Electrical connection unit and heat dissipation structure

The integration of a heat pipe embedded in a metal member within the electrical connection unit enhances heat dissipation, addressing overheating issues and enabling smaller, more efficient designs.

JP2026106608APending Publication Date: 2026-06-30YAZAKI CORP

Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
YAZAKI CORP
Filing Date
2024-12-18
Publication Date
2026-06-30

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Abstract

One embodiment provides an electrical connection unit and a heat dissipation structure that can improve heat dissipation. [Solution] The electrical connection unit of one embodiment is an electrical connection unit for use in a vehicle. The electrical connection unit comprises a heat dissipation object, a metal member, and a heat pipe structure. The metal member is connected to the heat dissipation object. At least a portion of the heat pipe structure is embedded in the metal member.
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Description

Technical Field

[0001] Embodiments of the present invention relate to an electrical connection unit and a heat dissipation structure.

Background Art

[0002] An electrical connection unit having an electronic component and a wiring material electrically connected to the electronic component is known.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] By the way, improvement in heat dissipation is expected for the electrical connection unit.

[0005] One embodiment provides an electrical connection unit and a heat dissipation structure capable of improving heat dissipation.

Means for Solving the Problems

[0006] An electrical connection unit according to one embodiment is an in-vehicle electrical connection unit. The electrical connection unit has a heat dissipation target, a metal member, and a heat pipe structure. The metal member is connected to the heat dissipation target. At least a part of the heat pipe structure is embedded in the metal member.

[0007] A heat dissipation structure according to one embodiment is a heat dissipation structure used for an in-vehicle electrical connection unit. The heat dissipation structure has a metal member and a heat pipe structure. The metal member is connected to a heat dissipation target. At least a part of the heat pipe structure is embedded in the metal member.

Effects of the Invention

[0008] According to one embodiment, heat dissipation can be improved. [Brief explanation of the drawing]

[0009] [Figure 1] A cross-sectional view showing the electrical connection unit of the first embodiment. [Figure 2] A perspective view showing a disassembled portion of the electrical connection unit of the first embodiment. [Figure 3] A diagram showing a heat dissipation structure according to the first embodiment. [Figure 4] A cross-sectional view of the heat dissipation structure shown in Figure 3, along the F4-F4 line. [Figure 5] A diagram showing the heat dissipation structure of the first embodiment in an exploded view. [Figure 6] A diagram showing a heat dissipation structure of a first modified example of the first embodiment. [Figure 7] A diagram showing a heat dissipation structure of a second modified example of the first embodiment. [Figure 8] A diagram showing a heat dissipation structure of a third modified example of the first embodiment. [Figure 9] A cross-sectional view showing an electrical connection unit of a fourth modified example of the first embodiment. [Figure 10] A cross-sectional view showing the electrical connection unit of the second embodiment. [Figure 11] A perspective view showing the heat dissipation structure of the second embodiment. [Figure 12] A cross-sectional view of the heat dissipation structure shown in Figure 11, along the line F12-F12. [Figure 13] A cross-sectional view showing an electrical connection unit of a modified example of the second embodiment. [Figure 14] A perspective view showing a heat dissipation structure of a modified example of the second embodiment. [Figure 15] A cross-sectional view showing the electrical connection unit of the third embodiment. [Modes for carrying out the invention]

[0010] Hereinafter, embodiments will be described with reference to the drawings. In the following description, components having the same or similar functions are denoted by the same reference numerals, and redundant descriptions of these components may be omitted. Note that the configurations described below do not limit the scope of the embodiments.

[0011] In the present disclosure, terms are defined as follows. "Connection" is not limited to mechanical connection and may include electrical connection. That is, "connection" is not limited to the case where two elements to be connected are directly connected, but may include the case where two elements to be connected are connected with another element intervening therebetween. "Face" or "overlap" means that virtual projections of two objects overlap each other when viewed from a specific direction. That is, "face" or "overlap" is not limited to the case where two objects directly face each other, but may include the case where two objects face each other with another member or a gap existing between the two objects. "Parallel", "orthogonal", or "the same" may each include the case of being "substantially parallel", "substantially orthogonal", or "substantially the same".

[0012] In the present disclosure, the +X direction, -X direction, +Y direction, -Y direction, +Z direction, and -Z direction are defined as follows. The +X direction is, for example, the direction from an electronic component 10 described later toward a connection component 50 (see FIG. 1). The -X direction is the direction opposite to the +X direction. Hereinafter, when the +X direction and the -X direction are not distinguished, they are simply referred to as the "X direction". The +Y direction and the -Y direction are directions that intersect (for example, are orthogonal) to the X direction. The +Y direction is, for example, the direction from a terminal 13A of the electronic component 10 described later toward a terminal 13B (see FIG. 2). The -Y direction is the direction opposite to the +Y direction. Hereinafter, when the +Y direction and the -Y direction are not distinguished, they are simply referred to as the "Y direction". The +Z direction and the -Z direction are directions that intersect (for example, are orthogonal) to the X direction and the Y direction. The +Z direction is the direction from a base member 6 toward the electronic component 10 (see FIG. 1). The -Z direction is the direction opposite to the +Z direction. Hereinafter, when the +Z direction and the -Z direction are not distinguished, they are simply referred to as the "Z direction".

[0013] Hereinafter, when the X direction and the Y direction are not distinguished, it may be referred to as the "horizontal direction". Hereinafter, the Z direction may be referred to as the "vertical direction". Also hereinafter, the +Z direction side may be referred to as "up", and the -Z direction side may be referred to as "down". However, these expressions are for convenience of explanation and do not limit the gravitational direction (installation posture of the electrical connection unit 1).

[0014] (A. First Embodiment) <A1. Configuration of Electrical Connection Unit> FIG. 1 is a cross-sectional view showing the electrical connection unit 1 of the first embodiment. The electrical connection unit 1 is an in-vehicle device mounted on a vehicle such as an EV (Electric Vehicle), an HEV (Hybrid Electric Vehicle), or a PHEV (Plug-in Hybrid Electric Vehicle), for example. The electrical connection unit 1 may be referred to as an "electrical connection box" or a "junction box", for example. However, the electrical connection unit 1 is not limited to a box-shaped device.

[0015] The electrical connection unit 1 has, for example, a housing 5, a base member 6, a plurality of heat dissipation members 7, 8, a main body portion MU, and a plurality of heat transfer members 70. Here, the housing 5, the base member 6, the heat dissipation members 7, 8, and the main body portion MU will be described, and the heat transfer member 70 will be described later.

