PCB processing system

Abstract

A substrate processing system is provided that allows for reliable parameter setting without causing configuration errors. [Solution] The substrate processing system is connected between multiple control devices and includes a communication network for sending and receiving parameters related to the operating conditions of devices between the multiple control devices.

Description

Technical Field

[0001] The present invention relates to a substrate processing system.

Background Art

[0002] Substrate processing apparatuses for processing substrates such as wafers are known. In such substrate processing apparatuses, wafers are transported to various modules and processed in each module. Each module is equipped with various devices such as motors, sensors, and fluid control devices.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0004] In such various devices, it is necessary to set parameters for determining the operating conditions of the devices according to the purpose of use. Generally, there is a method in which an operator operates buttons attached to individual devices to set the parameters.

[0005] However, in such a method, not only does it take a great deal of time to set the parameters, but there is also a risk of causing setting errors (for example, incorrect input or forgetting to input). In this case, since the device does not operate normally, it is necessary to reset the parameters. As a result, there is a risk of causing the overall downtime of the substrate processing apparatus.

[0006] Therefore, an object of the present invention is to provide a substrate processing system capable of reliably setting parameters without causing setting errors. [Means for solving the problem]

[0007] In one embodiment, a substrate processing system is provided that comprises a plurality of substrate processing devices. Each of the plurality of substrate processing devices comprises a control device, a device for operating a module or detecting the operation of the module, and a fieldbus for electrically connecting the control device and the device. The substrate processing system comprises a communication network connected between the plurality of control devices, including the control device, for sending and receiving parameters relating to the operating conditions of the device between the plurality of control devices.

[0008] In one embodiment, if, among a plurality of devices including the aforementioned device, the device that serves as the basis for setting the parameter is defined as the setting basis device, and the device that is subject to the change in the setting of the parameter is defined as the device to be changed, the control device displays at least one matching source parameter corresponding to the setting basis device and at least one matching target parameter corresponding to the device to be changed. In one embodiment, the control device compares the source parameter with the target parameter, and if the source parameter and the target parameter do not match, it reflects the selected source parameter in the target parameter. In one embodiment, the control device reflects the selected source parameter in the target parameter and then checks whether the target parameter matches the source parameter. In one embodiment, the substrate processing system is configured to transmit and receive the parameters via Ethernet communication as the communication network, and to transmit and receive the parameters via EtherCAT communication as the fieldbus.

[0009] In one embodiment, a substrate processing system is provided that includes a substrate processing apparatus. The substrate processing apparatus comprises a control device, a device for operating a module or detecting the operation of the module, and a fieldbus electrically connecting the control device and the device. The substrate processing system also comprises a data management device electrically connected to the control device, and a communication network for transmitting and receiving parameters relating to the operating conditions of the device between the control device and the data management device. The data management device is configured to manage the parameters stored internally in a modifiable manner.

[0010] In one embodiment, the data management device displays setting parameters for setting the operating conditions of the device and device parameters stored in the device. In one embodiment, the data management device compares the setting parameter with the device parameter, and if the setting parameter and the device parameter do not match, it adjusts the device parameter to match the setting parameter. In one embodiment, the data management device matches the device parameters to the setting parameters, and then checks whether the device parameters match the setting parameters.

[0011] In one embodiment, when the device is replaced, the data management device transfers the parameters corresponding to the device to be replaced, which are stored internally, to the new device. In one embodiment, the substrate processing system comprises a plurality of substrate processing devices, including the substrate processing device, and the data management device individually manages a plurality of parameters relating to the operating conditions of the devices included in each of the plurality of substrate processing devices. In one embodiment, the substrate processing system is configured to transmit and receive the parameters via Ethernet communication as the communication network, and to transmit and receive the parameters via EtherCAT communication as the fieldbus. [Effects of the Invention]

[0012] A substrate processing system equipped with a communication network can transmit and receive parameters among a plurality of control devices. With such a configuration, an operator does not need to manually set the parameters. As a result, the substrate processing system can surely set the parameters without causing setting errors.

[0013] A substrate processing system equipped with a communication network can transmit and receive parameters between a control device and a data management device. With such a configuration, an operator does not need to manually set the parameters. As a result, the substrate processing system can surely set the parameters without causing setting errors.

Brief Description of the Drawings

[0014] [Figure 1] It is a diagram showing one embodiment of a substrate processing system. [Figure 2] It is a diagram showing one embodiment of a substrate processing apparatus. [Figure 3] It is a diagram showing one embodiment of a polishing module in a polishing section. [Figure 4] It is a diagram showing one embodiment of a cleaning module. [Figure 5] It is a diagram showing one embodiment of a temporary placement table. [Figure 6] It is a diagram showing an operation screen of a control device. [Figure 7A] It is a diagram showing the operation flow of an operation screen when reflecting a collation source parameter to a collation destination parameter. [Figure 7B] It is a diagram showing the operation flow of an operation screen when reflecting a collation source parameter to a collation destination parameter. [Figure 7C] It is a diagram showing the operation flow of an operation screen when reflecting a collation source parameter to a collation destination parameter. [Figure 7D] It is a diagram showing the operation flow of an operation screen when reflecting a collation source parameter to a collation destination parameter. [Figure 7E]It is a diagram showing the operation flow of an operation screen when reflecting the comparison source parameters in the comparison destination parameters. [Figure 7F] It is a diagram showing the operation flow of an operation screen when reflecting the comparison source parameters in the comparison destination parameters. [Figure 8] It is a diagram showing the processing flow of a control device when reflecting the comparison source parameters in the comparison destination parameters. [Figure 9] It is a diagram showing the processing flow of a control device when reflecting setting parameters in device parameters in one substrate processing apparatus. [Figure 10] It is a diagram showing the processing flow of a control device for managing firmware information. [Figure 11] It is a diagram showing another embodiment of a substrate processing system. [Figure 12] It is a diagram showing another embodiment of a substrate processing system.

