Inductance element and method for manufacturing the same

Abstract

The present invention provides an inductance element and a method for manufacturing the same. [Solution] An inductance element comprising a magnetic package structure including a surface and two grooves provided on the surface, a coil body embedded in the magnetic package structure, a bent portion connected sequentially from the coil body, a pin portion, and a fixing portion, two extending line segments connected to both ends of the coil body, and two sealing materials provided inside the grooves and covering the fixing portion, wherein the bent portion extends from the coil body toward the surface of the magnetic package structure and penetrates the surface to be exposed to the outside of the magnetic package structure, the pin portion is provided on the surface of the magnetic package structure and extends from the bent portion toward the grooves, and the fixing portion extends from the pin portion toward the inside of the grooves and along the side walls of the grooves to the bottom surface of the grooves.

Description

Technical Field

[0001] The present disclosure relates to an inductance element, and particularly to an inductance element including a magnetic material and a method for manufacturing the same.

Background Art

[0002] An inductor is a passive element widely applied in circuit design and has different structural designs according to different application needs. In a conventional inductance structure, a T-core and a coil wound around the core are used to coat the core and the coil in a package structure. Electrodes of such an inductor are formed by plating in the package structure and connected to the coil embedded in the package structure. However, since the continuity of the plating layer during plating is difficult to control, the internal stress between the plating layers is too large, and thus the electrode plating layer is likely to peel off. Therefore, it is difficult to improve the manufacturing yield of this type of inductor, which is disadvantageous for mass production and market competition of enterprises.

Summary of the Invention

Problems to be Solved by the Invention

[0003] Therefore, the present disclosure provides an inductance element useful for improving the electrode stability of the inductance element.

Means for Solving the Problems

[0004] The present disclosure further provides a method for manufacturing the above inductance element.

[0005] At least one embodiment of the present disclosure provides an inductance element comprising: a magnetic package structure including a surface and two grooves provided on the surface; a coil body embedded in the magnetic package structure; a bent portion, each connected to the coil body and extending from the coil body toward the surface of the magnetic package structure, penetrating the surface and exposed to the outside of the magnetic package structure; a pin portion, connected to the bent portion and provided on the surface of the magnetic package structure, extending from the bent portion toward one of the grooves, and connected to the coil body via the bent portion; a fixing portion, connected to the pin portion and extending from the pin portion toward the interior of the groove, extending along the side wall of the groove adjacent to the surface to the bottom surface of the groove recessed in the surface; two extending line segments, each connected to both ends of the coil body; and two sealing materials, each provided inside the groove and covering the fixing portion.

[0006] In at least one embodiment of the present disclosure, the coil body is a flat wire coil.

[0007] In at least one embodiment of the present disclosure, the end face of the sealing material is flush with the surface of the magnetic package structure.

[0008] In at least one embodiment of the present disclosure, the magnetic package structure further comprises two support portions provided on the surface of the magnetic package structure, each having a plane that protrudes from the surface of the magnetic package structure, and the pin portion of the extending line segment covers the plane of the support portion.

[0009] In at least one embodiment of the present disclosure, the pin portion includes a first region connected to a support portion of the magnetic package structure, and two second regions connected to a bend portion and a fixation portion, respectively, and floating in mid-air above the surface of the magnetic package structure.

[0010] In at least one embodiment of the present disclosure, the inductance element further comprises two adhesives, each provided on the plane of the support portion and located between the support portion of the magnetic package structure and the pin portion of the extension line segment.

[0011] In at least one embodiment of the present disclosure, the inductance element further comprises a protective layer that covers the outer surface of the magnetic package structure and exposes a portion of the magnetic package structure and a portion of the extending line segment.

[0012] In at least one embodiment of the present disclosure, the magnetic package structure includes a magnetic material selected from iron, iron-nickel alloys, iron-cobalt alloys, iron-silicon alloys, iron-vanadium alloys, iron-silicon-chromium alloys, iron-silicon-aluminum alloys, iron-silicon-aluminum alloys, iron-cobalt-vanadium alloys, iron-based amorphous alloys, iron-based nanocrystalline alloys, nickel-zinc ferrites, nickel-copper-zinc ferrites, manganese-zinc ferrites, or combinations of the above materials.

[0013] In at least one embodiment of the present disclosure, the sealing material comprises an epoxy resin.

