Addition-curing thermally conductive silicone composition and its cured product

Abstract

The objective is to provide an addition-curing type thermally conductive silicone composition that exhibits stable curability even after long-term storage. [Solution] Components (A) to (E) below, (A) Organopolysiloxanes having alkenyl groups bonded to at least two silicon atoms in one molecule, (B) Organohydrogenpolysiloxanes having two or more hydrogen atoms (SiH groups) bonded to silicon atoms in one molecule, (C) At least one thermally conductive filler selected from the group consisting of metals, metal oxides, metal hydroxides, metal nitrides, metal carbides, and allotropes of carbon. (D) A platinum catalyst composition for hydrosilylation reactions obtained by mixing a platinum group metal complex (Da) having a vinyl group-containing organosiloxane represented by a specific formula as a ligand and a vinyl group-containing organopolysilyloxane (Db) represented by a specific formula, and heat-treating the mixture, and (E) Addition reaction regulator An addition-curing thermally conductive silicone composition characterized by containing [a certain substance].

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