Reactor

Abstract

To simplify the structure by eliminating the need for windings, and to reduce manufacturing costs. [Solution] The device comprises an annular core, a substrate on which multiple conductive patterns are formed, and multiple conductive members formed in a substantially U-shape, which are bonded to the substrate in a manner that straddles the core and are arranged in a line in the extending direction of the core. The conductive members are connected to the ends of the conductive patterns at the bonding portion with the substrate, and the conductive patterns electrically connect adjacent conductive members in the extending direction. The multiple conductive patterns and multiple conductive members are arranged to surround the core and are connected in a coil-like manner.

Description

Technical Field

[0001] The present invention relates to a reactor.

Background Art

[0002] Patent Document 1 discloses a structure in which, for a reactor having windings wound around a core, the ends of the windings are joined to a substrate to integrate the reactor and the substrate.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In the configuration described in Patent Document 1, during manufacturing, there are steps of winding the windings around the core and assembling the reactor to the substrate after winding the windings around the core. The step of winding the windings around the core is complicated and costly.

[0005] The present invention has been made in view of the above circumstances, and an object thereof is to provide a reactor that can simplify the structure by a structure that does not include windings and can reduce the manufacturing cost.

Means for Solving the Problems

[0006] The present invention comprises an annular core, a substrate on which a plurality of conductor patterns are formed, and a plurality of conductive members formed in a substantially U-shape, bonded to the substrate in a manner that straddles the core, and arranged in a line in the extending direction of the core, wherein the conductive members are connected to the ends of the conductor patterns at the bonding portion with the substrate, the conductor patterns electrically connect adjacent conductive members in the extending direction, and the plurality of conductor patterns and the plurality of conductive members are arranged to surround the core and connected in a coil-like manner. [Effects of the Invention]

[0007] This invention simplifies the structure by eliminating the need for windings and reduces manufacturing costs. [Brief explanation of the drawing]

[0008] [Figure 1] This is a diagram showing the reactor in the first embodiment. [Figure 2] This is a diagram illustrating the structure of the reactor in the first embodiment. [Figure 3] This is a diagram illustrating the conductor pattern. [Figure 4] This is a diagram illustrating the detailed structure of the copper plate and the conductor pattern. [Figure 5] This figure schematically shows the reactor of the first modified example in the first embodiment. [Figure 6] This figure schematically shows a reactor in a second modified example of the first embodiment. [Figure 7] This figure shows the reactor in the second embodiment. [Figure 8] This is a diagram illustrating the detailed structure of the bypass circuit and semiconductor switch. [Figure 9] This figure shows the reactor in the third embodiment. [Figure 10] This is a diagram illustrating the detailed structure of the reactor in the third embodiment. [Figure 11]This diagram illustrates the detailed structure of the first copper plate, the second copper plate, the first conductor pattern, and the second conductor pattern. [Figure 12] This figure shows a reactor in a modified example of the third embodiment. [Modes for carrying out the invention]

[0009] The reactor in the embodiments of the present invention will be described in detail below. However, the present invention is not limited to the embodiments described below.

[0010] (First Embodiment) Figure 1 is a schematic diagram of a reactor in the first embodiment. Reactor 1 is a reactor that does not include windings. Reactor 1 comprises a core 2, a plurality of copper plates 3, and a substrate 4. Reactor 1 has a structure in which the copper plates 3 and the substrate 4 are integrated. A plurality of conductor patterns 5 are provided on the substrate 4. The plurality of copper plates 3 and the plurality of conductor patterns 5 are arranged to surround the core 2 and are connected in a coil shape. Reactor 1 is mounted on a vehicle.