[0014] This disclosure provides a coil structure comprising a coil body and two extending wire segments, each connected to both ends of the coil body; a magnetic package structure covering the coil body, comprising a surface and two grooves provided on the surface, provided on the coil structure, wherein the extending wire segments extend from the coil body toward the surface and penetrate the surface to be exposed to the outside of the magnetic package structure; after providing the magnetic package structure, the extending wire segments are bent toward the surface and into the grooves to form a bent portion, a pin portion and a fixed portion in each of the extending wire segments, the bent portion is connected to the coil body and the pin portion, the pin portion is connected to the bent portion and the fixed portion, and the pin portion is provided on the surface; and after forming the bent portion, the pin portion and the fixed portion, a sealing material is provided inside the grooves so as to cover the fixed portion.

[0015] In at least one embodiment of the present disclosure, bending an extending line segment toward a surface and into a groove includes bending a portion of the extending line segment toward the side wall of a groove adjacent to the surface to form a pin portion, and bending a portion of the extending line segment away from the bottom surface of a groove recessed in the surface to form a fixed portion.

[0016] In at least one embodiment of the present disclosure, the method for manufacturing an inductance element further includes providing an adhesive to the extending line segment before bending the extending line segment toward the surface and the interior of the groove, and positioning the adhesive between the surface of the magnetic package structure and the pin portion after bending the extending line segment toward the surface and the interior of the groove.

[0017] In at least one embodiment of the present disclosure, the form of providing the magnetic package structure includes die-cast integral molding. [Effects of the Invention]

[0018] From the above, in at least one embodiment of the present disclosure, the inductance element is provided on the surface of the magnetic package structure by bending an extended line segment to serve as the electrode of the inductance element. Therefore, there is no need to form the electrodes of the inductance element on the surface of the magnetic package structure by plating, thereby reducing manufacturing costs. In addition, the present disclosure increases the bonding strength between the extended line segment and the magnetic package structure by performing a second bend on some of the extended line segments to form pin portions and fixed portions, and by sealing the fixed portions in grooves of the magnetic package structure with a sealing material, thereby preventing the extended line segments from being affected and detaching from the surface of the magnetic package structure even in environments with high vibration intensity (i.e., reducing the possibility of electrode detachment). In this way, the electrode stability of the inductance element can be improved.

[0019] The embodiments of this disclosure can be understood from the following detailed description and reference to the drawings. Note that various features are not depicted in proportion to industrial practice standards. In practice, the sizes of various features can be arbitrarily increased or decreased to clarify the discussion. [Brief explanation of the drawing]

[0020] [Figure 1] This is a perspective view of an inductance element according to one embodiment of the present disclosure. [Figure 2]It is a cross-sectional view along the cross-section C of the inductor element of the embodiment of FIG. 1. [Figure 3A] It is a perspective view of a method for manufacturing an inductor element according to an embodiment of the present disclosure. [Figure 3B] It is a perspective view of a method for manufacturing an inductor element according to an embodiment of the present disclosure. [Figure 4] It is a flowchart of a method for manufacturing an inductor element according to an embodiment of the present disclosure.

Mode for Carrying Out the Invention

[0021] The present disclosure will be described in detail with reference to the following embodiments. Note that the description of the embodiments of the present disclosure below is used only for illustration here, and is not intended to comprehensively disclose all embodiments or limit the specific embodiments of the present disclosure. For example, "the first feature is formed in the second feature" in the description includes that the first feature and the second feature are in direct contact, and also includes a plurality of embodiments in which additional features are formed between the first feature and the second feature so that the two are not in direct contact. Also, the same element signs adopted in the drawings and the specification represent the same or similar elements as much as possible.

[0022] In the following content, in order to clearly show the technical features of the present disclosure, the sizes (for example, length, width, thickness, and depth) of elements (for example, layers, films, substrates, and regions, etc.) in the drawings are enlarged in different proportions. Therefore, the description and interpretation of the following embodiments should not be limited to the sizes and shapes of the elements shown in the drawings, but should include the sizes, shapes, and deviations between the two due to actual processes and / or tolerances. For example, the flat surfaces shown in the drawings may have roughness and / or non-linear features, and the acute angles shown in the drawings may be rounded. Therefore, the elements shown in the drawings of the present disclosure are mainly schematic, and are not intended to accurately depict the actual shapes of the elements, nor are they for limiting the scope of the claims of the present disclosure.

