiconductor chip. In the semiconductor device manufacturing method described above, for example, a mounting step is performed in which one side of a semiconductor wafer is attached to the adhesive film 10 of the dicing tape adhesive film 1 described above, and the semiconductor wafer is fixed to the dicing tape 20 via the adhesive film 10. An expansion process is performed in which the semiconductor wafer is cleaved together with the adhesive film 10 at a pre-formed weak point of the semiconductor wafer by stretching the dicing tape 20.

[0132] Adhesive films with dicing tape used in dicing die bond films are preferably used in SDBG (Stealth Dicing Before Grinding) processes or DBG (Dicing Before Grinding) processes for manufacturing semiconductor chips by dicing semiconductor wafers.

[0133] In the semiconductor device manufacturing method described above (method of using a sheet for semiconductor device manufacturing), for example, a pickup step is performed after the expansion step described above. In the pickup step, the small pieces of adhesive film 10 attached to the adhesive layer 22 of the dicing tape 20 are peeled off from the adhesive layer 22 together with the semiconductor chip. The semiconductor device manufacturing method described above may further involve, for example, a die bonding process. In the die bonding process, multiple semiconductor chips with small pieces 10' of adhesive film attached may be stacked.

[0134] Subsequently, a curing process is performed to harden the multiple small pieces 10' of adhesive film stacked on top of the semiconductor chip. Then, a wire bonding process is performed to electrically connect the electrodes of the electronic circuit on the semiconductor chip to the adherend with wires. Furthermore, a sealing process may be performed to seal the semiconductor chip and wires on the adherend with a thermosetting resin (such as epoxy resin).

[0135] In the curing process, for example, a heat treatment is performed at a temperature of 100°C to 180°C to increase the reaction activity of the crosslinking groups (e.g., glycidyl groups) in the aforementioned crosslinking group-containing acrylic polymer contained in the adhesive film pieces 10', thereby promoting the curing of the adhesive film pieces 10'.

[0136] In the wire bonding process, for example, a semiconductor chip X (die) and a substrate Z are heated while being connected with a wire L.

[0137] In the sealing process, the semiconductor chip X and the small piece 10' of the adhesive film are sealed with a thermosetting resin M, such as epoxy resin. In the sealing process, a heat treatment is performed at a temperature of, for example, 100°C to 180°C to allow the curing reaction of the thermosetting resin M to proceed.

[0138] In recent years, with the further advancement of integration technology in the semiconductor industry, there has been a demand for thinner semiconductor chips (for example, thicknesses of 20 μm to 50 μm) and thinner adhesive films (for example, thicknesses of 1 μm to 40 μm, preferably 7 μm or less, and more preferably 5 μm or less).

[0139] The semiconductor device manufactured as described above includes an adhesive film 10 (a small piece 10' of the adhesive film) placed between the substrate Z and the semiconductor chip X. The substrate Z is, for example, a substrate or a semiconductor chip X.

[0140] The semiconductor device manufacturing sheet of this embodiment is as illustrated above, but the present invention is not limited to the semiconductor device manufacturing sheet illustrated above. In other words, various forms used in general semiconductor device manufacturing sheets can be adopted, to the extent that they do not impair the effects of the present invention.

[0141] The matters disclosed herein include the following: (1) A sheet for manufacturing semiconductor devices, comprising at least one strip-shaped structural unit, Each of the aforementioned strip-shaped structural units is: A strip-shaped release liner, Multiple adhesive films with dicing tape are arranged in a row, overlapping one side of the release liner and spaced apart in the longitudinal direction of the release liner, The release liner has an outer film that directly overlaps one of its surfaces and is spaced apart from each of the outer edges of the plurality of adhesive films with dicing tape, Each of the dicing tape-attached adhesive films comprises a dicing tape having a laminated structure of a base material layer and an adhesive layer, and an adhesive film disposed between the dicing tape and the release liner and in peelable contact with the adhesive layer. Each of the dicing tapes is positioned to extend beyond the outer edge of the adhesive film and cover the adhesive film. For each of the aforementioned strip-shaped structural units, the outer film comprises a first outer film and a second outer film, respectively, arranged on one side and the other side in the width direction of the release liner and spaced apart from each other in the width direction. Each of the strip-shaped structural units has a plurality of protrusions that project inward in the width direction and are arranged in the longitudinal direction between the adhesive films with dicing tape that are adjacent to each other in the longitudinal direction. The first outer film and the second outer film are arranged such that the tip portions of the protrusions face each other in the width direction, and the distance between the facing tip portions is 145 mm or less. Sheets for manufacturing semiconductor devices. (2) The sheet for manufacturing a semiconductor device as described in (1) above, wherein the leading edges of the first outer film and the second outer film are both rounded. (3) The semiconductor device manufacturing sheet according to (1) or (2) above, wherein the distance between the closest parts of the adhesive films with dicing tapes adjacent to each other in the longitudinal direction is 15 mm or less. (4) The adhesive film is a sheet for manufacturing semiconductor devices according to any one of (1) to (3) above, having a glass transition temperature of 25°C or higher. (5) The sheet for manufacturing a semiconductor device according to any one of (1) to (4) above, wherein the adhesive film with dicing tape is used as a dicing die bond sheet when manufacturing a semiconductor device. [Examples]

