Heat treatment apparatus and heat treatment method

Abstract

To provide a heat treatment apparatus that can operate stably for long periods of time, efficiently thermally decompose the material being processed, and prevent deterioration due to heat. [Solution] One embodiment of the heat treatment apparatus according to the present disclosure comprises: a first heating section 1 having granular heat-generating resistors 2 arranged inside; a heat-generating resistor supply section 3 connected to the first heating section 1 and supplying the heat-generating resistors 2 to the first heating section 1; a heat-generating resistor removal section 4 connected to the first heating section 1 and removing the heat-generating resistors 2 from the first heating section 1; a processing object supply section 5 connected to the first heating section 1 and supplying a processing object 7 to the first heating section 1; and a processing object removal section 6 connected to the first heating section 1 and removing a processing object 8 from the first heating section 1.

Description

Technical Field

[0001] The present disclosure relates to a heat treatment apparatus and a heat treatment method.

Background Art

[0002] Basic chemicals such as ethylene, propylene, benzene, toluene, and xylene are mainly produced from naphtha derived from fossil resources, petroleum. These basic chemicals are produced by thermally decomposing naphtha with 5 to 10 carbon atoms using superheated steam at a reaction temperature of 700°C to 850°C and separating them by distillation purification. Therefore, the reactor for decomposing naphtha needs to heat the external surface to about 1,000°C using a burner or the like, resulting in poor energy efficiency and easy deterioration of the reactor.

[0003] Conventional reactors are required to have durability under such high-temperature and steam-exposed conditions for a long time. Therefore, it is necessary to use a special metal alloy composition that can withstand these environments, which is costly.

[0004] Therefore, a method has been proposed in which a coiled metal wire of tungsten, molybdenum, or chromium is disposed in a reactor, an electric current is passed through this metal wire to heat it to 300°C to 600°C, and petroleum gas with 1 to 4 carbon atoms is decomposed into ethylene and propylene (see Non-Patent Document 1). <00​​​​​​​​​​​​​​​​​​​​​The purpose of this disclosure is to provide a heat treatment apparatus that can operate stably for a long period of time, efficiently thermally decompose the material to be treated, and prevent deterioration due to heat. [Means for solving the problem]

[0007] The means to solve the aforementioned problem are as follows: <1> A first heating section having granular heat-generating resistors arranged inside, A heating resistor supply unit connected to the first heating unit and supplying the heating resistor to the first heating unit, A heating resistor extraction unit connected to the first heating unit and for extracting the heating resistor from the first heating unit, A processing object supply unit connected to the first heating unit and supplying the processing object to the first heating unit, A processing material removal unit connected to the first heating unit for removing the processed material from the first heating unit, This is a heat treatment apparatus characterized by being equipped with the following features. <2> A first electrode is placed inside the first heating section so as to be in contact with the heating resistor, A second electrode electrically connected to the first electrode, The above <1> This is the heat treatment apparatus described above. <3> The gas supply unit is connected to the first heating unit and supplies an inert gas to the first heating unit, <1> or the above <2> This is the heat treatment apparatus described above. <4> The system includes a transport unit that transports the heat-generating resistor from the heat-generating resistor extraction unit to the heat-generating resistor supply unit. <1> from the above <3> The heat treatment apparatus is one of the items described in any one of the paragraphs. <5> The object to be processed is plastic, The treated product is at least one chemical selected from the group consisting of olefins having 2 to 5 carbon atoms and aromatic hydrocarbons. <1> from the above <4> The heat treatment apparatus is one of the items described in any one of the paragraphs. <6> A second heating section for heating the carbon attached to the heat-generating resistor, A first transport unit transports the heat-generating resistor from the heat-generating resistor removal unit to the second heating unit, A second transport unit that transports the heat-generating resistor from the second heating unit to the heat-generating resistor supply unit, The above <5> This is the heat treatment apparatus described above. <7> A gas supply unit connected to the second heating unit and supplying an oxygen-containing gas to the second heating unit, A gas discharge unit connected to the second heating unit and which discharges a gas containing carbon dioxide from the second heating unit, The above <6> This is the heat treatment apparatus described above. <8> The gas discharge unit is connected to a gas supply unit that supplies inert gas to the first heating unit. The gas supply unit is connected to the first heating unit, <7> This is the heat treatment apparatus described above. <9> The aforementioned <1> from the above <8> This heat treatment method is characterized by heat-treating an object to be treated using a heat treatment apparatus described in any one of the items. <10> The heating resistor is supplied from the heating resistor supply unit to the first heating unit, The process involves supplying the object to be processed from the object to be processed supply unit to the first heating unit, The heating element is heated in the first heating section, In the first heating section, the object to be processed and the heating resistor are brought into contact, From the aforementioned processed material removal unit, the processed material generated from the object to be processed is removed, To remove the heating resistor from the heating resistor removal section, Including the above <9> This is the heat treatment method described in [the relevant document]. <11> The heating described above involves heating the object to be processed to 650°C or higher with the heating resistor in the first heating section. <10> This is the heat treatment method described in [the relevant document]. [Effects of the Invention]

[0008] According to an embodiment of the present disclosure, it is possible to provide a heat treatment apparatus that can operate stably for a long time, efficiently pyrolyze an object to be processed, and prevent deterioration due to heat.

Brief Description of the Drawings

[0009] [Figure 1A] FIG. 1A is a schematic cross-sectional view showing an example of a heat treatment apparatus according to a first embodiment of the present disclosure. [Figure 1B] FIG. 1B is a block diagram showing an example of a control unit of the heat treatment apparatus according to the first embodiment of the present disclosure. [Figure 2] FIG. 2 is a schematic cross-sectional view showing an example of a heat treatment apparatus according to a second embodiment of the present disclosure. [Figure 3A] FIG. 3A is a schematic cross-sectional view showing an example of a heat treatment apparatus according to a third embodiment of the present disclosure. [Figure 3B] FIG. 3B is a block diagram showing an example of a control unit of the heat treatment apparatus according to the third embodiment of the present disclosure. [Figure 4A] FIG. 4A is a schematic cross-sectional view showing an example of a heat treatment apparatus according to a fourth embodiment of the present disclosure. [Figure 4B] FIG. 4B is a block diagram showing an example of a control unit of the heat treatment apparatus according to the fourth embodiment of the present disclosure. [Figure 5A] FIG. 5A is a schematic cross-sectional view showing an example of a heat treatment apparatus according to a fifth embodiment of the present disclosure. [Figure 5B] FIG. 5B is a block diagram showing an example of a control unit of the heat treatment apparatus according to the fifth embodiment of the present disclosure. [Figure 6A] FIG. 6A is a schematic cross-sectional view showing an example of a heat treatment apparatus according to a sixth embodiment of the present disclosure. [Figure 6B] FIG. 6B is a block diagram showing an example of a control unit of the heat treatment apparatus according to the sixth embodiment of the present disclosure. [Figure 7A] FIG. 7A is a schematic cross-sectional view showing an example of a heat treatment apparatus according to a seventh embodiment of the present disclosure. [Figure 7B]Figure 7B is a block diagram showing an example of a control unit of a heat treatment apparatus according to the seventh embodiment of the present disclosure. [Figure 8] Figure 8 is an example of a flowchart of a heat treatment method according to one embodiment of the present disclosure. [Modes for carrying out the invention]

[0010] A heat treatment apparatus and a heat treatment method according to the embodiments of this disclosure will be described in detail with reference to the drawings. However, the embodiments described below are illustrative examples of a heat treatment apparatus and a heat treatment method for realizing the technical concept of this disclosure and are not limited to those described below, and can be modified as appropriate without departing from the gist of this disclosure.

[0011] Furthermore, the dimensions, materials, shapes, numbers, and relative arrangements of the components described in the embodiments are merely illustrative examples and not intended to limit the scope of this disclosure unless otherwise specified. Note that the size and positional relationships of the components shown in each drawing may be exaggerated for clarity. Also, in the following description, the same name and reference numeral indicate the same or identical components, and detailed explanations are omitted as appropriate. To avoid overly complex drawings, schematic diagrams may be used with some elements omitted, or end views showing only the cross-section may be used as cross-sectional views.

[0012] Furthermore, in this disclosure, the term "polygon" refers to polygons such as rectangles, triangles, and quadrilaterals, including shapes where the corners of the polygon have been rounded, chamfered, or otherwise modified. Similarly, shapes where modifications have been made not only to the corners (ends of the sides) but also to the middle parts of the sides will also be referred to as polygons. In other words, shapes that retain the shape of a polygon but have been partially modified are included in the interpretation of "polygon" as described in this disclosure.

[0013] Furthermore, the same applies not only to polygons, but also to terms describing specific shapes such as cylinders, rectangular prisms, trapezoids, circles, and tapered shapes. The same also applies when dealing with each side that forms such a shape. In other words, even if a side has been processed at a corner or in the middle, the interpretation of "side" includes the processed part. When distinguishing a "polygon" or "side" without partial processing from a processed shape, the term "strictly" should be added, for example, "strictly quadrilateral."

[0014] Furthermore, the following description uses terms to indicate specific directions or positions as needed (e.g., "up," "down," "side," "top surface," "bottom surface," "side," "X," "Y," "Z," and other terms including these terms). However, the use of these terms is solely to facilitate understanding of the invention with reference to the drawings, and the meaning of these terms does not excessively limit the technical scope of the invention. For example, if "top surface" is mentioned, the invention must not always be used in a way that it faces upwards.

[0015] Furthermore, in this specification, the "~" symbol indicating a numerical range means that the values ​​before and after it are included as the lower and upper limits, respectively, unless otherwise specified.

[0016] (Heat treatment equipment) <First Embodiment> A heat treatment apparatus according to the first embodiment of the present disclosure comprises: a first heating section having granular heat-generating resistors arranged inside; a heat-generating resistor supply section connected to the first heating section and supplying the heat-generating resistors to the first heating section; a heat-generating resistor removal section connected to the first heating section and removing the heat-generating resistors from the first heating section; a processing material supply section connected to the first heating section and supplying a processing material to the first heating section; and a processing material removal section connected to the first heating section and removing a processing material from the first heating section. The heat treatment apparatus according to one embodiment may further include other components as needed.

[0017] Figure 1A is a schematic cross-sectional view showing an example of a heat treatment apparatus according to the first embodiment of the present disclosure. The heat treatment apparatus 100 comprises a first heating unit 1, a heat-generating resistor 2, a heat-generating resistor supply unit 3, a heat-generating resistor removal unit 4, a material to be processed supply unit 5, and a material to be processed removal unit 6.

[0018] The direction in which the granular heat-generating resistor 2 accumulates due to its own weight is defined as the Y-axis direction, the direction approximately perpendicular to the Y-axis direction is defined as the X-axis direction, and the direction approximately perpendicular to both the X-axis and Y-axis directions is defined as the Z-axis direction. The X-axis, Y-axis, and Z-axis are mutually orthogonal.

[0019] In this disclosure, "approximately orthogonal" is not limited to 90°, but allows for a difference of 90° ± 5°.

[0020] Conventional technologies, such as the reactor described in Non-Patent Document 1, allow for lower heating temperatures of the reaction tube compared to external heating methods. However, there is a problem in that the raw material, petroleum gas, and the products, ethylene and propylene, carbonize (sometimes referred to as "coking" in this disclosure) inside the reactor and on the surface of the metal wire that acts as a heating element, leading to a decrease in the efficiency of product production over time. Furthermore, if the material being processed is plastic, the carbon can penetrate the metal structure of the metal wire, or, if the reactor is made of metal, the metal structure of the reactor, causing the metal to become brittle. In addition, if the material being processed is plastic, the chlorine compounds generated during thermal decomposition can accelerate metal corrosion. Therefore, there is also the problem of cumbersome handling, as it requires periodic maintenance such as flowing air into the reactor to burn off the carbon, or cutting and replacing the reactor or metal wire.

[0021] In contrast, the heat treatment apparatus 100 of this disclosure directly heats the object to be treated 7 with the heat-generating resistor 2 by bringing the object to be treated 7 into contact with the heat-generating resistor 2. Compared to conventional technology in which a conventional reactor corresponding to the first heating unit 1 is heated from the outside with a burner or the like, the temperature of the first heating unit 1 that heats the object to be treated 7 does not become high, and deterioration of the heat treatment apparatus 100 including the first heating unit 1 can be suppressed.

[0022] Furthermore, in the heat treatment apparatus 100 of this disclosure, the heating resistor 2 is supplied from the heating resistor supply unit 3 to the first heating unit 1 and removed from the heating resistor removal unit 4 as appropriate after use, thereby preventing deterioration of the heating resistor 2 due to heat. Moreover, even if the heating resistor 2 deteriorates or becomes caulked due to prolonged use, the heating resistor 2 can be removed from the first heating unit 1 and the heat treatment apparatus 100 can be operated while replacing the deteriorated and / or caulked heating resistor 2. As a result, the heat treatment apparatus 100 can operate stably for a long time, efficiently thermally decompose the material to be treated 7, and increase the production volume of the processed material 8.

[0023] <<First heating section 1>> The first heating unit 1 heats the object to be processed 7. More specifically, the first heating unit 1 is configured to accommodate the object to be processed 7, and the object to be processed 7 is heated by a heating resistor 2 placed inside the first heating unit 1. As a result, the object to be processed 7 is decomposed, and processed material 8 is obtained.

[0024] The material of the first heating section 1 is not particularly limited, as long as it is stable in terms of surface temperature and atmosphere on the inside of the first heating section 1, that is, on the side of the first heating section 1 that houses the object to be processed 7.

[0025] For example, if the interior of the first heating section 1 is a nitrogen gas atmosphere and the inner surface temperature of the first heating section 1 is 400°C or less, the material of the first heating section 1 can be metals such as iron (Fe) and titanium (Ti); inorganic compounds such as alumina (Al2O3), zirconia (ZrO3), silicon carbide (SiC), silicon nitride (Si3N4), and mullite (3Al2O3·2SiO2) or ceramics thereof; or alloys such as stainless steel, Inconel (INCONEL®), and Hastelloy (HASTELLOY®). These may be used individually or in combination of two or more. Among these, when the interior of the first heating section 1 is a nitrogen gas atmosphere and the inner surface temperature of the first heating section 1 is 400°C or less, from the viewpoint of material cost, iron (Fe) and general stainless steels such as SUS304, SUS304L, SUS316, and SUS316L are preferred as the material of the first heating section 1.

[0026] For example, if the interior of the first heating section 1 is in a nitrogen gas atmosphere and the inner surface temperature of the first heating section 1 is between 400°C and 700°C, the material of the first heating section 1 can be an inorganic compound such as alumina (Al2O3), zirconia (ZrO3), silicon carbide (SiC), silicon nitride (Si3N4), mullite (3Al2O3·2SiO2), or ceramics thereof; or an alloy such as stainless steel (e.g., SUS316L, SUS310S, etc.), Inconel (INCONEL®), Hastelloy (HASTELLOY®).