[0023] Please refer to FIGS. 1 and 2. FIG. 1 shows an inductance element 100 of at least one embodiment of the present disclosure, and FIG. 2 is a cross-sectional view along a cross-section CS of the inductance element 100. The inductance element 100 includes a magnetic package structure 120, a coil body 140, two extending line segments 160, a sealing material 180a, and a sealing material 180b. The magnetic package structure 120 includes a surface 120s and two concave grooves 122 provided on the surface 120s. In various embodiments of the present disclosure, the magnetic package structure 120 may be composed of a magnetic material and an adhesive material, and the magnetic material may include at least one of a crystalline magnetic metal powder and an amorphous magnetic metal powder.

[0024] Specifically, the magnetic material may be selected from iron, iron-nickel-based alloys, iron-cobalt-based alloys, iron-silicon-based alloys, iron-vanadium-based alloys, iron-silicon-chromium alloys, iron-silicon-aluminum alloys, iron-silicon-aluminum-based alloys, iron-cobalt-vanadium-based alloys, iron-based amorphous alloys, iron-based nanocrystalline alloys, nickel-zinc-based ferrites, nickel-copper-zinc-based ferrites, manganese-zinc-based ferrites, or combinations of the above materials. The adhesive material may be selected from epoxy resins, silicone resins, acrylic resins, phenolic resins, polyvinyl alcohols, or combinations of the above materials. In particular, by mixing magnetic material powders with different particle sizes, the effect of adjusting the relative permeability and saturation magnetic field strength of the magnetic package structure 120 can be obtained.

[0025] The coil body 140 is embedded in the magnetic package structure 120, and two extending wire segments 160 are connected to each end of the coil body 140. More specifically, the coil body 140 is formed by winding a conductor (not shown) along an axis A1, and may be formed using a flatwise winding method or an alpha winding method. The conductor may include an internal conductive wire body and an insulating coating layer provided on the outside of the internal conductive wire body, but the conductor structure of this disclosure is not limited thereto. In this embodiment, the coil body 140 is a flat conductor coil (i.e., the conductor wound to form the coil body 140 is a flat conductor), but in other embodiments, it may be a circular conductor coil.

[0026] As shown in Figure 2, each extending line segment 160 includes a bent portion 162, a pin portion 164, and a fixing portion 166. The bent portion 162 is connected to the coil body 140. The bent portion 162 extends from the coil body 140 toward the surface 120s of the magnetic package structure 120 and penetrates the surface 120s to be exposed to the outside of the magnetic package structure 120. The pin portion 164 is connected to the bent portion 162 and is provided on the surface 120s of the magnetic package structure 120. The pin portion 164 extends from the bent portion 162 toward one of the grooves 122 and is connected to the coil body 140 via the bent portion 162.

[0027] In another configuration, the fixing portion 166 is connected to the pin portion 164 and extends from the pin portion 164 into the groove 122. More specifically, the fixing portion 166 extends along the side wall 122w of the groove 122 to the bottom surface 122b of the groove 122, the side wall 122w of the groove 122 is adjacent to the surface 120s, and the bottom surface 122b of the groove 122 is recessed into the surface 120s. Incidentally, the pin portion 164 is not directly connected to the coil body 140, and the fixing portion 166 is not directly connected to the bent portion 162 and the pin portion 164. In other words, starting from the intersection P1 between the coil body 140 and the extending line segment 160, we have the bent portion 162, the pin portion 164 and the fixing portion 166 in that order.

[0028] The sealing materials 180a and 180b are provided inside the groove 122 and cover the fixing portion 166. Please refer to Figures 1 and 2 together. The sealing materials 180a and 180b completely fill the inside of the groove 122 and cover the side walls 122w and bottom surface 122b of the groove 122. Therefore, the fixing portion 166 may be fixed inside the groove 122 by the sealing materials 180a and 180b in order to improve the bonding strength between the extending line segment 160 and the magnetic package structure 120. In this embodiment, the end face ED of the sealing material 180a (or sealing material 180b) is flush with the surface 120s of the magnetic package structure 120, but this disclosure is not limited thereto, and the end face ED may protrude from or be recessed into the surface 120s of the magnetic package structure 120. The sealing materials 180a and 180b may contain epoxy resin, but are not limited thereto.

