conductive adhesive film

Abstract

The present invention provides a conductive adhesive film that stabilizes the adhered state while suppressing fluctuations in resistivity when attached to the skin. [Solution] The conductive adhesive film 10 comprises an adhesive layer 11 that is attached to the skin, a urethane resin layer 12, and a conductive layer 13 located on one of a pair of opposing surfaces of the urethane resin layer 12 and formed from a conductive resin composition. The thickness of the urethane resin layer 12 is 50 μm or less, and the moisture permeability of the conductive adhesive film 10 is 750 g / m². 2 It is a day-old material with a peel strength of 1 N / 25 mm or more, in accordance with JIS Z 0237:2009.

Description

[Technical Field]

[0001] This invention relates to a conductive adhesive film. [Background technology]

[0002] A laminated sheet has been proposed for acquiring biosignals from a target for measurement. The laminated sheet comprises a first layer having adhesive and insulating properties and a second layer having electrical conductivity, with the first layer laminated on the second layer. The first layer has adhesive properties to the clothing worn by the target for measurement. The laminated sheet is used for acquiring biosignals while adhered to the clothing by the first layer so that the laminated sheet can come into contact with the target for acquisition (see, for example, Patent Document 1). [Prior art documents] [Patent Documents]

[0003] [Patent Document 1] International Publication No. 2019 / 073839 [Overview of the Initiative] [Problems that the invention aims to solve]

[0004] Incidentally, from the viewpoint of minimizing deviations in the measurement position on the object being measured, it is preferable that the laminated sheet be directly attached to the skin of the object being measured. However, when the laminated sheet is attached to the skin, sweat trapped between the laminated sheet and the skin acts to peel the laminated sheet away from the skin. Therefore, for laminated sheets attached to the skin, it is desirable to stabilize the attached state while suppressing fluctuations in resistivity in the attached state. [Means for solving the problem]

[0005] A conductive adhesive film for solving the above problems comprises an adhesive layer that is attached to the skin, a urethane resin layer, and a conductive layer located on one of a pair of opposing surfaces of the urethane resin layer and formed from a conductive resin composition. The thickness of the urethane resin layer is 50 μm or less, and the moisture permeability of the conductive adhesive film is 750 g / m². 2 The material is of a certain type (day or longer) and has a peel strength of 1 N / 25 mm or more in accordance with JIS Z 0237:2009.

[0006] According to the above conductive adhesive film, the thickness of the urethane resin layer is 50 μm or less, therefore 750 g / m 2 It is easy to achieve a moisture permeability of more than 1 day, which prevents sweat from accumulating between the conductive adhesive film and the skin. Furthermore, since the peel strength of the conductive adhesive film is 1 N / 25 mm or more, 750 g / m 2 It is possible to provide a conductive adhesive film that is resistant to peeling even under humidity levels of 50 μm or more. In addition, since the thickness of the urethane resin layer is 50 μm or less, the load acting on the urethane resin layer when it is stretched is suppressed, thereby suppressing the increase in resistance in the conductive layer.

[0007] In the conductive adhesive film described above, the thickness of the urethane resin layer may be 15 μm or more and 30 μm or less. The skin to which the conductive adhesive film is applied has a complex curved shape. In this regard, if the thickness of the urethane resin layer is 15 μm or more and 30 μm or less, the conductive adhesive film can easily conform to the shape of the skin and is less likely to peel off.

[0008] In the conductive adhesive film described above, the conductive resin composition may also contain a conductive polymer. With this conductive adhesive film, even if the surface to which it is applied has a complex curved shape, the conductive layer can easily conform to the shape of the skin, and variations in conductivity in the conductive layer can be suppressed.

[0009] In the conductive adhesive film described above, the conductive resin composition may also contain a non-conductive resin and a conductive filler. The conductivity required for the conductive layer varies depending on the device equipped with the conductive adhesive film. When the conductive resin composition contains a non-conductive resin and a conductive filler, it is possible to improve the conformability of the conductive layer by increasing the content of the non-conductive resin in the conductive resin composition, or to improve the conductivity required for the conductive layer by increasing the content of the conductive filler.