[0011] Core 2 is an annular core made of a magnetic material and is formed in a flattened cylindrical shape. When viewed from the Z direction, Core 2 has a linear portion extending in a straight line and a curved portion extending in a curved line. Core 2 is positioned opposite the mounting surface 4a of the substrate 4. Core 2 and the substrate 4 are spaced apart in the Z direction, and an insulating member (not shown) is interposed between Core 2 and the substrate 4. Core 2 is supported by the substrate 4 via the insulating member. For example, an insulating member made of a gel-like material is interposed between Core 2 and the mounting surface 4a. As shown in Figures 1 and 2, Core 2 has a first end face 2a, which is one end face in the Z direction, a second end face 2b, which is the other end face in the Z direction, and a through hole 2c that penetrates in the Z direction. The second end face 2b faces the mounting surface 4a.

[0012] The copper plate 3 is a conductive member formed in a substantially U-shape. The copper plate 3 is bonded to the substrate 4 in a manner that straddles the core 2, and multiple copper plates 3 are arranged in a line in the extending direction of the core 2. In the first embodiment, five copper plates 3 are arranged at predetermined intervals in the extending direction of the core 2. The copper plate 3 is a flat plate provided perpendicular to the mounting surface 4a, with the Y direction being the thickness direction, the X direction being the width direction, and the Z direction being the height direction. Note that one side in the Z direction may be described as the upper side and the other side in the Z direction as the lower side.

[0013] The copper plate 3 has a first leg portion 3a, a second leg portion 3b, and an intermediate portion 3c. The first leg portion 3a is located on the outer circumference of the core 2, and its end portion 3d is joined to the substrate 4. The second leg portion 3b is located on the inner circumference of the core 2, and its end portion 3e is joined to the substrate 4 while inserted through a through hole 2c of the core 2. The first leg portion 3a and the second leg portion 3b extend in the Z direction, and the end portion 3d of the first leg portion 3a and the end portion 3e of the second leg portion 3b penetrate the substrate 4. The intermediate portion 3c is the part that connects the first leg portion 3a and the second leg portion 3b. The copper plate 3 has a pair of legs connected via the intermediate portion 3c. The intermediate portion 3c is located above the first end face 2a of the core 2 and extends in the X direction. The first leg portion 3a, the second leg portion 3b, and the intermediate portion 3c are all formed in a straight line. As shown in Figures 2 and 3, the copper plate 3 is connected to the end of the conductor pattern 5 at the joint with the substrate 4.

[0014] The substrate 4 is a printed circuit board on which a plurality of conductor patterns 5 are formed. In the reactor 1, a conductor pattern 5 that bears a part of the coil is provided within the substrate 4. The reactor 1 is configured to obtain an effect equivalent to that of a winding by electrically connecting the conductor pattern 5 and the copper plate 3. The substrate 4 has through-holes that serve as the bonding portions with the copper plate 3. The through-holes of the substrate 4 penetrate in the thickness direction of the substrate 4 and are holes through which the leg portions of the copper plate 3 are inserted. These through-holes are formed in accordance with the shape of the leg portions of the copper plate 3 and include a first through-hole through which the first leg portion 3a is inserted and a second through-hole through which the second leg portion 3b is inserted. A plurality of first through-holes and a plurality of second through-holes are arranged side by side in the Y direction at different positions in the X direction on the substrate 4. Among the plurality of through-holes, the first through-hole and the second through-hole for bonding the same copper plate 3 are provided at the same position in the Y direction and at positions separated from each other in the X direction. These through-holes serve as the portions where the copper plate 3 and the substrate 4 are bonded and also as the portions where the copper plate 3 and the conductor pattern 5 are connected. The copper plate 3 is connected to the end of the conductor pattern 5 at the bonding portion with the substrate 4. The first leg portion 3a is joined to the conductor pattern 5 by soldering or welding in a state of being inserted into the first through-hole. The second leg portion 3b is joined to the conductor pattern 5 by soldering or welding in a state of being inserted into the second through-hole.

