TLVR inductor with heat dissipation structure and electronic module including the same

Abstract

The present invention provides an inductor having a heat dissipation structure and an electronic module including the same. [Solution] The inductor 1 includes a primary winding 3 and a secondary winding 4 that are electrically insulated from each other and are provided between magnetic EI cores (a first magnetic core 21 and a second magnetic core 22) in the stacking direction. The primary winding includes inverted U-shaped conductors arranged downwards, and the secondary winding includes U-shaped conductors arranged upwards. The extensions of the primary winding conductors 30, 31, 32, and 33, each defining a thermal path portion, are J-shaped so as to extend upwards and downwards. The J-shaped thermal path portion 30b allows heat to dissipate from the magnetic core upwards and downwards.

Description

Technical Field

[0001] The present invention relates to an inductor having a heat dissipation structure and an electronic module including the same.

Background Art

[0002] A TLVR inductor (Trans-Inductor Voltage Regulator inductor) is a dedicated coupled inductor that improves the performance of voltage regulators in high-current low-voltage applications such as server processors, AI accelerators, and data center power supplies. The TLVR inductor essentially functions as a 1:1 transformer having a primary winding and a secondary winding. These windings are magnetically coupled through a shared ferrite (magnetic) core for efficient energy transfer during transient states, but are electrically insulated (i.e., not directly or galvanically connected) to handle voltage differences without arc discharge or leakage current.

[0003] FIG. 10 shows a sub-module 10 including an inductor 3a and configured to be mounted on a power module as described in Patent Document 1. The substrate 6a of the sub-module 10 is molded with resin 28a so as to cover electronic components on the main surface of the substrate 6a. The resin 28a contains a heat sink 9a. The inductor 3a is disposed under the substrate 6a together with voltage input terminals 23a and 23b, ground terminals 22a and 22b, and other components (not shown).

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] The inventors of the present invention have recognized that in conventional inductors, insufficient thermal coupling of the inductor prevents heat from being released. Therefore, there is a need to provide an inductor with improved heat dissipation. [Means for solving the problem]

[0006] An exemplary embodiment of the present invention provides an inductor having an improved heat dissipation structure and an electronic module including the same. An inductor according to an exemplary embodiment of the present invention comprises: a first magnetic core including a first main surface and a first inner surface; a second magnetic core including a second main surface and a second inner surface; a primary winding having a first conductor including a first conducting portion; and a secondary winding having a second conductor electrically insulated from the first conductor, wherein the second conductor includes a second conducting portion. The first magnetic core is provided on the second magnetic core in a stacking direction such that the first inner surface and the second inner surface face each other. The first conducting portion of the first conductor and the second conducting portion of the second conductor overlap each other in the stacking direction and are sandwiched between the first magnetic core and the second magnetic core. The first conductor includes a first thermal path portion on the first side surface of the first magnetic core and the first side surface of the second magnetic core. The first thermal path portion extends from the second main surface to the first main surface in the stacking direction.

[0007] The first thermal path portion may have a J-shape. The first conductor may include a first terminal portion on the second side of the second magnetic core opposite to the first side, and the first terminal portion may extend in the stacking direction to the second main surface. Each of the first thermal path portion and the first terminal portion may extend downward from the second main surface so as to provide a gap between the second main surface and the mounting surface of the second magnetic core. The second conductor may include terminal portions on each of the first and second sides of the first magnetic core, and each terminal portion may extend in the stacking direction to the first main surface so as to have a U-shape.

[0008] The primary winding may comprise a plurality of first conductors, each including a first thermal path portion having a J-shape, and the secondary winding may comprise a plurality of second conductors, each including terminal portions on a first side and a second side of a second magnetic core, each terminal portion extending in the lamination direction to a first main surface such that each of the plurality of second conductors has a U-shape. The second inner surface of the second magnetic core may be flat or substantially flat. The first magnetic core may include recesses in its first inner surface. The first conducting portion of the first conductor and the second conducting portion of the second conductor may be provided within the recesses. The thickness of the first conductor may be greater than the thickness of the second conductor.

[0009] A power supply module according to an exemplary embodiment of the present invention includes a first substrate, an inductor according to one of the exemplary embodiments of the present invention, and a second substrate mounted on the inductor. The first conductor of the inductor is connected to the first substrate and the second substrate.