Embodiments for Carrying Out the Invention

[0015] Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the drawings described below, the same or corresponding components are denoted by the same reference numerals, and redundant explanations are omitted. In the following plurality of embodiments, the configuration of one embodiment not particularly described is the same as that of other embodiments, so the redundant explanations thereof are omitted.

[0016] FIG. 1 is a diagram showing an embodiment of a substrate processing system. FIG. 2 is a diagram showing an embodiment of a substrate processing apparatus. As shown in FIG. 1, the substrate processing system includes a plurality of substrate processing apparatuses SPA. As an example, the substrate processing apparatus SPA is a polishing apparatus for polishing a substrate.

[0017] As shown in FIG. 2, the substrate processing apparatus SPA includes a substantially rectangular housing 1. The inside of the housing 1 is partitioned by partition walls 1a and 1b into a load / unload section 2, a polishing section 3, and a cleaning section 4.

[0018] The substrate processing apparatus (SPA) includes a control device 5 that controls the substrate processing operation. The control device 5 includes a storage device 5a that stores a program and a processing device 5b that performs calculations according to the program. The control device 5, which is composed of a computer, operates according to the program electrically stored in the storage device 5a.

[0019] The load / unload section 2 includes two or more (four in this embodiment) front load sections 20 on which wafer cassettes for stocking a large number of wafers W (substrates) are placed. A travel mechanism 21 is laid out in the load / unload section 2 along the arrangement direction of the front load sections 20, and two transport robots (loaders) 22 that can move along the arrangement direction of the wafer cassettes are installed on this travel mechanism 21.

[0020] The polishing section 3 is the region where the wafer W is polished (planarized), and it comprises a first polishing module 3A, a second polishing module 3B, a third polishing module 3C, and a fourth polishing module 3D.

[0021] As shown in Figure 2, the first polishing module 3A includes a polishing table 30A to which a polishing pad 10 having a polishing surface is attached, a top ring 31A for holding a wafer W and polishing the wafer W while pressing it against the polishing pad 10 on the polishing table 30A, a polishing fluid supply nozzle 32A for supplying polishing fluid and dressing fluid (e.g., pure water) to the polishing pad 10, a dresser 33A for dressing the polishing surface of the polishing pad 10, and an atomizer 34A for spraying a mixed fluid of liquid (e.g., pure water) and gas (e.g., nitrogen gas) or liquid (e.g., pure water) in a mist onto the polishing surface. The second polishing modules 3B to the fourth polishing modules 3D have the same components as the first polishing module 3A.

[0022] A transport mechanism for transporting wafers W will now be described. As shown in Figure 2, the substrate processing apparatus SPA includes a first linear transporter 6 positioned adjacent to the first polishing module 3A and the second polishing module 3B. The first linear transporter 6 is a mechanism for transporting wafers W between four transport positions (first transport position TP1, second transport position TP2, third transport position TP3, and fourth transport position TP4) along the alignment direction of the polishing modules 3A and 3B.

[0023] The substrate processing apparatus SPA includes a second linear transporter 7 positioned adjacent to the third polishing module 3C and the fourth polishing module 3D. The second linear transporter 7 is a mechanism for transporting wafers W between three transport positions (fifth transport position TP5, sixth transport position TP6, and seventh transport position TP7) along the alignment direction of the polishing modules 3C and 3D.

[0024] A lifter 11 is positioned at the first transport position TP1 to receive the wafer W from the transport robot 22. The wafer W is transferred from the transport robot 22 to the first linear transporter 6 via the lifter 11.

[0025] A swing transporter 12 is positioned between the first linear transporter 6, the second linear transporter 7, and the cleaning unit 4. The swing transporter 12 has a hand that can move between the fourth transport position TP4 and the fifth transport position TP5. The transfer of wafers W from the first linear transporter 6 to the second linear transporter 7 is performed by the swing transporter 12.

[0026] The wafers W polished in the polishing section 3 are transported to the cleaning section 4 via a temporary storage table by a swing transporter 12. The cleaning section 4 is divided into a first cleaning chamber 190, a first transport chamber 191, a second cleaning chamber 192, a second transport chamber 193, and a drying chamber 194. Inside the first cleaning chamber 190 are an upper primary cleaning module 201A and a lower primary cleaning module 201B arranged along the vertical direction.

[0027] The upper primary cleaning module 201A is positioned above the lower primary cleaning module 201B. Similarly, within the second cleaning chamber 192, the upper secondary cleaning module 202A and the lower secondary cleaning module 202B are arranged along the longitudinal direction.