[0016] (Housing) The housing 5 is a component that forms the outer casing of the electrical connection unit 1. The housing 5 is made of, for example, synthetic resin and has insulating properties. The housing 5 houses the main body MU. The housing 5 includes a first wall portion 5a that covers at least a part of the main body MU from the -Z direction side, and a second wall portion 5b that covers at least a part of the main body MU from the +Z direction side. Each of the first wall portion 5a and the second wall portion 5b is an example of an "insulating portion". Note that the housing 5 may be omitted. The electrical connection unit 1 may also have another insulating portion (for example, an insulating sheet) equivalent to the first wall portion 5a of the housing 5 instead of the first wall portion 5a. The electrical connection unit 1 may also have another insulating portion (for example, an insulating sheet) equivalent to the second wall portion 5b of the housing 5 instead of the second wall portion 5b of the housing 5.

[0017] (Base component) The base member 6 is a member that supports the electronic component 10 or busbar 30, which will be described later, inside the housing 5. The base member 6 is housed in the housing 5. In this embodiment, the base member 6 is fixed to the first wall portion 5a of the housing 5. The base member 6 includes, for example, a first support portion 6a that supports the electronic component 10 and a second support portion 6b that supports the busbar 30. The base member 6 is an example of a "support". Note that the base member 6 may be formed by a part of the housing 5.

[0018] (Heat dissipation component) The first heat dissipation member 7 and the second heat dissipation member 8 are located outside the housing 5. For example, the first heat dissipation member 7 is located along the first wall portion 5a of the housing 5. The second heat dissipation member 8 is located along the second wall portion 5b of the housing 5. The first heat dissipation member 7 and the second heat dissipation member 8 are, for example, metal plates. Alternatively, the first heat dissipation member 7 and the second heat dissipation member 8 may be water jackets or the like.

[0019] Each of the first heat radiating member 7 and the second heat radiating member 8 is not limited to the heat radiating member provided as a part of the electrical connection unit 1, and may be a heat radiating member provided outside the electrical connection unit 1. In the example shown in FIG. 1, as the first heat radiating member 7, a water jacket which is a member outside the electrical connection unit 1 is provided. Also, as the second heat radiating member 8, a metal plate which is a part of the electrical connection unit 1 is provided. Note that one or both of the first heat radiating member 7 and the second heat radiating member 8 may be omitted.

[0020] (Main body part) The main body part MU is a part that performs the main functions of the electrical connection unit 1 (for example, switching of the electrical connection state or overcurrent protection). The main body part MU may be referred to as a "circuit configuration body". The main body part MU includes, for example, one or more electronic components 10, a plurality of bus bars 30 (only one is shown in FIG. 1), and a plurality of connection components 50 (see FIG. 2).

[0021] <A2. Electronic component> First, the electronic component 10 will be described. The electronic component 10 is an electronic component mounted according to the functions required for the main body part MU. The electronic component 10 is, for example, a connector, a fuse, a relay (for example, a mechanical relay or a semiconductor relay), a capacitor, a branching component, various sensors (for example, a current sensor or a voltage sensor), an electronic control unit, or an electronic component unit in which two or more of these are unitized. However, the type of the electronic component 10 is not limited to the above example. The electronic component 10 is, for example, a heat generating component that generates heat when energized. The electronic component 10 is an example of a "heat radiation target".

[0022] FIG. 2 is a perspective view showing a part of the electrical connection unit 1 disassembled. The electronic component 10 has, for example, a case 11, a component main body part 12, and a plurality of terminals 13.

[0023] The case 11 is an outer casing that forms most of the external shape of the electronic component 10. The case 11 is made of, for example, synthetic resin and has insulating properties. The case 11 houses the component body 12. The case 11 and the component body 12 may be formed integrally. For example, the case 11 is fixed to the base member 6 by a fixing part (not shown).

[0024] The main body of the component 12 is the part that performs the main function of the electronic component 10. For example, if the electronic component 10 is a relay, the main body of the component 12 includes a switching part (e.g., a contact part) that switches between a conductive state and a non-conductive state. For example, if the electronic component 10 is a fuse, the main body of the component 12 includes a fuse that melts when an overcurrent flows. For example, if the electronic component 10 is a capacitor, the main body of the component 12 includes a part that stores electric charge.

[0025] Terminal 13 is an electrical connection part exposed to the outside of the case 11. Terminal 13 is electrically connected to the component body 12 inside the case 11. In this embodiment, the electronic component 10 includes terminals 13A and terminal 13B as a plurality of terminals 13. One of terminals 13A and terminal 13B is the positive terminal. The other of terminals 13A and terminal 13B is the negative terminal. One of terminals 13A and terminal 13B is an example of a "first terminal". The other of terminals 13A and terminal 13B is an example of a "second terminal".

[0026] In this embodiment, terminals 13A and 13B are provided at one end of the electronic component 10 in the horizontal direction (e.g., the X direction). Terminals 13A and 13B are arranged side by side in the horizontal direction (e.g., the Y direction). Each of terminals 13A and 13B faces the horizontal direction (e.g., the X direction).

[0027] Each terminal 13 has a mounting hole 13h into which a fastening member 41 (e.g., a screw or bolt), described later, is inserted. The mounting hole 13h opens horizontally (e.g., in the +X direction). In this embodiment, the fastening member 41 is inserted into the mounting hole 13h from the X direction (e.g., from the +X direction side). The inner circumferential surface of the mounting hole 13h of the electronic component 10 has a screw groove. The mounting hole 13h is a bottomed hole provided in the electronic component 10. In this disclosure, the term "mounting hole" is not limited to a hole with a screw groove, and may also be a hole without a screw groove.

[0028] <A3.バスバー> Next, let's return to Figure 1 and describe the busbar 30. The busbar 30 is a wiring material that electrically connects multiple connection targets. The busbar 30 is made of metal (for example, copper, copper alloy, aluminum, or aluminum alloy) and is conductive. The busbar 30 electrically connects a first connection target (first component) and a second connection target (second component). For example, the busbar 30 electrically connects the electronic component 10 to another wiring material (for example, another busbar) in the electrical connection unit 1. Note that the first and second connection targets are not limited to the above examples. The first connection target is any one of the following: for example, an electronic component, a connection component, another busbar in the electrical connection unit 1, or a busbar for external connection. The second connection target is any one of the following: for example, an electronic component, a connection component, another busbar in the electrical connection unit 1, or a busbar for external connection. The busbar 30 is an example of a "wiring material" and an example of a "heat dissipation target". From another perspective, the busbar 30 is an example of a "first cable member".