[0010] An inductor according to an exemplary embodiment of the present invention comprises a magnetic core including a top surface, a bottom surface opposite to the top surface, a first side surface, a second side surface opposite to the first side surface, and a first hole extending between the first and second side surfaces. The inductor further comprises a first conductor including a first conductor portion extending through the first hole, a first terminal extending along the second side surface toward the bottom surface, a second terminal extending along the first side surface toward the top surface, and a first thermal path portion connected to the second terminal and extending between the top and bottom surfaces. The inductor further comprises a second conductor electrically insulated from the first conductor. The second conductor includes a second conductor portion extending through the first hole such that the first and second conductor portions face each other, a third terminal extending along the first side surface toward the top surface, and a fourth terminal extending along the second side surface toward the top surface.

[0011] The magnetic core may include a second hole extending between a first side and a second side. The inductor may further include a third conductor comprising a third conducting portion extending through the second hole, a fifth terminal extending along the first side toward the bottom, a sixth terminal extending along the second side toward the top, and a second thermal path portion connected to the sixth terminal and extending between the top and bottom. The inductor may further include a fourth conductor electrically insulated from the third conductor. The fourth conductor may include a fourth conducting portion extending through the first hole such that the third conducting portion and the fourth conducting portion face each other, a seventh terminal extending along the first side toward the top, and an eighth terminal extending along the second side toward the top.

[0012] The magnetic core may include a third hole and a fourth hole extending between a first side and a second side. The inductor may further include a fifth conductor, which includes a fifth conductor portion extending through the third hole, a ninth terminal extending along the second side toward the bottom, a tenth terminal extending along the first side toward the top, and a third thermal path portion connected to the tenth terminal and extending between the top and bottom. The inductor may further include a sixth conductor electrically insulated from the fifth conductor. The sixth conductor may include a sixth conductor portion extending through the third hole such that the fifth conductor portion and the sixth conductor portion face each other, an eleventh terminal extending along the first side toward the top, and a twelfth terminal extending along the second side toward the top.

[0013] The inductor may further include a seventh conductor comprising a seventh conducting portion extending through a fourth hole, a thirteenth terminal extending along a first side toward the bottom, a fourteenth terminal extending along a second side toward the top, and a fourth thermal path portion connected to the fourteenth terminal and extending between the top and bottom. The inductor may further include an eighth conductor electrically insulated from the seventh conductor. The eighth conductor may include an eighth conducting portion extending through a fourth hole such that the seventh conducting portion and the eighth conducting portion face each other, a fifteenth terminal extending along a first side toward the top, and a sixteenth terminal extending along a second side toward the top.

[0014] The thickness of the first conductor may be greater than that of the second conductor, the thickness of the third conductor may be greater than that of the fourth conductor, the thickness of the fifth conductor may be greater than that of the sixth conductor, and the thickness of the seventh conductor may be greater than that of the eighth conductor. A gap may be provided between the second main surface and the mounting surface. Each of the first, second, third, fourth, fifth, sixth, seventh, and eighth conductors may include a flat wire, the thickness of which is less than the width of which is which. The magnetic core may be an EI core.

[0015] An exemplary electronic module according to the present invention includes a first substrate, a second substrate, and an inductor according to one of the exemplary embodiments of the present invention, disposed between the first substrate and the second substrate.

[0016] The electronic module may further include electronic components on the first substrate below the inductor. The electronic module may further include an electrical connector which is connected between the first substrate and the second substrate and includes terminals that provide an electrical connection between the first substrate and the second substrate. The electronic module may further include an additional second substrate and an additional inductor which is located between the additional second substrate and the first substrate.

[0017] The above and other features, elements, steps, structures, characteristics, and advantages of the present invention will become more apparent from the following detailed description of exemplary embodiments of the present invention with reference to the accompanying drawings.

Brief Description of the Drawings

[0018] [Figure 1] An inductor according to an exemplary embodiment of the present invention is shown. [Figure 2] A disassembled view of the inductor shown in FIG. 1 according to an exemplary embodiment of the present invention is shown. [Figure 3] A disassembled view of the inductor is shown together with the inductor assembled as shown in FIG. 1. [Figure 4A] A side cross-sectional view of the inductor shown in FIG. 1 is shown. [Figure 4B] It is a disassembled view of the inductor showing a heat dissipation path. [Figure 5A] An electronic module according to an exemplary embodiment of the present invention is shown. [Figure 5B] An electronic module shown in FIG. 5A with the electrical connector omitted is shown. [Figure 5C] A disassembled view of the electronic module shown in FIG. 5A according to an exemplary embodiment of the present invention is shown. [Figure 6] The electronic module shown in FIG. 5A is shown together with a disassembled view of the electronic module shown in FIG. 5C and a disassembled view of the inductor shown in FIG. 2. [Figure 7] An electronic module according to another exemplary embodiment of the present invention is shown. [Figure 8] An equivalent circuit diagram for modeling a thermal resistance network of an inductor mounted between a top printed circuit board (PCB) and a bottom PCB is shown. [Figure 9] A cross-section of the inductor between the top PCB and the bottom PCB is shown. [Figure 10] A front view of a conventional sub-module including an inductor mounted on a power module is shown.

