Heating device and camera module

Abstract

This invention relates to a heating device. [Solution] This embodiment relates to a heating device comprising a substrate, a connecting terminal electrically connected to the substrate, and a heating member electrically connected to the connecting terminal, wherein the connecting terminal comprises a first region including an inner portion and an outer portion, a third region electrically connected to the substrate, and a second region disposed between the first region and the third region, and the heating member is disposed between the inner portion and the outer portion of the connecting terminal.

Description

Technical Field

[0001] The present invention relates to a heating device and a camera module.

Background Art

[0002] In recent years, ultra-small camera modules have been developed and are widely used in small electronic products such as smartphones, notebooks, and game machines.

[0003] As automobiles become more popular, ultra-small cameras are not only used in small electronic products but also in vehicles. For example, a black box camera for vehicle protection or objective materials for traffic accidents, a rear monitoring camera that allows a driver to monitor a blind spot at the rear of the vehicle through a screen to ensure safety when reversing, a peripheral sensing camera that can monitor the periphery of the vehicle, etc. are provided.

[0004] A camera includes a lens, a lens barrel that houses the lens, an image sensor that converts an image of a subject collected by the lens into an electrical signal, and a printed circuit board on which the image sensor is mounted. The housing that forms the outer shape of the camera has a structure in which the entire area is sealed to prevent internal components from being contaminated by moisture-containing foreign substances.

[0005] Due to the characteristics of automobiles placed outdoors, the indoor and outdoor temperatures of automobiles form various distributions depending on the season. For example, in summer, the indoor temperature is higher than the outdoor temperature, and in winter, it may drop to a temperature below zero. Therefore, a dew condensation phenomenon including frost may occur in a configuration including the lens and glass of the camera due to a rapid temperature change. This may result in an unsatisfactory photographed image or cause a product failure.

Summary of the Invention

Problems to be Solved by the Invention

[0006] The problem that this invention aims to solve is to provide a heating device and a camera module that can prevent condensation, including frost, from occurring on the lens.

[0007] The problem that this invention aims to solve is to provide a humidity controller for a camera device and a camera device that can prevent condensation, including the formation of frost, from occurring on the lens. [Means for solving the problem]

[0008] A heating device according to one aspect of the present invention for achieving the above objectives includes a substrate, a connecting terminal electrically connected to the substrate, and a heating member electrically connected to the connecting terminal, wherein the connecting terminal includes a first region including an inner portion and an outer portion, a third region electrically connected to the substrate, and a second region disposed between the first region and the third region, and the heating member is disposed between the inner portion and the outer portion of the connecting terminal.

[0009] Furthermore, the inner portion can be bent and extended in the intermediate region of one end of the second region, and the outer portion can be bent and extended in the outer region of one end of the second region.

[0010] Furthermore, the inner portion and the outer portion can be separated from each other.

[0011] Furthermore, the inner portion and the outer portion may include curved surface areas.

[0012] Furthermore, the heating member can be formed in a ring shape.

[0013] Furthermore, the heating member may include a main body and a heat-generating substance placed on the main body.

[0014] Furthermore, the heat-generating material may include a first heat-generating material disposed on the upper surface of the main body of the heating member and a second heat-generating material disposed on the lower surface of the main body of the heating member.

[0015] Furthermore, the inner portion may be positioned on the upper surface of the heating member, and the outer portion may be positioned on the lower surface of the heating member.

[0016] Furthermore, the height at which the inner portion is located and the height at which the outer portion is located in the optical axis direction may be different from each other.

[0017] A camera module according to one aspect of the present invention for achieving the above objectives includes a substrate; a lens barrel disposed on the substrate; a first lens disposed on the lens barrel; a heating member disposed between the first lens and the lens barrel; and a connecting terminal electrically connected to the heating member, wherein the heating member includes a body and a heat-generating substance disposed on the body; and the connecting terminal includes a first region connected to the heat-generating substance of the heating member, a third region electrically connected to the substrate, and a second region disposed between the first region and the third region.

[0018] Furthermore, the heat-generating material includes a first heat-generating material disposed on the upper surface of the main body of the heating member and a second heat-generating material disposed on the lower surface of the main body of the heating member, and the first region of the connecting terminal may include a first connecting portion connected to the first heat-generating material and a second connecting portion connected to the second heat-generating material.

[0019] Furthermore, the first lens is positioned at the outermost angle, and the first region of the connecting terminal and the heat-generating material can be connected to the lower surface of the first lens.

[0020] Furthermore, the lens barrel may include a retainer that is positioned on the lens barrel to secure the first lens.

[0021] Furthermore, the substrate may include a control unit and a resistor positioned between the connecting terminal and the control unit.

[0022] Furthermore, the resistor includes a first resistor and a second resistor, the first resistor can be electrically connected to the first connecting portion of the connecting terminal, and the second resistor can be electrically connected to the second connecting portion of the connecting terminal.

[0023] Furthermore, the first connecting portion includes a first electrode portion having a first voltage and a second electrode portion having a second voltage which is lower than the first voltage, and the second connecting portion includes a third electrode portion having a third voltage and a fourth electrode portion having a fourth voltage which is lower than the third voltage, and the first resistor can be electrically connected to the second electrode portion of the first connecting portion, and the second resistor can be electrically connected to the fourth electrode portion of the second connecting portion.

[0024] A humidity controller for a camera device according to one aspect of the present invention for achieving the above objectives includes a connecting terminal connected to a power supply, a heater connected to the connecting terminal, and a desiccant placed on the heater, wherein the desiccant and the heater have a closed-loop configuration.

[0025] Furthermore, the connecting terminal is a flexible substrate, the heater is electrically connected to the flexible substrate and includes a heating element having a closed-loop shape, and the desiccant includes silica gel and can be adhered to one surface of the heater.

[0026] Furthermore, the heater may include an insulating material that is bonded to the other side.

[0027] A camera device according to one aspect of the present invention for achieving the above objectives includes a housing, a lens module disposed in the housing, a substrate disposed in the housing, a connecting terminal connected to the substrate, a heater connected to the connecting terminal, and a desiccant disposed on the heater, wherein the heater and the desiccant are disposed within the housing.

[0028] Furthermore, the heater and the desiccant can be arranged on the inner surface of the substrate or the housing.

[0029] The system also includes a connector that penetrates the housing and connects to the substrate, and an image sensor disposed on the substrate, wherein the desiccant can be arranged around at least one of the image sensor, the connector, and the lens module.

[0030] Furthermore, the desiccant and the heater include an opening, and a portion of the image sensor or the connector can be placed within the opening.

[0031] Furthermore, the desiccant and the heater can have a closed-loop configuration.

[0032] Furthermore, the substrate includes a first substrate and a second substrate disposed below the first substrate, the heater is disposed on the first substrate, and the connecting terminal can be connected to the second substrate.

[0033] Furthermore, the substrate may include sensors that measure temperature and humidity.

[0034] A camera device according to one aspect of the present invention for achieving the above objectives includes a housing, an image sensor disposed in the housing, a connector disposed in the housing, a desiccant disposed adjacent to the image sensor or the connector, a heater coupled to the desiccant, a substrate electrically connected to the heater, and a control unit for controlling the heater, wherein the desiccant absorbs moisture when the internal temperature of the housing is below a first reference value, and the control unit operates the heater when the internal temperature of the housing is above a second reference value.

[0035] The housing also includes a sensor for measuring the temperature inside the housing, and the control unit can control the heater to turn on or off according to the measured temperature. [Effects of the Invention]

[0036] This embodiment provides a heating device and camera module that can prevent condensation, including frost, from occurring on the lens.

