End effectors and robotic arms

Abstract

This provides an end effector that can improve the detection sensitivity of the sensor. [Solution] The end effector 10 according to the present disclosure is an end effector 10 used in a robot, comprising: a main body 11 containing resin; a pressure sensor 121 disposed on the main body 11; and an amplification member 13 disposed on the pressure sensor 121 to increase the detection sensitivity of the pressure sensor 121.

Description

[Technical Field]

[0001] This disclosure relates to an end effector and a robotic arm. [Background technology]

[0002] Conventionally, robot arms for various applications are known, such as industrial use in manufacturing sites, medical use, and nursing care use. In addition, technologies related to end effectors, including robot hands or robot grippers that are attached to the tip of a robot arm, are known. For example, Patent Document 1 discloses a robot hand with a tactile sensor-equipped finger that can suppress damage and malfunction caused by contact between the gripping object and parts of the finger other than the palm surface when using a robot hand with a tactile sensor. [Prior art documents] [Patent Documents]

[0003] [Patent Document 1] Japanese Patent Publication No. 2022-184009 [Overview of the project] [Problems that the invention aims to solve]

[0004] The prior art described in Patent Document 1 did not adequately address improving the detection sensitivity of the tactile sensor in the robot hand.

[0005] This disclosure aims to provide an end effector and a robot arm capable of improving the detection sensitivity of a sensor. [Means for solving the problem]

[0006] The end effector designed to solve the above problems is: An end effector used in robots, The main body contains resin, A pressure sensor disposed relative to the main body portion, an amplification member disposed relative to the pressure sensor to increase the detection sensitivity of the pressure sensor, and is provided with.

[0007] The robotic arm for solving the above problems, includes the above end effector.

Effect of the Invention

[0008] According to the present disclosure, it is possible to provide an end effector and a robotic arm capable of improving the detection sensitivity of a sensor.

Brief Description of the Drawings

[0009] [Figure 1] It is a schematic diagram showing an example of the appearance of a robotic arm according to an embodiment of the present disclosure. [Figure 2] It is a schematic diagram showing an example of the appearance of the end effector of the robotic arm of FIG. 1. [Figure 3] It is a block diagram showing an example of the configuration of the robotic arm of FIG. 1. [Figure 4A] It is a schematic diagram showing a first example of the arrangement of the amplification member with respect to the wiring pattern of the pressure sensor of FIG. 2. [Figure 4B] It is a schematic diagram when each configuration shown in FIG. 4A is viewed from the side direction. [Figure 5A] It is a schematic diagram showing a second example of the arrangement of the amplification member with respect to the wiring pattern of the pressure sensor of FIG. 2. [Figure 5B] It is a schematic diagram when each configuration shown in FIG. 5A is viewed from the side direction. [Figure 6A] It is a first schematic diagram for explaining the effect exerted by the end effector of FIG. 2. [Figure 6B] It is a second schematic diagram for explaining the effect exerted by the end effector of FIG. 2. [Figure 7] It is a schematic diagram showing the configuration of the amplification member of the end effector according to the first modification example of the present disclosure. [Figure 8]This is a schematic diagram showing an example of the appearance of an end effector according to the second modified example of the present disclosure. [Modes for carrying out the invention]

[0010] In the following, one embodiment of this disclosure will be mainly described with reference to the attached drawings.

[0011] Figure 1 is a schematic diagram showing an example of the appearance of a robot arm 1 according to one embodiment of the present disclosure. Figure 2 is a schematic diagram showing an example of the appearance of the end effector 10 of the robot arm 1 in Figure 1. Figure 3 is a block diagram showing an example of the configuration of the robot arm 1 in Figure 1. An example of the configuration of the robot arm 1, including the end effector 10, will be mainly described with reference to Figures 1 to 3.

[0012] As shown in Figures 1 and 2, the robot arm 1 comprises a housing 1a that constitutes the main body and an end effector 10 attached to the housing 1a at the tip of the robot arm 1. The end of the end effector 10 opposite to the part for gripping an object is attached to the housing 1a, so that the end effector 10 is supported by the housing 1a. The end effector 10 is driven while supported by the housing 1a and grips an object.

[0013] The end effector 10 is used in a robot. For example, the end effector 10 functions as part of a robot having a robot arm 1. In this disclosure, “robot” includes, for example, industrial robots, caregiving robots, marine robots, medical robots, or mobile devices such as vehicles or drones that make autonomous decisions and move. “Industrial robot” includes, for example, collaborative robots that can work together with a worker in the same space, or other robots that work in isolation from a worker. The end effector 10 is configured as a robot hand or robot gripper in such a robot.

[0014] As shown in Figure 3, the end effector 10 has a main body 11 containing resin and a circuit section 12 including a circuit integrally formed with the resin in the main body 11. The circuit section 12 includes a pressure sensor 121 positioned relative to the main body 11. The end effector 10 has an amplification member 13 positioned relative to the pressure sensor 121 to increase the detection sensitivity of the pressure sensor 121. In addition to the end effector 10, the robot arm 1 has a storage unit 20, a drive unit 30, and a control unit 40. The storage unit 20, the drive unit 30, and the control unit 40 are housed, for example, in the housing 1a of the robot arm 1.

[0015] The storage unit 20 includes, for example, semiconductor memory, magnetic memory, optical memory, or any combination thereof. The storage unit 20 functions, for example, as main memory, auxiliary memory, or cache memory. The storage unit 20 stores information used for the operation of the robot arm 1 and information obtained by the operation of the robot arm 1. For example, the storage unit 20 stores system programs, application programs, or various data obtained by any means such as communication.

[0016] The drive unit 30 includes, for example, an arbitrary drive mechanism for driving the end effector 10. The drive mechanism includes, for example, a plurality of gears and a motor for rotating the gears. The drive unit 30 drives the end effector 10 according to a control signal from the control unit 40. The drive unit 30 drives the claw portion 11b of the main body portion 11 of the end effector 10, as described later, according to a control signal from the control unit 40, so that the claw portion 11b grips an object.

[0017] The control unit 40 includes a microcontroller, a processor, a programmable circuit, a dedicated circuit, or any combination thereof. The processor is a general-purpose processor such as a CPU or GPU, or a dedicated processor specialized for a specific process. "CPU" is an abbreviation for Central Processing Unit. "GPU" is an abbreviation for Graphics Processing Unit. The programmable circuit is, for example, an FPGA. "FPGA" is an abbreviation for Field-Programmable Gate Array. The dedicated circuit is, for example, an ASIC. "ASIC" is an abbreviation for Application Specific Integrated Circuit. The control unit 40 is communicated with each component constituting the robot arm 1 and executes various processes related to the operation of the robot arm 1 while controlling each component.

[0018] The following section will primarily describe the configuration and functions of the end effector 10.

[0019] As shown in Figure 2, the main body 11 constitutes the entire outer shape of the end effector 10. The main body 11 has a mounting portion 11a that is attached to the housing 1a of the robot arm 1. The main body 11 has a pair of claw portions 11b that protrude from the end of the mounting portion 11a that is on the opposite side from the housing 1a. The pair of claw portions 11b grip an object by, for example, reducing the distance between them to be approximately the same as the width of the object. As an example, the entire main body 11, including the mounting portion 11a and the claw portions 11b, is made of resin.

[0020] As described later, in this disclosure, “resin” includes, for example, thermoplastic resins. “Thermoplastic resin” includes, for example, at least one selected from the group consisting of engineering plastics or super engineering plastics. A thermoplastic resin is, for example, a polyarylene sulfide resin. More specifically, a thermoplastic resin includes a polyarylene sulfide resin such as a polyphenylene sulfide resin.