[0029] The bus bar 30 has, for example, a first connection part 31 and an extension part 33. The first connection part 31 is a part that is connected to a first connection target (for example, the electronic component 10) via a connection component 50. The first connection part 31 is, for example, a plate part along the X direction and the Y direction. The first connection part 31 has a mounting hole 31h into which a fastening member 43 is inserted from the Z direction (for example, from the -Z direction side). The mounting hole 31h, for example, does not have a thread groove. The mounting hole 31h is, for example, a through hole that penetrates the first connection part 31 in the Z direction. The extension part 33 extends horizontally from the first connection part 31. For example, the extension part 33 extends from the first connection part 31 toward the +X direction side.

[0030] <A4. Connection Component> Next, the connection component 50 will be described. The connection component 50 is a wiring material that is disposed between the electronic component 10 and the bus bar 30 and connects the electronic component 10 and the bus bar 30. The connection component 50 forms an energization path between the electronic component 10 and the bus bar 30. The connection component 50 may be referred to as a "bus bar". The connection component 50 is made of metal (for example, made of copper, copper alloy, aluminum, or aluminum alloy). The connection component 50 is an example of a "second wiring material" and an example of a "metal member". In the present disclosure, the "metal member" broadly means a member whose main part is made of metal, and also includes components that partially contain materials other than metal.

[0031] In the present embodiment, the first connection part 31 of the bus bar 30 is located below the terminal 13 of the electronic component 10. The connection component 50 is a member that forms a vertical energization path. The length L50A of the connection component 50 in the longitudinal direction (for example, the X direction) of the electronic component 10 is smaller than the length L10 in the longitudinal direction of the electronic component 10 (see FIG. 1). Also, the length L50A of the connection component 50 in the X direction is smaller than the length L50B of the connection component 50 in the Z direction. The connection component 50 has, for example, a first part 51 and a second part 52.

[0032] (First Part) The first portion 51 of the connecting component 50 is the portion that connects to the terminal 13 of the electronic component 10. The first portion 51 is plate-shaped or rectangular parallelepiped along the Y and Z directions. The first portion 51 extends in the Z direction along one end of the electronic component 10 (for example, the end in the X direction). The first portion 51 is an upright portion that stands upright in the Z direction relative to the busbar 30. The first portion 51 faces the electronic component 10 in the X direction and connects to the electronic component 10 from the X direction.

[0033] The first portion 51 of the connecting component 50 has a first mounting hole 51h into which a fastening member 41, passed through a washer 42, is inserted. The first mounting hole 51h opens in the X direction. The first mounting hole 51h is, for example, a through hole that penetrates the first portion 51 in the X direction. The inner circumferential surface of the mounting hole 51h does not have screw threads. The fastening member 41 passed through the first mounting hole 51h of the connecting component 50 engages with the mounting hole 13h of the terminal 13 of the electronic component 10. This engagement physically and electrically connects the first portion 51 of the connecting component 50 to the terminal 13 of the electronic component 10.

[0034] (Second part) The second portion 52 of the connecting component 50 is the portion that connects to the first connecting portion 31 of the busbar 30. The second portion 52 protrudes horizontally (for example, in the X direction) from the -Z direction end of the first portion 51. The second portion 52 is a plate portion that is aligned with the X and Y directions. The second portion 52 faces the first connecting portion 31 of the busbar 30 in the Z direction and connects to the first connecting portion 31 of the busbar 30 from the Z direction.

[0035] The second portion 52 of the connecting component 50 has a second mounting hole 52h into which a fastening member 43 (e.g., a screw or bolt) is inserted. The second mounting hole 52h opens in the Z direction. The second mounting hole 52h is, for example, a through hole that penetrates the second portion 52 in the Z direction. The inner circumferential surface of the mounting hole 52h does not have screw grooves. The fastening member 43 inserted into the second mounting hole 52h of the second portion 52 is inserted into the mounting hole 31h of the busbar 30. The tip of the fastening member 43 that has passed through the mounting hole 31h of the busbar 30 and the second mounting hole 52h of the connecting component 50 is passed through a washer 45 and engaged with an engaging member 44 (e.g., a nut). This engagement physically and electrically connects the second portion 52 of the connecting component 50 to the busbar 30. In this embodiment, the first portion 51 and the second portion 52 form an L-shaped single piece connecting component 50.

[0036] (Examples of connecting parts shapes) In this embodiment, the thickness of at least a portion of the connecting component 50 is greater than the plate thickness T31 in the Z direction of the first connecting portion 31 of the busbar 30. For example, the thickness T51 in the X direction of at least a portion of the connecting component 50 is greater than the plate thickness T31 of the busbar 30. In this embodiment, the thickness T51 in the X direction of the first portion 51 of the connecting component 50 is greater than the plate thickness T31 of the busbar 30 across the entire width of the first portion 51 in the Z direction.

[0037] In this embodiment, the thickness T51 of the first portion 51 of the connecting component 50 in the X direction is greater than the thickness T52 of the second portion 52 of the connecting component 50 in the Z direction. In this embodiment, the thickness T51 of the first portion 51 of the connecting component 50 in the X direction is greater than the thickness T52 of the second portion 52 across the entire width of the first portion 51 in the Z direction.

[0038] Next, the arrangement of the multiple connecting components 50 will be described. As shown in Figure 2, the electrical connection unit 1 has multiple connection components 50, including a first connection component 50A and a second connection component 50B. In the following, when the first connection component 50A and the second connection component 50B are not distinguished, they will simply be referred to as "connection component 50".

[0039] The first part 51 of the first connection component 50A is adjacent to the terminal 13A of the electronic component 10 in the X direction. The first part 51 of the first connection component 50A is fixed to the terminal 13A of the electronic component 10 by a fastening member 41 (fastening member 41A) inserted into the mounting hole 51h of the first part 51 of the first connection component 50A.

[0040] The first part 51 of the second connection component 50B is adjacent to the terminal 13B of the electronic component 10 in the X direction. The first part 51 of the second connection component 50B is fixed to the terminal 13B of the electronic component 10 by a fastening member 41 (fastening member 41B) inserted into the mounting hole 51h of the first part 51 of the second connection component 50B.

[0041] <A5. Heat dissipation structure> Next, the heat dissipation structure HS will be described. The heat dissipation structure HS is a heat dissipation structure provided in the electrical connection unit 1. For example, the heat dissipation structure HS dissipates at least a part of the heat generated by the electronic component 10 or the bus bar 30. The heat dissipation structure HS includes, for example, the above-described connection component 50 and a heat pipe 60.

[0042] FIG. 3 is a diagram showing the heat dissipation structure HS. At least a part of the heat pipe 60 is embedded in the connection component 50. For example, at least a part of the heat pipe 60 is embedded in the first part 51 of the connection component 50. In the present embodiment, the heat pipe 60 is embedded in the connection component 50 over the entire length of the heat pipe 60. Note that in the present disclosure, "embedded" is not limited to the case where the heat pipe 60 is buried inside the connection component 50 and the heat pipe 60 is not exposed outside. "Embedded" in the present disclosure may include cases where the heat pipe 60 is arranged in a depression provided on the surface of the connection component 5 so as to fill at least a part of the depression.