[0037] This embodiment provides a humidity controller and camera device that can prevent condensation, including frost, from occurring on the lens. [Brief explanation of the drawing]

[0038] [Figure 1] This is a perspective view of a camera module according to the first embodiment of the present invention. [Figure 2] This is an exploded perspective view of a camera module according to the first embodiment of the present invention. [Figure 3] This is a cross-sectional view of a camera module according to a first embodiment of the present invention. [Figure 4] This is a perspective view of the connecting terminal of a camera module according to the first embodiment of the present invention. [Figure 5] This is a perspective view of the heating member of a camera module according to a first embodiment of the present invention. [Figure 6] This is a perspective view of the connecting terminal and heating member of a camera module according to the first embodiment of the present invention. [Figure 7] This is a partial cross-sectional view of a camera module according to a first embodiment of the present invention. [Figure 8] This is a schematic circuit diagram of a camera module according to the first embodiment of the present invention. [Figure 9] This is a schematic circuit diagram of a camera module according to the first embodiment of the present invention. [Figure 10] This is a perspective view of the connecting terminal and heating member of a camera module according to another embodiment of the first embodiment of the present invention. [Figure 11] This is a partial cross-sectional view of a camera module according to another embodiment of the first embodiment of the present invention. [Figure 12] This is a schematic circuit diagram of a camera module according to another embodiment of the first embodiment of the present invention. [Figure 13]This is a schematic circuit diagram of a camera module according to another embodiment of the first embodiment of the present invention. [Figure 14] This is a perspective view of a camera device according to a second embodiment of the present invention. [Figure 15] This is an exploded perspective view of a camera device according to a second embodiment of the present invention. [Figure 16] This is a partial cross-sectional view of a camera device according to a second embodiment of the present invention. [Figure 17] This is a perspective view of a partial configuration of a camera device according to a second embodiment of the present invention. [Figure 18] This is a perspective view of a partial configuration of a camera device according to a second embodiment of the present invention. [Figure 19] This is a block diagram of a camera device according to a second embodiment of the present invention. [Figure 20] This is a flowchart of a camera device according to a second embodiment of the present invention. [Figure 21] This is a graph illustrating the operation of a camera device according to a second embodiment of the present invention. [Figure 22] This is a perspective view of a camera device according to another embodiment of the second embodiment of the present invention. [Figure 23] This is an exploded perspective view of a camera device according to another embodiment of the second embodiment of the present invention. [Figure 24] This is a partial cross-sectional view of a camera device according to another embodiment of the second embodiment of the present invention. [Figure 25] This is a perspective view of a partial configuration of a camera device according to another embodiment of the second embodiment of the present invention. [Figure 26] This is a perspective view of a partial configuration of a camera device according to another embodiment of the second embodiment of the present invention. [Modes for carrying out the invention]

[0039] Preferred embodiments of the present invention will be described in detail below with reference to the attached drawings.

[0040] However, the technical concept of the present invention is not limited to the embodiments described, but can be embodied in various forms that are different from each other, and within the scope of the technical concept of the present invention, one or more components of the embodiments can be selectively combined or replaced.

[0041] Furthermore, unless explicitly defined and described, terms used in the embodiments of the present invention (including technical and scientific terms) should be interpreted in a way that is generally understood by a person skilled in the art to which the present invention pertains, and terms used in common use together with predefined terms should be interpreted in consideration of their meaning in the context of the relevant art.

[0042] Furthermore, the terminology used in the embodiments of the present invention is for illustrative purposes only and is not intended to limit the invention.

[0043] In this specification, the singular form may also include the plural form unless otherwise specified in the text, and when it is written as "A and / or at least one of B and C", it may include one or more of all possible combinations of A, B and C.

[0044] Furthermore, when describing the components of the embodiments of the present invention, terms such as first, second, A, B, (a), (b), etc., may be used. Such terms are used solely to distinguish one component from another, and do not limit the essence, order, or sequence of the component in question.

[0045] Furthermore, when it is stated that one component is 'linked', 'joined', or 'connected' to another component, this may include not only cases where the component is 'linked', 'joined', or 'connected' to that other component directly, but also cases where it is 'linked', 'joined', or 'connected' by yet another component between that component and the other component.

[0046] Furthermore, when it is stated that a component is formed or positioned "above" or "below" another component, "above" or "below" includes not only cases where two components are in direct contact with each other, but also cases where one or more additional components are formed or positioned between the two components. Moreover, when expressed as "above" or "below," the meaning can include not only an upward direction but also a downward direction relative to one component.

[0047] In the following, 'optical axis direction' is defined as the optical axis direction of the lens coupled to the lens drive device. On the other hand, 'optical axis direction' can correspond to 'vertical direction', 'z-axis direction', etc.

[0048] A first embodiment of the present invention will be described in more detail below with reference to the attached drawings.

[0049] Figure 1 is a perspective view of a camera module according to the first embodiment of the present invention. Figure 2 is an exploded perspective view of a camera module according to the first embodiment of the present invention. Figure 3 is a cross-sectional view of a camera module according to the first embodiment of the present invention. Figure 4 is a perspective view of the connecting terminal of a camera module according to the first embodiment of the present invention. Figure 5 is a perspective view of the heating member of a camera module according to the first embodiment of the present invention. Figure 6 is a perspective view of the connecting terminal and heating member of a camera module according to the first embodiment of the present invention. Figure 7 is a partial cross-sectional view of a camera module according to the first embodiment of the present invention. Figures 8 and 9 are schematic circuit diagrams of a camera module according to the first embodiment of the present invention.

[0050] Referring to Figures 1 to 9, the camera module 10 according to the first embodiment of the present invention may include a housing 100, a lens barrel 200, a lens module 300, a connecting terminal 400, a substrate 510, a connector 520, a heating member 600, and a retainer 700. However, it is also possible to implement the invention without some of these components, and further additional components are not excluded.

[0051] Furthermore, the camera module 10 according to the first embodiment of the present invention may include a heating device. The heating device according to the first embodiment of the present invention may include a substrate 510, a connecting terminal 400, and a heating member 600, but no further additional configurations are excluded.

[0052] The camera module 10 may include a housing 100. The housing 100 can form the exterior of the camera module 10. The housing 100 may house a lens barrel 200, a lens module 300, a connecting terminal 400, a circuit board 510, a connector 520, a heating member 600, and a retainer 700. The housing 100 may include an upper housing and a lower housing.

[0053] The camera module 10 may include a lens barrel 200. The lens barrel 200 may be placed in the housing 100. The lens barrel 200 may be placed inside the housing 100. The lens barrel 200 may be coupled to the housing 100. The lens barrel 200 may be coupled to the front of the housing 100. A lens module 300 may be placed in the lens barrel 200. The lens barrel 200 may accommodate at least a portion of the lens module 300. The lens barrel 200 may include an opening in which the lens module 300 is placed. The first lens 310, i.e., the outermost lens, of the lens module 300 may be exposed at the top of the lens barrel 200. The center position of the lens barrel 200 may correspond to the center position of the lens module 300. At least a portion of the lens barrel 200 may overlap the coupling terminal 400 in a direction perpendicular to the optical axis. At least a portion of the coupling terminal 400 may be placed in the space between the lens barrel 200 and the housing 100. A retainer 700 can be attached to the lens barrel 200. The retainer 700 can be attached to the front of the lens barrel 200. The lens barrel 200 is manufactured from a non-metallic material such as synthetic resin using plastic injection molding or die-casting, but is not limited to this and the material of the lens barrel 200 can be varied in many ways.

