Circuit board cleaning apparatus, circuit board cleaning method, and control method for circuit board cleaning apparatus

JP2026111047APending Publication Date: 2026-07-03EBARA CORP
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
EBARA CORP
Filing Date
2024-12-23
Publication Date
2026-07-03

AI Technical Summary

Technical Problem

Existing substrate cleaning technologies using two-fluid injection struggle with insufficient cleaning power due to droplet reattachment and particle re-adhesion, particularly on areas where no liquid film has formed, and inadequate liquid supply downstream.

Method used

A substrate cleaning apparatus and method that employs a two-fluid nozzle and two rinse nozzles, where one rinse nozzle supplies liquid upstream and the other downstream, with controlled liquid amounts to form a liquid film and enhance particle removal, using a moving mechanism and control unit to manage liquid supply based on substrate position.

Benefits of technology

Improves cleaning power by preventing droplet reattachment and ensuring sufficient liquid supply for effective particle removal, enhancing the overall cleaning efficiency.

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Abstract

To improve the cleaning power of the circuit board. [Solution] A substrate cleaning device is provided, comprising a two-fluid nozzle for supplying two fluids to a rotating substrate, a first rinse nozzle for supplying rinse liquid to the rotating substrate, and a moving mechanism for holding and moving the two-fluid nozzle and the first rinse nozzle, wherein the first rinse nozzle supplies rinse liquid to a position upstream or downstream of the position where the two fluids are supplied, when the center of the rotating substrate is considered upstream and the outer circumference of the substrate is considered downstream.
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