Modes for Carrying Out the Invention

[0019] Embodiments of the present invention will be described in more detail below. However, descriptions that are unnecessarily detailed may be omitted. For example, detailed descriptions of already well-known matters or redundant descriptions of substantially identical configurations may be omitted. This is to avoid lengthy descriptions and to facilitate understanding for those skilled in the art. The inventors provide the accompanying drawings and the following description so that those skilled in the art can fully understand this disclosure, and not to limit the subject matter described in the claims. In the following description, components having the same or similar function will be denoted by the same reference numerals.

[0020] The present invention relates to an inductor having improved thermal coupling and an electronic module including the same, which can be used, for example, in a computing data server such as an artificial intelligence (AI) server.

[0021] The following explanation describes the issues that need to be addressed regarding heat dissipation of the inductor, as shown in Figures 8 and 9. The inventors of this invention have recognized that in conventional inductors, such as the inductor shown in Figure 10, insufficient thermal coupling of the inductor prevents heat from being released.

[0022] Figure 8 shows a thermal resistance network model (similar to an equivalent circuit diagram). The model in Figure 8 shows how heat flows out from a power inductor (such as the inductor shown in Figure 9 or Figure 10) mounted between the top and bottom PCBs. Figure 9 shows a cross-section of the inductor mounted between the top and bottom PCBs.

[0023] Figure 9 shows a cross-section of an inductor, such as the inductor shown in Figure 10, mounted on a power supply module on a PCB, as shown in Figure 8. As shown in Figure 9, a power supply module 900, such as a module similar to the module shown in Figure 10, includes an inductor 10 mounted and connected between a top printed circuit board (PCB) 902 and a bottom PCB 903. The bottom PCB 903 is connected to the motherboard 908 via a bump 907. Power pin terminals 904 and signal connectors 905 are also connected between the top PCB 902 and the bottom PCB 903. A capacitor 906 is located below the inductor 10. An integrated circuit (IC) 90 is mounted on the top PCB 902. The enclosure 901 (chassis or case) functions as a heatsink for the IC 90.

[0024] Referring to Figures 8 and 9, heat from the inductor is dissipated mainly to the top and bottom through the inductor windings. Resin may be present between the inductor's magnetic core and the substrate (e.g., PCB), which also dissipates heat. In the diagram shown in Figure 8, the main heat dissipation paths are through R6, R7, R8, R9, R10, etc. The path through R12 is not effectively utilized.

[0025] Specifically, as shown in Figure 8, the heat sources inside the inductor include inductor core losses (heat generated in the magnetic core itself due to hysteresis / eddy currents) and inductor copper losses. The diagram in Figure 8 includes a ladder / network of thermal resistances (R6, R7, R8, R9, R10, R11, R12, etc.) similar to an electrical circuit diagram, but for heat flow instead of current. V1 and V4 represent the voltage sources at the bottom and top, respectively, and I4, I5, and I6 represent the current sources in the analog thermal model.

[0026] In Figure 8, the switching power supply (SPS) is an example of a power module and may be a DC-DC or AC-DC converter using high-frequency switching. A complete assembly of the switching power supply (SPS) may include ICs (e.g., MOSFET / GaN transistors), a controller IC, inductors, capacitors, a PCB, a heat sink, an enclosure, etc., as shown in Figure 9, for example. In Figure 8, "PS loss" represents the power stage loss, also known as "power supply loss," excluding the inductor. This is the heat generated primarily by the switching transistors (e.g., MOSFETs or GaN FETs) and, to a lesser extent, by the rectifiers, drivers, etc., of the switching power supply (SPS). In the thermal resistance diagram of Figure 8, "PS loss" is shown as a separate heat source injected into the SPS block (upper part of the model), distinct from the loss of the inductor itself. Inductor loss is shown as "copper loss" (i.e., I in the winding) in the lower left of the inductor block. 2 The inductor's thermal energy (PS) is divided into R loss and "core loss" (i.e., hysteresis + eddy current loss in the magnetic core), which is shown in the lower right of the inductor block. PS loss is heat coming from active switching devices that are physically located above the inductor, on the top PCB. In some layouts of server or power supply unit (PSU) designs, such as shown in Figure 9, MOSFETs, GaN FETs, or integrated circuits (ICs) are mounted on the top side of the PCB or on a daughterboard directly above the inductor, and therefore the heat from such MOSFETs or ICs flows into the same thermal network but through different paths (usually well coupled by the top heatsink).