[0054] The camera module 10 may include a lens module 300. The lens module 300 may be housed in the lens barrel 200. The lens module 300 may be positioned in the opening of the lens barrel 200. The lens module 300 may penetrate the opening of the lens barrel 200. The lens module 300 may be screw-coupled to the inner surface of the lens barrel 200. The lens module 300 may have corresponding screw threads formed on its outer surface to those formed on the inner surface of the lens barrel 200. The lens module 300 may include a first lens 310 which is the outermost lens and at least one lens positioned below the first lens 310. The first lens 310 of the lens module 300 may be exposed above the lens barrel 200. At least a portion of the first lens 310 of the lens module 300 may be positioned above the lens barrel 200. At least one lens of the lens module 300 may be positioned below the first lens 310. Each lens in the lens module 300 is made from synthetic resin, glass, or quartz, but is not limited to these materials and can be made from a variety of other materials.

[0055] The camera module 10 may include a connecting terminal 400. The connecting terminal 400 can be electrically connected to the substrate 510. The connecting terminal 400 can be electrically connected to the heating member 600. The connecting terminal 400 can electrically connect the heating member 600 to the substrate 510. The connecting terminal 400 can be electrically connected to the connector 520. The connecting terminal 400 can electrically connect the heating member 600 to the connector 520. The connecting terminal 400 can supply current from the substrate 510 to the heating member 600. The connecting terminal 400 may include a first region 410 positioned adjacent to the first lens 310, a third region 430 positioned adjacent to the substrate 510, and a second region 420 connecting the first region 410 and the third region 430.

[0056] The connecting terminal 400 may include a first region 410. The first region 410 may be located above the second region 420 and the third region 430. The first region 410 may be located between the lens barrel 200 and the lens module 300. The first region 410 may be located on the lens barrel 200. The first region 410 may be located on the lens module 300. The first region 410 may be located between the first lens 310 and at least one lens of the lens module 300. The first region 410 may be located between the first lens 310 and the lens barrel 200. The first region 410 may include an inner portion 412 and an outer portion 414. The first region 410 may be coupled to the heating member 600. The first region 410 may be coupled to the heating member 600 via contact means 610, 620. The first region 410 may be electrically connected to the heating member 600.

[0057] The inner portion 412 can be formed as an extension from one end 421 of the second region 420. The inner portion 412 can be formed as an extension from the central region of one end 421 of the second region 420. The inner portion 412 can be bent and extended from the central region of one end 421 of the second region 420. The inner portion 412 can include a curved region. The inner portion 412 consists of a curved region. The inner portion 412 can be formed in a ring shape. The inner portion 412 can be formed in a half-ring shape. The inner portion 412 can be formed in a horseshoe shape. The inner portion 412 can be separated from the outer portion 414. The inner portion 412 can be positioned higher than the outer portion 414. The inner portion 412 can be positioned on the upper surface of the heating member 600. The lower surface of the inner portion 412 can be coupled to the upper surface of the heating member 600. The lower surface of the inner portion 412 can be electrically connected to the upper surface of the heating member 600. The lower surface of the inner portion 412 can be ACF bonded to the upper surface of the heating member 600. The lower surface of the inner portion 412 can be bonded to the first heat-generating material of the heating member 600. The lower surface of the inner portion 412 can be electrically connected to the first heat-generating material of the heating member 600. The lower surface of the inner portion 412 can be ACF bonded to the first heat-generating material of the heating member 600. The inner portion 412 may be a first connecting portion connected to the first heat-generating material. The upper surface of the inner portion 412 can be bonded to the lower surface of the first lens 310. At least a portion of the upper surface of the inner portion 412 can be bonded to at least a portion of the lower surface of the first lens 310.

[0058] The outer portion 414 can be formed as an extension from one end 421 of the second region 420. The outer portion 414 can be formed as an extension from the outer region of one end 421 of the second region 420. The outer portion 414 can be bent and extended from the outer region of one end 421 of the second region 420. The outer portion 414 can include a curved region. The outer portion 414 consists of a curved region. The outer portion 414 can be formed in a ring shape. The outer portion 414 can be formed in a half-ring shape. The outer portion 414 can be formed in a horseshoe shape. The outer portion 414 can be separated from the inner portion 412. The outer portion 414 can be positioned lower than the inner portion 412. The outer portion 414 can be positioned on the lower surface of the heating member 600. The upper surface of the outer portion 414 can be coupled to the lower surface of the heating member 600. The upper surface of the outer portion 414 can be electrically connected to the lower surface of the heating member 600. The upper surface of the outer portion 414 can be ACF bonded to the lower surface of the heating member 600. The upper surface of the outer portion 414 can be bonded to the second heat-generating material of the heating member 600. The upper surface of the outer portion 414 can be electrically connected to the second heat-generating material of the heating member 600. The upper surface of the outer portion 414 can be ACF bonded to the second heat-generating material of the heating member 600. The outer portion 414 may be a second connecting portion connected to the second heat-generating material. The lower surface of the outer portion 414 can be fixed to the inner surface of the lens barrel 200. The lower surface of the outer portion 414 can be fixed to the upper part of at least one lens.

[0059] In the first embodiment of the present invention, the explanation will be given using an example where the height at which the inner portion 412 is located is higher than the height at which the outer portion 414 is located. However, the invention is not limited to this, and the height at which the outer portion 414 is located may be higher than the height at which the inner portion 412 is located.

[0060] The connecting terminal 400 may include a second region 420. The second region 420 can connect the first region 410 and the third region 430. The second region 420 can be bent at least once. The second region 420 can pass through at least one region of the housing 100, the lens barrel 200, and the retainer 700. Specifically, the second region 420 can pass through the space between the retainer 700 and the lens module 300, through the space between the lens barrel 200 and the lens module 300, and through the space between the housing 100 and the lens module 300. The second region 420 may include one end 421 connected to the first region 410, a first curved surface region 422 extending downward from the one end 421, a second curved surface region 423 extending downward from the first curved surface region 422, a third curved surface region 424 extending downward from the second curved surface region 423, a fourth curved surface region 425 extending downward from the third curved surface region 424, and the other end 426 connecting the fourth curved surface region 425 to the third region 430. In this case, the widths of the first to fourth curved surface regions 422, 423, 424, and 425 may be the same. The first to fourth curved surface regions 422, 423, 424, and 425 may each have different lengths. The first to fourth curved surface regions 422, 423, 424, and 425 may each have different curvatures. The second region 420 can be formed in an overall 'S' shape.

[0061] The connecting terminal 400 may include a third region 430. The third region 430 may be formed as an extension from the second region 420. The third region 430 may be bent from the other end 426 of the second region 420. The third region 430 may be connected to the substrate 510. The third region 430 may be connected to the connector 520. The third region 430 may be electrically connected to the substrate 510. The third region 430 may be electrically connected to the substrate 510 via the connector 520. The third region 430 may be flat. The third region 430 may be formed as an extension in a direction perpendicular to the optical axis.

[0062] The camera module 10 may include a circuit board 510. The camera module 10 may include a circuit board 510. The circuit board 510 may be placed in the housing 100. The circuit board 510 may be a printed circuit board (PCB) or a flexible printed circuit board (FPCB). The circuit board 510 may be coupled to a coupling terminal 400. The circuit board 510 may be electrically coupled to a coupling terminal 400. The circuit board 510 may be electrically coupled to a third area 430 of the coupling terminal 400.