[0015] The conductor pattern 5 is a coil pattern provided on the substrate 4. Multiple conductor patterns 5 are formed on the substrate 4, aligned in the direction of extension of the core 2. The number of conductor patterns 5 corresponds to the number of copper plates 3. As shown in Figures 2 and 3, a portion of the conductor pattern 5 is provided inside the substrate 4, and the remaining portion protrudes toward the mounting surface 4b. The mounting surface 4b is the surface opposite to the mounting surface 4a. The substrate 4 includes layers on which the conductor patterns 5 are formed and layers on which the conductor patterns 5 are not formed. Both ends of the conductor pattern 5 are connected to different copper plates 3. In the first embodiment, the conductor pattern 5 electrically connects adjacent copper plates 3 in the direction of extension of the core 2. The reactor 1 includes an electric circuit in which copper plates 3 and conductor patterns 5 are alternately connected. In the reactor 1, a coil-shaped conductor is formed that surrounds the core 2 by alternately connecting copper plates 3 arranged to straddle the core 2 and conductor patterns 5 on the substrate 4 side.

[0016] As shown in Fig. 4, they are arranged in the order of copper plates 3A, 3B, 3C, 3D, 3E from one side in the Y direction, and in the order of conductor patterns 5A, 5B, 5C, 5D. Adjacent copper plates 3A and 3B are electrically connected via conductor pattern 5A. Both ends of conductor pattern 5A are connected to the first leg 3a of copper plate 3A and the second leg 3b of copper plate 3B. Adjacent copper plates 3B and 3C are electrically connected via conductor pattern 5B. Both ends of conductor pattern 5B are connected to the first leg 3a of copper plate 3B and the second leg 3b of copper plate 3C. Adjacent copper plates 3C and 3D are electrically connected via conductor pattern 5C. Both ends of conductor pattern 5C are connected to the first leg 3a of copper plate 3C and the second leg 3b of copper plate 3D. Adjacent copper plates 3D and 3E are electrically connected via conductor pattern 5D. Both ends of conductor pattern 5D are connected to the first leg 3a of copper plate 3D and the second leg 3b of copper plate 3E. When current is input from the second leg 32b of copper plate 3A, current flows from the first leg 3a of copper plate 3A through conductor pattern 5A to the second leg 3b of copper plate 3B. Similarly hereinafter, current flows in the order of copper plate 3B, conductor pattern 5B, copper plate 3C, conductor pattern 5C, copper plate 3D, conductor pattern 5D, copper plate 3E, and is output from the first leg 3a of copper plate 3E.

[0017] On substrate 4, there is a projection area where core 2 is projected in the Z direction. The projection area is not limited to the mounting surface 4a but includes the inside of substrate 4. When looking at substrate 4 from the Z direction, there is a projection area with the same shape as core 2, and the shape of the projection area is a flat shape. Since the through holes of substrate 4 are provided outside the projection area, the ends of copper plates 3 and conductor patterns 5 are connected outside the projection area. Conductor pattern 5 extends across the projection area and is connected to the positive electrode side leg and the negative electrode side leg of one of the adjacent copper plates 3. When the first leg 3a is the positive electrode side leg and the second leg 3b is the negative electrode side leg, only the negative electrode side leg is arranged on one outside of the projection area, and only the positive electrode side leg is arranged on the other outside.

[0018] As explained above, according to the first embodiment, since the copper plate 3 and the substrate 4 are integrated, there is no need to wind the wire around the core 2, and the structure can be simplified by eliminating the need for a winding. During the manufacturing of the reactor 1, the process of winding the wire around the core 2 is unnecessary, so manufacturing costs can be reduced. Since the conductor pattern 5, which is part of the coil, is printed directly on the substrate 4, the reactor 1 can be made smaller and lighter.

[0019] Furthermore, the structure is not limited to one in which a portion of the conductor pattern 5 is provided inside the substrate 4. The entire conductor pattern 5 may be provided inside the substrate 4. Alternatively, the entire conductor pattern 5 may be provided only on the mounting surface 4a or the mounting surface 4b.

[0020] Furthermore, the shape of core 2 is not particularly limited. Core 2 may be circular or square.