[0043] ] Figure 4 is a cross-sectional view of the heat dissipation structure HS shown in Figure 3 along the line F4-F4. The heat pipe 60 includes, for example, a container 60c, a wick 60k, and a working fluid 60w. The container 60c is an outer shell member that forms the outer shape of the heat pipe 60. In this embodiment, the container 60c is formed by a metal pipe 60p. The wick 60k is a capillary structure provided inside the container 60c. In this embodiment, the wick 60k is formed by a plurality of fine protrusions 60t provided on the inner surface of the container 60c. However, the wick 60k is not limited to the above example and may be formed by mesh, wire, sintered powder, etc. The working fluid 60w is a fluid that undergoes repeated evaporation and condensation inside the container 60c. The working fluid 60w is, but is not limited to, water, ethanol, or acetone.

[0044] Returning to Figure 3, let's continue the explanation of the heat pipe 60. The heat pipe 60 transfers heat from one part (heat receiving part) to another part (heat dissipation part) by evaporation and condensation of the working fluid 60w. The heat pipe 60 is an example of a "heat pipe structure". In this disclosure, the term "heat pipe structure" is not limited to a structure having a pipe 60p. In this disclosure, "heat pipe structure" broadly refers to a structure that transfers heat by evaporation and condensation of a working fluid. For example, a structure in which working fluid is sealed in a space formed between two metal members instead of a pipe 60p is also an example of a "heat pipe structure".

[0045] In this embodiment, the first portion 51 of the connecting component 50 has a first end 51e1, a second end 51e2, and an intermediate portion 51c. The first end 51e1 is the -Z direction end of the first portion 51. The first end 51e1 is connected to the second portion 52. The second end 51e2 is the +Z direction end of the first portion 51. The intermediate portion 51c is located in the Z direction between the first end 51e1 and the second end 51e2. The intermediate portion 51c has a mounting hole 51h into which the fastening member 41 is inserted.

[0046] In this embodiment, the heat pipe 60 is linear along the Z direction. The heat pipe 60 has, for example, a first heat dissipation section R1, a second heat dissipation section R2, and a heat receiving section J. However, the heat pipe 60 may have only one of the first heat dissipation section R1 and the second heat dissipation section R2.

[0047] The first heat dissipation section R1 is provided at one end (for example, the lower end) of the heat pipe 60. The first heat dissipation section R1 is located at the first end 51e1 of the first portion 51 of the connecting component 50. In other words, one end of the heat pipe 60 (the first heat dissipation section R1) is embedded in the first end 51e1 of the first portion 51 of the connecting component 50.

[0048] The second heat dissipation section R2 is provided at the other end (for example, the upper end) of the heat pipe 60. The second heat dissipation section R2 is located at the second end 51e2 of the first portion 51 of the connecting component 50. In other words, the other end of the heat pipe 60 (the second heat dissipation section R2) is embedded in the second end 51e2 of the first portion 51 of the connecting component 50.

[0049] The heat receiving section J is provided between the first heat dissipation section R1 and the second heat dissipation section R2 of the heat pipe 60. The heat receiving section J is provided, for example, in the intermediate section 51c of the connecting component 50.

[0050] The heat receiving section J absorbs heat from the intermediate section 51c of the connecting component 50. The heat pipe 60 transfers a portion of the heat absorbed by the heat receiving section J from the intermediate section 51c of the connecting component 50 to the first heat dissipation section R1, and releases the transferred heat from the first heat dissipation section R1. In this embodiment, the heat pipe 60 releases the heat transferred to the first heat dissipation section R1 to the first end section 51e1 of the connecting component 50. Similarly, the heat pipe 60 transfers a portion of the heat absorbed by the heat receiving section J from the intermediate section 51c of the connecting component 50 to the second heat dissipation section R2, and releases the transferred heat from the second heat dissipation section R2. In this embodiment, the heat pipe 60 releases the heat transferred to the second heat dissipation section R2 to the second end section 51e2 of the connecting component 50.

[0051] FIG. 5 is a diagram showing the heat dissipation structure HS disassembled. In the present embodiment, the first portion 51 of the connecting component 50 has a hole 55. The hole 55 extends in the Z direction. The hole 55, for example, extends across the first end portion 51e1 and the second end portion 51e2 of the first portion 51 of the connecting component 50. In the present embodiment, the heat pipe 60 is embedded in the connecting component 50 by being inserted into the hole 55. For example, a brazing material may be supplied to the hole 55 into which the heat pipe 60 is inserted to fill the gap between the heat pipe 60 and the inner surface of the hole 55.

[0052] <A6. Heat transfer member> Next, returning to FIG. 1, the heat transfer member 70 will be described. The heat transfer member 70 is a member for transferring the heat of the heat dissipation structure HS to the first heat dissipation member 7 or the second heat dissipation member 8. The heat transfer member 70 is, for example, a heat transfer sheet having elasticity (for example, a thermally conductive silicone sheet). The heat transfer member 70 is formed of a material having a higher thermal conductivity than, for example, the housing 5 or the base member 6. However, the heat transfer member 70 is not limited to the above example, and may be a heat transfer member formed of a thermally conductive gel or other materials. In the present embodiment, two heat transfer members 70 (heat transfer members 70A, 70B) are provided as the heat transfer member 70.

[0053] The heat transfer member 70A is disposed between the connecting component 50 and the first wall portion 5a of the housing 5. In other words, the heat transfer member 70A is disposed between the connecting component 50 and the first heat dissipation member 7. The first end portion 51e1 of the first portion 51 of the connecting component 50 faces the heat transfer member 70A in the Z direction. The first end portion 51e1 of the first portion 51 of the connecting component 50 is thermally connected to the first heat dissipation member 7 through the heat transfer member 70A. The heat transfer member 70A transfers the heat carried to the first end portion 51e1 of the first portion 51 of the connecting component 50 by the heat pipe 60 from the connecting component 50 to the first heat dissipation member 7. In the present embodiment, the heat transfer member 70A is in contact with the first end portion 51e1 of the first portion 51 of the connecting component 50.

