Grinding apparatus and workpiece processing method
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- DISCO CORP
- Filing Date
- 2024-12-11
- Publication Date
- 2026-06-23
AI Technical Summary
【0013】 本願発明は、保持テーブルで保持された被加工物を研削ホイールの研削砥石で加工する際、厚さ測定ユニット(厚さ測定ステップ)で測定した被加工物の厚さが所定の仕上げ厚さに到達した場合においても、検知ユニット(検知ステップ)で検知する値が所定の負荷電流値または荷重値を超えていない場合は加工を継続する制御を行う。このため、本願発明は、所定の仕上げ厚さに至っていると判定される場合においても、好適に研削加工を継続できる。
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Figure 2026101808000001_ABST
Abstract
Claims
1. A grinding device that processes a workpiece using a grinding wheel on which grinding wheels are arranged, A holding table for holding the workpiece, A grinding unit comprising a grinding wheel for processing the workpiece held in the holding table, which can be mounted on the tip of a spindle, A moving unit that moves the holding table and the grinding unit relative to each other, A thickness measuring unit for measuring the thickness of the workpiece held on the holding table, A detection unit that detects the load current value of the motor of the spindle that rotates the grinding wheel, or the load value that the grinding wheel applies to the workpiece held on the holding table, A controller that controls each component, Equipped with, The controller is, A grinding apparatus characterized in that, when processing a workpiece held on the holding table with the grinding wheel of the grinding wheel, even when the thickness of the workpiece measured by the thickness measuring unit reaches a predetermined finish thickness, the apparatus continues processing if the value detected by the detection unit does not exceed a predetermined load current value or load value.
2. The grinding apparatus according to claim 1, characterized in that, when the thickness of the workpiece measured by the thickness measuring unit reaches a predetermined finish thickness and the value detected by the detection unit exceeds the predetermined load current value or load value, the controller controls the stopping of the movement of the moving unit while the spindle of the grinding unit is rotating to perform spark-out processing.
3. The grinding apparatus according to claim 1, characterized in that when the thickness of the workpiece measured by the thickness measuring unit reaches a predetermined limit thickness set to be thinner than the predetermined finish thickness, the controller controls the movement of the moving unit to stop the movement of the spindle of the grinding unit while it is rotating and perform spark-out processing.
4. A method for machining a workpiece, wherein the workpiece is machined using a grinding wheel on which grinding wheels are arranged, A holding step of holding the workpiece on a holding table, A machining step in which the grinding wheel is rotated while the grinding wheel is brought into contact with the workpiece held on the holding table to perform machining, During the processing step, a thickness measuring step is performed to measure the thickness of the workpiece held on the holding table, During the machining step, a detection step is performed to detect the load current value of the motor of the spindle that rotates the grinding wheel, or to detect the load value that the grinding wheel applies to the workpiece held on the holding table. Equipped with, A method for processing a workpiece, characterized in that even when the thickness of the workpiece measured in the thickness measurement step reaches a predetermined finish thickness, the processing is continued if the value detected in the detection step does not exceed a predetermined load current value or load value.