Adhesive tape, and method for manufacturing a part using the adhesive tape.

Abstract

This disclosure provides an adhesive tape that allows for visual inspection of the quality of the cut surfaces of all chips after cutting electronic components to a minute size, by bending the tape, and then allows for the removal of the minute electronic components simply by stretching the tape. This disclosure also provides a method for manufacturing components using the adhesive tape described above. [Solution] The adhesive tape of this disclosure has an adhesive layer on at least one surface of a substrate, and the substrate has a 25% modulus S 25 S is obtained by multiplying (MPa) by the thickness T (μm) of the substrate. 25 The coefficient of force (T) is greater than 75 but less than or equal to 5000 (MPa·μm), the thickness of the substrate is 500 μm or less, and the absolute value of the difference between the 25% modulus and the 300% modulus of the adhesive layer is 0.5 MPa or more.

Description

[Technical Field]

[0001] This disclosure relates to an adhesive tape suitably used for temporary fixing of parts. In particular, it relates to an adhesive tape having stretchable peelability, which allows it to be stretched (stretched) and peeled off from the adherend. [Background technology]

[0002] In the manufacturing of electronic components such as semiconductor wafers, multilayer ceramic capacitors (MLCCs), and inductors, the workpiece is fixed to adhesive tape, and after manufacturing one or more processed parts (electronic components) through processes such as grinding, processing, transport, and dicing, the processed parts are peeled off and detached from the adhesive tape. In such manufacturing processes, the tape used for temporary fixing of the workpiece and processed parts (collectively referred to as processed parts, etc.) is sometimes called "temporary fixing tape," "processing tape," etc.

[0003] As an example of such adhesive tapes, Patent Document 1 discloses a heat-foaming release tape in which the adhesive strength decreases due to the foaming or expansion of thermally expandable balloons in the adhesive layer upon heating. Patent Document 1 discloses a method in which a workpiece is fixed to the heat-foaming release tape, and after processing, heat is applied to the tape to peel the workpiece off the tape. Patent Document 2 also discloses an active energy ray curing release tape in which the adhesive layer hardens and the adhesive strength decreases upon irradiation with active energy rays such as UV. Patent Document 2 discloses a method in which a workpiece is fixed to the active energy ray curing release tape, and after processing, UV is irradiated to peel the workpiece off the tape. [Prior art documents] [Patent Documents]

[0004] [Patent Document 1] Japanese Patent Publication No. 2010-229399 [Patent Document 2] Japanese Patent Publication No. 2002-121511 [Overview of the project] [Problems that the invention aims to solve]

[0005] In manufacturing methods for processed products using heat-foaming release tape, the heat applied during tape peeling can cause thermal degradation and other problems to the processed product. In particular, in the manufacturing process of MLCCs, heating the laminated thin films can easily cause quality problems such as cracks. Furthermore, heat-foaming release tape requires sufficient foaming or expansion of the thermally expandable balloons in the adhesive layer to adequately reduce the adhesive strength, which can require long heating times or high heating temperatures. Moreover, when heat is applied during the processing of the workpiece, the thermally expandable balloons in the adhesive layer may foam or expand at a point different from when the workpiece is to be detached, causing the workpiece to detach, making temperature control difficult.

[0006] In manufacturing methods for processed products using active energy ray curing release tape, the processed product may be affected by photodegradation or other issues due to the active energy rays irradiated during tape peeling. Furthermore, if the amount of active energy rays irradiated onto the tape is insufficient, the adhesive strength of the tape may not decrease sufficiently, resulting in the processed product not being easily peeled off the tape or adhesive residue being left on the processed product.

[0007] The inventors have discovered a method for temporary fixing without the problems associated with conventional process tapes: using an adhesive tape with stretchable release properties (hereinafter sometimes referred to as "stretchable release tape") that can be stretched and peeled off the adherend by pulling, instead of conventional process tapes, for process applications. However, further investigation by the inventors revealed the following new problems.

[0008] In the manufacturing process of electronic components, there is a process of fixing a workpiece on an adhesive tape and cutting it by die-cutting to form small chips. Since the cut surface of the chip can provide information related to the internal quality of the electronic component along with the impact of the cutting state on the quality, a quality inspection of the chip cross-section is performed after cutting. In this inspection, it is necessary to read information on the dimensions and shapes of internal electrodes and the like that can be observed from the chip cross-section by visual confirmation or acquisition of image information. However, immediately after cutting on the adhesive tape, the chips are in a state where there are no gaps between the chips and they are densely arranged, and it was difficult to obtain information on the dimensions and shapes of the chip cross-section in such a state. Therefore, some electronic component manufacturers have taken measures such as manually extracting a part of the chip and visually inspecting the cross-section, but currently, it is very labor-intensive and difficult to read the quality status of all chip arrays numbering in the tens of thousands. Furthermore, since the chips that were not inspected are not quality-checked, there was a problem that the product cost increased when defects were detected in a process after going through several processing steps. From the above, a method that can easily perform a quality check on all chips is desired.

[0009] To solve the above problems, after cutting the workpiece on the adhesive tape, the tape is bent so that the workpiece faces outward to expose the chip cross-section, and automation of quality confirmation with a camera is being considered. However, since the conventionally used heat-foaming release tape and UV-curing release tape selectively use a rigid substrate such as a PET substrate to suppress tape deformation caused by UV irradiation or intentional heating, the curvature when bending the tape to inspect the cutting quality becomes large, making it difficult to sufficiently expose the chip cross-section. These problems are more prominent especially in the case of components with a micro size such as MLCC.

[0010] The present disclosure has been made in view of the above circumstances, and provides an adhesive tape that can visually inspect the quality of the cut surfaces of all chips by bending the tape after cutting the electronic component into a micro size, and then can peel off the micro electronic component simply by stretching. The present disclosure also provides a method for manufacturing components using the above-described adhesive tape. [Means for Solving the Problems]

[0011] The present invention includes the following aspects. [1] An adhesive tape having an adhesive layer on at least one surface of a base material, and the 25% modulus S 25 of the base material multiplied by the thickness T (μm) of the base material 25 ·T is more than 75 and 5000 or less (MPa·μm), the thickness of the base material is 500 μm or less, and the absolute value of the difference between the 25% modulus and the 300% modulus of the adhesive layer is 0.5 MPa or more. [2] The adhesive tape according to [1], wherein the 300% modulus is twice or more the 25% modulus of the adhesive layer. [3] The adhesive tape according to [1] or [2], wherein the adhesive layer contains an extensible crystalline resin. [4] The adhesive tape according to any one of [1] to [3], wherein the adhesive layer contains a filler. [5] The adhesive tape according to [4], wherein the average particle diameter of the filler is 0.5 to 50 μm. [6] The adhesive tape according to any one of [1] to [5], wherein the adhesive layer contains at least one of a polymerizable compound and a polymer of the polymerizable compound. [7] The adhesive tape according to [6], wherein the polymerizable compound is a polyfunctional (meth)acrylate. [8] The adhesive tape according to any one of [1] to [7], wherein the rubber hardness of the base material is Shore A 40 to Shore D 75. [9] The adhesive tape according to any one of [1] to [8], wherein the arithmetic mean height (Sa) of the surface of the base material opposite to the adhesive layer is 0.100 μm or more.

[10] The adhesive tape according to any one of [1] to [9], wherein the base material has no yield point.

[11] The adhesive tape according to any one of [1] to

[10] , wherein the 180° peel adhesive strength measured by the method described below is 0.001 to 5 N / 20 mm. [Measurement Method of 180° Peel Adhesive Strength] The base material side of an adhesive tape cut to a length of 150 mm and a width of 50 mm was fixed to a stainless steel plate (length 200 mm, width 100 mm, thickness 3 mm) via double-sided tape (DIC Corporation, #8800CH). Next, under conditions of 23°C and 50% RH, the release liner of the adhesive tape was peeled off, and a PET film (thickness 25 μm, length 100 mm, width 20 mm) was pressed onto the adhesive layer of the adhesive tape by applying a load of 2 kg with a roller for one back-and-forth motion. After that, it was left to stand for 1 hour under conditions of 23°C and 50% RH. Under ambient conditions of 23°C and 50% RH, the PET film was peeled from the tape in a 180° direction at a tensile speed of 300 mm / min using a Tensilon tensile testing machine (model: RTF-1210, manufactured by A&D Co., Ltd.) to measure the 180° peel adhesion strength.

[12] An adhesive tape as described in any of [1] to

[11] , having a break elongation of 300 to 1000%.

[13] An adhesive tape as described in any of [1] to

[12] , having a thickness of 10 to 1500 μm.

[14] An adhesive tape as described in any of [1] to

[13] , which is used for temporarily fixing parts.

[15] A method for inspecting parts using an adhesive tape described in any of [1] to

[13] , comprising the step of bending the adhesive tape to which one or more parts are fixed, thereby exposing and inspecting the cross-section of the parts.

[16] The method for inspecting a part according to

[15] , further comprising the step of shifting the position in which the adhesive tape is bent to change the cross-section of the part to be inspected.

[17] A method for manufacturing a part using an adhesive tape described in any of [1] to

[13] , comprising a peeling step of stretching the adhesive tape on which one or more parts are fixed in at least one direction to peel the parts from the adhesive tape.

[18] The surface area of ​​each part that is detached from the adhesive tape by the peeling process is 1 mm² 2 The method for manufacturing the component described in

[17] is as follows:

[19] The adhesive tape according to

[14] , wherein the component is a multilayer ceramic capacitor, a semiconductor element, an inductor, or a chip.

[20] The method for inspecting a component according to

[15] or

[16] , wherein the component is a multilayer ceramic capacitor, a semiconductor element, an inductor, or a chip.

[21] A method for manufacturing a component according to

[17] or

[18] , wherein the component is a multilayer ceramic capacitor, a semiconductor element, an inductor, or a chip. [Effects of the Invention]

[0012] With the adhesive tape of this disclosure, after cutting electronic components to a minute size, the quality of the cut surfaces of all chips can be visually inspected by bending the tape, and then the minute electronic components can be peeled off simply by stretching the tape. The above effect is particularly pronounced when the adherend is a minute component of millimeter size or less, such as MLCCs. [Brief explanation of the drawing]

[0013] [Figure 1] This is a process diagram showing an example of a method for manufacturing a component using the adhesive tape disclosed herein. [Figure 2] This is a process diagram showing an example of a method for manufacturing a component using the adhesive tape disclosed herein. [Figure 3] This is an explanatory diagram illustrating the test method for evaluating the visibility of the cut surface of a chip. [Modes for carrying out the invention]

[0014] The following describes the adhesive tape of this disclosure and the method for manufacturing parts using the same. The adhesive tape of this disclosure may be referred to as the tape of this disclosure or simply as the tape.

[0015] In this specification, "stretch," "extend," "stretchability," and "extendability" refer to the act of stretching (extending) when tension is applied, for example, by pulling, and the property thereof.

[0016] In this specification, "low elongation" refers to a low elongation rate (elongation), which is the ratio of the length of the tape after stretching to the length of the tape before stretching, during the process of stretching the tape. Furthermore, "low elongation region" refers to the region in which the elongation rate is low relative to the length of the tape before stretching during the process of stretching the tape, that is, the region in the initial stage of stretching the tape. Specifically, the low elongation region can be a region in which the elongation of the tape is 400% or less, preferably 350% or less, more preferably 300% or less, and among these, the low elongation region is preferably a region in which the elongation of the tape is 200% or less, particularly 150% or less. The lower limit of the elongation in the low elongation region is not particularly limited as long as it is greater than 0%, and can be, for example, 5% or more, 10% or more, 30% or more, 50% or more, or 100% or more. The elongation of the tape when it is pulled, stretched, and peeled off (when the tape is stretched) is the value defined by the following formula, unless otherwise specified. Tape elongation [%] = {(length of tape after elongation) - (length of tape before elongation)} / (length of tape before elongation)

[0017] In this specification, the "surface area of ​​the side of the adherend (component) that contacts the tape (hereinafter sometimes referred to as the tape-side surface area)" refers to the area of ​​the surface of the adherend (component) that is located on the adhesive layer side (fixing surface) when one adherend (component) is placed on the tape before stretching and fixed. The "adhesion area (contact area)" of the adherend (component) refers to the area of ​​the region that is actually adhered to the adhesive layer, out of the surface area of ​​the side of the adherend (component) that contacts the tape. Before the tape is stretched, the surface area of ​​the side of the adherend (component) that contacts the tape and the adhesion area are approximately the same. However, when the tape is stretched, parts of the tape peel off from the adherend (component), reducing the contact area, resulting in the relationship "contact area < surface area of ​​the side of the adherend (component) that contacts the tape".

[0018] In this specification, "micro size" refers to a size of millimeter level or less, particularly a size from millimeter level to micro level. Also, "micro component" refers to a component of millimeter size or less among adherends, particularly a component from millimeter size to micro size. "Micro size" to "micro component" more specifically refers to a size including the dimensional size defined by JIS C 5101-22:2014 (IEC 60384-22:2011) or a component having such a size. Among them, for a micro component, it is preferable that the surface area of the surface contacting the tape of the present disclosure is 50 mm 2 or less, preferably 30 mm 2 or less, preferably 10 mm 2 or less, preferably 3 mm 2 or less, preferably 1 mm 2 or less, particularly preferably 0.5 mm 2 or less, and more preferably 0.2 mm 2 or less. The lower limit value of the above surface area is not particularly limited, but for example, it can be 0.001 mm 2 or more, preferably 0.01 mm 2 or more.

[0019] In this specification, the shapes and sizes of the elements in each drawing do not necessarily exactly match between the drawings, and the arrangement relationships and dimensional ratios between the elements also do not necessarily exactly match between the drawings. Also, in each drawing, the shapes and sizes of the elements do not necessarily exactly match the shapes and sizes of the actual objects, and the arrangement relationships and dimensional ratios between the elements also do not necessarily exactly match the arrangement relationships and dimensional ratios of the actual objects.

[0020] I. Adhesive Tape The adhesive tape of the present disclosure has a base material and an adhesive layer on at least one surface of the base material. 1. Adhesive Layer The adhesive layer in this disclosure is characterized in that the absolute value of the difference between the 25% modulus and the 300% modulus of the adhesive layer is 0.5 MPa or more. The tape in this disclosure needs to firmly fix workpieces in the manufacturing process of electronic components, and when peeling off the workpiece, it needs to be possible to peel off even minute electronic components simply by stretching the tape. As a result of sincere research by the inventors, it was found that when the absolute value of the difference between the 25% modulus and the 300% modulus of the adhesive layer is ≥ a predetermined value, the tape can exhibit sufficient adhesive strength for temporary fixing of the adherend before stretching, while at the same time, when the tape is stretched, a rapid decrease in adhesive strength occurs in the low-stretch region. Therefore, the tape in this disclosure can achieve both good adhesion before stretching and good peelability in the low-stretch region during the stretching process. The above-mentioned substrate is not particularly limited as long as it possesses the above-mentioned properties, and can be appropriately selected from known materials that can be used for tape.

[0021] The greater the absolute value of the difference between the 25% modulus and the 300% modulus of the adhesive layer, the more favorable it is for the adhesive strength in the low elongation range to change significantly before and after stretching the tape, making it easier to obtain excellent peelability. The absolute value of the difference between the 25% modulus and the 300% modulus of the adhesive layer is 0.5 MPa or more, preferably 0.6 MPa or more, more preferably 1.0 MPa or more, even more preferably 2.5 MPa or more, particularly preferably 4.0 MPa or more, and most preferably 4.2 MPa or more. By having the absolute value of the difference between the 25% modulus and the 300% modulus of the adhesive layer within the above range, an excellent rate of decrease in adhesive strength in the low elongation range can be obtained before and after stretching the tape. The upper limit of the absolute value of the difference between the 25% modulus and the 300% modulus of the adhesive layer is not particularly limited as long as the rate of decrease in adhesive strength before and after stretching the tape can be increased, but for example it can be 30 MPa or less, and preferably 20.0 MPa or less.

[0022] The 300% modulus of the adhesive layer relative to the 25% modulus is preferably 2 times or more, more preferably 2 to 10 times, even more preferably 2.2 to 9 times, and particularly preferably 2.5 to 8 times. By adjusting the 300% modulus of the adhesive layer relative to the 25% modulus within the above range, it is possible to achieve both good adhesion before elongation and good peelability in the low elongation region during the elongation process.

[0023] The 25% modulus of the adhesive layer described above is preferably 0.1 MPa to 10.0 MPa, more preferably 0.5 MPa to 7.0 MPa, even more preferably 0.6 MPa to 5.0 MPa, and particularly preferably 0.7 MPa to 3.5 MPa.

[0024] The 300% modulus of the adhesive layer described above is preferably 2.0 MPa to 50.0 MPa, more preferably 3.0 MPa to 45.0 MPa, even more preferably 4.0 MPa to 40.0 MPa, and particularly preferably 5.0 MPa to 35.0 MPa.

[0025] The 25% modulus and 300% modulus of the adhesive layer can be adjusted, for example, by adjusting the formulation of the adhesive resin contained in the adhesive layer, the hard block weight ratio of the block copolymer used as the stretchable crystalline resin, the formulation ratio of the diblock copolymer, the formulation of the tackifying resin, and the formulation weight ratio of the polymer (Y). The polymer (Y) will be explained in the section "(2) Polymerizable compound (Y') and polymer (Y) of polymerizable compound (Y')" below.

[0026] The 25% modulus and 300% modulus of the adhesive layer are measured by the measurement method described in the Examples section below under <25% modulus, 300% modulus>.

[0027] The thickness of the adhesive layer described above is not particularly limited, but can be, for example, 1 μm to 200 μm, preferably 3 μm to 100 μm, more preferably 5 μm to 80 μm, and even more preferably 7 μm to 50 μm. By setting the thickness of the adhesive layer within the above range, the tape exhibits good adhesive strength before stretching, while simultaneously reducing the adhesive strength in the low-elongation range in a short time during the stretching process.

[0028] The thickness of the adhesive layer described above is measured by the measurement method described in the section on <Thickness> in the Examples section described later. If the tape of this disclosure is a double-sided tape, the thickness of the adhesive layer refers to the thickness of the adhesive layer on each surface of the substrate. Also, if the tape of this disclosure is a double-sided tape, the thickness of the adhesive layer on one surface and the thickness of the adhesive layer on the other surface may be the same or different.

[0029] The elongation at break of the adhesive layer described above can be, for example, 200% or more, from the viewpoint of exhibiting stretchability. In particular, the elongation at break of the adhesive layer is preferably in a range that balances moderate stretchability with workability that allows the tape to be stretched and the parts to be easily peeled off, for example, 200% to 1500%, more preferably 250% to 1200%, more preferably 300% to 1000%, and even more preferably 350% to 800%. When the elongation at break of the adhesive layer is within the above range, the tape of this disclosure becomes less likely to break during the stretching process and can be stretched to the desired distance. In addition, the stretching distance of the tape (peel elongation) until the adhesive state between the tape and the adherend is released does not become too long, making it possible to work in a small space.

