Light-emitting device

Abstract

To improve the reliability of light-emitting devices. [Solution] The light-emitting device is a support having a substrate and a plurality of conductive members supported by the substrate and including a first conductive portion, wherein the support has a first recess on its upper surface, a first light-emitting element disposed on the support, an integrated circuit disposed on the support having a first direction and a second direction orthogonal to the first direction in a top view, aligned with the first light-emitting element in the first direction, a bonding member disposed between the support and the integrated circuit and joining the support and the integrated circuit, and a first wire connected to the first conductive portion and the integrated circuit, wherein the first recess is located between the connection portion to which the first conductive portion and the first wire are connected and the integrated circuit in the first direction.

Description

Technical Field

[0001] The present disclosure relates to a light-emitting device.

Background Art

[0002] For example, Patent Document 1 discloses a light-emitting device including a support, a light-emitting element disposed on the support, and an integrated circuit disposed on the support.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] An embodiment according to the present disclosure aims to improve the reliability of a light-emitting device.

Means for Solving the Problems

[0005] A light-emitting device according to an embodiment of the present disclosure includes a support having a base material and a plurality of conductive members supported by the base material and including a first conductive portion, the support having a first recess on an upper surface thereof, a first light-emitting element disposed on the support, having a first direction and a second direction orthogonal to the first direction in a top view, arranged in the first direction with the first light-emitting element, an integrated circuit disposed on the support, a joining member disposed between the support and the integrated circuit for joining the support and the integrated circuit, and a first wire connected to the first conductive portion and the integrated circuit, wherein the first recess is located between a connection portion where the first conductive portion and the first wire are connected and the integrated circuit in the first direction.

Effects of the Invention

[0006] According to the embodiments described herein, the reliability of the light-emitting device can be improved. [Brief explanation of the drawing]

[0007] [Figure 1] This is a schematic top view of a light-emitting device according to the first embodiment. [Figure 2] This is a schematic cross-sectional view of the line II-II in Figure 1. [Figure 3] This is a magnified view of area III in Figure 2. [Figure 4] This is a schematic bottom view of the light-emitting device according to the first embodiment. [Figure 5] This is a schematic top view showing all of the multiple vias formed in the support in the light-emitting device according to the first embodiment. [Figure 6] This is a schematic top view of the light-emitting device according to the second embodiment. [Figure 7] This is a schematic cross-sectional view of the line VII-VII in Figure 6. [Figure 8] This is a schematic top view of a light-emitting device according to the third embodiment. [Figure 9] This is a schematic cross-sectional view of the IX-IX line in Figure 8. [Figure 10] This is a schematic top view of the light-emitting device according to the fourth embodiment. [Figure 11] Figure 10 is a schematic cross-sectional view of the line XI-XI. [Figure 12] This is a schematic cross-sectional view of the light-emitting device of the fifth embodiment. [Figure 13] This is a schematic diagram showing the system configuration of the light-emitting unit according to the sixth embodiment. [Figure 14] This is a schematic top view showing a light-emitting unit according to the first example of the seventh embodiment. [Figure 15] Figure 14 shows a schematic cross-sectional view of the line XV-XV. [Figure 16] This is a schematic top view showing a light-emitting unit according to a second example of the seventh embodiment. [Figure 17] This is a schematic cross-sectional view of the line XVII-XVII in Figure 16.

Best Mode for Carrying Out the Invention

[0008] Hereinafter, embodiments will be described with reference to the drawings. Since each drawing schematically shows an embodiment, the scale, interval, positional relationship, etc. of each member may be exaggerated, or illustration of a part of the member may be omitted.

[0009] In the following description, components having substantially the same function may be denoted by a common reference numeral, and the description thereof may be omitted. Also, terms indicating a specific direction or position (for example, "up", "down", and other terms including those terms) may be used. However, those terms are merely used for ease of understanding of the relative direction or position in the referenced drawings. As long as the relative direction or positional relationship by terms such as "up" and "down" in the referenced drawings is the same, in drawings other than the present disclosure, actual products, etc., they do not have to be arranged in the same way as in the referenced drawings. In this specification, "parallel" includes not only the case where two straight lines, sides, surfaces, etc. do not intersect even when extended, but also the case where the angle formed by two straight lines, sides, surfaces, etc. intersects within a range of 10° or less. Also, "orthogonal" may include a deviation of ±10° or less with respect to 90°. In this specification, the positional relationship expressed as "up" includes both the case of being in contact and the case of not being in contact but being located above.

[0010] In this specification, as a direction expression, a rectangular coordinate system having D1 axis, D2 axis, and D3 axis is used. The D1 axis, D2 axis, and D3 axis are orthogonal to each other. The direction along the D1 axis is defined as the first direction D1, the direction along the D2 axis is defined as the second direction D2, and the direction along the D3 axis is defined as the vertical direction. Also, the direction in which the arrow of the D1 axis points is defined as the front, and the opposite direction of the front is defined as the rear. The direction in which the arrow of the D2 axis points is defined as the right, and the opposite direction of the right is defined as the left. The direction in which the arrow of the D3 axis points is defined as the up, and the opposite direction of the up is defined as the down. Looking at an object from above is called a top view. A top view is synonymous with a plan view.

[0011] [First Embodiment] Referring to FIGS. 1 to 5, the light-emitting device according to the first embodiment will be described. FIG. 1 is a schematic top view of the light-emitting device 100 according to the first embodiment. FIG. 2 is a schematic cross-sectional view taken along line II-II in FIG. 1. FIG. 3 is an enlarged view of region III in FIG. 2. FIG. 4 is a schematic bottom view of the light-emitting device 100. FIG. 5 is a schematic top view showing all of the plurality of vias 6 formed in the support 1 of the light-emitting device 100.

[0012] As shown in FIGS. 1 to 3, the light-emitting device 100 according to the present embodiment includes a support 1 having a base material 11 and a plurality of conductive members 12 supported by the base material 11 and including a first conductive portion 12-1, and the support 1 has a first recess 10 on the upper surface thereof. Further, the light-emitting device 100 includes a first light-emitting element 21 and an integrated circuit 3 respectively disposed on the support 1. The integrated circuit 3 has a first direction D1 and a second direction D2 orthogonal to the first direction D1 in a top view. The integrated circuit 3 is aligned with the first light-emitting element 21 in the first direction D1. Furthermore, the light-emitting device 100 includes a bonding member 4 disposed between the support 1 and the integrated circuit 3 for bonding the support 1 and the integrated circuit 3, and a first wire 51 connected to the first conductive portion 12-1 and the integrated circuit 3.

[0013] In the example shown in Figures 1 to 3, the light-emitting device 100 includes a second light-emitting element 22 and a third light-emitting element 23, each positioned on a support 1, and a plurality of second wires 52, each connected to an integrated circuit 3. The plurality of second wires 52 include a first wire 51. The support 1 has a plurality of vias 6 electrically connected to a first conductive part 12-1. The first conductive part 12-1 is located in the center of the support 1 and has the first light-emitting element 21, the second light-emitting element 22, and the third light-emitting element 23 mounted on its upper surface. In the example shown in Figure 1, the support 1 has six vias 6, each electrically connected to the first conductive part 12-1. The length of the integrated circuit 3 in the second direction D2 is longer than the length of the integrated circuit 3 in the first direction D1. The light-emitting device 100 may include wires other than the plurality of second wires 52, and may include conductive members other than the plurality of conductive members 12. Furthermore, to avoid making the drawings too complex, in the example shown in Figure 1, only the six vias 6, each electrically connected to the first conductive part 12-1, are shown, and in the example shown in Figure 4, the vias 6 are omitted. All vias 6 formed on the support 1 will be explained with reference to Figure 5.

[0014] As shown in Figures 2 and 3, the first recess 10 is a portion recessed downward from the upper surface 1a of the support 1. The first light-emitting element 21, the second light-emitting element 22, the third light-emitting element 23, and the integrated circuit 3 are arranged on the upper surface 1a of the support 1. In the example shown in Figures 2 and 3, the upper surface 1a of the support 1 is the upper surface of the conductive member 12. In the example shown in Figures 1 to 3, the first recess 10 is formed by a hole that penetrates from the upper surface to the lower surface of the conductive member 12, which is arranged on the base material 11. In a top view, there is no hole or recess formed in the portion of the base material 11 that overlaps with the hole formed in the conductive member 12. The inner surface 10a of the first recess 10 is defined by the base material 11 and the conductive member 12. In the example shown in Figures 2 and 3, the inner surface 10a of the first recess 10 includes a portion of the upper surface of the base material 11 and a portion of the side surface of the conductive member 12.

[0015] However, the first recess 10 is not limited to the hole that penetrates from the upper surface to the lower surface of the conductive member 12. For example, the first recess 10 may be composed of a depression that does not penetrate the conductive member 12, or it may be composed of a hole that penetrates from the upper surface of the conductive member 12 to the lower surface of the base material 11. Alternatively, the first recess 10 may be composed of a hole that penetrates from the upper surface to the lower surface of the conductive member 12 and a depression that overlaps with the hole in a top view and does not penetrate the base material 11. The lower surface 1b of the support 1 is the lowermost surface of the support 1. In the example shown in Figure 2, the lower wiring 13 is located on the surface of the support 1 opposite to the surface on which the conductive member 12 is arranged. The lower surface 1b of the support 1 is the lower surface of the lower wiring 13.