[0021] The circuit section 12 of the end effector 10 contributes to a predetermined function. In this disclosure, the "predetermined function" is, for example, a function to detect the magnitude of the pressure generated when the end effector 10 grips an object. However, the predetermined function may further include, in addition to the function to detect the magnitude of the pressure, a function to detect when the main body 11 has come into contact with the object, or a function to detect the height of the object.

[0022] As shown in Figure 2, the circuit of the circuit section 12 is formed, for example, by directly drawing on the surface of the resin that forms the claw portion 11b of the main body 11. In the circuit of the circuit section 12, the wiring and electrodes are formed in each region of the resin surface that forms the claw portion 11b. The circuit of the circuit section 12 is formed, for example, as a molded circuit using LDS among MIDs. "MID" is an abbreviation for Molded Interconnect Device. "LDS" is an abbreviation for Laser Direct Structuring. The circuit of the circuit section 12 is formed by plating by directly irradiating the surface of the main body 11, which is a molded product, with a laser.

[0023] The circuit of the circuit section 12 has wiring formed in a predetermined pattern on the resin surface of the main body section 11, and contributes to a predetermined function based on the wiring itself. The circuit of the circuit section 12 includes, for example, the circuit of a pressure sensor 121. The pressure sensor 121 has wiring integrally formed in a predetermined pattern on the resin surface of the main body section 11, and contributes to the function of detecting the magnitude of the pressure generated when the end effector 10 grips an object based on the wiring itself. The pressure sensor 121 includes, for example, a strain gauge.

[0024] The pressure sensor 121 is formed, for example, on the inner surface of at least one of a pair of claw portions 11b arranged in the separation direction D1. The inner surface of the claw portion 11b is the surface located on the ventral side of the claw portion 11b that grips the object. The pressure sensor 121 is located on the inner surface of the claw portion 11b at the tip in the extending direction D2 of the main body portion 11. However, the pressure sensor 121 may be located at a different position on the inner surface of the claw portion 11b from the tip in the extending direction D2, or it may be located on the outer surface of the claw portion 11b. The outer surface of the claw portion 11b is the surface located on the dorsal side opposite to the ventral side of the claw portion 11b that grips the object.

[0025] The amplification member 13 has, for example, a projection structure that protrudes outward from the pressure sensor 121. The elastic modulus of the amplification member 13 is, for example, higher than the elastic modulus of the pressure sensor 121. The amplification member 13 is made of, for example, a metal material or resin material having such an elastic modulus. The amplification member 13 is, for example, integrally attached to the surface of the pressure sensor 121. The amplification member 13 is attached to the surface of the pressure sensor 121 by, for example, an adhesive sheet, adhesive tape, adhesive seal, adhesive, or a cover that conforms to the shape of the pressure sensor 121. In this disclosure, "adhesion" in adhesive means, for example, an attachment method involving a chemical reaction. "Adhesion" in adhesive tape means, for example, an attachment method that does not involve a chemical reaction.

[0026] For example, from the standpoint of wear resistance and replacement, the amplification member 13 may be integrally attached to the pressure sensor 121 via the cover, with the amplification member 13 positioned on the surface of the cover that conforms to the shape of the pressure sensor 121. The amplification member 13 amplifies the amount of deformation of the pressure sensor 121 when it comes into contact with an object, for example, by arranging a pattern of protrusions on the surface of the cover that effectively deforms the pressure sensor 121. As a result, the amplification member 13 increases the original detection sensitivity of the pressure sensor 121 when it comes into contact with an object without the amplification member 13.

[0027] Figure 4A is a schematic diagram showing a first example of the arrangement of the amplification member 13 with respect to the wiring pattern P of the pressure sensor 121 in Figure 2. In Figure 4A, the region R1 of Figure 2 is enlarged to show the tip of the claw portion 11b along with the pressure sensor 121 of the circuit portion 12. In addition to the pressure sensor 121 and the tip of the claw portion 11b, Figure 4A also shows the amplification member 13 and the object S, which are not shown in Figure 2. The amplification member 13 is attached to the pressure sensor 121 via a mounting member R, which includes an adhesive sheet, adhesive tape, adhesive seal, adhesive, or a cover that conforms to the shape of the pressure sensor 121.

[0028] The pressure sensor 121, acting as a strain gauge, may be made of any material capable of changing its electrical resistance by being deformed by an external force. The pressure sensor 121 has an input electrode E1 and an output electrode E2 formed on the surface of the resin of the claw portion 11b. The input electrode E1 and the output electrode E2 are formed in parallel with each other. The pressure sensor 121 has wiring W formed in a pattern P on the surface of the resin of the claw portion 11b, and the wiring W itself contributes to a predetermined function. The pattern P corresponding to the predetermined function functions as a strain gauge. For example, the pattern P is formed by repeatedly folding a straight line 180° at one end and then folding the folded straight line another 180° at the other end.

[0029] The pressure sensor 121 has two gauge leads L that connect one end and the other end of the wiring W, which is formed by pattern P, to the input electrode E1 and the output electrode E2, respectively. The gauge leads L are also formed on the surface of the resin of the claw portion 11b, for example, similar to the input electrode E1, the output electrode E2, and the wiring W.

[0030] The circuit, including the input electrode E1, output electrode E2, wiring W, and gauge lead L, is integrally formed with the resin in the main body 11. The circuit is formed, for example, by directly drawing on the surface of the resin that forms the claw portion 11b of the main body 11. The circuit is formed in region R1 of the resin surface that forms the claw portion 11b. The circuit is configured, for example, as a molded circuit using LDS among MIDs. The circuit is formed by plating by directly irradiating the surface of the main body 11 as a molded product with a laser.

[0031] The projection structure of the amplification member 13 is arranged linearly, for example, in at least a portion between one end and the other end of the pressure sensor 121. The projection structure is arranged to overlap the pattern P of the strain gauge of the pressure sensor 121 along the longitudinal direction D3. Multiple projection structures are arranged along the short direction D4 of the pattern P, which is perpendicular to the longitudinal direction D3. Multiple projection structures arranged along the short direction D4 are, for example, parallel to the longitudinal direction D3 and parallel to each other.

[0032] In Figure 4A, one end of the pressure sensor 121 represents, for example, one end of the area where pattern P exists along the longitudinal direction D3. The other end of the pressure sensor 121 represents, for example, the other end of the area where pattern P exists along the longitudinal direction D3. For example, the projection structure of the amplification member 13 is arranged linearly over the entire area between one end and the other end of the pressure sensor 121. The projection structure extends over the entire mounting member R along the longitudinal direction D3, including the entire area between one end and the other end of the pressure sensor 121.

[0033] The width of the projection structure in the short direction D4 of pattern P, which is perpendicular to the longitudinal direction D3, is, for example, greater than the width of pattern P in the short direction D4. The spacing in the short direction D4 between one projection structure and another projection structure adjacent to one of the multiple projection structures arranged along the short direction D4 is narrower than the spacing in the short direction D4 of the parts of pattern P that are adjacent to each other in the short direction D4.

[0034] Figure 4B is a schematic diagram of each component shown in Figure 4A viewed from the side. As shown in Figure 4B, an amplification member 13 is attached to the wiring W of the pressure sensor 121 via a mounting member R on the side of the wiring W opposite to the claw portion 11b. The amplification member 13 is positioned on the outermost side of the wiring W, opposite to the claw portion 11b. Therefore, when the end effector 10 grips the object S, the object S makes direct contact with the amplification member 13, not the wiring W.