[0029] Incidentally, in this embodiment, the bending point P2 included in the bent portion 162 of the extending line segment 160 is not a right angle but an arc. In order to make the pin portion 164 of the extending line segment 160 adhere flat to the magnetic package structure 120, the magnetic package structure 120 further includes two support portions 124 provided on the surface 120s of the magnetic package structure 120. The plane 124p of each support portion 124 protrudes from the surface 120s of the magnetic package structure 120, and the pin portion 164 of the extending line segment 160 covers the plane 124p of the support portion 124. In this way, even if the bending point P2 included in the bent portion 162 does not exhibit a right angle, the pin portion 164 can adhere flat to the magnetic package structure 120.

[0030] However, due to the support portion 124, a portion of the pin portion 164 is suspended above the surface 120s of the magnetic package structure 120. More specifically, the pin portion 164 includes one first region 164a and two second regions 164b, the first region 164a being connected to the support portion 124 of the magnetic package structure 120. On the other hand, the two second regions 164b are connected to the bending portion 162 and the fixing portion 166, respectively, and are suspended above the surface 120s of the magnetic package structure 120. Incidentally, in this embodiment, a portion of the pin portion 164 is suspended above the surface 120s of the magnetic package structure 120, but the present invention is not limited thereto. In other embodiments, both ends of the support portion 124 (i.e., the left and right ends of the support portion 124 in Figure 2) may extend until they are aligned with both ends of the pin portion 164 (i.e., the left and right ends of the pin portion 164 in Figure 2), so that the pin portion 164 is not suspended in mid-air above the surface 120s of the magnetic package structure 120.

[0031] As shown in Figure 2, the inductance element 100 further includes two adhesives 150, each provided on the plane 124p of the support portion 124. The adhesives 150 are located between the support portion 124 of the magnetic package structure 120 and the pin portion 164 of the extending line segment 160, thereby joining the support portion 124 of the magnetic package structure 120 and the pin portion 164 of the extending line segment 160. The adhesives 150 may include nickel, tin, similar weld metals, or other non-metallic materials, such as epoxy resin, polyimide, or similar bonding materials. However, in various embodiments, the inductance element 100 is not limited to including the adhesives 150. In other words, in some embodiments, the inductance element 100 may not have adhesives 150. Therefore, the plane 124p of the support portion 124 may be in direct contact with the pin portion 164 (not shown) of the extending line segment 160.

[0032] Figures 3A to 3B illustrate a series of steps illustrating a method for manufacturing an inductance element 100 according to at least one embodiment of the present disclosure, and Figure 4 is a flowchart of the method for manufacturing an inductance element 100 according to at least one embodiment of the present disclosure. Please refer to Figure 4. First, in step S1, a coil structure including a coil body and two extending wire segments is provided. Next, in step S2, a magnetic package structure including a surface and two grooves provided on the surface is provided on the coil structure. Next, in step S3, the extending wire segments are bent toward the surface and the inside of the grooves to form a bent portion, a pin portion and a fixed portion on each of the extending wire segments. Then, in step S4, a sealing material is provided in the grooves. The following description will explain each of the above steps in detail.

[0033] Please refer to Figure 3A. First, a coil structure (not shown) is provided, which includes a coil body 140 and two extending wire segments 160. Each of the extending wire segments 160 is connected to both ends of the coil body 140. Next, a magnetic package structure 120 may be provided on the coil structure by die casting.

[0034] The die-casting step includes: placing the coil structure into the mold cavity of a mold and filling the cavity with powder to form a magnetic package structure 120, which includes a magnetic material and an adhesive material; then pressing the powder filled in the cavity with a press so that the powder covers a part of the coil structure (including the coil body 140 and a part of the extending line segment 160) and forms an initial package (not shown); applying pressure to the powder with a press so that the powder fills the gap between the mold cavity and the coil structure; and after forming the initial package, for example by cold pressing or hot pressing at different temperatures, removing it from the mold.

[0035] Furthermore, in the die-casting step of this embodiment, after removing the initial package, the initial package may be subjected to heat treatment, such as a hardening and firing treatment, in order to further harden the initial package and form the magnetic package structure 120. The magnetic package structure 120 covers the coil body 140 and includes a surface 120s and two grooves 122 provided on the surface 120s, and the extending line segment 160 extends from the coil body 140 toward the surface 120s and penetrates the surface 120s to be exposed to the outside of the magnetic package structure 120.