[0028] The drying chamber 194 contains an upper drying module 205A and a lower drying module 205B arranged vertically. The first transport chamber 191 contains a first transport robot 209 that can move up and down, and the second transport chamber 193 contains a second transport robot 210 that can move up and down. The first transport robot 209 and the second transport robot 210 are freely movable up and down.

[0029] Figure 3 shows one embodiment of a polishing module in the polishing section. Hereinafter, the first polishing module 3A, the second polishing module 3B, the third polishing module 3C, and the fourth polishing module 3D may be collectively referred to as polishing module 3.

[0030] As shown in Figure 3, the polishing table 30 is located below the top ring 31, and the polishing fluid supply nozzle 32 is located above the polishing pad 10 which is attached to the upper surface of the polishing table 30.

[0031] The top ring 31 is connected to the top ring drive shaft 211. The top ring drive shaft 211 is connected (indirectly) to the top ring air cylinder 111, which is fixed to the top ring head 110.

[0032] The top ring air cylinder 111 moves the top ring drive shaft 211 up and down, raising and lowering the entire top ring 31. The top ring air cylinder 111 is configured to press the top ring 31 against the polishing table 30 by lowering the top ring 31.

[0033] The top ring air cylinder 111 is connected to the compressed air source 120 via a regulator RE1. The regulator RE1 is configured to adjust the pressure of the compressed air supplied to the top ring air cylinder 111.

[0034] The top ring drive shaft 211 is connected to the rotating cylinder 112 via a key (not shown). The rotating cylinder 112 has a timing pulley 113 formed on its outer circumference. A top ring motor 114 is fixed to the top ring head 110. The timing pulley 113 is connected to a timing pulley 116 which is connected to the top ring motor 114 via a timing belt 115.

[0035] The top ring 31 has multiple pressure chambers (not shown). These multiple pressure chambers are connected to the compressed air source 120 via regulators RE2 to RE6. Therefore, regulators RE2 to RE6 are configured to adjust the pressure of the compressed air supplied to each of the multiple pressure chambers of the top ring 31.

[0036] Some of the multiple pressure chambers are connected to a vacuum source 121. Therefore, when the vacuum source 121 is driven, a vacuum is formed in the pressure chambers connected to the vacuum source 121. A communication hole is formed on the lower surface of this pressure chamber. Therefore, the wafer W in contact with the lower surface of the pressure chamber is attracted to the top ring 31.

[0037] During the polishing of the wafer W, with the wafer W released from suction, the top ring 31 holds the wafer W on its lower surface, and the control device 5 operates the top ring air cylinder 111. Furthermore, the control device 5 operates the compressed air source 120 to supply compressed air to the pressure chamber, pressing the wafer W against the polishing pad 10. By supplying polishing liquid Q onto the polishing pad 10 from the polishing liquid supply nozzle 32, the wafer W is polished with the polishing liquid Q present between the surface of the wafer W to be polished and the polishing pad 10.

[0038] The polishing module 3 is located inside the polishing table 30 and includes an eddy current sensor 322 for detecting the thickness of the wafer W, and a thickness measuring device 200 connected to the eddy current sensor 322 for measuring the thickness of the wafer W. The thickness measuring device 200 is electrically connected to a control device 5, which is configured to acquire the thickness of the wafer W measured by the thickness measuring device 200.

[0039] When the eddy current sensor 322 detects the film thickness of the wafer W, the film thickness measuring device 200 measures the film thickness of the wafer W. The control device 5 controls the polishing of the wafer W based on the film thickness of the wafer W measured by the film thickness measuring device 200. When the film thickness of the wafer W reaches a predetermined thickness, the control device 5 terminates the polishing of the wafer W.

[0040] Figure 4 shows one embodiment of the cleaning module. In the embodiment shown in Figure 4, the configuration of cleaning module 201A (and cleaning module 202A) will be described. In one embodiment, cleaning module 201B (and cleaning module 202B) may have the same configuration as cleaning module 201A (and cleaning module 202A). Hereinafter, cleaning module 201A and cleaning module 202A may be collectively referred to as cleaning module 201.

[0041] As shown in Figure 4, the cleaning module 201 includes a spin chuck 40 that rotates the wafer W while holding the polished wafer W, a roll sponge 41 that rotates around an axis parallel to the surface of the wafer W, a cleaning liquid nozzle 42 that supplies cleaning liquid to the surface of the wafer W to be cleaned, and a support drive device 43 that rotates the roll sponge 41.

[0042] When the control device 5 operates the support drive device 43, the roll sponge 41 is configured to rotate and clean the surface of the wafer W by rubbing it. Furthermore, when the control device 5 operates the spin chuck 40, the spin chuck 40 is configured to rotate while supporting the outer circumferential surface of the wafer W, thereby rotating the wafer W.

[0043] Figure 5 shows one embodiment of a temporary storage stand. The substrate processing apparatus SPA includes an optical sensor 302 for detecting the presence or absence of a wafer W transported to the temporary storage stand 180, and a mounting stage 300 for placing the wafer W.