[0010] In the conductive adhesive film described above, the thickness of the conductive layer may be thinner than the thickness of the urethane resin layer. Skin has a complex curved shape. In this respect, when the thickness of the conductive layer is thinner than the thickness of the urethane resin layer, the conductive layer can easily conform to the shape of the skin. Furthermore, since the amount of expansion and contraction of the urethane resin layer tends to be dominant in the amount of expansion and contraction of the conductive adhesive film, the effectiveness of suppressing the increase in resistance in the conductive layer is enhanced. [Effects of the Invention]

[0011] According to the present invention, it is possible to stabilize the attached state while suppressing fluctuations in resistivity when attached to the skin. [Brief explanation of the drawing]

[0012] [Figure 1] This is a cross-sectional view showing a schematic structure of a conductive adhesive film according to one embodiment. [Modes for carrying out the invention]

[0013] An embodiment of a conductive adhesive film will be described with reference to Figure 1. As shown in FIG. 1, the conductive adhesive film 10 includes an adhesive layer 11, a urethane resin layer 12, and a conductive layer 13. The adhesive layer 11 is attached to the skin which is the object to be attached with the conductive adhesive film 10. The conductive layer 13 is located between the adhesive layer 11 and the urethane resin layer 12. The conductive layer 13 is formed from a conductive resin composition. The adhesive layer 11 and the urethane resin layer 12 are non-conductive.

[0014] The conductive adhesive film 10 satisfies the following conditions. (Condition 1) The thickness of the urethane resin layer 12 is 50 μm or less. (Condition 2) The water vapor permeability of the conductive adhesive film 10 is 750 g / m 2 ·day or more. (Condition 3) The peel strength conforming to JIS Z 0237:2009 is 1 N / 25 mm or more.

[0015] Since the thickness of the urethane resin layer 12 is 50 μm or less, it is easy to obtain a water vapor permeability of 750 g / m 2 ·day or more, whereby the accumulation of sweat between the conductive adhesive film 10 and the skin is suppressed. Furthermore, since the peel strength of the conductive adhesive film 10 is 1 N / 25 mm or more, it is possible to provide a conductive adhesive film 10 that is difficult to peel off under a water vapor permeability of 750 g / m 2 ·day or more. In addition, since the thickness of the urethane resin layer 12 is 50 μm or less, the load acting on the urethane resin layer during the elongation of the urethane resin layer is suppressed, whereby the increase in resistance in the conductive layer 13 is suppressed.

[0016] The water vapor permeability in Condition 2 is measured by a method conforming to JIS Z 0208-1976 "Test Method for Water Vapor Permeability of Moistureproof Packaging Materials (Cup Method)". The water vapor permeability is the measured value under the conditions of 40°C and a relative humidity of 90%.

[0017] Also, the peel strength under Condition 3 is measured by a method compliant with JIS Z 0237:2009 "Test Methods for Adhesive Tapes and Adhesive Sheets". The peel strength is the peel strength of the conductive adhesive film 10 against a stainless steel test plate. The peel strength of the conductive adhesive film 10 is 1 N / 25 mm or more as described above. It is more preferable that the peel strength of the conductive adhesive film 10 is 3.5 N / 25 mm or more. Thereby, the peeling of the conductive adhesive film 10 from the skin can be further suppressed.

[0018] The thickness of the adhesive layer 11 may be, for example, 5 μm or more and 25 μm or less. The adhesive layer 11 is made of a synthetic resin. The adhesive layer 11 is formed from, for example, a urethane-based resin. The material forming the adhesive layer 11 preferably satisfies the biocompatibility defined in ISO 10993. By forming the adhesive layer 11 from a urethane-based resin, it is possible to obtain an adhesive layer 11 having high moisture permeability.

[0019] The thickness of the urethane-based resin layer 12 may be, for example, 15 μm or more and 30 μm or less. The skin to which the conductive adhesive film 10 is to be applied has a complex curved surface shape. In this regard, if the thickness of the urethane-based resin layer 12 is 15 μm or more and 30 μm or less, the conductive adhesive film 10 can easily follow the shape of the skin and is difficult to peel off.

[0020] The urethane-based resin layer 12 can satisfy at least one of the following conditions. (Condition 4) The tensile elongation at break is 130% or more. (Condition 5) The tensile strength at 100% elongation is 4 N / cm or less.

[0021] The tensile elongation at break under condition 4 can be determined in accordance with JIS K 7161-1:2014 (ISO 527-1) "Plastics - Determination of tensile properties - Part 1: General rules" and JIS K 7127:1999 (ISO 527-3) "Plastics - Test methods for tensile properties - Part 3: Test conditions for films and sheets". If the object to be measured does not have a yield point, the tensile fracture strain is measured; if it has a yield point, the nominal strain at tensile fracture is measured, and the tensile elongation at break can be determined using these measured values.