[0035] When the amplification member 13 comes into contact with the object S and receives an external force toward the claw portion 11b, it presses the wiring W via the mounting member R. The pressure sensor 121, acting as a strain gauge, receives a pressing force from the amplification member 13 based on the external force received by the amplification member 13 and deforms. As a result, the pressure sensor 121 changes its electrical resistance value.

[0036] Figure 5A is a schematic diagram showing a second example of the arrangement of the amplification member 13 relative to the wiring pattern P of the pressure sensor 121 in Figure 2. In Figure 5A, the region R1 of Figure 2 is enlarged to show the tip of the claw portion 11b along with the pressure sensor 121 of the circuit portion 12. In addition to the pressure sensor 121 and the tip of the claw portion 11b, Figure 5A also shows the amplification member 13 and the object S, which are not shown in Figure 2. The amplification member 13 is attached to the pressure sensor 121 via a mounting member R, which includes an adhesive sheet, adhesive tape, adhesive seal, adhesive, or a cover that conforms to the shape of the pressure sensor 121.

[0037] The above explanation of the configuration and function of the pressure sensor 121 shown in Figure 4A also applies to the configuration and function of the pressure sensor 121 shown in Figure 5A. Therefore, the explanation of the configuration and function of the pressure sensor 121 shown in Figure 5A will be omitted, and the configuration and function of the amplification member 13 will be explained in detail.

[0038] The projection structure of the amplification member 13 is arranged linearly, for example, in at least a portion between one end and the other end of the pressure sensor 121. The projection structure is arranged to overlap the pattern P of the strain gauge pattern P of the pressure sensor 121 along the short direction D4. Multiple projection structures are arranged along the longitudinal direction D3 of the pattern P, which is perpendicular to the short direction D4. Multiple projection structures arranged along the longitudinal direction D3 are, for example, parallel to the short direction D4 and parallel to each other.

[0039] In Figure 5A, one end of the pressure sensor 121 represents, for example, one end of the area where pattern P exists along the short direction D4. The other end of the pressure sensor 121 represents, for example, the other end of the area where pattern P exists along the short direction D4. For example, the projection structure of the amplification member 13 is arranged linearly over the entire area between one end and the other end of the pressure sensor 121. The projection structure extends over the entire mounting member R along the short direction D4, including the entire area between one end and the other end of the pressure sensor 121.

[0040] The width of the projection structure in the longitudinal direction D3 of pattern P, which is perpendicular to the short direction D4, is, for example, greater than the width of pattern P in the short direction D4. The distance in the longitudinal direction D3 between one projection structure and another projection structure adjacent to one of the multiple projection structures arranged along the longitudinal direction D3 is wider than the distance in the short direction D4 of the parts of pattern P that are adjacent to each other in the short direction D4.

[0041] Figure 5B is a schematic diagram of each component shown in Figure 5A viewed from the side. As shown in Figure 5B, an amplification member 13 is attached to the wiring W of the pressure sensor 121 via a mounting member R on the side of the wiring W opposite to the claw portion 11b. The amplification member 13 is positioned on the outermost side of the wiring W, opposite to the claw portion 11b. Therefore, when the end effector 10 grips the object S, the object S makes direct contact with the amplification member 13, not the wiring W.

[0042] When the amplification member 13 comes into contact with the object S and receives an external force toward the claw portion 11b, it presses the wiring W via the mounting member R. The pressure sensor 121, acting as a strain gauge, receives a pressing force from the amplification member 13 based on the external force received by the amplification member 13 and deforms. As a result, the pressure sensor 121 changes its electrical resistance value.

[0043] The following mainly describes an example of control of the end effector 10 by the control unit 40 of the robot arm 1. The control unit 40 controls the end effector 10.

[0044] The control unit 40 acquires the output signal from the pressure sensor 121, whose detection sensitivity has been increased by the amplification member 13, via the gauge lead L and output electrode E2, in an example configuration of the end effector 10 shown in Figure 2. The control unit 40 monitors the resistance change rate of the strain gauge based on the acquired output signal and identifies the time change in the resistance change rate. The resistance change rate of the strain gauge is, for example, the value obtained by dividing the resistance change amount Δr in the strain gauge by the resistance value r.

[0045] The control unit 40 detects the moment when the end effector 10 grasps the object S based on the output signal. For example, the control unit 40 determines that the end effector 10 has grasped the object S when it determines that the output signal satisfies a first predetermined condition. In this disclosure, the "predetermined condition" includes, for example, the magnitude of the voltage value of the output signal exceeding a first threshold or the rate of change of the magnitude of the voltage value of the output signal exceeding a second threshold.

[0046] The control unit 40 controls the gripping force of the end effector 10 while it is continuing to grip the object S based on the output signal. For example, after detecting that the end effector 10 has gripped the object S based on the output signal, the control unit 40 detects the static gripping force of the end effector 10 while it is continuing to grip the object S. The control unit 40 controls the end effector 10 so that the magnitude of the detected gripping force of the end effector 10 falls within a predetermined range.

[0047] In one embodiment, a thermoplastic resin is preferred as the resin used. The thermoplastic resin is not particularly limited, but examples include polyolefin resins such as polypropylene, polyethylene, and polybutene; polyester resins such as polyethylene terephthalate and polybutylene terephthalate; polyamide resins or aromatic polyamide resins such as nylon-6 and nylon 6,6; thermoplastic polyimide resins; polyamide-imide resins; polystyrene resins such as polystyrene, syndiotactic polystyrene, acrylonitrile-styrene copolymer resin, or acrylonitrile-butadiene-styrene copolymer resin; polyarylene sulfide resins such as polyphenylene sulfide; polyphenylene ether resins; polyurethane resins; polylactic acid; polyetheretherketone resins; polyetherimide resins; polyketone resins; polyarylate resins such as amorphous polyarylate and liquid crystalline polyarylate; and liquid crystalline polyester resins.

[0048] Among these, the thermoplastic resin used in one embodiment is preferably a so-called engineering plastic or super engineering plastic that has excellent heat resistance and mechanical properties, such as thermoplastic polyimide resin, polyamide-imide resin, aromatic polyamide resin, polyarylene sulfide resin, polyphenylene ether resin, polyether ether ketone resin, polyetherimide resin, polyketone resin, polyarylate resin, and liquid crystalline polyester resin. From the viewpoint of chemical resistance, heat resistance, and mechanical properties, polyarylene sulfide resin is more preferred, and among polyarylene sulfide resins (hereinafter also referred to as "PAS resin"), polyphenylene sulfide resin (hereinafter also referred to as "PPS resin") is particularly preferred.

[0049] In one embodiment, the above resin may be used alone or in the form of a polymer alloy in which multiple resins are mixed. The resin according to one embodiment may contain a filler. The resin containing a filler may contain the filler described later and the above resin, and may be in the form of a composition containing any additive components described later (colorants, antistatic agents, antioxidants, heat stabilizers, ultraviolet stabilizers, ultraviolet absorbers, foaming agents, flame retardants, flame retardant additives, rust inhibitors, coupling agents, silane coupling agents, thermoplastic elastomers, or synthetic resins) as needed.

[0050] Polyarylene sulfide resins have a resin structure in which aromatic rings and sulfur atoms are bonded together as repeating units. Specifically, they are resins in which structural units represented by the following general formula (1) and, if necessary, trifunctional structural units represented by the following general formula (2) are repeated.