[0044] The light sensor 302 comprises a light-emitting unit 302a that emits light and a light-receiving unit 302b that receives the light emitted from the light-emitting unit 302a. The light sensor 302 is electrically connected to the control device 5. The control device 5 is configured to control the light-emitting operation of the light sensor 302 (more specifically, the light-emitting unit 302a) (i.e., the start and stop of light irradiation).

[0045] When the light receiving unit 302b receives light emitted from the light emitting unit 302a, the light receiving unit 302b is configured to send a detection signal to the control device 5. When the control device 5 receives the detection signal from the light receiving unit 302b, the control device 5 determines that the wafer W is not present on the mounting stage 300. Based on the cessation of the transmission of the detection signal, the control device 5 determines that the wafer W has been placed on the mounting stage 300.

[0046] Returning to Figure 1, the substrate processing system comprises a communication network CN that electrically connects multiple substrate processing devices SPA, and a data management device MD that is electrically connected to each of the multiple substrate processing devices SPA. The data management device MD is connected to the substrate processing devices SPA by a different communication network CN than the communication network CN that connects the multiple substrate processing devices SPA.

[0047] Hereinafter, in this specification, the polishing module 3, the cleaning module 201, and the drying module 205 may be collectively referred to as module ML. Module ML is configured to process wafer W and includes the device DV necessary for processing wafer W.

[0048] Device DVs are configured to operate or detect the operation of module MLs. Examples of device DVs include actuators such as motors (more specifically, drivers, amplifiers, etc.) and sensors (e.g., pressure sensors, flow sensors, optical sensors, etc.). An example of a device DV in a substrate processing apparatus (SPA) is as follows:

[0049] Polishing module 3, as an example of device DV, includes a top ring motor 114, regulators RE1 to RE6, a motor (not shown) for rotating the polishing table 30, and an eddy current sensor 322.

[0050] The cleaning module 201 includes, as an example of a device DV, a motor (not shown) that operates the spin chuck 40 and a support drive device 43. The device DV may also be an optical sensor 302 placed on the temporary stand 180 or various sensors (e.g., pressure sensor, temperature sensor, flow sensor, etc.) placed on each module ML.

[0051] The communication network CN is configured to send and receive data between multiple substrate processing units (SPAs). The communication network CN can be, for example, Ethernet® communication, wired communication, or wireless communication (e.g., Wi-Fi® or Bluetooth®).

[0052] The data transmitted and received includes, in particular, parameters related to the operating conditions of the device DV. These parameters correspond to settings that allow the device DV to operate in a manner suitable for the operating environment of the substrate processing apparatus (SPA).

[0053] For example, if device DV is a motor, the parameters would correspond to gain settings for adjusting the motor's response performance and control accuracy, or conditions for determining the motor's rotation direction. For example, if device DV is a sensor, the parameters would correspond to setting values ​​for determining the sensor's detection conditions or thresholds for triggering alarms.

[0054] As shown in Figure 1, the substrate processing apparatus SPA is equipped with a fieldbus (i.e., field network) FB that electrically connects the control device 5 and the device DV. The control device 5 is equipped with a communication controller 5c that enables the transmission and reception of data with the device DV via the fieldbus FB (see Figure 2).

[0055] The fieldbus FB connects the communication controller 5c of the control device 5 to devices DV such as actuators and sensors, enabling the transmission and reception of data (especially parameters). Examples of fieldbus FB include EtherCAT® communication and IO-Link® communication, which offer high real-time performance.

[0056] As mentioned above, the parameters of the device DV must be set according to its intended use. However, manually setting the parameters by an operator is time-consuming and prone to errors. Therefore, a board processing system can reliably set the parameters without causing errors. The detailed configuration of the board processing system is described below.

[0057] The substrate processing system is configured to send and receive parameters between multiple control devices 5 mounted on multiple substrate processing devices (SPAs) via a communication network CN. More specifically, a control device 5 can not only read the parameters of the substrate processing device SPA to which it belongs, but also read the parameters of other substrate processing devices SPA connected by the communication network CN. Furthermore, a control device 5 can rewrite the parameters of other substrate processing devices SPA.

[0058] As shown in Figure 1, the control device 5 stores a configuration parameter storage database and / or configuration parameter definition files internally, and is configured to send and receive the configuration parameter storage database and / or configuration parameter definition files via the communication network CN.

[0059] Configuration parameters are parameters used to set the operating conditions of the device DV. The configuration parameter storage database is a database for centrally managing configuration parameters, and it stores not only the current configuration parameters but also the history (data) of past configuration parameters. Therefore, by accessing the configuration parameter storage database, operators can check not only the current configuration parameters but also past configuration parameters.

[0060] The configuration parameter definition file is a file that compiles documented configuration parameters. By creating a configuration parameter definition file, the control device 5 can document the configuration parameters. The documented configuration parameters can be transmitted and received offline between multiple control devices 5 via the communication network CN.

[0061] The control unit 5 and the device DV are electrically connected by a fieldbus FB. Therefore, the control unit 5 transfers (writes) the configuration parameters stored inside it to the device DV via the fieldbus FB. By transferring the configuration parameters to the device DV, the device DV stores the configuration parameters.

[0062] The parameters stored in the device DV are called device parameters. The control unit 5 reads the device parameters from the device DV via the fieldbus FB. The control unit 5 can store the device parameters read from the device DV.