[0022] The 100% elongation tensile strength under condition 5 is the value obtained by dividing the magnitude of the force measured when the strain, as defined in JIS K 7161-1:2014 (ISO 527-1) "Plastics - Determination of tensile properties - Part 1: General rules", reaches the specified value (100%) by the width of the test specimen. The 100% elongation tensile strength (T) (N / cm) can be calculated using the following formula. T = F / W In the above formula, F is the magnitude of the measured force (N), and W is the width of the test specimen (cm).

[0023] It is preferable that the urethane resin layer 12 satisfies both conditions 4 and 5. This ensures that the urethane resin layer 12 has tensile breaking strength and 100% elongation tensile strength suitable for adhesion to the skin. Therefore, such a urethane resin layer 12 is easy to adhere to the skin. Furthermore, the urethane resin layer 12 stretches well even with small external forces applied to it. As a result, the urethane resin layer 12 can have high conformability to the skin and high adhesion to the skin.

[0024] The urethane resin layer 12 may include any of the following selected from the group consisting of ether-based polyurethane resin, ester-based polyurethane resin, and carbonate-based polyurethane resin. This makes it possible to obtain a urethane resin layer 12 with high bonding suitability and high moisture permeability.

[0025] Ether-based polyurethane resins are polyurethane resins produced using ether-based polyols containing ether bonds (‐O‐). Ester-based polyurethane resins are polyurethane resins produced using ester-based polyols containing ester bonds (‐COO‐). Carbonate-based polyurethane resins are polyurethane resins produced using polyols containing carbonate bonds (‐OC(=O)O‐).

[0026] In the conductive layer 13, the conductive resin composition may include a conductive polymer. In this case, even if the surface to which the adhesive is applied has a complex curved shape, the conductive layer 13 can easily conform to the shape of the skin, and variations in conductivity in the conductive layer 13 can be suppressed. The conductive polymer may be, for example, (3,4-ethylenedioxythiophene):polystyrene sulfonic acid (PEDOT:PSS). The conductive polymer can be light-transmitting and transparent. Therefore, with a conductive resin composition containing a conductive polymer, the color exhibited by the conductive layer 13 does not restrict the applications of the conductive adhesive film 10.

[0027] The conductive resin composition may also contain a non-conductive resin and a conductive filler. The conductivity required for the conductive layer 13 varies depending on the device equipped with the conductive adhesive film 10. When the conductive resin composition contains a non-conductive resin and a conductive filler, it is possible to improve the conformability of the conductive layer 13 by increasing the content of the non-conductive resin in the conductive resin composition, or to improve the conductivity required for the conductive layer 13 by increasing the content of the conductive filler. In other words, when the conductive resin composition contains a non-conductive resin and a conductive filler, it is easy to adjust the conformability and conductivity and other properties of the conductive layer 13.

[0028] The non-conductive resin may be, for example, a thermoplastic resin. Examples of thermoplastic resins include epoxy resins, vinyl chloride-vinyl acetate resins, and polyester resins. The conductive filler may be formed from, for example, nickel, copper, gold, silver, aluminum, zinc, nickel, tin, lead, chromium, platinum, palladium, tungsten, molybdenum, etc. Alternatively, the conductive filler may be formed from an alloy containing two or more of these metals, or from a mixture of these metals. Furthermore, the conductive filler may be formed from a compound of these metals that has good conductivity.

[0029] An example of a conductive resin composition is a conductive ink. Furthermore, if the conductive resin composition is formed solely from a conductive polymer, that is, if the conductive layer 13 is formed solely from a conductive polymer, it is not necessary to ensure uniform dispersibility of the conductive filler. Therefore, it is easy to form a conductive layer 13 with suppressed variations in conductivity within the plane. On the other hand, in applications where it is desirable to have differences in conductivity within the conductive layer 13, it is preferable that the conductive resin composition includes both a non-conductive resin composition and a conductive filler.

[0030] The thickness of the conductive layer 13 may be thinner than the thickness of the urethane resin layer 12. Skin has a complex curved shape. In this respect, when the thickness of the conductive layer 13 is thinner than the thickness of the urethane resin layer 12, the conductive layer 13 can easily conform to the shape of the skin. Also, since the amount of expansion and contraction of the urethane resin layer 12 tends to be dominant in the amount of expansion and contraction of the conductive adhesive film 10, the effectiveness of suppressing the increase in resistance in the conductive layer 13 is enhanced.