[0016] As shown in Figure 1, the first recess 10 is located in the first direction D1 between the connection portion 61 to which the first conductive portion 12-1 and the first wire 51 are connected and the integrated circuit 3. In the example shown in Figure 1, the first recess 10 has a roughly rectangular outer shape in a top view, with the second direction D2 as its longitudinal side and both ends of the second direction D2 containing curved surfaces. However, the outer shape of the first recess 10 in a top view is not limited to a roughly rectangular shape, and may be roughly square, roughly circular, roughly elliptical, roughly polygonal, etc. Also, the first recess 10 may have a shape that includes a bent portion or a curved portion in a top view. Furthermore, the first recess 10 may extend in directions other than the second direction D2 in a top view, and may extend in multiple directions.

[0017] In the typical manufacturing process of a light-emitting device, for example, an integrated circuit is bonded to a support using a bonding member placed on the support, and then wires connected to the integrated circuit are positioned. Since the bonding member remains fluid after being placed on the support until it hardens, it may wet and spread across the support. When the bonding member that has wet and spread across the support reaches the connection point where the wire and the conductive part connect, the presence of the bonding member at the connection point makes it difficult to position the wire. Furthermore, the presence of the bonding member at the connection point may reduce the bonding strength between the wire and the conductive part at that connection point.

[0018] In this embodiment, the first recess 10 is located between the connection portion 61, to which the first conductive portion 12-1 and the first wire 51 are connected, and the integrated circuit 3 in the first direction D1. The first recess 10 prevents the bonding member 4, which is placed on the support 1 during the manufacturing process of the light-emitting device 100, from wetting and spreading toward the connection portion 61. This reduces the amount of wetting and spreading of the bonding member 4 toward the connection portion 61. As a result, it becomes easier to position the first wire 51 after the integrated circuit 3 is bonded to the support 1, and the reduction in bonding strength between the first wire 51 and the connection portion 61 is reduced. By reducing the reduction in bonding strength between the first wire and the connection portion 61, the reliability of the light-emitting device 100 can be improved in this embodiment.

[0019] The support 1 of the light-emitting device 100 may have a protrusion positioned at the location of the first recess 10. This protrusion is a portion that protrudes upward from the upper surface 1a of the support 1. In a top view, the protrusion may have an outer shape that is approximately rectangular, with the second direction D2 as its longitudinal side and both ends of the second direction D2 containing curved surfaces. However, the outer shape of the protrusion in a top view is not limited to approximately rectangular, and may be approximately square, approximately circular, approximately elliptical, approximately polygonal, etc. Furthermore, in a top view, the protrusion may have a shape that includes a bent portion or a curved portion. In addition, in a top view, the protrusion may extend in directions other than the second direction D2, and may extend in multiple directions. The support 1 of the light-emitting device 100 may have the first recess and the protrusion located near the first recess.

[0020] As shown in Figure 1, it is preferable that the maximum length L10-2 of the first recess 10 in the second direction D2 is longer than the maximum length L10-1 of the first recess 10 in the first direction D1. By making the maximum length L10-2 longer than the maximum length L10-1, the first recess 10 can be extended over a wider area in the second direction D2 compared to the case where the maximum length L10-2 is less than or equal to the maximum length L10-1. This makes it possible to prevent the bonding member 4, which wets and spreads on the support 1, from moving toward the connection portion 61 over a wide area. As a result, the likelihood of the bonding member 4, which wets and spreads on the support 1, reaching the position of the connection portion 61 can be reduced, and the reliability of the light-emitting device 100 can be improved.

[0021] From the viewpoint of reducing the extent to which the joining member 4 extends to the connection portion 61, it is preferable that the maximum length L10-2 is at least twice, five times, or ten times the maximum length L10-1. Furthermore, from the viewpoint of miniaturizing the light-emitting device 100, it is preferable that the maximum length L10-2 is 100 times or less the maximum length L10-1.

[0022] In the light-emitting device 100, the inner surface 10a of the first recess 10 is defined by the base material 11 and the conductive member 12. This prevents the bonding member 4, which spreads over the support 1, from spreading further in the direction of the first light-emitting element 21 by contacting the inner surface 10a of the first recess 10. As a result, the likelihood of the bonding member 4 spreading over the support 1 reaching the position of the connection part 61 is reduced, improving the reliability of the light-emitting device 100. In the light-emitting device 100, the bottom surface of the first recess 10 is defined by the base material 11, and the inner surface of the first recess 10 is defined by the conductive member 12.

[0023] As shown in Figure 1, in the second direction D2, it is preferable that the maximum length L10-2 of the first recess 10 is longer than the maximum length L21 of the first light-emitting element 21. For example, the connecting portion 61 is often located near the first light-emitting element 21. By making the maximum length L10-2 longer than the maximum length L21, the first recess 10 can be extended over a wide area in the second direction D2 near the first light-emitting element 21, thereby preventing the bonding member 4, which wets and spreads on the support 1, from moving toward the connecting portion 61 over a wide area. As a result, the likelihood of the bonding member 4, which wets and spreads on the support 1, reaching the location of the connecting portion 61 is reduced, and the reliability of the light-emitting device 100 is improved.

[0024] In the example shown in Figure 1, one of the multiple conductive members 12 located directly below the first light-emitting element 21 includes a first portion 121 in a top view that includes a region overlapping with the first light-emitting element 21 in the second direction D2. In Figure 1, the first portion 121 is represented by upward-sloping diagonal hatching. In the light-emitting device 100, it is preferable that the maximum length L10-2 of the first recess 10 in the second direction D2 is longer than the maximum length L121 of the first portion 121. By making the maximum length L10-2 longer than the maximum length L121, the first recess 10 can be extended over a wide area in the second direction D2 near the first light-emitting element 21, thereby preventing the bonding member 4 that wets and spreads on the support 1 from moving toward the connection portion 61 over a wide area. As a result, the likelihood of the bonding member 4 that wets and spreads on the support 1 reaching the position of the connection portion 61 is reduced, improving the reliability of the light-emitting device 100.

[0025] As shown in Figure 1, in the second direction D2, it is preferable that the maximum length L10-2 of the first recess 10 is shorter than the maximum length L3 of the integrated circuit 3. For example, in the second direction D2, the length of the light-emitting device 100 is often determined by the maximum length L3 of the integrated circuit 3. By making the maximum length L10-2 shorter than the maximum length L3, the length of the light-emitting device 100 in the second direction D2 can be reduced, making it easier to miniaturize the light-emitting device 100.

[0026] As shown in Figure 1, it is preferable that the integrated circuit 3 is located on the first conductive portion 12-1. By positioning the integrated circuit 3 on the first conductive portion 12-1, the connection portion 61 can be placed closer to the integrated circuit 3 in the first direction D1 compared to the case where the integrated circuit 3 is located on a conductive member 12 other than the first conductive portion 12-1 among the multiple conductive members 12. This reduces the length of the light-emitting device 100 in the first direction D1, making it easier to miniaturize the light-emitting device 100. In addition, since the distance from the integrated circuit 3 to the connection portion 61 is shortened, the first wire 51 can be shortened, making it easier to position the first wire 51 in the manufacturing process of the light-emitting device 100.

[0027] As shown in Figure 1, the integrated circuit 3 includes, in a top view, a first outer edge 3G-1 facing the first light-emitting element 21, a second outer edge 3G-2 located on the opposite side of the first outer edge 3G-1, a third outer edge 3G-3 connected to the first outer edge 3G-1 and the second outer edge 3G-2 respectively, and a fourth outer edge 3G-4 located on the opposite side of the third outer edge 3G-3. The multiple second wires 52 do not overlap with the second outer edge 3G-2 in a top view. For example, if the multiple second wires 52 are arranged to overlap with the second outer edge 3G-2 in a top view, it is necessary to secure a region outside the second outer edge 3G-2 of the integrated circuit 3 on the support 1 to which the other ends of each of the multiple second wires 52, each with one end connected to the integrated circuit 3, are connected. This may result in the support 1 becoming longer in the first direction D1, and the light-emitting device 100 becoming larger. In a top view, the multiple second wires 52 do not overlap with the second outer edge 3G-2, eliminating the need to secure a region outside the second outer edge 3G-2 of the integrated circuit 3 on the support 1 for connecting the other ends of each of the multiple second wires 52. This reduces the lengthening of the support 1 in the first direction D1, making it easier to miniaturize the light-emitting device 100.

[0028] As shown in Figure 1, it is preferable that the integrated circuit 3 overlaps with the via 6 in a top view. By arranging the via 6 to overlap with the integrated circuit 3, which is prone to generating heat during operation, the heat emitted from the integrated circuit 3 can be dissipated through the via 6 to the external substrate on which the support 1 is placed. This reduces the temperature rise of the integrated circuit 3 and the light-emitting device 100. As a result, the thermal impact on the integrated circuit 3 and the light-emitting device 100 is reduced, and the reliability of the light-emitting device 100 is improved.

[0029] The following describes in detail each element that makes up the light-emitting device 100.

[0030] (Support 1) The support body 1 is a member on which the first light-emitting element 21, the second light-emitting element 22, and the third light-emitting element 23 are mounted. The first light-emitting element 21, the second light-emitting element 22, and the third light-emitting element 23 are joined to the upper surface 1a of the support body 1 by a bonding member such as resin, solder, or conductive paste.

[0031] In the example shown in Figure 1, the light-emitting device 100 has, in addition to the first conductive part 12-1, conductive members 12-2, 12-3, 12-4, 12-5, 12-6, 12-7, 12-8, 12-9, 12-10, 12-11, 12-12, and 12-13.

[0032] Conductive member 12-2 is located to the left of the integrated circuit 3 and, in a top view, has a substantially rectangular external shape with the first direction D1 as its longitudinal side. Conductive member 12-3 is located in front of conductive member 12-2 and, in a top view, has a substantially rectangular external shape with the first direction D1 as its longitudinal side. Conductive member 12-4 is located in front of conductive member 12-3 and, in a top view, has a substantially rectangular external shape with the first direction D1 as its longitudinal side. Conductive member 12-5 is located in front of conductive member 12-4 and, in a top view, has a substantially square external shape. Conductive member 12-6 is located in front of conductive member 12-5 and, in a top view, has a shape that extends forward from a portion located to the left of the first conductive part 12-1 and extends to the right from a portion located near the front end of the support 1.