[0030] (Adhesive resin component) The composition of the adhesive layer in this disclosure is not limited, as long as the tape and adhesive layer of this disclosure can exhibit the desired physical properties. In particular, the adhesive layer preferably comprises at least an stretchable crystalline resin (X) and a polymer (Y) of a polymerizable compound (Y').

[0031] (1) Stretched crystalline resin (X) The stretchable crystalline resin (X) in the adhesive layer described above is the base polymer that constitutes the adhesive. Here, a stretchable crystalline resin is a resin that has the property of forming a crystalline structure when stretched, as the polymer chains stretched in the stretching direction come together to form a crystalline structure, and is a resin that has a regular molecular structure that easily forms a crystalline structure. A regular molecular structure is a structure in which each monomer unit tends to have asymmetric carbon atoms with the same stereochemistry along the chain, such as polyethylene and polypropylene. Such stretchable crystallinity can be identified in a tensile test. Specifically, it can be identified by a low 100% modulus (e.g., 5 MPa or less) and a high fracture stress relative to the 100% modulus (e.g., a fracture stress of 15 MPa or more).

[0032] Examples of stretchable crystalline resins (X) include block copolymers having at least polymer block A and polymer block B, wherein polymer block B has at least blocks containing structural units b1 having a crystalline skeleton. The block copolymers that can be used as stretchable crystalline resins (X) are sometimes described as block copolymers (X').

[0033] (Block copolymer (X')) The block copolymer (X') comprises at least polymer block A and polymer block B, wherein polymer block B comprises at least a block containing structural unit b1 having a crystalline skeleton. The block copolymer (X') may also be composed of polymer block A and polymer block B having a block containing structural unit b1. It is preferable that polymer block A is a hard block and polymer block B is a soft block.

[0034] Furthermore, the block copolymer (X') may have polymer block B having a block containing polymer block A and the structural unit b1, and polymer block C different from polymer blocks A and B. When the block copolymer (X') has polymer blocks A, B and C, it is preferable that polymer block B is located between polymer block A and polymer block C. When the block copolymer (X') has polymer blocks A, B and C, it is preferable that polymer block B is a mid-block phase located between polymer blocks A and C, and that polymer blocks A and C are end-block phases. It is also preferable that polymer blocks A and C are hard blocks and polymer block B is a soft block.

[0035] The above block copolymer (X') is, for example, • A diblock copolymer represented by polymer block A - polymer block B, Triblock copolymers represented as polymer block A-polymer block B-polymer block A, polymer block A-polymer block B-polymer block C, etc. Tetrablock copolymers represented as polymer block A-polymer block B-polymer block A-polymer block B, polymer block A-polymer block B-polymer block C-polymer block B, etc. Examples include pentablock copolymers represented as polymer block A-polymer block B-polymer block A-polymer block B-polymer block C, polymer block A-polymer block B-polymer block C-polymer block B-polymer block C, etc. In particular, diblock copolymers represented by polymer block A-polymer block B, or triblock copolymers represented by polymer block A-polymer block B-polymer block A or polymer block A-polymer block B-polymer block C are preferred.

[0036] (Polymer Block B) The polymer block B described above includes at least blocks containing structural units b1 having a crystalline skeleton. In the block copolymer (X'), since polymer block B contains blocks containing structural units b1 having a crystalline skeleton, the polymer chains become clustered together during elongation, forming a crystalline structure. The block copolymer (X') contained in the adhesive layer has polymer block B with such a specific structure, so that during the process of stretching the adhesive layer, the blocks containing the structural units b1 in polymer block B form a crystalline structure and a phase transition occurs. This increases the hardness of the adhesive layer, reduces the adhesive strength, and allows the adherend to be easily peeled off.

[0037] The structural unit b1 having a crystalline skeleton is not particularly limited as long as it is a structural unit that can form a crystalline structure by elongation, but examples include linear hydrocarbon structural units. Among these, linear aliphatic hydrocarbon structures are preferred. When the structural unit b1 having a crystalline skeleton is a linear hydrocarbon structural unit, the number of carbon atoms in the linear hydrocarbon constituting the structural unit b1 is not particularly limited, but for example, it can be 20 or less, preferably 10 or less, and more preferably 8 or less. Also, the number of carbon atoms is 2 or more, preferably 4 or more.

[0038] In polymer block B, an example of a block containing the structural unit b1 is a linear polyolefin block. The block containing the structural unit b1 only needs to have the structural unit b1 as its main component, and a block consisting of the structural unit b1 is preferred.

[0039] The content of structural unit b1 having a crystalline skeleton in the polymer block B is preferably 10% to 95% by mass, more preferably 30% to 90% by mass, and even more preferably 60% to 85% by mass.

[0040] Preferably, the polymer block B described above includes a block containing structural unit b1 having a crystalline skeleton, as well as a block containing structural unit b2 having an amorphous skeleton. An amorphous skeleton is a structure that does not form a crystalline structure when stretched in the direction of elongation, and has an irregular molecular structure. An irregular molecular structure refers to a structure in which, for example, the chiral carbon atoms in the main chain tend to have multiple different stereoconfigurations. Specifically, examples include polycarbonate and polymethyl methacrylate resin.

[0041] The polymer block B, which includes a block containing structural unit b1 having the crystalline skeleton and a block containing structural unit b2 having the amorphous skeleton, can be represented, for example, by the following formula (I).

[0042] [ka]

[0043] (In the above formula, b1 represents a structural unit having a crystalline skeleton, and b2 represents a structural unit having an amorphous skeleton. j and l are independent integers greater than 0, and k is an integer greater than or equal to 0.) When k is 0 in the above formula, polymer block B is composed of structural unit b1.

[0044] When the polymer block B contains a block with structural unit b1 having a crystalline skeleton and a block with structural unit b2 having an amorphous skeleton, structural unit b1 can form a crystalline structure by elongation, and structural unit b2 can have its extensibility improved. Structural unit b1, which has been given extensibility by structural unit b2 of polymer block B, becomes an oriented state that aggregates during the elongation process, forming a crystalline structure and causing a phase transition. As a result, the hardness of the adhesive layer increases, the adhesive strength decreases, and the adherend can be easily peeled off.

[0045] The structural unit b2 having an amorphous skeleton is not particularly limited as long as it is a structural unit that does not form a crystalline structure by elongation, for example, a branched hydrocarbon structural unit. Among these, a branched aliphatic hydrocarbon structural unit is preferred. The number of carbon atoms in the branched hydrocarbon constituting the structural unit b2 is not particularly limited, but for example it can be 20 or less, preferably 10 or less, and more preferably 8 or less. Also, the number of carbon atoms is 2 or more, preferably 4 or more. An example of a block containing the above structural unit b2 in such a polymer block B is a branched polyolefin block. The block containing the above structural unit b2 only needs to have the above structural unit b2 as the main component, and it is preferable that the block is made up of the above structural unit b2.

[0046] The polymer block B described above preferably has a block containing a linear hydrocarbon structural unit b1 and a block containing a branched hydrocarbon structural unit b2.

[0047] The polymer block B described above preferably does not contain unsaturated double bonds. The amount of remaining unsaturated double bonds is preferably 50 mol% or less, more preferably 30 mol% or less, even more preferably 10 mol% or less, even more preferably 5 mol% or less, and particularly preferably 0 mol%. The amount of remaining unsaturated double bonds in polymer block B can be determined by measuring the iodine value before and after hydrogenation.

[0048] The content of polymer block B in the block copolymer (X') is preferably 10% by mass or more and 95% by mass or less, more preferably 30% by mass or more and 90% by mass or less, and even more preferably 60% by mass or more and 85% by mass or less. When the proportion of polymer block B in the block copolymer (X') is within the above range, the block copolymer (X') becomes extensible, and during the extensibility process, the structural units b1 having a crystalline skeleton of polymer block B gather together and become oriented, causing a phase transition, which in turn can rapidly increase the hardness of the adhesive layer and reduce the adhesive strength.

[0049] (Polymer blocks A and C) Each of the above polymer blocks A and C may independently have structural units such as olefins like propylene, urethane, aromatic polyesters like PBT, polyamides, methacrylic acid esters, and aromatic vinyl compounds like styrene.

[0050] In particular, polymer block A preferably has a ring structure, and more preferably has an aromatic ring structure. Furthermore, when block copolymer (X') contains polymer blocks A and C, polymer blocks A and C each preferably have a ring structure independently, and more preferably have an aromatic ring structure. The cohesive force of the adhesive layer can be increased, making the adhesive layer less likely to tear during the stretching process of the tape and adhesive layer, and suppressing the generation of adhesive residue on the adherend when the adherend is peeled off and detached from the tape.

[0051] (Block copolymer (X')) The weight-average molecular weight of the block copolymer (X') can be appropriately selected depending on the type of block copolymer, but is preferably 50,000 to 500,000, more preferably 60,000 to 400,000, and even more preferably 70,000 to 300,000. In particular, it is preferable that the block copolymer is a styrene-based block copolymer and that the weight-average molecular weight of the styrene-based block copolymer is within the above range. The weight-average molecular weight of the block copolymer (X') is a polystyrene-equivalent value measured by gel permeation chromatography (GPC). (GPC measuring device and measurement conditions) Equipment: GPC system "GPC-8020" (manufactured by Tosoh Corporation) Separation column: Column "TSKgel Super HM-N (manufactured by Tosoh Corporation)" Eluent: Tetrahydrofuran Eluent flow rate: 150μL Flow rate: 1ml / min Sample concentration: 5 mg / 10 cc Column temperature: 40℃ Calibration curve: Created using standard polystyrene.

[0052] The block copolymer (X') described above preferably has a Shore hardness of A (Type A) 50 or higher and a Shore hardness of D (Type D) 75 or lower, more preferably a Shore hardness of A (Type A) 55 or higher and a Shore hardness of D (Type D) 65 or lower, and even more preferably a Shore hardness of A (Type A) 60 or higher and a Shore hardness of D (Type D) 60 or lower. Having the Shore hardness of the block copolymer (X') described above within the above range makes it easier to obtain suitable adhesive strength for the adhesive layer, and the high cohesive force makes it easier to suppress adhesive residue when peeling the adherend from the tape.

[0053] The Shore hardness of the block copolymer (X') described above is measured by the method described in the <Rubber Hardness> section of the Examples below, and is a Type A hardness or Type D hardness value measured using a durometer (spring-type rubber hardness tester, model: GS-719G, manufactured by Teclock Co., Ltd.) or a durometer (spring-type rubber hardness tester, model: GS-720G, manufactured by Teclock Co., Ltd.) in accordance with JIS K 6253. More specifically, Shore hardness A (Type A) is the value measured using a durometer (spring-type rubber hardness tester, model: GS-719G, manufactured by Teclock Co., Ltd.) in accordance with JIS K 6253, and Shore hardness D (Type D) is the value measured using a durometer (spring-type rubber hardness tester, model: GS-720G, manufactured by Teclock Co., Ltd.) in accordance with JIS K 6253. The Shore hardness is measured 15 seconds or more after loading the test sheet of block copolymer (X').

[0054] The Shore hardness of the above block copolymer (X') can be adjusted by the content ratio and density of polymer blocks A and C (hard domains) in the block copolymer (X').

[0055] The adhesive layer described above contains a stretchable crystalline resin (preferably a block copolymer (X')) as a base polymer. The content of the stretchable crystalline resin (block copolymer (X')) in the adhesive layer is preferably 5% to 60% by mass, more preferably 10% to 55% by mass, and even more preferably 20% to 50% by mass, based on 100% by mass of the adhesive layer (solid content of the adhesive composition). By setting the content of the stretchable crystalline resin (block copolymer (X')) in the adhesive layer within the above range, suitable adhesive strength can be easily obtained, and adhesive residue can be suppressed when the tape is stretched and peeled off the adherend.

[0056] Furthermore, the adhesive layer may contain polymers other than the stretchable crystalline resin (block copolymer (X')) as a base polymer. Examples of polymers other than the stretchable crystalline resin (block copolymer (X')) include resins that do not have stretchability (non-stretchable crystalline resins), specifically diblock copolymers, block copolymers that do not have the polymer block B, etc. More specifically as the non-stretchable crystalline resins, examples include styrene-ethylene-propylene copolymer (SEP) and styrene-ethylene-propylene-styrene copolymer (SEPS), etc.

[0057] For example, the base polymer of the adhesive layer may include an elongated crystalline resin (block copolymer (X')) selected from the group consisting of styrene-ethylene-butylene-styrene copolymer (SEBS) and styrene-ethylene-ethylene-propylene-styrene copolymer (SEEPS), and a non-elongated crystalline resin selected from the group consisting of styrene-ethylene-propylene copolymer (SEP) and styrene-ethylene-propylene-styrene copolymer (SEPS). Note that SEBS and SEEPS are elongated crystalline resins based on their molecular structure, while SEP and SEPS are non-elongated crystalline resins that do not possess elongated crystallinity based on their molecular structure.

[0058] The proportion of stretchable crystalline resin (block copolymer (X')) in the total amount of the above base polymer is preferably 30% by mass or more, more preferably 40% by mass or more, even more preferably 50% by mass or more, and particularly preferably 60% by mass or more. Having the proportion of stretchable crystalline resin (block copolymer (X')) in the total amount of the above base polymer within this range helps to suppress the inhibition of the function provided by the structure of the block copolymer (X') due to the presence of other polymers. The upper limit of the proportion of stretchable crystalline resin (block copolymer (X')) in the total amount of the above base polymer is 100% by mass, i.e., the entire base polymer is stretchable crystalline resin.

[0059] The content of the base polymer in the adhesive layer is not particularly limited as long as the adhesive function provided by the base polymer can be exhibited. However, it is preferably 10% to 70% by mass, more preferably 30% to 60% by mass, and even more preferably 35% to 55% by mass, based on 100% by mass of the adhesive layer (solid matter of the adhesive composition).

[0060] The block copolymer (X') can be a thermoplastic elastomer having a block structure. Examples include styrene-based block copolymers (soft segment: polybutadiene, polyisoprene, etc. / hard segment: polystyrene), olefin-based block copolymers (soft segment: ethylene propylene rubber / hard segment: polypropylene), polyurethane-based block copolymers (soft segment: polyether, polyester / hard segment: polyurethane), polyester-based block copolymers (soft segment: polyether / hard segment: polyester), polyamide-based block copolymers (soft segment: polypropylene glycol, polytetramethylene ether glycol, or polyester, polyether / hard segment: polyamide <nylon resin>), polybutadiene-based block copolymers (soft segment: amorphous butyl rubber / hard segment: syndiotactic 1,2-polybutadiene resin), and acrylic-based block copolymers (soft segment: polyacrylic acid ester / hard segment: polymethyl methacrylate).

[0061] In particular, the block copolymer (X') is preferably one or more block copolymers selected from the group consisting of styrene-based block copolymers, urethane-based block copolymers, acrylic-based block copolymers, and polyester-based block copolymers. Styrene-based block copolymers are preferred because they exhibit good compatibility with tackifiers used to adjust the tackiness of the adhesive layer, and the blending composition can be easily adjusted using commercially available raw materials.

[0062] The block copolymer (X') contained in the adhesive layer may be a single type or two or more types. When the block copolymer contained in the adhesive layer is two or more types, for example, block copolymer (X') may include one or more styrene-based block copolymers (X1) and non-styrene-based block copolymers. Furthermore, the block copolymer may contain two or more identical block copolymers with different structures. For example, if the block copolymer is a styrene-based block copolymer (X1), it may also include a styrene-based block copolymer (X11) and a styrene-based block copolymer (X12) with a structure different from that of the styrene-based block copolymer (X11).

[0063] (Styrene-based block copolymer) When the block copolymer (X') is a styrene-based block copolymer (X1), it is preferable that the styrene-based block copolymer (X1) has a structural unit (a1) derived from an aromatic vinyl compound that becomes polymer block A, and polymer block B has a structural unit (a2) derived from a hydrogenated conjugated diene compound. When the styrene-based block copolymer (X1) has polymer blocks A, B, and C, it is preferable that polymer block C has a structural unit (a1) derived from an aromatic vinyl compound independently of polymer block A. In the styrene-based block copolymer (X1), the structural unit (a1) derived from the aromatic vinyl compound is a hard domain, and the structural unit (a2) derived from the hydrogenated conjugated diene compound is a soft domain.

[0064] The polymer block B in the styrene-based block copolymer (X1) described above may have at least linear structural units (a2-1) derived from a hydrogenated conjugated diene compound, but it is preferable that it has both linear structural units (a2-1) derived from a hydrogenated conjugated diene compound and branched structural units (a2-2) derived from a hydrogenated conjugated diene compound. In this case, polymer block B has a random polymer block (random copolymer structure) of linear structural units (a2-1) derived from a hydrogenated conjugated diene compound and branched structural units (a2-2) derived from a hydrogenated conjugated diene compound.

[0065] Structural units derived from hydrogenated conjugated diene compounds refer to structural units in which the double bond within the conjugated diene compound has been hydrogenated. The conjugated diene compound before hydrogenation is a diolefin having a conjugated double bond. In other words, the styrene-based block copolymer (X1) can be rephrased as a block copolymer in which polymer blocks A and C each independently have structural units (a1) derived from aromatic vinyl compounds, and polymer block B has at least structural units (a2-1) derived from linear polyolefins. In particular, it is preferable that polymer block B is a block copolymer having structural units (a2-1) derived from linear polyolefins and structural units (a2-2) derived from branched polyolefins.

[0066] -Structural unit (a1)- Examples of aromatic vinyl compounds that constitute the structural unit (a1) derived from the above aromatic vinyl compound include styrene, α-methylstyrene, 2-methylstyrene, 3-methylstyrene, 4-methylstyrene, 4-propylstyrene, 4-t-butylstyrene, 4-cyclohexylstyrene, 4-dodecylstyrene, 2,4-dimethylstyrene, 2,4-diisopropylstyrene, 2,4,6-trimethylstyrene, 2-ethyl-4-benzylstyrene, 4-(phenylbutyl)styrene, 1-vinylnaphthalene, 2-vinylnaphthalene, vinylanthracene, N,N-diethyl-4-aminoethylstyrene, vinylpyridine, 4-methoxystyrene, monochlorostyrene, dichlorostyrene, divinylbenzene, 1,1-diphenylethylene, N,N-dimethyl-p-aminoethylstyrene, and N,N-diethyl-p-aminoethylstyrene. The above aromatic vinyl compounds may be used individually or in combination of two or more.

[0067] In particular, the above structural unit (a1) is preferably derived from an aromatic vinyl compound selected from styrene, α-methylstyrene, and 4-methylstyrene, and more preferably derived from styrene. That is, it is preferable that polymer blocks A and C each have a styrene-derived structural unit (a1) represented by the following chemical formula (II).