[0063] The substrate 510 may include a plurality of substrates 512, 514. The substrate 510 may include a first substrate 512 on which the image sensor 502 is placed, and a second substrate 514 placed below the first substrate 512 and electrically connected to the first substrate. In this case, the first and second substrates 512, 514 can be spaced apart in the optical axis direction (vertical direction) and arranged in parallel to improve spatial efficiency. A connector 520 can be placed between the first substrate 512 and the second substrate 514. Referring to Figure 2, in the embodiment of the present invention, four substrates are used as an example, but the number of substrates is not limited to this and can be varied in various ways.

[0064] The substrate 510 according to the embodiment of the present invention can be replaced with a printed circuit board or a circuit board, etc. An image sensor 502 can be mounted on the substrate 510. In this case, the image sensor 502 can be electrically connected to the substrate 510. For example, the image sensor 502 can be coupled to the substrate 510 by surface mounting technology (SMT). In another example, the image sensor 502 can be coupled to the substrate 510 by flip-chip technology.

[0065] The circuit board 510 includes a control unit and a resistor (R-) placed between the connecting terminal 400 and the control unit (MCU). -01 , R02 ) can include. Resistance (R- -01 , R 02 ) can include the first resistance (R- -01 ) and the second resistance (R 02 ). The first resistance (R 01 ) can be electrically connected to the first connection part 412 of the connection terminal 400. The second resistance (R 02 ) can be electrically connected to the second connection part 414 of the connection terminal 400. Here, the first resistance (R- -01 ) can be the first heating substance, and the second resistance (R 02 ) can be the second heating substance, but is not limited thereto. The first resistance (R- -01 ) can be on the upper surface of the heating member 600, and the second resistance (R 02 ) can mean the lower surface of the heating member 600. In the first embodiment of the present invention, the control unit will be described by taking the MCU as an example, but it is not limited thereto, and the configuration of the control unit can be variously changed.

[0066] Also, sensing resistances (R- -sense1 , R sense2 ) arranged between the connection terminal 400 and the control unit, and ground resistances (R1, R2) arranged between the connection terminal 400 and the ground (RND) or between the control unit (MCU) and the ground (RND) can be included. At this time, the sensing resistances (R -sense1 , R sense2 ) can include the first sensing resistance (R 01 ) arranged between the first resistance (R sense2 ) and the control unit (MCU), and the second sensing resistance (R 02 ) arranged between the second resistance (R sense2 ) and the control unit (MCU). The ground resistances (R1, R2) can include the first ground resistance (R1) arranged between the first resistance (R 01 ) and the ground (RND), and the second ground resistance (R2) arranged between the second resistance (R 02 ) and the ground (RND).

[0067] The first connecting section 412 has a first voltage (V -in1 A first electrode section having ) and a first voltage (V -in1 A second voltage (V) having a lower voltage than ) R01 It may include a second electrode portion having a first resistance (R 01 The second connection part 414 can be electrically connected to the second electrode part of the first connection part 412. The second connection part 414 is connected to the third voltage (V -in2 A third electrode section having ) and a third voltage (V -in2 The fourth voltage (V) is a voltage lower than ). R02 It may include a fourth electrode section having a second resistance (R 02 ) can be electrically connected to the fourth electrode portion of the second connecting portion 414. At this time, the first resistor (R 01 The voltage applied to the second resistor (R) satisfies equation 1, 02 The voltage applied to ) can satisfy mathematical equation 2.

[0068]

number

[0069]

number

[0070] First voltage (V -in1 ) and the second voltage (V R01 ) satisfies mathematical formula 3, and the third voltage (V -in2 ) and the fourth voltage (V R02 ) can satisfy mathematical formula 4.

[0071]

number

[0072]

number

[0073] First resistance (R 01 If the voltage decreases from the initial value, the control unit (MCU) will use the first PWM control (PWM1) to set the second voltage (V R01 By reducing the value of the first resistor (R 01 If the voltage increases from the initial value, the control unit (MCU) will use the first PWM control (PWM1) to adjust the second voltage (VR 01 By incrementing the value, a constant power supply can be provided, thereby maintaining a constant heating temperature for the heating element 600.

[0074] Also, the second resistor (R 02 If the voltage decreases from the initial value, the control unit (MCU) will use second PWM control (PWM2) to control the fourth voltage (V R02 By reducing the value of the second resistor (R 02 If the voltage increases from the initial value, the control unit (MCU) will use second PWM control (PWM2) to control the fourth voltage (V R02 By incrementing the value, a constant power supply can be provided, thereby maintaining a constant heating temperature for the heating element 600.

[0075] For this purpose, the camera module 10 according to the first embodiment of the present invention has a first sensing resistor (R sense1 ) and the second voltage (V R01A first sensor that senses ) and a second sensing resistor (R sense2 ) and the fourth voltage (V R02 It may include a second sensor that senses ).

[0076] The camera module 10 may include a connector 520. The connector 520 may be placed on the substrate 510. The connector 520 may be electrically connected to the substrate 510. The connector 520 may be placed between the first substrate 512 and the second substrate 514. The connector 520 may be coupled to a coupling terminal 400. The connector 520 may be electrically connected to a coupling terminal 400. The connector 520 may be electrically connected to the third region 430 of the coupling terminal 400. The connector 520 may electrically couple the substrate 510 and the coupling terminal 400.

[0077] The camera module 10 may include a heating member 600. The heating member 600 can be placed in the lens module 300. The heating member 600 can be placed between the lens barrel 200 and the lens module 300. The heating member 600 can be placed between the first lens 310 and at least one lens in the lens module 300. The heating member 600 can be placed below the first lens 310. The heating member 600 can be placed in an area adjacent to the lower surface of the first lens 310. The heating member 600 can be coupled to the connecting terminal 400. The heating member 600 can be coupled to the first region 410 of the connecting terminal 400. The heating member 600 can be placed between the inner portion 412 and the outer portion 414 of the first region 410 of the connecting terminal 400. The heating member 600 can be coupled to the connecting terminal 400 via an adhesive means 610 such as an adhesive. The heating member 600 can be bonded to a portion of the first region 410, specifically region 412, via a first bonding means 610 such as an adhesive, and to a portion of the first region 410, specifically region 414, via a second bonding means 620. The heating member 600 may be a heating wrap including a heating sheet and heating wires arranged on the heating sheet. In this case, the heating wires may include a plurality of heating wires.

[0078] The heating member 600 can be electrically connected to the substrate 510 via the connecting terminal 400. The heating member 600 can generate heat by receiving an electric current from the substrate 510. At this time, the heating member 600 can be electrically connected to the connecting terminal 400 by ACF bonding (anisotropic conductive film bonding), which is an electrically conductive connection. The heating member 600 may be a transparent heating film coated with conductive indium tin oxide (ITO), which is capable of generating heat due to its own resistive component. The heating member 600 can be formed, for example, by a coating process or a vapor deposition process of indium tin oxide material. However, this is illustrative, and the material of the heating member 600 can be varied and not limited to this, as long as it is a material that can generate heat when an electric current is supplied. The heating member 600 can be placed on the connecting terminal 400. The heating member 600 can be placed between the inner part 412 and the outer part 414 of the connecting terminal 400. The heating member 600 may include a main body and a heat-generating material disposed on the main body. The heat-generating material may include a first heat-generating material disposed on the upper surface of the main body and a second heat-generating material disposed on the lower surface of the main body. The main body may be disposed between the inner portion 412 and the outer portion 414 of the connecting terminal 400. The first heat-generating material may be disposed on the lower surface of the inner portion 412. The upper surface of the first heat-generating material may be electrically coupled to the lower surface of the inner portion 412. The upper surface of the first heat-generating material may be ACF bonded to the lower surface of the inner portion 412 via a first contact means 610. The second heat-generating material may be disposed on the upper surface of the outer portion 414. The lower surface of the second heat-generating material may be electrically coupled to the upper surface of the outer portion 414. The lower surface of the second heat-generating material may be ACF bonded to the upper surface of the outer portion 414 via a second contact means 620.