[0033] Conductive member 12-7 is located to the right of conductive member 12-6 and, in a top view, includes a shape that extends forward from a portion located to the left of the first conductive part 12-1 and extends to the right from a portion located near the front end of the support 1. Conductive member 12-8 is located in front of the first conductive part 12-1 in a top view and includes a shape that branches into a portion extending to the right and a portion extending to the rear from a portion located in front of the first conductive part 12-1 in a top view. Conductive member 12-9 is located to the right of the first conductive part 12-1 and, in a top view, includes a substantially square outer shape. Conductive member 12-10 is located behind conductive member 12-9 and, in a top view, includes a substantially square outer shape. Conductive member 12-11 is located behind conductive member 12-10 and, in a top view, includes a substantially rectangular outer shape with the first direction D1 as its longitudinal side. Conductive member 12-12 is located behind conductive member 12-11 and, in a top view, has a substantially rectangular external shape with the first direction D1 as its longitudinal side. Conductive member 12-13 is located behind conductive member 12-12 and, in a top view, has a substantially rectangular external shape with the first direction D1 as its longitudinal side.

[0034] The support 1 can be a wiring board including a base material 11 and wiring. The first recess 10 is defined by the base material 11 and the wiring. The base material 11 can be made of resin, ceramics, glass, etc. As the resin, known materials such as thermosetting resins and thermoplastic resins can be used. Examples of ceramics include aluminum oxide, aluminum nitride, zirconium oxide, zirconium nitride, titanium oxide, titanium nitride, or mixtures thereof. Examples of wiring include copper, iron, nickel, tungsten, chromium, aluminum, silver, gold, titanium, palladium, rhodium, or alloys thereof. These metals or alloys may be a single layer or a multilayer. The base material 11 may include a molding resin that holds multiple leads.

[0035] The first conductive part 12-1 and the conductive member can be made of leads that are conductive and function as electrodes for supplying power to the first light-emitting element 21, the second light-emitting element 22, the third light-emitting element 23 and / or the integrated circuit. As the base material of the leads, metals such as copper, aluminum, gold, silver, iron, nickel, or alloys thereof, phosphor bronze, and iron-containing copper can be used. These may be single layers or laminated structures (e.g., clad materials). In particular, it is preferable to use copper as the base material because it is inexpensive and has high heat dissipation. The leads may also have a metal layer on the surface of the base material. As the metal layer, gold, silver, aluminum, nickel, palladium, rhodium, copper, or alloys thereof can be used. The metal layer may be provided over the entire surface of the lead or partially. Furthermore, the metal layer may be different in the region formed on the upper surface of the lead and the region formed on the lower surface of the lead. For example, the metal layer formed on the upper surface of the lead may be a multi-layered metal layer containing nickel and silver, while the metal layer formed on the lower surface of the lead may be a metal layer that does not contain a nickel metal layer. Furthermore, the metal layer, such as gold, formed on the upper surface of the lead can be thicker than the metal layer, such as gold, formed on the lower surface of the lead. When a silver-containing metal layer is formed on the outermost surface of the lead, it is preferable to provide a protective layer, such as silicon oxide, on the surface of the silver-containing metal layer. This suppresses discoloration of the silver-containing metal layer due to sulfur components in the atmosphere. The protective layer can be formed by a vacuum process, such as sputtering.

[0036] The first conductive part 12-1 can be any conductive material capable of conducting electric current, and it is not necessary for the current required to flow through it to cause the first light-emitting element 21, the second light-emitting element 22, and / or the third light-emitting element 23 to emit light. The first conductive part 12-1 can also be used as a heat dissipation part in the light-emitting device 100. The first conductive part 12-1 can be made up of a metal or the like that has conductivity and good heat dissipation properties.

[0037] As shown in Figure 4, the following bottom wirings are arranged on the lower surface of the support 1: bottom wiring 13-1, bottom wiring 13-2, bottom wiring 13-3, bottom wiring 13-4, bottom wiring 13-5, bottom wiring 13-6, bottom wiring 13-7, bottom wiring 13-8, bottom wiring 13-9, bottom wiring 13-10, bottom wiring 13-11, bottom wiring 13-12, and bottom wiring 13-13.

[0038] (First light-emitting element 21, second light-emitting element 22, and third light-emitting element 23) In the example shown in Figure 1, the first light-emitting element 21, the second light-emitting element 22, and the third light-emitting element 23 are positioned in the center of the support 1. By positioning the first light-emitting element 21, the second light-emitting element 22, and the third light-emitting element 23 in the center of the support 1, they can be arranged at a high density. In other words, the distance from the first light-emitting element 21 to the second light-emitting element 22 and the distance from the first light-emitting element 21 to the third light-emitting element 23 can be shortened. Furthermore, even if they are mounted in a position rotated with respect to the center of the light-emitting device 100, the positions of the first light-emitting element 21, the second light-emitting element 22, and the third light-emitting element 23 can be made less likely to change than when they are located near the corners of the light-emitting device.

[0039] The first light-emitting element 21, the second light-emitting element 22, and the third light-emitting element 23 each include a semiconductor laminate. The semiconductor laminate includes, for example, a substrate such as sapphire or gallium nitride, an n-type semiconductor layer disposed on the substrate, a p-type semiconductor layer, and a light-emitting layer sandwiched between the n-type and p-type semiconductor layers. Furthermore, the first light-emitting element 21, the second light-emitting element 22, and the third light-emitting element 23 each include an n-side electrode electrically connected to the n-type semiconductor layer and a p-side electrode electrically connected to the p-type semiconductor layer. The n-side electrode and the p-side electrode constitute a part of the upper surface of the first light-emitting element 21, the second light-emitting element 22, and the third light-emitting element 23, respectively. Note that the first light-emitting element 21, the second light-emitting element 22, and the third light-emitting element 23 do not necessarily have a substrate such as sapphire or gallium nitride. This makes it easier to miniaturize the first light-emitting element 21, the second light-emitting element 22, and the third light-emitting element 23.

[0040] The structure of the light-emitting layer may be a double heterostructure, a single quantum well structure (SQW) with a single active layer, or a multiple quantum well structure (MQW) with a group of active layers. The light-emitting layer is capable of emitting visible light or ultraviolet light. The light-emitting layer is capable of emitting visible light from blue to red. An example of a semiconductor laminate containing such a light-emitting layer is In x Al y Ga 1-x-y N(0≦x, 0≦y, x+y≦1) may be included. The semiconductor stack may include at least one light-emitting layer capable of the above-described emission. For example, the semiconductor stack may have a structure that includes one or more light-emitting layers between an n-type semiconductor layer and a p-type semiconductor layer, or it may have a structure in which a structure containing an n-type semiconductor layer, a light-emitting layer, and a p-type semiconductor layer in sequence is repeated multiple times. When the semiconductor stack includes multiple light-emitting layers, it may include light-emitting layers with different emission peak wavelengths, or it may include light-emitting layers with the same emission peak wavelength. Note that the emission peak wavelengths may be the same, for example, with variations of a few nanometers. Such combinations of light-emitting layers can be selected as appropriate. For example, when the semiconductor stack includes two light-emitting layers, the light-emitting layers can be selected in combinations such as blue light and blue light, green light and green light, red light and red light, ultraviolet light and ultraviolet light, blue light and green light, blue light and red light, or green light and red light. Furthermore, the light-emitting layer may include multiple active layers with different emission peak wavelengths, or it may include multiple active layers with the same emission peak wavelength.

[0041] The first light-emitting element 21 emits light containing a first peak wavelength. The wavelength with the highest output value of the light spectrum emitted from the first light-emitting element 21 is defined as the first peak wavelength. In the examples shown in Figures 1 to 4, the first light-emitting element 21 emits blue light. However, the first light-emitting element 21 may also emit green light, red light, or other colors.

[0042] The second light-emitting element 22 emits light containing a second peak wavelength that is different from the first peak wavelength. The wavelength with the highest output value of the light spectrum emitted from the second light-emitting element 22 is defined as the second peak wavelength. In the examples shown in Figures 1 to 4, the second light-emitting element 22 emits green light. However, the second light-emitting element 22 may also emit blue light, red light, or other colors.

[0043] The third light-emitting element 23 emits light containing a third peak wavelength that is different from the first and second peak wavelengths. The wavelength with the highest output value of the light spectrum emitted from the third light-emitting element 23 is defined as the third peak wavelength. In the examples shown in Figures 1 to 4, the third light-emitting element 23 emits red light. However, the third light-emitting element 23 may also emit blue light, green light, or other colors.

[0044] The light-emitting device 100 is not limited to the first light-emitting element 21, the second light-emitting element 22, and the third light-emitting element 23, and may have one or more light-emitting elements arranged on the support 1. The positions in which the one or more light-emitting elements are arranged can be determined as appropriate.