[0068] [ka]

[0069] The content of structural units (a1) derived from aromatic vinyl compounds in the above-mentioned styrene-based block copolymer (X1) is preferably in the range of 20% to 80% by mass, preferably in the range of 22% to 50% by mass, more preferably in the range of 25% to 40% by mass, and even more preferably in the range of 28% to 35% by mass, based on the total amount of the styrene-based block copolymer (X1). By containing structural units (a1) derived from aromatic vinyl compounds in the above range, the cohesive force of the adhesive layer can be increased, the adhesive layer becomes less likely to tear during the stretching process of the tape and adhesive layer, and the generation of adhesive residue on the adherend when the adherend is peeled off and detached from the tape can be suppressed.

[0070] -Structural Unit (a2)- Structural units derived from hydrogenated conjugated diene compounds refer to structural units in which the double bond in a structural unit derived from a conjugated diene compound has been hydrogenated. The conjugated diene compound before hydrogenation is a diolefin having a conjugated double bond. Structural units derived from hydrogenated conjugated diene compounds preferably have 4 to 20 carbon atoms, more preferably 4 to 10 carbon atoms, and even more preferably 4 to 8 carbon atoms. Examples of the conjugated diene compounds that constitute such structural units derived from hydrogenated conjugated diene compounds include 1,3-butadiene, isoprene, 2,3-dimethyl-1,3-butadiene, 2-phenyl-butadiene, 1,3-pentadiene, 2-methyl-1,3-pentadiene, 3-methyl-1,3-pentadiene, 2,3-dimethyl-1,3-pentadiene, 4-methyl-1,3-pentadiene, 1,3-hexadiene, 2,4-hexadiene, 1,3-octadiene, and 1,3-cyclohexadiene. Examples include 2-methyl-1,3-octadiene, 1,3,7-octatriene, 1,3-cyclopentadiene, 2-phenyl-1,3-butadiene, 2-phenyl-1,3-pentadiene, 3-phenyl-1,3-pentadiene, 2-hexyl-1,3-butadiene, 1,3-hexadiene, 1,3-cyclohexadiene, 3-methyl-1,3-hexadiene, 2-benzyl-1,3-butadiene, 2-p-tolyl-1,3-butadiene, myrcene, farnesene, and chloroprene.

[0071] When the polymer block B in the styrene-based block copolymer (X1) has linear structural units (a2-1) derived from a hydrogenated conjugated diene compound and branched structural units (a2-2) derived from a hydrogenated conjugated diene compound, it is preferable that the conjugated diene before hydrogenation contains two or more types.

[0072] The linear structural unit (a2-1) can be appropriately selected from the above-mentioned conjugated diene compounds, which are capable of forming a linear structure by hydrogenation. Among these, 1,3-butadiene, 1,3-pentadiene, 1,3-hexadiene, 2,4-hexadiene, and 1,3-octadiene are preferred, and 1,3-butadiene is particularly preferred.

[0073] Furthermore, the branched structural unit (a2-2) can be appropriately selected from the above-mentioned conjugated diene compounds that can acquire a branched structure by hydrogenation. Among these, isoprene, isoprene, 2,3-dimethyl-1,3-butadiene, 2-phenyl-butadiene, 1,3-pentadiene, 2-methyl-1,3-pentadiene, 3-methyl-1,3-pentadiene, 2,3-dimethyl-1,3-pentadiene, 4-methyl-1,3-pentadiene, 1,3-cyclohexadiene, 2-methyl-1,3-octadiene, 1,3,7-octatri Isoprene is preferred, with 1,3-cyclopentadiene, 2-phenyl-1,3-butadiene, 2-phenyl-1,3-pentadiene, 3-phenyl-1,3-pentadiene, 2-hexyl-1,3-butadiene, 1,3-cyclohexadiene, 3-methyl-1,3-hexadiene, 2-benzyl-1,3-butadiene, and 2-p-tolyl-1,3-butadiene being particularly preferred.

[0074] -Polymerized Block B- In the polymer block B described above, the hydrogenation rate of the linear structural unit (a2-1) and the branched structural unit (a2-2) is preferably 80 mol% or more of the carbon-carbon double bond based on the conjugated diene compound unit, more preferably 90 mol% or more, even more preferably 95 mol% or more, and substantially preferably 100 mol%. By having the hydrogenation rate of the linear structural unit (a2-1) and the branched structural unit (a2-2) in the polymer block B described above be within the above range, the adhesive layer hardens in the low elongation range of the tape and adhesive layer, thereby reducing the adhesive strength and surface tackiness. The hydrogenation rate of the carbon-carbon double bond in polymer block B is measured by nuclear magnetic resonance spectroscopy (1H-NMR spectrum) before and after hydrogenation, and the hydrogenation rate is obtained from the measured values.

[0075] Polymer block B may contain structural units derived from other polymerizable monomers other than conjugated diene compounds, as long as they do not interfere with the effects of the present invention. Examples of other polymerizable monomers include at least one selected from aromatic vinyl compounds such as styrene, α-methylstyrene, o-methylstyrene, m-methylstyrene, p-methylstyrene, pt-butylstyrene, 2,4-dimethylstyrene, vinylnaphthalene, and vinylanthracene, methyl methacrylate, methyl vinyl ether, N-vinylcarbazole, β-pinene, 8,9-p-menthene, dipentene, methylenenorbornene, and 2-methylenetetrahydrofuran.

[0076] If polymer block B contains structural units derived from polymerizable monomers other than conjugated diene compounds, the content thereof is more preferably 20% by mass or less, even more preferably 10% by mass or less, and even more preferably 5% by mass or less, based on the total mass of polymer block B.

[0077] -Styrene-based block copolymer (X1)- Specifically, styrene-ethylene-butylene-styrene copolymer (SEBS) and styrene-ethylene-ethylene-propylene-styrene copolymer (SEEPS) are preferred as the styrene-based block copolymer (X1) mentioned above.

[0078] The weight-average molecular weight (Mw) of the above-mentioned styrene-based block copolymer (X1) is preferably 50,000 to 500,000, more preferably 60,000 to 400,000, even more preferably 65,000 to 300,000, and particularly preferably 70,000 to 250,000. If the above-mentioned adhesive layer contains two or more types of styrene-based block copolymers (X1), it is preferable that the Mn of at least one type of styrene-based block copolymer (X1) is within the above range, and it is more preferable that the Mn of all types of styrene-based block copolymers (X1) is within the above range.

[0079] The molecular weight distribution (Mw / Mn), which is the ratio of the weight-average molecular weight (Mw) to the number-average molecular weight (Mn) of the styrene-based block copolymer (X1), is not particularly limited, but is preferably greater than 1.0 and 1.5 or less, more preferably greater than 1.0 and 1.3 or less, even more preferably greater than 1.0 and 1.2 or less, and particularly preferably greater than 1.0 and 1.1 or less. If the adhesive layer contains two or more types of styrene-based block copolymers (X1), it is preferable that the Mw / Mn of at least one type of styrene-based block copolymer (X1) is within the above range, and it is more preferable that the Mw / Mn of all types of styrene-based block copolymers (X1) is within the above range.

[0080] The number-average molecular weight (Mn) and weight-average molecular weight (Mw) of the styrene-based block copolymer (X1) were determined by gel permeation chromatography (GPC) on a standard polystyrene basis, and the molecular weight distribution (Mw / Mn) was calculated from the above Mw and Mn values. Equipment: GPC-8020 (manufactured by Tosoh Corporation) Solvent: tetrahydrofuran Measurement temperature: 40℃ Flow rate: 1mL / min Injection volume: 150μL, concentration: 5mg / 10cc (block copolymer / THF)

[0081] If the adhesive layer contains a styrene-based block copolymer (X1), it may or may not contain other styrene-based block copolymers besides the styrene-based block copolymer (X1). Examples of styrene-based block copolymers other than the styrene-based block copolymer (X1) include styrene-based diblock copolymers and styrene-based triblock copolymers other than the styrene-based block copolymer (X1). Specifically, examples include styrene-isoprene block copolymers, styrene-isoprene-styrene block copolymers, styrene-isoprene-butadiene-styrene block copolymers, styrene-butadiene-styrene block copolymers, styrene-ethylene-butylene block copolymers, styrene-ethylene-propylene block copolymers, and hydrogenated products of these copolymers. These may be used individually or in combination of two or more. In particular, it is preferable that the styrene-based block copolymer other than the styrene-based block copolymer (X1) is a styrene-based diblock copolymer.

[0082] When the adhesive layer contains a styrene-based block copolymer (X1) and a styrene-based block copolymer other than the styrene-based block copolymer (X1), the content of the styrene-based block copolymer other than the styrene-based block copolymer (X1) in the adhesive layer (solid content of the adhesive composition) is preferably 50% by mass or less, preferably 40% by mass or less, more preferably 30% by mass or less, and even more preferably 20% by mass or less. Furthermore, the lower limit of the content of the styrene-based block copolymer other than the styrene-based block copolymer (X1) in the adhesive layer is 0% by mass.

[0083] (2) Polymerizable compound (Y') and polymer (Y) of polymerizable compound (Y') The adhesive layer preferably contains at least one of a polymerizable compound (Y') and a polymer (Y) of the polymerizable compound (Y'). By containing at least one of the polymerizable compound (Y') and a polymer (Y) of the polymerizable compound (Y') in the adhesive layer, the cohesive force of the adhesive layer can be increased, suppressing stringing when the tape is stretched and peeled off the adherend, making it easier to peel off. This improves peelability in the low elongation range. Note that the polymer (Y) of the polymerizable compound (Y') is different from and distinct from the polymers that constitute the base polymer and filler mentioned above.

[0084] An adhesive layer containing at least one of a polymerizable compound (Y') and a polymer (Y) of the polymerizable compound (Y') can be formed, for example, by applying an adhesive composition containing at least the stretchable crystalline resin (X) and the polymerizable compound (Y') to a release liner or substrate, and irradiating the coating film of the adhesive composition with active energy rays such as light to polymerize the polymerizable compound, or by heating the coating film of the adhesive composition to polymerize the polymerizable compound.

[0085] The adhesive layer preferably contains at least a polymer (Y) of the polymerizable compound (Y'). The coexistence of the stretchable crystalline resin (X) and the polymer (Y) of the polymerizable compound (Y') in the adhesive layer enhances the stereocontrol effect of the polymer (Y) on the stretchable crystalline resin (X), effectively reducing the elongation rate of the tape until the stretchable crystalline resin crystallizes. The adhesive layer contains a polymer (Y) of the polymerizable compound (Y'), but may also contain unreacted polymerizable compound (Y'). Of the total content of the polymerizable compound (Y') and its polymer (Y), the proportion of the polymer (Y) is preferably 50% by mass or more, more preferably 80% by mass or more, more preferably 90% by mass or more, even more preferably 95% by mass or more, and particularly preferably 100% by mass. By setting the proportion of the polymer (Y) in the total weight of the polymerizable compound (Y') and its polymer (Y) within the above range, it is possible to suppress an unintended increase in the adhesion force between the adhesive layer and the adherend caused by the presence of unreacted polymerizable compound (Y'), and to suppress the occurrence of the adhesion enhancement phenomenon in which the adhesive strength increases over time.

[0086] The polymerizable compound (Y') constituting the polymer (Y) described above is not particularly limited as long as it can be bonded by the application of energy, and examples include low molecular weight compounds (monomers, oligomers, copolymers, etc.) with an average molecular weight of around 1000. Examples of such polymerizable compounds (Y') include active energy ray polymerizable compounds that can be polymerized by irradiation with active energy rays such as light, and thermal polymerizable compounds that can be polymerized by heat. Among these, active energy ray polymerizable compounds are preferred because they easily yield dense polymers with high crosslinking density and are excellent at significantly reducing the adhesive strength of the adhesive surface of the tape when the tape is stretched and peeled off the adherend.

[0087] The active energy ray polymerizable compound is not particularly limited as long as it can form a polymer by irradiation with active energy rays. Examples of such active energy ray polymerizable compounds include monomers, oligomers, or copolymers of polyester, acrylic, urethane, amide, silicone, epoxy, etc. These can be used individually or in combination of two or more.

[0088] The above-mentioned active energy ray polymerizable compounds are preferably compounds having two or more polymerizable unsaturated double bonds in one molecule, and are preferably polyfunctional monomers and / or oligomers having two or more (preferably 2 to 6, more preferably 3 to 6) active energy ray polymerizable functional groups in one molecule. Examples of active energy ray polymerizable functional groups include vinyl groups, allyl groups, (meth)acryloyl groups, and other ethylenically unsaturated bond-containing groups. Multiple identical functional groups may be used, or two or more different functional groups may be used.

[0089] In particular, the above-mentioned active energy ray polymerizable compound preferably contains at least a polyfunctional (meth)acrylate, and more preferably the above-mentioned active energy ray polymerizable compound is a polyfunctional (meth)acrylate. That is, the above-mentioned adhesive layer preferably contains at least one of a polyfunctional (meth)acrylate and a polymer of a polyfunctional (meth)acrylate, and more preferably contains a polymer of a polyfunctional (meth)acrylate. This is because a polymer of a polyfunctional (meth)acrylate (especially a polymer of a polyfunctional (meth)acrylate with three or more functional groups) can have a network structure and has a high effect of stereocontrolling the stretchable crystalline resin.

[0090] Polyfunctional (meth)acrylates may be used individually or in combination of two or more. Examples of the above polyfunctional (meth)acrylates include polyethylene glycol di(meth)acrylate, tetraethylene glycol di(meth)acrylate, polypropylene glycol di(meth)acrylate, 1,2-ethanediol di(meth)acrylate, 1,2-propanediol di(meth)acrylate, 1,4-butanediol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, propylene glycol di(meth)acrylate, neopentyl glycol di(meth)acrylate, neopentyl glycol hydroxypivalate di(meth)acrylate, triplo Examples include pyrene glycol di(meth)acrylate, trimethylolpropane di(meth)acrylate, trimethylolpropane tri(meth)acrylate, tris(2-acryloyloxy) isocyanurate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, di(trimethylolpropane)tetra(meth)acrylate, di(pentaerythritol) penta(meth)acrylate, di(pentaerythritol) hexa(meth)acrylate, and other (meth)acrylates, as well as (meth)acrylate esters of sugar alcohols such as sorbitol.

[0091] Other examples of polyfunctional (meth)acrylates include urethane acrylate, polyester acrylate, epoxy acrylate, and the like.

[0092] The number of functional groups in a polyfunctional (meth)acrylate is not particularly limited, but two or more are preferred, and three or more are more preferred because the network structure of the polymer enhances the effect of stereocontrol on the stretchable crystalline resin. The upper limit of the number of functional groups is not particularly limited, but it can be 10 or less, preferably 6 or less, and more preferably 5 or less. In addition, the polyfunctional (meth)acrylate may have other functional groups such as hydroxyl groups to the extent that it does not impair the effect.

[0093] The thermopolymerizable compounds are preferably those that are unreactive at room temperature but exhibit crosslinking, polymerization, polycondensation, or polyaddition reactions at temperatures of 100°C or higher (preferably 150°C or higher). Examples of thermopolymerizable compounds include monomers, oligomers, or copolymers of polyurethane, acrylic-urethane, acrylic-styrene, fluororesin, acrylic-silicone, acrylic, polyester, polyolefin, melamine, benzoguanamine, epoxy, oxetane, phenol, and benzoxazine systems. Blocked isocyanates, carbodiimides, silane coupling agents, etc., can also be used as the above-mentioned thermopolymerizable compounds.

[0094] The molecular weight of the polymerizable compound (Y') is preferably 100 to 3000, more preferably 150 to 1000, even more preferably 150 to 1000, and even more preferably 200 to 500, from the viewpoint of compatibility with other resin components forming the adhesive layer (such as stretchable crystalline resins and tackifying resins) and ensuring safety for the human body while maintaining liquid properties that are easy for workers to handle. The weight-average molecular weight of the polymer (Y) of the polymerizable compound (Y') is a value (polystyrene equivalent) based on measurement by GPC (gel permeation chromatography).

[0095] The total content of the polymerizable compound (Y') and its polymer (Y) in the adhesive layer is preferably 4 parts by mass or more and less than 50 parts by mass, more preferably 10 parts by mass or more and 45 parts by mass or less, even more preferably 15 parts by mass or more and 40 parts by mass or less, and particularly preferably 20 parts by mass or more and 35 parts by mass or less, per 100 parts by mass of the stretchable crystalline resin (X). By having the total content of the polymerizable compound (Y') and its polymer (Y) in the adhesive layer within the above range per 100 parts by mass of the stretchable crystalline resin (X), the stereocontrol function of the stretchable crystalline resin (X) by the polymerizable compound (Y') and its polymer (Y) is effectively exerted, effectively reducing the elongation rate of the tape until the stretchable crystalline resin (X) crystallizes, and significantly reducing the adhesive strength even in the low elongation range. In particular, it is preferable that the content of the polymer (Y) of the polymerizable compound (Y') in the adhesive layer is within the above range per 100 parts by mass of the stretchable crystalline resin (X). In this case, it is preferable that all of the polymerizable compound (Y') exists as polymer (Y) in the adhesive layer.

[0096] Furthermore, the total content of the polymerizable compound (Y') and its polymer (Y) in the adhesive layer is preferably 1.5% to 20% by mass, more preferably 5% to 15% by mass, and even more preferably 10% to 14% by mass, based on 100% by mass of the adhesive layer (solid content of the adhesive composition). By having the total content of the polymerizable compound (Y') and its polymer (Y) in the adhesive layer within the above range, it is possible to achieve both good adhesion before elongation and good peelability in the low elongation region during the elongation process.

[0097] The polymerizable compound (Y') and its polymer (Y) are preferably photopolymerizable compounds and their polymers, and more preferably polyfunctional (meth)acrylates and their polymers. Furthermore, when the polymerizable compound (Y') is a photopolymerizable compound, the adhesive layer and adhesive composition preferably further contain a photopolymerization initiator described later. This is because it can promote the photopolymerization of the polymerizable compound (Y'), increase the proportion of polymer (Y) in the adhesive layer, and effectively exert a stereochemical control function on the stretchable crystalline resin (X).

[0098] Within the adhesive layer described above, the polymerizable compound (Y') and its polymer (Y) perform stereocontrol functions on the stretchable crystalline resin (X). Therefore, it is preferable that the polymerizable compound (Y') and its polymer (Y) do not have chemical bonds with the stretchable crystalline resin. In other words, it is preferable that the polymerizable compound (Y') and its polymer (Y) exist in a state in which substantially no reaction occurs with the stretchable crystalline resin.

[0099] The resin contained in the adhesive layer in this disclosure can be appropriately selected from known materials, in addition to the stretchable crystalline resin (X) and polymer (Y) of the polymerizable compound (Y') described above. Examples include acrylic adhesive resins, rubber adhesive resins, urethane adhesive resins, silicone adhesive resins, or other adhesive resins. These may be used individually or in combination of two or more.