[0079] The camera module 10 may include a retainer 700. The retainer 700 can be positioned on the top or front of the housing 100. The retainer 700 can be coupled to the lens barrel 200. The retainer 700 can be positioned on the outside of the lens barrel 200. The retainer 700 can be positioned on the first lens 310 of the lens module 300 to secure the lens module 300 and the lens barrel 200 to the housing 100. The retainer 700 can be coupled to the lens barrel 200 to secure the lens module 300 housed in the lens barrel 200. In this case, the end of the retainer 700 is formed in a '┐' (inverted L) shape to press down on and secure the lens module 300 housed in the lens barrel 200, and can be bonded to the lens barrel 200 using an adhesive material such as epoxy. That is, the retainer 700 can be positioned on the lens barrel 200 to secure the first lens 310, which is the outermost lens. An O-ring 710 can be placed between the retainer 700 and the lens module 300 to eliminate the space formed between the retainer 700 and the lens module 300. An O-ring 710 can also be placed between the retainer 700 and the first lens 310 to eliminate the space formed between the retainer 700 and the first lens 310.

[0080] Figure 10 is a perspective view of the connecting terminal and heating member of a camera module according to another embodiment of the first embodiment of the present invention. Figure 11 is a partial cross-sectional view of a camera module according to another embodiment of the first embodiment of the present invention. Figures 12 and 13 are schematic circuit diagrams of a camera module according to another embodiment of the first embodiment of the present invention.

[0081] Referring to Figures 10 to 13, a camera module 10 according to another embodiment of the first embodiment of the present invention may include a housing 100, a lens barrel 200, a lens module 300, a connecting terminal 400, a substrate 510, a connector 520, a heating member 600, and a retainer 700, although some of these components may be omitted, and further additional components are not excluded.

[0082] Furthermore, the camera module 10 according to another embodiment of the first embodiment of the present invention may include a heating device. The heating device according to another embodiment of the first embodiment of the present invention may include a substrate 510, a connecting terminal 400, and a heating member 600, but no further additional configurations are excluded.

[0083] Except for the configuration described below, the detailed configuration of the camera module 10 according to another embodiment of the first embodiment of the present invention is the same as the detailed configuration of the camera module 10 according to the first embodiment of the present invention.

[0084] The first region 412 of the camera module 10 according to another embodiment of the first embodiment of the present invention does not need to be divided into an outer part and an inner part. That is, the first region 412 may have the same shape as the outer part 412 or outer part 414 of the first region 410 according to the first embodiment of the present invention.

[0085] The first region 412 is positioned on the lower surface of the first lens 310, which is the outermost lens, and the first region 412 can be coupled to the upper surface of the heating member 600. At this time, the lower surface of the first region 412 can be electrically connected to the upper surface of the heating member 600 via the contact means 610, and can be bonded, for example, by ACF bonding.

[0086] In this case, the circuit configuration of the camera module 10 according to another embodiment of the first embodiment of the present invention can satisfy mathematical formulas 1 and 3 of the circuit configuration of the camera module 10 according to the first embodiment of the present invention.

[0087] In other words, due to environmental factors such as temperature changes, the first resistance (R 01 ) is changed, but the first resistor (R 01 A first sensing resistor (R) is placed between the control unit (MCU) and the control unit (R). sense2 This can be compensated for through ).

[0088] Specifically, the first sensing resistor (R sense1 ) and the second voltage (V R01 ) senses the first resistor (R 01 The change in the second sensing resistor (R) can be determined, and the second sensing resistor (R) can be determined. sense2 ) and the fourth voltage (V R02 ) senses the second resistor (R 02 The change in ) can be determined.

[0089] First resistance (R 01 If the voltage decreases from the initial value, the control unit (MCU) will use the first PWM control (PWM1) to set the second voltage (V R01 By reducing the value of the first resistor (R 01 If the voltage increases from the initial value, the control unit (MCU) will use the first PWM control (PWM1) to adjust the second voltage (V R01 By incrementing the value, a constant power supply can be provided, thereby maintaining a constant heating temperature for the heating element 600.

[0090] In another embodiment of the first embodiment of the present invention, the first region 412 was described as being located on the lower surface of the first lens 310, which is the outermost lens, and coupled to the upper surface of the heating member 600. However, in contrast to this, the heating member 600 can also be located on the lower surface of the first lens 310, which is the outermost lens, and the first region 412 can be coupled to the lower surface of the heating member 600.

[0091] A second embodiment of the present invention will be described in more detail below with reference to the attached drawings.

[0092] Figure 14 is a perspective view of a camera device according to a second embodiment of the present invention. Figure 15 is an exploded perspective view of a camera device according to a second embodiment of the present invention. Figure 16 is a partial cross-sectional view of a camera device according to a second embodiment of the present invention. Figures 17 and 18 are perspective views of a partial configuration of a camera device according to a second embodiment of the present invention. Figure 19 is a block diagram of a camera device according to a second embodiment of the present invention. Figure 20 is a flowchart of a camera device according to a second embodiment of the present invention. Figure 21 is a graph illustrating the operation of a camera device according to a second embodiment of the present invention.

[0093] Referring to Figures 14 to 21, the camera device 1010 according to the second embodiment of the present invention may include a lens module 1100, a housing 1200, a substrate 1300, an image sensor 1310, a heater 1410, a connecting terminal 1420, a desiccant 1500, a control unit 1910, and a sensor unit 1920. However, some of these components may be omitted, and further additional components are not excluded.

[0094] Furthermore, referring to Figures 14 to 21, the humidity controller of the camera device 1010 according to the second embodiment of the present invention may include a heater 1410, a connecting terminal 1420, and a desiccant 1500, but it may be implemented with some of these components excluded, and additional components are not excluded.

[0095] The camera device 1010 may include a lens module 1100. The lens module 1100 may be placed in the housing 1200. At least a portion of the lens module 1100 may be housed in the housing 1200. At least a portion of the lens module 1100 may be positioned in front of or above the housing 1200, passing through an opening in the housing 1200. The lens module 1100 may be screw-coupled to the inner circumferential surface of the housing 1200. The lens module 1100 may have corresponding screw threads formed on its outer circumferential surface to those formed on the inner circumferential surface of the housing 1200. The lens module 1100 may include at least one lens. Each lens of the lens module 1100 may be made of a variety of materials, including but not limited to synthetic resin, glass, or quartz.

[0096] The camera device 1010 may include a housing 1200. The housing 1200 can form the exterior of the camera device 1010. The housing 1200 may house a lens module 1100, a substrate 1300, a heater 1410, a connecting terminal 1420, and a desiccant 1500. The housing 1200 may include an upper housing and a lower housing. In a second embodiment of the present invention, the housing 1200 is described as having a hexahedral shape, but is not limited thereto.

[0097] The camera device 1010 may include a substrate 1300. The substrate 1300 may be placed in the housing 1200. The substrate 1300 may be placed inside the housing 1200. The substrate 1300 may be placed below the lens module 1100. The substrate 1300 may include a printed circuit board (PCB) or a flexible printed circuit board (FPCB). The substrate 1300 may be coupled to a coupling terminal 1420. The substrate 1300 may be electrically coupled to the coupling terminal 1420. The substrate 1300 may be electrically coupled to the third region 1426 of the coupling terminal 1420. The substrate 1300 may be electrically coupled to the coupling terminal 1420 via a coupling member 1320. An image sensor 1310 may be mounted on the substrate 1300. The substrate 1300 may be electrically coupled to the image sensor 1310.