[0045] (Integrated Circuit 3) In the example shown in Figure 1, the integrated circuit 3 is an electronic circuit such as a large-scale integrated circuit (LSI) that drives the first light-emitting element 21, the second light-emitting element 22, and the third light-emitting element 23 to emit light. The integrated circuit 3 is supplied with a drive signal via the conductive member 12-5. The integrated circuit 3 may have, for example, the following specifications and functions. However, the specifications and functions of the integrated circuit 3 are not limited to those listed below. • 488Hz, 12-bit PWM (Pulse Width Modulation) control • Temperature compensation function • 8-bit brightness resolution (Red, Green, Blue) • Dimming function • Up to 4079 LEDs (Light Emitting Diodes) or other light-emitting devices can be connected in a daisy-chain configuration. • Two-way and half-duplex communication are possible. • Supports 16 multicast address groups • Built-in OSC (Oscillator) • Maximum length of the first direction D1: 0.73 mm • Maximum length of the second direction D2: 2.29 mm

[0046] The numbers 1 to 19 inside the integrated circuit 3 in Figure 1 represent the pin numbers of each of the multiple pins provided by the integrated circuit 3. The names, types, and descriptions of the pins corresponding to the pin numbers are shown in Table 1 below. Note that the chip select signal in Table 1 refers to a signal that selects one of the first light-emitting element 21, the second light-emitting element 22, or the third light-emitting element 23 provided by the light-emitting device 100.

[0047] [Table 1]

[0048] In the example shown in Figure 1, pin number 1 of the integrated circuit 3 is connected to conductive member 12-2. Pin number 2 of the integrated circuit 3 is connected to conductive member 12-3. Pin number 3 of the integrated circuit 3 is connected to conductive member 12-4. Pin number 4 of the integrated circuit 3 is connected to conductive member 12-5. Pin number 5 of the integrated circuit 3 is connected to conductive member 12-6. Pin number 6 of the integrated circuit 3 is connected to the first conductive part 12-1. Pin number 7 of the integrated circuit 3 is connected to conductive member 12-7. Pin number 8 of the integrated circuit 3 is connected to the first conductive part 12-1. Pin number 9 of the integrated circuit 3 is connected to the first light-emitting element 21. Pin number 10 of the integrated circuit 3 is connected to the first conductive part 12-1. Pin number 11 of the integrated circuit 3 is connected to the third light-emitting element 23. Pin number 12 of the integrated circuit 3 is connected to the first conductive part 12-1. Pin number 13 of the integrated circuit 3 is connected to the conductive member 12-8 and the second light-emitting element 22. Pin number 14 of the integrated circuit 3 is connected to the first conductive part 12-1. Pin number 15 of the integrated circuit 3 is connected to the conductive member 12-9. Pin number 16 of the integrated circuit 3 is connected to the conductive member 12-10. Pin number 17 of the integrated circuit 3 is connected to the conductive member 12-11. Pin number 18 of the integrated circuit 3 is connected to the conductive member 12-12. Pin number 19 of the integrated circuit 3 is connected to the conductive member 12-13. Note that the positions of the pins are not particularly limited; for example, instead of pin number 8 which is connected to the first conductive part 12-1, a pin located between pin number 8 and pin number 9 may be connected to the first conductive part 12-1.

[0049] In the integrated circuit 3, pin number 10 is positioned between pin number 9, which is the output pin to the first light-emitting element 21, and pin number 11, which is the output pin to the third light-emitting element 23. For example, the temperature tends to rise near output pins that control the current to the light-emitting elements. By positioning another pin between the output pin to the first light-emitting element 21 and the output pin to the third light-emitting element 23, the distance between these output pins becomes longer compared to the case where the output pins to the first light-emitting element 21 and the output pin to the third light-emitting element 23 are adjacent to each other. As a result, the temperature rise of the integrated circuit 3 is more easily reduced.

[0050] In integrated circuit 3, pin number 10, which is the power ground pin of the first light-emitting element 21, is located next to pin number 9, which is the output pin to the first light-emitting element 21. This ensures that the external noise on both the output pin and the power ground pin of the first light-emitting element 21 is approximately equal. As a result, the external noise is canceled out, reducing its impact, and the intrinsic noise on the output pin to the first light-emitting element 21 is also reduced.

[0051] In the example shown in Figure 5, the support 1 has 12 vias 6 that are electrically connected to conductive members 12-2, 12-3, 12-4, 12-5, 12-6, 12-7, 12-9, 12-10, 12-11, 12-12, and 12-13, as seen from above. More specifically, of the multiple conductive members 12, each conductive member 12 except conductive member 12-6 has one via 6 formed in a one-to-one correspondence. On the other hand, conductive member 12-6 has two vias 6 formed thereon. In addition, the first conductive part 12-1 has nine vias 6, each of which is electrically connected to the first conductive part 12-1. However, the position and number of vias 6 formed on the support 1 can be appropriately changed depending on the application of the light-emitting device.

[0052] In the examples shown in Figures 1, 4, and 5, conductive member 12-2 is electrically connected to the bottom wiring 13-1 via the corresponding via 6. Conductive member 12-3 is electrically connected to the bottom wiring 13-2 via the corresponding via 6. Conductive member 12-4 is electrically connected to the bottom wiring 13-3 via the corresponding via 6. Conductive member 12-5 is electrically connected to the bottom wiring 13-4 via the corresponding via 6. Conductive member 12-6 is electrically connected to the bottom wiring 13-5 and bottom wiring 13-8 via the corresponding via 6. Conductive member 12-7 is electrically connected to the bottom wiring 13-6 via the corresponding via 6. Conductive member 12-8 is electrically connected to the bottom wiring 13-7 via the corresponding via 6. Conductive member 12-9 is electrically connected to the bottom wiring 13-9 via the corresponding via 6. Conductive member 12-10 is electrically connected to the bottom wiring 13-10 via the corresponding via 6. Conductive members 12-11 are electrically connected to the bottom wiring 13-11 via the corresponding via 6. Conductive members 12-12 are electrically connected to the bottom wiring 13-12 via the corresponding via 6. Conductive members 12-13 are electrically connected to the bottom wiring 13-13 via the corresponding via 6.

[0053] [Second Embodiment] Next, a light-emitting device according to the second embodiment will be described with reference to Figures 6 and 7. Figure 6 is a schematic top view of the light-emitting device 100a according to the second embodiment. Figure 7 is a schematic cross-sectional view taken along line VII-VII in Figure 6. Note that names and reference numerals identical to those used in the previously described embodiments indicate the same or identical components or configurations, and detailed explanations will be omitted as appropriate. This also applies to the descriptions of the embodiments described later.

[0054] As shown in Figures 6 and 7, the light-emitting device 100a according to this embodiment differs from the light-emitting device 100 according to the first embodiment in that it further includes a reflective member 7 that covers at least a portion of the side surface 3S of the integrated circuit 3 facing the first light-emitting element 21.

[0055] In the examples shown in Figures 6 and 7, the integrated circuit 3 has a roughly rectangular shape when viewed from above. Of the four corners 3K-1, 3K-2, 3K-3, and 3K-4 of the integrated circuit 3 when viewed from above, the two corners 3K-1 and 3K-2 located on the side of the first light-emitting element 21 are covered by the reflective member 7. On the other hand, the two corners 3K-3 and 3K-4 located on the opposite side of the first light-emitting element 21 are exposed from the reflective member 7.

[0056] For example, if some of the light emitted from the first light-emitting element 21 is incident on the integrated circuit 3, the light may be absorbed by the integrated circuit 3, which may reduce the light extraction efficiency of the light-emitting device 100a. In this embodiment, by covering at least a portion of the side surface 3S of the integrated circuit 3 facing the first light-emitting element 21 with a reflective member 7, the light emitted from the first light-emitting element 21 that is directed toward the integrated circuit 3 is reflected by the reflective member 7. As a result, the absorption of the light directed toward the integrated circuit 3 is reduced, and it contributes to the light emitted from the light-emitting device 100a. As a result, in this embodiment, the light extraction efficiency of the light-emitting device 100a is improved.

[0057] Furthermore, if, for example, the reflective member 7 covers corners 3K-3 and 3K-4 of the integrated circuit 3, it becomes necessary to secure a certain area on the outside (for example, the rear side) of the integrated circuit 3 on the support 1 when viewed from above, for the reflective member 7 to be placed. This can lead to the light-emitting device becoming larger. In this embodiment, of the corners 3K-1, 3K-2, 3K-3, and 3K-4 of the integrated circuit 3, only corners 3K-1 and 3K-2 are covered with the reflective member 7. This eliminates the need to secure an area on the outside of the integrated circuit 3 on the support 1 when viewed from above, for the reflective member 7 to be placed. As a result, the light-emitting device 100a can be made smaller compared to the case where all corners 3K-1, 3K-2, 3K-3, and 3K-4 are covered with the reflective member 7.

[0058] Furthermore, by covering corners 3K-1 and 3K-2 with the reflective member 7, the likelihood of the integrated circuit 3 peeling off from the support 1 is reduced. In addition, by exposing corners 3K-3 and 3K-4, which are located on the opposite side of the first light-emitting element 21, from the reflective member 7, the volume of the reflective member 7 is reduced. As the volume of the reflective member 7 is reduced, variations in the shape of the reflective member 7 become easier to reduce. This makes it easier to reduce variations in appearance between multiple light-emitting devices 100a, for example, when multiple light-emitting devices 100a are used.

[0059] (Reflective member 7) The reflective member 7 is a member that reflects light emitted by the first light-emitting element 21, the second light-emitting element 22, and the third light-emitting element 23. In this specification, "reflective" means that the reflectance with respect to the emission peak wavelength of at least one of the first light-emitting element 21, the second light-emitting element 22, and the third light-emitting element 23 is 50% or more. However, from the viewpoint of improving the light extraction efficiency of the light-emitting device 100a, it is preferable that the reflectance with respect to the emission peak wavelength of each of the first light-emitting element 21, the second light-emitting element 22, and the third light-emitting element 23 is 50% or more.

[0060] The reflective member 7 includes, for example, a base resin material and a light-reflecting substance. As the resin material for the reflective member 7, thermosetting resins, thermoplastic resins, etc., can be used. In the case of thermoplastic resins, polyphthalamide resins, polybutylene terephthalate (PBT), unsaturated polyesters, etc., can be used. In the case of thermosetting resins, epoxy resins, modified epoxy resins, silicone resins, modified silicone resins, etc., can be used. In particular, it is preferable to use thermosetting resins such as epoxy resins and silicone resins that have excellent heat resistance and light resistance as the resin material.