[0027] While the heat (PS loss) of the MOSFET can dissipate relatively well to the top, some heat is trapped in the magnetic core of the inductor. Because the bottom of the core may be insulated by resin, and due to the high thermal resistance of R12, it is not possible to effectively utilize a low-temperature chassis (enclosure) or heat sink.

[0028] As shown in FIG. 9, the temperature label is usually metal and indicates X°C corresponding to an enclosure (chassis) that can be cooled passively or actively, and Y°C corresponding to the motherboard (main board) or the bottom side. The chassis (enclosure) is significantly colder (X < Y) than the substrate / inductor area. If the temperature difference is available, previous inductor designs such as the inductor shown in FIG. 10 do not utilize the available temperature difference because the heat in the magnetic core of the inductor is trapped and cannot reach the cold chassis efficiently.

[0029] As described above, referring to FIGS. 8 and 9, the heat from the inductor is mainly dissipated to the top and bottom through the inductor windings. There is resin between the magnetic core and the substrate, which also dissipates heat (through the secondary path R11). In FIG. 8, the main heat dissipation path is the path leading to the top surface through R6, R7, R8, R9, R10, etc. The path through R12 (and the secondary path R11) is not effectively used.

[0030] Hereinafter, the features of the embodiments of the present invention will be described. FIG. 1 shows an inductor 1 according to an embodiment of the present invention. FIG. 2 shows an exploded view of the inductor 1 shown in FIG. 1. As shown in FIGS. 1 and 2, the inductor 1 includes a magnetic core 20, a primary winding 3, and a secondary winding 4. As shown in FIGS. 1 and 2, the inductor 1 may be a TLVR inductor, and the magnetic core 20 may be an E-I core. As shown in FIGS. 1 and 2, the stacking direction Z, the width direction X, and the length direction Y are labeled. <000014 (should be probably, but keeping as is)

[0031] As shown in Figures 1 and 2, the magnetic core 20 includes a top surface (first main surface) 21A, a bottom surface (second main surface) 22A opposite to the top surface 21A, a first side surface 21C (22C), a second side surface 21D (22D) opposite to the first side surface 21C (22C) in the X direction, and a first hole 5a extending in the X direction between the first side surface 21C and the second side surface 21D. In this exemplary embodiment, the magnetic core 20 includes a first magnetic core 21 having a first main surface 21A and a first inner surface 21B, and a second magnetic core 22 having a second main surface 22A and a second inner surface 22B. The first magnetic core 21 is provided on top of the first magnetic core 22 in the stacking direction Z such that the first inner surface 21B and the second inner surface 22B face each other in the stacking direction Z. The stacking direction Z is orthogonal to or substantially orthogonal to the X and Y directions within manufacturing and / or measurement tolerances. The magnetic core 20 in Figures 1 and 2 includes an EI core, but other possible arrangements are also possible. For example, the magnetic core may be an EE core, or may be comprised of three or more sections. The primary winding 3 includes a first conductor 30. As shown in Figure 2, the first conductor 30 includes a first conductor portion 30a extending in a first direction corresponding to a direction parallel to or substantially parallel to the X direction within manufacturing and / or measurement tolerances. In this exemplary embodiment, the X direction corresponds to the width direction of the inductor 1. It is understood that the first direction does not necessarily have to be parallel to the X direction, but may be any direction in the XY plane. The first conductor 30 includes a first thermal path portion 30b on the first side surface 21C of the first magnetic core and the first side surface 22C of the second magnetic core 22. As shown in Figures 1 and 2, the first thermal path portion 30b extends from the second main surface 22A to the first main surface 21 in the stacking direction Z. In this exemplary embodiment, the first thermal path portion 30b has a J-shape, as shown in Figures 1 and 2. The first conductor 30 also includes a first terminal portion (first terminal) 30c on the second side surface 22D of the second magnetic core 22, opposite to the first side surface 22C. The first terminal portion 30c extends to the second main surface 22A in the stacking direction Z.