[0100] (Adhesive-granting resin) The adhesive layer may further contain a tackifying resin. By further containing a tackifying resin, the tape can exhibit higher adhesive strength before stretching, and the adherend can be stably fixed.

[0101] There are no particular restrictions on the type of tackifying resin mentioned above, and it can be appropriately selected according to the purpose. Specifically, examples of the tackifying resins include rosin-based tackifying resins, polymerized rosin-based tackifying resins, polymerized rosin ester-based tackifying resins, rosin phenol-based tackifying resins, stabilized rosin ester-based tackifying resins, disproportionated rosin ester-based tackifying resins, hydrogenated rosin ester-based tackifying resins, terpene-based tackifying resins, terpene phenol-based tackifying resins, petroleum resin-based tackifying resins, (meth)acrylate-based tackifying resins, etc. The tackifying resins may be used individually or in combination of two or more. Among these, tackifying resins selected from the group consisting of petroleum resin-based tackifying resins, polymerized rosin ester-based tackifying resins, rosin phenol-based tackifying resins, disproportionated rosin ester-based tackifying resins, hydrogenated rosin ester-based tackifying resins, terpene phenol-based resins, and (meth)acrylate-based resins are preferred.

[0102] The softening point of the tackifying resin is not particularly limited, but is preferably 30°C to 180°C, and more preferably 70°C to 160°C. The softening point of the tackifying resin is measured by the softening point test method (ring-ball method) specified in either JIS K 5902 or JIS K 2207.

[0103] There are no particular restrictions on the content of the tackifying resin in the adhesive layer described above, and it can be appropriately selected depending on the purpose, but it is preferably 0% to 65% by mass, and more preferably 8% to 55% by mass, of 100% by mass of the adhesive layer (solid content of the adhesive composition forming the adhesive layer).

[0104] (Filler) The adhesive layer described above may contain one or more fillers. By further containing fillers in the adhesive layer, the surface of the adhesive layer becomes roughened in the low elongation range during the tape's stretching process, and the tackiness decreases, thus preventing the adherend from being reattached once it has been peeled off.

[0105] The filler content in the adhesive layer described above is not particularly limited, but can be 0% to 50% by volume, 5% to 50% by volume, 10% to 50% by volume, 15% to 45% by volume, or 20% to 40% by volume. By setting the filler content in the adhesive layer within the above range, the tape before stretching can exhibit excellent adhesive strength and stably maintain the fixation of the adherend. During the stretching process of the tape, when the tape is pulled and stretched, the tack of the adhesive layer is greatly reduced in the low elongation range, making it easy to peel off from the adherend and preventing the adherend from being reattached.

[0106] The filler content (volume %) in the adhesive layer is calculated using the method for calculating the filler content (volume ratio) in the adhesive composition (solids) described in the examples below.

[0107] The shape of the filler may be regular or irregular, and examples include polygonal, cubic, elliptical, spherical, needle-shaped, flat, scaly, or bead-shaped fillers. Among these, elliptical, spherical, or polygonal fillers are preferred, with spherical fillers being more preferred, because they allow the filler to remain protruding from the adhesive layer during the tape's stretching process, resulting in good slipperiness to the adherend. The filler may be of one type or a mixture of two or more types.

[0108] The filler described above is preferably a solid filler that does not have voids inside. The filler may also have a core-shell structure having a core and a shell that covers the surface of the core.

[0109] The above-mentioned filler may be an organic filler composed of resin, an inorganic filler composed of inorganic material, or an organic-inorganic composite filler.

[0110] Examples of inorganic materials that constitute inorganic fillers include metals, metal oxides, metal hydroxides, hydrated metal compounds, carbides, nitrides, titanates, carbon-based materials, glass, and minerals. More specifically, the above inorganic materials include aluminum hydroxide, magnesium hydroxide, aluminum oxide, silicon oxide, magnesium oxide, zinc oxide, titanium oxide, zirconium oxide, iron oxide, silicon carbide, boron nitride, aluminum nitride, titanium nitride, silicon nitride, titanium boride, carbon, nickel, copper, aluminum, titanium, gold, silver, zirconium hydroxide, basic magnesium carbonate, dolomite, hydrotalcite, calcium hydroxide, barium hydroxide, tin oxide, tin oxide hydrate, borax, zinc borate, zinc metaborate, barium metaborate, zinc carbonate, magnesium carbonate-calcium carbonate, calcium carbonate, and barium carbonate. Examples include molybdenum oxide, antimony oxide, red phosphorus, mica, clay, kaolin, talc, zeolite, wollastonite, smectite, silica (quartz, fumed silica, precipitated silica, anhydrous silicic acid, fused silica, crystalline silica, ultrafine amorphous silica, etc.), potassium titanate, magnesium sulfate, sepiolite, zonolite, aluminum borate, barium sulfate, barium titanate, zirconia oxide, cerium, tin, indium, carbon, sulfur, therium, cobalt, molybdenum, strontium, chromium, barium, lead, tin oxide, indium oxide, diamond, magnesium, platinum, zinc, manganese, stainless steel, etc. Among these, aluminum hydroxide and nickel are preferred.

[0111] Inorganic fillers may be surface-treated, such as silane coupling treatment or stearic acid treatment, to improve their dispersibility within the adhesive layer.

[0112] Examples of organic fillers include resin fillers composed of resins. Examples of resins that make up resin fillers include thermoplastic resins, thermosetting resins, rubber, etc., with thermoplastic resins being preferred. Examples of thermoplastic resins include thermoplastic plastics and thermoplastic elastomers.

[0113] Specifically, the resins that make up the resin filler include: polyolefin resins such as polyethylene and polypropylene; polyether resins such as polyoxymethylene and polyoxyethylene; halogenated polyolefins such as polyvinyl chloride and polyvinylidene chloride; carbonate resins such as polycarbonate; polyester resins such as polymethylene terephthalate, polyethylene terephthalate, and polybutylene terephthalate; polystyrene resin; acrylic resins such as polyacrylonitrile; acrylate resins such as polyacrylate, polymethacrylate, polymethyl methacrylate, polyethyl acrylate, and styrene / methacrylic acid copolymer; and poly Examples include vinyl carboxylic acid polymers such as vinyl acetate, ethylene-vinyl acetate copolymer, polyvinyl alcohol, and ethylene-vinyl alcohol copolymer, and their saponifications; cellulosic resins such as cellulose, ethylcellulose, cellulose acetate, and cellulose nitrate; rubbers such as butyl rubber, natural rubber, isobutylene rubber, butadiene rubber, and nitrile rubber; polyamides such as nylon (nylon 6, nylon 66, etc.) and aramid; epoxy resins such as bisphenol A type epoxy resin and novolac type epoxy resin; polyurethane; polyimide; melamine resin; phenolic resin; benzoguanamine resin; urea-formaldehyde resin; and fluororesin.

[0114] In particular, from the viewpoint of excellent dispersibility within the adhesive layer and adhesion with resins contained in adhesives such as the stretchable crystalline resin and tackifying resin, the resin filler is preferably composed of a resin selected from the group consisting of polyamide, acrylic resin, urethane resin, and cellulose, with polyamide or cellulose being more preferred.

[0115] The average particle size of the filler is preferably 0.5 μm to 50 μm, more preferably 1 μm to 40 μm, even more preferably 5 μm to 30 μm, and particularly preferably 7 μm to 20 μm. When the average particle size of the filler is within the above range, the tape exhibits excellent adhesive strength before stretching, stably maintaining the fixation of the adherend. On the other hand, during the stretching process, even with a small stretching distance (elongation), the surface roughness of the adhesive layer increases, significantly reducing tackiness.

[0116] The average particle size of the filler mentioned above refers to the volume-average particle size. The particle diameter of the filler is measured using a laser diffraction scattering method measuring instrument such as Microtrac, and the cumulative volume curve against particle size is determined with the total volume of the filler set to 100%. The particle diameter at the point on the cumulative curve where the cumulative volume is 50% is defined as the average particle size.

[0117] (Other ingredients) The above adhesive layer may contain a photopolymerization initiator. Examples of photopolymerization initiators include carbonyl compounds such as acetophenones, benzophenones, Michler ketones, and benzoins; sulfur compounds such as tetramethylthiuram monosulfide and thioxanthones; phosphorus compounds such as acylphosphine oxides; titanium compounds such as titanocenes; and azo compounds. One type of photopolymerization initiator may be used alone, or two or more types may be used in combination. Among these, acetophenones and benzophenones are preferred.

[0118] The content of the above-mentioned photopolymerization initiator is preferably 0.1% to 10% by mass, more preferably 0.5% to 7% by mass, and even more preferably 1% to 5% by mass, based on 100% by mass of the adhesive layer (solid content of the adhesive composition).

[0119] The adhesive layer described above preferably contains substantially no plasticizer. If the amount of plasticizer in the adhesive layer is large, when the tape is stretched and peeled off the adherend, contamination such as adhesive residue is likely to occur on the adherend. The plasticizer content in the adhesive layer is preferably 20% by mass or less, more preferably 10% by mass or less, even more preferably 5% by mass or less, and particularly preferably 0% by mass.

[0120] Examples of plasticizers include general-purpose materials used in adhesives, such as trimette acid ester plasticizers, pyromellitic acid ester plasticizers, polyester plasticizers, and adipic acid plasticizers. More specifically, examples of the above plasticizers include aliphatic polycarboxylic acid esters such as adipic acid esters, citrate esters, sebacate esters, azelaic acid esters, and maleic acid esters; aromatic polycarboxylic acid esters such as terephthalic acid esters, isophthalic acid esters, phthalic acid esters, trimellitic acid esters, and benzoic acid esters; ether-modified polyesters; epoxy-modified polyesters; and polyesters formed from polycarboxylic acids and polyols.

[0121] The adhesive layer described above may contain a crosslinking agent as needed. The type of crosslinking agent is not particularly limited and can be appropriately selected from known crosslinking agents. Examples of such crosslinking agents include isocyanate-based crosslinking agents, epoxy-based crosslinking agents, oxazoline-based crosslinking agents, aziridine-based crosslinking agents, melamine-based crosslinking agents, peroxide-based crosslinking agents, and metal chelate-based crosslinking agents. One type of crosslinking agent may be used alone, or two or more types may be used in combination. In particular, from the viewpoint of improving cohesive strength, isocyanate-based crosslinking agents and epoxy-based crosslinking agents are preferred. The amount of crosslinking agent used is not particularly limited and can be selected from a range of about 10 parts by mass or less (for example, about 0.005 to 10 parts by mass, preferably about 0.01 to 5 parts by mass) per 100 parts by mass of base resin (e.g., acrylic polymer).

[0122] The above adhesive composition may optionally contain various common additives such as leveling agents, crosslinking aids, softeners, colorants (dyes, pigments), antistatic agents, anti-aging agents, UV absorbers, antioxidants, or light stabilizers. Such additives can be used by conventional methods if they are known.

[0123] 2. Base material The substrate in this disclosure is 25% modulus S 25 S is obtained by multiplying the thickness T [μm] of the substrate by [MPa]. 25The tape is characterized by having a T of 50 to 5000 [MPa·μm]. The tape of this disclosure is required to bend in order to inspect the cross-section with a minute-sized electronic component attached to the tape, and then stretch in order to peel off the electronic component. In this process, the tape is required to have appropriate stiffness, flexibility, and stretchability. As a result of sincere consideration by the inventors, the flexibility and stretchability of the tape are determined by the 25% modulus S of the base material. 25 We found that it is important to keep the product of [MPa] and thickness T [μm] within a certain range. 25% Modulus S of the base material 25 [MPa] and thickness T [μm] contribute to the flexibility and stretchability of the tape, respectively. Generally, the higher the 25% modulus and the thicker the base material, the less flexible and stretchable the tape tends to be. Conversely, the lower the 25% modulus and the thinner the base material, the more flexible the tape becomes, and the more stretchable it becomes, but the more easily it breaks. Therefore, we found that by adjusting both the 25% modulus and the thickness of the base material—for example, lowering the 25% modulus when the base material is thick and raising it when the base material is thin—and keeping the product of the 25% modulus and the thickness of the base material within a certain range, it is possible to create a tape that excels in both flexibility and stretchability. The above-mentioned substrate is not particularly limited as long as it possesses the above-mentioned properties, and can be appropriately selected from known materials that can be used for tape.

[0124] 25% Modulus S of the above substrate 25 (MPa) and the product S of the thickness T (μm) of the above substrate. 25 T (MPa·μm) is greater than 75, more preferably 90 or higher, even more preferably 100 or higher, and particularly preferably 230 or higher. 25 If T is 75 or less, the substrate becomes highly flexible and loses its rigidity, making it difficult to stretch and peel off tiny electronic components. S 25 T (MPa·μm) is 5000 or less, preferably 3000 or less, more preferably 2200 or less, and even more preferably 1800 or less. 25If T (MPa·μm) is greater than 5000, the substrate becomes too hard, preventing the tape from being sufficiently bent, making it difficult to visually inspect the quality of the cut surfaces of minute components. Furthermore, because the substrate is too hard, it cannot be stretched sufficiently, making it difficult to remove electronic components. Therefore, S 25 By adjusting T (MPa·μm) to the above range, the tape can be sufficiently bent, allowing for visual inspection of the quality of the cut surface, even for minute components. Furthermore, because it possesses both appropriate stiffness and flexibility, after inspection, the minute electronic components can be peeled off simply by stretching the tape.

[0125] The 25% modulus of the above substrate is preferably 0.1 MPa to 120 MPa, more preferably 0.5 MPa to 100 MPa, even more preferably 1.0 MPa to 50 MPa, and particularly preferably 3.0 MPa to 15 MPa.

[0126] The 100% modulus of the above substrate is preferably 1 MPa to 30 MPa, more preferably 2 MPa to 27 MPa, even more preferably 3 MPa to 25 MPa, and particularly preferably 3 MPa to 20 MPa.

[0127] The 200% modulus of the above substrate is preferably 1 MPa to 45 MPa, more preferably 1.5 MPa to 40 MPa, even more preferably 2.5 MPa to 35 MPa, and particularly preferably 3 MPa to 30 MPa.

[0128] The 300% modulus of the above substrate is preferably 3.5 MPa to 60 MPa, more preferably 4 MPa to 55 MPa, even more preferably 5 MPa to 50 MPa, and particularly preferably 6 MPa to 45 MPa.

[0129] The 25%, 100%, 200%, and 300% modulus of the base material are independently within the above ranges, allowing the tape to be sufficiently bent and enabling visual inspection of the quality of the cut surface, even for minute parts. Furthermore, the tape can be stretched with relatively little force in the initial stretching stage, while reducing the stress required for the tape to be stretched and peel off from the adherend. This makes the peeling operation easier, even when the adherend is an ultra-small part. Also, when stretching the tape of this disclosure, it is easier to peel off from the adherend at a relatively low degree of elongation. If the modulus of the base material is too low, areas other than the adhesive region between the tape and the adherend (non-adhesive regions) will stretch preferentially, making peeling between the tape and the adherend less likely.

[0130] The substrate preferably has at least one of the following modulus values: 25% modulus, 100% modulus, 200% modulus, and 300% modulus, and more preferably, 25% modulus, 100% modulus, and 300% modulus are each within the above range, and more preferably, all of the following modulus values ​​are within the above range.

[0131] Furthermore, the absolute value of the difference between the 100% modulus and the 300% modulus of the above-mentioned substrate is preferably 0.5 MPa or more and 100 MPa or less, more preferably 3 MPa or more and 80 MPa or less, even more preferably 7 MPa or more and 60 MPa or less, even more preferably 10 MPa or more and 50 MPa or less, and particularly preferably 12 MPa or more and 45 MPa or less. By having the absolute value of the difference between the 100% modulus and the 300% modulus of the substrate within the above range, the force required to stretch the tape of this disclosure and peel off the adherend can be reduced, and the distance over which the tape of this disclosure must be stretched to peel off the adherend can be reduced, thus saving workspace.

[0132] The 25% modulus, 100% modulus, 200% modulus, and 300% modulus of the substrate can be adjusted, for example, by the composition of the substrate, the type of resin constituting the substrate, the thickness of the substrate, and uniaxial or biaxial stretching treatment.

[0133] The 25% modulus, 100% modulus, 200% modulus, and 300% modulus of the substrate are measured by the measurement methods described in the section on <25% modulus, 100% modulus, 200% modulus, 300% modulus, elongation at break, and stress at break> in the Examples section below.

[0134] The thickness of the above-mentioned substrate is 500 μm or less. By keeping the thickness of the substrate within the above range, the tape of this disclosure can be sufficiently bent, and even minute parts can be visually inspected for quality at the cut surface. Furthermore, while not particularly limited as long as the desired physical properties described above are exhibited, the thickness can be, for example, 5 μm to 500 μm, preferably 10 μm to 350 μm, more preferably 25 μm to 250 μm, and even more preferably 40 μm to 150 μm.

[0135] The thickness of the substrate is measured by the measurement method described in the section on <Thickness> in the Examples section below.

[0136] The elongation at break of the above-mentioned base material can be, for example, 200% or more, from the viewpoint of exhibiting stretchability. In particular, the elongation at break of the above-mentioned base material is preferably in a range that balances moderate stretchability with workability that allows the tape to be stretched and the parts to be easily peeled off, for example, it can be 200% to 1000%, more preferably 250% to 800%, more preferably 300% to 700%, and even more preferably 350% to 600%. When the elongation at break of the above-mentioned base material is within the above-mentioned range, the tape of this disclosure becomes less likely to break during the stretching process and can be stretched to the desired distance. In addition, the stretching distance of the tape (peel elongation) until the adhesive state between the tape and the adherend is released does not become too long, making it possible to work in a small space.

[0137] The fracture stress of the above-mentioned base material is preferably within a range that balances moderate extensibility with workability that allows the tape to be stretched and the parts to be easily peeled off. For example, 30 MPa to 180 MPa is preferred, 40 MPa to 150 MPa is more preferred, and 50 MPa to 120 MPa is even more preferred. By having the fracture stress of the base material within the above range, the tape of this disclosure becomes less likely to tear during the stretching process, and the stress required to stretch the tape does not become too large, allowing the temporarily fixed parts to be easily peeled off.

[0138] From the viewpoint of exhibiting stretchability, it is preferable that the above-mentioned substrate does not have a yield point when stretched. By using a substrate without a yield point, the stress required to stretch the tape of this disclosure does not become too large during the stretching process, and the stretching distance of the tape (peel elongation) until the adhesive state between the tape and the adherend is released does not become too long, making it possible to work in a small space.

[0139] The elongation at break, stress at break, and yield point of the base material can be adjusted, respectively, by appropriately selecting the base material or by applying a stretching treatment during the manufacturing process of the base material.