[0027] For example, if the interior of the first heating section 1 is in a nitrogen gas atmosphere and the inner surface temperature of the first heating section 1 is between 700°C and 950°C, the material of the first heating section 1 can be an inorganic compound such as alumina (Al2O3), zirconia (ZrO3), silicon carbide (SiC), silicon nitride (Si3N4), mullite (3Al2O3·2SiO2), or ceramics thereof; or an alloy such as SUS310S (INCONEL®) or Hastelloy (HASTELLOY®).

[0028] For example, if the interior of the first heating section 1 is a water vapor atmosphere and the inner surface temperature of the first heating section 1 is 700°C or less, the material of the first heating section 1 may be an inorganic compound such as alumina (Al2O3), zirconia (ZrO3), silicon carbide (SiC), silicon nitride (Si3N4), mullite (3Al2O3·2SiO2), or ceramics thereof; or an alloy such as stainless steel (e.g., SUS316, SUS316L, SUS310S, etc.), Inconel (registered trademark), Hastelloy (registered trademark).

[0029] For example, if the interior of the first heating section 1 is a water vapor atmosphere and the inner surface temperature of the first heating section 1 is between 700°C and 950°C, the material of the first heating section 1 can be an inorganic compound such as alumina (Al2O3), zirconia (ZrO3), silicon carbide (SiC), silicon nitride (Si3N4), mullite (3Al2O3·2SiO2), or ceramics thereof; or an alloy such as Inconel® or Hastelloy®.

[0030] The shape, structure, and size of the first heating section 1 are not particularly limited, as long as they are capable of accommodating the heat-generating resistor 2 and the object to be processed 7.

[0031] Examples of the shape of the first heating section 1 include cylindrical, rectangular parallelepiped, conical, frustoconical, and columnar shapes in which the cross-section parallel to the first surface 1a and / or second surface 1b of the first heating section 1 is polygonal.

[0032] Among these, when the heat-generating resistor supply unit 3 is located at the top of the first heating unit 1 in the Y-axis direction, and the heat-generating resistor removal unit 4 is located at the bottom of the first heating unit 1 in the Y-axis direction, it is preferable that the shape of the first heating unit 1 is such that the cross-sectional area A of the first heating unit 1 in the XZ plane continuously decreases in the Y-axis direction where the heat-generating resistor 2 accumulates under its own weight, that is, the cross-sectional shape of the first heating unit 1 in the Y-axis direction is tapered. When the cross-sectional shape of the first heating unit 1 in the Y-axis direction is such a tapered shape, the heat-generating resistor 2 can be removed from the heat-generating resistor removal unit 4 by its own weight, resulting in a low load.

[0033] Furthermore, when the material supply unit 5 is located at the top of the first heating unit 1 in the Y-axis direction, and the material removal unit 6 is located at the bottom of the first heating unit 1 in the Y-axis direction, if the cross-sectional shape of the first heating unit 1 in the Y-axis direction is such a tapered shape, the flow velocity of the material 7 tends to increase from the material supply unit 5 to the material removal unit 6, improving the yield of the material 8 and minimizing the power consumption of the heating resistor 2.

[0034] The size of the first heating section 1 is not particularly limited, as long as it has a length and inner diameter that can accommodate the heating resistor 2 and the object to be processed 7.

[0035] <<Heating resistor 2>> The heat-generating resistor 2 is granular and is supplied from the heat-generating resistor supply unit 3 to the first heating unit 1 and removed from the heat-generating resistor removal unit 4.

[0036] The heat-generating resistor 2 may be continuously supplied from the heat-generating resistor supply unit 3 to the first heating unit 1 and removed from the heat-generating resistor removal unit 4 when the heat treatment apparatus 100 is in operation, or it may be intermittently supplied from the heat-generating resistor supply unit 3 to the first heating unit 1 and removed from the heat-generating resistor removal unit 4 at desired timings. The supply and removal of the heat-generating resistor 2 to and from the first heating unit 1 can be suitably controlled by the control unit 200, which will be described later.

[0037] There are no particular restrictions on the material of the heat-generating resistor 2, and it can be appropriately selected according to the purpose, but a material that is stable in the temperature and atmosphere in which it is used is preferred. For example, if the inside of the first heating section 1 is in a nitrogen gas atmosphere, the material of the heat-generating resistor 2 can be nichrome, kanthal, tungsten, molybdenum, tantalum, etc., and can be appropriately selected according to the purpose. Also, if durability is required, such as when the inside of the first heating section 1 is in a water vapor atmosphere, tantalum can be used as the material of the heat-generating resistor 2.

[0038] Furthermore, the heating resistor 2 may be made by coating the surface of the material with a conductive ceramic such as tungsten oxide, molybdenum(VI) oxide, molybdenum disilide, lanthanum chromite, triiron tetroxide, copper(I) oxide, tin dioxide, or indium oxide, so as to stabilize it in the atmosphere inside the first heating section 1.

[0039] From the viewpoint of not hindering the electrical connections and heat conduction between the particles of the heat-generating resistor 2, the thickness of the coating on the heat-generating resistor 2 is preferably 0.001 μm to 5 μm.

[0040] There are no particular limitations on the method for coating the surface of the heat-generating resistor 2. A known method can be appropriately selected depending on the material, shape, structure, and size of the heat-generating resistor 2. For example, a method of coating with a ceramic raw material such as tungsten oxide using a spray coating method, printing method, immersion method, dispenser coating method, etc. The heat-generating resistor 2 coated with the ceramic raw material can be fired using a known method to form a ceramic coating on its surface.

[0041] Furthermore, the heat-generating resistor 2 may be coated by a dry method such as physical vapor deposition, chemical vapor deposition, or sputtering, or the surface of the heat-generating resistor 2 itself may be oxidized to form an oxide film of the aforementioned thickness.

[0042] A catalyst may be supported on the surface of the heat-retaining resistor 2, depending on the purpose of the heat treatment. There are no particular restrictions on the type of catalyst, but examples include various zeolites and FCC (Fluid Catalytic Cracking) catalysts when the material to be treated 7 is one or more selected from the group consisting of naphtha, hydrocarbons, plastics, and biomass, and the material to be treated 8 is at least one chemical selected from the group consisting of olefins having 2 to 5 carbon atoms and aromatic hydrocarbons. The catalyst supported on the surface of the heat-retaining resistor 2 may be an unused catalyst or a catalyst that has been used in heat treatment one or more times.

[0043] The heat-generating resistor 2 may have pores. If the heat-generating resistor 2 has pores, the mass per particle of the heat-generating resistor 2 can be reduced, and supply from the heat-generating resistor supply unit 3 and removal from the heat-generating resistor removal unit 4 can be made easier.

[0044] There are no particular restrictions on the particle size of the heat-generating resistor 2, and it can be appropriately selected depending on the type of material to be processed 7. However, a number-average particle size of 0.5 mm to 100 mm is preferred, and 1 mm to 80 mm is more preferred. When the number-average particle size of the heat-generating resistor 2 is 0.5 mm or more, the gaps between the heat-generating resistors 2 are appropriate, making it easy to maintain an appropriate flow rate for the material to be processed 7. Furthermore, when the number-average particle size of the heat-generating resistor 2 is 100 mm or less, the heat-generating resistor 2, which is made of metal or the like, does not become too heavy, resulting in excellent handling.

[0045] In this disclosure, the number-average particle size of the heat-generating resistor 2 is determined by taking a photograph with an optical microscope or a regular camera so that 50 to 70 particles of the heat-generating resistor 2 are in the field of view, measuring the particle size of all the particles of the heat-generating resistor 2 in the field of view, and taking the average value.

[0046] <<Heat-generating resistor supply unit 3>> The heat-generating resistor supply unit 3 is connected to the first heating unit 1 and supplies the heat-generating resistor 2 to the first heating unit 1.

[0047] In this disclosure, "connection" of the heat-generating resistor supply unit 3 to the first heating unit 1 means that the inside of the heat-generating resistor supply unit 3 and the inside of the first heating unit 1 are in communication so that the heat-generating resistor 2 can pass through them.

[0048] There are no particular restrictions on the material of the heat-generating resistor supply unit 3; for example, it can be appropriately selected from the same materials as the first heating unit 1, depending on the purpose.

[0049] The shape, structure, and size of the heat-generating resistor supply unit 3 are not particularly limited as long as it can be connected to the first heating unit 1 and supply the heat-generating resistor 2 to the first heating unit 1. They can be appropriately selected according to the purpose, for example, a cylindrical shape or a rectangular parallelepiped. Furthermore, if a part of the first heating unit 1 has an opening, this opening can also be used as the heat-generating resistor supply unit 3.

[0050] The position of the heat-generating resistor supply unit 3 is not particularly restricted as long as it can be connected to the first heating unit 1, and can be appropriately selected according to the purpose. Figure 1A shows the heat-generating resistor supply unit 3 being located on the side of the first heating unit 1 near the first surface 1a of the first heating unit 1, and below the material to be processed supply unit 5. However, the heat-generating resistor supply unit 3 may be located at any position on the side of the first heating unit 1, on the first surface 1a of the first heating unit 1, or on the second surface 1b of the first heating unit 1. Furthermore, the heat-generating resistor supply unit 3 may be located above the material to be processed supply unit 5.

[0051] <<Heating resistor extraction section 4>> The heat-generating resistor extraction unit 4 is connected to the first heating unit 1 and extracts the heat-generating resistor 2 from the first heating unit 1.

[0052] In this disclosure, "connection" of the heat-generating resistor extraction section 4 to the first heating section 1 means that the inside of the heat-generating resistor extraction section 4 and the inside of the first heating section 1 are in communication so that the heat-generating resistor 2 can pass through them.

[0053] There are no particular restrictions on the material of the heat-generating resistor extraction section 4; for example, it can be appropriately selected from the same materials as the first heating section 1, depending on the purpose.

[0054] The shape, structure, and size of the heat-generating resistor removal section 4 are not particularly limited as long as it can be connected to the first heating section 1 and the heat-generating resistor 2 can be removed from the first heating section 1. They can be appropriately selected according to the purpose, for example, a cylindrical shape or a rectangular parallelepiped. Also, if a part of the first heating section 1 has an opening, this opening can be used as the heat-generating resistor removal section 4.

[0055] The position of the heat-generating resistor extraction section 4 is not particularly restricted as long as it can be connected to the first heating section 1, and can be appropriately selected depending on the type of material to be processed 8. Figure 1A shows the heat-generating resistor extraction section 4 being placed on the side surface of the first heating section 1 near the second surface 1b of the first heating section 1, but the heat-generating resistor extraction section 4 may be placed at any position on the side surface of the first heating section 1, or it may be placed on the first surface 1a of the first heating section 1, or it may be placed on the second surface 1b of the first heating section 1.

[0056] <<Processing Material Supply Unit 5>> The material to be processed supply unit 5 is connected to the first heating unit 1 and supplies the material to be processed 7 to the first heating unit 1.

[0057] In this disclosure, "connection" of the material to be processed supply unit 5 to the first heating unit 1 means that the inside of the material to be processed supply unit 5 and the inside of the first heating unit 1 are in communication so that the material to be processed 7 can pass through them.

[0058] There are no particular restrictions on the material of the material supply unit 5 to be processed; for example, it can be appropriately selected from the same materials as the first heating unit 1, depending on the purpose.

[0059] The shape, structure, and size of the material supply unit 5 are not particularly limited as long as it can be connected to the first heating unit 1 and supply the material to be processed 7 to the first heating unit 1. They can be appropriately selected according to the purpose, for example, a cylindrical shape or a rectangular parallelepiped. Also, if a part of the first heating unit 1 has an opening, this opening can be used as the material supply unit 5.

[0060] The position of the material to be processed supply unit 5 is not particularly restricted as long as it can be connected to the first heating unit 1, and can be appropriately selected according to the type of material to be processed 7. Figure 1A shows the material to be processed supply unit 5 being placed on the side surface of the first heating unit 1 near the first surface 1a of the first heating unit 1, but the material to be processed supply unit 5 may be placed at any position on the side surface of the first heating unit 1, or on the first surface 1a of the first heating unit 1, or on the second surface 1b of the first heating unit 1.

[0061] -Item to be processed 7- There are no particular restrictions on the materials to be processed (7), and they can be appropriately selected depending on the purpose. Examples include naphtha, hydrocarbons, plastics, and biomass.

[0062] <<Processing material removal section 6>> The processed material removal unit 6 is connected to the first heating unit 1 and removes the processed material 8 that has been processed in the first heating unit 1.

[0063] In this disclosure, "connection" of the processed material removal section 6 to the first heating section 1 means that the inside of the processed material removal section 6 and the inside of the first heating section 1 are in communication so that the processed material 8 can pass through them.

[0064] There are no particular restrictions on the material of the processed material removal section 6; for example, it can be appropriately selected from the same materials as the first heating section 1, depending on the purpose.

[0065] The shape, structure, and size of the processed material removal section 6 are not particularly limited as long as the processed material 8 processed in the first heating section 1 can be removed, and can be appropriately selected according to the purpose. Examples include cylindrical shapes and rectangular parallelepipeds. Furthermore, if a part of the first heating section 1 has an opening, this opening can also be used as the processed material removal section 6.

[0066] The position of the material removal section 6 is not particularly restricted as long as it can be connected to the first heating section 1, and can be appropriately selected according to the type of material to be processed 8. Figure 1A shows the material removal section 6 being placed on the side surface of the first heating section 1 near the second surface 1b of the first heating section 1, but the material removal section 6 may be placed at any position on the side surface of the first heating section 1, on the first surface 1a of the first heating section 1, or on the second surface 1b of the first heating section 1.

[0067] In the first heating section 1, processed material 8 is generated from the material to be processed 7, so the material to be processed 7 and processed material 8 may be mixed within the first heating section 1. Therefore, the processed material removal section 6 may remove not only the processed material 8 but also a mixture of processed material 8 and the material to be processed 7. Furthermore, if by-products are generated within the first heating section 1, the processed material removal section 6 may also remove the by-products.

[0068] Furthermore, when the first heating unit 1 is used as a batch reaction vessel, the material supply unit 5 and the material removal unit 6 may be the same. That is, a single component located in the same position may serve as both the material supply unit 5, which supplies the material 7 to the first heating unit 1, and the material removal unit 6, which removes the material 8 processed in the first heating unit 1. In this case, both the first supply speed adjustment unit 12 and the first removal speed adjustment unit 16, which will be described later, are also a single component located in the same position.