[0032] The secondary winding 4 includes a second conductor 40 that is electrically isolated from the first conductor 30. In this specification, the term “electrically isolated” means that there is no direct electrical connection (i.e., no galvanic connection). In a TLVR inductor, the windings are physically separate, isolated, and operate like a transformer, often having a 1:1 turns ratio. The primary and secondary windings of a TLVR inductor are electrically isolated from each other, meaning there is no direct electrical (galvanic) connection between them. However, the primary and secondary windings are magnetically coupled, similar to a transformer. As shown in Figure 2, the second conductor 40 includes a second conductor portion 40a extending in the X direction. As shown in Figures 1 and 2, the first conductor portion 30a of the first conductor 30 and the second conductor portion 40a of the second conductor 40 overlap each other in the stacking direction Z and are sandwiched between the first magnetic core 21 and the second magnetic core 22.

[0033] As shown in Figure 2, the second inner surface 22B of the second magnetic core 22 is flat or substantially flat. Each side surface 22C, 22D of the second magnetic core (lower magnetic core) 22 is provided with a rounded corner 22G. The rounded corner 22G accommodates the mounting portions of the conductors 30, 31, 32, and 33 of the primary winding 3. The first magnetic core 21 includes a plurality of recesses in its first inner surface 21B. Each of the plurality of recesses defines holes 5a, 5b, 5c, and 5d. The first conducting portion 30a of the first conductor 30 and the second conducting portion 40a of the second conductor 40 are located within the corresponding recesses. That is, the first hole 5a extends between the first side surface 21C and the second side surface 21D, and each of the first conducting portion 30 and the second conducting portion 40a passes through the first hole 5a. As shown in Figures 2 and 4A, the thickness of the first conductor 30 may be greater than the thickness of the second conductor 40. However, other arrangements are also possible. For example, the thickness of the first conductor 30 may be less than the thickness of the second conductor 40, or the thickness of the first conductor 30 may be the same as or substantially the same as the thickness of the second conductor 40, within manufacturing tolerances and / or measurement error.

[0034] As shown in Figures 1 and 2, the first conductor 30 includes a first conductor portion 30a extending through the first hole 5a. The first conductor 30 includes a first terminal 30c connected to the first conductor portion 30a and extending along the second side surface 22D toward the bottom surface (second main surface) 22A. The first conductor 30 also includes a second terminal 30d extending along the first side surface 22C toward the top surface 21A. The first conductor 30 also includes a first heat path portion 30b connected to the second terminal 30d and extending between the top surface 21A and the bottom surface 22A. Thus, the first conductor 30 defines an inverted U-shaped conductor portion when viewed from the Y direction and a J-shaped conductor portion (30b) when viewed from the X direction.

[0035] As shown in Figures 1 and 2, the second conductor 40 includes a second conductor portion 40a extending through the first hole 5a such that the second conductor portion 40a and the first conductor portion 30a face each other. The second conductor 40 also includes a third terminal 40b extending along the first side surface 21C toward the top surface 21A, and a fourth terminal 40c extending along the second side surface 21D toward the top surface 21A. Thus, the second conductor 40 defines a U-shaped conductor when viewed from the Y direction.

[0036] Figure 3 shows an exploded view of the inductor as shown in Figure 2, along with the inductor assembled as shown in Figure 1. In Figure 3, symbols and labels have been omitted to make the arrangement of the inductor components visible. As shown in Figure 3, the J-shaped thermal path portion 30b allows heat to dissipate upward and downward from the inductor. This conductive portion 30b provides an additional heat dissipation structure that is used as a thermal path to improve thermal coupling. This conductive portion 30b can be configured to connect to a power supply circuit, i.e., when inductor 1 is used in a power supply module, current flows through the conductive portion 30b.

[0037] As shown in Figures 1 to 3, the primary winding 3 may include multiple conductors 30, 31, 32, and 33, and the secondary winding 4 may include multiple conductors 40, 41, 42, and 43. That is, as shown in Figures 1 to 3, a first conductor 30, a second conductor 40, a third conductor 31, a fourth conductor 41, a fifth conductor 32, a sixth conductor 42, a seventh conductor 33, and an eighth conductor 43 are provided. Each of the secondary winding conductors 40, 41, 42, and 43 has the same structure, and each of the primary winding conductors 30, 31, 32, and 33 has the same structure. However, the primary winding conductors 30, 31, 32, and 33 are arranged in alternating orientations as shown in Figures 1 to 3. As shown in Figures 1 to 3, the third conductor 31 is rotated 180° around the Z axis relative to the first conductor 30, with both ends adjacent to each other. A similar arrangement applies to adjacent conductors 31 and 32, and adjacent conductors 32 and 33. This arrangement increases wiring density and provides a compact structure while providing improved thermal coupling of the TLVR inductor as the number of windings increases. It will be understood that the number of conductors (windings) in the primary and secondary windings is not limited to those shown in the drawings of this application. For example, there may be more than four or fewer than four conductors in the primary winding 3 and conductors in the secondary winding 4. The number of conductors is not particularly limited as long as there is at least one conductor (30) for the primary winding 3 and at least one conductor (40) for the secondary winding 4.