[0054] The heat transfer member 70B is disposed between the connection component 50 and the second wall portion 5b of the housing 5. In other words, the heat transfer member 70B is disposed between the connection component 50 and the second heat radiation member 8. The second end portion 51e2 of the first portion 51 of the connection component 50 faces the heat transfer member 70B in the Z direction. The second end portion 51e2 of the first portion 51 of the connection component 50 is thermally connected to the second heat radiation member 8 via the heat transfer member 70B. The heat transfer member 70B transfers the heat carried to the second end portion 51e2 of the first portion 51 of the connection component 50 by the heat pipe 60 from the connection component 50 to the second heat radiation member 8. In the present embodiment, the heat transfer member 70B is in contact with the second end portion 51e2 of the first portion 51 of the connection component 50.

[0055] <A7. Advantages> The electrical connection unit of the present embodiment includes a heat dissipation target (e.g., the electronic component 10 or the bus bar 30), a metal member (e.g., the connection component 50) connected to the heat dissipation target, and a heat pipe structure (e.g., the heat pipe 60) at least partially embedded in the metal member. According to such a configuration, since the heat pipe structure is provided, it is easier to further diffuse the heat transferred from the heat dissipation target to the metal member by the heat pipe structure. With this configuration, the heat dissipation performance of the electrical connection unit can be improved.

[0056] Here, in the present embodiment, at least a part of the heat pipe structure is embedded in the metal member. According to such a configuration, the contact area (heat transfer area) between the metal member and the heat pipe structure can be increased as compared with the case where the heat pipe contacts the flat surface of the metal member. With this configuration, the heat dissipation performance of the electrical connection unit can be further improved. Further, according to the structure in which at least a part of the heat pipe structure is embedded in the metal member, it is easier to reduce the size of the heat dissipation structure as compared with the case where the heat pipe contacts the flat surface of the metal member. With this configuration, it is easier to reduce the size of the electrical connection unit.

[0057] In this embodiment, the heat dissipation target is an electronic component or a wiring material. The metal member is a wiring material electrically connected to the heat dissipation target. According to such a configuration, the heat dissipation performance of the electrical connection unit can be improved by a structure in which at least a part of the heat pipe structure is embedded in the wiring material. According to this configuration, compared with a structure in which the heat pipe structure is embedded in a metal member separate from the wiring material, it is easier to reduce the number of components, and it is easier to further miniaturize and reduce the cost of the electrical connection unit.

[0058] In this embodiment, the metal member has a hole (for example, hole 55). The heat pipe structure is attached to the hole. According to such a configuration, the contact area (heat transfer area) between the metal member and the heat pipe structure can be further increased. With this configuration, the heat dissipation performance of the electrical connection unit can be further improved.

[0059] <A8. Modified Example> Next, some modified examples of the first embodiment will be described. The configuration other than those described below in each modified example is the same as the configuration of the first embodiment described above.

[0060] <A8.1 First Modified Example> FIG. 6 is a diagram showing a heat dissipation structure HS of the first modified example. In this modified example, the first portion 51 of the connecting component 50 has a groove 56 instead of the hole 55. The groove 56 extends in the Z direction. The groove 56 extends, for example, between the first end 51e1 and the second end 51e2 of the first portion 51 of the connecting component 50. The groove 56 is, for example, an arc shape along the outer shape of the heat pipe 60. In this modified example, the heat pipe 60 is arranged along the groove 56 and fills at least a part of the inside of the groove 56. At least a part of the heat pipe 60 is arranged inside the groove 56. The gap between the heat pipe 60 and the inner surface of the groove 56 may be filled, for example, by supplying a brazing material.

[0061] Even with such a configuration, the contact area (heat transfer area) between the metal member and the heat pipe structure can be increased as compared with the case where the heat pipe contacts the flat surface of the metal member. With this configuration, further improvement in the heat dissipation performance of the electrical connection unit can be achieved. Further, according to the structure in which at least a part of the heat pipe structure is embedded in the metal member, it becomes easier to reduce the size of the heat dissipation structure as compared with the case where the heat pipe contacts the flat surface of the metal member. With this configuration, it becomes easier to reduce the size of the electrical connection unit.

[0062] <A8.2 Second Modified Example> FIG. 7 is a diagram showing the heat dissipation structure HS of the second modified example. In this modified example, the heat pipe 60 does not extend across the first end 51e1 and the second end 51e2 of the first portion 51 of the connection component 50. For example, the heat pipe 60 extends across the first end 51e1 and the intermediate portion 51c of the first portion 51 of the connection component 50. Alternatively, the heat pipe 60 may extend across the second end 51e2 and the intermediate portion 51c of the first portion 51 of the connection component 50.

[0063] Even with such a configuration, since the heat pipe structure is provided, the heat transferred from the heat dissipation target to the metal member can be more easily diffused by the heat pipe structure. With this configuration, improvement in the heat dissipation performance of the electrical connection unit can be achieved.

[0064] <A8.3 Third Modified Example> FIG. 8 is a diagram showing the heat dissipation structure HS of the third modified example. In this modified example, in the first connection component 50A, the mounting hole 51h is disposed offset to the +Y direction side with respect to the center in the Y direction of the first portion 51. On the other hand, in the second connection component 50B, the mounting hole 51h is disposed offset to the -Y direction side with respect to the center in the Y direction of the first portion 51.

[0065] In this modified example, the heat pipe 60 is formed in a U shape. The heat pipe 60 has, for example, a first portion 61, a second portion 62, and a third portion 63.

[0066] The first part 61 includes a first heat dissipation part R1. The first part 61 is located at the first end 51e1 of the first part 51 of the connection component 50. The first part 61 linearly extends in the Y direction at the first end 51e1.

[0067] The second part 62 includes a second heat dissipation part R2. The second part 62 is located at the second end 51e2 of the first part 51 of the connection component 50. The second part 62 linearly extends in the Y direction at the second end 51e2.

[0068] The third part 63 includes a heat receiving part J. The third part 63 extends in the Z direction of the first part 51 of the connection component 50 and connects the first part 61 and the second part 62 of the heat pipe 60. The third part 63 is disposed offset to the opposite side of the mounting hole 51h in the Y direction. For example, in the first connection component 50A, the third part 63 is disposed offset to the -Y direction side with respect to the central part in the Y direction of the first part 51. On the other hand, the third part 63 is disposed offset to the +Y direction side with respect to the central part in the Y direction of the first part 51.

[0069] According to such a configuration, compared with the first embodiment, the length of the heat pipe 60 disposed at the first end 51e1 or the second end 51e2 of the connection component 50 becomes larger. With this configuration, it becomes easier to transfer heat to the first end 51e1 or the second end 51e2 of the connection component 50. With this configuration, further improvement in the heat dissipation performance of the electrical connection unit can be achieved.

[0070] <A8.4 Fourth Modified Example> FIG. 9 is a cross-sectional view showing the electrical connection unit 1 of the fourth modified example. In this modified example, a part of the heat pipe 60 protrudes outside the connection component 50.