[0061] The reflective member 7 preferably contains a light-reflective substance in the base resin material. The light-reflective substance preferably has a large refractive index difference with respect to the base resin material and does not easily absorb light from the first light-emitting element 21, the second light-emitting element 22, and the third light-emitting element 23. Examples of light-reflective substances include titanium oxide, zinc oxide, silicon oxide, zirconium oxide, aluminum oxide, and aluminum nitride. The reflective member 7 may also contain a light-absorbing substance in the base resin material. Dark-colored pigments such as carbon black can be used as the light-absorbing substance. The reflective member 7 may also be composed of an inorganic material containing, for example, boron nitride and alkali metal silicate. A reflective member composed of an inorganic material may further contain titanium oxide or zirconium oxide.

[0062] In the light-emitting device 100a, it is preferable that the reflective member 7 is separated from the first light-emitting element 21, the second light-emitting element 22, and the third light-emitting element 23. By separating the reflective member 7 from the light-emitting elements 2, the reflective member 7 can more easily extract light from the sides of the first light-emitting element 21, the second light-emitting element 22, and the third light-emitting element 23. The reflective member 7 can be formed, for example, by applying an uncured reflective member onto an integrated circuit using a nozzle, and then curing the uncured reflective member.

[0063] Furthermore, effects other than those described in this embodiment are the same as those of the light-emitting device 100 according to the first embodiment.

[0064] [Third Embodiment] Next, a light-emitting device according to the third embodiment will be described with reference to Figures 8 and 9. Figure 8 is a schematic top view of the light-emitting device 100b according to the third embodiment. Figure 9 is a schematic cross-sectional view taken along the line IX-IX in Figure 8.

[0065] As shown in Figures 8 and 9, the light-emitting device 100b according to this embodiment differs from the light-emitting device 100a according to the second embodiment in that the support 1 includes a second recess 20 located between the connecting portion 61 and the first light-emitting element 21 in the first direction D1.

[0066] In the example shown in Figure 8, the support 1 includes a second recess 20, so the first conductive portion 12-1 includes a conductive member 12-14 on which the integrated circuit 3 is located, and a conductive member 12-15 on which the first light-emitting element 21, the second light-emitting element 22, and the third light-emitting element 23 are located. The conductive members 12-14 and 12-15 are located apart from each other.

[0067] As shown in Figure 9, the second recess 20 is a portion recessed downward from the upper surface 1a of the support 1. In the example shown in Figure 9, the second recess 20 is formed by a hole that penetrates from the upper surface to the lower surface of the conductive member 12, which is placed on the base material 11. The inner surface 20b of the second recess 20 is defined by the base material 11 and the conductive member 12. However, the second recess 20 is not limited to a hole that penetrates from the upper surface to the lower surface of the conductive member 12. For example, the second recess 20 may be formed by a depression that does not penetrate the conductive member 12, or by a hole that penetrates from the upper surface of the conductive member 12 to the lower surface 1b of the base material 11. Furthermore, the second recess 20 may be formed by a hole that penetrates from the upper surface to the lower surface of the conductive member 12 and a depression that does not penetrate the base material 11 and overlaps with the hole in a top view.

[0068] In the example shown in Figure 8, the second recess 20 includes a plurality of bent portions 20a in a top view and extends in the second direction D2. However, the shape of the second recess 20 in a top view can be changed as appropriate. The second recess 20 does not divide the first conductive portion 12-1 into conductive members 12-14 and 12-15, but may be a recess formed in a part of the first conductive portion 12-1 in a top view. Also, the second recess 20 may have a shape that includes a curved portion in a top view.

[0069] For example, in a light-emitting device having a reflective member 7, during the manufacturing process of the light-emitting device, the reflective member 7 remains fluid after being placed on the support until it solidifies, and may spread and wet on the support. If the reflective member 7 placed on the support spreads and comes into contact with a light-emitting element placed on the support, the light emitted from the light-emitting element may be blocked by the reflective member 7, which may reduce the light extraction efficiency of the light-emitting device.

[0070] In this embodiment, the second recess 20 is located between the connecting portion 61 and the first light-emitting element 21 in the first direction D1. The second recess 20 prevents the reflective member 7, which is placed on the support 1, from wetting and spreading during the manufacturing process of the light-emitting device 100, even if the reflective member 7 is wet and spreads. This reduces the amount of wetting and spreading of the reflective member 7 to the positions of the first light-emitting element 21, second light-emitting element 22, or third light-emitting element 23. As a result, the contact of the reflective member 7 with the first light-emitting element 21, second light-emitting element 22, or third light-emitting element 23 is reduced, and the light extraction efficiency of the light-emitting device 100b can be improved. Effects other than those described in this embodiment are the same as those of the light-emitting device 100a according to the second embodiment.

[0071] [Fourth Embodiment] Next, a light-emitting device according to the fourth embodiment will be described with reference to Figures 10 and 11. Figure 10 is a schematic top view of the light-emitting device 100c according to the fourth embodiment. Figure 11 is a schematic cross-sectional view taken along the line XI-XI in Figure 10.

[0072] As shown in Figures 10 and 11, the light-emitting device 100c according to this embodiment has a frame 8 surrounding the first light-emitting element 21 when viewed from above. The outer edge of the integrated circuit 3 has a rectangular shape. Of the four corners 3K-1, 3K-2, 3K-3, and 3K-4 of the integrated circuit 3, the two corners 3K-1 and 3K-2 located on the side of the first light-emitting element 21 are covered by the frame 8, while the two corners 3K-3 and 3K-4 located on the opposite side of the first light-emitting element 21 are exposed from the frame 8. The light-emitting device 100c according to this embodiment differs from the light-emitting device 100a according to the second embodiment in these respects.

[0073] In the example shown in Figure 10, the frame 8 continuously surrounds the entire circumference of the first light-emitting element 21, the second light-emitting element 22, and the third light-emitting element 23. In other words, the first light-emitting element 21, the second light-emitting element 22, and the third light-emitting element 23 are located within the region continuously surrounded by the frame 8. However, the frame 8 may continuously surround at least the entire circumference of the first light-emitting element 21, or it may intermittently surround at least the periphery of the first light-emitting element 21. The frame 8 can be made of the same material as the reflective member 7 described in the second embodiment.

[0074] In this embodiment, by surrounding the first light-emitting element 21 with the frame 8, the light emitted from the first light-emitting element 21 is reflected by the frame 8 and contributes to the light emitted from the light-emitting device 100c. This improves the light extraction efficiency of the light-emitting device 100c. Furthermore, surrounding the first light-emitting element 21 with the frame 8 makes it easier to increase the area that the frame 8 covers on the upper surface 1a of the support 1. As a result, absorption of light from the first light-emitting element 21 by the support 1 is reduced, improving the light extraction efficiency of the light-emitting device 100c.

[0075] In this embodiment, of the four corners 3K-1, 3K-2, 3K-3, and 3K-4 of the integrated circuit 3 as seen from above, only the two corners 3K-1 and 3K-2 located on the side of the first light-emitting element 21 are covered by the frame 8. This reduces the area occupied by the frame 8 on the support 1 compared to the case where all four corners 3K-1, 3K-2, 3K-3, and 3K-4 of the integrated circuit 3 are covered by the frame 8. As a result, the light-emitting device 100c can be miniaturized.

[0076] Furthermore, effects other than those described in this embodiment are the same as those of the light-emitting device 100a according to the second embodiment.

[0077] [Fifth Embodiment] Next, with reference to Figure 12, a light-emitting device according to the fifth embodiment will be described. Figure 12 is a schematic cross-sectional view of the light-emitting device 100d according to the fifth embodiment. Figure 12 shows a cross-section of the light-emitting device 100d corresponding to the line XI-XI in Figure 10.

[0078] The light-emitting device 100d according to this embodiment differs from the light-emitting device 100c according to the fourth embodiment in that it further includes a covering member 91 that covers the outer sides of the frame 8 and the integrated circuit 3, respectively.

[0079] In the example shown in Figure 12, the light-emitting device 100d includes a second reflective member 92 that covers the side surface 21S of the first light-emitting element 21, the side surface 23S of the third light-emitting element 23, and the upper surface 1a of the support 1, a second covering member 93 that covers the upper surface 21a of the first light-emitting element 21 and the upper surface 23a of the third light-emitting element 23, and a second recess 20. The covering member 91 covers the outer side surface 8a of the frame 8 and the outer side surface 3a of the integrated circuit 3. The outer side surface 8a of the frame 8 refers to the side of the frame 8 located on the opposite side of the frame 8 that faces the first light-emitting element 21 in a cross-sectional view. The outer side surface 3a of the integrated circuit 3 refers to the side of the integrated circuit 3 located on the opposite side of the integrated circuit 3 that faces the first light-emitting element 21 in a cross-sectional view.

[0080] In this embodiment, the covering member 91 covers the outer side surface 8a of the frame 8 and the outer side surface 3a of the integrated circuit 3, thereby reducing the amount of external force applied to the frame 8 and the integrated circuit 3. This protects the frame 8 and the integrated circuit 3 from external forces.

[0081] Furthermore, in this embodiment, the upper surface 21a of the first light-emitting element 21 and the upper surface 23a of the third light-emitting element 23 can be protected from external forces, etc., by covering them with the second covering member 93. The second covering member 93 may also cover the upper surface of the second light-emitting element 22. In addition, in this embodiment, the upper surface 93a of the second covering member 93 is the light-emitting surface of the light-emitting device 100.