[0038] The first conductor 30 and the second conductor 40 are electrically insulated from each other but are magnetically coupled to each other. An insulating material can be provided between the first conductor 30 and the second conductor 40. Two conductors 31 and 41 are electrically insulated from each other, and an insulating material may be present between them. A similar configuration applies to two conductors 32 and 42 facing each other in the stacking direction Z, and to two conductors 33 and 43 facing each other in the stacking direction.

[0039] As shown in Figures 1 to 3, each of the first conductor 30, second conductor 40, third conductor 31, fourth conductor 41, fifth conductor 32, sixth conductor 42, seventh conductor 33, and eighth conductor 43 includes a flat wire, the thickness of which is less than the width of which is which.

[0040] Figure 4A shows a side cross-sectional view of the inductor 1 shown in Figure 1. As shown in Figure 4A, heat from the upper magnetic core 21 (indicated by arrow H) is dissipated by the upper core winding (secondary winding) 40, and heat from the lower magnetic core 22 (H) is dissipated by the primary winding including the first conductor 30. As shown in Figure 4, the first heat path portion 30b and the first terminal portion 30c each extend downward from the second main surface 22A of the second magnetic core 22 so that a gap space G is provided between the second main surface 22A of the second magnetic core 22 and the mounting surface S. The mounting surface S is the surface on which the inductor 1 is mounted, for example, a printed circuit board (PCB) or the surface of a substrate. The gap space G provides space for housing electrical components below the inductor 1, as further explained in Figure 5C. It is also possible not to provide a gap space G below the lower magnetic core 22.

[0041] As shown in Figures 2 and 4A, the second conductor 40 includes terminal portions 40b and 40c on the first side surface 21C and the second side surface 21D of the first magnetic core 21, respectively, and extends in the stacking direction Z to the first main surface 21A. As shown in Figure 4A, the second conductor 40 has a U-shape.

[0042] As described above, the primary winding 3 includes a plurality of conductors 30, 31, 32, and 33, each of which has a downward U-shape (when viewed in a side cross-sectional view as shown in Figure 4A) and includes a first thermal path portion 30b having a J-shape. The secondary winding 4 includes a plurality of second conductors 41, 42, 43, and 44, each of which includes terminal portions 40b and 40c on the first side surface 21C and the second side surface 21D of the second magnetic core 21, respectively, such that each of the plurality of second conductors 41, 42, 43, and 44 has a U-shape, and extends in the stacking direction Z to the first main surface 21.

[0043] Referring to Figures 1, 2, and 4A, all or part of the edges of terminals 40b, 40c of each of the conductors 40, 41, 42, and 43 of the secondary winding 4 may be configured to be connected to the circuit of the top PCB (or upper board) (mounted on the top of the inductor 1) for use as a current path. All of the terminals 40b, 40c of each of the conductors 40, 41, 42, and 43 of the secondary winding 4 may be connected to the top PCB (or upper board) via solder for use as a heat path. Referring to Figures 1, 2, and 4A, the lower terminals 30c of each of the primary winding conductors 30, 31, 32, and 33 may be soldered to the lower board, and the upper terminal portions 30d of each of the primary winding conductors 30, 31, 32, and 33 may be soldered to the upper board. Furthermore, while the primary winding 3 is generally fixed to the lower magnetic core 22 with resin, an insulating material and a TL winding (secondary winding 4) may be present between the upper core 21 and the primary winding 3.

[0044] Figure 4B shows an exploded view of inductor 1 having an annotated heat dissipation path H. With the configuration described above in the exemplary embodiments shown in Figures 1 to 4B, exemplary embodiments of the present invention provide a coupled inductor (e.g., a TLVR inductor) comprising a plurality of U-shaped conductors arranged upward and downward between EI cores. The extensions defining each heat path portion 30b of the bottom U-shaped conductor are J-shaped, extending downward to the mounting surface of the lower substrate and then extending upward to connect to the upper substrate. The J-shaped wires (heat path portions 30b) allow heat to dissipate upward and downward from the magnetic core. Thus, the thermal coupling of the inductor is improved.