[0051] [ka] In formula (1), R 1 and R 2 Each of these independently represents a hydrogen atom, an alkyl group with 1 to 4 carbon atoms, a nitro group, an amino group, a phenyl group, a methoxy group, or an ethoxy group.

[0052] [ka] The trifunctional structural site represented by formula (2) is preferably in the range of 0.001 to 3 mol%, and particularly preferably in the range of 0.01 to 1 mol%, relative to the total number of moles of the other structural sites.

[0053] Here, the structural part represented by the general formula (1) above is, in particular, R in the formula 1 and R 2 From the viewpoint of the mechanical strength of the PAS resin, it is preferable that the atom is a hydrogen atom, and in that case, examples include those bonded at the para position represented by the following formula (3) and those bonded at the meta position represented by the following formula (4).

[0054] [ka] Among these, the bond of the sulfur atom to the aromatic ring in the repeating unit is particularly preferable in terms of the heat resistance and crystallinity of the PAS resin if it is bonded at the para position as represented by the general formula (3) above.

[0055] The above-mentioned PAS resin may contain not only the structural parts represented by the above-mentioned general formulas (1) and (2), but also structural parts represented by the following structural formulas (5) to (8) in an amount of 30 mol% or less of the total of the structural parts represented by the above-mentioned general formulas (1) and (2).

[0056] [ka] In particular, in one embodiment, it is preferable that the structural parts represented by the above general formulas (5) to (8) be 10 mol% or less, from the viewpoint of heat resistance and mechanical strength of the PAS resin. When the above PAS resin contains structural parts represented by the above general formulas (5) to (8), the bonding mode may be either a random copolymer or a block copolymer.

[0057] The above-mentioned PAS resin may have naphthyl sulfide bonds or the like in its molecular structure, but it is preferable that the amount of naphthyl sulfide bonds is 3 mol% or less, and particularly preferable that it is 1 mol% or less, relative to the total number of moles of other structural parts.

[0058] The physical properties of the PAS resin are not particularly limited as long as they do not impair the effects of one embodiment, but are as follows.

[0059] (Melting viscosity) The melt viscosity of the PAS resin is not particularly limited, but in order to achieve a good balance between fluidity and mechanical strength, the melt viscosity (V6) measured at 300°C is preferably in the range of 2 Pa·s or more, preferably in the range of 1000 Pa·s or less, more preferably in the range of 500 Pa·s or less, and even more preferably in the range of 200 Pa·s or less. However, the melt viscosity (V6) is measured using a Shimadzu flow tester, CFT-500D, with polyarylene sulfide resin at 300°C and a load of 1.96 × 10⁻⁶. 6 The measured melt viscosity was obtained after holding the mixture at Pa and L / D = 10(mm) / 1(mm) for 6 minutes.

[0060] (Non-Newtonian exponents) The non-Newton index of the PAS resin is not particularly limited, but it is preferably in the range of 0.90 or higher and 2.00 or lower. When using a linear polyarylene sulfide resin, the non-Newton index is preferably in the range of 0.90 or higher, more preferably in the range of 0.95 or higher, more preferably in the range of 1.50 or lower, and more preferably in the range of 1.20 or lower. Such polyarylene sulfide resins have excellent mechanical properties, fluidity, and abrasion resistance. However, in one embodiment, the non-Newton index (N value) is a value calculated using the following formula by measuring the shear rate (SR) and shear stress (SS) using a capillograph under conditions of melting point +20°C and orifice length (L) to orifice diameter (D), L / D = 40. The closer the non-Newton index (N value) is to 1, the closer the structure is to linear, and the higher the non-Newton index (N value), the more branched the structure is.

[0061]

number

[0062] The resin used in one embodiment is blended with a metal oxide containing at least one of copper and chromium for the purpose of forming a molded circuit using LDS. The metal oxide generates heat when irradiated with a laser in the resulting molded product, melts the resin, and has functions such as roughening the surface of the molded product, being activated by laser irradiation, and selectively forming a plating layer.

[0063] The metal oxide contains at least one of copper and chromium. The metal oxide may further contain other metals such as iron, aluminum, gallium, boron, molybdenum, tungsten, and selenium.

[0064] Specific examples of the metal oxide are not particularly limited, but CuFe 0.5 B 0.5 O 2.5 、CuAl 0.5 B 0.5 O 2.5 、CuGa 0.5 B 0.5 O 2.5 、CuB2O4、CuB 0.7 O2、CuMo 0.7 O3、CuMo 0.5 O 2.5 、CuMoO4、CuWO4、CuSeO4、CuCr2O4, etc. Among these, the metal oxide is preferably CuCr2O4, CuFe 0.5 B 0.5 O 2.5 、CuAl 0.5 B 0.5 O 2.5 and more preferably CuCr2O4, CuFe 0.5 B 0.5 O 2.5 . These metal oxides may be used alone or in combination of two or more.

[0065] The average particle size of the metal oxide is preferably in the range of 0.01 μm or more, more preferably 0.05 μm or more, more preferably 50 μm or less, and more preferably 30 μm or less. An average particle size of 0.01 μm or more is preferable because it allows for efficient and stable production. On the other hand, an average particle size of 50 μm or less is preferable because it allows for the maintenance of material strength. In this disclosure, "average particle size of the metal oxide" means the number-average particle diameter, and the value measured by electron microscopy is adopted. Specifically, the particle sizes of 100 arbitrarily selected metal oxide particles in one field of view of an electron microscope are measured, and the average value is calculated.

[0066] The Mohs hardness of the metal oxide is preferably in the range of 4.0 or higher, preferably 6.5 or lower, and more preferably 6.0 or lower.

[0067] The amount of the metal oxide blended is preferably 15 parts by mass or more, more preferably 20 parts by mass or more, even more preferably 25 parts by mass or more, and preferably 90 parts by mass or less, per 100 parts by mass of the PAS resin. When the amount of the metal oxide blended per 100 parts by mass of the PAS resin is 15 parts by mass or more, it is preferable from the viewpoint that the resulting molded product can undergo a high degree of surface roughening by laser irradiation and activation of the metal oxide, and has excellent plating properties. On the other hand, when the amount of the metal oxide blended per 100 parts by mass of the PAS resin is 90 parts by mass or less, it is preferable because the material strength can be maintained.

[0068] Other fillers may be known and commonly used materials as long as they do not impair the effect of one embodiment. Examples include fillers of various shapes, such as fibrous materials and non-fibrous materials such as granular or plate-shaped materials. Specifically, fibrous fillers such as glass fibers, carbon fibers, silane glass fibers, ceramic fibers, aramid fibers, metal fibers, potassium titanate, silicon carbide, calcium silicate, wollastonite, and natural fibers can be used. Non-fibrous fillers such as glass beads, glass flakes, barium sulfate, clay, pyrophyllite, bentonite, sericite, mica, talc, kerolite, pimelite, hydrotalcite, kaolinite, attapulgite, ferrite, calcium silicate, calcium carbonate, glass beads, zeolite, milled fiber, and calcium sulfate can also be used.

[0069] In one embodiment, the filler content is not particularly limited as long as it does not impair the effects of that embodiment. The amount of filler added is preferably in the range of 1 part by mass or more, more preferably 10 parts by mass or more, preferably 600 parts by mass or less, and more preferably 200 parts by mass or less, per 100 parts by mass of resin. This range is preferable because the resin exhibits good mechanical strength and moldability.