[0142] The present invention will be further explained with experimental examples, but the present invention is not limited to these.

[0143] The semiconductor device manufacturing sheets for the examples and comparative examples were manufactured as follows. The outline of the manufacturing method is as follows. First, multiple adhesive films were prepared on one side of a long strip of release liner. Separately, a roll of dicing tape with almost the same shape as the release liner was prepared. The adhesive layer of the long strip of dicing tape was placed on the aforementioned side of the release liner so as to cover all of the multiple adhesive films. At this point, the multiple adhesive films are arranged in a line with gaps in the longitudinal direction between the overlapping long strips of release liner and dicing tape. Furthermore, a portion of the dicing tape was peeled off from one side of the peeling liner to achieve the state shown in Figure 1. This resulted in the production of a sheet for semiconductor device manufacturing. Therefore, the first outer film and the second outer film have the same material and thickness as the dicing tape.

[0144] [Long strip-shaped peel-off liner] Polyethylene terephthalate (PET) film with one side treated with silicone release agent. Commercially available products (hereinafter also simply referred to as PET release liners)

[0145] [Fabrication of adhesive film] The composition of the components contained in each adhesive film is shown below. Each of the raw materials shown below was added to a predetermined amount of methyl ethyl ketone and mixed to prepare an adhesive film composition (liquid) with a total solids content of 20% by mass. Next, the adhesive film composition was applied to the silicone release surface of the PET release liner using an applicator in a circular shape (33 cm in diameter) to form a coating. Numerous such coatings were formed at intervals along the longitudinal direction. These coatings were then subjected to a heat drying treatment at 130°C for 2 minutes to create multiple adhesive films with a thickness of 20 μm on the PET release liner. (Acrylic resin) • Product name: "Teisan Resin SG-P3" Manufactured by Nagase ChemteX Corporation. Glass transition temperature 12°C, contains glycidyl groups. Epoxy value: 0.21 [eq / kg]) Mass-average molecular weight: 850,000 (Filler) • Silica filler (product name "SO-E2", manufactured by Admatex Co., Ltd.) Average primary particle diameter 500nm (Phenolic resin) • Biphenyldimethylene type phenolic resin (Product name "MEH-7851SS", manufactured by UBE) Hydroxyl group equivalent: 198[g / eq], Softening temperature: 66℃) Adhesive film D: 25 parts by mass of acrylic resin / 50 parts by mass of filler / 25 parts by mass of phenolic resin Adhesive film E: 15 parts by mass of acrylic resin / 50 parts by mass of filler / 35 parts by mass of phenolic resin (Crosslinking agent) Imidazole-based epoxy resin curing agent: 0.5 parts by mass for any adhesive film. (Manufactured by Shikoku Chemicals Co., Ltd., product name: "Curesol 2PHZ")