[0069] -Processed item 8- There are no particular restrictions on the processed material 8, and it can be appropriately selected depending on the type of object to be processed 7. For example, if the object to be processed 7 is plastic, the processed material 8 is at least one chemical selected from the group consisting of olefins having 2 to 5 carbon atoms and aromatic hydrocarbons. Therefore, the heat treatment apparatus 100 can be suitably used as a production apparatus for at least one chemical selected from the group consisting of olefins having 2 to 5 carbon atoms and aromatic hydrocarbons. In the case of the object to be processed 7 being plastic, the processed material 8 may also contain by-products in addition to at least one chemical selected from the group consisting of olefins having 2 to 5 carbon atoms and aromatic hydrocarbons. In that case, the processed material 8 includes at least one chemical selected from the group consisting of olefins having 2 to 5 carbon atoms and aromatic hydrocarbons, as well as the by-products.

[0070] <<Other components>> Other components are not particularly limited as long as they do not impair the effectiveness of the heat treatment apparatus according to the first embodiment of this disclosure. Examples include a temperature sensor 11, a first supply speed adjustment unit 12, a second supply speed adjustment unit 13, a first supply speed sensor 14, a second supply speed sensor 15, a first removal speed adjustment unit 16, a second removal speed adjustment unit 17, a first removal speed sensor 18, a second removal speed sensor 19, and a control unit 200. Depending on the type of material to be processed 7 and the material to be processed 8, the apparatus may also be provided with a material recovery unit for the material to be processed 8, a material separation unit for the material to be processed 8, and so on.

[0071] -Temperature sensor 11- The temperature sensor 11 measures the temperature of the heat-generating resistor 2. The temperature detection signal from the temperature sensor 11 is preferably transmitted to the first temperature controller 206a of the control unit 200. The presence of the temperature sensor 11 in the heat treatment apparatus 100 is preferable because the first temperature controller 206a can provide feedback control over the temperature of the heat-generating resistor 2.

[0072] There are no particular restrictions on the temperature sensor 11, as long as it can accurately measure the temperature of the heat-generating resistor 2. Here, the diagram illustrates a configuration in which the temperature sensor 11 measures the temperature by contacting the heat-generating resistor 2, but it is not limited to this configuration, and the temperature sensor 11 may measure the temperature without contacting the heat-generating resistor 2.

[0073] If the temperature sensor 11 measures temperature by contacting the heat-generating resistance element 2, examples include thermocouples and platinum thermometers.

[0074] If the temperature sensor 11 measures temperature without contact with the heat-generating resistance element 2, examples include a radiation thermometer and an infrared thermographic camera.

[0075] -First supply speed adjustment section 12- The first supply speed adjustment unit 12 adjusts the supply speed at which the material to be processed supply unit 5 supplies the material to be processed 7 to the first heating unit 1, or stops the material to be processed supply unit 5 from supplying the material to be processed 7 to the first heating unit 1.

[0076] For the first supply speed adjustment unit 12, for example, a known pump, a cock, etc., can be used.

[0077] The rate at which the material to be processed 7 is supplied to the first heating unit 1 by the first supply rate adjustment unit 12 can be adjusted by the first supply rate controller 206b of the control unit 200, which will be described later.

[0078] -First supply rate sensor 14- The first supply speed sensor 14 measures the supply speed of the material to be processed 7 by the first supply speed adjustment unit 12. The first supply speed sensor 14 is not particularly limited as long as it can accurately measure the supply speed of the material to be processed 7 by the first supply speed adjustment unit 12; for example, a known flow sensor for liquids or gases can be used.

[0079] The supply speed detection signal from the first supply speed sensor 14 is suitably transmitted to the first supply speed controller 206b of the control unit 200. The heat treatment apparatus 100 is preferable because it has the first supply speed sensor 14, which improves the yield of the processed material 8 and minimizes the power consumption of the heating resistor 2, and because the first supply speed controller 206b can provide feedback control of the supply speed of the processed material supply unit 5.

[0080] -Second supply speed adjustment section 13- The second supply speed adjustment unit 13 adjusts the supply speed at which the heat-generating resistor supply unit 3 supplies the heat-generating resistor 2 to the first heating unit 1, or stops the heat-generating resistor supply unit 3 from supplying the heat-generating resistor 2 to the first heating unit 1.

[0081] For the second supply speed adjustment unit 13, for example, a known pump, a cock, etc., can be used.

[0082] The rate at which the heating resistor 2 is supplied to the first heating unit 1 by the second supply rate adjustment unit 13 can be adjusted by the second supply rate controller 206c of the control unit 200, which will be described later.

[0083] -Second supply rate sensor 15- The second supply rate sensor 15 measures the supply rate of the heat-generating resistor 2 by the second supply rate adjustment unit 13. The second supply rate sensor 15 is not particularly limited as long as it can accurately measure the supply rate of the heat-generating resistor 2 by the second supply rate adjustment unit 13; for example, a known flow sensor for solid particles can be used.

[0084] The supply speed detection signal from the second supply speed sensor 15 is suitably transmitted to the second supply speed controller 206c of the control unit 200. The presence of the second supply speed sensor 15 in the heat treatment apparatus 100 is preferable because it allows the second supply speed controller 206c to provide feedback control over the supply speed of the heating resistor 2 by the second supply speed adjustment unit 13.

[0085] -First extraction speed adjustment unit 16- The first removal speed adjustment unit 16 adjusts the removal speed at which the processed material removal unit 6 removes the processed material 8 from the first heating unit 1, or stops the processed material removal unit 6 from removing the processed material 8 from the first heating unit 1.

[0086] For the first extraction speed adjustment unit 16, for example, a known pump, a cock, or the like can be used.

[0087] The speed at which the first removal speed adjustment unit 16 removes the processed material 8 from the first heating unit 1 can be adjusted by the first removal speed controller 206d of the control unit 200, which will be described later.

[0088] By adjusting the supply of the material to be processed 7 to the first heating section 1 by the first supply rate adjustment section 12 and the removal of the processed material 8 from the first heating section 1 by the first removal rate adjustment section 16, the first heating section 1 can be used as a batch reaction vessel or a continuous reaction vessel.

[0089] For example, by stopping the removal of the material 8 from the first heating unit 1 using the first removal speed adjustment unit 16, supplying a certain amount of the material to be processed 7 to the first heating unit 1 using the first supply speed adjustment unit 12, then stopping the supply of the material to be processed 7 to the first heating unit 1 using the first supply speed adjustment unit 12, and then heating the material to be processed 7 with the heating resistor 2, the first heating unit 1 can be used as a batch reaction vessel to perform a batch reaction.

[0090] Furthermore, for example, if the first removal speed adjustment unit 16 continuously removes the processed material 8 from the first heating unit 1, while the first supply speed adjustment unit 12 continuously supplies the material to be processed 7 to the first heating unit 1, the first heating unit 1 can be used as a continuous reaction vessel to carry out a continuous reaction.

[0091] -First extraction speed sensor 18- The first extraction speed sensor 18 measures the extraction speed of the processed material 8 by the first extraction speed adjustment unit 16. The first extraction speed sensor 18 is not particularly limited as long as it can accurately measure the extraction speed of the processed material 8 by the first extraction speed adjustment unit 16; for example, a known flow sensor for liquids or gases can be used.

[0092] The extraction speed detection signal from the first extraction speed sensor 18 is suitably transmitted to the first extraction speed controller 206d of the control unit 200. The inclusion of the first extraction speed sensor 18 in the heat treatment apparatus 100 is preferable because it improves the yield of the processed material 8 and minimizes the power consumption of the heating resistor 2, and the first extraction speed controller 206d can provide feedback control of the extraction speed of the processed material extraction unit 6.

[0093] -Second extraction speed adjustment unit 17- The second extraction speed adjustment unit 17 adjusts the extraction speed at which the heating resistor extraction unit 4 extracts the heating resistor 2 from the first heating unit 1, or stops the heating resistor extraction unit 4 from extracting the heating resistor 2 from the first heating unit 1.

[0094] For the second extraction speed adjustment unit 17, for example, a known pump, a cock, etc., can be used.

[0095] The speed at which the second extraction speed adjustment unit 17 extracts the heating resistor 2 from the first heating unit 1 can be adjusted by the second extraction speed controller 206e of the control unit 200, which will be described later.

[0096] The amount of heat-generating resistor 2 in the first heating unit 1 can be adjusted by adjusting the supply of the heat-generating resistor 2 to the first heating unit 1 by the second supply speed adjustment unit 13 and the removal of the heat-generating resistor 2 from the first heating unit 1 by the second removal speed adjustment unit 17.

[0097] -Second extraction speed sensor 19- The second extraction speed sensor 19 measures the extraction speed of the heat-generating resistor 2 by the second extraction speed adjustment unit 17. The second extraction speed sensor 19 is not particularly limited as long as it can accurately measure the extraction speed of the heat-generating resistor 2 by the second extraction speed adjustment unit 17; for example, a known flow sensor for solid particles can be used.

[0098] The extraction speed detection signal from the second extraction speed sensor 19 is suitably transmitted to the second extraction speed controller 206e of the control unit 200. The presence of the second extraction speed sensor 19 in the heat treatment apparatus 100 is preferable because it allows the second extraction speed controller 206e to provide feedback control over the extraction speed of the heating resistor 2.

[0099] -Control Unit 200- Figure 1B is a block diagram showing an example of a control unit of a heat treatment apparatus according to the first embodiment of the present disclosure.

[0100] The control unit 200 optimally controls each component of the heat treatment apparatus 100. For example, depending on the type of object to be processed 7, it controls each component based on processing recipe data 208 which consists of processing conditions such as the amount of current applied by the current circuit to the heating resistor 2, the temperature of the heating resistor 2, the speed at which the object to be processed 7 is supplied to the first heating unit 1 by the first supply speed adjustment unit 12, the speed at which the processed object 8 is removed from the first heating unit 1 by the first removal speed adjustment unit 16, the speed at which the heating resistor 2 is supplied to the first heating unit 1 by the second supply speed adjustment unit 13, and the speed at which the heating resistor 2 is removed from the first heating unit 1 by the second removal speed adjustment unit 17.

[0101] The control unit 200 includes, for example, a CPU (Central Processing Unit) 201, a memory 202, a display unit 203, an input / output unit 204, a communication unit 205, various controllers 206, and a storage unit 207.

[0102] --CPU201-- The CPU 201 reads various programs and data necessary for program execution from the storage unit 207 as needed and uses them.

[0103] --Memory 202-- Memory 202 is used for various processes performed by CPU 201.

[0104] --Display section 203-- The display unit 203 is a liquid crystal display that displays the operation screen, selection screen, etc., of the heat treatment apparatus 100.

[0105] --Input / output section 204-- The input / output unit 204 consists of an operation panel, keyboard, and other components for the operator to perform various operations such as inputting various data and outputting various data to a predetermined storage medium.

[0106] --Communications Department 205-- The communications unit 205 handles data exchange via networks and other means.

[0107] --Controller 206-- The various controllers 206 control various parts of the heat treatment apparatus 100. Examples of the various controllers 206 include a first temperature controller 206a, a first supply rate controller 206b, a second supply rate controller 206c, a first extraction rate controller 206d, and a second extraction rate controller 206e.

[0108] ---First temperature controller 206a--- The first temperature controller 206a controls the temperature of the heating resistor 2 in the first heating unit 1 by controlling the amount of current applied to the heating resistor 2 in the first heating unit 1. The first temperature controller 206a can use semiconductor-based phase control, semiconductor-based PWM (Pulse Width Modulation) control, etc. Furthermore, the first temperature controller 206a can take in the temperature detection signal from the temperature sensor 11 of the heating resistor 2 in the first heating unit 1 and feedback control the amount of current applied to the heating resistor 2 in the first heating unit 1 using PID (Proportional-Integral-Differential) control or on-off control. Among these, PID control is preferred for the first temperature controller 206a from the viewpoint of suppressing temperature overshoot in the heating resistor 2 in the first heating unit 1 and suppressing side reactions at high temperatures.

[0109] ---First supply rate controller 206b--- The first supply speed controller 206b controls the supply speed of the object to be processed 7 to the first heating unit 1 by the first supply speed adjustment unit 12. The first supply speed controller 206b receives the supply speed detection signal from the first supply speed sensor 14 and can feedback control the supply speed of the object to be processed 7 using PID control or on-off control.

[0110] ---Second supply rate controller 206c--- The second supply speed controller 206c controls the supply speed of the heating resistor 2 to the first heating unit 1 by the second supply speed adjustment unit 13. The second supply speed controller 206c receives the supply speed detection signal from the second supply speed sensor 15 and can feedback control the supply speed of the heating resistor 2 using PID control or on-off control.

[0111] ---First extraction speed controller 206d--- The first removal speed controller 206d controls the removal speed of the processed material 8 from the first heating unit 1 by the first removal speed adjustment unit 16. The first removal speed controller 206d receives the removal speed detection signal from the first removal speed sensor 18 and can feedback control the removal speed of the processed material 8 using PID control or on-off control.

[0112] ---Second extraction speed controller 206e--- The second extraction speed controller 206e controls the extraction speed of the heating resistor 2 from the first heating unit 1 by the second extraction speed adjustment unit 17. The second extraction speed controller 206e receives the extraction speed detection signal from the second extraction speed sensor 19 and can feedback control the extraction speed of the heating resistor 2 using PID control or on-off control.

[0113] --Storage section 207-- The memory unit 207 consists of a hard disk drive (HDD) and other components that store various programs executed by the CPU 201 and data necessary for program execution.

[0114] [Example of operation of the heat treatment apparatus 100 according to the first embodiment] Next, a specific example of the operation of the heat treatment apparatus 100 according to the first embodiment will be described. First, the material to be processed 7 is supplied from the material to be processed supply unit 5 into the first heating unit 1. At this time, the supply speed of the material to be processed 7 into the first heating unit 1 is adjusted by the first supply speed adjustment unit 12. The supply speed of the material to be processed 7 is measured by the first supply speed sensor 14, and the supply speed detection signal is transmitted to the first supply speed controller 206b of the control unit 200, where it is controlled.

[0115] The object to be processed 7 supplied into the first heating unit 1 comes into contact with the heat-generating resistor 2 and is heated. At this time, the temperature of the heat-generating resistor 2 is measured by the temperature sensor 11. The temperature detection signal from the temperature sensor 11 is suitably transmitted to the first temperature controller 206a of the control unit 200. Inside the first heating unit 1, the object to be processed 7 is heated and processed material 8 is generated.

[0116] If the temperature of the heating resistor 2 is not constant, the amount of current is adjusted by feedback control by the first temperature controller 206a of the control unit 200 so that the temperature of the heating resistor 2 becomes constant. Also, if the temperature of the heating resistor 2 is to be lowered or raised, the amount of current applied to the current input terminal 22 is adjusted so that the desired temperature is achieved by changing the input value to the input / output unit 204.