[0045] Figure 5A shows an electronic module 101 according to an exemplary embodiment of the present invention. The electronic module 101 includes a first substrate 100, a second substrate 200, and an inductor 1 disposed between the first substrate 100 and the second substrate 200. The electronic module 101 may also be a power supply module. The first substrate 100 is provided with a plurality of electronic components 7a. The second substrate 100 is provided with a plurality of electronic components 7a and a plurality of integrated circuits (ICs) 90. Although four ICs 90 are shown in Figure 5A, any number of ICs 90 can be used. Electrical connectors 8a and 8b, including terminals 81, are provided on both sides of the inductor 1 to provide an electrical connection between the first substrate 100 and the second substrate 200.

[0046] Figure 5B shows the electronic module shown in Figure 5A, with the electrical connector 8A omitted. The first conductor 30, like each of the other conductors 31, 32, and 33 of the primary winding 3, is connected to the first substrate 100 and the second substrate 200. As shown in Figure 5B, the portion between the first conductor 30 and the first substrate 100 is connected with resin or solder, which is used as a thermal path and also physically fixes the inductor component 1 in place.

[0047] Figure 5C shows an exploded view of the electronic module 101 shown in Figure 5A, according to an exemplary embodiment of the present invention. As shown in Figure 5C, the electronic module 101 includes electronic components 7c on a first substrate 100 beneath the inductor 1. Electrical connectors 8a (and 8b) are connected between the first substrate 100 and the second substrate 200 and include terminals 81 that provide an electrical connection between the first substrate 100 and the second substrate 200. The first substrate 100 includes a land pad 203 connected to terminals 81 and land pads 201 and 202 connected to conductors 31 and 33 of the primary winding 3 of the inductor 1.

[0048] Figure 6 shows the electronic module 101 shown in Figure 5A, along with the exploded view of the electronic module shown in Figure 5C and the exploded view of the inductor 1 shown in Figure 2. Figure 7 shows an electronic module 101A according to another exemplary embodiment of the present invention. In this example, a plurality of (additional) second substrates 200 are provided, and a plurality of (additional) inductors 1 are arranged between the additional second substrates 200 and the first substrate 100A. In Figure 7, the first substrate 100A is larger than the substrate 100 in Figures 5A-5C. The larger substrate 100A can accommodate a plurality of submodules to provide a multimodule power supply. In Figure 7, 16 submodules, each containing an inductor 1 and a second substrate 200, are provided in a 4x4 array.

[0049] While exemplary embodiments of the present invention have been described above, it should be understood that modifications and alterations will be obvious to those skilled in the art without departing from the scope and spirit of the invention. Therefore, the scope of the present invention should be determined solely by the following claims.

Claims

1. It is an inductor, A first magnetic core including a first main surface and a first inner surface, A second magnetic core including a second main surface and a second inner surface, A primary winding having a first conductor, wherein the first conductor includes a first conductor portion, A secondary winding having a second conductor electrically insulated from the first conductor, wherein the second conductor comprises a secondary winding including a second conductor portion, The first magnetic core is provided on the second magnetic core in a stacking direction such that the first inner surface and the second inner surface face each other. The first conducting portion of the first conductor and the second conducting portion of the second conductor overlap each other in the stacking direction and are sandwiched between the first magnetic core and the second magnetic core. An inductor wherein the first conductor includes a first thermal path portion on the first side surface of the first magnetic core and the first side surface of the second magnetic core, the first thermal path portion extending from the second main surface to the first main surface in the lamination direction.

2. The inductor according to claim 1, wherein the first heat path portion has a J-shape.

3. The inductor according to claim 1, wherein the first conductor includes a first terminal portion on the second side surface of the second magnetic core opposite to the first side surface, and the first terminal portion extends to the second main surface in the lamination direction.

4. The inductor according to claim 3, wherein each of the first thermal path portion and the first terminal portion extends downward from the second main surface of the second magnetic core such that a gap is provided between the second main surface and the mounting surface of the second magnetic core.

5. The inductor according to any one of claims 1 to 4, wherein the second conductor includes terminal portions on each of the first and second sides of the first magnetic core, and each terminal portion extends to the first main surface in the stacking direction such that the second conductor has a U-shape.

6. The primary winding comprises a plurality of first conductors, each including the first heat path portion having a J-shape, The inductor according to any one of claims 1 to 4, wherein the secondary winding comprises a plurality of second conductors, each having a terminal portion on the first side and the second side of the second magnetic core, and each terminal portion extends to the first main surface in the stacking direction such that each of the plurality of second conductors has a U-shape.

