Temporary fixing film, temporary fixing laminate, and method for manufacturing a semiconductor device

Abstract

The present invention provides a temporary fixing film that can reduce the peel strength required when removing the temporary fixing layer remaining on a semiconductor component by peeling. [Solution] A temporary fixing film 1 used to temporarily fix a semiconductor member and a support member, comprising a resin composition layer 6 containing a thermoplastic resin and a thermosetting resin, wherein the film contains (A) a hydrocarbon resin having monomer units derived from styrene and (B) an epoxy resin, and the content of component (A) is 65 parts by mass or less with respect to 100 parts by mass of the total of components (A) and (B).

Claims

1. A temporary fixing film used to temporarily fix a semiconductor component and a support component, (A) A hydrocarbon resin having monomer units derived from styrene, and (B) an epoxy resin, A temporary fixing film in which the content of component (A) is 65 parts by mass or less per 100 parts by mass of the total of component (A) and component (B).

2. The temporary fixing film according to claim 1, wherein the component (B) comprises (B1) an epoxy resin having an alicyclic structure and (B2) an epoxy resin having an aromatic ring.

3. A temporary fixing laminate comprising, in this order, a support member, a light-absorbing layer, and a temporary fixing material layer consisting of the temporary fixing film or cured product thereof described in claim 1.

4. A step of preparing the temporary fixing laminate according to claim 3, A step of temporarily fixing the semiconductor member to the support member via the temporary fixing material layer, A step of processing the semiconductor member that has been temporarily fixed to the support member, A step of irradiating the light-absorbing layer of the temporary fixing laminate with light from the support member side to separate the semiconductor member from the support member, A method for manufacturing a semiconductor device, comprising:

5. The temporary fixing material layer in the temporary fixing laminate consists of the temporary fixing film. The method for manufacturing a semiconductor device according to claim 4, wherein the semiconductor member is placed on or pressed onto the temporary fixing material layer, and then the temporary fixing material layer is heat-cured.

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