[0070] The resin used in one embodiment may optionally contain a silane coupling agent as an optional component. The silane coupling agent is not particularly limited as long as it does not impair the effects of the embodiment, but silane coupling agents having a functional group that reacts with a carboxyl group, such as an epoxy group, isocyanate group, amino group, or hydroxyl group, are preferred. Examples of such silane coupling agents include epoxy group-containing alkoxysilane compounds such as γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropyltriethoxysilane, and β-(3,4-epoxycyclohexyl)ethyltrimethoxysilane; isocyanato group-containing alkoxysilane compounds such as γ-isocyanatopropyltrimethoxysilane, γ-isocyanatopropyltriethoxysilane, γ-isocyanatopropylmethyldimethoxysilane, γ-isocyanatopropylmethyldiethoxysilane, γ-isocyanatopropylethyldimethoxysilane, γ-isocyanatopropylethyldiethoxysilane, and γ-isocyanatopropyltrichlorosilane; amino group-containing alkoxysilane compounds such as γ-(2-aminoethyl)aminopropylmethyldimethoxysilane, γ-(2-aminoethyl)aminopropyltrimethoxysilane, and γ-aminopropyltrimethoxysilane; and hydroxyl group-containing alkoxysilane compounds such as γ-hydroxypropyltrimethoxysilane and γ-hydroxypropyltriethoxysilane. In one embodiment, the silane coupling agent is not an essential component, but if it is included, the amount added is not particularly limited as long as it does not impair the effects of the embodiment. However, it is preferably in the range of 0.01 parts by mass or more, more preferably 0.1 parts by mass or more, preferably 10 parts by mass or less, and more preferably 5 parts by mass or less, per 100 parts by mass of resin. This range is preferable because the resin has good moldability, especially release properties, and the mechanical strength of the molded product is improved.

[0071] The resin used in one embodiment may optionally contain a thermoplastic elastomer as an optional component. Examples of thermoplastic elastomers include polyolefin-based elastomers, fluorine-based elastomers, or silicone-based elastomers, of which polyolefin-based elastomers are preferred. When these elastomers are added, the amount added is not particularly limited as long as it does not impair the effects of the embodiment, but is preferably in the range of 0.01 parts by mass or more, more preferably 0.1 parts by mass or more, preferably 10 parts by mass or less, and more preferably 5 parts by mass or less, per 100 parts by mass of resin (A). This range is preferable because it improves the impact resistance of the resulting resin.

[0072] For example, the polyolefin-based elastomers mentioned above include homopolymers of α-olefins, copolymers of two or more α-olefins, and copolymers of one or more α-olefins with a vinyl polymerizable compound having a functional group. In this case, the α-olefins include ethylene, propylene, 1-butene, and other α-olefins having 2 to 8 carbon atoms. The functional groups include carboxyl groups, acid anhydride groups (-C(=O)OC(=O)-), epoxy groups, amino groups, hydroxyl groups, mercapto groups, isocyanate groups, and oxazoline groups. Examples of vinyl polymerizable compounds having the above-mentioned functional groups include vinyl acetate; α,β-unsaturated carboxylic acids such as (meth)acrylic acid; alkyl esters of α,β-unsaturated carboxylic acids such as methyl acrylate, ethyl acrylate, and butyl acrylate; metal salts of α,β-unsaturated carboxylic acids such as ionomers (metals include alkali metals such as sodium, alkaline earth metals such as calcium, and zinc); glycidyl esters of α,β-unsaturated carboxylic acids such as glycidyl methacrylate; α,β-unsaturated dicarboxylic acids such as maleic acid, fumaric acid, and itaconic acid; and derivatives of the above-mentioned α,β-unsaturated dicarboxylic acids (monoesters, diesters, acid anhydrides), one or more of these. The above-mentioned thermoplastic elastomers may be used individually or in combination of two or more types.

[0073] Furthermore, in addition to the above components, the resin used in one embodiment may optionally contain synthetic resins (hereinafter simply referred to as "synthetic resins") such as polyester resin, polyamide resin, polyimide resin, polyetherimide resin, polycarbonate resin, polyphenylene ether resin, polysulfone resin, polyethersulfone resin, polyetheretherketone resin, polyetherketone resin, polyarylene resin, polyethylene resin, polypropylene resin, polytetrafluoroethylene resin, polydifluoroethylene resin, polystyrene resin, ABS resin, phenolic resin, urethane resin, and liquid crystal polymer, depending on the application. In one embodiment, the above synthetic resins are not essential components, but when they are included, the proportion of the synthetic resin is not particularly limited as long as it does not impair the effects of the embodiment, and it will vary depending on the purpose and cannot be defined in general terms. However, as an example of the proportion of synthetic resin to be included in the resin according to one embodiment, it may be in the range of 5 parts by mass or more and 15 parts by mass or less per 100 parts by mass of resin. In other words, the ratio of resin (A) to the total of resin (A) and synthetic resin is preferably in the range of (100 / 115) or more, and more preferably in the range of (100 / 105) or more, on a mass basis.

[0074] The resin used in one embodiment may also contain, as necessary, other known and commonly used additives such as colorants, antistatic agents, antioxidants, heat stabilizers, UV stabilizers, UV absorbers, foaming agents, flame retardants, flame retardant aids, rust inhibitors, and coupling agents as optional components. These additives are not essential components, and for example, they may be used in an amount of preferably 0.01 parts by mass or more, and preferably 1000 parts by mass or less, per 100 parts by mass of resin, adjusted appropriately according to the purpose and application so as not to impair the effects of the embodiment.

[0075] The method for producing the resin used in one embodiment will be described in detail below.

[0076] The resin used in one embodiment is made by blending each essential component and, if necessary, other optional components. The method for producing the resin used in one embodiment is not particularly limited, but includes a method of blending the essential components and, if necessary, optional components and then melt-kneading them, or more specifically, a method of uniformly dry-mixing them in a tumbler or Henschel mixer as needed, and then feeding them into a twin-screw extruder and melt-kneading them.

[0077] Melt mixing can be carried out by heating the resin to a temperature range in which the resin temperature is above the melting point of the resin, preferably a temperature range in which the temperature is 10°C or higher above the melting point, more preferably 10°C or higher above the melting point, even more preferably from 20°C or higher above the melting point, preferably 100°C or lower above the melting point, and more preferably 50°C or lower below the melting point.

[0078] As the melting and mixing machine described above, a twin-screw extruder is preferred from the viewpoint of dispersibility and productivity. For example, it is preferable to melt and mix while appropriately adjusting the discharge rate of the resin component in the range of 5 to 500 kg / hr and the screw rotation speed in the range of 50 to 500 rpm, and it is even more preferable to melt and mix under conditions in which the ratio of these (discharge rate / screw rotation speed) is in the range of 0.02 to 5 kg / hr / rpm. The addition and mixing of each component to the melting and mixing machine may be done simultaneously or in stages. For example, when adding an additive from the above components, it is preferable from the viewpoint of dispersibility to introduce it into the extruder from the side feeder of the twin-screw extruder. The position of such a side feeder is preferably such that the ratio of the distance from the resin input section (top feeder) of the extruder to the total length of the screw of the twin-screw extruder is 0.1 or more, and more preferably 0.3 or more. This ratio is preferably 0.9 or less, and more preferably 0.7 or less.

[0079] The resin obtained by melt-kneading in this manner according to one embodiment is a molten mixture containing the above-mentioned essential components, optional components to be added as needed, and their derived components. After melt-kneading, it is preferable to extrude the molten resin into strands using a known method, then process it into forms such as pellets, chips, granules, or powders, and then pre-dry it at a temperature range of 100 to 150°C as needed.