[0146] [Preparation of the adhesive layer for dicing tape] (Synthesis of acrylic polymers) (Meth)acrylic monomer was placed in a reaction vessel equipped with a condenser, a nitrogen inlet, a thermometer, and a stirring device in the following proportions. 2-Ethylhexyl acrylate (2EHA): 83.3 mol% Hydroxyethyl acrylate (HEA): 16.7 mol% Furthermore, 0.2 parts by mass of azobisisobutyronitrile (AIBN) was added as a thermal polymerization initiator to 100 parts by mass of the (meth)acrylic monomer. Then, butyl acetate was added as a reaction solvent so that the concentration of the (meth)acrylic monomer was 38%. After that, polymerization was carried out under a nitrogen atmosphere at 62°C for 4 hours and at 75°C for 2 hours to obtain an acrylic polymer intermediate. To a solution containing this acrylic polymer intermediate, 0.06 parts by mass of dibutyltin dilaurate was added per 100 parts by mass of the acrylic polymer intermediate. Furthermore, 80 moles of 2-isocyanite ethyl methacrylate (MOI) were added per 100 moles of the hydroxyethyl acrylate (HEA). An addition reaction was carried out at 50°C for 12 hours under an air stream to synthesize the acrylic polymer. Note that the MOI undergoes addition polymerization with HEA. The mol% of MOI is not included in the mol% of the (meth)acrylate monomer mentioned above. As the MOI, we used the product name "Kalenz MOI (registered trademark)" manufactured by Showa Denko Corporation. MOI is a polymerizable group-containing (meth)acrylate, and in addition to having a vinyl group as a polymerizable group in its molecule, it further has isocyanate groups that can be bonded to -OH groups and other urethane groups.

[0147] (Preparation of composition for adhesive layer) To the solution containing the acrylic polymer obtained as described above, a polyisocyanate compound (product name "Coronate L", manufactured by Nippon Polyurethane Co., Ltd.) as a crosslinking agent and a photopolymerization initiator (product name "Omnirad127", manufactured by IGM Resins) were added in the following proportions to prepare a composition for an adhesive layer. Acrylic polymer: 100 parts by mass Crosslinking agent: 1.5 parts by mass Photopolymerization initiator: 3.0 parts by mass

[0148] [Making dicing tape] A PET separator with almost the same shape as the PET release liner described above was prepared. The above adhesive layer composition was applied to the entire surface of the silicone release treatment surface of this PET separator using an applicator, and dried at 120°C for 2 minutes to form an adhesive layer with a thickness of 10 μm. Subsequently, the adhesive layer and the base material layer (details described below) were bonded together and stored at 50°C for 24 hours to produce each dicing tape. Dicing tape A raw material: Long strip-shaped base material layer (PP + EVA) Melting point 92°C, Tensile modulus (90°C) 1.92 [MPa] Main component: Polypropylene resin Other components: Ethylene-vinyl acetate copolymer (EVA) Dicing tape B raw material: Long strip-shaped base material layer (PP + LDPE) Melting point 124°C, Tensile modulus (90°C) 24.7 [MPa] Main component: Polypropylene resin Other ingredients: Polymer-type antistatic agent Dicing tape C raw material: Long strip-shaped base material layer (EVA) Melting point 94°C, Tensile modulus (90°C) 1.31 [MPa] Main component: Ethylene-vinyl acetate copolymer (EVA) Other ingredients: Polymer-type antistatic agent

[0149] <Examples 1-8, Comparative Examples 1-4> [Manufacturing of sheets (dicing die bond films) for semiconductor equipment manufacturing] The configurations of each semiconductor device manufacturing sheet are shown in Tables 1 and 2, respectively. The PET separator was peeled off the adhesive layer of the dicing tape, and at room temperature, the adhesive layer of the dicing tape and the PET release liner were bonded together using a laminator so that multiple circular adhesive films were sandwiched between the dicing tape and the PET release liner. Furthermore, by peeling off a portion of the dicing tape, a sheet for manufacturing a conductor device was produced in the state shown in Figure 1. Note that when peeling, a portion of the dicing tape was peeled off so that each of the following set values ​​reached the desired values.

[0150] [Table 1]

[0151] [Table 2]

[0152] <Measurement of various separation distances, etc., in sheets used for semiconductor device manufacturing> The separation distances A and B shown in Figure 2 were measured using a long steel ruler. The radius of curvature R shown in Figure 2 was measured using a commercially available radius gauge.

[0153] <Glass transition temperature of adhesive films> The glass transition temperature of the adhesive films of each example and comparative example was measured by the dynamic viscoelasticity measurement described above.

[0154] <Storage modulus of dicing tape at 25°C> For each example and comparative example of dicing tape, the storage modulus at 25°C was measured using the dynamic viscoelasticity measurement described above.

[0155] Furthermore, the performance of the semiconductor device manufacturing sheets produced as described above was evaluated as follows.