[0063] Figure 6 shows the operation screen of the control device. Each of the multiple control devices 5 has a monitor (not shown) that displays the operation screen shown in Figure 6, and the operation screen is displayed on this monitor.

[0064] The operation screen has a read button B1 for reading parameters. When the operator selects the read button B1 (for example, by clicking it with the mouse), the data (history) stored in the setting parameter storage database and / or the device parameters stored in the device DV are read.

[0065] The operation screen has a list image G1 that displays a list of device DVs connected to module ML and a set of parameters for each device DV. The operator can quickly grasp the list of device DVs and their parameters through the list image G1. The parameter set refers to a group of classified parameters, such as condition parameters and calibration parameters.

[0066] Furthermore, the operation screen includes a selection image G2a for selecting the parameters to be transferred, and a parameter name display image G2b that displays the names of each parameter belonging to the parameter group. The selectable parameters displayed in the selection image G2a and the parameters displayed in the parameter name display image G2b correspond to each other.

[0067] Hereinafter, in this specification, among multiple device DVs, the device DV that serves as the basis for setting parameters is defined as the "setting basis device," and the device DVs that are subject to parameter setting changes (excluding the setting basis device) are defined as the "devices to be changed."

[0068] The operation screen includes a source parameter display image G2c that displays the source parameters corresponding to the setting reference device, and a target parameter display image G2d that displays the target parameters corresponding to the device to be changed.

[0069] The source parameter display image G2c and the target parameter display image G2d are placed adjacent to each other, and the numerical values ​​of each parameter have a corresponding relationship. Therefore, the operator can quickly identify matching and mismatching parameters.

[0070] When the operator selects the read button B1 (for example, by clicking it with the mouse), the control device 5 displays the numerical value of the setting parameter of the setting reference device stored internally, or the numerical value of the device parameter read from the setting reference device, on the source parameter display image G2c.

[0071] When the operator selects the read button B1, the control device 5 displays the target parameter of the device to be changed on the target parameter display image G2d. More specifically, the control device 5 displays the numerical value of the setting parameter of the device to be changed stored internally, or the numerical value of the device parameter read from the device to be changed, on the target parameter display image G2d.

[0072] In the embodiment shown in Figure 6, the control device 5 displays multiple (eight in this embodiment) source parameters and multiple (eight in this embodiment) target parameters. However, the control device 5 does not necessarily need to display multiple source parameters and target parameters. The control device 5 may display at least one source parameter and at least one target parameter.

[0073] As shown in Figure 6, the operation screen has a comparison button B3 for comparing the source parameter and the target parameter. When the operator selects the comparison button B3, the control device 5 compares the source parameter displayed in the source parameter display image G2c with the target parameter displayed in the target parameter display image G2d.

[0074] Figures 7A to 7F show the operation flow of the operation screen when reflecting the source parameters to the target parameters. Figure 8 shows the processing flow of the control device when reflecting the source parameters to the target parameters. In the embodiment shown in Figure 8, the processing flow when sending and receiving parameters between multiple substrate processing devices will be described.

[0075] As shown in step 1 of Figure 7A and step S101 of Figure 8, the control device 5 automatically reads the reference parameters of the setting reference device in a predetermined substrate processing apparatus SPA (first substrate processing apparatus SPA) and displays the reference parameters in the reference parameter display image G2c. Note that the devices of the substrate processing apparatus SPA (and module ML) corresponding to the setting reference device are pre-configured.

[0076] As shown in step 2 of Figure 7B and step S102 of Figure 8, when the operator selects the read button B1, the control device 5 reads the target parameters of the device to be changed in a different substrate processing device SPA (second substrate processing device SPA) from the first substrate processing device SPA, and displays the target parameters in the target parameter display image G2d. Note that the devices of the substrate processing device SPA (and module ML) corresponding to the device to be changed are pre-configured.

[0077] In the embodiment shown in Figure 8, the source parameter displayed in the source parameter display image G2c is a setting parameter, but the source parameter may also be a device parameter. The target parameter displayed in the target parameter display image G2d is a setting parameter, but the target parameter may also be a device parameter.

[0078] As shown in steps S103 and S104 of Figure 8, the control device 5 compares the source parameter and the target parameter and determines whether the matching results of the source parameter and the target parameter match. If the matching results match perfectly, that is, if all the source parameters and target parameters match (see "YES" in step S104), the control device 5 terminates the processing flow.

[0079] If the matching results do not match, that is, if at least one of the source parameter and the target parameter does not match (see "NO" in step S104), the control device 5 decides whether or not to reflect the mismatched source parameter in the target parameter (see step S105).

[0080] At this time, the control device 5 may visualize target parameters that differ from the source parameters (see the shaded area in step 2 of Figure 7B). When reflecting mismatched source parameters in target parameters (see "YES" in step S105), the operator can arbitrarily select the source parameters to be reflected from among the multiple selection items (e.g., checkboxes) displayed on the selection image G2a (e.g., by placing a check mark on the checkbox) (see step 3-1 in Figure 7C).

[0081] The operator may select only the options corresponding to the mismatched source parameters (see step 3-2 in Figure 7D), or they may select all options (see step 3-3 in Figure 7E).