[0098] The substrate 1300 may include a plurality of substrates 1302, 1304, 1306, and 1308. The substrate 1300 may include a first substrate 1302 on which the image sensor 1310 is placed, a second substrate 1304 placed below the first substrate 1302 and electrically connected to the first substrate 1302, a third substrate 1306 placed below the second substrate 1304 and electrically connected to the second substrate 1304, and a fourth substrate 1308 placed below the third substrate 1306 and electrically connected to the third substrate 1306. In this case, the first to fourth substrates 1302, 1304, 1306, and 1308 can each be spaced apart in the optical axis direction (vertical direction) and can be arranged in parallel to improve spatial efficiency. A connecting member 1320 can be placed between the first substrate 1302 and the second substrate 1304. In the second embodiment of the present invention, the multiple substrates 1302, 1304, 1306, and 1308 are described using four substrates as an example, but the number of substrates 1302, 1304, 1306, and 1308 can be varied in various ways, and the invention is not limited to this.

[0099] The camera device 1010 may include an image sensor 1310. The image sensor 1310 may be placed in the housing 1200. The image sensor 1310 may be placed inside the housing 1200. The image sensor 1310 may be placed on the substrate 1300. The image sensor 1310 may be electrically connected to the substrate 1300. The image sensor 1310 may be placed on the entire surface or top surface of the first substrate 1302. The image sensor 1310 may be placed in the opening 1412 of the heater 1410 and / or the opening of the desiccant 1500. The image sensor 1310 may be mounted on one side of the first substrate 1302. The image sensor 1310 may be electrically connected to the first substrate 1302. For example, the image sensor 1310 may be bonded to the substrate 1300 by surface mounting technology (SMT). In another example, the image sensor 1310 can be coupled to the substrate 1300 using flip-chip technology. The optical axis of the image sensor 1310 is aligned with the optical axis of the lens module 1100.

[0100] The camera device 1010 may include a heating element 1400. The heating element 1400 may include a connecting terminal 1420 and a heater 1410. At least a portion of the heating element 1400 may be formed from a flexible printed circuit board or a flexible substrate. The heating element 1400 can release heat when current is applied from the substrate 1300. The heating element 1400 may be a transparent heating film coated with conductive indium tin oxide (ITO), which is capable of generating heat due to its own resistive component. The heating element 1400 may be formed, for example, by a coating or vapor deposition process of the indium tin oxide material. However, this is illustrative, and the material of the heating element 1400 can be varied and is not limited to this, as long as it is a material that can generate heat when current is supplied.

[0101] The camera device 1010 may include a coupling terminal 1420. The coupling terminal 1420 can be coupled to the substrate 1300. The coupling terminal 1420 can be electrically coupled to the substrate 1300. The coupling terminal 1420 can be coupled to the second substrate 1304. The coupling terminal 1420 can be electrically coupled to the second substrate 1304. The coupling terminal 1420 can be coupled to a coupling member 1320. The coupling terminal 1420 can be electrically coupled to the substrate 1300 via the coupling member 1320. The coupling terminal 1420 can be coupled to a power supply located on the substrate 1300. The coupling terminal 1420 can be coupled to a heater 1410. The coupling terminal 1420 can be formed from a flexible printed circuit board or a flexible substrate. The coupling terminal 1420 can be formed in an overall '⊂' (horizontal U) shape.

[0102] The connecting terminal 1420 may include a first region 1422 that connects to the heater 1410, a third region 1426 that connects to the substrate 1300, and a second region 1424 that connects the first region 1422 and the third region 1426. One side of the first region 1422 is connected to the heater 1410, and at least a portion of the first region 1422 can be folded downwards, while the other side of the first region 1422 can be connected to the second region 1424. The first region 1422 can extend horizontally overall. One side of the second region 1424 can be connected to the first region 1422, and the other side can be connected to the third region 1426. At least a portion of the second region 1424 can be folded. The second region 1424 can extend vertically overall. One side of the third region 1426 can be connected to the second region 1424, and the other side can be coupled to the substrate 1300. The other side of the third region 1426 can also be directly coupled to the second substrate 1304, and can be electrically coupled to the first substrate 1302 and / or the second substrate 1304 through the connecting member 1320.

[0103] The camera device 1010 may include a heater 1410. The heater 1410 can be connected to a connection terminal 1420. The heater 1410 can be electrically connected to a connection terminal 1420. The heater 1410 can be connected to a first region 1422 of the connection terminal 1420. The heater 1410 can be electrically connected to a first region 1422 of the connection terminal 1420. The heater 1410 may be in a closed-loop configuration. The heater 1410 can be placed on a substrate 1300. The heater 1410 can be placed on a first substrate 1302. The heater 1410 can be placed on the entire surface or top surface of the first substrate 1302. The heater 1410 can be bonded to the entire surface or top surface of the first substrate 1302. The heater 1410 can be placed in an area adjacent to the image sensor 1310. The heater 1410 can be positioned in the region surrounding the image sensor 1310. The heater 1410 may include an opening 1412. The image sensor 1310 can be positioned in the opening 1412 of the heater 1410. The heater 1410 can be formed in a 'square' shape. Alternatively, the shape of the heater 1410 can be formed in a donut or triangular band shape, corresponding to the shape of the image sensor 1310. The heater 1410 may include a heating element having a closed loop shape. This allows the heater 1410 to release more heat than the connecting terminal 1420 when current is supplied to it. That is, when current is supplied through the connecting terminal 1420, the heater 1410 can generate heat to remove moisture from the desiccant 1500.

[0104] The camera device 1010 may include a desiccant 1500. The desiccant 1500 may be placed on the heater 1410. The desiccant 1500 may be placed on one surface of the heater 1410. The desiccant 1500 may be bonded to one surface of the heater 1410. The desiccant 1500 may be bonded to the entire surface or top surface of the heater 1410. The desiccant 1500 may be bonded to one surface of the heater 1410 via an adhesive or the like. The desiccant 1500 may also be bonded via an adhesive film or the like attached to one surface of the desiccant 1500. The desiccant 1500 may be placed in an area adjacent to the image sensor 1310. The desiccant 1500 may be placed in an area surrounding the image sensor 1310. The desiccant 1500 may be formed in a shape corresponding to the shape of the heater 1410. The desiccant 1500 may include an opening. An image sensor 1310 can be placed in the opening of the desiccant 1500. The desiccant 1500 can be formed in a '□' shape. The desiccant 1500 may be in a closed-loop shape. The desiccant 1500 may contain silica gel. The desiccant 1500 is preferably formed with dimensions of 25 mm in width, 25 mm in height, and 1.3 mm in thickness. In this case, interference with other components within the camera device 1010 can be prevented. Also, since the contact area with the heater 1510 is important, the desiccant 1500 can be placed together with the heater 1510 on both sides.

[0105] The desiccant 1500 can absorb moisture generated from within the housing 1200. Specifically, the desiccant 1500 can absorb moisture when the internal temperature of the housing 1200 is below a first reference value. In this case, the first reference value refers to a value predetermined by the designer. For example, the first reference value may be ambient temperature or a value between 25°C and 30°C. In contrast, the desiccant 1500 can also absorb moisture when the internal humidity of the housing 1200 is above a third reference value.