[0082] The light-emitting device 100d may have a first light-emitting element 21, a second light-emitting element 22, and a third light-emitting element 23. The second reflective member 92 may cover the sides of each of the first light-emitting element 21, the second light-emitting element 22, and the third light-emitting element 23, and the upper surface 1a of the support 1. The second covering member 93 may cover the upper surfaces of each of the first light-emitting element 21, the second light-emitting element 22, and the third light-emitting element 23.

[0083] (Covering member 91) The covering member 91 is composed of, for example, a light-reflective material that blocks light by reflecting it. The covering member 91 functions to return the light emitted from the first light-emitting element 21, which has passed through the frame 8 and reached the covering member 91, back into the frame 8. This improves the light extraction efficiency from the light-emitting device 100d.

[0084] Examples of resins used for the base material of the coating member 91 include thermoplastic resins and thermosetting resins. In the case of thermoplastic resins, for example, polyamide resins, polyphthalamide resins, liquid crystal polymers, polybutylene terephthalate (PBT), and unsaturated polyesters can be used. In the case of thermosetting resins, for example, epoxy resins, modified epoxy resins, silicone resins, and modified silicone resins can be used.

[0085] The coating member 91 can be formed using a resin material in which light-reflecting properties are imparted by incorporating particles of a light-reflecting substance as a filler into the base material. Examples of light-reflecting substances that can be used include titanium dioxide, aluminum oxide, zirconium oxide, and magnesium oxide. The content of the light-reflecting substance filler in the coating member 91 should be 5% by mass or more and 60% by mass or less, and preferably 10% by mass or more and 50% by mass or less. The average particle size of the filler is preferably about 0.5 μm or more and 15 μm or less. By setting the size of the filler within this range, the coating member 91 can obtain at least one of good strength and light reflectivity. The coating member 91 may also be composed of a light-absorbing material. The coating member 91 may contain a light-absorbing substance in the resin material that serves as the base material. Dark-colored pigments such as carbon black can be used as the light-absorbing substance.

[0086] The covering member 91 can be formed using a resin material that has been given at least one of light reflectivity and strength by containing a filler in the base material, by molding methods such as transfer molding using a mold, injection molding, compression molding, etc., or coating methods such as screen printing.

[0087] (Second reflective member 92) The second reflective member 92 exposes at least a portion of the upper surface 21a of the first light-emitting element 21 and the upper surface 23a of the third light-emitting element 23. The second reflective member 92 may include a plurality of reflective particles and a base material made of a translucent material. For example, the reflective particles can be made of the same light-reflective material as the reflective member 7. For example, the base material of the second reflective member 92 can be made of the same resin material as the reflective member 7. The second reflective member 92 may or may not have the reflective particles settled. From the viewpoint of extracting light from the side of the light-emitting element, it is preferable that the reflective particles are unevenly distributed, for example, settled. To settle the reflective particles, natural sedimentation or centrifugal sedimentation can be used. Centrifugal sedimentation can be performed, for example, using a centrifuge. Furthermore, the second reflective member 92 may be made of an inorganic material containing, for example, boron nitride or alkali metal silicate. It may also contain titanium oxide or zirconium oxide. The second reflective member 92 only needs to cover the side surface 21S of the first light-emitting element 21 and the upper surface 1a of the support 1.

[0088] (Second covering member 93) The base material of the second coating member 93 can be the same material as the base material of the coating member 91. The second coating member 93 may contain multiple reflective particles. By containing multiple reflective particles in the second coating member 93, the light emitted from the upper surface 21a of the first light-emitting element 21 and the light emitted from the upper surface 23a of the third light-emitting element 23 are more easily diffused within the second coating member 93, thereby improving the color mixing properties of the light-emitting device 100d. The second coating member 93 may also contain a wavelength conversion member. Furthermore, the second coating member 93 only needs to cover at least a portion of the upper surface 21a of the first light-emitting element 21.

[0089] [Sixth Embodiment] Next, the light-emitting unit according to the sixth embodiment will be described with reference to Figure 13. Figure 13 is a schematic diagram showing an example of the system configuration of the light-emitting unit 200 according to the sixth embodiment.

[0090] The light-emitting unit 200 shown in Figure 13 has a plurality of light-emitting devices 100 according to the first embodiment. The plurality of light-emitting devices 100 are arranged in a line in the second direction D2. In the example shown in Figure 13, the light-emitting unit 200 has a plurality of light-emitting devices 100, including a first light-emitting device 100-1, a second light-emitting device 100-2, and a third light-emitting device 100-3. In this embodiment, the reliability of the light-emitting unit 200 can be improved by having a plurality of light-emitting devices 100. Note that the light-emitting unit 200 may have two or more of the light-emitting devices 100 according to the first embodiment, the light-emitting device 100a according to the second embodiment, the light-emitting device 100b according to the third embodiment, the light-emitting device 100c according to the fourth embodiment, and the light-emitting device 100d according to the fifth embodiment.

[0091] Each of the multiple light-emitting devices 100 shown in Figure 13 has a built-in SPI (Serial Peripheral Interface) and can communicate with the host controller via SPI. The SPI consists of signal lines including four systems: chip select, clock, and data lines (SDI and SDO). In the SPI, the main, which is the host controller, sends a clock signal to the replica light-emitting devices 100, and the replicas send or receive data in synchronization with the clock signal from the main. The main can control multiple light-emitting devices 100. The light-emitting unit 200 connects multiple light-emitting devices 100 in a daisy chain. In the daisy chain, one light-emitting device 100 is connected to the main, and the light-emitting device 100 connected to the main and the other multiple light-emitting devices 100 are connected in a chain. The light-emitting device 100 receives data sent from the main and sends data to the next light-emitting device 100. Each of the multiple light-emitting devices 100 can exchange data between the previous light-emitting device 100 and the next light-emitting device 100. In the light-emitting unit 200, multiple light-emitting devices 100 can be controlled by a single main power source such as a microcontroller by connecting them in a daisy-chain configuration.

[0092] Conductive member 12-5 is connected to an input terminal that receives electrical signals from adjacent light-emitting devices 100 among the multiple light-emitting devices 100. Conductive member 12-10 is connected to an output terminal that outputs electrical signals to adjacent light-emitting devices 100 among the multiple light-emitting devices 100. In other words, in the light-emitting unit 200 shown in Figure 13, multiple light-emitting devices 100 are connected in a daisy chain.

[0093] Let me explain in more detail. In the first light-emitting device 100-1, conductive member 12-13 receives the data SDO_IN from the second light-emitting device 100-2. Also, in the first light-emitting device 100-1, conductive member 12-10 outputs the chip select signal CSX_OUT, conductive member 12-11 outputs the clock signal SCLK_OUT, and conductive member 12-12 outputs the data signal SDI_OUT, all to the adjacent second light-emitting device 100-2.

[0094] In the second light-emitting device 100-2, conductive member 12-5 receives the chip select signal CSX_IN, conductive member 12-4 receives the clock signal SCLK_IN, and conductive member 12-3 receives the data signal SDI_IN, all from the adjacent first light-emitting device 100-1. Conductive member 12-2 also outputs the data SDO_OUT to the adjacent first light-emitting device 100-1. Furthermore, conductive member 12-10 receives the chip select signal CSX_OUT, conductive member 12-11 receives the clock signal SCLK_OUT, and conductive member 12-12 receives the data signal SDI_OUT, all from the adjacent third light-emitting device 100-3.

[0095] In the third light-emitting device 100-3, conductive member 12-5 receives the chip select signal CSX_IN, conductive member 12-4 receives the clock signal SCLK_IN, and conductive member 12-3 receives the data signal SDI_IN, all from the adjacent second light-emitting device 100-2. Conductive member 12-2 also outputs the data SDO_OUT to the adjacent second light-emitting device 100-2.

[0096] By connecting multiple light-emitting devices 100 in a daisy-chain configuration, the reliability of the light-emitting unit 200 is improved, and the wiring and connection management of the multiple light-emitting devices 100 within the light-emitting unit 200 can be efficiently performed.

[0097] Each of the multiple light-emitting devices 100 has a support 1 which includes a second conductive part located on one side of the integrated circuit 3 in the second direction D2, and a third conductive part located on the other side of the integrated circuit 3 in the second direction D2. In the example shown in Figure 13, "one side" is the left side in a top view, and "the other side" is the right side in a top view. Conductive members 12-2, 12-3, 12-4, and 12-5 shown in Figure 1 each correspond to the second conductive part. Conductive members 12-13, 12-12, 12-11, and 12-10 shown in Figure 1 each correspond to the third conductive part.

[0098] Each of the second and third conductive parts can either input or output electrical signals. By including the second and third conductive parts in the light-emitting unit 200, the number of electrical signal inputs and outputs to each of the multiple light-emitting devices 100 can be increased without increasing the size of the light-emitting unit 200 in the first direction D1, thereby increasing the degree of freedom in controlling each of the multiple light-emitting devices 100.

[0099] [Seventh Embodiment] Next, with reference to Figures 14 to 17, a light-emitting unit according to the seventh embodiment will be described. The light-emitting unit according to this embodiment differs from the light-emitting unit 200 according to the sixth embodiment in that it has a plurality of light-emitting devices 100 and a light-guiding member positioned above the plurality of light-emitting devices 100 to guide the light emitted from the plurality of light-emitting devices 100.

[0100] (Example 1) Figure 14 is a schematic top view showing a light-emitting unit 200a according to the first example of this embodiment. Figure 15 is a schematic cross-sectional view taken along the line XV-XV in Figure 14.

[0101] The light-emitting unit 200a includes a substrate 211, a first light-emitting device 100-1, a second light-emitting device 100-2, a third light-emitting device 100-3, a fourth light-emitting device 100-4, a fifth light-emitting device 100-5, and a light-guiding member 220a. The light-emitting unit 200a is a light-emitting unit used, for example, in ambient lighting.