[0117] In the case of a batch reaction, the material removal unit 6 operates after a desired time has elapsed since the supply of the material to be processed 7. In the case of a continuous reaction, the material removal unit 6 operates together with the material supply unit 5. As a result, the material 8 is removed from the material removal unit 6. At this time, the first supply speed adjustment unit 12 adjusts the supply speed of the material to be processed 7 to the first heating unit 1, and the first removal speed adjustment unit 16 adjusts the removal speed of the material 8 from the first heating unit 1. The removal speed of the material 8 is measured by the first removal speed sensor 18, and the removal speed detection signal is transmitted to the first removal speed controller 206d of the control unit 200.

[0118] In a continuous reaction, if the supply rate of the material to be processed 7 exceeds the removal rate of the material to be processed 8, and the material to be processed 7 in the first heating unit 1 is about to overflow, feedback control is used to either slow down the supply rate of the material to be processed 7 with the first supply rate controller 206b, or increase the removal rate of the material to be processed 8 with the first removal rate controller 206d. This ensures that a certain amount of material to be processed 7 is in contact with the heating resistor 2.

[0119] In the series of reactions described above, the heat-generating resistor 2 is supplied to and removed from the first heating section 1 intermittently or continuously. For example, if the supply of the heat-generating resistor 2 from the heat-generating resistor supply section 3 and the removal of the heat-generating resistor 2 from the heat-generating resistor removal section 4 are stopped during the series of reactions, then when deterioration and / or coking of the heat-generating resistor 2 are detected, the supply of the heat-generating resistor 2 from the heat-generating resistor supply section 3 and the removal of the heat-generating resistor 2 from the heat-generating resistor removal section 4 are started, and the heat-generating resistor 2 in the first heating section 1 is replaced with a heat-generating resistor 2 that is not deteriorated and / or coked. This allows the heat treatment apparatus 100 to operate continuously and stably. This can be done by the operator changing the input value to the input / output section 204 to stop or start the supply and removal of the heat-generating resistor 2.

[0120] As another example, if the supply of heat-generating resistors 2 from the heat-generating resistor supply unit 3 and the removal of heat-generating resistors 2 from the heat-generating resistor removal unit 4 are performed continuously during a series of reactions, deterioration and / or coking of the heat-generating resistors 2 can be prevented, and the heat treatment apparatus 100 can be operated continuously and stably.

[0121] When replacing the heating resistor 2 within the first heating unit 1, the supply speed of the heating resistor 2 to the first heating unit 1 is adjusted by the second supply speed adjustment unit 13. The supply speed of the heating resistor 2 is measured by the second supply speed sensor 15, and the supply speed detection signal is transmitted to the second supply speed controller 206c of the control unit 200 for control. In addition, the removal speed of the heating resistor 2 from the first heating unit 1 is adjusted by the second removal speed adjustment unit 17. The removal speed of the heating resistor 2 from the first heating unit 1 is measured by the second removal speed sensor 19, and the removal speed detection signal is transmitted to the second removal speed controller 206e of the control unit 200 for control.

[0122] These operations can be stored in the memory unit 207, and the desired reaction conditions can be read from the memory unit 207 and used as appropriate.

[0123] In this way, the heat treatment apparatus 100 according to the first embodiment can operate stably for a long time, efficiently thermally decompose the object to be treated 7, and prevent deterioration due to heat.

[0124] <Second Embodiment> Figure 2 is a schematic cross-sectional view showing an example of a heat treatment apparatus according to the second embodiment of the present disclosure. The heat treatment apparatus according to the second embodiment of the present disclosure differs from the heat treatment apparatus according to the first embodiment in that it comprises a first electrode 20A arranged inside the first heating section 1 so as to be in contact with a heating resistor 2, and a second electrode 20B that is electrically connected to the first electrode 20A via the heating resistor 2 without directly contacting the first electrode 20A. The heat treatment apparatus according to the second embodiment of the present disclosure preferably further comprises a power supply 21, and may further comprises other components as needed.

[0125] <<First electrode 20A, second electrode 20B, and power supply 21>> The first electrode 20A is positioned inside the first heating section 1 so as to be in contact with the heating resistor 2, and is electrically connected to the second electrode 20B via the heating resistor 2. Preferably, the first electrode 20A is positioned to penetrate from outside the first heating section 1 into the interior of the first heating section 1 in the Y-axis direction, and is positioned so as to be in contact with the heating resistor 2 inside the first heating section 1.

[0126] The second electrode 20B is positioned to be electrically connected to the first electrode 20A via the heating resistor 2. Preferably, the second electrode 20B is positioned to form the outer circumference of the first heating section 1, to be in contact with the heating resistor 2 inside the first heating section 1, and not to be in direct contact with the first electrode 20A, thereby being electrically connected to the first electrode 20A via the heating resistor 2.

[0127] The power supply 21 applies current to the first electrode 20A and the second electrode 20B. The power supply 21 is located outside the first heating unit 1 and is electrically connected to the first electrode 20A and the second electrode 20B, respectively.

[0128] There are no particular restrictions on the materials used for the electrical connection between the power supply 21 and the first electrode 20A and the second electrode 20B, but it is preferable to use materials that have conductivity and sliding properties. For example, carbon brushes commonly used in motors (e.g., manufactured by Fuji Carbon Manufacturing Co., Ltd.), ceramics, metals, etc., can be used.

[0129] The current applied to the first electrode 20A and the second electrode 20B may be a direct current or an alternating current. However, from the viewpoint of minimizing energy consumption during temperature control, it is preferable to use the AC current without rectification when using commercial power.

[0130] There are no particular restrictions on the maximum current applied to the heating resistor 2 through the first electrode 20A and the second electrode 20B. It can be appropriately selected depending on the desired temperature in the first heating section 1, the density of the heating resistor 2 in the first heating section 1, the particle size of the heating resistor 2, etc. In order to bring the heating resistor 2 to the desired temperature, it is necessary to increase the maximum current. On the other hand, in order to suppress the deterioration of the heating resistor 2 and prevent the heating resistor 2 from burning out, it is necessary to decrease the maximum current.

[0131] <<Other components>> Other components are not particularly limited as long as they do not impair the effects of the heat treatment apparatus according to the second embodiment of this disclosure, and examples include the current introduction terminal 22 and the insulating part 23.

[0132] -Current introduction terminal 22 and insulating part 23- The current input terminal 22 is electrically connected to the first electrode 20A and the second electrode 20B.

[0133] The current input terminal 22 can be appropriately selected from known types, for example, a known current input terminal such as a field-through terminal (manufactured by Cosmo-Tech Co., Ltd.) can be used.

[0134] The number of current input terminals 22 is two or more. For example, it is preferable that the current input terminals 22 be located on the portion of the first electrode 20A that is outside the first heating section 1, and on the second electrode 20B.

[0135] Furthermore, for safety reasons, an insulator of a known material may be placed around the first electrode 20A and the second electrode 20B, as long as it does not interfere with the electrical connection between the power supply 21 and the current input terminal 22, and this insulator may also serve as the exterior of the heat treatment apparatus 100. At a minimum, it is preferable that the first electrode 20A and the second electrode 20B are insulated from each other, and an insulating portion 23 can be provided. For example, if the first electrode 20A is positioned on the first surface 1a of the first heating section 1 so as to penetrate from the outside of the first heating section 1 to the inside of the first heating section 1 in the Y-axis direction, and the second electrode 20B constitutes the outer circumference of the first heating section 1, it is preferable that the insulating portion 23 be placed on the inner surface of the portion where the first electrode 20A penetrates the second electrode 20B and on the inner surface of the portion of the second electrode 20B corresponding to the second surface 1b of the first heating section 1. It is preferable to arrange an insulating portion 23 around the portion where the first electrode 20A penetrates the second electrode 20B. Furthermore, it is preferable to arrange an insulating portion 23 around the entire inner surface of the second electrode 20B, except for openings such as the opening connected to the heating resistor extraction portion 4, so that the second electrode 20B and the heating resistor 23 do not come into contact on the first surface 1b. With this configuration, current can be efficiently supplied to the heating resistor 2.

[0136] [Example of operation of the heat treatment apparatus 100 according to the second embodiment] Next, a specific example of the operation of the heat treatment apparatus 100 according to the second embodiment will be described, highlighting the differences from the heat treatment apparatus 100 according to the first embodiment. When the power supply 21 is turned on and current is applied to the first electrode 20A and the second electrode 20B, current flows between the first electrode 20A, the second electrode 20B, and the heating resistor 2. This heats up the heating resistor 2. When the object to be processed 7 comes into contact with the heated heating resistor 2, a decomposition reaction occurs in the object to be processed 7, and the processed material 8 is generated.

[0137] In the heat treatment apparatus 100 according to the second embodiment, the control unit 200 also has the same configuration as the control unit of the heat treatment apparatus according to the first embodiment (see Figure 1B). In the heat treatment apparatus 100 according to the second embodiment, the first temperature controller 206a controls the amount of current applied to the heating resistor 2 in the first heating unit 1, as well as the amount of current applied to the first electrode 20A and the second electrode 20B.

[0138] In this way, the heat treatment apparatus 100 according to the second embodiment can more efficiently thermally decompose the material to be treated 7.

[0139] <Third Embodiment> Figure 3A is a schematic cross-sectional view showing an example of a heat treatment apparatus according to the third embodiment of this disclosure. The heat treatment apparatus according to the third embodiment of this disclosure differs from the heat treatment apparatus according to the first embodiment in that it further comprises an inert gas supply unit 30. Furthermore, the heat treatment apparatus according to the third embodiment of this disclosure may further comprise other components related to the inert gas supply unit 30.

[0140] Furthermore, the heat treatment apparatus according to the third embodiment may also be the heat treatment apparatus according to the second embodiment, further comprising an inert gas supply unit 30.

[0141] <<Inert gas supply unit 30>> The inert gas supply unit 30 is connected to the first heating unit 1 and supplies inert gas 31 to the first heating unit 1.

[0142] In this disclosure, "connecting" the inert gas supply unit 30 to the first heating unit 1 means that the inside of the inert gas supply unit 30 and the inside of the first heating unit 1 are in communication so that the inert gas 31 can pass through them.

[0143] There are no particular restrictions on the material of the inert gas supply unit 30; for example, it can be appropriately selected from the same materials as the first heating unit 1, depending on the purpose.

[0144] The shape, structure, and size of the inert gas supply unit 30 are not particularly limited as long as it can be connected to the first heating unit 1 and supply inert gas 31 to the first heating unit 1. They can be appropriately selected according to the purpose, for example, a cylindrical shape or a rectangular parallelepiped. Furthermore, if a part of the first heating unit 1 has an opening, this opening can also be used as the inert gas supply unit 30.

[0145] There are no particular restrictions on the position of the inert gas supply unit 30, as long as it can be connected to the first heating unit 1, and it can be appropriately selected according to the type of object to be processed 7. In Figure 3A, the inert gas supply unit 30 is shown to be placed on the side surface of the first heating unit 1 near the first surface 1a of the first heating unit 1, but the inert gas supply unit 30 may be placed at any position on the side surface of the first heating unit 1, on the first surface 1a of the first heating unit 1, or on the second surface 1b of the first heating unit 1.

[0146] Note that the material to be processed supply unit 5 and the inert gas supply unit 30 may be the same. That is, a single component located at the same position may be both the material to be processed supply unit 5, which supplies the material to be processed 7 to the first heating unit 1, and the inert gas supply unit 30, which supplies the inert gas 31 to the first heating unit 1. In this case, both the first supply speed adjustment unit 12 and the inert gas supply speed adjustment unit 32, which will be described later, are a single component located at the same position.

[0147] -Inert gas 31- There are no particular restrictions on the type of inert gas used; it can be appropriately selected depending on the purpose. Examples include nitrogen gas, argon gas, and water vapor. These may be used individually or in combination of two or more.

[0148] <<Other components>> The heat treatment apparatus 100 according to the third embodiment of this disclosure may also have other components, such as an inert gas supply rate adjustment unit 32 and an inert gas supply rate sensor 33, and the controller 206 of the control unit 200 may have an inert gas supply rate controller 206f.

[0149] -Inert gas supply rate adjustment unit 32- The inert gas supply rate adjustment unit 32 adjusts the supply rate at which the inert gas supply unit 30 supplies inert gas 31 to the first heating unit 1, or stops the supply of inert gas 31 to the first heating unit 1 by the inert gas supply unit 30.

[0150] For example, a known pump, a cock, or the like can be used as the inert gas supply rate adjustment unit 32.

[0151] The rate at which the inert gas 31 is supplied to the first heating unit 1 by the inert gas supply rate adjustment unit 32 can be adjusted by the controller 206 of the control unit 200 using the inert gas supply rate controller 206f.

[0152] -Inert gas supply rate sensor 33- The inert gas supply rate sensor 33 measures the supply rate of the inert gas 31 by the inert gas supply rate adjustment unit 32. The inert gas supply rate sensor 33 is not particularly limited as long as it can accurately measure the supply rate of the inert gas 31 by the inert gas supply rate adjustment unit 32; for example, a known flow sensor for liquids or gases can be used.

[0153] -Control Unit 200- Figure 3B is a block diagram showing an example of the control unit of a heat treatment apparatus according to the third embodiment of this disclosure. The control unit 200 of the heat treatment apparatus according to the third embodiment differs from the control unit 200 of the heat treatment apparatus according to the first embodiment in that the controller 206 has an inert gas supply rate controller 206f.

[0154] --Inert gas supply rate controller 206f-- The inert gas supply rate controller 206f controls the supply rate of the inert gas 31 by the inert gas supply rate adjustment unit 32. The inert gas supply rate controller 206f receives the inert gas supply rate detection signal from the inert gas supply rate sensor 33 and can feedback control the amount of inert gas 31 supplied by PID control or on-off control.

[0155] [Example of operation of the heat treatment apparatus 100 according to the third embodiment] Next, a specific example of the operation of the heat treatment apparatus 100 according to the third embodiment will be described, highlighting the differences from the heat treatment apparatus 100 according to the first or second embodiment. Inert gas 31 is supplied from the inert gas supply unit 30 into the first heating unit 1. At this time, the inert gas supply rate adjustment unit 32 adjusts the supply rate of the inert gas 31 into the first heating unit 1. The supply rate of the inert gas 31 is measured by the inert gas supply rate sensor 33, and the inert gas supply rate detection signal is transmitted to the inert gas supply rate controller 206f of the control unit 200 for control.

[0156] The timing of starting or stopping the supply of inert gas 31, the supply amount, and the supply speed can be controlled by the operator by changing the input values ​​to the input / output unit 204. Furthermore, if the measured value obtained by the inert gas supply speed sensor 33 indicates that the supply speed of inert gas 31 differs from the input value, the inert gas supply speed controller 206f provides feedback control to adjust the supply of a constant amount of inert gas 31 into the first heating unit 1 according to the input value.