[0071] For example, a portion of the third portion 63 of the heat pipe 60 is embedded in the first portion 51 of the connecting component 50. Another portion of the third portion 63 of the heat pipe 60 extends below the connecting component 50. The first portion 61 of the heat pipe 60 is positioned below the connecting component 50 and is supported by the third portion 63 of the heat pipe 60. The first portion 61 of the heat pipe 60 extends horizontally (for example, in the X direction) below the connecting component 50. In this embodiment, the first portion 61 of the heat pipe 60 (first heat dissipation portion R1) is in contact with the heat transfer member 70A below the connecting component 50. The first portion 61 of the heat pipe 60 (first heat dissipation portion R1) is thermally connected to the first heat dissipation member 7 via the heat transfer member 70A.

[0072] Another portion of the third portion 63 of the heat pipe 60 extends above the connector 50. The second portion 62 of the heat pipe 60 is positioned above the connector 50 and is supported by the third portion 63 of the heat pipe 60. The second portion 62 of the heat pipe 60 extends horizontally (e.g., in the X direction) above the connector 50. In this embodiment, the second portion 62 of the heat pipe 60 (second heat dissipation portion R2) is in contact with the heat transfer member 70B above the connector 50. The second portion 62 of the heat pipe 60 (second heat dissipation portion R2) is thermally connected to the second heat dissipation member 8 via the heat transfer member 70B.

[0073] With this configuration, heat can be transferred by the heat pipe 60 to the vicinity of the first heat dissipation member 7 or the second heat dissipation member 8, overcoming the size constraints of the connecting component 50. This configuration further improves the heat dissipation performance of the electrical connection unit.

[0074] (Second Embodiment) Next, a second embodiment will be described. The second embodiment differs from the first embodiment in that the heat pipe structure is provided between two metal members. Other than what is described below, the configuration is the same as that of the first embodiment.

[0075] Figure 10 is a cross-sectional view showing an electrical connection unit 1 of a second embodiment. In this embodiment, the electrical connection unit 1 has a connection component 50' instead of a connection component 50. The connection component 50' is a wiring member that connects the electronic component 10 and the busbar 30. The connection component 50' is an example of a "second wiring member". The connection component 50' includes, for example, a first metal member 80 and a second metal member 90. The first metal member 80 and the second metal member 90 are bonded together to form a single unit.

[0076] (First metal component) The first metal member 80 is, for example, a single metal plate. The first metal member 80 has a first portion 81, a second portion 82, and a bent portion 83, which are formed by bending a single metal plate.

[0077] The first portion 81 is the portion connected to the electronic component 10. The first portion 81 is a plate portion that is aligned along the Y and Z directions. The first portion 81 is an upright portion that is upright in the Z direction relative to the bus bar 30. The first portion 81 faces the electronic component 10 in the X direction. The first portion 81 has a first mounting hole 81h into which the fastening member 41 is inserted. The first mounting hole 81h is a through hole that penetrates the first portion 81 in the X direction.

[0078] The second portion 82 is the portion that connects to the bus bar 30. The second portion 82 is a plate portion that runs along the X and Y directions. The second portion 82 faces the first connection portion 31 of the bus bar 30 in the Z direction. The second portion 82 has a second mounting hole 82h into which the fastening member 43 is inserted. The second mounting hole 82h is a through hole that penetrates the second portion 82 in the Z direction.

[0079] The bent portion 83 is located between the first portion 81 and the second portion 82. The bent portion 83 connects the first portion 81 and the second portion 82. The bent portion 83 is, for example, arc-shaped.

[0080] (Second metal component) The second metal member 90 is, for example, a single metal plate. The second metal member 90 has a first portion 91, a second portion 92, and a bent portion 93, formed by bending a single metal plate. The second metal member 90 is bonded to another metal member 90, for example, by a brazing material MR (see Figure 12).

[0081] The first portion 91 is the portion connected to the electronic component 10. The first portion 91 is located on the opposite side of the first portion 81 of the first metal member 80 from the electronic component 10. The first portion 91 is a plate portion that runs along the Y and Z directions. The first portion 91 runs along the first portion 81 of the first metal member 80. The first portion 91 is an upright portion that stands upright in the Z direction relative to the busbar 30. The first portion 91 faces the electronic component 10 in the X direction. The first portion 91 has a first mounting hole 91h into which a fastening member 41 is inserted. The first mounting hole 91h is a through hole that penetrates the first portion 91 in the X direction. The fastening member 41, which is passed through the first mounting hole 91h of the second metal member 90 and the first mounting hole 81h of the first metal member 80, engages with the terminal 13 of the electronic component 10, thereby physically and electrically connecting the first metal member 80 and the second metal member 90 to the electronic component 10. In this embodiment, the first portion 51 of the connecting component 50' is formed by the first portion 81 of the first metal member 80 and the first portion 91 of the second metal member 90.

[0082] The second portion 92 is the portion that connects to the bus bar 30. The second portion 82 is a plate portion that runs along the X and Y directions. The second portion 92 is located on the opposite side of the first connection portion 31 of the bus bar 30 from the second portion 82 of the first metal member 80. The second portion 92 runs along the second portion 82 of the first metal member 80. The second portion 92 faces the first connection portion 31 of the bus bar 30 in the Z direction. The second portion 92 has a second mounting hole 92h into which a fastening member 43 is inserted. The second mounting hole 92h is a through hole that penetrates the second portion 92 in the Z direction. The first metal member 80 and the second metal member 90 are physically and electrically connected to the first connection portion 31 of the bus bar 30 by the engagement of the engaging member 44 with the tip of the fastening member 43 that is passed through the second mounting hole 82h of the first metal member 80 and the second mounting hole 92h of the second metal member 90. In this embodiment, the second portion 52 of the connecting component 50' is formed by the second portion 82 of the first metal member 80 and the second portion 92 of the second metal member 90.

[0083] The bent portion 93 is located between the first portion 91 and the second portion 92. The bent portion 93 connects the first portion 91 and the second portion 92. The bent portion 93 is, for example, arc-shaped. The radius of curvature of the bent portion 93 of the second metal member 90 is smaller than that of the bent portion 83 of the first metal member 80.

[0084] (Relationship between the first metal member and the second metal member) Figure 11 is a perspective view showing a heat dissipation structure HS of a second embodiment. In this embodiment, the first metal member 80 has a first surface S1 facing the second metal member 90. The first surface S1 is provided, for example, across a first portion 81 and a second portion 82. On the other hand, the second metal member 90 has a second surface S2 facing the first surface S1 of the first metal member 80. The second surface S2 is provided, for example, across a first portion 91 and a second portion 92.