[0031] The thickness of the conductive layer 13 may be 10 μm or more. If the thickness of the conductive layer 13 is 10 μm or more, it is possible to satisfy the conductivity required for the conductive layer 13 when it is used as wiring or as an electrode. When viewed from a viewpoint opposite to the plane on which the conductive adhesive film 10 is spread, the conductive layer 13 may have a planar shape along the surface of the urethane resin layer 12 that the conductive layer 13 is in contact with. That is, the conductive layer 13 may be a solid film. Alternatively, when viewed from a viewpoint opposite to the plane on which the conductive adhesive film 10 is spread, the conductive layer 13 may have a predetermined shape. For example, when the conductive layer 13 is used as wiring, the conductive layer 13 may include a portion having a linear shape extending along one direction.

[0032] Furthermore, when viewed from a viewpoint opposite to the plane on which the conductive adhesive film 10 extends, the conductive adhesive film 10 may comprise a separator film covering the urethane resin layer 12 and a protective film covering the adhesive layer 11. The separator film is laminated on the urethane resin layer 12 in a manner that allows for peeling from the urethane resin layer 12. The protective film is laminated on the adhesive layer 11 in a manner that allows for peeling from the adhesive layer 11. Each film comprises, for example, a base material and a release layer located on one surface of the base material. The base material may be a film made of synthetic resin or paper.

[0033] [Examples] Examples and comparative examples are described with reference to Table 1. [Example 1] Polypropylene (PP) laminate release paper (Lintec Corporation, EV130TPD) was prepared as a separator film. Then, an aqueous polyurethane containing an ether-based polyol (Mitsui Chemicals, Inc., Takelac WS-6021) (Takelac is a registered trademark) was coated onto the PP-laminated side of the separator film, and the aqueous polyurethane was dried. Subsequently, the dried aqueous polyurethane was aged at room temperature to obtain a non-conductive urethane resin layer with a thickness of 15 μm.

[0034] A conductive coating containing PEDOT:PSS (Denatron PT-436, manufactured by Nagase ChemteX Co., Ltd.) (Denatron is a registered trademark) was applied to a urethane resin layer, and then the conductive coating was dried together with the substrate to form a conductive layer with a thickness of 10 μm. In this process, the conductive coating was applied to the entire surface of one side of the urethane resin layer.

[0035] A protective film (Therapiel WZ, manufactured by Toray Film Processing Co., Ltd.) (Therapiel is a registered trademark) with a thickness of 38 μm was prepared, comprising a PET film and a release layer formed on the PET film. A urethane-based adhesive (Ciabein SP-205, manufactured by Toyo Chem Co., Ltd.) (Ciabein is a registered trademark) and a curing agent (T-501B, manufactured by Toyo Chem Co., Ltd.) were prepared as the main component. The curing agent was then added to the main component so that the ratio of the number of moles of isocyanate groups (Mh) in the curing agent to the number of moles of hydroxyl groups (Mm) in the main component (Mh / Mm) was 0.13. After stirring the main component with the added curing agent, a coating solution for forming an adhesive layer was obtained. In the following, the ratio of the number of moles of isocyanate groups in the curing agent to the number of moles of hydroxyl groups in the main component will also be referred to as the molar ratio of the main component to the curing agent. An adhesive layer with a thickness of 15 μm was obtained by applying a coating solution to the release layer of a protective film and then drying the coating solution.

[0036] Then, a laminate was obtained by bonding an adhesive layer to the conductive layer. Next, after aging the laminate in an environment of 40°C, the conductive adhesive film of Example 1 was obtained by peeling off the separator film from the urethane resin layer.

[0037] [Comparative Example 1] A conductive adhesive film of Comparative Example 1 was obtained by the same method as in Example 1, except that the molar ratio of the main component to the curing agent was changed to 0.25.

[0038] [Example 2] The conductive adhesive film of Example 2 was obtained by the same method as in Example 1, except that the thickness of the urethane resin layer was changed to 30 μm.

[0039] [Example 3] The conductive adhesive film of Example 3 was obtained by the same method as in Example 1, except that the thickness of the urethane resin layer was changed to 50 μm.

[0040] [Comparative Example 2] A conductive adhesive film of Comparative Example 2 was obtained by the same method as in Example 1, except that the thickness of the urethane resin layer was changed to 100 μm.

[0041] [Comparative Example 3] A conductive adhesive film for Comparative Example 3 was obtained by the same method as in Example 1, except that the urethane resin layer was replaced with a polyethylene terephthalate (PET) film (FE2001, manufactured by Futamura Chemical Co., Ltd.) having a thickness of 12 μm.