[0140] The tape of this disclosure allows for the inspection of the cross-section of electronic components by cutting them into minute sizes and then bending the tape. By shifting the bending position, all cross-sections of the electronic components attached to the tape can be observed. In this process, the bending position may be shifted while sliding the surfaces of the substrate opposite to the adhesive layer in contact with each other. Therefore, the arithmetic mean height (Sa) of the surfaces of the substrate opposite to the adhesive layer is preferably 0.100 μm to 3.00 μm, more preferably 0.200 μm to 2.50 μm, and even more preferably 0.300 μm to 1.00 μm. By having the arithmetic mean height (Sa) of the surfaces of the substrate opposite to the adhesive layer within the above range, the bending position can be shifted without the substrate blocking or deforming.

[0141] Furthermore, the crustosis (Sku) on the side of the substrate opposite to the adhesive layer is preferably 1.5 or higher, more preferably 2.0 or higher, even more preferably 2.3 or higher, and even more preferably 2.5 or higher. Having the crustosis (Sku) on the side of the substrate opposite to the adhesive layer within the above range allows the substrate to shift its bending position without blocking or deformation. While there is no particular upper limit to the crustosis (Sku), it can be made as large as possible within the range where the effects of the present invention are obtained. However, for example, a value of 10.0 or less is preferred, more preferably 9.0 or less, and 8.0 or less is preferable for handling the tape in a smooth state.

[0142] The arithmetic mean height (Sa) and crustosis (Sku) of the substrate are measured by the measurement method described in the section on <Arithmetic Mean Height (Sa) and Crustosis (Sku)> in the Examples section below.

[0143] The hardness of the substrate described above is not particularly limited as long as it does not hinder the function of the tape of this disclosure (especially the function of the adhesive layer), but it is preferably Shore hardness A (Type A) 40 or higher and Shore hardness D (Type D) 90 or lower, more preferably Shore hardness A (Type A) 80 or higher and Shore hardness D (Type D) 80 or lower, and even more preferably Shore hardness A (Type A) 85 or higher and Shore hardness D (Type D) 70 or lower. Having the Shore hardness of the substrate within the above range ensures the mechanical strength and extensibility of the tape, thereby improving workability. In addition, the strong stress acting on the stretching behavior of the tape that occurs when stretching the tape to peel it off the adherend makes it easier to peel the adhesive layer from the adherend. Furthermore, even when the bending position is shifted while the sides of the substrate opposite to the adhesive layer are in contact with each other when bending the tape, it is possible to prevent the substrate from blocking or deforming.

[0144] The hardness of the above-mentioned substrate is Shore hardness, and is measured by the method described in <Rubber Hardness> in the Examples section below, and is the value of Type A hardness or Type D hardness measured using a durometer (spring-type rubber hardness tester, model: GS-719G, manufactured by Teclock Co., Ltd.) or a durometer (spring-type rubber hardness tester, model: GS-720G, manufactured by Teclock Co., Ltd.) in accordance with JIS K 6253. More specifically, Shore hardness A (Type A) is the value measured using a durometer (spring-type rubber hardness tester, model: GS-719G, manufactured by Teclock Co., Ltd.) in accordance with JIS K 6253, and Shore hardness D (Type D) is the value measured using a durometer (spring-type rubber hardness tester, model: GS-720G, manufactured by Teclock Co., Ltd.) in accordance with JIS K 6253.

[0145] The storage modulus E' (25°C) of the above substrate is 1.0 × 10⁻⁶ 5 ~9.0×10 8 It is preferable that it be Pa, 6.0 × 10 5 ~5.0×10 8 It is more preferable that it be Pa, 8.0 × 10 6 ~2.5×10 8 It is even more preferable that the storage modulus E'(25°C) of the above substrate is within the above range. When the storage modulus E'(25°C) of the above substrate is within the above range, the tape of this disclosure can be easily stretched, and the distance over which the tape needs to be stretched to peel off the part does not become too long, allowing for space-saving peeling. In addition, the tape can be sufficiently bent, making it less likely to leave creases, and even for minute parts, the quality of the cut surface can be visually inspected. In particular, when the storage modulus E'(25°C) is 1.0 × 10⁻⁶ 5 If the Pa value falls below a certain level, the tape may curl due to creases formed when it is bent, which can lead to poor handling in subsequent processing steps.

[0146] The loss modulus of elasticity E'' (25°C) of the above substrate is 1.0 × 10 4 ~9.0×10 8 It is preferably Pa, 1.0 × 10 5 ~5.0×10 7 It is more preferable that it be Pa, 1.0 × 106 ~2.0×10 7 It is even more preferable that the loss modulus of elasticity E''(25°C) of the above substrate is within the above range. When the loss modulus of elasticity E''(25°C) of the above substrate is within the above range, the tape of this disclosure can be easily stretched, and the distance over which the tape needs to be stretched to peel off the part does not become too long, allowing for space-saving peeling. In addition, the tape can be sufficiently bent, making it less likely to leave creases, and even for minute parts, the quality of the cut surface can be visually inspected. In particular, when the loss modulus of elasticity E''(25°C) is within the above range, 8 If the pressure exceeds Pa, the tape may curl due to creases formed when it is bent, which can lead to poor handling in subsequent processing steps.

[0147] The loss tangent tanδ(25°C) of the above-mentioned substrate is preferably 0.02 to 1.00, more preferably 0.03 to 0.40, and even more preferably 0.10 to 0.30. When the loss tangent tanδ(25°C) of the above-mentioned substrate is within the above range, it is possible to suppress localized stretching of the tape when the tape of this disclosure is stretched, which can result in uneven peeling of the parts. In addition, the tape can be bent sufficiently, making it less likely to leave creases, and allowing for visual inspection of the quality of the cut surface even for minute parts. In particular, if the loss tangent tanδ(25°C) exceeds 1.00, the tape may curl due to creases left when the tape is bent, which can lead to poor handling in subsequent processing steps.

[0148] The storage modulus E', loss modulus E'', and loss tangent tanδ are determined by measuring dynamic viscoelasticity under temperature dispersion. The above substrate is punched out into the shape of test piece type 5 of JIS K 7127 using a dumbbell cutter to serve as the test piece. Using a viscoelasticity tester (RSA-II, manufactured by Rheometrics), the test piece is placed in the measurement section of the tester, and the storage modulus (E') is measured from 30°C to 200°C at a frequency of 1 Hz and a heating rate of 3°C / min. Next, the loss modulus (E'') is measured in the same manner as the storage modulus (E'), and tanδ is calculated from E' and E''.

[0149] The above-mentioned substrate may be a single layer or may have a multilayer structure consisting of two or more layers, as long as it can possess the desired physical properties.

[0150] The above-mentioned substrate can be, for example, a resin film mainly composed of resin. Examples of resins that make up the substrate (resin film) include styrene resins, urethane resins, olefin resins, ester resins, acrylic resins, polycarbonate resins, polymethylpentene resins, polysulfone resins, polyetheretherketones, polyethersulfones, polyetherimides, polyimides, fluororesins, nylon, etc. One of these resins may be used, or two or more may be used in combination.

[0151] In particular, it is preferable that the above-mentioned substrate has a resin selected from the group consisting of styrene resins, urethane resins, and acrylic resins as its main component. That is, it is preferable that the above-mentioned substrate is selected from the group consisting of styrene resin film, urethane resin film, and acrylic resin film. The main component refers to the component that is present in the largest amount in the total amount of the substrate, and specifically, it is preferable that the component makes up 50% by mass or more, preferably 80% by mass or more, more preferably 90% by mass or more, even more preferably 95% by mass or more, and especially preferably substantially 100% by mass in the total amount of the substrate.

[0152] (Styrene resin) Styrene resins have structural units derived from aromatic vinyl compounds. Specific examples of structural units derived from aromatic vinyl compounds can be selected from those exemplified in section "1. Adhesive Layer" above. In particular, it is preferable to include a styrene-derived structural unit represented by the following chemical formula (III).

[0153] [ka]

[0154] The above-mentioned styrene-based resin may have one or more functional groups in its molecular chain and / or at its molecular ends, or it may not have any functional groups. Examples of the above-mentioned functional groups include alkyl groups, carboxyl groups, hydroxyl groups, acid anhydride groups, amino groups, epoxy groups, etc. Furthermore, the hydrogen atoms on the benzene ring of the above-mentioned styrene-based resin may be substituted with alkyl groups such as methyl and ethyl, and the number of substituted alkyl groups may be any of 1 to 5.

[0155] The proportion of styrene-derived structural units in the above-mentioned styrene-based resin is preferably 5% by mass or more and 75% by mass or less, more preferably 10% by mass or more and 50% by mass or less, even more preferably 15% by mass or more and 45% by mass or less, and particularly preferably 20% by mass or more and 40% by mass or less. By setting the proportion of styrene-derived structural units within the above range, the 25% modulus, elongation at break, and stress at break of the substrate can be easily obtained within a suitable range.

[0156] Among the styrene-based resins described above, styrene-based block copolymers are preferred because they can lower the elastic modulus of the substrate in the low elongation range during the process of stretching the tape, resulting in a substrate with high strength and excellent elongation at break. The styrene-based resin may consist of one type of styrene-based block copolymer, or it may be a mixture of two or more types of styrene-based block copolymers.

[0157] The above-mentioned styrene-based block copolymer has structural units derived from aromatic vinyl compounds and structural units derived from conjugated diene compounds. Examples of aromatic vinyl compounds that constitute the structural units derived from aromatic vinyl compounds, and conjugated diene compounds that constitute the structures derived from conjugated diene compounds, include the aromatic vinyl compounds and conjugated diene compounds described in the "1. Adhesive Layer" section above. Examples of aromatic vinyl compounds and conjugated diene compounds disclosed in Japanese Patent Application Publication No. 2022-094735 include the aromatic vinyl compounds and conjugated diene compounds disclosed in Japanese Patent Application Publication No.

[0158] The styrene-based block copolymer may be a diblock copolymer, a triblock copolymer, or a copolymer of tetrablocks or more. Furthermore, the styrene-based block copolymer may be a mixture of diblock copolymers and triblock copolymers. Among these, it is more preferable that the styrene-based resin contains at least a styrene-based triblock copolymer, from the viewpoint of achieving both excellent cohesive strength and extensibility of the substrate. The styrene-based triblock copolymer preferably has structural units derived from aromatic vinyl compounds in its hard segment and structural units derived from conjugated diene compounds in its soft segment. It is also preferable that the structural units derived from aromatic vinyl compounds are the end-block phase and the structural units derived from conjugated diene compounds are the mid-block phase.

[0159] Specific examples of styrene-based block copolymers include styrene-isoprene block copolymer, styrene-isoprene-styrene block copolymer, styrene-isoprene-butadiene-styrene block copolymer, styrene-butadiene-styrene block copolymer, styrene-ethylene-butylene block copolymer, and styrene-ethylene-propylene block copolymer. These may be used individually or in combination of two or more. An example of a mixture of the above is a mixture of styrene-isoprene block copolymer and styrene-isoprene-styrene block copolymer.

[0160] Furthermore, the above-mentioned styrene-based block copolymer may also be a hydrogenated styrene-based block copolymer. A hydrogenated styrene-based block copolymer refers to a copolymer in which the double bonds of the main chain of a styrene-based block copolymer are hydrogenated. In particular, it is preferable that the hydrogenated styrene-based block copolymer has a random block structure in which the structural units derived from the conjugated diene compound consist of linear hydrocarbon structural units and branched hydrocarbon structural units. The above-mentioned structural units derived from the conjugated diene compound having a random block structure contain linear structural units that contribute to crystallinity and branched structural units that contribute to elongation, making it easier to achieve both improved tape elongation and improved breaking strength (breaking stress).

[0161] Examples of the above-mentioned hydrogenated styrene-based block copolymers include hydrogenated products of the block copolymers listed above as specific examples of styrene-based block copolymers, specifically styrene-ethylene / butylene-styrene block copolymer (SEBS), styrene-ethylene-ethylene / propylene-styrene block copolymer (SEEPS), etc. The styrene-ethylene-ethylene / propylene-styrene block copolymer is a hydrogenated product of a block copolymer formed from styrene-butadiene-isoprene-styrene. The styrene-ethylene / butylene-styrene block copolymer is a hydrogenated product of styrene-isoprene / butadiene-styrene block copolymer. Among these, the hydrogenated product of styrene-isoprene-butadiene-styrene block copolymer is particularly preferred.

[0162] The content of styrene-based resin in the resin constituting the base material is preferably 50% by mass or more, more preferably 80% by mass or more, more preferably 90% by mass or more, and substantially 100% by mass, based on 100% by mass of the total amount of resin in the base material. In particular, it is more preferable that the content of styrene-based block copolymer in the resin constituting the base material is within the above range, as this allows for a lower modulus of elasticity in the low elongation region of the base material during the tape stretching process, resulting in a base material with high strength and excellent elongation at break.

[0163] Styrene resins can be manufactured using known methods. For example, known methods can be used to manufacture styrene block copolymers, such as sequential polymerization of blocks by anionic living polymerization, or production of block copolymers having living active ends, followed by reaction with a coupling agent to produce coupled block copolymers. Furthermore, if the styrene resin is a mixture of two or more styrene block copolymers, it may be manufactured as a mixture simultaneously in a single polymerization step.

[0164] (Urethane resin) Urethane resins have structural units derived from polyols and structural units derived from polyisocyanates. Examples of urethane resins include ester-based polyurethanes, ether-based polyurethanes, and polycarbonate-based polyurethanes.

[0165] The polyol used to form the polyol-derived structural units can be appropriately selected depending on the purpose, and examples include polyester polyols, polyether polyols, polycarbonate polyols, and acrylic polyols. One type of polyol may be used, or two or more types may be used in combination. Among these, polyester polyols or polyether polyols are preferred from the viewpoint of obtaining the mechanical properties of the substrate. From the viewpoint of heat resistance, polyester polyols are preferred, and from the viewpoint of water resistance and biodegradability, polyether polyols are preferred.

[0166] Examples of the above-mentioned polyester polyols include polyesters obtained by esterifying a low molecular weight polyol with a polycarboxylic acid, polyesters obtained by ring-opening polymerization of cyclic ester compounds such as ε-caprolactone, and copolymer polyesters thereof. Examples of the above-mentioned low molecular weight polyols include aliphatic alkylene glycols such as ethylene glycol, propylene glycol, 1,4-butanediol, 1,6-hexanediol, diethylene glycol, neopentyl glycol, and 1,3-butanediol, and cyclohexanedimethanol, which generally have a weight-average molecular weight (Mw) of about 60 to 280. Examples of the above-mentioned polycarboxylic acids include aliphatic dicarboxylic acids such as succinic acid, adipic acid, sebacic acid, and dodecanedicarboxylic acid; aromatic dicarboxylic acids such as terephthalic acid, isophthalic acid, phthalic acid, and naphthalenedicarboxylic acid; and their anhydrides or esterified products.

[0167] Examples of the above-mentioned polyether polyols include those obtained by addition polymerization of alkylene oxide using one or more compounds having two or more active hydrogen atoms as initiators.

[0168] Examples of the polycarbonate polyols mentioned above include polycarbonate polyols obtained by reacting a carbonate ester and / or phosgene with a low molecular weight polyol. Examples of the carbonate esters include methyl carbonate, dimethyl carbonate, ethyl carbonate, diethyl carbonate, cyclocarbonate, and diphenyl carbonate. Examples of low molecular weight polyols include ethylene glycol, diethylene glycol, triethylene glycol, tetraethylene glycol, 1,2-propanediol, 1,3-propanediol, dipropylene glycol, tripropylene glycol, 1,2-butanediol, 1,3-butanediol, 1,4-butanediol, 2,3-butanediol, 1,5-pentanediol, 1,5-hexanediol, 1,6-hexanediol, 2,5-hexanediol, 1,7-heptanediol, and 1,8-octanediol. Examples include ol, 1,9-nonanediol, 1,10-decanediol, 1,11-undecanediol, 1,12-dodecanediol, 2-methyl-1,3-propanediol, neopentyl glycol, 2-butyl-2-ethyl-1,3-propanediol, 3-methyl-1,5-pentanediol, 2-ethyl-1,3-hexanediol, 2-methyl-1,8-octanediol, 1,4-cyclohexanedimethanol, hydroquinone, resorcinol, bisphenol A, bisphenol F, and 4,4'-biphenol.

[0169] The polyisocyanates used to form the constituent units derived from polyisocyanates can be appropriately selected depending on the purpose. Examples include alicyclic polyisocyanates, aliphatic polyisocyanates, aromatic polyisocyanates, and modified forms of these polyisocyanates (adduct forms, biuret forms, allophanate-type modified forms, isocyanurate-type modified forms, and reaction products having isocyanate groups and urethane bonds obtained by reacting isocyanates and polyols under conditions of excess isocyanate groups). One type of polyisocyanate may be used, or two or more types may be used in combination. Among these, alicyclic polyisocyanates and / or modified forms thereof are preferred.

[0170] Examples of the above-mentioned alicyclic polyisocyanates include isophorone diisocyanate, 1,3-bis(isocyanate methyl)cyclohexane, 4,4'-dicyclohexylmethane diisocyanate, 2,4-methylcyclohexane diisocyanate, 2,6-methylcyclohexane diisocyanate, cyclohexylene diisocyanate, methylcyclohexylene diisocyanate, bis(2-isocyanatoethyl)-4-cyclohexylene-1,2-dicarboxylate, 2,5-norbornane diisocyanate, 2,6-norbornane diisocyanate, dimer acid diisocyanate, and bicycloheptane triisocyanate. One type of alicyclic polyisocyanate may be used, or two or more types may be used in combination.

[0171] The above urethane resin preferably has an equivalent ratio (NCO / OH equivalent ratio) of isocyanate groups (NCO) of the polyisocyanate to hydroxyl groups (OH) of the polyol in the range of 1 to 20, more preferably in the range of 1.1 to 13, even more preferably in the range of 1.2 to 5, and particularly preferably in the range of 1.5 to 3.

[0172] The polyurethane resin described above may be a thermoplastic polyurethane. The thermoplastic polyurethane can be appropriately selected within a range that does not impair the effects of the present invention, and examples include block copolymers containing hard segments and soft segments, known as TPU. More specifically, examples include polyester-based TPU, polyether-based TPU, polycarbonate-based TPU, etc.

[0173] (Acrylic polymer) The above acrylic polymer may be a random polymer or a block polymer, but it is preferable to include an acrylic block polymer because it is easier to adjust the mechanical properties of the substrate. The acrylic block copolymer may be a diblock copolymer, a triblock copolymer, or a block copolymer of tetrablocks or more, but an acrylic triblock copolymer is preferred because it can achieve a good balance between excellent cohesive force, resulting in high breaking strength (breaking stress) and extensibility. The above acrylic polymer may contain two or more acrylic block copolymers with different block structures.