[0157] The inert gas 31 supplied into the first heating section 1 generates turbulence in the material to be processed 7 and the heat-generating resistor 2. As a result, the heat-generating resistor 2 becomes a jet layer, the material to be processed 7 comes into contact with the heat-generating resistor 2 at a high frequency, and the production efficiency of the processed material 8 is further improved.

[0158] Therefore, in the heat treatment apparatus 100 according to the third embodiment, for the purpose of forming a jet layer, it is preferable that the heat-generating resistor 2 is supplied intermittently from the heat-generating resistor supply unit 3 to the first heating unit 1 at desired timings and intermittently removed from the heat-generating resistor removal unit 4.

[0159] The inert gas 31 supplied into the first heating section 1 may be discharged from the material removal section 6 to the outside of the first heating section 1 along with the removal of the material 8 from the material removal section 6, or it may be discharged from the heat-generating resistor removal section 4 to the outside of the first heating section 1 along with the removal of the heat-generating resistor 2 from the heat-generating resistor removal section 4, or it may be discharged from both the material removal section 6 and the heat-generating resistor removal section 4.

[0160] The discharge rate of the inert gas 31 from the processed material removal unit 6 is adjusted by the first removal rate adjustment unit 16 along with the removal rate of the processed material 8 from the first heating unit 1. The removal rates of the processed material 8 and the inert gas 31 are measured by the first removal rate sensor 18, and the removal rate detection signal is transmitted to the first removal rate controller 206d of the control unit 200 for control.

[0161] The discharge rate of the inert gas 31 from the processed material removal section 6 is adjusted by the second removal rate adjustment section 17 together with the removal rate of the heating resistor 2 from the first heating section 1. The removal rates of the heating resistor 2 and the inert gas 31 are measured by the second removal rate sensor 19, and the removal rate detection signal is transmitted to the second removal rate controller 206e of the control unit 200. In this case, it is preferable that the heat treatment apparatus 100 according to the third embodiment has both a flow rate sensor for solid particles and a flow rate sensor for gases in the second removal rate sensor 19.

[0162] In this way, the heat treatment apparatus 100 according to the third embodiment can further efficiently thermally decompose the material to be treated 7.

[0163] <Fourth Embodiment> Figure 4A is a schematic cross-sectional view showing an example of a heat treatment apparatus according to the fourth embodiment of this disclosure. The heat treatment apparatus according to the fourth embodiment of this disclosure differs from the heat treatment apparatus according to the first embodiment in that it further comprises a transport unit 40 for transporting the heat-generating resistor 2 from the heat-generating resistor extraction unit 4 to the heat-generating resistor supply unit 3. Furthermore, the heat treatment apparatus according to the fourth embodiment of this disclosure may further comprise other components related to the transport unit 40.

[0164] Furthermore, the heat treatment apparatus according to the fourth embodiment may be the heat treatment apparatus according to the second embodiment or the heat treatment apparatus according to the third embodiment, further comprising a transport unit 40.

[0165] <<Conveying section 40>> The transport unit 40 transports the heat-generating resistor 2 from the heat-generating resistor extraction unit 4 to the heat-generating resistor supply unit 3. In Figure 4A, the transport direction of the heat-generating resistor 2 is indicated by an arrow. Preferably, the transport unit 40 has a transport channel and a transport means.

[0166] -Conveyor channel- The transport channel is the channel for the heat-generating resistor 2 and constitutes the exterior of the transport section 40. There are no particular restrictions on the material of the transport section 40, and it can be appropriately selected according to the type of transport means, but it is preferable that it has heat resistance, and for example, it can be appropriately selected from the same materials as the first heating section 1, depending on the purpose.

[0167] The shape, structure, and size of the transport channel are not particularly limited as long as they can transport the heat-generating resistor 2, and examples include cylindrical, rectangular parallelepiped, or a combination thereof. Furthermore, the size of the transport channel is not particularly limited as long as it has a length and inner diameter that can transport the heat-generating resistor 2 from the heat-generating resistor extraction section 4 to the heat-generating resistor supply section 3.

[0168] -Conveying means- There are no particular restrictions on the means used to transport the heat-generating resistor 2 by the transport unit 40, and they can be appropriately selected according to the purpose. Examples include transport gas, screw conveyors, bucket conveyors, and vacuum conveyors. Furthermore, if there is a part within the transport unit 40 that transports the heat-generating resistor 2 in the direction of gravity, the heat-generating resistor 2 may be transported by gravity without providing any special transport means.

[0169] When the transport path of the transport unit 40 is divided in the order of transport into a region 40A for taking out the heat-generating resistor 2 taken out from the heat-generating resistor extraction unit 4 in the Y-axis direction, a region 40B for transporting the heat-generating resistor 2 from region 40A in the X-axis direction, a region 40C for transporting the heat-generating resistor 2 from region 40B in the Y-axis direction, and a region 40D for transporting the heat-generating resistor 2 from region 40C to the heat-generating resistor supply unit 3 in the X-axis direction, the transport means for regions 40A, 40B, 40C, and 40D may all be the same, or two or more regions may be different. When two or more regions have different transport means, the means for transporting the heat-generating resistor 2 may be used individually or two or more may be used in combination.

[0170] Furthermore, the transport path of the transport unit 40 does not necessarily consist of four regions: region 40A, region 40B, region 40C, and region 40D. For example, if the heat-generating resistor extraction unit 4 is located on the side of the first heating unit 1, region 40A, which extracts the heat-generating resistor 2 in the Y-axis direction, becomes unnecessary, and the heat-generating resistor extraction unit 4 and region 40B, which transports the heat-generating resistor 2 in the X-axis direction, can be directly connected. In this way, the transport path of the transport unit 40 can consist of one or more regions depending on the arrangement of each part.

[0171] --Transport gas-- When using a conveying gas as a conveying means, the gas used may be the inert gas 31 discharged from the heat-generating resistor extraction section 4, or a gas generator may be placed in one or more locations within the conveying section 40 to generate the conveying gas. Alternatively, the inert gas 31 may be used as the conveying gas, and a gas generator may be placed in one or more locations within the conveying section 40.

[0172] Within the transport section 40, possible locations for the gas generator include, but are not limited to, the outlet of the heat-generating resistor extraction section 4, the space between region 40A and region 40B, the space between region 40B and region 40C, and the space between region 40C and region 40D.

[0173] There are no particular restrictions on the type of conveying gas, as long as it does not affect the properties of the heat-generating resistor 2. It can be appropriately selected according to the purpose, for example, inert gases such as nitrogen gas and argon gas. Furthermore, if the temperature of the heat-generating resistor 2 is kept below 150°C during conveying, the conveying gas may be air.

[0174] -Screw Conveyor- When using a screw conveyor as a means of transport, there are no particular restrictions on the material of the screw conveyor, but it is preferable that it be made of a heat-resistant material. For example, it can be appropriately selected from the same material as the first heating section 1, depending on the purpose.

[0175] When using a screw conveyor as a means of transport, there are no particular restrictions on the shape, structure, and size of the screw conveyor, as long as it can transport the heat-generating resistor 2. It can be appropriately selected from known screw conveyors used for transporting powders. An example of a known screw conveyor is the Sanitary Screw Conveyor U-Trough Type (manufactured by Fukuchi Sangyo Co., Ltd.).

[0176] -Bucket conveyor- When using a bucket conveyor as a means of transport, there are no particular restrictions on the material of the bucket conveyor, but it is preferable that it be made of a heat-resistant material. For example, it can be appropriately selected from the same material as the first heating section 1, depending on the purpose.

[0177] When using a bucket conveyor as a means of transport, there are no particular restrictions on the shape, structure, and size of the bucket conveyor, as long as it can transport the heat-generating resistor 2, and it can be appropriately selected from known bucket conveyors used for transporting powders. Examples of known bucket conveyors include NFV Flight Bear, BLF Flight Bear, PA Pivot Bear, LC Flow (all manufactured by Tsubakimoto Chain Co., Ltd.), SB type Snecon, and SBP type Snecon (products of ESTEC Co., Ltd.).

[0178] -Vacuum conveyor- When using a vacuum conveyor as a means of transport, there are no particular restrictions on the material of the vacuum conveyor, but it is preferable that it be made of a heat-resistant material. For example, it can be appropriately selected from the same material as the first heating section 1, depending on the purpose.

[0179] When using a vacuum conveyor as a means of transport, there are no particular restrictions on the shape, structure, and size of the vacuum conveyor, as long as it can transport the heat-generating resistor 2. It can be appropriately selected from known vacuum conveyors used for transporting powders. Examples of known vacuum conveyors include the piFLOW® series (manufactured by piab) and the VS series (manufactured by Volkmann).

[0180] Specific examples of the conveying section include, for example, a method in which, in the Y-axis direction, the heat-generating resistor 2 is taken out from the heat-generating resistor extraction section 4 together with the inert gas 31, the heat-generating resistor 2 is conveyed in region 40A by the inert gas 31, a gas generator is placed between region 40A and region 40B, the heat-generating resistor 2 is conveyed from region 40A to region 40B by the inert gas 31 and the conveying gas generated by the gas generator, the heat-generating resistor 2 is conveyed from region 40C to region 40D by a screw conveyor, a gas generator is placed between region 40C and region 40D, and the heat-generating resistor 2 that was conveyed by the screw conveyor in region 40C is conveyed to the heat-generating resistor supply section 3 by the conveying gas. Thus, the conveying means may be used in appropriate combinations depending on the purpose.

[0181] <<Other components>> Other components are not particularly limited as long as they do not impair the effects of the heat treatment apparatus according to the fourth embodiment of this disclosure. For example, the controller 206 of the control unit 200 may have a transport speed controller 206g. The heat treatment apparatus according to the fourth embodiment may also have a storage section in any area of ​​the transport section 40 for temporarily storing the heat-generating resistors 2 taken out from the first heating section 1 before transporting them to the heat-generating resistor supply section 3.

[0182] -Control Unit 200- Figure 4B is a block diagram showing an example of a control unit of a heat treatment apparatus according to the fourth embodiment of this disclosure. The control unit 200 of the heat treatment apparatus according to the fourth embodiment differs from the control unit 200 of the heat treatment apparatus according to the first embodiment in that it has a transport speed controller 206g.

[0183] --Conveyor speed controller 206g-- The transport speed controller 206g controls the transport speed of the heat-generating resistor 2 by the transport unit 40. The transport speed controller 206g receives the extraction speed detection signal from the second extraction speed sensor 19 and the supply speed detection signal from the second supply speed sensor 15, and can feedback control the transport speed of the heat-generating resistor 2 using PID control or on-off control.

[0184] [Example of operation of the heat treatment apparatus 100 according to the fourth embodiment] Next, a specific example of the operation of the heat treatment apparatus 100 according to the fourth embodiment will be described, highlighting the differences from the heat treatment apparatus 100 according to the first, second, or third embodiment. The heating resistor 2 is transported by the transport unit 40 from the heating resistor removal unit 4 to the heating resistor supply unit 3. At this time, the second removal speed adjustment unit 17 adjusts the removal speed of the heating resistor 2 from the first heating unit 1 to the transport unit 40. The second supply speed adjustment unit 13 also adjusts the supply speed of the heating resistor 2 from the transport unit 40 to the first heating unit 1. The removal speed of the heating resistor 2 is measured by the second removal speed sensor 19, and the heating resistor removal speed detection signal is transmitted to the second removal speed controller 206e and the transport speed controller 206g of the control unit 200. Furthermore, the supply speed of the heat-generating resistor 2 is measured by the second supply speed sensor 15, and the heat-generating resistor removal speed detection signal is transmitted to the second supply speed controller 206c and the transport speed controller 206g of the control unit 200.

[0185] The transport speed of the heat-generating resistor 2 in the transport section 40 by the transport speed controller 206g may be controlled collectively for the transport speeds of the heat-generating resistor 2 in regions 40A, 40B, 40C, and 40D, or the transport speeds of the heat-generating resistor 2 in regions 40A, 40B, 40C, and 40D may be controlled individually.

[0186] In this way, the heat treatment apparatus 100 according to the fourth embodiment can reuse the heat-generating resistor 2 used in the first heating unit 1, and can operate more efficiently, inexpensively, and stably for a long period of time.

[0187] <Fifth Embodiment> Figure 5A is a schematic cross-sectional view showing an example of a heat treatment apparatus according to the fifth embodiment of the present disclosure. The heat treatment apparatus according to the fifth embodiment of the present disclosure differs from the heat treatment apparatus according to the first embodiment in that it further comprises a second heating unit 50 for heating carbon attached to the heating resistor 2, a first transport unit 51 for transporting the heating resistor 2 from the heating resistor removal unit 4 to the second heating unit 50, and a second transport unit 52 for transporting the heating resistor 2 from the second heating unit 50 to the heating resistor supply unit 3. Furthermore, the heat treatment apparatus according to the fifth embodiment may further include other components related to the second heating unit 50, the first transport unit 51, and the second transport unit 52 as needed.

[0188] Furthermore, the heat treatment apparatus according to the fifth embodiment may be the heat treatment apparatus according to the second embodiment, the heat treatment apparatus according to the third embodiment, or the heat treatment apparatus according to the fourth embodiment, further comprising a second heating unit 50, a first transport unit 51, and a second transport unit 52.

[0189] <<Second heating section 50>> The second heating unit 50 heats the carbon adhering to the heat-generating resistor 2. More specifically, the second heating unit 50 heats the heat-generating resistor 2, which is placed inside the second heating unit 50, thereby heating and removing the carbon adhering to the heat-generating resistor 2. Therefore, the heat treatment apparatus 100 according to the fifth embodiment can be suitably used when a material 7 that is easily caulked to the heat-generating resistor 2 is used, for example, when the material 7 is made of plastic.

[0190] The material of the second heating section 50 is not particularly limited as long as it is stable in terms of surface temperature and atmosphere on the inside of the second heating section 50, that is, on the side of the second heating section 50 that houses the heat-generating resistor 2. It can be appropriately selected from the same materials as the first heating section 1, depending on the purpose.

[0191] The shape, structure, and size of the second heating section 50 are not particularly limited, as long as they are capable of accommodating the heat-generating resistor 2.

[0192] Examples of the shape of the second heating section 50 include cylindrical, rectangular, tapered, and polygonal columnar shapes.

[0193] The temperature of the heat-generating resistor 2 in the first heating section 1 and the temperature of the heat-generating resistor 2 in the second heating section 50 may be the same or different.

[0194] The temperature inside the second heating section 50 is preferably 500°C to 1,000°C, and more preferably 600°C to 950°C, from the viewpoint of heating and removing carbon derived from the plastic attached to the heating resistor 2.