[0106] In Figures 15 to 18, the heater 1410 and desiccant 1500 are shown as being in a '□' shape, but the heater 1410 and desiccant 1500 may also be square, circular, or triangular in shape. In this case, the heater 1410 and desiccant 1500 can be placed on the inner surface of the substrate 1300 or the housing 1200.

[0107] Furthermore, while Figures 15 to 18 illustrate the example of the heater 1410 and desiccant 1500 being arranged in the area surrounding the image sensor 1310, the arrangement is not limited to this, and the heater 1410 and desiccant 1500 can also be arranged in the area surrounding the lens module 1100.

[0108] The camera device 1010 may include a sensor unit 1920. The sensor unit 1920 may be located in the housing 1200. The sensor unit 1920 may be located inside the housing 1200. The sensor unit 1920 may be located on the substrate 1300. The sensor unit 1920 may be electrically connected to the substrate 1300. The sensor unit 1920 may measure the temperature and / or humidity inside the housing 1200. The sensor unit 1920 may be electrically connected to the control unit 1910. The temperature and / or humidity information measured by the sensor unit 1920 may be transmitted to the control unit 1910. The sensor unit 1920 may include sensors for measuring temperature and / or humidity. Alternatively, the sensor unit 1920 may include a first sensor for measuring temperature and a second sensor for measuring humidity.

[0109] The camera device 1010 may include a control unit 1910. The control unit 1910 may be located on the circuit board 1300. The control unit 1910 may be electrically connected to the sensor unit 1920 and the heating unit 1930. The control unit 1910 can control the heating unit 1930 based on temperature and / or humidity information inside the housing 1200 measured by the sensor unit 1920. Here, the heating unit 1930 may mean a heating element 1400. The heating unit 1930 may include a connection terminal 1420 and a heater 1410. Alternatively, the heating unit 1930 may mean only the heater 1410. The control unit 1910 can control the on / off state of the heater 1410. Specifically, the control unit 1910 can activate the heater 1410 when the internal temperature of the housing 1200 is above a second reference value. In this case, the second reference value means a value predetermined by the designer. For example, the second reference value may be a value between 85°C and 100°C. Alternatively, the control unit 1910 may operate the heater 1410 when the internal humidity of the housing 1200 is below the fourth reference value. For example, in the second embodiment of the present invention, it is preferable for the control unit 1910 to operate the heater 1410 at 120°C for about 1 to 2 minutes to remove moisture from the desiccant 1500.

[0110] The method for adjusting the humidity controller of the camera device 1010 according to the second embodiment of the present invention will be described below with reference to Figure 20.

[0111] In the temperature and / or humidity sensing step (S101), the sensor unit 1920 senses the temperature and / or humidity inside the housing and transmits this information to the control unit 1910.

[0112] In the condensation condition confirmation step (S102), if the condensation conditions are met, the control unit 1910 performs the heat generation signal generation step (S103). If the condensation conditions are not met, the temperature and / or humidity sensing step (S101) is performed again.

[0113] Here, whether or not condensation conditions are met can be determined by the region in which the temperature and humidity values ​​measured by the sensor unit 1920 are located relative to the temperature and humidity graph in Figure 21. In this case, the horizontal axis represents temperature and the vertical axis represents humidity.

[0114] In the heating signal generation step (S103), the control unit 1910 transmits a heating signal to the heating element 1400, causing the heating element 1400 to generate heat. At this time, the heating element 1400 may refer to the heater 1410 excluding the connecting terminal 1420.

[0115] In the improvement confirmation process (S104), the temperature and humidity environment inside the housing 1200 are measured via the sensor unit 1920 to determine if they have improved. If they have improved, the control unit 1910 generates a termination signal; if they have not improved, the control unit 1910 continuously generates a heat generation signal.

[0116] In the termination signal generation (S105) step, if the internal temperature and humidity environment of the housing 1200, as measured via the sensor unit 1920, improves, the control unit 1910 terminates the generation of the heat generation signal.

[0117] Therefore, the camera device 1010 according to the second embodiment of the present invention can prevent condensation, including frost, from occurring on the lens of the lens module 1100, thereby maintaining the humidity inside the housing 1200 appropriately.

[0118] Figure 22 is a perspective view of a camera device according to another embodiment of the second embodiment of the present invention. Figure 23 is an exploded perspective view of a camera device according to another embodiment of the second embodiment of the present invention. Figure 24 is a partial cross-sectional view of a camera device according to another embodiment of the second embodiment of the present invention. Figures 25 and 26 are perspective views of a partial configuration of a camera device according to another embodiment of the second embodiment of the present invention.

[0119] Referring to Figures 22 to 26, the camera device 1020 according to another embodiment of the second embodiment of the present invention may include a lens module 1100, a housing 1200, a substrate 1300, an image sensor 1310, a connector 1600, a heater 1710, a connecting terminal 1720, a desiccant 1800, a control unit 1910, and a sensor unit 1920, but may be implemented with some of these components excluded, and further additional components are not excluded.

[0120] Furthermore, referring to Figures 22 to 26, the humidity controller of the camera device 1020 according to another embodiment of the second embodiment of the present invention may include a heater 1710, a connecting terminal 1720, and a desiccant 1800, but it may be implemented with some of these components excluded, and further additional components are not excluded.

[0121] It can be understood that the configuration of camera device 1020 according to another embodiment of the second embodiment of the present invention, which is not described below, is the same as the configuration of camera device 1010 according to the second embodiment of the present invention, within the same scope of the drawings.

[0122] The camera device 1020 may include a connector 1600. The connector 1600 may be placed in the housing 1200. The connector 1600 may be coupled to the substrate 1300. The connector 1600 may be coupled to the substrate 1300 by passing through the housing 1200. The connector 1600 may be electrically connected to the substrate 1300. The connector 1600 may supply external power to the camera device 1020. The cross-section of the connector 1600 may be formed in a circular shape. Alternatively, the cross-section of the connector 1600 may be varied to an elliptical or square shape, etc. The camera device 1010 according to a second embodiment of the present invention may also include a connector 1600. An O-ring 1610 may be placed in the space between the connector 1600 and the housing 1200 to seal the space between the connector 1600 and the housing 1200.

[0123] The camera device 1020 may include a heating element 1700. The heating element 1700 may include a connecting terminal 1720 and a heater 1710. At least a portion of the heating element 1700 may be formed from a flexible printed circuit board or a flexible substrate. The heating element 1700 can release heat when an electric current is applied from the substrate 1300. The heating element 1700 may be a transparent heating film coated with conductive indium tin oxide (ITO), which is capable of generating heat due to its own resistive component. The heating element 1700 may be formed, for example, by a coating or vapor deposition process of the indium tin oxide material. However, this is illustrative, and the material of the heating element 1700 is not limited to this and can be varied in many ways as long as it is a material that can generate heat when an electric current is supplied.

[0124] The camera device 1020 may include a coupling terminal 1720. The coupling terminal 1720 can be coupled to the substrate 1300. The coupling terminal 1720 can be electrically coupled to the substrate 1300. The coupling terminal 1720 can be coupled to a second substrate 1304. The coupling terminal 1720 can be electrically coupled to the second substrate 1304. The coupling terminal 1720 can be coupled to a coupling member 1320. The coupling terminal 1720 can be electrically coupled to the substrate 1300 via the coupling member 1320. The coupling terminal 1720 can be coupled to a power supply located on the substrate 1300. The coupling terminal 1720 can be coupled to a heater 1410. The coupling terminal 1720 can be formed from a flexible printed circuit board or a flexible substrate. The coupling terminal 1720 can be formed in an overall '⊂' shape.