[0036] Next, in some embodiments, a protective layer may be formed on the outer surface (including the surface 120s) of the magnetic package structure 120, for example by spray coating. This protective layer may include, for example, an epoxy resin or a similar insulating material. In addition, in some embodiments, the protective layer may be formed on the extended line segment 160 that is exposed to the outside of the magnetic package structure 120. After forming the protective layer, a portion of the protective layer may be removed, for example by laser cutting or laser ablation, to expose a portion of the magnetic package structure 120 (i.e., the groove 122 of the magnetic package structure 120) and a portion of the extended line segment 160. Incidentally, some embodiments of this disclosure may further include, but are not limited to, a step of performing, for example, terminal cutting on the extended line segment 160 in order to adjust the length of the extended line segment 160 that is exposed to the outside of the magnetic package structure 120.

[0037] After providing the magnetic package structure 120, please refer to Figure 3B. The extending line segments 160 may be bent by machining toward the surface 120s and the interior of the groove 122 to form bent portions 162, pin portions 164 and fixing portions 166 on each extending line segment 160. The bent portions 162 are connected to the coil body 140 and the pin portions 164, the pin portions 164 are connected to the bent portions 162 and the fixing portions 166, and the pin portions 164 are provided on the surface 120s.

[0038] Before bending the extending line segment 160 toward the surface 120s and groove 122, an adhesive 150 (shown in Figure 2) can be applied to the extending line segment 160 by, for example, tin immersion or coating, so that after bending the extending line segment 160 toward the surface 120s and groove 122, the adhesive 150 can be positioned between the surface 120s of the magnetic package structure 120 and the pin portion 164. In other words, by applying the adhesive 150 to the extending line segment 160, the extending line segment 160 exposed to the outside of the magnetic package structure 120 can be joined to the magnetic package structure 120. However, this disclosure is not limited to applying the adhesive 150 to the extending line segment 160, and in some embodiments, the adhesive 150 may be applied to the surface 120s of the magnetic package structure 120 or to the support portion 124 (shown in Figure 2) in order to join the extending line segment 160 to the magnetic package structure 120.

[0039] More specifically, the step of bending the extending line segment 160 toward the surface 120s and the interior of the groove 122 may include bending a portion of the extending line segment 160 toward the side wall 122w of the groove 122 (shown in Figure 2) to form a pin portion 164. This step may further include bending the bottom surface 122b of the groove 122 (shown in Figure 2) away from a portion of the extending line segment 160 to form a fixing portion 166. The side wall 122w is adjacent to the surface 120s, and the bottom surface 122b is recessed into the surface 120s.

[0040] After forming the bent portion 162, the pin portion 164, and the fixing portion 166, sealing materials 180a and 180b (shown in Figure 1) are provided inside the groove 122 by dispensing, and the sealing materials 180a and 180b are covered with the fixing portion 166 by, for example, baking. At this point, the inductance element 100 according to at least one embodiment of the present disclosure is almost complete.

[0041] Based on the above, the coil structure of the inductance element of this disclosure employs a flat wire coil, and the extended wire segment is bent to serve as the electrode of this inductance element and provided on the surface of the magnetic package structure. Therefore, there is no need to form the electrodes of the inductance element on the surface of the magnetic package structure by plating, thereby reducing manufacturing costs. In addition, this disclosure increases the bonding strength between the extended wire segment and the magnetic package structure by performing a second bend on a portion of the extended wire segment of the inductance element electrode to form a pin portion and a fixed portion, and by sealing the fixed portion in a groove of the magnetic package structure with a sealing material, thereby preventing the extended wire segment from being affected and detaching from the surface of the magnetic package structure even in environments with high vibration intensity (i.e., reducing the possibility of electrode peeling), and further improving the electrode stability and process yield of the inductance element.