[0102] In the first example shown in Figure 14, the first light-emitting device 100-1, the second light-emitting device 100-2, the third light-emitting device 100-3, the fourth light-emitting device 100-4, and the fifth light-emitting device 100-5 are arranged on the upper surface 212 of the substrate 211 in a second direction D2. The first light-emitting device 100-1, the second light-emitting device 100-2, the third light-emitting device 100-3, the fourth light-emitting device 100-4, and the fifth light-emitting device 100-5 can be any of the light-emitting devices 100, 100a, 100b, or 100c. For the sake of explanation, the first light-emitting device 100-1, the second light-emitting device 100-2, the third light-emitting device 100-3, the fourth light-emitting device 100-4, and the fifth light-emitting device 100-5 may be collectively referred to as light-emitting device 100 in the following description when they are not distinguished.

[0103] The light guide member 220a is a member that directs light emitted from multiple light-emitting devices 100 into its interior, guides the light through its interior, and then exits from its interior to the outside. The light guide member 220a is fixed so as to be located above the first light-emitting device 100-1, the second light-emitting device 100-2, the third light-emitting device 100-3, and the fourth light-emitting device 100-4. In a top view, the light guide member 220a has a roughly rectangular outer shape with its longitudinal side in the second direction D2, where the first light-emitting device 100-1, the second light-emitting device 100-2, the third light-emitting device 100-3, and the fourth light-emitting device 100-4 are aligned. Preferably, the light guide member 220a has a transmittance of 60% or more for light emitted from the light-emitting devices 100.

[0104] The light guide member 220a includes a first light guide section 220a-1, a second light guide section 220a-2, a third light guide section 220a-3, a fourth light guide section 220a-4, a fifth light guide section 220a-5, and a light emitting section 224. The first light guide section 220a-1 is positioned above the first light-emitting device 100-1 and guides light from the first light-emitting device 100-1. The second light guide section 220a-2 is positioned above the second light-emitting device 100-2 and guides light from the second light-emitting device 100-2. The third light guide section 220a-3 is positioned above the third light-emitting device 100-3 and guides light from the third light-emitting device 100-3. The fourth light guide unit 220a-4 is positioned above the fourth light-emitting device 100-4 and guides the light from the fourth light-emitting device 100-4. The fifth light guide unit 220a-5 is positioned above the fifth light-emitting device 100-5 and guides the light from the fifth light-emitting device 100-5.

[0105] The first light guide section 220a-1, the second light guide section 220a-2, the third light guide section 220a-3, the fourth light guide section 220a-4, and the fifth light guide section 220a-5 each include a light incident section 221a, a first reflecting section 222a, and a second reflecting section 223a.

[0106] The light incident portion 221a shown in Figure 15 is the portion through which light from the light-emitting device 100 passes when it enters the interior of the light guide member 220a. Furthermore, the light incident portion 221a constitutes a recessed portion that is concave upwards in a cross-sectional view including the second direction D2 and the third direction D3. In the top view shown in Figure 14, the light incident portion 221a has a roughly rectangular outer shape.

[0107] The first reflecting section 222a and the second reflecting section 223a are portions that reflect upward a portion of the light incident from the light incident section 221a that reaches the first reflecting section 222a and the second reflecting section 223a. The first reflecting section 222a and the second reflecting section 223a are arranged side by side in the second direction D2, with the light incident section 221a in between.

[0108] A portion of the light guided through the light incident section 221a and inside the light guide member 220a is emitted from the light guide member 220a through the light emission section 224. Another portion of the light that has passed through the light incident section 221a and inside the light guide member 220a is reflected by the first reflecting section 222a or the second reflecting section 223a, and then emitted from the light guide member 220a through the light emission section 224. The light emission section 224 is a common light emission section for the first light guide section 220a-1, the second light guide section 220a-2, the third light guide section 220a-3, the fourth light guide section 220a-4, and the fifth light guide section 220a-5.

[0109] In the light-emitting unit 200a, the light emitted from the first light-emitting device 100-1, the second light-emitting device 100-2, the third light-emitting device 100-3, the fourth light-emitting device 100-4, and the fifth light-emitting device 100-5 is guided by the light-guiding member 220a, thereby controlling the light distribution of the light emitted from the light-guiding member 220a.

[0110] (Example 2) Figure 16 is a schematic top view showing a light-emitting unit 200b according to a second example of this embodiment. Figure 17 is a schematic cross-sectional view taken along line XVII-XVII in Figure 16. Note that in the top view of Figure 16, some of the components corresponding to the cross-sectional view in Figure 17 may be omitted to avoid making the drawing excessively complex.

[0111] The light-emitting unit 200b includes a substrate 211, a first light-emitting device 100-1, a second light-emitting device 100-2, a third light-emitting device 100-3, a fourth light-emitting device 100-4, a fifth light-emitting device 100-5, and a light-guiding member 220b. The light-emitting unit 200b is a light-emitting unit used as a backlight for liquid crystal display panels and the like.

[0112] In the second example shown in Figure 16, the first light-emitting device 100-1, the second light-emitting device 100-2, the third light-emitting device 100-3, the fourth light-emitting device 100-4, and the fifth light-emitting device 100-5 are arranged on the upper surface 212 of the substrate 211 in a second direction D2. The first light-emitting device 100-1, the second light-emitting device 100-2, the third light-emitting device 100-3, the fourth light-emitting device 100-4, and the fifth light-emitting device 100-5 can be replaced with any of the light-emitting devices 100, 100a, 100b, or 100c.

[0113] The light guide member 220b includes a first light guide member 220b-1, a second light guide member 220b-2, a third light guide member 220b-3, a fourth light guide member 220b-4, and a fifth light guide member 220b-5.

[0114] The first light guide member 220b-1 is positioned above the first light-emitting device 100-1. The first light guide member 220b-1 is a member that causes light emitted from the first light-emitting device 100-1 to enter its interior, guides the light through the interior of the first light guide member 220b-1, and then causes the light to exit from the interior of the first light guide member 220b-1 to the outside.

[0115] The second light guide member 220b-2 is positioned above the second light-emitting device 100-2. The second light guide member 220b-2 is a member that causes light emitted from the second light-emitting device 100-2 to enter the interior of the second light guide member 220b-2, guides the light through the interior of the second light guide member 220b-2, and then causes the light to exit from the interior of the second light guide member 220b-2 to the outside.

[0116] The third light guide member 220b-3 is positioned above the third light-emitting device 100-3. The third light guide member 220b-3 is a member that causes light emitted from the third light-emitting device 100-3 to enter its interior, guides the light through the interior of the third light guide member 220b-3, and then causes the light to exit from the interior of the third light guide member 220b-3 to the outside.

[0117] The fourth light guide member 220b-4 is positioned above the fourth light-emitting device 100-4. The fourth light guide member 220b-4 is a member that causes light emitted from the fourth light-emitting device 100-4 to enter the interior of the fourth light guide member 220b-4, guides the light through the interior of the fourth light guide member 220b-4, and then causes the light to exit from the interior of the fourth light guide member 220b-4 to the outside.

[0118] The fifth light guide member 220b-5 is positioned above the fifth light-emitting device 100-5. The fifth light guide member 220b-5 is a member that causes light emitted from the fifth light-emitting device 100-5 to enter its interior, guides the light through the interior of the fifth light guide member 220b-5, and then causes the light to exit from the interior of the fifth light guide member 220b-5 to the outside.

[0119] The first light guide member 220b-1, the second light guide member 220b-2, the third light guide member 220b-3, the fourth light guide member 220b-4, and the fifth light guide member 220b-5 each preferably have a substantially circular outer shape when viewed from above and have a transmittance of 60% or more to the light emitted from the light-emitting device 100. Furthermore, the first light guide member 220b-1, the second light guide member 220b-2, the third light guide member 220b-3, the fourth light guide member 220b-4, and the fifth light guide member 220b-5 each include a light incident part 221b, a first light emission part 222b, and a second light emission part 223b.

[0120] The light incident portion 221b is a substantially flat portion through which light from the light-emitting device 100 passes when it enters the interior of the light guide member 220b. When viewed from above, the light incident portion 221b has a substantially circular outer shape.

[0121] The first light-emitting section 222b is a curved portion through which some of the light emitted from the light-emitting device 100 and transmitted through the interior of the light-guiding member 220b is emitted from the light-guiding member 220b. In a top view, the first light-emitting section 222b has a substantially circular annular shape.

[0122] The second light-emitting section 223b is a substantially flat portion through which some of the light emitted from the light-emitting device 100 and transmitted through the inside of the light-guiding member 220b passes when it is emitted from the light-guiding member 220b. The second light-emitting section 223b has a substantially circular outer shape when viewed from above.

[0123] In the light-emitting unit 200b, the light emitted from the first light-emitting device 100-1, the second light-emitting device 100-2, the third light-emitting device 100-3, the fourth light-emitting device 100-4, and the fifth light-emitting device 100-5 is guided by the light-guiding member 220b, thereby controlling the light distribution of the light emitted from the light-guiding member 220b.

[0124] The light guide members in the light-emitting unit according to this embodiment are not limited to the light guide member 220a shown in the first example and the light guide member 220b shown in the second example. The light guide members in the light-emitting unit according to this embodiment may be, for example, one or more convex lenses, one or more concave lenses, one or more meniscus lenses, one or more Fresnel lenses, one or more diffractive lenses, one or more cylindrical lenses, or a combination thereof.

[0125] Although preferred embodiments have been described in detail above, the invention is not limited to the embodiments described above, and various modifications and substitutions can be made to the embodiments described above without departing from the scope of the claims.