7. The second inner surface of the second magnetic core is flat or substantially flat. The first magnetic core includes a recess on its first inner surface, The inductor according to any one of claims 1 to 4, wherein the first conducting portion of the first conductor and the second conducting portion of the second conductor are provided in the recess.

8. The inductor according to any one of claims 1 to 4, wherein the thickness of the first conductor is greater than the thickness of the second conductor.

9. A power module, The first substrate and An inductor according to any one of claims 1 to 4, mounted on the first substrate, The device comprises a second substrate mounted on the inductor, The first conductor is connected to the first substrate and the second substrate in a power module.

10. It is an inductor, It is a magnetic core, Top surface and, The bottom surface opposite to the top surface, The first aspect and, The second side opposite to the first side, A magnetic core including a first hole extending between the first side and the second side, A first conductor, A first conductive portion extending through the first hole, A first terminal extending along the second side toward the bottom surface, A second terminal extending along the first side toward the top surface, A first conductor, including a first heat path portion connected to the second terminal and extending between the top surface and the bottom surface, A second conductor electrically insulated from the first conductor, A second conductor portion extends through the first hole such that the first conductor portion and the second conductor portion face each other, A third terminal extending along the first side toward the top surface, An inductor comprising a second conductor, including a fourth terminal extending along the second side toward the top surface.

11. The magnetic core includes a second hole extending between the first side surface and the second side surface. The aforementioned inductor is A third conductor, A third conductive portion extending through the second hole, A fifth terminal extending along the first side toward the bottom surface, A sixth terminal extending along the second side toward the top surface, A third conductor, including a second heat path portion connected to the sixth terminal and extending between the top surface and the bottom surface, A fourth conductor electrically insulated from the third conductor, A fourth conductor portion extends through the first hole such that the third conductor portion and the fourth conductor portion face each other, A seventh terminal extending along the first side toward the top surface, The inductor according to claim 10, further comprising a fourth conductor including an eighth terminal extending along the second side toward the top surface.

12. The magnetic core includes a third hole and a fourth hole extending between the first side and the second side, The aforementioned inductor is A fifth conductor, A fifth conductive portion extending through the third hole, A ninth terminal extending toward the bottom surface along the second side surface, A tenth terminal extending along the first side toward the top surface, A fifth conductor, including a third heat path portion connected to the tenth terminal and extending between the top surface and the bottom surface, A sixth conductor electrically insulated from the fifth conductor, A sixth conductor portion extends through the third hole such that the fifth conductor portion and the sixth conductor portion face each other, An eleventh terminal extending along the first side toward the top surface, A sixth conductor, including a twelfth terminal extending along the second side toward the top surface, A seventh conductor, A seventh conductive portion extending through the fourth hole, A thirteenth terminal extending along the first side toward the bottom surface, A 14th terminal extending along the second side toward the top surface, A seventh conductor, including a fourth thermal path portion connected to the 14th terminal and extending between the top surface and the bottom surface, An eighth conductor electrically insulated from the seventh conductor, The eighth conductor portion extends through the fourth hole such that the seventh conductor portion and the eighth conductor portion face each other, A 15th terminal extending along the first side toward the top surface, The inductor according to claim 11, further comprising an eighth conductor, including a sixteenth terminal extending along the second side toward the top surface.

13. The thickness of the first conductor is greater than the thickness of the second conductor. The thickness of the third conductor is greater than the thickness of the fourth conductor. The thickness of the fifth conductor is greater than the thickness of the sixth conductor. The inductor according to claim 12, wherein the thickness of the seventh conductor is greater than the thickness of the eighth conductor.

14. The inductor according to any one of claims 10 to 13, wherein a gap space is provided between the second main surface and the mounting surface.

15. The inductor according to any one of claims 10 to 13, wherein each of the first conductor, the second conductor, the third conductor, the fourth conductor, the fifth conductor, the sixth conductor, the seventh conductor, and the eighth conductor includes a flat wire, the thickness of the flat wire being less than the width of the flat wire.

16. The inductor according to any one of claims 10 to 13, wherein the magnetic core is an E-I core.

17. It is an electronic module, The first substrate and The second circuit board, An electronic module comprising an inductor according to any one of claims 10 to 13, disposed between the first substrate and the second substrate.

18. The electronic module according to claim 17, further comprising an electronic component on the first substrate below the inductor.

19. The electronic module according to claim 17, further comprising an electrical connector connected between the first substrate and the second substrate, and including terminals that provide an electrical connection between the first substrate and the second substrate.

20. An additional second circuit board, The electronic module according to claim 17, further comprising an additional inductor disposed between the additional second substrate and the first substrate.

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