[0080] The molded article of one embodiment is made by molding resin. The manufacturing method of the molded article of one embodiment includes a step of melt-molding the above-mentioned resin. This will be described in detail below.

[0081] The resin used in one embodiment is subjected to injection molding. Various molding conditions are not particularly limited and can be molded using generally accepted methods. For example, the resin can be melted in an injection molding machine at a temperature range above the melting point of the resin, preferably at a temperature range of melting point + 10°C or higher, more preferably at a temperature range of melting point + 10°C to melting point + 100°C, and even more preferably at a temperature range of melting point + 20°C to melting point + 50°C, after which it can be injected into a mold from the resin discharge port for molding. In this case, the mold temperature can also be set to a known temperature range, for example, room temperature (23°C) to 300°C, preferably 120 to 180°C.

[0082] According to the end effector 10 of the above embodiment, the detection sensitivity of the sensor can be improved. The end effector 10 has an amplification member 13 that is positioned relative to the pressure sensor 121 and increases the detection sensitivity of the pressure sensor 121. As a result, the end effector 10 can improve the detection sensitivity of the pressure sensor 121 of the circuit unit 12. The robot arm 1 having the end effector 10 can accurately detect the moment when it grasps an object S based on the output signal output from the pressure sensor 121, and can accurately control the gripping force when it continues to grasp the object S based on the output signal.

[0083] Therefore, even when the robot arm 1 grasps a soft or lightweight object S that does not generate much force when the end effector 10 makes contact, the amplification member 13 improves sensitivity, enabling the robot arm 1 to perform a series of grasping operations with high precision. The robot arm 1 can also fine-tune the grasping force when grasping the object S using both the amplification member 13 and the pressure sensor 121. The robot arm 1 can also precisely control minute forces in the minute force range using both the amplification member 13 and the pressure sensor 121. As a result, the robot arm 1 can delicately grasp the object S with the end effector 10 without damaging it.

[0084] Figure 6A is a first schematic diagram illustrating the effect of the end effector 10 in Figure 2. Figure 6B is a second schematic diagram illustrating the effect of the end effector 10 in Figure 2. Referring to Figures 6A and 6B, the effects of the end effector 10 on improving detection sensitivity will be explained in more detail. In Figure 6B, the mounting member R is omitted for the sake of simplicity, but the following explanation of the effects also applies when the mounting member R is interposed between the amplification member 13 and the pressure sensor 121.

[0085] The strain gauge of the pressure sensor 121 responds to the expansion and contraction of the pattern P that the strain gauge itself possesses. However, as shown in Figure 6A, when an object S that is larger than the pattern P of the strain gauge and can be considered flat comes into contact with the pressure sensor 121, the pressure generated from the object S toward the pressure sensor 121 is dispersed and easily relieved. As a result, the pattern P of the strain gauge becomes less likely to deform, and it becomes more difficult to exceed the detection limit of the pressure sensor 121.

[0086] On the other hand, by arranging the amplification member 13, the end effector 10 can change the contact between the pressure sensor 121 and the object S from a planar contact as shown in Figure 6A to a linear or point contact as shown in Figure 6B. The end effector 10 can concentrate pressure on the strain gauge pattern P of the pressure sensor 121 to cause deformation more effectively, thereby improving the detection sensitivity of the pressure sensor 121. Even when the object S has a flat shape and it is difficult for shape changes to occur in the strain gauge of the pressure sensor 121, the end effector 10 can easily detect contact with the object S by arranging the amplification member 13.

[0087] Unlike conventional technology that uses an amplifier circuit to amplify electrical signals, the end effector 10 effectively transmits the pressure when the object S contacts the amplifying member 13, thereby promoting the deformation of the strain gauge of the pressure sensor 121, thus eliminating the need for additional elements such as an amplifier circuit. The end effector 10 achieves improved sensitivity to surface pressure, eliminating the need for amplification of the electrical signal itself. Therefore, the end effector 10 can avoid the amplification of external noise such as electromagnetic waves caused by additional elements such as amplifier circuits, which can then affect the object S. As described above, the end effector 10 can easily implement noise countermeasures for electrical signals.

[0088] Unlike conventional technologies that required the addition of noise suppression components such as coaxial cables or covers, the end effector 10 does not require such components. The end effector 10 can easily improve detection sensitivity by reducing the man-hours required for noise suppression. Unlike conventional technologies that required the modification of the shape to intentionally cause deflection in the strain gauge pattern or the installation of numerous pressure sensors, the end effector 10 can reduce the man-hours required for design and prototype verification, thereby reducing overall man-hours and costs. The end effector 10 can reduce design man-hours, eliminate the constraints of high investment and spatial freedom, and reduce costs related to time, expense, workload, and the number of units to be installed.

[0089] The amplification member 13 has a projection structure that protrudes outward relative to the pressure sensor 121. This allows the end effector 10 to position the amplification member 13 relative to the pressure sensor 121 as a thickness structure that promotes deformation of the strain gauge pattern P of the pressure sensor 121 due to the load from the object S. Therefore, the end effector 10 can improve the detection sensitivity of the pressure sensor 121.

[0090] The projection structure of the amplification member 13 is arranged linearly in at least a portion of the area between one end and the other end of the pressure sensor 121. This allows the end effector 10 to place the amplification member 13 over a wider area relative to the strain gauge pattern P, thereby improving the detection sensitivity of the pressure sensor 121.

[0091] The pressure sensor 121 includes a strain gauge. This allows the pressure sensor 121 to detect pressure by deforming the pattern P of the strain gauge and changing its electrical resistance.

[0092] The projection structure of the amplification member 13 is positioned to overlap the pattern P of the strain gauge of the pressure sensor 121 along the longitudinal direction D3. This allows the projection structure of the amplification member 13 to effectively transmit the pressure generated from the object S toward the pressure sensor 121 to the portion of the strain gauge pattern P that is positioned along the longitudinal direction D3.

[0093] The projection structure of the amplification member 13 is positioned to overlap the pattern P of the strain gauge of the pressure sensor 121 along the short-side direction D4. This allows the projection structure of the amplification member 13 to effectively transmit the pressure generated from the object S toward the pressure sensor 121 to the portion of the strain gauge pattern P that is positioned along the short-side direction D4. The end effector 10 can also further improve the detection sensitivity of the pressure sensor 121 compared to the case where the projection structure is positioned along the long-side direction D3.

[0094] The elastic modulus of the amplification member 13 is higher than that of the pressure sensor 121. Therefore, the end effector 10 can be configured so that the amplification member 13 is stiffer than the pressure sensor 121. Consequently, the end effector 10 can more easily deform the strain gauge pattern P of the pressure sensor 121 by the pressure applied to the amplification member 13 from the object S. This makes it possible for the end effector 10 to further improve the detection sensitivity of the pressure sensor 121.

[0095] The pressure sensor 121 has wiring W integrally formed on the resin surface of the main body 11 in a predetermined pattern, and contributes to the function of detecting the magnitude of the pressure generated when the end effector 10 grips the object S based on the wiring W itself. As a result, the end effector 10 can contribute to the function with a simpler configuration. The end effector 10 can simplify the circuit structure of the pressure sensor 121. The end effector 10 can simplify the configuration of the electrical circuit used in the end effector 10 without requiring separate wiring for the sensor, such as lead wires, to output an output signal from the pressure sensor 121.