[0085] (Heat pipe structure) In this embodiment, a heat pipe structure 100 is provided at the boundary between the first metal member 80 and the second metal member 90. The heat pipe structure 100 does not have a metal pipe 60p. At least a portion of the heat pipe structure 100 is defined by a groove 80g provided on the first surface S1 of the first metal member 80 and a groove 90g provided on the second surface S2 of the second metal member 90 (see Figure 12). The heat pipe structure 100 is provided at a position away from the first mounting holes 81h, 91h and the second mounting holes 82h, 92h.

[0086] Figure 12 is a cross-sectional view of the heat dissipation structure HS shown in Figure 11 along the line F12-F12. The first surface S1 of the first metal member 80 has a groove 80g recessed in the direction away from the second metal member 90 (-X direction). The groove 80g extends in the Z direction. The inner surface 80i of the groove 80g has a plurality of fine protrusions 80t for forming, for example, the wick 60k of the heat pipe structure 100. As mentioned above, the wick 60k is not limited to the above example and may be formed from mesh, wire, sintered powder, etc. The groove 80g is provided, for example, across the first part 81 and the second part 82 of the first metal member 80.

[0087] The second surface S2 of the second metal member 90 has a groove 90g recessed in the direction away from the first metal member 80 (towards the +X direction). The groove 90g extends in the Z direction. The inner surface 90i of the groove 90g has a plurality of fine protrusions 90t for forming, for example, the wick 60k of the heat pipe structure 100. The groove 90g is provided, for example, across the first portion 91 and the second portion 92 of the second metal member 90.

[0088] In this embodiment, the heat pipe structure 100 is defined between a groove 80g provided on the first surface S1 and a groove 90g provided on the second surface S2. In other words, the first metal member 80 and the second metal member 90 function as the container 60c of the heat pipe structure 100. Working fluid is sealed in the space between the grooves 80g and 90g, and this space becomes the fluid's movement space. That is, in this embodiment, the connecting component 50' itself functions as the heat pipe. In this embodiment, the area outside the grooves 80g and 90g within the gap between the first surface S1 and the second surface S2 is sealed with brazing material MR.

[0089] The heat pipe structure 100, like the heat pipe 60 of the first embodiment, has a first heat dissipation section R1, a second heat dissipation section R2, and a heat receiving section J. In this embodiment, the first heat dissipation section R1 is provided on the second portion 52 of the connecting component 50'. That is, the first heat dissipation section R1 is provided between the second portion 82 of the first metal member 80 and the second portion 92 of the second metal member 90. The first heat dissipation section R1 is thermally connected to the first heat dissipation member 7 via the heat transfer member 70A.

[0090] On the other hand, the second heat dissipation section R2 is provided on the first portion 51 of the connecting component 50'. That is, the second heat dissipation section R2 is provided between the first portion 81 of the first metal member 80 and the first portion 91 of the second metal member 90. The second heat dissipation section R2 is thermally connected to the second heat dissipation member 8 via the heat transfer member 70B.

[0091] With this configuration, heat can be dissipated by the heat pipe structure provided between the first and second metal members. This configuration further improves the heat dissipation performance of the electrical connection unit.

[0092] In this embodiment, the first heat dissipation section R1 of the heat pipe structure 100 is provided on the second portion 52 of the connecting component 50'. With this configuration, it is easy to secure a large heat transfer area between the first heat dissipation section R1 of the heat pipe structure 100 and the heat transfer member 70A. This configuration makes it possible to further improve the heat dissipation performance of the electrical connection unit.

[0093] (modified version) Next, a modified version of the second embodiment will be described. In the modified version, the configuration is the same as that of the second embodiment described above, except for the configuration described below.

[0094] Figure 13 shows a modified electrical connection unit 1. Figure 14 is a perspective view showing a modified heat dissipation structure HS. In this modified example, the second metal member 90 has only the first portion 91. The heat pipe structure 100 is formed between the first portion 81 of the first metal member 80 and the first portion 91 of the second metal member 90.

[0095] Even with this configuration, heat can be dissipated by the heat pipe structure provided between the first and second metal members. This configuration allows for further improvement of the heat dissipation performance of the electrical connection unit.

[0096] In the second embodiment described above, an example was described in which the first metal member 80 and the second metal member 90 are stacked in the X direction. However, the heat pipe structure 100 may be provided between a plurality of metal members bonded in the Y direction, or between a plurality of metal members bonded in the Z direction.

[0097] (Third embodiment) Next, a third embodiment will be described. The third embodiment differs from the first embodiment in that a heat pipe structure is provided on a heat storage metal block instead of a wiring material. Other than what is described below, the configuration is the same as that of the first embodiment.

[0098] Figure 15 shows an electrical connection unit 1 of the third embodiment. In this embodiment, the two terminals 13 of the electronic component 10 are separated and arranged at both ends of the electronic component 10 in the X direction. The terminals 13 have mounting holes 13h. The mounting holes 13h are through holes that penetrate the terminals 13 in the Z direction. The inner circumferential surface of the mounting holes 13h does not have, for example, screw grooves. The first connection portion 31 of the busbar 30 is in contact with the terminals 13.

[0099] In this embodiment, the electrical connection unit 1 has a heat storage member 110. The heat storage member 110 is a metal member (e.g., a metal block) for heat storage. The heat storage member 110 is positioned, for example, on the opposite side of the busbar 30 from the terminal 13 of the electronic component 10. The heat storage member 110 is made of metal (e.g., copper, copper alloy, aluminum, or aluminum alloy). The heat storage member 110 is an example of a "metal member". Alternatively, the heat storage member 110 may be provided between the terminal 13 of the electronic component 10 and the first connection portion 31 of the busbar 30. Alternatively, the heat storage member 110 may be provided on the opposite side of the first connection portion 31 of the busbar 30 from the terminal 13 of the electronic component 10.

[0100] In this embodiment, the heat storage member 110 includes, for example, a metal block 111 and a hole 112. The metal block 111 is a metal part having a rectangular parallelepiped shape. The hole 112 is provided in the metal block 111. The hole 112 is a cylindrical hole extending in the Z direction. The hole 112 opens in the +Z direction. The diameter of the hole 112 is larger than that of the engaging member 44 and the washer 45. With the provision of the hole 112, the metal block 111 has a bottom portion 111a and a peripheral wall portion 111b.

[0101] The bottom portion 111a is a plate portion that runs horizontally. The bottom portion 111a faces the terminals 13 of the electronic component 10 in the Z direction. For example, the bottom portion 111a is placed on the terminals 13 of the electronic component 10 from the +Z direction side. The bottom portion 111a has mounting holes 110h that face the mounting holes 13h of the terminals 13 of the electronic component 10.