[0174] The above acrylic block copolymer preferably comprises a polymer block having structural units derived from alkyl methacrylate and a polymer block having structural units derived from alkyl acrylate. In particular, it is preferable that the mid-block phase is a polymer block having structural units derived from alkyl acrylate, and that the end-block phases located on both sides of the mid-block phase are polymer blocks each independently having structural units derived from alkyl methacrylate.

[0175] Structural units derived from alkyl methacrylate monomers refer to constituent units derived from alkyl methacrylate monomers when alkyl methacrylate is (co)polymerized or graft polymerized, i.e., repeating units derived from methacrylate monomers. Examples of the alkyl methacrylate monomers mentioned above include methyl methacrylate, ethyl methacrylate, n-propyl methacrylate, isopropyl methacrylate, n-butyl methacrylate, isobutyl methacrylate, sec-butyl methacrylate, t-butyl methacrylate, n-pentyl methacrylate, isopentyl methacrylate, n-hexyl methacrylate, 2-ethylhexyl methacrylate, pentadecyl methacrylate, cyclohexyl methacrylate, lauryl methacrylate, tridecyl methacrylate, and 2-hexyldecyl methacrylate. Of these, methyl methacrylate is preferred.

[0176] Structural units derived from alkyl acrylates refer to constituent units derived from alkyl acrylate monomers when alkyl acrylate monomers are (co)polymerized or graft polymerized, i.e., repeating units derived from acrylate monomers. Examples of alkyl acrylate monomer units include methyl acrylate, ethyl acrylate, n-propyl acrylate, isopropyl acrylate, n-butyl acrylate, isobutyl acrylate, sec-butyl acrylate, t-butyl acrylate, amyl acrylate, isoamyl acrylate, n-hexyl acrylate, 2-ethylhexyl acrylate, and lauryl acrylate. Among these, n-butyl acrylate, 2-ethylhexyl acrylate, and copolymers thereof are preferred from the viewpoint of imparting elongation to the substrate.

[0177] In the alkyl methacrylate and alkyl acrylate described above, one or more hydrogen atoms in the alkyl group may be substituted with, for example, a halogen atom, an amino group, a cyano group, etc.

[0178] When the degree of polymerization of the structural unit derived from alkyl acrylate is denoted as q, and the degrees of polymerization of the structural units derived from alkyl methacrylate located on either side of the polymer block of the structural unit derived from alkyl acrylate are denoted as p and r, respectively, then p / (p+q+r) is preferably 0.02 to 0.40, and more preferably 0.05 to 0.37. q / (p+q+r) is preferably 0.20 to 0.95, and more preferably 0.25 to 0.90. r / (p+q+r) is preferably 0.02 to 0.40, and more preferably 0.05 to 0.37. The values ​​of p, q, and r mentioned above are related to the molecular weight, etc.

[0179] Preferred forms of the above acrylic triblock copolymer include polymethyl methacrylate block - polyacrylate n-butyl block - polymethyl methacrylate block, polyethyl methacrylate block - polyacrylate n-butyl block - polyethyl methacrylate block, polypropyl methacrylate block - polyacrylate n-butyl block - polypropyl methacrylate block, polymethyl methacrylate block - polyacrylate t-butyl block - polymethyl methacrylate block, and polymethyl methacrylate block - polyacrylate propyl block - polymethyl methacrylate block.

[0180] The above-mentioned acrylic block copolymer may contain one or more triblock copolymers or diblock copolymers, or it may be a mixture of one or more triblock copolymers and one or more diblock copolymers. The content of diblock copolymers in the above mixture can be appropriately selected depending on the purpose.

[0181] The above acrylic block copolymer may be modified as needed with functional groups such as hydroxyl groups, carboxyl groups, acid anhydride groups, amino groups, and trimethoxysilyl groups in the molecular side chains or at the molecular main chain ends.

[0182] The weight-average molecular weight (hereinafter also referred to as "Mw") of the above acrylic block copolymer is preferably 50,000 to 300,000, more preferably 100,000 to 250,000, and even more preferably 130,000 to 230,000. Furthermore, the number-average molecular weight (hereinafter also referred to as "Mn") of the above acrylic block copolymer is preferably 50,000 to 300,000, more preferably 100,000 to 250,000, and even more preferably 130,000 to 230,000. When the Mw and / or Mn of the above acrylic block copolymer are within these ranges, the substrate can achieve a good balance between excellent elongation and tensile strength (breaking stress), and also exhibit good thickness uniformity. If the Mw and Mn of the above acrylic block copolymer are too small, it is difficult to obtain the necessary elongation and tensile strength (breaking stress) of the substrate. On the other hand, if the Mw and Mn are too large, the substrate becomes poorly soluble in solvents, making molding such as heat melting difficult, and it becomes difficult to obtain a substrate with the desired properties.

[0183] In particular, it is preferable that the Mw of the block copolymer is between 100,000 and 250,000 and the Mn is between 100,000 and 250,000, and it is even more preferable that the Mw is between 130,000 and 230,000 and the Mn is between 130,000 and 230,000.

[0184] The Mw and Mn of the above-mentioned acrylic block copolymer are measured by GPC using a GPC instrument (HLC-8329GPC, manufactured by Tosoh Corporation). The Mw and Mn values ​​are based on standard polystyrene equivalents, and the measurement conditions for the GPC method are the same as described above.

[0185] The method for producing the above-mentioned acrylic block copolymer can be appropriately selected from conventionally known production methods, such as a method of sequentially polymerizing the block copolymer by anionic living polymerization or cationic living polymerization. Furthermore, if the block copolymer has stereoregularity such as syndiotacticity, known methods using organometallic complexes may be used.

[0186] (others) When the resin constituting the above-mentioned substrate is a block copolymer, it is preferable that the soft segments of the block copolymer have a random copolymer structure of linear hydrocarbon structural units and branched hydrocarbon structural units. Having the desired structure in the soft segments of the block copolymer can further enhance the stretchability (elongation) and tensile strength (breaking stress).

[0187] In particular, it is preferable that the block copolymer is a triblock copolymer or higher and the soft segment has the specific structure described above. In other words, it is preferable that the block copolymer has a midblock and end blocks located on both sides of the midblock, and that the midblock has a random copolymer structure of linear hydrocarbon structural units and branched hydrocarbon structural units. The synergistic effect of the function of the hard segment, which is the end block, and the function of the soft segment, which is the midblock, makes it possible to achieve a good balance between excellent cohesive force, resulting in high tensile strength (breaking stress) and extensibility. Examples of such resins include hydrogenated styrene-based triblock copolymers, and the specific compounds are the same as those described above and in the specific example of the styrene-based block polymer (X1) described in section "1. Adhesive Layer".

[0188] (Other ingredients) The substrate may contain other components as needed. Examples of other components include tackifying resins, crosslinking agents, antioxidants, UV absorbers, fillers, polymerization inhibitors, surface modifiers, antistatic agents, defoamers, viscosity modifiers, light stabilizers, weather stabilizers, heat stabilizers, antioxidants, leveling agents, organic pigments, inorganic pigments, pigment dispersants, silica beads, organic beads, and inorganic fillers. The content of these other components in the substrate can be appropriately selected within a range that does not impair the properties of the substrate.

[0189] 3. Any configuration The tape of this disclosure may have an adhesive layer in contact with the surface of the substrate, or may have an intermediate layer between the adhesive layer and the substrate. The intermediate layer can further enhance the adhesion between the adhesive layer and the substrate. The intermediate layer is not particularly limited as long as it is a layer that can enhance the adhesion between the adhesive layer and the substrate, and examples include an intermediate adhesive layer different from the adhesive layer, a primer layer, etc.

[0190] The above-mentioned intermediate layer mainly consists of polymers such as acrylic polymers, urethane polymers, epoxy polymers, polyester polymers, polyvinyl polymers (e.g., polyvinyl alcohol, vinyl chloride-vinyl acetate copolymer, ethylene-vinyl acetate copolymer, urethane-vinyl chloride copolymer, etc.), rubber polymers (e.g., styrene block copolymer, etc.), and thermoplastic elastomers. These may be used individually or in combination. The polymer content in the above-mentioned intermediate layer can be, for example, 30% by mass or more, preferably 40% by mass or more, more preferably 50% by mass or more, even more preferably 60% by mass or more, and particularly preferably 80% by mass, based on 100% by mass of the total amount of the intermediate layer.

[0191] If the above-mentioned intermediate layer is an intermediate adhesive layer, the adhesive constituting the intermediate adhesive layer can be, for example, an adhesive mainly composed of the polymer described above, specifically including acrylic adhesives, urethane adhesives, rubber adhesives, polyester adhesives, etc. These may be used individually or in combination. Furthermore, if the above-mentioned intermediate layer is a primer layer, the primer constituting the primer layer can be, for example, a primer mainly composed of the polymer described above.

[0192] In addition to the polymer described above, the intermediate layer may optionally contain additives such as tackifying resins, defoamers, coating properties improvers, thickeners, organic lubricants, UV absorbers, antioxidants, foaming agents, dyes, pigments, and particles.

[0193] The thickness of the above-mentioned intermediate layer is not particularly limited, but from the viewpoint of improving the adhesion between the adhesive layer and the substrate and allowing the adhesive layer to be suitably strained when the tape is stretched and peeled off, it is preferably in the range of 0.01 μm to 100 μm, more preferably in the range of 0.1 μm to 50 μm, and more preferably in the range of 0.5 μm to 10 μm.

[0194] The tape of this disclosure may have a release liner on the surface opposite to the substrate of the adhesive layer. The release liner can be any known material, such as paper, plastic film, polytetrafluoroethylene (PTFE) film, or plastic film with a surface release treatment such as silicone treatment or fluorosilicone treatment. The release liner is usually peeled off when an adherend is bonded and fixed to the tape of this disclosure. If the tape of this disclosure is a double-sided adhesive tape having adhesive surfaces on both sides, the release liner may be provided on one adhesive surface of the tape of this disclosure, or on both adhesive surfaces.

[0195] 4. Adhesive tape The thickness of the tape of this disclosure is not particularly limited as long as it can perform the desired function, but is preferably 10 μm to 1500 μm, more preferably 30 μm to 1000 μm, and even more preferably 50 μm to 500 μm. The thickness of the release liner is not included in the total thickness of the tape. Furthermore, the thickness of the tape of this disclosure refers to the total thickness of the tape, and is measured by the measurement method described in <Thickness> in the Examples section below.

[0196] The elongation at break of the tape of this disclosure is not particularly limited as long as it is difficult to break during the stretching process and can be peeled off from the adherend, but for example, 200% to 1000% is preferred, 250% to 800% is more preferred, 300% to 600% is even more preferred, and 350% to 500% is particularly preferred. By setting the elongation at break of the tape of this disclosure within the above range, it is possible to suppress excessive stress when stretching the tape of this disclosure, and to shorten the stretching distance required for the adherend to peel off from the tape of this disclosure.

[0197] The breaking point stress of the tape of this disclosure is not particularly limited as long as it is difficult to break during the stretching process and can be peeled off from the adherend, but is preferably 5 MPa to 130 MPa, more preferably 10 MPa to 120 MPa, even more preferably 15 MPa to 110 MPa, and particularly preferably 20 MPa to 100 MPa. When the breaking point stress of the tape of this disclosure is within the above range, tearing of the tape is suppressed during the stretching process, and the stress when stretching the tape can be reduced.

[0198] The elongation at break and stress at break of the tape of this disclosure can be adjusted, for example, by the elongation at break and stress at break of each layer constituting the tape of this disclosure, and in particular by the elongation at break and stress at break of the substrate if the tape of this disclosure has a substrate.

[0199] The tape's elongation at break and stress at break are measured by the measurement method described in the Examples section below under <25% modulus, 100% modulus, 200% modulus, 300% modulus, elongation at break, and stress at break>.

[0200] The 180° peel adhesive strength of the tape disclosed herein is not particularly limited as long as it is strong enough to fix and hold the adherend (especially minute components such as MLCCs), but is preferably 0.01 N / 20 mm to 12 N / 20 mm, more preferably 0.02 N / 20 mm to 9 N / 20 mm, and even more preferably 0.03 N / 20 mm to 5 N / 20 mm. By setting the 180° peel adhesive strength of the tape disclosed herein within the above range, the adherend can be sufficiently fixed, and when peeling from the adherend by stretching, the increase in peel strength is suppressed, allowing peeling in the low elongation range and resulting in good re-peelability.

[0201] The 180° peel adhesive strength of the tape of this disclosure is measured by the measurement method described in <180° Peel Adhesion> in the Examples section described later.

[0202] The tapes of this disclosure can be manufactured using known manufacturing methods. Examples of manufacturing methods for the tapes of this disclosure include the method described in section "1. Adhesive Layer" above, which involves applying an adhesive composition to one side of a substrate to form an adhesive layer, and the method of applying the adhesive composition onto a release liner to form an adhesive layer, and then transferring the adhesive layer to a substrate to form an adhesive layer on the substrate. The method of applying the adhesive composition is not particularly limited, and known methods such as roll coaters and die coaters can be used.

[0203] Furthermore, if the tape of this disclosure has an intermediate layer between the substrate and the adhesive layer, a method for manufacturing the tape of this disclosure may be used, for example, to form an intermediate layer on a release liner using an intermediate layer forming composition, to form a laminated intermediate by laminating the intermediate layer to the surface of the substrate, and then to peel off the release liner from the surface of the intermediate layer and to laminate an adhesive layer formed on another release liner.

[0204] The tape disclosed herein can be suitably used in applications requiring temporary fixing properties for fixing and re-peeling an adherend. In particular, it can be suitably used in process applications such as the manufacturing processes for ceramic components and semiconductor devices. That is, the tape disclosed herein can be suitably used as a temporary fixing tape and a process tape.

[0205] II. Methods for Manufacturing Articles The method for manufacturing a component according to the present disclosure is a method for manufacturing a component using the adhesive tape described in Section I. Adhesive Tape above, comprising: an inspection step of inspecting one or more components fixed to the adhesive tape; and a peeling step of stretching the adhesive tape to which one or more components are fixed in at least one direction to peel the components from the adhesive tape.

[0206] Figures 1 and 2 are process diagrams showing an example of a method for manufacturing the parts of the present disclosure. The method for manufacturing the parts of the present disclosure includes an inspection step (Figure 1) for inspecting one or more parts 5 fixed to an adhesive tape 1, and a peeling step (Figure 2) for peeling the parts 5 from the adhesive tape 1 by stretching the adhesive tape 1 to which one or more parts 5 are fixed in at least one direction D. The adhesive tape 1 illustrated in Figures 1 and 2 is a single-sided tape specification having an adhesive layer 3 on one side of a base material 2.

[0207] According to the component manufacturing method of this disclosure, after cutting the electronic components to a minute size, the quality of the cut surfaces of all chips can be visually inspected by bending the tape. In particular, the component manufacturing method of this disclosure uses the adhesive tape described in section "I. Adhesive Tape" above, and because the tape has appropriate stiffness and flexibility during the bending process, the cut surfaces can be sufficiently observed even if the electronic components fixed to the tape are minute in size.

[0208] According to the method for manufacturing parts of this disclosure, processed products can be easily and simply peeled off the tape by stretching the tape, without requiring the application of energy such as heat or active energy rays. In particular, the method for manufacturing parts of this disclosure, by using the adhesive tape described in section "I. Adhesive Tape" above, reduces the adhesive strength and tackiness of the tape in the low elongation range during the stretching process, so that parts fixed on the tape can be easily and simply peeled off and detached. Furthermore, by simply stretching the tape, multiple parts fixed to the tape can be peeled off at once, making it possible to easily manufacture a large quantity of parts.

[0209] In the manufacturing method of this disclosure, the component fixed to the tape may be a component before processing or a component after processing. Furthermore, in the manufacturing method of this disclosure, the component fixed to the tape may be a component after processing on the tape, so it may be a component after processing when peeled off. The component before processing may be called a workpiece, and the component after processing may be called a processed product, and both processed products and workpieces are collectively referred to as "components".

[0210] 1. Inspection Process The above inspection process is an inspection process for inspecting one or more parts fixed to an adhesive tape. The adhesive tape is the adhesive tape of this disclosure as described in section "I. Adhesive Tape" above.

[0211] In the inspection process illustrated in Figure 1, the adhesive tape 1 (Figure 1(a)) to which the cut and miniature parts 5 are attached is bent so that the parts 5 face outwards (Figure 1(b)). Because the tape of this disclosure is flexible, the bending radius when the tape is bent can be reduced. Therefore, even with miniature parts, gaps can be created between the chips, and the cut surfaces 7,7' that could not normally be seen because the parts are adjacent to each other can be exposed. The direction of bending is not particularly limited and can be bent in any direction. Note that the bending radius refers to the inner radius when the tape is bent.

[0212] In this inspection process, the tape is bent to expose the cut surface, and information on the dimensions and shape of the chip cross-section is read by visual inspection or acquisition of image information. The method used to acquire image information is not particularly limited, but examples include the inspection apparatus disclosed in Japanese Patent Publication No. 2020-193890 and Japanese Patent Publication No. 2022-138855.

[0213] The method for bending the adhesive tape to which the parts are fixed is not particularly limited, but for example, one can use a method in which the tape is held in place by a jig or the like and bent by bringing the ends of the tape closer together, or a method in which the tape is held in place by two rolls and bent.

[0214] The tape allows for the inspection of all cross-sections of electronic components attached to it by shifting the bending position and changing the cross-section of the object being inspected. In this process, the bending position is shifted while sliding the tape with the sides opposite to the adhesive layer of the base material in contact with each other. Because the tape of this disclosure is flexible, even if the bending radius is small, creases are less likely to form at the bend, and the bending position can be shifted smoothly. Therefore, the inspection process can be carried out smoothly and efficiently.

[0215] The inspection device 6 illustrated in Figure 1 can be freely positioned to allow observation of the cut surface 7 and cut surface 7' as wide as possible. In other words, if the exposure angle of the chip varies as described later in <Visibility of Chip Cut Surface>, the installation position of the inspection device 6 can be freely adjusted to match that exposure angle. For example, the closer the angle of the cut surface 7 or cut surface 7' is to 90° with respect to the observation direction of the inspection device 6, the fewer blind spots there are on the cut surface 7 or cut surface 7', allowing observation of a wider area. Therefore, the inspection device 6 can be installed not only directly above the adhesive tape 1, but also at an angle such that the angle between the observation direction of the inspection device 6 and the cut surface 7 or cut surface 7' is 90°. Furthermore, the inspection device 6 may observe both the cut surface 7 and cut surface 7' at the same time, or it may observe only one of the cut surface 7 or cut surface 7'. In addition, multiple inspection devices 6 may be installed.

[0216] 2. Peeling process In the peeling process illustrated in Figure 2, an adhesive tape 1 (Figure 2(a)) on which one or more parts 5 are fixed to an adhesive layer is stretched in at least one direction D to peel the parts 5 from the adhesive tape 1 (Figure 2(b)). The adhesive tape on which one or more parts are fixed is the adhesive tape of this disclosure as described in section "I. Adhesive Tape" above.