[0195] <<First transport section 51>> The first transport unit 51 transports the heat-generating resistor 2 from the heat-generating resistor removal unit 4 to the second heating unit 50. In Figure 5A, the transport direction of the heat-generating resistor 2 is indicated by an arrow. The first transport unit 51 preferably has a transport channel, and more preferably has a transport passage and transport means. The transport channel and transport means can be the same as those used in the transport unit 40 in the heat treatment apparatus 100 according to the fourth embodiment.

[0196] Furthermore, if the first transport unit 51 has only a transport passage, the heating resistor 2 may be configured to fall from the heating resistor removal unit 4 through the first transport unit 51 by its own weight and be transported to the second heating unit 50.

[0197] <<Second transport section 52>> The second transport unit 52 transports the heat-generating resistor 2 from the second heating unit 50 to the heat-generating resistor supply unit 3. In Figure 5A, the transport direction of the heat-generating resistor 2 is indicated by an arrow. The second transport unit 52 preferably has a transport passage and a transport means. The transport passage and transport means can be the same as those used in the transport unit 40 in the heat treatment apparatus 100 according to the fourth embodiment.

[0198] When the transport path of the second transport unit 52 is divided into three regions in order of transport: a region 52A for transporting the heating resistor 2 from the second heating unit 50 in the X-axis direction, a region 52B for transporting the heating resistor 2 from region 52A in the Y-axis direction, and a region 52C for transporting the heating resistor 2 from region 52B to the heating resistor supply unit 3 in the X-axis direction, the transport means for regions 52A, 52B, and 52C may all be the same, or two or more regions may be different. When two or more regions have different transport means, the means for transporting the heating resistor 2 described above may be used individually or two or more may be used in combination.

[0199] Furthermore, the transport path of the second transport unit 52 does not necessarily consist of three regions 52A, 52B, and 52C, but can have one or more regions depending on the arrangement of each unit.

[0200] <<Other components>> The heat treatment apparatus 100 according to the fifth embodiment of the present disclosure may have other components, for example, a second heating unit 50 which may have a temperature measuring sensor 11, similar to the first heating unit 1, and may also have a second transport speed adjustment unit 53 and a second transport speed sensor 54, and a control unit 200 which may have a second temperature controller 206h, a first transport speed controller 206i, and a second transport speed controller 206j.

[0201] -Temperature sensor 11- Preferably, the heat treatment apparatus 100 includes a temperature sensor 11 for measuring the temperature of the heat-generating resistor 2 in the second heating section 50, in addition to the temperature sensor 11 for measuring the temperature of the heat-generating resistor 2 in the first heating section 1. The temperature detection signal from the temperature sensor 11 in the second heating section 50 is preferably transmitted to the second temperature controller 206h of the control unit 200. It is preferable for the heat treatment apparatus 100 to have a temperature sensor 11 in the second heating section 50 because the second temperature controller 206h can provide feedback control of the temperature of the heat-generating resistor 2.

[0202] -Second transport speed adjustment unit 53- The second transport speed adjustment unit 53 adjusts the transport speed at which the second transport unit 52 transports the heat-generating resistor 2 from the second heating unit 50 to the heat-generating resistor supply unit 3, or stops the second transport unit 52 from transporting the heat-generating resistor 2 from the second heating unit 50 to the heat-generating resistor supply unit 3.

[0203] For the second transport speed adjustment unit 53, for example, a known pump, a cock, etc., can be used.

[0204] The speed at which the second transport unit 52 transports the heat-generating resistor 2 can be adjusted by the second transport speed controller 206j of the control unit 200, which will be described later.

[0205] -Second transport speed sensor 54- The second transport speed sensor 54 measures the transport speed of the heat-generating resistor 2 by the second transport speed adjustment unit 53. The second transport speed sensor 54 is not particularly limited as long as it can accurately measure the transport speed of the heat-generating resistor 2 by the second transport speed adjustment unit 53; for example, a known flow sensor for solid particles can be used.

[0206] The supply speed detection signal from the second transport speed sensor 54 is suitably transmitted to the second transport speed controller 206j of the control unit 200. The presence of the second transport speed sensor 54 in the heat treatment apparatus 100 is preferable because it allows the second transport speed controller 206j to provide feedback control of the transport speed of the heating resistor 2 by the second transport speed adjustment unit 53.

[0207] -Control Unit 200- Figure 5B is a block diagram showing an example of a control unit of a heat treatment apparatus according to the fifth embodiment of this disclosure. The control unit 200 of the heat treatment apparatus according to the fifth embodiment differs from the control unit 200 of the heat treatment apparatus according to the first embodiment in that it has a second temperature controller 206h, a first transport speed controller 206i, and a second transport speed controller 206j.

[0208] --Second temperature controller 206h-- The second temperature controller 206h controls the temperature of the heating resistor 2 in the second heating unit 50 by controlling the amount of current applied to the heating resistor 2 in the second heating unit 50. The second temperature controller 206h can use semiconductor-based phase control, semiconductor-based PWM control, etc. Furthermore, the second temperature controller 206h can take in the temperature detection signal from the temperature sensor 11 of the heating resistor 2 in the second heating unit 50 and feedback control the amount of current applied to the heating resistor 2 in the second heating unit 50 using PID control or on-off control. Among these, PID control is preferred for the second temperature controller 206h from the viewpoint of suppressing temperature overshoot in the heating resistor 2 in the second heating unit 50 and suppressing side reactions at high temperatures.

[0209] --First transport speed controller 206i-- The first transport speed controller 206i controls the transport speed of the heating resistor 2 by the first transport unit 51. The first transport speed controller 206i receives the extraction speed detection signal from the second extraction speed sensor 19 and can feedback control the transport speed of the heating resistor 2 using PID control or on-off control.

[0210] --Second transport speed controller 206j-- The second transport speed controller 206j controls the transport speed of the heating resistor 2 by the second transport unit 52. The second transport speed controller 206j receives the transport speed detection signal from the second transport speed sensor 54 and can feedback control the transport speed of the heating resistor 2 using PID control or on-off control.

[0211] [Example of operation of the heat treatment apparatus 100 according to the fifth embodiment] Next, we will explain specific examples of the operation of the heat treatment apparatus 100 according to the fifth embodiment, and how it differs from the heat treatment apparatus according to the first embodiment, the second embodiment, the third embodiment, or the fourth embodiment.

[0212] In the heat treatment apparatus 100 according to the fifth embodiment, the heat-generating resistor 2 removed from the heat-generating resistor removal unit 4 is transported to the second heating unit 50 by the first transport unit 51. At this time, the removal speed of the heat-generating resistor 2 is adjusted by the second removal speed adjustment unit 17 and measured by the second removal speed sensor 19, and the removal speed detection signal is transmitted to the first removal speed controller 206d of the control unit 200. The transport speed of the heat-generating resistor 2 to the second heating unit 50 by the first transport unit 51 is controlled by the transport speed detection signal being transmitted to the first transport speed controller 206i of the control unit 200.

[0213] The heat-generating resistor 2 is heated in the second heating section 50. If the heat-generating resistor 2 develops coking in the first heating section 1, the coking is heated and removed in the second heating section 50. In the second heating section 50, the temperature of the heat-generating resistor 2 is measured by the temperature sensor 11. The temperature detection signal from the temperature sensor 11 is transmitted to the second temperature controller 206h of the control unit 200, and the temperature in the second heating section 50 is controlled. The heat-generating resistor 2, from which the coking has been removed in the second heating section 50, is transported to the heat-generating resistor supply section 3 by the second transport section 52. At this time, the transport speed of the heat-generating resistor 2 is adjusted by the second transport speed adjustment section 53, measured by the second transport speed sensor 54, and the transport speed detection signal is transmitted to the second transport speed controller 206j of the control unit 200 for control.

[0214] The heating resistor 2 is supplied to the first heating unit 1 at a rate adjusted by the second supply rate adjustment unit 13, measured by the second supply rate sensor 15, and the supply rate detection signal is transmitted to the second supply rate controller 206c of the control unit 200 for control. The heating resistor 2 supplied into the first heating unit 1 then heats the object to be processed 7 again within the first heating unit 1.

[0215] Thus, the heat treatment apparatus 100 according to the fifth embodiment can remove the coking from the heat-generating resistor 2, allowing it to operate stably for an even longer period of time, efficiently thermally decompose the material to be treated, and prevent deterioration due to heat.

[0216] <Sixth Embodiment> Figure 6A is a schematic cross-sectional view showing an example of a heat treatment apparatus according to the sixth embodiment of the present disclosure. The heat treatment apparatus according to the sixth embodiment of the present disclosure differs from the heat treatment apparatus according to the fifth embodiment in that it further comprises a gas supply unit 60 connected to the second heating unit 50 and supplying a gas 62 containing oxygen to the second heating unit 50, and a gas discharge unit 61 connected to the second heating unit 50 and discharging a gas 63 containing carbon dioxide from the second heating unit 50. Furthermore, the heat treatment apparatus according to the sixth embodiment may further comprise other components related to the gas supply unit 60 or the gas discharge unit 61 as needed.

[0217] Furthermore, the heat treatment apparatus according to the sixth embodiment may also include a gas supply unit 60 and a gas discharge unit 61 when the heat treatment apparatus according to the second embodiment, the heat treatment apparatus according to the third embodiment, or the heat treatment apparatus according to the fourth embodiment is applied to the heat treatment apparatus according to the fifth embodiment.

[0218] <<Gas supply unit 60>> The gas supply unit 60 is connected to the second heating unit 50 and supplies oxygen-containing gas 62 to the second heating unit 50.

[0219] In this disclosure, "connection" of the gas supply unit 60 to the second heating unit 50 means that the inside of the gas supply unit 60 and the inside of the second heating unit 50 are in communication so that an oxygen-containing gas 62 can pass through them.

[0220] There are no particular restrictions on the material of the gas supply unit 60; for example, it can be appropriately selected from the same materials as the second heating unit 50, depending on the purpose.

[0221] The shape, structure, and size of the gas supply unit 60 are not particularly limited as long as it can be connected to the second heating unit 50 and supply oxygen-containing gas 62 to the second heating unit 50. They can be appropriately selected according to the purpose, for example, a cylindrical shape or a rectangular parallelepiped. Also, if a part of the second heating unit 50 has an opening, this opening can be used as the gas supply unit 60.

[0222] The location of the gas supply unit 60 is not particularly restricted, as long as it can be connected to the second heating unit 50, and can be selected as appropriate.

[0223] -Oxygen-containing gas 62- There are no particular restrictions on the oxygen content in the oxygen-containing gas 62; it can be appropriately selected depending on the purpose, and may even be a gas consisting solely of oxygen.

[0224] If the oxygen-containing gas 62 also contains gases other than oxygen, examples of these other gases include nitrogen, water vapor, and carbon dioxide. These may be present individually or in combination of two or more.

[0225] The content of gases other than oxygen in the oxygen-containing gas 62 is not particularly limited as long as it can remove the coking of the heat-generating resistor 2, and can be appropriately selected depending on the purpose. However, from the viewpoint of efficiently removing carbon, it is preferable that the content be 95% or less, and more preferably 85% or less. When the content of gases other than oxygen in the oxygen-containing gas 62 is 95% or less, the coking of the heat-generating resistor 2 can be efficiently removed.

[0226] <<Gas discharge section 61>> The gas discharge unit 61 is connected to the second heating unit 50, and a gas 63 containing carbon dioxide is discharged from the second heating unit 50.

[0227] In this disclosure, "connection" of the gas discharge section 61 to the second heating section 50 means that the inside of the gas discharge section 61 and the inside of the second heating section 50 are in communication so that a gas 63 containing carbon dioxide can pass through them.

[0228] There are no particular restrictions on the material of the gas discharge section 61; for example, it can be appropriately selected from the same materials as the second heating section 50, depending on the purpose.

[0229] The shape, structure, and size of the gas discharge section 61 are not particularly limited as long as they can extract the gas 63 containing carbon dioxide generated in the second heating section 50, and can be appropriately selected according to the purpose. Examples include cylindrical and rectangular parallelepiped shapes. Furthermore, if a part of the second heating section 50 has an opening, this opening can also be used as the gas discharge section 61.

[0230] The location of the gas discharge section 61 is not particularly limited as long as it can be connected to the second heating section 50, and can be appropriately selected depending on the type of gas 63 containing carbon dioxide.

[0231] In the second heating section 50, a gas containing carbon dioxide 63 is produced by the reaction of oxygen-containing gas 62 with carbon in the heating resistor 2. Therefore, the gas containing carbon dioxide 63 and the gas containing oxygen 62 may be mixed within the second heating section 50. For this reason, the gas discharge section 61 may not only remove the gas containing carbon dioxide 63, but also remove a mixed gas of the gas containing carbon dioxide 63 and the gas containing oxygen 62. Furthermore, if by-products are generated within the second heating section 50, the gas discharge section 61 may also remove the by-products.

[0232] Furthermore, the gas supply unit 60 and the gas discharge unit 61 may be the same. That is, a single component located in the same position may be the gas supply unit 60 that supplies oxygen-containing gas 62 to the second heating unit 50 and the gas discharge unit 61 that extracts the carbon dioxide-containing gas 63 processed in the second heating unit 50. In this case, the gas supply rate adjustment unit 64 and the gas discharge rate adjustment unit 66, which will be described later, are also a single component located in the same position.

[0233] <<Other components>> The heat treatment apparatus 100 according to the sixth embodiment of this disclosure may include, for example, a gas supply rate adjustment unit 64, a gas supply rate sensor 65, a gas discharge rate adjustment unit 66, and a gas discharge rate sensor 67 as other components. Furthermore, the heat treatment apparatus 100 according to the sixth embodiment of this disclosure may also include, as other components, a control unit 200 which may have a gas supply rate controller 206k and a gas discharge rate controller 205l.

[0234] -Gas supply speed adjustment unit 64- The gas supply rate adjustment unit 64 adjusts the supply rate at which the gas supply unit 60 supplies oxygen-containing gas 62 to the second heating unit 50, or stops the gas supply unit 60 from supplying oxygen-containing gas 62 to the second heating unit 50.

[0235] For example, a known pump, a cock, or the like can be used as the gas supply rate adjustment unit 64.

[0236] The rate at which the oxygen-containing gas 62 is supplied to the second heating unit 50 by the gas supply rate adjustment unit 64 may be manually adjusted by the operator, or it may be adjusted by the gas supply rate controller 206k of the control unit 200, which will be described later.

[0237] -Gas supply speed sensor 65- The gas supply rate sensor 65 measures the supply rate of the oxygen-containing gas 62 by the gas supply rate adjustment unit 64. The gas supply rate sensor 65 is not particularly limited as long as it can accurately measure the supply rate of the oxygen-containing gas 62 by the gas supply rate adjustment unit 64; for example, a known flow sensor for liquids or gases can be used.