[0125] The connecting terminal 1720 may include a first region 1722 positioned adjacent to the connector 1600 and coupled to the heater 1710, a fourth region 1728 coupled to the substrate 1300, and second and third regions 1724, 1726 connecting the first region 1722 and the fourth region 1728. One side of the first region 1722 may be coupled to the heater 1710, and the other side of the first region 1722 may be coupled to the second region 1724. At least a portion of the first region 1722 may be bent. The first region 1722 may extend horizontally as a whole. One side of the second region 1724 may be coupled to the first region 1722, and the other side of the second region 1724 may be coupled to the third region 1726. The second region 1724 may extend vertically as a whole. One side of the third region 1726 can be connected to the second region 1724, and the other side of the third region 1726 can be connected to the fourth region 1728. At least a portion of the third region 1726 can be bent. The third region 1726 can extend horizontally as a whole. One side of the fourth region 1728 can be connected to the third region 1726. The fourth region 1728 can be coupled to the substrate 1300. Specifically, the fourth region 1728 may be directly coupled to the second substrate 1304, or it may be electrically coupled to the substrate 1300 and / or the second substrate 1304 via a coupling member 1320.

[0126] The camera device 1020 may include a heater 1710. The heater 1710 may be connected to a coupling terminal 1720. The heater 1710 may be electrically connected to a coupling terminal 1720. The heater 1710 may be connected to a first region 1722 of the coupling terminal 1720. The heater 1710 may be electrically connected to a first region 1722 of the coupling terminal 1720. The heater 1710 may be in a closed-loop shape. The heater 1710 may be positioned adjacent to the inner surface of the housing 1200. The heater 1710 may be positioned adjacent to the lower inner surface of the housing 1200. The heater 1710 may be positioned in a region adjacent to the connector 1600. The heater 1710 may include an opening 1712. At least a portion of the connector 1600 may be positioned in the opening 1712 of the heater 1710. The heater 1710 can be positioned in the area surrounding the connector 1600. The heater 1710 can be formed in an 'O' shape or a donut shape. Alternatively, the shape of the heater 1710 may be formed in a square or triangular band shape corresponding to the cross-sectional shape of the connector 1600. The heater 1710 may include a heating element having a closed loop shape. This allows the heater 1710 to release more heat than the connecting terminal 1420 when current is supplied to it. That is, when current is supplied through the connecting terminal 1720, the heater 1710 can generate heat to remove moisture from the desiccant 1700.

[0127] The camera device 1020 may include a desiccant 1800. The desiccant 1800 can be placed on the heater 1710. The desiccant 1800 can be placed on one surface of the heater 1710. The desiccant 1800 can be bonded to one surface of the heater 1710. The desiccant 1800 can be bonded to the upper surface of the heater 1410. The desiccant 1800 can be bonded to the upper surface of the heater 1410 via an adhesive or the like. The desiccant 1800 can be placed in an area adjacent to the connector 1600. The desiccant 1800 can be placed around the connector 1600. The desiccant 1800 can be placed in an area surrounding the connector 1600. The desiccant 1800 can be placed adjacent to the inner surface of the housing 1200. The desiccant 1800 can be placed adjacent to the lower inner surface of the housing 1200. The desiccant 1800 may include an opening. At least a portion of the connector 1600 can be placed in the opening of the desiccant 1800. The desiccant 1800 may be formed in the same shape as the heater 1710. The desiccant 1800 may be formed in an 'O' shape or a donut shape. Alternatively, the shape of the desiccant 1800 may be a square band or a triangular band shape corresponding to the shape of the heater 1710. The desiccant 1800 may contain silica gel. The desiccant 1800 is preferably formed with dimensions of 25 mm in width, 25 mm in height, and 1.3 mm in thickness. In this case, interference with other components within the camera device 1020 can be prevented. Also, since the contact area with the heater 1710 is important, the desiccant 1800 may be placed together on both sides of the heater 1710. In this case, the insulation material 1820 may be placed between the dehumidifier 1800, which is located on the underside of the heater 1710, and the inner surface of the housing 1200, or it may be omitted from the configuration.

[0128] The desiccant 1800 can absorb moisture generated from within the housing 1200. Specifically, the desiccant 1800 can absorb moisture when the internal temperature of the housing 1200 is below a first reference value. In this case, the first reference value refers to a value predetermined by the designer. Alternatively, the desiccant 1800 may also absorb moisture when the internal humidity of the housing 1200 is above a third reference value.

[0129] In Figures 23 to 26, the heater 1710 and desiccant 1800 were explained using an 'O' shape as an example, but the heater 1710 and desiccant 1800 may also be square, circular, or triangular in shape. In this case, the heater 1710 and desiccant 1800 may be placed on the inner surface of the substrate 1300 or the housing 1200.

[0130] The camera device 1020 may include an insulating material 1820. The insulating material 1820 can be placed on the other side of the heater 1710. The insulating material 1820 can be bonded to the other side of the heater 1710 via an adhesive 1810. The insulating material 1820 can be placed between the heater 1710 and the inner surface of the housing 1200. This prevents heat generated from the heater 1710 from being lost through the housing 1200, if the housing 1200 is made of aluminum. In other words, it improves the efficiency of heat transfer from the heater 1710 to the desiccant 1800. The shape of the insulating material 1820 can be formed to correspond to the shape of the heater 1710.

[0131] A camera device 1020 according to another embodiment of the second embodiment of the present invention can achieve the same effects and advantages as the camera device 1010 according to the second embodiment of the present invention.

[0132] The first and second embodiments of the present invention have been described separately above, but a third embodiment of the present invention may include at least some components of the first embodiment and at least some components of the second embodiment. For example, the third embodiment may include both a heating member 600 and a dehumidifier 1500.

[0133] While embodiments of the present invention have been described above with reference to the attached drawings, those with ordinary skill in the art to which the present invention pertains should understand that the present invention can be implemented in other specific forms without altering its technical idea or essential features. Therefore, the embodiments described above should be understood to be illustrative and not limiting in all respects.

Claims

1. A connecting terminal that is connected to the power supply, The heater connected to the aforementioned connecting terminal, The heater includes a desiccant placed on the heater, The desiccant and the heater form a closed-loop configuration in a humidity controller for a camera device.

2. The aforementioned connecting terminal is a flexible substrate, The heater is electrically connected to the flexible substrate and includes a heating element having a closed-loop shape. The humidity controller for a camera device according to claim 1, wherein the desiccant contains silica gel and is adhered to one surface of the heater.

3. A humidity controller for a camera device according to claim 2, comprising an insulating material bonded to the other side of the heater.

4. Housing and A lens module arranged in the housing, A substrate placed in the housing, A connecting terminal connected to the aforementioned substrate, The heater connected to the aforementioned connecting terminal, The desiccant is placed on the heater, The heater and the desiccant are arranged inside the housing. A camera device in which the desiccant and the heater have a closed-loop configuration.

5. The camera device according to claim 4, wherein the heater and the desiccant are arranged on the inner surface of the substrate or the housing.

6. The housing includes a connector that penetrates the substrate and connects to it, and an image sensor placed on the substrate. The camera apparatus according to claim 4 or 5, wherein the desiccant is arranged around at least one of the image sensor, the connector, and the lens module.

7. The desiccant and the heater include an opening, The camera device according to claim 6, wherein part of the image sensor or the connector is disposed within the opening.

8. The substrate includes a first substrate and a second substrate disposed below the first substrate. The heater is placed on the first substrate, The camera device according to claim 4 or 5, wherein the connecting terminal is connected to the second substrate.

9. The camera device according to claim 4 or 5, comprising a sensor disposed on the substrate for measuring temperature and humidity.

Images