[0021] Furthermore, the number of copper plates 3 and the locations where the copper plates 3 straddle the core 2 are not particularly limited. The copper plates 3 may be arranged to straddle not only the straight sections of the core 2, but also the curved sections.

[0022] Furthermore, the reactor 1 may be equipped with a metallic conductor instead of the copper plate 3. The metallic conductor is configured in a U-shape or gate shape.

[0023] (Modification of the first embodiment) In a modified version of the first embodiment, the reactor 1 comprises a plurality of cores 2. The reactor 1 may have a structure in which two cores 2 are stacked in the Z direction, as shown in Figure 5, or it may have a structure in which two cores 2 are arranged in the X direction, as shown in Figure 6.

[0024] As shown in Figure 5, the reactor 1 in the first modified example of the first embodiment comprises a first core 21 and a second core 22 facing the first core 21 in the Z direction. Both the first core 21 and the second core 22 are arranged on the same mounting surface 4a side and are formed in the same shape. Multiple copper plates 3 are arranged to straddle both the first core 21 and the second core 22, and are arranged side by side in the extending direction of the first core 21 and the extending direction of the second core 22. The first core 21 is configured similarly to core 2. The second core 22 is arranged facing the first end face of the first core 21 and is spaced apart from the first core 21 in the Z direction. An insulating member (not shown) is interposed between the second end face and the first end face of the first core 21. The second core 22 is supported by the first core 21 via the insulating member. The copper plate 3 and the conductor pattern 5 form a coil-shaped conductor that surrounds both the first core 21 and the second core 22, which are aligned in the Z direction. The conductor pattern 5 extends so as to cross both the projected area of ​​the first core 21 and the projected area of ​​the second core 22. In the first modified example, the projected area of ​​the first core 21 and the projected area of ​​the second core 22 coincide. In the example shown in Figure 5, the copper plate 3 is placed on the straight portion of the first core 21 and the straight portion of the second core 22, but in the first modified example, the copper plate 3 may be placed on the curved portion of the first core 21 and the curved portion of the second core 22.

[0025] As shown in Figure 6, the reactor 1 in the second modified example of the first embodiment comprises a first core 21 and a second core 22 arranged alongside the first core 21 in the X direction. In the second modified example, the straight portion of the first core 21 and the straight portion of the second core 22 are arranged opposite each other in the X direction. The straight portion of the first core 21 and the straight portion of the second core 22 are arranged parallel to the Y direction and are located at the same position in the Y direction. The second core 22 is positioned opposite the mounting surface 4a and is spaced apart from the substrate 4 in the Z direction. An insulating member (not shown) is interposed between the second end face of the second core 22 and the mounting surface 4a of the substrate 4. The second core 22 is supported by the substrate 4 via the insulating member. The copper plate 3 is arranged to straddle both the first core 21 and the second core 22 which are aligned in the X direction, and multiple copper plates are arranged side by side in the extending direction of the first core 21 and the extending direction of the second core 22. The first leg portion 3a is inserted through the through hole 2c of the first core 21, and its end portion 3d is joined to the substrate 4. The second leg portion 3b is inserted through the through hole 2c of the second core 22, and its end portion 3e is joined to the substrate 4. The intermediate portion 3c is positioned above the first end face 2a of the first core 21 and the first end face 2a of the second core 22, and is positioned to straddle both the straight portion of the first core 21 and the straight portion of the second core 22. The multiple copper plates 3 and the multiple conductor patterns 5 are arranged to surround both the first core 21 and the second core 22, which are aligned in the X direction, and are connected in a coil-like manner. In the second modified example, the projection area of ​​the first core 21 and the projection area of ​​the second core 22 are in different positions.

[0026] (Second Embodiment) The second embodiment is configured to mount a semiconductor switch and a bypass circuit on a conductor pattern 5 embedded in a substrate 4, and to optimize the inductance value and coil resistance value according to requirements. Note that the same configuration as in the first embodiment will not be described in detail, and its reference numerals will be used for reference only.