[0042] Although the present application has been disclosed as described above by the examples, the above-described examples are not intended to limit the present disclosure, and a person skilled in the art can make several changes and modifications without departing from the spirit and scope of the present disclosure. Therefore, the scope of protection of the present disclosure should be based on the claims that are later appended. [Explanation of Symbols]

[0043] 100: Inductance element 120: Magnetic package structure 120s: surface 122: Groove 122w: side wall 122b: Bottom 124: Support part 124p: Plane 140: Coil body 150:Adhesive 160: Extended line segment 162: Folding part 164: Pin part 164a:First area 164b:Second area 166: Fixed part 180a, 180b: Sealing material 190: Protective layer A1: Axial center CS: Cross section ED: End face P1: Intersection P2: Folding point S1~S4: Step

Claims

1. A magnetic package structure including a surface and two grooves provided on the surface, The coil body embedded in the aforementioned magnetic package structure, Each includes a bent portion connected to the coil body, extending from the coil body toward the surface of the magnetic package structure, and penetrating the surface to be exposed to the outside of the magnetic package structure; a pin portion connected to the bent portion and provided on the surface of the magnetic package structure, extending from the bent portion toward one of the grooves, and connected to the coil body via the bent portion; and a fixing portion connected to the pin portion and extending from the pin portion toward the interior of the groove, extending along the side wall of the groove adjacent to the surface to the bottom surface of the groove recessed in the surface, and each includes two extending line segments connected to both ends of the coil body, Two sealing materials are provided inside the grooves and cover the fixing portion, An inductance element equipped with the following features.

2. The inductance element according to claim 1, wherein the coil body is a flat wire coil.

3. The inductance element according to claim 1, wherein the end face of the sealing material is flush with the surface of the magnetic package structure.

4. The aforementioned magnetic package structure is The magnetic package structure further comprises two support portions provided on the surface thereof, each of which has a plane protruding from the surface thereof. Furthermore, the pin portion of the extending line segment covers the plane of the support portion, as described in claim 1.

5. The aforementioned pin portion is A first region connected to the support portion of the magnetic package structure, Two second regions are connected to the bending portion and the fixing portion, respectively, and are suspended in mid-air above the surface of the magnetic package structure, An inductance element according to claim 4, including the above.

6. The inductance element according to claim 4, further comprising two adhesives provided on the plane of the support portion and located between the support portion of the magnetic package structure and the pin portion of the extension line segment.

7. The inductance element according to claim 1, further comprising a protective layer that covers the outer surface of the magnetic package structure and exposes a part of the magnetic package structure and a part of the extending line segment.

8. The inductance element according to claim 1, wherein the magnetic package structure includes a magnetic material selected from iron, iron-nickel alloy, iron-cobalt alloy, iron-silicon alloy, iron-vanadium alloy, iron-silicon-chromium alloy, iron-silicon-aluminum alloy, iron-silicon-aluminum alloy, iron-cobalt-vanadium alloy, iron-based amorphous alloy, iron-based nanocrystalline alloy, nickel-zinc ferrite, nickel-copper-zinc ferrite, manganese-zinc ferrite, or a combination of the above materials.

9. The inductance element according to claim 1, wherein the sealing material comprises an epoxy resin.

10. To provide a coil structure including a coil body and two extending wire segments connected to both ends of the coil body, A magnetic package structure is provided on the coil structure, which includes a surface and two grooves provided on the surface, and covers the coil body, and the extending line segment extends from the coil body toward the surface and penetrates the surface to be exposed to the outside of the magnetic package structure, After providing the magnetic package structure, the extending line segments are bent toward the surface and the interior of the grooves to form a bent portion, a pin portion, and a fixing portion in each of the extending line segments, the bent portion being connected to the coil body and the pin portion, the pin portion being connected to the bent portion and the fixing portion, and the pin portion being provided on the surface. After forming the bent portion, the pin portion, and the fixing portion, a sealing material is provided inside the groove so as to cover the fixing portion. A method for manufacturing an inductance element that includes [the specified element].

11. Bending the extending line segment toward the surface and the interior of the groove is, The pin portion is formed by bending a portion of the extending line segment toward the side wall of the groove adjacent to the surface, The fixing portion is formed by bending a portion of the extending line segment so as to be away from the bottom surface of the recessed groove on the surface, The method according to claim 10, including the method described in claim 10.

12. The method according to claim 10, further comprising: providing an adhesive to the extending line segment before bending the extending line segment toward the surface and the interior of the groove; and positioning the adhesive between the surface and the pin portion of the magnetic package structure after bending the extending line segment toward the surface and the interior of the groove.

13. The method according to claim 10, which includes die-cast integral molding as an embodiment of the magnetic package structure.

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