[0238] The gas supply rate detection signal from the gas supply rate sensor 65 is suitably transmitted to the gas supply rate controller 206k of the control unit 200. The inclusion of the gas supply rate sensor 65 in the heat treatment apparatus 100 is preferable because it minimizes the power consumption of the heating resistor 2, and the gas supply rate controller 206k can provide feedback control of the gas supply rate of the gas supply unit 60.

[0239] -Gas discharge speed adjustment unit 66- The gas discharge speed adjustment unit 66 adjusts the discharge speed at which the gas discharge unit 61 discharges the gas 63 containing carbon dioxide from the second heating unit 50, or stops the gas discharge unit 61 from taking out the gas 63 containing carbon dioxide from the second heating unit 50.

[0240] As the gas discharge speed adjustment unit 66, for example, a known pump, cock, etc. can be used.

[0241] The speed at which the gas discharge speed adjustment unit 66 takes out the gas 63 containing carbon dioxide from the second heating unit 50 may be adjusted manually by the operator, or may be adjusted by the gas discharge speed controller 205l of the control unit 200 described later.

[0242] -Gas discharge speed sensor 67- The gas discharge speed sensor 67 measures the discharge speed of the gas 63 containing carbon dioxide by the gas discharge speed adjustment unit 66. The gas discharge speed sensor 67 is not particularly limited as long as it can accurately measure the discharge speed of the gas 63 containing carbon dioxide by the gas discharge speed adjustment unit 66. For example, a known flow sensor for liquid or gas can be used.

[0243] The gas discharge speed detection signal from the gas discharge speed sensor 67 is preferably transmitted to the gas discharge speed controller 205l of the control unit 200. When the heat treatment apparatus 100 has the gas discharge speed sensor 67, it is preferable in that the power consumption of the heating resistor 2 can be minimized and the gas discharge speed of the gas discharge unit 61 can be feedback-controlled by the gas discharge speed controller 205l.

[0244] -Control unit 200- FIG. 6B is a block diagram showing an example of the control unit of the heat treatment apparatus according to the sixth embodiment of the present disclosure. The control unit 200 of the heat treatment apparatus according to the sixth embodiment is different from the control unit 200 of the heat treatment apparatus according to the fifth embodiment in that it has a gas supply speed controller 206k and a gas discharge speed controller 205l.

[0245] -Gas supply rate controller 206k- The gas supply rate controller 206k controls the supply rate of the gas 62 containing oxygen to the second heating section 50 by the gas supply rate adjustment section 64. The gas supply rate controller 206k takes in the supply rate detection signal from the gas discharge rate sensor 67, and can feedback-control the supply rate of the gas 62 containing oxygen by PID control or on-off control.

[0246] -Gas discharge rate controller 205l- The gas discharge rate controller 205l controls the discharge rate of the gas 63 containing carbon dioxide from the second heating section 50 by the gas discharge rate adjustment section 66. The gas discharge rate controller 205l takes in the gas discharge rate detection signal from the gas discharge rate sensor 67, and can feedback-control the discharge rate of the gas 63 containing carbon dioxide by PID control or on-off control.

[0247] [Operation example of the heat treatment apparatus 100 according to the sixth embodiment] Next, a specific example of the operation of the heat treatment apparatus 100 according to the sixth embodiment will be described, which is different from the heat treatment apparatus according to the first embodiment, the heat treatment apparatus according to the second embodiment, the heat treatment apparatus according to the third embodiment, the heat treatment apparatus according to the fourth embodiment, or the heat treatment apparatus 100 according to the fifth embodiment.

[0248] In the heat treatment apparatus 100 according to the sixth embodiment, the gas 62 containing oxygen is supplied from the gas supply section 60 into the second heating section 50. At this time, the gas supply rate adjustment section 64 adjusts the supply rate of the gas 62 containing oxygen into the second heating section 50. The supply rate of the gas 62 containing oxygen is measured by the gas supply rate sensor 65, and the gas supply rate detection signal is transmitted to the gas supply rate controller 206k of the control section 200 and is controlled.

[0249] The gas 62 containing oxygen supplied into the second heating section 50 is used for heating and removing carbon in the heating resistor 2, and is converted into the gas 63 containing carbon dioxide.

[0250] The carbon dioxide-containing gas 63 inside the second heating section 50 is discharged outside the second heating section 50 from the gas discharge section 61. At this time, the gas discharge rate adjustment section 66 adjusts the discharge rate of the carbon dioxide-containing gas 63 outside the second heating section 50. The discharge rate of the carbon dioxide-containing gas 63 is measured by the gas discharge rate sensor 67, and the gas discharge rate detection signal is transmitted to the gas discharge rate controller 206l of the control unit 200 for control.

[0251] In the heat treatment apparatus 100 according to the sixth embodiment, when heating the heat-generating resistor 2 in the second heating section 50, the coking of the heat-generating resistor 2 can be more efficiently heated and removed by the oxygen-containing gas 62 supplied from the gas supply section 60.

[0252] <Seventh Embodiment> Figure 7A is a schematic cross-sectional view showing an example of a heat treatment apparatus according to the seventh embodiment of this disclosure. Figure 7B is a block diagram showing an example of a control unit of the heat treatment apparatus according to the seventh embodiment of this disclosure. The heat treatment apparatus according to the seventh embodiment of this disclosure differs from the heat treatment apparatus according to the first embodiment in that it further comprises a first electrode 20A, a second electrode 20B, an inert gas supply unit 30, a second heating unit 50, a first transport unit 51, a second transport unit 52, a gas supply unit 60, and a gas discharge unit 61. Since each of these components is the same as in the heat treatment apparatus according to the second embodiment of this disclosure, the heat treatment apparatus according to the third embodiment of this disclosure, the heat treatment apparatus according to the fifth embodiment of this disclosure, and the heat treatment apparatus according to the sixth embodiment of this disclosure, a detailed description is omitted.

[0253] The heat treatment apparatus according to the seventh embodiment of this disclosure may further include other components described in the heat treatment apparatus according to the second embodiment of this disclosure, the heat treatment apparatus according to the third embodiment of this disclosure, the heat treatment apparatus according to the fifth embodiment of this disclosure, and the heat treatment apparatus according to the sixth embodiment of this disclosure.

[0254] [Example of operation of the heat treatment apparatus 100 according to the seventh embodiment] Next, a specific example of the operation of the heat treatment apparatus 100 according to the seventh embodiment will be described. First, the material to be processed 7 is supplied from the material to be processed supply unit 5 into the first heating unit 1. At this time, the supply speed of the material to be processed 7 into the first heating unit 1 is adjusted by the first supply speed adjustment unit 12. The supply speed of the material to be processed 7 is measured by the first supply speed sensor 14, and the supply speed detection signal is transmitted to the first supply speed controller 206b of the control unit 200.

[0255] The material to be processed 7 supplied into the first heating unit 1 comes into contact with the heating resistor 2. When the power supply 21 is turned on and current is applied to the first electrode 20A and the second electrode 20B, current flows between the first electrode 20A, the second electrode 20B, and the heating resistor 2. This heats up the heating resistor 2. When the material to be processed 7 comes into contact with the heated heating resistor 2, a decomposition reaction occurs in the material to be processed 7, and processed material 8 is generated.

[0256] At this time, the temperature of the heating resistor 2 is measured by the temperature sensor 11. The temperature detection signal from the temperature sensor 11 is suitably transmitted to the first temperature controller 206a of the control unit 200. If the temperature of the heating resistor 2 is not constant, the first temperature controller 206a of the control unit 200 controls the amount of current applied to the heating resistor 2 in the first heating unit 1, as well as the amount of current applied to the first electrode 20A and the second electrode 20B, through feedback control so that the temperature of the heating resistor 2 becomes constant.

[0257] Furthermore, when the temperature of the heating resistor 2 is to be lowered or raised, the operator changes the input value to the input / output unit 204, thereby adjusting the amount of current applied to the current introduction terminal 22 to achieve the desired temperature.

[0258] Furthermore, when bringing the object to be processed 7 into contact with the heating resistor 2, inert gas 31 is supplied from the inert gas supply unit 30 into the first heating unit 1. At this time, the inert gas supply rate adjustment unit 32 adjusts the supply rate of the inert gas 31 into the first heating unit 1. The supply rate of the inert gas 31 is measured by the inert gas supply rate sensor 33, and the inert gas supply rate detection signal is transmitted to the inert gas supply rate controller 206f of the control unit 200.

[0259] The timing of starting or stopping the supply of inert gas 31, the supply amount, and the supply speed can be controlled by the operator by changing the input values ​​to the input / output unit 204. Furthermore, if the measured value obtained by the inert gas supply speed sensor 33 indicates that the supply speed of inert gas 31 differs from the input value, the inert gas supply speed controller 206f provides feedback control to adjust the supply of a constant amount of inert gas 31 into the first heating unit 1 according to the input value.

[0260] The inert gas 31 supplied into the first heating section 1 generates turbulence in the material to be processed 7 and the heat-generating resistor 2. As a result, the heat-generating resistor 2 becomes a jet layer, the material to be processed 7 comes into contact with the heat-generating resistor 2 at a high frequency, and the production efficiency of the processed material 8 is further improved.

[0261] The inert gas 31 supplied into the first heating section 1 may be discharged from the material removal section 6 to the outside of the first heating section 1 along with the removal of the material 8 from the material removal section 6, or it may be discharged from the heat-generating resistor removal section 4 to the outside of the first heating section 1 along with the removal of the heat-generating resistor 2 from the heat-generating resistor removal section 4, or it may be discharged from both the material removal section 6 and the heat-generating resistor removal section 4.

[0262] The discharge rate of the inert gas 31 from the processed material removal unit 6 is adjusted by the first removal rate adjustment unit 16 together with the removal rate of the processed material 8 from the first heating unit 1. The removal rates of the processed material 8 and the inert gas 31 are measured by the first removal rate sensor 18, and the removal rate detection signal is transmitted to the first removal rate controller 206d of the control unit 200.

[0263] The discharge rate of the inert gas 31 from the processed material extraction unit 6 is adjusted together with the extraction rate of the heating resistor 2 from the first heating unit 1 by the second extraction rate adjustment unit 17. The extraction rates of the heating resistor 2 and the inert gas 31 are measured by the second extraction rate sensor 19, and an extraction rate detection signal is transmitted to the second extraction rate controller 206e of the control unit 200. In this case, for the heat treatment apparatus 100 according to the third embodiment, it is preferable that the second extraction rate sensor 19 has both a flow rate sensor for solid particles and a flow rate sensor for gas.

[0264] In the case of a batch reaction, after a desired time has elapsed since the supply of the processing object 7, the processed material extraction unit 6 operates. In the case of a continuous reaction, the processed material extraction unit 6 operates together with the processing object supply unit 5. Thereby, the processed material 8 is taken out from the processed material extraction unit 6. At this time, the supply rate of the processing object 7 to the first heating unit 1 is adjusted by the first supply rate adjustment unit 12, and the extraction rate of the processed material 8 from the first heating unit 1 is adjusted by the first extraction rate adjustment unit 16. The extraction rate of the processed material 8 is measured by the first extraction rate sensor 18, and an extraction rate detection signal is transmitted to the first extraction rate controller 206d of the control unit 200.

[0265] In a continuous reaction, when the supply rate of the processing object 7 exceeds the extraction rate of the processed material 8 and the processing object 7 in the first heating unit 1 is likely to overflow, the first supply rate controller 206b slows down the supply rate of the processing object 7 or the first extraction rate controller 206d speeds up the extraction rate of the processed material 8 by feedback control. Thereby, a fixed amount of the processing object 7 and the heating resistor 2 can be brought into contact with each other.

[0266] In the series of reactions described above, the heat-generating resistor 2 is supplied to and removed from the first heating section 1 intermittently or continuously. For example, if the supply of the heat-generating resistor 2 from the heat-generating resistor supply section 3 and the removal of the heat-generating resistor 2 from the heat-generating resistor removal section 4 are stopped during the series of reactions, then when deterioration and / or coking of the heat-generating resistor 2 are detected, the supply of the heat-generating resistor 2 from the heat-generating resistor supply section 3 and the removal of the heat-generating resistor 2 from the heat-generating resistor removal section 4 are started, and the heat-generating resistor 2 in the first heating section 1 is replaced with a heat-generating resistor 2 that is not deteriorated and / or coked. This allows the heat treatment apparatus 100 to operate continuously and stably. This can be done by the operator changing the input value to the input / output section 204 to stop or start the supply and removal of the heat-generating resistor 2.

[0267] As another example, if the supply of heat-generating resistors 2 from the heat-generating resistor supply unit 3 and the removal of heat-generating resistors 2 from the heat-generating resistor removal unit 4 are performed continuously during a series of reactions, deterioration and / or coking of the heat-generating resistors 2 can be prevented, and the heat treatment apparatus 100 can be operated continuously and stably.

[0268] When replacing the heating resistor 2 within the first heating unit 1, the supply speed of the heating resistor 2 to the first heating unit 1 is adjusted by the second supply speed adjustment unit 13. The supply speed of the heating resistor 2 is measured by the second supply speed sensor 15, and the supply speed detection signal is transmitted to the second supply speed controller 206c of the control unit 200 for control. In addition, the removal speed of the heating resistor 2 from the first heating unit 1 is adjusted by the second removal speed adjustment unit 17. The removal speed of the heating resistor 2 from the first heating unit 1 is measured by the second removal speed sensor 19, and the removal speed detection signal is transmitted to the second removal speed controller 206e of the control unit 200 for control.

[0269] The heating resistor 2 removed from the heating resistor removal unit 4 is transported to the second heating unit 50 by the first transport unit 51. At this time, the removal speed of the heating resistor 2 is adjusted by the second removal speed adjustment unit 17 and measured by the second removal speed sensor 19, and the removal speed detection signal is transmitted to the first removal speed controller 206d of the control unit 200. The transport speed of the heating resistor 2 to the second heating unit 50 by the first transport unit 51 is then controlled by the transport speed detection signal transmitted to the first transport speed controller 206i of the control unit 200.

[0270] The heat-generating resistor 2 is heated in the second heating section 50. If the heat-generating resistor 2 develops coking in the first heating section 1, the coking is heated and removed in the second heating section 50. Inside the second heating section 50, the temperature of the heat-generating resistor 2 is measured by the temperature sensor 11. The temperature detection signal from the temperature sensor 11 is transmitted to the second temperature controller 206h of the control unit 200, and the temperature inside the second heating section 50 is controlled.

[0271] When the heating resistor 2 is heated in the second heating section 50, an oxygen-containing gas 62 is supplied from the gas supply section 60 into the second heating section 50. At this time, the gas supply rate adjustment section 64 adjusts the supply rate of the oxygen-containing gas 62 into the second heating section 50. The supply rate of the oxygen-containing gas 62 is measured by the gas supply rate sensor 65, and the gas supply rate detection signal is transmitted to the gas supply rate controller 206k of the control section 200 for control.