[0156] <Performance evaluation (winding marks (transfer marks) that may occur in the adhesive film during winding)> The evaluation was performed on semiconductor manufacturing sheets that were positioned as the third and fourth sheets from the innermost to the outermost in the winding configuration. Specifically, a portion of the inner third semiconductor manufacturing sheet that overlapped with a specific area of ​​the outer fourth semiconductor manufacturing sheet was marked. The specific areas mentioned above are the tips of the opposing protrusions on the outer film of the outer fourth semiconductor manufacturing sheet, and both ends of the portion where adjacent dicing tapes are close together in the longitudinal direction. A portion of the inner third semiconductor manufacturing sheet that overlapped with these specific areas was marked (marked portion). The marking was performed on a portion of the release liner of the inner third semiconductor manufacturing sheet. Using a wafer mounting device (product name "Wafer Mounter MA 3000III", manufactured by Nitto Seiki Co., Ltd.), adhesive films with dicing tape corresponding to the marking areas were mounted onto bare wafers. The mounting speed was set to 10 mm / second, the mounting temperature to 65°C, and the mounting pressure to 0.3 MPa. Using a device with FIB processing capabilities in a cooled state (product name "Helios G4 UX", manufactured by Thermo Fisher Scientific), a cross-section was prepared by cutting the adhesive film corresponding to the marked area in the thickness direction while cooled, and the change in thickness at the winding mark portion of the adhesive film corresponding to the marked area was confirmed. The thickness change of the winding marks was checked at two locations, and the thickness change of the winding marks (winding mark depth) was judged according to the following criteria. [Evaluation Criteria] ○: The change in thickness of the rolled area (decrease in thickness) is less than 0.8 mm. △: Change in thickness of the rolled area (decrease in thickness) is 0.8 mm or more and less than 1.2 mm. ×: Change in thickness of the rolled-up area (decrease in thickness) is 1.2 mm or more.

[0157] As can be seen from the evaluation results above, the adhesive film of the example can be said to suppress the occurrence of winding marks (transfer marks) on the adhesive film when it is wound, compared to the adhesive film of the comparative example. [Industrial applicability]

[0158] The semiconductor device manufacturing sheet of the present invention is suitably used, for example, as an auxiliary tool when manufacturing semiconductor devices (semiconductor integrated circuits). For example, the adhesive film with dicing tape of the semiconductor device manufacturing sheet of the present invention can be used in the application of a dicing die bond film. [Explanation of symbols]

[0159] 100: Sheets for semiconductor device manufacturing, 1: Dicing tape adhesive film (dicing die bond film), 10: Adhesive film, 20: Dicing tape, 21: Base layer, 22: Adhesive layer, 3: Peel-off liner, 4: Outer film, 41: First outer film, 42: Second outer film, T: Convex portion, G: A strip-shaped structural unit.

Claims

1. A sheet for manufacturing semiconductor equipment, comprising at least one strip-shaped structural unit, Each of the aforementioned strip-shaped structural units is: A strip-shaped release liner, Multiple adhesive films with dicing tape are arranged in a row, overlapping one side of the release liner and spaced apart in the longitudinal direction of the release liner, The release liner has an outer film that directly overlaps one of its surfaces and is spaced apart from each of the outer edges of the plurality of adhesive films with dicing tape, Each of the dicing tape-attached adhesive films comprises a dicing tape having a laminated structure of a base material layer and an adhesive layer, and an adhesive film disposed between the dicing tape and the release liner and in peelable contact with the adhesive layer. Each of the dicing tapes is positioned to extend beyond the outer edge of the adhesive film and cover the adhesive film. For each of the aforementioned strip-shaped structural units, the outer film comprises a first outer film and a second outer film, respectively, which are arranged on one side and the other side in the width direction of the release liner and are spaced apart from each other in the width direction. Each of the strip-shaped structural units has a plurality of protrusions that project inward in the width direction and are arranged in the longitudinal direction between the adhesive films with dicing tape that are adjacent to each other in the longitudinal direction. The first outer film and the second outer film are arranged such that the tip portions of the protrusions face each other in the width direction, and the distance between the facing tip portions is 145 mm or less. Sheets for manufacturing semiconductor devices.

2. The tip portions of the first outer film and the second outer film are both rounded. Sheet for manufacturing a semiconductor device according to claim 1.

3. The semiconductor device manufacturing sheet according to claim 1 or 2, wherein the distance between the closest parts of the adhesive films with dicing tapes adjacent to each other in the longitudinal direction is 15 mm or less.

4. The adhesive film has a glass transition temperature of 25°C or higher, and is a sheet for manufacturing a semiconductor device according to claim 1 or 2.

5. The semiconductor device manufacturing sheet according to claim 1 or 2, wherein the adhesive film with dicing tape is used as a dicing die bond sheet when manufacturing a semiconductor device.

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