[0027] As shown in Figure 7, the reactor 1 of the second embodiment includes a bypass circuit 11, a first semiconductor switch 12, and a second semiconductor switch 13. The bypass circuit 11, the first semiconductor switch 12, and the second semiconductor switch 13 are all provided on the substrate 4.

[0028] The bypass circuit 11 is a circuit that bypasses a portion of the current circuit consisting of the copper plate 3 and the conductor pattern 5. The bypass circuit 11 is used to change the number of turns of the coil in the current circuit. As shown in Figure 8, the bypass circuit 11 is connected to the first leg 3a of copper plate 3C, the first leg 3a of copper plate 3D, and the first leg 3a of copper plate 3E. The bypass circuit 11 connects the first leg 3a of adjacent copper plates 3.

[0029] The first semiconductor switch 12 is a semiconductor switch connected to the conductor pattern 5, and switches between conducting and disconnecting the conductor pattern 5. When the first semiconductor switch 12 is turned on, the connected conductor pattern 5 becomes conductive. When the first semiconductor switch 12 is turned off, the connected conductor pattern 5 becomes non-conductive.

[0030] The second semiconductor switch 13 is a semiconductor switch connected to the bypass circuit 11, and switches between conducting and disconnecting the bypass circuit 11. When the second semiconductor switch 13 is turned on, the connected bypass circuit 11 becomes conductive. When the second semiconductor switch 13 is turned off, the connected bypass circuit 11 becomes non-conductive.

[0031] Reactor 1 can change the number of copper plates 3 and conductor patterns 5 included in the conductive path by switching the conductive path consisting of copper plates 3 and conductor patterns 5 using the bypass circuit 11 and first and second semiconductor switches 12 and 13. In reactor 1, the number of coil turns is adjusted by switching the first semiconductor switch 12 and the second semiconductor switch 13 as needed.

[0032] As shown in Figure 8, the bypass circuit 11 and the second semiconductor switch 13 are mounted on the substrate 4 in a vertical arrangement. Both the bypass circuit 11 and the second semiconductor switch 13 are positioned perpendicular to the mounting surfaces 4a and 4b, and at least a portion of them is located inside the substrate 4. Both the bypass circuit 11 and the second semiconductor switch 13 are positioned partially inside the substrate 4, with the remaining portion protruding towards the mounting surface 4b. In comparison, when the bypass circuit and the second semiconductor switch are mounted on the substrate in a planar arrangement along the XY plane, a large mounting area on the substrate must be secured in order to arrange the bypass circuit and the second semiconductor switch in the XY plane. In contrast, in the second embodiment, since the bypass circuit 11 and the second semiconductor switch 13 are positioned vertically, the mounting area of ​​the substrate 4 can be reduced compared to the comparative example.

[0033] According to the second embodiment, the number of coil turns in the coil-shaped conductor can be adjusted by switching the conduction path of the current circuit using the bypass circuit 11 and the first and second semiconductor switches 12 and 13. This allows the length of the conduction path to be shortened as needed, reducing losses due to current flow. This also provides the effect of reducing magnetic losses by optimizing the inductance. The vertical arrangement of the bypass circuit 11 and the second semiconductor switch 13 reduces the area of ​​the mounting surfaces 4a and 4b, enabling miniaturization of the reactor 1.

[0034] (Third embodiment) The third embodiment is a reactor 1 having two cores arranged on both sides of a substrate 4, and is configured to cancel out magnetic flux by alternately arranging coil-shaped conductors with different current directions on the substrate 4 and changing the direction of the current in each coil-shaped conductor. The same configuration as in the first embodiment will not be described and will be referred to by reference numerals.

[0035] As shown in Figure 9, the reactor 1 of the third embodiment comprises a first core 21, a second core 22, a plurality of first copper plates 31, a plurality of second copper plates 32, a plurality of first conductor patterns 51, and a plurality of second conductor patterns 52.