[0272] The oxygen-containing gas 62 supplied into the second heating section 50 is used to heat and remove carbon in the heating resistor 2 and is converted into a carbon dioxide-containing gas 63.

[0273] The carbon dioxide-containing gas 63 inside the second heating section 50 is discharged outside the second heating section 50 from the gas discharge section 61. At this time, the gas discharge rate adjustment section 66 adjusts the discharge rate of the carbon dioxide-containing gas 63 outside the second heating section 50. The discharge rate of the carbon dioxide-containing gas 63 is measured by the gas discharge rate sensor 67, and the gas discharge rate detection signal is transmitted to the gas discharge rate controller 206l of the control unit 200 for control.

[0274] The heat-generating resistor 2, from which the coking has been removed in the second heating unit 50, is transported to the heat-generating resistor supply unit 3 by the second transport unit 52. At this time, the transport speed of the heat-generating resistor 2 is adjusted by the second transport speed adjustment unit 53, measured by the second transport speed sensor 54, and the transport speed detection signal is transmitted to the second transport speed controller 206j of the control unit 200 for control. Subsequently, the supply speed of the heat-generating resistor 2 to the first heating unit 1 is adjusted by the second supply speed adjustment unit 13, measured by the second supply speed sensor 15, and the supply speed detection signal is transmitted to the second supply speed controller 206c of the control unit 200 for control. The heat-generating resistor 2 supplied into the first heating unit 1 heats the object to be processed 7 again within the first heating unit 1.

[0275] These operations can be stored in the memory unit 207, and the desired reaction conditions can be read from the memory unit 207 and used as appropriate.

[0276] The heat treatment apparatus 100 according to the seventh embodiment has all the advantages of the heat treatment apparatus according to the second embodiment of the present disclosure, the heat treatment apparatus according to the third embodiment of the present disclosure, the heat treatment apparatus according to the fifth embodiment of the present disclosure, and the heat treatment apparatus according to the sixth embodiment of the present disclosure. Therefore, it can operate stably for a long period of time, can thermally decompose the material to be treated with particular efficiency, and can particularly prevent deterioration due to heat.

[0277] (Heat treatment method) A heat treatment method according to one embodiment of the present disclosure involves heat-treating an object using the heat treatment apparatus of the present disclosure.

[0278] A heat treatment method according to one embodiment of the present disclosure includes supplying the heat-generating resistor from the heat-generating resistor supply unit to the first heating unit, supplying the object to be processed from the object to be processed supply unit to the first heating unit, heating the heat-generating resistor in the first heating unit, bringing the object to be processed and the heat-generating resistor into contact within the first heating unit, removing the processed product generated from the object to be processed from the processed product removal unit, and removing the heat-generating resistor from the heat-generating resistor removal unit. The heat treatment method according to one embodiment of the present disclosure may further include other processes as necessary.

[0279] Figure 8 is an example of a flowchart of a heat treatment method according to one embodiment of the present disclosure.

[0280] <Supplying a heat-generating resistor S1> Supplying a heat-generating resistor S1 involves supplying a heat-generating resistor 2 from the heat-generating resistor supply unit 3 to the first heating unit 1.

[0281] There are no particular restrictions on the supply speed of the heating resistor 2 to the first heating unit 1, and it can be selected as appropriate for the purpose.

[0282] <Supplying the object to be processed S2> S2 involves supplying the material to be processed, which means supplying the material to be processed 7 from the material to be processed supply unit 5 to the first heating unit 1.

[0283] There are no particular restrictions on the supply speed of the material to be processed 7 to the first heating unit 1, and it can be appropriately selected depending on the type of material to be processed 7.

[0284] <Heat it S3> Heating S3 involves heating the heat-generating resistor 2 in the first heating unit 1. Supplying the heat-generating resistor S1, supplying the material to be processed S2, and heating S3 may be performed separately or simultaneously. From the viewpoint of improving the yield of the processed material 8, it is preferable to first supply the heat-generating resistor S1, then heat S3 to bring the first heating unit 1 to a desired temperature according to the type of material to be processed 7, and then supply the material to be processed S2 and heat S3 simultaneously.

[0285] There are no particular restrictions on the heating temperature in S3, and it can be appropriately selected depending on the purpose, but 400°C or higher is preferred, 650°C to 950°C is more preferred, and 700°C to 900°C is even more preferred.

[0286] Furthermore, the heating temperature should be controlled so that the inner surface of the first heating section 1 does not become so hot that its material cannot be used stably. The relationship between the heating temperature and the temperature of the inner surface of the first heating section 1 varies depending on various conditions such as the distance between the inner surface of the first heating section 1 and the heat-generating resistor 2, the type of inert gas 31, and the supply rate of the inert gas 31. For example, if the inert gas 31 is nitrogen gas or water vapor, and the distance between the inner surface of the first heating section 1 and the heat-generating resistor 2 is 2 mm or more and 15 mm or less, a heating temperature of 750°C or less is preferable because the temperature of the inner surface of the first heating section 1 does not rise too high, and SUS316 stainless steel or SUS316L stainless steel can be used.

[0287] In heating S3, from the viewpoint of improving the yield of the processed material 8 and minimizing the power consumption of the heating resistor 2, it is preferable that the material to be processed 7 becomes turbulent within the first heating section 1 and comes into frequent contact with the heating resistor 2. Turbulence of the material to be processed 7 within the first heating section 1 can be suitably achieved by supplying an inert gas 31 into the first heating section 1. In this case, it is preferable to use the heat treatment apparatus according to the fourth embodiment of this disclosure, the heat treatment apparatus according to the fifth embodiment of this disclosure, or the heat treatment apparatus according to the sixth embodiment of this disclosure.

[0288] When the object to be processed 7 is plastic, and the processed material 8 is at least one chemical selected from the group consisting of olefins having 2 to 5 carbon atoms and aromatic hydrocarbons, and heating S3 is performed without a catalyst, the supply rate of the inert gas 31 is v(m 3 The value calculated by the following formula 1 for the ( / minute) is preferably between 0.05 and 10, and more preferably between 0.1 and 4. [Formula 1] 60 x L R ×(AB) / v However, in Equation 1, L R A represents the length (m) of the heating resistor 2, and A represents the cross-sectional area (m) of the first heating section 1. 2 ) is shown, and B is the cross-sectional area (m²) of the heat-generating resistor 2. 2 ) indicates that v is the supply rate of the inert gas 31 v(m 3 This indicates the time ( / minute).

[0289] <Removing the processed material S4> In the process of removing the processed material S4, the heated processed material 8 is removed from the processed material removal unit 6. The process of removing the processed material S4 is performed in the heating process S3.

[0290] <Removing the heat-generating resistor S5> The removal of the heat-generating resistor S5 may be performed together with or between any of the processes in the flowchart 300. That is, the removal of the heat-generating resistor S5 may be performed intermittently before or after an appropriately selected process between each of the processes in the flowchart 300, or it may be performed continuously during or together with each of the processes in the flowchart 300.

[0291] <Other processing> Other processing methods are not particularly limited and can be selected as appropriate depending on the purpose. For example, if the object to be processed 7 is plastic, these methods may include plastic pretreatment, recovery of useful components from the processed material 8 obtained by decomposing the plastic, and separation of useful components.

[0292] <<Pre-processing>> The pretreatment is the pretreatment of the plastic before heating in S3. By making the plastic easier to decompose in the pretreatment, the plastic can be decomposed more efficiently during heating in S3.

[0293] Examples of pretreatment include crushing the plastic, pelletizing (chipping) the crushed plastic, and melting the plastic.

[0294] There are no particular restrictions on the method for obtaining pulverized plastic, and any conventionally known method can be appropriately selected. For example, a method of crushing plastic with a pulverizer to obtain powder or flakes can be used.

[0295] Furthermore, there are no particular restrictions on the method of pelletizing (chipping) the pulverized material, and any conventionally known method can be appropriately selected. For example, one method is to melt-extrude the pulverized material and then cut the strand-shaped melt-extruded material to obtain chipped raw material.

[0296] There are no particular restrictions on the melting treatment of the plastic, and a suitable method can be selected from conventionally known methods. However, it is preferable to treat the plastic at a temperature above its melting point and below its thermal decomposition temperature, and more preferably at a temperature of 100°C to 300°C.

[0297] Plastics can also be supplied to the heat treatment as a molten material; for example, this can be done by supplying them to the heat treatment using a molten extruder.

[0298] <<Disassembly Process>> The decomposition process is a process that decomposes the plastic before heating (S3). In the decomposition process, the plastic may be used as is, or it may be used after pretreatment.

[0299] There are no particular restrictions on the method of decomposing plastic, and any conventionally known method can be appropriately selected. For example, one method is to heat-treat the plastic at a temperature above its decomposition temperature (e.g., 200°C or higher).

[0300] The material to be processed 7 may also be plastic decomposition products, which may be supplied to the first heating section 1 using, for example, a melt extruder.

[0301] <<Recovery Process>> The recovery process involves recovering gases, which are products containing ethylene and other lower olefins obtained by decomposing the plastic through heating (S3), and, if necessary, liquid substances. The recovery process is carried out by the recovery unit.

[0302] There are no particular restrictions on the recovery method, and a method can be appropriately selected from known methods depending on the type of product obtained. For example, gaseous products can be separated by pressurized distillation at atmospheric pressure, and liquid hydrocarbons can be separated by atmospheric pressure and reduced pressure distillation.

[0303] <<Separation Process>> The separation process involves separating only the useful components from the gas and liquid substances recovered in the recovery process and removing unwanted components. The separation process is carried out by the separation unit described above.

[0304] By decomposing plastics, useful components such as ethylene and other lower olefins may be produced, as well as by-components such as paraffins with 2 to 5 carbon atoms.

[0305] In the separation process, there are no particular restrictions on the method used to separate the useful components from the minor components, and a method can be appropriately selected from known methods depending on the type of product obtained or the type of minor components.

[0306] As described above, this disclosure has been explained based on specific embodiments, but these embodiments are merely examples, and this disclosure is not limited to the above embodiments. The above embodiments can be implemented in various other forms, and various combinations, omissions, substitutions, additions, modifications, etc., are possible without departing from the spirit of the invention. These embodiments and their variations are included in the scope and spirit of the invention, as well as in the claims of the invention and its equivalents. [Explanation of symbols]

[0307] 1...First heating section 1a...First surface of the first heating section 1b...Second surface of the first heating section 2… Heat-generating resistor 3… Heat-generating resistor supply unit 4… Heat-generating resistor extraction section 5… Processing material supply unit 6…Processing material removal section 7…Objects to be processed 8…Processed items 9…Current introduction terminal 11…Temperature sensor 12...First supply speed adjustment section 13...Second supply speed adjustment section 14…First supply rate sensor 15…Second supply rate sensor 16...First extraction speed adjustment unit 17...Second extraction speed adjustment unit 18…First extraction speed sensor 19…Second extraction speed sensor 20A…1st electrode 20B…Second electrode 21…Power supply 22...Current introduction terminal 23...Insulation 30...Inert gas supply unit 31...Inert gas 32...Inert gas supply rate adjustment unit 33...Inert gas supply rate sensor 40…Conveyor Unit 50…Second heating section 51...First Transport Unit 52... Second Transport Unit 53...Second transport speed adjustment unit 54…Second transport speed sensor 60...Gas supply unit 61...Gas discharge section 62…Gases containing oxygen 63...Gases containing carbon dioxide 64...Gas supply rate adjustment unit 65... Gas supply rate sensor 66...Gas discharge rate adjustment unit 67...Gas discharge rate sensor 100... Heat treatment equipment 200... Control Unit 202...Memory 203…Display section 204…Input / output section 205... Communications Department 206... Various controllers 206a...First temperature controller 206b...First supply rate controller 206c...Second supply rate controller 206d...First extraction speed controller 206e...Second extraction speed controller 206f...Inert gas supply rate controller 206g…Conveyor speed controller 206h... Second temperature controller 206i…First transport speed controller 206j... Second transport speed controller 206k... Gas supply rate controller 206L...Gas discharge rate controller 207...Storage section 208…Processing recipe data

Claims

1. A first heating section having granular heat-generating resistors arranged inside, A heating resistor supply unit connected to the first heating unit and supplying the heating resistor to the first heating unit, A heating resistor extraction unit connected to the first heating unit and for extracting the heating resistor from the first heating unit, A processing object supply unit connected to the first heating unit and supplying the processing object to the first heating unit, A processing material removal unit connected to the first heating unit for removing the processed material from the first heating unit, A heat treatment apparatus characterized by comprising the following:

2. A first electrode is placed inside the first heating section so as to be in contact with the heating resistor, A second electrode electrically connected to the first electrode, The heat treatment apparatus according to claim 1, comprising:

3. The heat treatment apparatus according to claim 1, further comprising a gas supply unit connected to the first heating unit and supplying an inert gas to the first heating unit.

4. The heat treatment apparatus according to claim 1, further comprising a conveying unit for conveying the heat-generating resistor from the heat-generating resistor extraction unit to the heat-generating resistor supply unit.

5. The object to be processed is plastic, The heat treatment apparatus according to claim 1, wherein the treated product is at least one chemical selected from the group consisting of olefins having 2 to 5 carbon atoms and aromatic hydrocarbons.

6. A second heating section for heating the carbon attached to the heating resistor, A first transport unit transports the heat-generating resistor from the heat-generating resistor removal unit to the second heating unit, A second transport unit transports the heat-generating resistor from the second heating unit to the heat-generating resistor supply unit, The heat treatment apparatus according to claim 5, comprising:

7. A gas supply unit connected to the second heating unit and supplying an oxygen-containing gas to the second heating unit, A gas discharge unit connected to the second heating unit and which discharges a gas containing carbon dioxide from the second heating unit, The heat treatment apparatus according to claim 6, comprising:

8. The gas discharge unit is connected to a gas supply unit that supplies inert gas to the first heating unit. The heat treatment apparatus according to claim 7, wherein the gas supply unit is connected to the first heating unit.

9. A heat treatment method characterized by heat-treating an object to be treated using a heat treatment apparatus described in any one of claims 1 to 8.

10. The heating resistor is supplied from the heating resistor supply unit to the first heating unit, The process involves supplying the object to be processed from the object to be processed supply unit to the first heating unit, The heating element is heated in the first heating unit, In the first heating section, the object to be processed and the heating resistor are brought into contact, From the aforementioned processed material removal unit, the processed material generated from the object to be processed is removed, To remove the heating resistor from the heating resistor removal section, The heat treatment method according to claim 9, including the method described in claim 9.

11. The heat treatment method according to claim 10, wherein the heating is performed by heating the object to be treated to 650°C or higher in the first heating section using the heat-generating resistor.

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