[0217] The direction in which the tape is stretched can be arbitrarily set in a plan view of the tape. The direction in which the adhesive tape is stretched may be at least one direction, one direction, two intersecting directions, three or more axial directions, or all directions (360° directions). The specific direction in which the tape of this disclosure is stretched is not particularly limited, but for example, if the tape has a long shape, the stretching direction can be appropriately selected from the longitudinal direction of the tape, the short direction of the tape, a direction oblique to the longitudinal direction of the tape, and a direction that combines these directions. The direction in which the tape of this disclosure is stretched may also be radial, centered on any point (reference point) of the tape.

[0218] When stretching the tape in two or more directions, it may be stretched simultaneously in two or more directions, or it may be stretched sequentially in each direction. Furthermore, when stretching the tape in two directions, it is preferable that the first direction and the second direction are approximately perpendicular. "Approximately perpendicular" means that the second direction does not need to be exactly 90° to the first direction, but approximately 90° is sufficient, for example, a direction forming an angle between 85° and 95°, or even a direction forming an angle between 88° and 92° is acceptable.

[0219] The method for stretching the adhesive tape to which the component is fixed is not particularly limited, but for example, one can use a method of clamping the tape with a jig and pulling it in a certain direction, a method of pulling the tape by utilizing the difference in peripheral speed of two rolls, a method of pulling the tape in a direction intersecting the surface to which it is bonded to the component, or a method of pressing a convex jig against the tape from the side opposite to the side on which the component is placed and pushing the tape toward the side on which the component is placed to stretch the tape. The side on which the component is placed on the adhesive tape refers to the side of the adhesive tape's surface that adheres to the component.

[0220] In the above peeling process, the parts peeled off by the stretching of the adhesive tape can be detached (removed) from the tape by a desired method. Methods for detaching (removing) the processed product from the stretched adhesive tape include, for example, detachment (removal) by gravity, detachment (removal) by vibration, and detachment (removal) by means of suction, adsorption, clamping, sweeping, etc. Examples of suction means include vacuums and vacuum cleaners. Examples of adsorption means include suction cups, suction machines, and suction collets. Examples of clamping means include tweezers and clamps. Examples of sweeping means include swing plates, air pressure, and brushes. Among these, the gravity-dropping method, the vibration method, the sweeping means, and the suction means are preferred.

[0221] 3.Optional process The method for manufacturing the component described herein includes at least the inspection step and the peeling step described above, but may include other steps as necessary.

[0222] (1) Transfer process The manufacturing method of the component of this disclosure may include a transfer step in which another adherend is placed on the side of the component opposite to the side that adheres to the adhesive tape, and the adhesive tape is stretched to transfer the component to the other adherend. Since the transfer step is performed simultaneously with the peeling step, it can be included in the peeling step.

[0223] The other adherend onto which the parts are transferred is not particularly limited as long as the transferred parts can be fixed directly or indirectly, and examples include adhesive tape, tack tape, other parts coated with adhesive, etc.

[0224] (2) Processing process The manufacturing method of the part of this disclosure may include a processing step of processing a part before processing (workpiece) fixed on the adhesive layer of the tape described in section "I. Adhesive Tape" above to obtain one or more processed parts (processed products). The processing step is usually performed before the peeling step, but the peeling step may be performed in the middle of the processing step.

[0225] The parts (workpieces) before processing mentioned above are not particularly limited and can be appropriately selected depending on the type of parts (workpieces) to be processed. Examples of parts (workpieces) before processing include ceramic green sheet laminates, semiconductor wafers, optical device wafers, glass, quartz, and various other sheet materials.

[0226] The processing performed on the parts (workpieces) before processing in the above processing steps is not particularly limited and includes, for example, cutting, dicing, polishing, etching, etc.

[0227] (3) Other processes The manufacturing method of the parts described herein may include other steps in addition to the steps described above, such as a cleaning step and a curing step. Furthermore, the parts that have been peeled off the adhesive tape by the peeling step may be sent to other processes such as other processing, part assembly, or joining with other parts.

[0228] 4.Goods The size of each component manufactured by the manufacturing method of the component described herein is not particularly limited, but millimeter-level size is preferred, and micro-level size is more preferred. Specifically, the component is preferably a size that includes the dimensions specified in JIS C 5101-22:2014 (IEC 60384-22:2011).

[0229] The surface area of ​​the side of each component that comes into contact with the tape, manufactured by the manufacturing method of the component disclosed herein, is not particularly limited, but is 50 mm, as this is considered to be the most effective method for manufacturing the component disclosed herein. 2 The following is preferable: 30 mm 2 The following is preferable: 10 mm 2 Preferably, the following: 3 mm 2 Preferably, the following: 1 mm 2 Preferably, the following: 0.5 mm 2 The following are preferred, especially 0.2 mm 2 The following is preferable. The lower limit of the surface area is not particularly limited, but for example, 0.001 mm² 2 Preferably 0.01 mm 2 This can be done.

[0230] The parts that can be manufactured by the manufacturing method of the part disclosed herein are not particularly limited, but parts having the sizes described above are preferred. Examples include semiconductor wafers, semiconductor elements, capacitors such as multilayer ceramic capacitors, various chips such as chip resistors, and electronic components such as inductors.

[0231] This disclosure is not limited to the embodiments described above. The embodiments described above are illustrative, and any configuration that is substantially identical to the technical idea described in the claims of this disclosure and produces similar effects is included within the technical scope of this disclosure. [Examples]

[0232] The present invention will be described in detail below with reference to examples, but the present invention is not limited to these examples.

[0233] 1. Evaluation and Measurement Methods Each physical property was measured using the following method.

[0234] <25% Modulus, 100% Modulus, 200% Modulus, 300% Modulus> The object to be measured (adhesive layer, substrate, etc.) was cut into a JIS K6251 dumbbell No. 3 shape (gauge distance 20 mm, gauge width 5 mm), and under measurement conditions of 23°C and 50% RH, it was pulled longitudinally at a tensile speed of 500 mm / min using a Tensilon tensile testing machine (model: RTF-1210, manufactured by A&D Co., Ltd.). The stress value when the gauge distance after elongation became twice the gauge distance before elongation (initial gauge distance) (when the elongation calculated by formula (1) below is 100%) was defined as the 100% modulus of the object to be measured. Furthermore, the sample was stretched using the same method as the 100% modulus measurement method described above. The stress value when the distance between gauge marks after stretching became 1.25 times the distance between gauge marks before stretching (initial distance between gauge marks) (when the elongation calculated by formula (1) below is 25%) was defined as the 25% modulus of the object being measured. The stress value when the distance between gauge marks after stretching became 3 times the distance between gauge marks before stretching (initial distance between gauge marks) (when the elongation calculated by formula (1) below is 200%) was defined as the 200% modulus of the object being measured. The stress value when the distance between gauge marks after stretching became 4 times the distance between gauge marks before stretching (initial distance between gauge marks) (when the elongation calculated by formula (1) below is 300%) was defined as the 300% modulus of the object being measured. Modulus elongation (%) = {(distance between gauge marks after elongation) - (distance between gauge marks before elongation)} / (distance between gauge marks before elongation) ... Equation (1)

[0235] For the adhesive layer, the ratio of the 300% modulus to the 25% modulus (300% modulus / 25% modulus) and the absolute value of the difference between the 25% modulus and the 300% modulus (|Δ(25% modulus - 300% modulus)|) were calculated.

[0236] For the base material, the product of the 25% modulus and the thickness (25% modulus × thickness), and the absolute value of the difference between the 100% modulus and the 300% modulus (|Δ(100% modulus - 300% modulus)|) were calculated.

[0237] <Breaking elongation, breaking point stress, yield point elongation, yield point stress> The measurement object (adhesive layer, base material, etc.) was cut into the shape of No. 3 dumbbell of JIS K6251 (distance between gauge lines: 20 mm, width between gauge lines: 5 mm), and under the conditions of a measurement atmosphere of 23°C and 50% RH, using a tensilon tensile testing machine (model: RTF - 1210, manufactured by E & D Co., Ltd.), it was pulled longitudinally at a tensile speed of 500 mm / min. The stress value and elongation at the first point where the elongation increased without the tensile force increasing before the sample was cut were taken as the yield point stress and yield point elongation respectively, and the stress value and tensile elongation rate at the time of breakage were taken as the breaking point stress and breaking elongation respectively.

[0238] [Storage elastic modulus E’, loss elastic modulus E”, loss tangent Tanδ] The measurement object (base material) was punched into the shape of test piece type 5 of JIS K 7127 using a dumbbell cutter to obtain a test piece. Using the said test piece, it was measured by a dynamic viscoelasticity measuring device RSA-II manufactured by Rheometric Scientific (frequency: 1 Hz, heating rate: 3°C / min) to obtain the storage elastic modulus E’, loss elastic modulus E”, and loss tangent Tanδ at 25°C.

[0239] <Thickness> The thicknesses at 5 points were measured at intervals of 10 mm in the width direction of the measurement object (adhesive layer, base material, tape, etc.) using a thickness measuring machine for TH-104 paper / film (manufactured by Tester Sangyo Co., Ltd.), and the average value of the above 5 points was taken.

[0240] <Rubber hardness> The rubber hardness (Shore hardness) was measured for Shore A hardness and Shore D hardness in accordance with JIS K 6253 using a durometer (spring-type rubber hardness tester, model: GS-719G, manufactured by Techlock Co., Ltd.) and a durometer (spring-type rubber hardness tester, model: GS-720G, manufactured by Techlock Co., Ltd.). The Shore hardness of the above base polymer was measured after more than 15 seconds had elapsed after loading, by creating a test piece sheet from the base polymer.

[0241] <Arithmetic mean height (Sa) and kurtosis (Sku)> In accordance with ISO25178, the surface of each adhesive sheet substrate was observed under the following measurement conditions using a non-contact surface / layer cross-sectional shape measurement system ZeGage Pro HR (manufactured by Ametek Co., Ltd.), and the arithmetic mean height (Sa) and kurtosis (Sku) were measured. -Measurement conditions- · Camera pixel number (pix): 1000×1000@195Hz · Objective lens: 2.75X Mich · Shape removal: Plane

[0242] <Average particle size of the filler> The average particle size (primary particle size) of the filler was measured using a measuring instrument (Microtrac) that employs the laser diffraction scattering method.

[0243] <Filler content> The specific gravity of each of the base polymer, tackifier resin, polymerizable compound, and filler was measured in accordance with the method of JIS K7112, and the filler content (volume ratio) in the adhesive composition (solid content) was calculated using the following formula. {(Filler mass) / (Filler specific gravity)} = Volume of filler {(Volume of filler) / (Total volume of adhesive composition (solid content))} × 100 = Filler content in adhesive layer [volume%]

[0244] <180° peel adhesive strength at 23°C environment> The base material side of a tape cut to a length of 150 mm and a width of 50 mm was fixed to a stainless steel plate (length 200 mm, width 100 mm, thickness 3 mm) via double-sided tape (DIC Corporation, #8800CH). Next, under conditions of 23°C and 50% RH, the release liner of the tape was peeled off, and a PET film (thickness 25 μm, length 100 mm, width 20 mm) was pressed onto the adhesive layer of the tape by applying a load of 2 kg with a roller for one back-and-forth motion. After that, it was left to stand for 1 hour under conditions of 23°C and 50% RH. Under ambient conditions of 23°C and 50% RH, the PET film was peeled from the tape in a 180° direction at a tensile speed of 300 mm / min using a Tensilon tensile testing machine (model: RTF-1210, manufactured by A&D Co., Ltd.) to measure the 180° peel adhesion strength.

[0245] <180° peel adhesion at 70°C> The base material side of a tape cut to a length of 150 mm and a width of 50 mm was fixed to a stainless steel plate (length 200 mm, width 100 mm, thickness 3 mm) via double-sided tape (DIC Corporation, #8800CH). Next, under conditions of 23°C and 50% RH, the release liner of the tape was peeled off, and a PET film (thickness 25 μm, length 100 mm, width 20 mm) was pressed onto the adhesive layer of the tape by applying a load of 2 kg with a roller for one back-and-forth motion. After that, it was left to stand for 1 hour under conditions of 23°C and 50% RH. Under ambient conditions of 70°C, the PET film was peeled from the tape in a 180° direction at a tensile speed of 300 mm / min using a Tensilon tensile testing machine (model: RTF-1210, manufactured by A&D Co., Ltd.) to measure the 180° peel adhesion strength.

[0246] <Chip cutting ability> 100 parts by mass of barium titanate (particle size 150 nm), 16 parts by mass of toluene, and 16 parts by mass of ethanol were stirred and mixed in a ball mill. Then, 93.75 parts by mass of polyvinyl acetal resin solution (BH-3 manufactured by Sekisui Chemical Co., Ltd., diluted to 10% solids in an ethanol:toluene = 4:6 solution) and 2.63 parts by mass of bis(2-ethylhexyl) phthalate (manufactured by J-Plus Co., Ltd., DOP) were stirred and mixed to create a slurry. This slurry was applied to the release side of a release-treated PET film so that the thickness after drying would be 20 μm, and a ceramic sheet (1) was created by drying at 85°C for 3 minutes. The release-treated PET film was removed from the ceramic sheet (1), and 18 sheets were laminated together. The entire assembly was heated to 80°C and pressed together, and then trimmed to a size of 50 mm x 50 mm to create a ceramic block (1).

[0247] A test specimen was prepared by cutting a tape to a length of 130 mm x width of 130 mm, marking the entire surface of the tape with 10 mm square grid-like markers, and attaching the ceramic block (1) to the center. The test specimen was placed on the stage of a cutting machine (MTC-ST, manufactured by Micro-Tech), and under the conditions of a blade speed of 200 mm / min, a workpiece temperature of 70°C, a blade temperature of 40°C, and a stripper pressure of 0.15 MPa, the ceramic block (1) in a 45 mm x 45 mm area from the center was cut into 0.7 mm x 0.35 mm ceramic chips. There were 8450 ceramic chips after cutting. The chip cutting performance was evaluated according to the following criteria. (judgement) ◎: The ceramic chip was able to cut without peeling off the tape. ○: Cutting was possible when the number of ceramic chips that peeled off the tape was between 1 and 100. ×: The number of ceramic chips that peeled off the tape was 100 or more.

[0248] <Tape flexibility> The test specimens (tapes with ceramic chips attached) prepared in the "<Chip Cutting Ability>" evaluation described above were bent with the ceramic chips facing outwards to a bending radius of 1 mm. The appearance of the bent portion of the test specimens was visually observed, and the flexibility of the tape was evaluated according to the following criteria. ○: No creases were left on the bent part of the test specimen. ×: A crease was left on the bent part of the test specimen.

[0249] <Tape slipperiness> The test specimen (tape with ceramic chips attached) prepared in the "<Chip Cutting Ability>" evaluation was bent with the ceramic chips facing outwards, using a 1 mm diameter rod as a fulcrum. The bending position was then moved by sliding the tape while rotating the rod, keeping the base surfaces of the test specimens in contact with each other. The slipperiness of the tape at that time was evaluated according to the following criteria. ○: The bending position could be moved smoothly without any sagging of the test specimen or blocking between the substrate surfaces. △: Although sagging occurred in the test specimen, the substrate surfaces did not block each other, and the bending position could be moved. ×: The substrate surfaces blocked each other and could not be slid.

[0250] <Visibility of the chip's cut surface> The test specimen (tape on which the ceramic chip was placed) created in the evaluation of "<Chip Cutting Ability>" was bent so that the ceramic chip was facing outwards and it covered the outer edge of a 1 mm thick plastic plate 8. The exposed cross-section of the ceramic chip was observed with a microscope 9. When the observation direction of the microscope 9 was defined as E, and the angle between observation direction E and the chip cut surface 7,7' was defined as the exposure angle A (Figure 3(a)), the visibility of the chip cut surface was evaluated according to the following criteria. If the exposure angle A was not between 45° and 90° when the test specimen was simply placed along the plastic plate 8, the test specimen was sandwiched between support rolls 10 and pressed against the plastic plate 8 for observation (Figure 3(b)). The observation direction E of the microscope 9 was adjusted so that the angle between observation direction E and the chip cut surface 7 was equal to the angle between observation direction E and the chip cut surface 7'. ○: By simply bending the test specimen along the plastic plate 8, the exposure angle A was between 45° and 90°, allowing observation of the entire cross-section 7,7'. △: When the test specimen was pressed down and bent using the support roll 10, the exposure angle A was between 45° and 90°, allowing observation of the entire cross-section 7,7'. ×: When the test specimen was pressed down and bent by the support roll 10, the exposure angle A was less than 45°, and a portion of the cross-section 7,7' could not be observed.

[0251] <Removability (elongation when ceramic chip is peeled)> The peelability was evaluated using a device for stretching the tape of the test piece (tape with a ceramic chip placed thereon) created in the evaluation of the "<Chip Cutability>". Specifically, the outer peripheral region that is only the tape where the ceramic chip of the test piece is not attached (the region outside the region where the ceramic chip is attached on the tape surface) was placed on a φ80 mm fixed ring with a hollow inside. From the surface opposite to the surface where the ceramic chip of the test piece is attached, in the thickness direction of the tape, a stretching member A (outer periphery φ70 mm, spoke shape, with 15 coating portions created with a 10 mm wide PP band evenly arranged on the outer peripheral rim of the spokes) was pushed up at a moving speed of 1 mm / second and a maximum moving distance of 80 mm to stretch the test piece, and the elongation at the time of peeling of the tape when all the ceramic chips were peeled off from the tape was calculated by the following calculation formula (2). Note that the determination of whether the ceramic chip was peeled off or not was judged by whether it slid (peeled off) from the side of the ceramic chip with a 50 μm thick PET film, and evaluated by the following determination. (Determination) ◎: The ceramic chip slid (peeled off) without resistance when the moving distance of the stretching member A was 50 mm or less. 〇: The ceramic chip slid (peeled off) without resistance when the moving distance of the stretching member A exceeded 50 mm and was less than 80 mm. △: The ceramic chip peeled off with some resistance when the moving distance of the stretching member A was 80 mm. ×: The ceramic chip could not be peeled off when the moving distance of the stretching member A was 80 mm. The elongation at the time of peeling was taken as the length of the side of the central square of the 10 mm square grid marks pre-written on the tape when creating the test piece in the "<Chip Cutability>" as the "initial distance between scale marks", and the length of the side of the central square when all the ceramic chips were peeled off as the distance between scale marks, and calculated by the following calculation formula (2). Elongation at the time of peeling [%] = {(Distance between scale marks of the tape after elongation when all the ceramic chips are peeled off) / (Initial distance between scale marks)} × 100 … Formula (2)

[0252] 2. Manufacture of the tape [Materials] The materials and preparation methods used in the examples and comparative examples are as follows.