[0102] The inner circumferential surface of the mounting hole 110h does not have, for example, screw grooves. The mounting hole 110h is a through hole that penetrates the bottom portion 141a in the Z direction. However, the mounting hole 110h may also be a hole into which the fastening member 41 engages. Alternatively, the mounting hole 110h may be a bottomed hole that opens in the -Z direction. The peripheral wall portion 111b rises from the bottom portion 111a in the +Z direction. The peripheral wall portion 111b surrounds the periphery of the hole 112.

[0103] In this embodiment, the fastening member 41 is inserted into the mounting holes 31h, 13h, and 110h of the bus bar 30, the electronic component 10, and the heat storage member 110, with these mounting holes overlapping in the Z direction. A washer 45 is passed over the tip of the fastening member 41 that has passed through the mounting holes 31h, 13h, and 110h, and the engaging member 44 engages with it. With this configuration, the first connection portion 31 of the bus bar 30, the terminal 13 of the electronic component 10, and the heat storage member 110 are fixed together. With this configuration, the heat storage member 110 is connected to the bus bar 30 and the electronic component 10.

[0104] In this embodiment, at least a portion of the heat pipe 60 is embedded in the heat storage member 110. For example, the heat pipe 60 is embedded in the heat storage member 110 along its entire length.

[0105] In this embodiment, the heat storage member 110 has a first end 110e1 and a second end 110e2. The first end 110e1 is the end of the heat storage member 110 on the -Z direction side. The second end 110e2 is the end of the heat storage member 110 on the +Z direction side.

[0106] In this embodiment, the heat pipe 60 is linear along the Z direction. The heat pipe 60 has, for example, a heat dissipation section R and a heat receiving section J. The heat receiving section J is provided at one end of the heat pipe 60 (for example, the lower end). The heat receiving section J is located at the first end 110e1 of the heat storage member 110. In other words, one end of the heat pipe 60 (heat receiving section J) is embedded in the first end 110e1 of the heat storage member 110. On the other hand, the heat dissipation section R is provided at the other end of the heat pipe 60 (for example, the upper end). The heat dissipation section R is located at the second end 110e2 of the heat storage member 110. In other words, one end of the heat pipe 60 (heat dissipation section R) is embedded in the second end 110e2 of the heat storage member 110.

[0107] In this embodiment, the first end 110e1 of the heat storage member 110 is in contact with the terminal 13 of the electronic component 10. The second end 110e2 of the heat storage member 110 faces the heat transfer member 70B in the Z direction. The second end 110e2 of the heat storage member 110 is thermally connected to the second heat dissipation member 8 via the heat transfer member 70B. In this embodiment, the second end 110e2 of the heat storage member 110 is in contact with the heat transfer member 70B.

[0108] In this embodiment, the thickness of at least a portion of the metal block 111 is greater than the plate thickness T31 in the Z direction of the first connection portion 31 of the busbar 30. For example, the thickness T111 in the X direction of at least a portion of the metal block 111 is greater than the plate thickness T31 of the busbar 30. In this embodiment, the thickness T111 in the X direction of the metal block 111 is greater than the plate thickness T31 of the busbar 30 across the entire width of the metal block 111 in the Z direction. The metal block 111 is an example of the "first portion". In this embodiment, the heat pipe 60 is embedded in the metal block 111 by being attached to a hole 55 or groove 56 provided in the metal block 111.

[0109] With this configuration, the contact area (heat transfer area) between the heat storage member and the heat pipe structure can be increased compared to the case where the heat pipe is in contact with the flat surface of the heat storage member. This configuration improves the heat dissipation performance of the electrical connection unit. Furthermore, with a structure in which at least a portion of the heat pipe structure is embedded in the heat storage member, it becomes easier to miniaturize the heat dissipation structure compared to the case where the heat pipe is in contact with the flat surface of the heat storage member. This configuration makes it easier to miniaturize the electrical connection unit.

[0110] The configuration of the third embodiment is not limited to the above example. For example, a portion of the heat pipe 60 may protrude from the heat storage member 110, similar to the fourth modification of the first embodiment. For example, a portion of the heat pipe 60 may protrude above the heat storage member 110 and contact the heat transfer member 70B above the heat storage member 110. Furthermore, the structure of the third embodiment may have a heat pipe structure 100 similar to that of the second embodiment instead of the heat pipe 60.

[0111] Several embodiments and modifications have been described above. However, the embodiments and modifications are not limited to the examples described above. For example, the above-described embodiments or modifications may be implemented in combination with each other. For example, the configuration of each modification of the first embodiment may be implemented in combination with a structure having a heat pipe structure 100 according to the second embodiment or a modification of the second embodiment. Also, the configuration of each modification of the first embodiment may be implemented in combination with a structure having a heat storage member 110 according to the second embodiment. [Explanation of symbols]

[0112] 1…Electrical connection unit 10…Electronic components (for heat dissipation) 30... Busbar (for heat dissipation) 50,50'...Connecting parts (metal components) 60… Heat pipe (heat pipe structure) 80...First metal component 80g…Groove 90...Second metal component 90g…Groove 100…Heat pipe structure 110... Heat storage component (metal component) S1...Side 1 S2...Side 2

Claims

1. An in-vehicle electrical connection unit, The object to be heated, A metal member connected to the heat dissipation target, A heat pipe structure in which at least a portion is embedded in the metal member, An electrical connection unit equipped with [a specific feature].

2. The heat dissipation target is an electronic component or wiring material. The metal member is a wiring member electrically connected to the heat dissipation target. The electrical connection unit according to claim 1.

3. The aforementioned metal member has holes or grooves, The heat pipe structure is attached to the hole or groove. The electrical connection unit according to claim 1 or claim 2.

4. The aforementioned metal member is a second cable connecting the heat dissipation target and the first cable, The second cable member has a first portion that is thicker than the first cable member. The hole or groove is provided in the first portion. The electrical connection unit according to claim 3.

5. Heat dissipation component, A heat transfer member is disposed between the heat dissipation member and the metal member, Furthermore, The metal member has an end in which the end of the heat pipe structure is embedded, The end of the metal member is thermally connected to the heat dissipation member via the heat transfer member. The electrical connection unit according to claim 1 or claim 2.

6. The metal member includes a first metal member having a first surface and a second metal member having a second surface facing the first surface. At least a portion of the heat pipe structure is defined by grooves provided on the first surface and grooves provided on the second surface. The electrical connection unit according to claim 1 or claim 2.

7. A heat dissipation structure used in an in-vehicle electrical connection unit, A metal component connected to the heat dissipation target, A heat pipe structure in which at least a portion is embedded in the metal member, A heat dissipation structure equipped with [specific features / features].