[0082] As shown in Figure 6, the operation screen has a write button B2 for reflecting the selected source parameter to the corresponding target parameter. After the operator selects the source parameter to be reflected, when the operator selects the write button B2, the control device 5 displays a pop-up screen to confirm the source parameter to be reflected (see step 4 in Figure 7F). Once the operator confirms on the pop-up screen that the source parameter to be reflected is correct, the control device 5 determines the source parameter to be reflected (see step S106).

[0083] After step S106, the control device 5 rewrites the target parameter so that the target parameter matches the source parameter (see step S107). If the control device 5 determines the setting parameter of the device to be changed as the target parameter, the control device 5 transfers the source parameter to the control device 5 acting as the higher-level controller of the device to be changed via the communication network CN, and rewrites the setting parameter of the control device 5.

[0084] Subsequently, the control device 5, acting as a higher-level controller for the device to be modified, may transfer the source parameters to the device to be modified via the fieldbus FB and rewrite the device parameters of the device to be modified.

[0085] On the other hand, if the control device 5 determines the device parameters of the device to be modified as the matching parameters, the control device 5 transfers the matching parameters to the device to be modified via the communication network CN and the fieldbus FB, and rewrites the device parameters of the device to be modified.

[0086] If the mismatched source parameters are not reflected in the target parameters (see "NO" in step S105), the control device 5 terminates the processing flow.

[0087] As shown in step S108, the control device 5 may, after reflecting the source parameter in the target parameter, that is, after matching the target parameter to the source parameter, check whether the target parameter matches the source parameter.

[0088] If the source parameter and the target parameter match (see "YES" in step S108), the control device 5 terminates the processing flow. If the source parameter and the target parameter do not match (see "NO" in step S108), the control device 5 determines that an abnormality has occurred. In this case, the control device 5 may issue an alarm.

[0089] According to this embodiment, the substrate processing system can send and receive parameters (i.e., setting parameters and / or device parameters) between multiple control devices 5 via a communication network CN. With this configuration, the control device 5 can centrally manage multiple parameters in multiple substrate processing apparatuses (SPAs) and reflect any source parameter in any target parameter. As a result, operators do not need to manually set parameters. Therefore, the substrate processing system can reliably set parameters without causing setting errors.

[0090] In particular, the substrate processing system allows for easy reference of multiple parameters in multiple substrate processing devices (SPAs) and the transfer of parameters from one to another. Therefore, it is possible to rewrite the device parameters of newly introduced substrate processing devices all at once, and to easily verify whether performance differences between multiple substrate processing devices are due to differences in device parameter settings.

[0091] In the above-described embodiment, an embodiment was explained in which parameters are sent and received between multiple control devices 5 in multiple substrate processing apparatuses SPA. However, in the embodiment shown below, an embodiment is described in which parameters are sent and received between a data management device MD and a control device 5 in a single substrate processing apparatus SPA.

[0092] As shown in Figure 1, the data management device MD is electrically connected to the control device 5 via the communication network CN, and can send and receive parameters with the control device 5. When the data management device MD is connected to multiple substrate processing devices SPA, the data management device MD is configured to store (back up) data (especially parameters) for each substrate processing device SPA.

[0093] Therefore, the data management system (MD) manages and modifies multiple parameters in multiple substrate processing machines (SPAs) individually. By accessing the data management system (MD), operators can check the parameters of each of the multiple substrate processing machines (SPAs).

[0094] The data management device MD has a database similar to the setting parameter storage database in the control device 5. Therefore, the data management device MD stores the history (data) of past parameters for each of the multiple substrate processing devices SPA. The data management device MD may also store setting parameter definition files.

[0095] Even if a new substrate processing unit (SPA) is introduced, by connecting the new SPA and the data management unit (MD) via a communication network (CN), the data management unit (MD) can reflect the device DV parameters of the already installed SPA in the new SPA's device DV parameters. As a result, the startup time for the new SPA can be shortened without causing configuration errors.

[0096] By connecting the data management device (MD) and the substrate processing device (SPA) via a communication network (CN), the substrate processing system can achieve data sharing among multiple substrate processing devices (SPAs), even if multiple SPAs are not connected to each other via the communication network (CN).

[0097] The data management device MD has a monitor that displays the same operation screen as shown in Figure 6. Therefore, the data management device MD displays on its operation screen the setting parameters input to the control device 5 of one substrate processing apparatus SPA, and the device parameters stored in the device DV connected to the control device 5 via the fieldbus FB, based on the operator's operation (selection of the read button B1).

[0098] Figure 9 shows the processing flow of a control unit when setting parameters are reflected in device parameters in a single substrate processing unit. As shown in step S201 of Figure 9, the data management unit MD obtains the setting parameters of the setting reference device stored internally and displays the setting parameters in the matching source parameter display image G2c.

[0099] As shown in step S202, the data management device MD acquires device parameters from the device to be changed based on the operator's operation (selection of the read button B1) and displays the device parameters in the matching parameter display image G2d.

[0100] After step S202, when the operator selects the compare button B3, the data management device MD compares the setting parameter (source parameter) displayed in the source parameter display image G2c with the device parameter (target parameter) displayed in the target parameter display image G2d, and determines whether the matching results between the setting parameter and the device parameter match (see step S203). If the matching results are a perfect match (see "YES" in step S203), the data management device MD terminates the processing flow.