[0253] <<Base Polymer>> • Base polymer (1) In a pressure vessel that had been purged with nitrogen and dried, 3,000 mL of cyclohexane and 9.2 mL of sec-butyllithium (10.5% by mass cyclohexane solution) were charged as solvents. After raising the temperature to 60°C, 100 mL of styrene was added and polymerization was carried out for 60 minutes. Subsequently, at the same temperature, 270 mL of isoprene and 350 mL of butadiene were added and the reaction was continued for 90 minutes. Then, at the same temperature, 100 mL of styrene was added and polymerization was carried out for 60 minutes, after which 0.52 mL of methanol was added to stop the polymerization, and a polymerization reaction solution containing a block copolymer was obtained. 29.3 g of palladium carbon (palladium loading: 5% by mass) was added to this polymerization reaction solution as a hydrogenation catalyst, and the hydrogenation reaction was carried out at 150°C for 10 hours at a hydrogen pressure of 2 MPa. After cooling and release of pressure, the palladium carbon was removed by filtration, the filtrate was concentrated, and the base polymer (1) was obtained by further vacuum drying. The above-mentioned base polymer (1) is a hydrogenated polystyrene-polyisoprene / butadiene-polystyrene block copolymer (styrene-ethylene-ethylene-propylene-styrene block copolymer, sometimes referred to as "SEEPS"), with a styrene content of 30% by mass, a weight-average molecular weight of 98,000, a specific gravity of 0.91, and is a resin with elongation crystallinity. A solution of base polymer (1) dissolved in toluene was applied to a release liner (film vinyl 50E-0010GT, manufactured by Fujimori Kogyo Co., Ltd.) using an applicator to a thickness of 50 μm after drying, and the sheet was dried at 80°C for 3 minutes. The 100% modulus of the sheet was 2.2 MPa, the breaking stress was 35.3 MPa, and the Shore hardness was Shore A75.

[0254] • Base polymer (2) In a pressure vessel that had been purged with nitrogen and dried, 4000 mL of cyclohexane, 9.6 mL of sec-butyllithium (10% by mass cyclohexane solution) and 0.9 mL of ethylene glycol dimethyl ether were charged as solvents. After raising the temperature to 60°C, 100 mL of styrene was added and polymerization was carried out for 60 minutes. Then, at the same temperature, 1.10 L of butadiene was added and polymerization was carried out for 90 minutes. Subsequently, 100 mL of styrene was added at the same temperature and polymerization was carried out for 60 minutes, after which 3.5 L of methanol was added to stop the polymerization and obtain a polymerization reaction solution containing a block copolymer. To this polymerization reaction solution, 46.7 g of palladium carbon (palladium loading: 5% by mass) was added to the copolymer as a hydrogenation catalyst, and the reaction was carried out for 10 hours under conditions of hydrogen pressure of 2 MPa and 150°C. After cooling and release of pressure, the palladium carbon was removed by filtration, the filtrate was concentrated, and the base polymer (2) was obtained by further vacuum drying. The above-mentioned base polymer (2) is a hydrogenated polystyrene-polybutadiene-polystyrene block copolymer (styrene-ethylene-butylene-styrene block copolymer, sometimes referred to as "SEBS"), with a styrene content of 22% by mass, a weight-average molecular weight of 126,000, a specific gravity of 0.91, and is a resin with elongation crystallinity. A solution of base polymer (2) dissolved in toluene was applied to a release liner (film vinyl 50E-0010GT, manufactured by Fujimori Kogyo Co., Ltd.) using an applicator to a thickness of 50 μm after drying, and the sheet was dried at 80°C for 3 minutes. The 100% modulus of the sheet was 2.3 MPa, the breaking stress was 20.6 MPa, and the Shore hardness was Shore A77.

[0255] • Base polymer (3) As the base polymer (3), a styrene-ethylene-propylene copolymer (Septon 1020, manufactured by Kuraray Co., Ltd., hereinafter sometimes referred to as "SEP"; styrene content: 36% by mass, specific gravity 0.91) was used. A solution of the base polymer (3) dissolved in toluene was applied to a release liner (film vinyl 50E-0010GT, manufactured by Fujimori Kogyo Co., Ltd.) using an applicator so that the thickness after drying was 50 μm, and the sheet dried at 80°C for 3 minutes had a 100% modulus of 2.0 MPa and a breaking stress of 15.3 MPa.

[0256] The shore hardness was Shore A70.

[0257] • Base polymer (4) As the base polymer (4), a styrene-ethylene-propylene-styrene copolymer (Septon 2063, manufactured by Kuraray Co., Ltd., sometimes referred to as "SEPS" below; styrene content: 13% by mass, specific gravity 0.91) was used. A solution of the base polymer (4) dissolved in toluene was applied to a release liner (Film Vina 50E-0010GT, manufactured by Fujimori Kogyo Co., Ltd.) using an applicator to achieve a thickness of 50 μm after drying. The sheet was dried at 80°C for 3 minutes. The 100% modulus of the sheet was 0.5 MPa, the breaking stress was 10.8 MPa, and the Shore hardness was Shore A36.

[0258] <<Adhesive-enhancing resin>> Quinton M100 (manufactured by Zeon Corporation, softening point 95°C, specific gravity 1.05)

[0259] <<Polymerizable compounds>>

[0260] [Table 1]

[0261] <<Photopolymerization initiator>> Omnirad 184 (manufactured by IGM Resins BV)

[0262] <<Filler>>

[0263] [Table 2]

[0264] <<Adhesive Composition>> • Adhesive composition (1) 50 parts by mass of the above base polymer (1), 50 parts by mass of the above base polymer (2), 100 parts by mass of Quinton M100 as a tackifying resin, 50 parts by mass of the above polymerizable compound (1), 17 parts by mass of Omnirad 184 as a photopolymerization initiator, 66 parts by mass of the above filler (1), and toluene were added and stirred and mixed until homogeneous to obtain an adhesive composition (1) with a solid content of 25% by mass.

[0265] • Adhesive compositions (2) to (5) The adhesive composition (1) was prepared in the same manner as described above, according to the mixing ratios shown in Table 3 below.

[0266] [Table 3]

[0267] <<Resin composition for forming intermediate layer>> ·Resin composition for forming intermediate layer (1) In a reaction vessel equipped with a stirrer, reflux condenser, nitrogen inlet tube, thermometer, and dropping funnel, 75.94 parts by mass of n-butyl acrylate, 5 parts by mass of 2-ethylhexyl acrylate, 15 parts by mass of cyclohexyl acrylate, 4 parts by mass of acrylic acid, 0.06 parts by mass of 4-hydroxybutyl acrylate, and 200 parts by mass of ethyl acetate were charged. The mixture was heated to 65°C while stirring and blowing in nitrogen to obtain mixture (1). Next, 4 parts by mass (2.5% by mass of solids) of 2,2'-azobisisobutyronitrile solution, which had been previously dissolved in ethyl acetate, was added to mixture (1), and the mixture was held at 65°C for 10 hours while stirring to obtain mixture (2). Next, mixture (2) was diluted with ethyl acetate to a solids content of 30% by mass and filtered through a 200-mesh wire mesh to obtain a solution of acrylic copolymer (1) with a weight-average molecular weight of 1.6 million (polystyrene equivalent). To 100 parts by mass (solid content) of the above acrylic copolymer (1), 2.0 parts by mass of an epoxy crosslinking agent (a solution with a solid content of 5% obtained by mixing Tetrad X manufactured by Mitsubishi Gas Chemical Company, Inc. with ethyl acetate) was added, and the mixture was stirred until homogeneous to obtain an acrylic adhesive intermediate layer forming resin composition (1).

[0268] <<Base material>> ·Base material (1) The substrate (1) was an ester-based polyurethane resin film (manufactured by Nippon Matai Co., Ltd., Esmar URS, 100 μm thick). The substrate (1) had a 100% modulus of 8.56 MPa, a 200% modulus of 11.27 MPa, a 300% modulus of 22.84 MPa, an elongation at break of 556%, a stress at break of 91.0 MPa, and a rubber hardness of Shore A92.

[0269] ·Base material (2) The substrate (2) was an ester-based polyurethane resin film (manufactured by Nippon Matai Co., Ltd., Esmar URS-ET 98A, 100 μm thick). The substrate (2) had a 100% modulus of 15.19 MPa, a 200% modulus of 24.35 MPa, a 300% modulus of 40.90 MPa, an elongation at break of 459%, a stress at break of 81.0 MPa, and a rubber hardness of Shore A98.

[0270] ·Base material (3) The base material (3) was an ester-based polyurethane resin film (manufactured by Nippon Matai Co., Ltd., Esmar URS-ET 65D, 100 μm thick). The base material (3) had a 100% modulus of 19.57 MPa, a 200% modulus of 30.88 MPa, a 300% modulus of 47.19 MPa, an elongation at break of 380%, a stress at break of 70.2 MPa, and a rubber hardness of Shore D65.

[0271] ·Base material (4) The base material (4) was an ester-based polyurethane resin film (manufactured by Nippon Matai Co., Ltd., Esmar URS-ET 86A, 100 μm thick). The base material (4) had a 100% modulus of 6.45 MPa, a 200% modulus of 8.55 MPa, a 300% modulus of 16.47 MPa, an elongation at break of 566%, a stress at break of 79.1 MPa, and a rubber hardness of Shore A86.

[0272] ·Base material (5) The base material (5) was an ester-based polyurethane resin film (manufactured by Nippon Matai Co., Ltd., Esmar OES DC-RP, 100 μm thick). The base material (5) had a 100% modulus of 9.36 MPa, a 200% modulus of 9.08 MPa, a 300% modulus of 9.21 MPa, an elongation at break of 803%, a stress at break of 40.1 MPa, and a rubber hardness of Shore D65.

[0273] ·Base material (6) A thermoplastic acrylic elastomer (Clarity LH8156, manufactured by Kuraray Co., Ltd.) was melted at 240°C using a T-die extruder (single-screw extruder D2020, D(mm)=20, L / D=20, die: 300mm wide coat hanger die, manufactured by Toyo Seiki Seisakusho Co., Ltd.) and extruded to an average thickness of 100 μm to produce a base material (6). The above base material (6) had a 100% modulus of 1.73 MPa, a 200% modulus of 3.01 MPa, a 300% modulus of 5.34 MPa, an elongation at break of 608%, a stress at break of 20.26 MPa, and a rubber hardness of Shore A50.

[0274] ·Base material (7) A styrene-isoprene-styrene copolymer (hereinafter sometimes referred to as "SIS") was used as the base material (7). This base material (7) contained 18% by weight of styrene-derived structural units represented by the following chemical formula (1).

[0275] [ka] The base material (7) was prepared by melting the material for the base material (7) at 200°C using a T-die extruder (single-screw extruder D2020, D(mm)=20, L / D=20, die: 300mm wide coat hanger die, manufactured by Toyo Seiki Seisakusho Co., Ltd.) and extruding it to an average thickness of 100 μm. The above base material (7) had a 100% modulus of 2.13 MPa, a 200% modulus of 2.55 MPa, a 300% modulus of 2.91 MPa, an elongation at break of 1179%, a stress at break of 19.19 MPa, and a rubber hardness of Shore A45.

[0276] ·Base material (8) The substrate (8) used was a PET film (manufactured by Toyobo Co., Ltd., A4160, 100 μm thick). The substrate (8) had a breaking elongation of 77% and a breaking stress of 133.21 MPa. Since the breaking elongation of the substrate (8) was less than 100%, the 100% modulus, 200% modulus, and 300% modulus could not be measured. In addition, the rubber hardness could not be measured because it exceeded the measurement limit of Shore D.

[0277] ·Base material (9) The substrate (9) used was a polyimide film (manufactured by Toray DuPont Co., Ltd., Kapton 500H, 125 μm thick). The substrate (9) had a 100% modulus of 220.82 MPa, an elongation at break of 130.99%, and a stress at break of 234.99 MPa. Since the elongation at break of the substrate (9) was less than 200%, the 200% modulus and 300% modulus could not be measured. In addition, the rubber hardness could not be measured because it exceeded the measurement limit of Shore D.

[0278] [Manufacturing of adhesive tape] (Example 1) The above-mentioned resin composition (1) for forming the intermediate layer was applied to a release liner (1) (film vinyl 75E-0010GT, manufactured by Fujimori Kogyo Co., Ltd.) using an applicator so that the thickness after drying was 3 μm, and an intermediate layer was created by drying at 80°C for 3 minutes. The intermediate layer was bonded to a substrate (1) that had been corona-treated to have a wet tension of 56 mN / m, and a laminated intermediate was created by laminating under pressure of 0.2 MPa while heating at 70°C.

[0279] The above adhesive composition (1) is applied to a release liner (2) (Film Vina 50E-0010GT, manufactured by Fujimori Kogyo Co., Ltd.) using an applicator so that the thickness after drying is 10 μm, and dried at 80°C for 3 minutes. An ultraviolet irradiation device (Fusion UV Systems Japan Co., Ltd. "F450", lamp: 120 W / cm, H bulb) is used to irradiate with a light intensity of 1000 mJ / cm². 2An adhesive layer (1) was created by irradiating it with ultraviolet light. Furthermore, the release liner (1) of the laminated intermediate was peeled off, and the adhesive layer (1) was bonded to the surface of the exposed intermediate layer and laminated under pressure of 0.2 MPa to create the tape of Example 1.

[0280] (Examples 2-11, Comparative Examples 1-5) Except for changing the material, thickness, and substrate of the adhesive composition of Example 1 as shown in Tables 4 to 8 below, the tapes of Examples 2 to 11 and Comparative Examples 1 to 5 were prepared in the same manner as in Example 1. The evaluation results of Examples 1 to 11 and Comparative Examples 1 to 5 are shown in Tables 4 to 8. In the tables, modulus and rubber hardness that could not be measured, and yield point elongation and yield point stress where no yield point existed, are indicated as "-".

[0281] [Table 4]

[0282] [Table 5]

[0283] [Table 6]

[0284] [Table 7]

[0285] [Table 8]

[0286] Compared to Comparative Examples 1-5, the adhesive tapes of Examples 1-11 exhibited superior flexibility, as they did not leave creases when bent, allowing for smooth observation of the cross-section. Furthermore, the good exposure angle of the cut surface enabled clear observation of the entire cut surface with a microscope. Moreover, the tapes could be easily peeled off simply by stretching them. [Explanation of symbols]

[0287] 1…Adhesive tape, 2…Substrate, 3…Adhesive layer, 5…Part, 6…Inspection device, 7,7'…Cut surface, 8…Plastic plate, 9…Microscope, 10…Support roll, D…Stretching direction, E…Observation direction, A…Exposure angle

Claims

1. The substrate has an adhesive layer on at least one surface, 25% Modulus S of the aforementioned substrate ２５ S is obtained by multiplying (MPa) by the thickness T (μm) of the substrate. ２５ - T is greater than 75 but less than or equal to 5000 (MPa·μm), The thickness of the substrate is 500 μm or less. An adhesive tape in which the absolute value of the difference between the 25% modulus and the 300% modulus of the adhesive layer is 0.5 MPa or more.

2. The adhesive tape according to claim 1, wherein the 300% modulus of the adhesive layer is more than twice the 25% modulus of the adhesive layer.

3. The adhesive tape according to claim 1, wherein the adhesive layer contains an stretchable crystalline resin.

4. The adhesive tape according to claim 1, wherein the adhesive layer includes a filler.

5. The adhesive tape according to claim 4, wherein the average particle size of the filler is 0.5 to 50 μm.

6. The adhesive tape according to claim 1, wherein the adhesive layer comprises at least one of a polymerizable compound and a polymer of the polymerizable compound.

7. The adhesive tape according to claim 6, wherein the polymerizable compound is a polyfunctional (meth)acrylate.

8. The adhesive tape according to claim 1, wherein the rubber hardness of the base material is Shore A40 to Shore D75.

9. The adhesive tape according to claim 1, wherein the arithmetic mean height (Sa) of the surface of the substrate opposite to the adhesive layer is 0.100 μm or more.

10. The adhesive tape according to claim 1, wherein the substrate does not have a yield point.

11. The adhesive tape according to claim 1, wherein the 180° peel adhesive strength measured by the method described below is 0.001 to 5 N / 20 mm. <Method for measuring 180° peel adhesive strength> The base material side of an adhesive tape cut to a length of 150 mm and a width of 50 mm was fixed to a stainless steel plate (length 200 mm, width 100 mm, thickness 3 mm) via double-sided tape (DIC Corporation, #8800CH). Next, under conditions of 23°C and 50% RH, the release liner of the adhesive tape was peeled off, and a PET film (thickness 25 μm, length 100 mm, width 20 mm) was pressed onto the adhesive layer of the adhesive tape by applying a load of 2 kg with a roller for one back-and-forth motion. After that, it was left to stand for 1 hour under conditions of 23°C and 50% RH. Under ambient conditions of 23°C and 50% RH, the PET film was peeled from the tape in a 180° direction at a tensile speed of 300 mm / min using a Tensilon tensile testing machine (model: RTF-1210, manufactured by A&D Co., Ltd.) to measure the 180° peel adhesion strength.

12. The adhesive tape according to claim 1, wherein the elongation at break is 300 to 1000%.

13. The adhesive tape according to claim 1, wherein the thickness is 10 to 1500 μm.

14. An adhesive tape according to any one of claims 1 to 13, which is used for temporarily fixing parts.

15. The adhesive tape according to claim 14, wherein the component is a multilayer ceramic capacitor, a semiconductor element, an inductor, or a chip.

16. An inspection method for inspecting parts using an adhesive tape according to any one of claims 1 to 13, A method for inspecting parts, comprising the step of bending the adhesive tape on which one or more parts are fixed, thereby exposing and inspecting the cross-sections of the parts.

17. The method for inspecting a component according to claim 16, wherein the component is a multilayer ceramic capacitor, a semiconductor element, an inductor, or a chip.

18. The method for inspecting a part according to claim 16, further comprising the step of shifting the bending position of the adhesive tape to change the cross-section of the part to be inspected.

19. The method for inspecting a component according to claim 18, wherein the component is a multilayer ceramic capacitor, a semiconductor element, an inductor, or a chip.

20. A method for manufacturing a component using an adhesive tape according to any one of claims 1 to 13, A method for manufacturing a component, comprising a peeling step of stretching the adhesive tape on which one or more components are fixed in at least one direction to peel the components from the adhesive tape.

21. The method for manufacturing a component according to claim 20, wherein the component is a multilayer ceramic capacitor, a semiconductor element, an inductor, or a chip.

22. The surface area of ​​the part that comes into contact with the adhesive tape for each part that detaches from the adhesive tape in the peeling process is 1 mm². ２ The method for manufacturing a component according to claim 20 is as follows:

23. The method for manufacturing a component according to claim 22, wherein the component is a multilayer ceramic capacitor, a semiconductor element, an inductor, or a chip.

Images