[0126] The ordinal numbers, quantities, and other figures used in the description of the embodiments are all illustrative to specifically illustrate the technology of this disclosure, and this disclosure is not limited to the illustrative figures. Furthermore, the connection relationships between the components are illustrative to specifically illustrate the technology of this disclosure, and are not limited to the connection relationships that realize the functions of this disclosure.

[0127] The light-emitting device and light-emitting unit of this disclosure can improve the reliability of the light-emitting device and can therefore be suitably used, for example, as a light-emitting device or lighting device for the interior of a vehicle such as an automobile. However, the light-emitting device and light-emitting unit of this disclosure are not limited to light-emitting devices or lighting devices for the interior of a vehicle and can be used for a variety of applications.

[0128] The aspects of this disclosure are, for example, as follows: <Item 1> A light-emitting device comprising a support having a base material and a plurality of conductive members supported by the base material and including a first conductive portion, wherein the support has a first recess on its upper surface, a first light-emitting element disposed on the support, an integrated circuit disposed on the support having a first direction and a second direction orthogonal to the first direction in a top view, aligned with the first light-emitting element in the first direction, a bonding member disposed between the support and the integrated circuit and joining the support and the integrated circuit, and a first wire connected to the first conductive portion and the integrated circuit, wherein the first recess is located between the connection portion to which the first conductive portion and the first wire are connected and the integrated circuit in the first direction. <Item 2> The light-emitting device according to <Item 1>, wherein the maximum length of the first recess in the second direction is longer than the maximum length of the first recess in the first direction. <Item 3> The inner surface of the first recess is the light-emitting device described in <Item 1> or <Item 2>, defined by the base material and the conductive member. <Clause 4> The light-emitting device according to any one of <Clause 1> to <Clause 3>, wherein in the second direction, the maximum length of the first recess is longer than the maximum length of the first light-emitting element. <Clause 5> The light-emitting device according to any one of <Clause 1> to <Clause 4>, wherein one of the plurality of conductive members located directly below the first light-emitting element includes a first portion that, in a top view, includes a region that overlaps with the first light-emitting element in the second direction, and in the second direction, the maximum length of the first recess is longer than the maximum length of the first portion. <Clause 6> The light-emitting device according to any one of <Clause 1> to <Clause 5>, wherein in the second direction, the maximum length of the first recess is shorter than the maximum length of the integrated circuit. <Clause 7> The integrated circuit is a light-emitting device according to any one of <Clause 1> to <Clause 6>, located on the first conductive portion. <Clause 8> The light-emitting device according to any one of <Clause 1> to <Clause 7>, having a plurality of second wires, each connected to the integrated circuit, wherein the integrated circuit includes, in a top view, a first outer edge facing the first light-emitting element, a second outer edge located on the opposite side of the first outer edge, a third outer edge connected to each of the first and second outer edges, and a fourth outer edge located on the opposite side of the third outer edge, wherein the plurality of second wires include the first wire and, in a top view, do not overlap with the second outer edge. <Clause 9> The support has vias electrically connected to the first conductive portion, and the integrated circuit is a light-emitting device according to any one of <Clause 1> to <Clause 8>, which overlaps with the vias in a top view. <Clause 10> The light-emitting device according to any one of <Clause 1> to <Clause 9>, further comprising a reflective member that covers at least a portion of the side surface of the integrated circuit facing the first light-emitting element. <Item 11> The light-emitting device according to <Item 10>, wherein, in a top view, the outer edge of the integrated circuit has a rectangular shape, and of the four corners of the integrated circuit in a top view, two corners located on the side of the first light-emitting element are covered by the reflective member, and two corners located on the opposite side of the first light-emitting element are exposed from the reflective member. <Clause 12> The support is the light-emitting device according to <Clause 10> or <Clause 11>, including a second recess located between the connecting portion and the first light-emitting element in the first direction. <Item 13> The light-emitting device according to any one of <Item 1> to <Item 12>, wherein, in a top view, it has a frame surrounding the first light-emitting element, the outer edge of the integrated circuit has a rectangular shape, and of the four corners of the integrated circuit, two corners located on the side of the first light-emitting element are covered by the frame, and two corners located on the opposite side of the first light-emitting element are exposed from the frame. <Item 14> The light-emitting device according to <Item 13>, further comprising a covering member that covers the outer side surfaces of the frame and the integrated circuit, respectively. [Explanation of Symbols]

[0129] 1 Support 1a Top surface 1b Bottom side 2 light-emitting elements 3. Integrated Circuits 3a Outer side 3G-1 First outer edge 3G-2 Second outer edge 3G-3 Third outer edge 3G-4 Fourth outer edge 3K-1, 3K-2, 3K-3, 3K-4 corner 3S side 4. Joining members 6 Beers 7 Reflective material 8 Frame 8a Outer side 10 First recess 10a Inner surface 11 Base material 12-1 First conductive part 12, 12-2, 12-3, 12-4, 12-5, 12-6, 12-7, 12-8, 12-9, 12-10, 12-11, 12-12, 12-13, 12-14, 12-15 Conductive members 13, 13-1, 13-2, 13-3, 13-4, 13-5, 13-6, 13-7, 13-8, 13-9, 13-10, 13-11, 13-12, 13-13 Bottom wiring 20 Second recess 20a Bent section 20b Inner surface 21 First light-emitting element 21a Top side 21S side 22 Second light-emitting element 23 Third light-emitting element 23a Top side 23S side 51 First wire 52 Second wire 61 Connection part 91 Covering member 92 Second reflective member 93 Second covering member 93a Top side 121 Part 1 100, 100a, 100b, 100c, 100d Light-emitting devices 100-1 First Light-Emitting Device 100-2 Second Light-Emitting Device 100-3 Third Light-Emitting Device 100-4 Fourth Light-Emitting Device 100-5 Fifth Light-Emitting Device 200, 200a, 200b light-emitting units 211 circuit board 212 Top surface 220a, 220b Light guide members 220a-1 First light guide 220a-2 Second light guide 220a-3 Third light guide section 220a-4 Fourth light guide 220a-5 Fifth light guide 220b-1 First light guide member 220b-2 Second light guide member 220b-3 Third light guide member 220b-4 Fourth light guide member 220b-5 Fifth light guide member 221a, 221b Light incidence part 222a 1st reflection section 222b First light output part 223a 2nd reflector 223b Second light output section 224 Light-emitting section D1 1st direction D2 2nd direction D3 Third direction L3 Maximum length of the integrated circuit in the second direction L10-1 Maximum length of the first recess in the first direction L10-2 Maximum length of the first recess in the second direction L21 Maximum length of the first light-emitting element in the second direction L121 Maximum length of the first portion in the second direction

Claims

1. A support comprising a base material and a plurality of conductive members supported by the base material and including a first conductive portion, wherein the support has a first recess on its upper surface, A first light-emitting element disposed on the support, In a top view, the integrated circuit has a first direction and a second direction perpendicular to the first direction, and is arranged on the support in the first direction, alongside the first light-emitting element. A bonding member is disposed between the support and the integrated circuit and joins the support and the integrated circuit, The first conductive part and the integrated circuit are connected by a first wire, The first recess is located in the first direction between the connection portion to which the first conductive portion and the first wire are connected and the integrated circuit of the light-emitting device.

2. The light-emitting device according to claim 1, wherein the maximum length of the first recess in the second direction is longer than the maximum length of the first recess in the first direction.

3. The light-emitting device according to claim 1, wherein the inner surface of the first recess is defined by the substrate and the conductive member.

4. The light-emitting device according to claim 1, wherein in the second direction, the maximum length of the first recess is longer than the maximum length of the first light-emitting element.

5. Of the plurality of conductive members, one conductive member located directly below the first light-emitting element includes a first portion that, in a top view, includes a region that overlaps with the first light-emitting element in the second direction. The light-emitting device according to claim 1, wherein in the second direction, the maximum length of the first recess is longer than the maximum length of the first portion.

6. The light-emitting device according to claim 1, wherein in the second direction, the maximum length of the first recess is shorter than the maximum length of the integrated circuit.

7. The light-emitting device according to claim 1, wherein the integrated circuit is located on the first conductive portion.

8. Each has a plurality of second wires connected to the aforementioned integrated circuit, The aforementioned integrated circuit, when viewed from above, The first outer edge facing the first light-emitting element, The second outer edge located on the opposite side of the first outer edge, A third outer edge connected to the first outer edge and the second outer edge, Including the fourth outer edge located opposite the third outer edge, The light-emitting device according to claim 1, wherein the plurality of second wires include the first wire and do not overlap with the second outer edge in a top view.

9. The support has vias that are electrically connected to the first conductive portion. The light-emitting device according to claim 1, wherein the integrated circuit overlaps with the via in a top view.

10. The light-emitting device according to claim 1, further comprising a reflective member that covers at least a portion of the side surface of the integrated circuit facing the first light-emitting element.

11. In a top view, the outer edge of the integrated circuit has a rectangular shape. Of the four corners of the integrated circuit in a top view, The two corners located on the first light-emitting element side are covered by the reflective member. The light-emitting device according to claim 10, wherein the two corners located on the opposite side of the first light-emitting element are exposed from the reflective member.

12. The light-emitting device according to claim 10, wherein the support includes a second recess located between the connecting portion and the first light-emitting element in the first direction.

13. In a top view, The first light-emitting element has a frame surrounding it, The outer edge of the aforementioned integrated circuit has a rectangular shape. Of the four corners of the aforementioned integrated circuit, The two corners located on the first light-emitting element side are covered by the frame. The light-emitting device according to claim 1, wherein the two corners located on the opposite side of the first light-emitting element are exposed from the frame.

14. The light-emitting device according to claim 13, further comprising a covering member that covers the outer side surfaces of the frame and the integrated circuit, respectively.

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