[0042] [Comparative Example 4] A conductive adhesive film of Comparative Example 4 was obtained by the same method as in Example 1, except that the urethane resin layer in the conductive film of Example 1 was replaced with a biaxially oriented polypropylene (OPP) film (manufactured by Futamura Chemical Co., Ltd., FOS) having a thickness of 40 μm.

[0043] [Evaluation Method] [Moisture permeability] The moisture permeability of the conductive adhesive film was measured according to the method specified in JIS Z 0208-1976 "Test Method for Moisture Permeability of Moisture-Proof Packaging Materials (Cup Method)". For the moisture permeability measurement, anhydrous calcium chloride was placed in a moisture permeability cup as a desiccant. Next, the initial weight of the moisture permeability cup containing the desiccant was measured using an electronic balance. Then, with the moisture permeability cup sealed with the conductive adhesive film, it was left in an environment of 40°C and 90% relative humidity for 2 hours, and the post-test weight of the moisture permeability cup was measured. The increase in the post-test weight relative to the initial weight of the moisture permeability cup was then calculated as the amount of water vapor transmitted.

[0044] [Electrical resistance] A test specimen with a width of 15 mm and a length of 120 mm was cut from a conductive adhesive film. The electrical resistance (Ω / □) of the test specimen was then measured using a low resistivity meter (Loresta-GP MCP-T610, manufactured by Mitsubishi Chemical Analytec Corporation) (Loresta is a registered trademark).

[0045] Next, the tensile testing machine (Shimadzu Corporation, Autograph AGS-X load cell 1kN) was used to clamp the test specimen at two points aligned along its length, ensuring that the distance between the chucks was 50mm, while the specimen remained unbending. The specimen was then pulled at a speed of 50mm / min until the tensile elongation in the length direction reached 10%, i.e., until the displacement of the chucks reached 5mm.

[0046] Subsequently, the electrical resistance (Ω / □) of the specimen after stretching was measured using the same method as before stretching. Then, the ratio of the increase in electrical resistance after stretching was calculated, with the electrical resistance before stretching set to 1.

[0047] [Peel strength] The peel strength of a conductive adhesive film was measured according to the method specified in "Method 1: 180° peel strength from a test plate" of JIS Z 0237:2009 "Test methods for adhesive tapes and adhesive sheets". A test piece with a width of 25 mm was cut from the conductive adhesive film. After peeling the protective film from the adhesive layer, the adhesive layer was attached to a stainless steel test plate. Next, a load was applied to the test piece by passing a roller with a weight of 2 kg back and forth twice, and the test piece was left to stand for at least 30 minutes. After that, the peel strength was measured using a tensile testing machine (Shimadzu Corporation, Autograph AGS-X, load cell 1kN) at a peeling speed of 300 mm / min and when the test piece was peeled 180° from the stainless steel test plate.

[0048] [Suitability for application] A test piece with a size of 5 cm square was cut out from the conductive adhesive film. After the test piece was attached to the arm of the subject for 5 days, the state of the test piece was confirmed. Then, the adhesion suitability of the test piece was evaluated in the following two steps.

[0049] ○ The skin did not get stuffy, and the test piece did not peel off from the skin. × At least one of skin stuffiness and peeling of at least a part of the test piece was observed.

[0050] [Evaluation Results] The evaluation results of moisture permeability, electrical resistance, peel strength, and adhesion suitability were as shown in Table 1 below.

[0051] [Table 1]

[0052] As shown in Table 1, the moisture permeability of the conductive adhesive film was 840 g / m 2 ·day in Example 1, 825 g / m 2 ·day in Comparative Example 1, 786 g / m 2 ·day in Example 2, and 752 g / m 2 ·day in Example 3. It was also found that the moisture permeability of the conductive adhesive film was 485 g / m 2 ·day in Comparative Example 2, 60 g / m 2 ·day in Comparative Example 3, and 82 g / m 2 ·day in Comparative Example 4. That is, it was found that the moisture permeability of the conductive adhesive films of Example 1, 2, 3, and Comparative Example 1 was 750 g / m 2 ·day or more. In contrast, it was found that the moisture permeability of the conductive adhesive films of Comparative Examples 2, 3, and 4 was less than 750 g / m 2 ·day.

[0053] The increase ratio of electrical resistance in the conductive adhesive film was 1.8 in Example 1 and Comparative Example 1, 2.0 in Example 2, and 2.2 in Example 3. Furthermore, the increase ratio of electrical resistance in the conductive adhesive film was 3.5 in Comparative Example 2, 1.6 in Comparative Example 3, and 2.6 in Comparative Example 4.