[0096] The end effector 10 includes a circuit integrally formed with the resin in the main body 11 and has a circuit section 12 that contributes to a predetermined function. As a result, the end effector 10 can contribute not only to the basic function of gripping an object S, but also to the various functions described above. By integrally forming the circuit of the circuit section 12 with the resin, the end effector 10 does not require the separate placement of a sensor sheet or film, a substrate for forming an electrical circuit, etc., as in the conventional technology. The end effector 10 does not require the separate provision of joints or bonding parts for sheets, films, substrates, etc. The end effector 10 can also contribute to the simpler implementation of multiple functions.

[0097] As a result, the end effector 10 can achieve a reduction in the number of parts, miniaturization, and weight reduction, and can also meet the payload limit of the robot arm 1. The end effector 10 can also have a greater degree of freedom in its shape design. In addition, the end effector 10 has improved waterproofing and water resistance because the main body 11 contains resin, and can be cleaned for the purpose of preventing the spread of infectious diseases and other hygiene purposes. Unlike conventional metal end effectors, the end effector 10 is lightweight and rust can be suppressed during cleaning.

[0098] The end effector 10 tends to become charged due to the resin content of its main body 11, but even in such cases, static electricity can be easily discharged by the plated wiring W in the metal circuit formed on its surface. The end effector 10 can effectively discharge static electricity through the path shape of the wiring W drawn directly on its surface.

[0099] The end effector 10 can contribute to a predetermined function by having pattern P function as a strain gauge. More specifically, pattern P is a brush-like pattern in which a straight line is folded 180° at one end, and the folded straight line is folded again 180° at the other end. When an object S comes into contact with the wiring W formed by such pattern P via the amplification member 13, the amount of strain in the wiring W changes according to the pressure at the contact point. As the amount of strain changes, the resistance of the wiring W also changes. This causes a change in voltage between the input electrode E1 and the output electrode E2. For example, the control unit 40 of the robot arm 1 can calculate the pressure applied to the wiring W by measuring the amount of change in such voltage. In this case, the control unit 40 may use data that correlates the pressure generated when the end effector 10 grips the object S with the amount of change in voltage. Such data may be stored in advance in the storage unit 20, for example.

[0100] As described above, the robot arm 1 can measure the pressure applied to the tip of the claw portion 11b when gripping an object S using the pressure sensor 121 of the end effector 10. By detecting the magnitude of the pressure applied to the tip of the claw portion 11b, the robot arm 1 can appropriately adjust the load applied to the object S when gripping it. The robot arm 1 can suppress the application of a large load to the object S when gripping it, thereby preventing damage to the object S or failure of the end effector 10 itself.

[0101] Because the resin contains a thermoplastic resin, and the thermoplastic resin is a polyarylene sulfide resin, the end effector 10 can have improved waterproofing and water resistance. In addition, due to the excellent chemical resistance and heat resistance of the polyarylene sulfide resin, the end effector 10 can also have improved chemical resistance and heat resistance. This makes the end effector 10 usable in chemicals or for gripping high-temperature substances.

[0102] The end effector 10 facilitates the formation of a molded circuit using LDS by being composed of a resin containing a metal oxide that includes at least one of copper and chromium. The end effector 10 can provide functions such as generating heat when irradiated with a laser, melting the resin and roughening its surface, and being activated by laser irradiation, enabling the selective formation of a plating layer.

[0103] It will be apparent to those skilled in the art that this disclosure can be implemented in other predetermined forms besides the embodiments described above without deviating from its spirit or essential features. Therefore, the prior description is illustrative and not limiting. The scope of the disclosure is defined not by the prior description but by the added claims. Any modifications within their equivalent scope are included therein.

[0104] For example, the shape, pattern, size, arrangement, orientation, type, or number of each component described above are not limited to those shown in the above description and drawings. The shape, pattern, size, arrangement, orientation, type, or number of each component may be configured arbitrarily as long as it can realize its function. The components of the end effector 10 and robot arm 1 shown are functional concepts, and the specific form of each component is not limited to those shown.

[0105] For example, the length, width, height, spacing, hardness, shape, pattern, or arrangement of the amplification members 13 are not limited to those shown in the above description and drawings. These may be configured arbitrarily as long as they enable the amplification members 13 to perform their function.

[0106] In the above embodiment, the amplification member 13 was described as having a projection structure that protrudes outward from the mounting member R relative to the pressure sensor 121, but it is not limited to this. The amplification member 13 may have a projection structure that protrudes from the mounting member R toward the pressure sensor 121, or it may have a recessed structure that is recessed from the surface of the mounting member R toward the pressure sensor 121.

[0107] Figure 7 is a schematic diagram showing the configuration of the amplification member 13 of the end effector 10 according to the first modified example of the present disclosure. In the above embodiment, the projection structure of the amplification member 13 was described as being arranged linearly in at least a portion of the space between one end and the other end of the pressure sensor 121, but is not limited thereto. The projection structure of the amplification member 13 may be arranged curved relative to the pressure sensor 121, as shown in Figure 7. For example, the projection structure may be arranged concentrically. This makes it possible for the end effector 10 to place the amplification member 13 over a wider area relative to the strain gauge pattern P, thereby improving the detection sensitivity of the pressure sensor 121.

[0108] Alternatively, the projection structure of the amplification member 13 may have a plurality of local structures discretely arranged relative to the pressure sensor 121. This allows the end effector 10 to place the amplification member 13 over a wider area relative to the strain gauge pattern P, thereby improving the detection sensitivity of the pressure sensor 121.

[0109] In the above embodiment, the pressure sensor 121 was described as including a strain gauge, but is not limited thereto. The pressure sensor 121 may include any other sensor capable of detecting pressure.

[0110] In the above embodiment, the projection structure of the amplification member 13 was described as being arranged to overlap the pattern P of the strain gauge along the longitudinal direction D3 or the short direction D4 of the pattern P, but it is not limited to this. The projection structure may be arranged to overlap the pattern P of the strain gauge at an oblique direction.

[0111] In the above embodiment, the elastic modulus of the amplification member 13 was described as being higher than that of the pressure sensor 121, but this is not limited to this. The elastic modulus of the amplification member 13 may be less than or equal to that of the pressure sensor 121.

[0112] In the above embodiment, the pressure sensor 121 has wiring W integrally formed on the resin surface of the main body 11 in a predetermined pattern P, and is described as contributing to the function of detecting the magnitude of the pressure generated when the end effector 10 grips the object S based on the wiring W itself, but is not limited to this. The pressure sensor 121 of the circuit section 12 may have a substrate integrally molded with the resin of the main body 11, and wiring W formed on the substrate in a predetermined pattern P, and may contribute to a predetermined function based on the wiring W itself.

[0113] The circuit of the circuit section 12 may be based on a substrate that is integrally molded with resin, for example, by insert molding. In the circuit of the circuit section 12, the wiring and electrodes may be formed on the substrate. The circuit of the circuit section 12 may be configured as a molded circuit using IME, a type of MID. "IME" is an abbreviation for In-Mold Electronics. The circuit of the circuit section 12 may be formed by inserting a flexible substrate or the like during injection molding. As a result, the end effector 10 becomes a single molded product that contributes to a predetermined function by integrally molding the substrate with resin.

[0114] The circuit of the circuit section 12 may be configured as a molded circuit using a MID technology other than LDS and IME. For example, the circuit of the circuit section 12 may be formed by a process of forming at least one plating layer on the surface of the resin molded product of the main body section 11, using a mask corresponding to a predetermined pattern P of the wiring W of the circuit of the circuit section 12. In this case, the at least one plating layer may be formed as a layer made of metal and / or ceramics by electroless plating, electrolytic plating, sputtering, or a combination thereof.