[0101] If the matching results do not match (see "NO" in step S203), the data management device MD decides whether or not to transfer the mismatched configuration parameters to the device to be modified (see step S204). More specifically, if at least one configuration parameter and at least one device parameter do not match, the data management device MD decides whether or not to reflect the mismatched configuration parameter in the device parameter.

[0102] When transferring mismatched setting parameters to the target device (see "YES" in step S204), the operator selects the setting parameters to be applied (see selection image G2a in Figure 6) and selects the write button B2. At this time, the data management device MD displays a pop-up screen to confirm the setting parameters to be transferred.

[0103] As shown in step S205, after determining the configuration parameters to be transferred, the data management unit MD transfers the configuration parameters to the target device via the fieldbus FB. By transferring the configuration parameters, the device parameters match the configuration parameters. If mismatched configuration parameters are not transferred to the device DV (see "NO" in step S204), the data management unit MD terminates the processing flow.

[0104] As shown in step S206, the data management device MD may, after matching the device parameters to the configured parameters, verify whether the device parameters match the configured parameters. If the configured parameters and device parameters match (see "YES" in step S206), the data management device MD terminates the processing flow. If the configured parameters and device parameters do not match (see "NO" in step S206), the data management device MD determines that an abnormality has occurred. In this case, the data management device MD may stop processing the wafer W and issue an alarm.

[0105] The data management unit (MD) can manage the parameters of the substrate processing unit (SPA) in a unified manner, independently of the SPA. Therefore, even when replacing a device DV, the data management unit (MD) can transfer the setting parameters corresponding to the previous device DV to the new device DV.

[0106] If, after replacing a device DV, the operator manually enters the setting parameters corresponding to the previous device DV into the new device DV, there is a risk of setting errors.

[0107] In this embodiment, the data management device MD stores a history (data) of past parameters. Therefore, the data management device MD can retrieve the previously stored setting parameters of the device DV from the database and write these setting parameters to the new device DV. This writing process ensures that the data management device MD reliably transfers the setting parameters to the new device DV without causing setting errors.

[0108] Furthermore, in this embodiment, by connecting one substrate processing apparatus (SPA) to the data management device (MD), the data management device (MD) functions as a backup for the control device (5). By connecting multiple substrate processing apparatuses (SPAs) to the data management device (MD), the data management device (MD) functions as a backup for each control device (5), and also facilitates the management and rewriting of parameters between multiple substrate processing apparatuses (SPAs).

[0109] EtherCAT communication, as a fieldbus FB, can perform SDO (Service Data Object) communication as an internal protocol. Therefore, the control unit 5 (and / or data management unit MD) may use SDO communication to obtain and manage firmware information of connected devices DV. Firmware information is, for example, a program for controlling the operation of device DV.

[0110] Figure 10 shows the processing flow of the control unit for managing firmware information. As shown in step S301 of Figure 10, first the control unit 5 obtains the firmware information of the target device DV and checks the current firmware version and the latest firmware version (see step S302).

[0111] Subsequently, the control device 5 compares the current firmware version with the latest firmware version (see step S303) to determine whether there is a difference between the current firmware version and the latest firmware version, in other words, whether the current firmware version is the latest firmware version.

[0112] If the current firmware version is the latest (see "NO" in step S303), the control unit 5 terminates the processing flow. If the current firmware version is not the latest (see "YES" in step S303), the control unit 5 obtains the latest firmware version and writes the latest firmware to device DV. In this way, the control unit 5 updates the firmware version of device DV to the latest firmware version (see step S304).

[0113] In the embodiment described with reference to Figures 1 to 10, the substrate processing system comprises a plurality of substrate processing devices (SPAs) and a data management device (MD) connected to each of the plurality of substrate processing devices (SPAs). With this configuration, even if a malfunction occurs in the communication network (CN) connecting the plurality of substrate processing devices (SPAs), the plurality of substrate processing devices (SPAs) can communicate with each other via the data management device (MD).

[0114] Furthermore, by connecting one (or more) substrate processing units (SPAs) to the data management unit (MD), the data management unit (MD) functions as a backup for the control unit (5), and also facilitates the management and rewriting of parameters between multiple substrate processing units (SPAs).

[0115] Figure 11 shows another embodiment of the substrate processing system. As shown in Figure 11, the substrate processing system comprises multiple substrate processing devices (SPAs) but does not include a data management device (MD). The multiple substrate processing devices (SPAs) are connected by a communication network (CN). Even with this configuration, the control device (5) in each substrate processing device (SPA) can centrally manage the parameters introduced in all substrate processing devices (SPAs) connected by the communication network (CN) and transfer the parameters to the device (DV).

[0116] Figure 12 shows another embodiment of the substrate processing system. As shown in Figure 12, the substrate processing system comprises one substrate processing unit SPA, a data management unit MD connected to the substrate processing unit SPA, and a communication network CN connecting the substrate processing unit SPA and the data management unit MD. With this configuration as well, the data management unit MD can centrally manage the parameters introduced into the substrate processing unit SPA (including not only current parameters but also past parameters) and transfer the parameters to the device DV.