[0054] The peel strength of the conductive adhesive film was found to be 3.5 N / 25 mm in Example 1, 0.8 N / 25 mm in Comparative Example 1, 3.6 N / 25 mm in Example 2, and 3.8 N / 25 mm in Example 3. Furthermore, the peel strength of the conductive adhesive film was found to be 4.1 N / 25 mm in Comparative Example 2, 5.1 N / 25 mm in Comparative Example 3, and 3.6 N / 25 mm in Comparative Example 3.

[0055] When the adhesion suitability of the conductive adhesive film to the skin was evaluated, it was found that the adhesion suitability of Examples 1, 2, and 3 was "○", while the adhesion suitability of Comparative Examples 1, 2, 3, and 4 was "×". In other words, neither dampness due to skin perspiration nor peeling of the test piece was observed in Examples 1, 2, and 3. In contrast, in Comparative Example 1, while no dampness of the skin was observed, a part of the test piece peeled off the skin. Also, in Comparative Examples 2, 3, and 4, while no peeling of the test piece was observed, dampness of the skin was observed. In particular, in Comparative Examples 3 and 4, it was found that the amount of moisture trapped between the skin and the test piece was greater compared to Comparative Example 2.

[0056] As described above, according to one embodiment of the conductive adhesive film, the following effects can be obtained. (1) In a conductive adhesive film 10 having high moisture permeability to the extent that sweat does not accumulate between the conductive adhesive film 10 and the skin, it is possible to provide a conductive adhesive film 10 that is difficult to peel off. In addition, the increase in resistance in the conductive layer 13 is also suppressed.

[0057] (2) If the thickness of the urethane resin layer 12 is 15 μm or more and 30 μm or less, the conductive adhesive film 10 will conform to the shape of the skin and will not peel off easily. (3) When the conductive resin composition contains a conductive polymer, the conductive layer 13 can easily conform to the shape of the skin, and variations in conductivity in the conductive layer 13 can be suppressed.

[0058] (4) When the conductive resin composition includes a non-conductive resin and a conductive filler, it is easy to adjust the properties of the conductive layer 13, such as its conformability and conductivity. (5) When the thickness of the conductive layer 13 is thinner than the thickness of the urethane resin layer 12, the effectiveness of suppressing the increase in resistance in the conductive layer 13 is enhanced.

[0059] The above-described embodiment can be implemented with the following modifications. [Conductive layer] The conductive layer 13 may be thicker than the urethane resin layer 12. Even in this case, the conductive adhesive film 10 can satisfy the above-mentioned conditions 1, 2, and 3, thereby achieving the effects similar to those described in (1).

[0060] The conductive layer 13 may be located on the side of the urethane resin layer 12 opposite to the side facing the adhesive layer 11. In this case, the urethane resin layer 12 is located between the conductive layer 13 and the adhesive layer 11. In other words, the conductive layer 13 may be located on either of the pair of opposing sides of the urethane resin layer 12.

[0061] [Urethane resin] The thickness of the urethane resin layer 12 may be less than 15 μm or thicker than 30 μm. Even in this case, the conductive adhesive film 10 can satisfy the above-mentioned conditions 1, 2, and 3, thereby achieving the effects similar to those described in (1). [Explanation of Symbols]

[0062] 10... Conductive adhesive film 11…Adhesive layer 12…Urethane resin layer 13…Conductive layer

Claims

1. An adhesive layer that can be attached to the skin, A urethane resin layer, A conductive adhesive film comprising: a conductive layer located on one of a pair of opposing surfaces of the urethane resin layer and formed from a conductive resin composition, The thickness of the urethane resin layer is 50 μm or less. The moisture permeability of the conductive adhesive film is 750 g / m². ２ ・day, The peel strength conforming to JIS Z 0237:2009 is 1 N / 25 mm or higher. Conductive adhesive film.

2. The thickness of the urethane resin layer is 15 μm or more and 30 μm or less. The conductive adhesive film according to claim 1.

3. The conductive resin composition includes a conductive polymer. A conductive adhesive film according to claim 1 or 2.

4. The conductive resin composition comprises a non-conductive resin and a conductive filler. A conductive adhesive film according to claim 1 or 2.

5. The thickness of the conductive layer is thinner than the thickness of the urethane resin layer. A conductive adhesive film according to any one of claims 1 to 4.

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