[0036] As shown in Figure 10, the first core 21 is positioned on the mounting surface 4a side of the substrate 4. The second core 2B is positioned on the mounting surface 4b side of the substrate 4, with its first end face 2a facing the mounting surface 4b of the substrate 4. Both the first core 21 and the second core 22 have straight sections and are formed in the same shape. The reactor 1, including the first core 21 and the second core 22, can be implemented with a projected area equivalent to that of a single core. The second core 22 is spaced apart from the substrate 4 in the Z direction. The second core 22 is supported by the substrate 4 via an insulating member. An insulating member is interposed between the first end face 2a of the second core 22 and the mounting surface 4b.

[0037] The first copper plate 31 and the second copper plate 32 are formed to the same shape. The first copper plate 31 is arranged so as to straddle the straight portion of the first core 21 on the mounting surface 4a side, and multiple plates are arranged in line in the extending direction of the first core 21. The first copper plate 31 has a first leg portion 31a, a second leg portion 31b, and an intermediate portion 31c. The second copper plate 32 is arranged so as to straddle the straight portion of the second core 22 on the mounting surface 4b side, and multiple plates are arranged in line in the extending direction of the second core 22. The second copper plate 32 has a first leg portion 32a, a second leg portion 32b, and an intermediate portion 32c. The intermediate portion 32c is located below the second end face 2b of the second core 22. As shown in Figure 11, the first leg portions 31a and 32a are arranged alternately in the Y direction and are bonded to the substrate 4. The second legs 31b and 32b are arranged alternately in the Y direction and are joined to the substrate 4. The first copper plate 31 is connected to the end of the first conductor pattern 51 at the joint with the substrate 4. The second copper plate 32 is connected to the end of the second conductor pattern 52 at the joint with the substrate 4.

[0038] The first conductor pattern 51 and the second conductor pattern 52 are arranged alternately in the extending direction of the first core 21 and the extending direction of the second core 22. The first conductor pattern 51 electrically connects the first copper plates 31 that are arranged on either side of the second copper plate 32, among a plurality of first copper plates 31 arranged in the extending direction of the first core 21. The first conductor pattern 51 connects one first leg 31a to the other second leg 31b of the first copper plates 31 that are arranged on either side of the second copper plate 32. The second conductor pattern 52 electrically connects the second copper plates 32 that are arranged on either side of the first copper plate 31, among a plurality of second copper plates 32 arranged in the extending direction of the second core 22. The second conductor pattern 52 connects one first leg 32a to the other second leg 32b of the second copper plates 32 that are arranged on either side of the first copper plate 31.

[0039] The conductor formed by connecting the first conductor pattern 51 and the first copper plate 31 forms a coil-shaped conductor arranged to surround the first core 21. The conductor formed by connecting the second conductor pattern 52 and the second copper plate 32 forms a coil-shaped conductor arranged to surround the second core 22.

[0040] Figure 9 shows the direction of current flowing through a coiled conductor with arrows. The direction of current flowing through the coiled conductor formed by the first conductor pattern 51 and the first copper plate 31, and the direction of current flowing through the coiled conductor formed by the second conductor pattern 52 and the second copper plate 32, are in directions that cancel each other's magnetic flux. When the reactor 1 is viewed from the Y direction, current flows clockwise in the coiled conductor made up of the first conductor pattern 51 and the first copper plate 31, and current flows counterclockwise in the coiled conductor made up of the second conductor pattern 52 and the second copper plate 32. In the third embodiment, two coiled conductors with different current directions are arranged alternately, and the magnetic flux is canceled out by changing the direction of the current.

[0041] According to the third embodiment, the magnetic flux linking the substrate 4 can be canceled out, thereby reducing noise. Since the two cores are mounted sandwiching the substrate 4, they can be mounted using the projected area of ​​a single core. This minimizes the substrate mounting area and reduces the area of ​​the mounting surfaces 4a and 4b of the substrate 4. Furthermore, it contributes to miniaturizing the vehicle on which the reactor 1 is mounted.