[0115] In addition, the pressure sensor 121 of the circuit section 12 may be integrally attached to the surface of the resin of the claw section 11b by other means. The pressure sensor 121 may be attached, for example, to the surface of the resin forming the main body section 11 by adhesive or adhesive tape.

[0116] In the above embodiment, pattern P was described as repeatedly folding a straight line 180° at one end and then folding the folded straight line another 180° at the other end, but it is not limited to this. Pattern P may be any other pattern that can contribute to a predetermined function.

[0117] In the above embodiment, the circuit of the circuit section 12 was described as contributing to a predetermined function based on the wiring W itself, but this is not limited to this. The circuit section 12 may have sensor elements that contribute to any other function, which are mounted on the circuit of the circuit section 12 by soldering or the like, in place of or in addition to the wiring W that contributes to the predetermined function. In this disclosure, "sensor elements" may include, for example, microphones, proximity sensors, vibration sensors, PH sensors, LiDAR (Light Detection And Ranging) sensors, and image sensors. As a result, the end effector 10 can contribute to even more functions.

[0118] In addition, the circuit section 12 may have control elements that are mounted on the circuit of the circuit section 12 by soldering or the like and perform processing necessary to realize the function. In this disclosure, "control elements" may include, for example, a microcontroller, a processor, a programmable circuit, a dedicated circuit, or any combination thereof. This makes it possible for the end effector 10 to perform the various processing described above that is performed by the control unit 40 of the robot arm 1. The end effector 10 can also perform judgment processing, learning processing, and other arbitrary processing on its own.

[0119] In the above embodiment, it was explained that the entire main body portion 11, including the mounting portion 11a and the claw portion 11b, is made of resin, but this is not limited to this. It is sufficient that at least the portion of the main body portion 11 in which the circuit is formed is made of resin, and other parts of the main body portion 11 may be made of any material other than resin.

[0120] In the above embodiment, the circuit of the circuit section 12 is formed on the surface of the claw section 11b and is configured to be entirely exposed to the outside, but is not limited to this. The circuit of the circuit section 12 may be sealed with a resin that has high waterproof and water-resistant properties, such as PPS resin, except for the parts that contribute to a predetermined function. This can further improve the waterproof and water-resistant properties of the end effector 10.

[0121] Figure 8 is a schematic diagram showing an example of the appearance of an end effector 10 according to a second modified example of the present disclosure. In the above embodiment, the end effector 10 has been described as having a pair of claw portions 11b, i.e., two claw portions 11b, but is not limited thereto. The end effector 10 may have three or more claw portions 11b. For example, as shown in Figure 8, the end effector 10 may have three claw portions 11b.

[0122] Some embodiments of the present disclosure are described below. However, it should be noted that the embodiments of the present disclosure are not limited to these. [Note 1] An end effector used in robots, The main body contains resin, A pressure sensor positioned relative to the main body, An amplification member is positioned relative to the pressure sensor to increase the detection sensitivity of the pressure sensor, Equipped with, End effector. [Note 2] The end effector described in Appendix 1, The amplification member has a projection structure that protrudes outward from the pressure sensor. End effector. [Note 3] The end effector described in Appendix 2, The aforementioned projection structure is arranged linearly in at least a portion of the distance between one end and the other end of the pressure sensor. End effector. [Note 4] The end effector described in Appendix 3, The pressure sensor includes a strain gauge. End effector. [Note 5] The end effector described in Appendix 4, The projection structure is arranged so as to overlap the pattern along the longitudinal direction of the strain gauge pattern. End effector. [Note 6] An end effector as described in Appendix 4 or 5, The projection structure is arranged so as to overlap the pattern of the strain gauge along the shorter direction of the pattern. End effector. [Note 7] An end effector as described in any one of the appendices 2 to 6, The aforementioned projection structure is arranged in a curved shape relative to the pressure sensor. End effector. [Note 8] An end effector as described in any one of the appendices 2 to 7, The projection structure has a plurality of local structures that are discretely arranged relative to the pressure sensor. End effector. [Note 9] An end effector as described in any one of the appendices 2 to 8, The elastic modulus of the amplification member is higher than that of the pressure sensor. End effector. [Note 10] An end effector as described in any one of the appendices 1 to 9, The pressure sensor has wiring integrally formed in a predetermined pattern on the surface of the resin in the main body, and contributes to the function of detecting the magnitude of the pressure generated when the end effector grips an object based on the wiring itself. End effector. [Note 11] An end effector described in any one of the appendices 1 to 10, The aforementioned resin includes a thermoplastic resin. End effector. [Note 12] The end effector described in Appendix 11, The thermoplastic resin includes at least one selected from the group consisting of engineering plastics or super engineering plastics. End effector. [Note 13] The end effector described in Appendix 12, The thermoplastic resin is a polyarylene sulfide resin. End effector. [Note 14] A robotic arm equipped with an end effector as described in any one of the appendices 1 to 13. [Explanation of symbols]

[0123] 1. Robot arm 1a Enclosure 10 End Effectors 11 Main body 11a Mounting part 11b Claw part 12 Circuit section 121 Pressure Sensor 13 Amplifying element 20 Memory section 30 Drive unit 40 Control Unit D1 Separation direction D2 Extending direction D3 Longitudinal direction D4 Short direction E1 Input electrode E2 Output electrode L Gauge Lead P pattern R mounting component R1 area S Object W wiring

Claims

1. An end effector used in robots, The main body contains resin, A pressure sensor positioned relative to the main body, An amplification member is positioned relative to the pressure sensor to increase the detection sensitivity of the pressure sensor, Equipped with, End effector.

2. The end effector according to claim 1, The amplification member has a projection structure that protrudes outward from the pressure sensor. End effector.

3. The end effector according to claim 2, The aforementioned projection structure is arranged linearly in at least a portion of the distance between one end and the other end of the pressure sensor. End effector.

4. The end effector according to claim 3, The pressure sensor includes a strain gauge. End effector.

5. The end effector according to claim 4, The projection structure is arranged so as to overlap the pattern along the longitudinal direction of the strain gauge pattern. End effector.

6. The end effector according to claim 4, The projection structure is arranged so as to overlap the pattern of the strain gauge along the shorter direction of the pattern. End effector.

7. An end effector according to any one of claims 2 to 6, The aforementioned projection structure is arranged in a curved shape relative to the pressure sensor. End effector.

8. An end effector according to any one of claims 2 to 6, The projection structure has a plurality of local structures that are discretely arranged relative to the pressure sensor. End effector.

9. An end effector according to any one of claims 2 to 6, The elastic modulus of the amplification member is higher than that of the pressure sensor. End effector.

10. An end effector according to any one of claims 1 to 6, The pressure sensor has wiring integrally formed in a predetermined pattern on the surface of the resin in the main body, and contributes to the function of detecting the magnitude of the pressure generated when the end effector grips an object based on the wiring itself. End effector.

11. An end effector according to any one of claims 1 to 6, The aforementioned resin includes a thermoplastic resin. End effector.

12. The end effector according to claim 11, The thermoplastic resin includes at least one selected from the group consisting of engineering plastics or super engineering plastics. End effector.

13. The end effector according to claim 12, The thermoplastic resin is a polyarylene sulfide resin. End effector.

14. A robotic arm comprising an end effector according to any one of claims 1 to 6.

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