[0117] A substrate processing apparatus (SPA) can be a variety of substrate processing equipment, such as plating equipment, cleaning equipment, or film deposition equipment such as CVD.

[0118] The embodiments described above are intended to enable persons with ordinary skill in the art to implement the present invention. Various modifications of the above embodiments can be made naturally by those skilled in the art, and the technical idea of ​​the present invention can be applied to other embodiments as well. Therefore, the present invention is not limited to the embodiments described, but is to be interpreted in the broadest sense according to the technical idea defined by the claims. [Explanation of symbols]

[0119] 1 Housing 1a,1b bulkhead 2 Load / Unload Section 3 Polishing section 3A~3D polishing module 4. Cleaning section 5 Control device 5a Storage device 5b Processing Unit 5c communication controller 6. First linear transporter 7. Second linear transporter 10 polishing pads 11 Lifter 12 Swing Transporter 20 Front Load Section 21. Running mechanism 22 Transport robots 30A~30D Polishing Table 31A~31D Top Ring 32A~32D Polishing fluid supply nozzle 33A~33D Dresser 34A~34D Atomizer 40 Spin Chuck 41 Roll sponge 42 Cleaning solution nozzle 43 Support drive device 110 Top Ring Head 111 Air cylinder for top ring 112 Rotating Cylinder 115 Timing belt 116 Timing Pulley 117 Top Ring Head Shaft 120 Compressed air source 121 Vacuum source 180 Temporary Stand 190 Washing Room 1 191 First Transport Room 192 Second Washing Room 193 Second transport room 194 Drying room 200 Film Thickness Measuring Device 201A Upper primary cleaning module 201B Lower primary cleaning module 202A Upper secondary cleaning module 202B Lower secondary cleaning module 205A Upper drying module 205B Lower Drying Module 209 First Transport Robot 210 Second transport robot 211 Top ring drive shaft 300 mounting stage 302 Light Sensor 302a Lighting Unit 302b Light receiving part 322 Eddy current sensor SPA substrate processing equipment TP1~TP7 Conveyor positions RE1~RE6 Regulator CN Communications Network MD Data Management System ML module DV device FB Fieldbus B1 Read button B2 Write button B3 Comparison Button G1 List Images G2a Selected Image G2b Parameter Name Display Image G2c Matching Source Parameter Display Image G2d Matching Parameter Display Image

Claims

1. A substrate processing system comprising multiple substrate processing devices, Each of the aforementioned plurality of substrate processing devices is Control device and A device for operating the module or detecting the operation of the module, The system includes a fieldbus that electrically connects the control device and the device, The substrate processing system is a substrate processing system comprising a communication network connected between a plurality of control devices, including the control device, for sending and receiving parameters relating to the operating conditions of the device between the plurality of control devices.

2. The substrate processing system according to claim 1, wherein, among a plurality of devices including the aforementioned device, the device that serves as the setting criterion for the parameter is defined as the setting criterion device, and the device that is subject to the change in the setting of the parameter is defined as the device to be changed, the control device displays at least one matching source parameter corresponding to the setting criterion device and at least one matching target parameter corresponding to the device to be changed.

3. The control device is The source parameter and the target parameter are compared, The substrate processing system according to claim 2, wherein if the source parameter and the target parameter do not match, the selected source parameter is reflected in the target parameter.

4. The substrate processing system according to claim 3, wherein the control device reflects the selected source parameter in the target parameter and then checks whether the target parameter matches the source parameter.

5. The substrate processing system is The aforementioned communication network transmits and receives the parameters via Ethernet communication. The substrate processing system according to claim 1, wherein the fieldbus is configured to transmit and receive the parameters by EtherCAT communication.

6. A substrate processing system comprising a substrate processing apparatus, The substrate processing apparatus is Control device and A device for operating the module or detecting the operation of the module, The system includes a fieldbus that electrically connects the control device and the device, The substrate processing system is A data management device electrically connected to the control device, The system includes a communication network for transmitting and receiving parameters related to the operating conditions of the device between the control device and the data management device. The aforementioned data management device is configured to manage the parameters stored within it in a modifiable manner, thereby forming a substrate processing system.

7. The substrate processing system according to claim 6, wherein the data management device displays setting parameters for setting the operating conditions of the device and device parameters stored in the device.

8. The aforementioned data management device is The setting parameters and the device parameters are compared, The substrate processing system according to claim 7, wherein if the setting parameter and the device parameter do not match, the device parameter is made to match the setting parameter.

9. The substrate processing system according to claim 8, wherein the data management device matches the device parameters to the setting parameters, and then checks whether the device parameters match the setting parameters.

10. The substrate processing system according to claim 6, wherein when the device is replaced, the data management device transfers the parameters corresponding to the device to be replaced, which are stored inside it, to the new device.

11. The substrate processing system comprises a plurality of substrate processing devices, including the substrate processing device. The substrate processing system according to claim 6, wherein the data management device individually manages a plurality of parameters relating to the operating conditions of the devices included in each of the plurality of substrate processing devices.

12. The substrate processing system is The aforementioned communication network transmits and receives the parameters via Ethernet communication. The substrate processing system according to claim 6, wherein the fieldbus is configured to transmit and receive the parameters by EtherCAT communication.

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