[0042] (Modified version of the third embodiment) In a modified example of the third embodiment, two cores are arranged on the same mounting surface. The reactor 1 may have a structure in which two cores 2 are arranged on the mounting surface 4a side and stacked in the Z direction, as shown in Figure 12. [Explanation of symbols]

[0043] 1 Reactor 2 cores 3 copper plate 4 circuit boards 5 Conductor Patterns 11 Bypass Circuit 12. First semiconductor switch 13. Second semiconductor switch

Claims

1. A ring-shaped core, A substrate on which multiple conductor patterns are formed, It is formed in a roughly U-shape and is bonded to the substrate in a manner that straddles the core, and a plurality of conductive members are arranged in line in the extending direction of the core, Equipped with, The conductive member is connected to the end of the conductor pattern at the joint with the substrate, The conductor pattern electrically connects adjacent conductive members in the direction of extension. The plurality of conductor patterns and the plurality of conductive members are arranged to surround the core and are connected in a coil-like manner. A reactor characterized by the following features.

2. A bypass circuit provided on the substrate that bypasses the conductor pattern, A first semiconductor switch provided on the substrate for switching between conduction and disconnection of the conductor pattern, The substrate is provided with a second semiconductor switch that switches between conducting and disconnecting the bypass circuit, The first semiconductor switch is connected to the conductor pattern, The second semiconductor switch is connected to the bypass circuit, By switching the conductive path consisting of the conductor pattern and the conductive member using the first semiconductor switch and the second semiconductor switch, the number of conductive members and the number of conductor patterns included in the conductive path can be changed. The reactor according to feature 1.

3. The bypass circuit is arranged perpendicular to the mounting surface of the substrate, and at least a portion of it is provided inside the substrate. The second semiconductor switch is arranged perpendicular to the mounting surface of the substrate, and at least a portion of it is located inside the substrate. The reactor according to feature 2.

4. The aforementioned core is A first core is disposed on one side of the substrate, The system includes a second core arranged alongside the first core, The plurality of conductive members are bonded to the substrate in such a manner that they straddle both the first core and the second core, and are arranged side by side in the extending direction of the first core and the extending direction of the second core. The plurality of conductor patterns and the plurality of conductive members are arranged to surround both the first core and the second core, and are connected in a coil-like manner. A reactor according to any one of the features 1 to 3.

5. The aforementioned core is A first core is disposed on one side of the substrate, The substrate includes a second core disposed on the other side of the substrate, The plurality of conductive members are, A plurality of first conductive members are arranged on one side of the substrate so as to straddle the first core and are arranged in line with the extending direction of the first core, The substrate includes a plurality of second conductive members arranged on the other side of the substrate so as to straddle the second core and arranged in line with the extending direction of the second core, The plurality of conductor patterns are, A plurality of first conductor patterns that electrically connect adjacent first conductive members in the extending direction of the first core, The second core includes a plurality of second conductor patterns that electrically connect adjacent second conductive members in the extending direction of the second core, The first conductor pattern and the second conductor pattern are arranged alternately in the direction of extension of the first core and the direction of extension of the second core. The first conductive member is connected to the end of the first conductor pattern at the junction with the substrate, The second conductive member is connected to the end of the second conductor pattern at the junction with the substrate, The plurality of first conductor patterns and the plurality of first conductive members are arranged to surround the first core and are connected in a coil shape. The plurality of second conductor patterns and the plurality of second conductive members are arranged to surround the second core and are connected in a coil shape. The direction of the current flowing through the coil-shaped conductor formed by the first conductor pattern and the first conductive member, and the direction of the current flowing through the coil-shaped conductor formed by the second conductor pattern and the second conductive member, are in directions that cancel each other's magnetic fluxes. The reactor according to feature 1.

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