Film manufacturing equipment
The film manufacturing apparatus addresses inefficiencies in adhesive application by using a multi-stage process to produce laminated films efficiently and uniformly, enabling continuous production of dicing-diebond films.
JP2026111748APending Publication Date: 2026-07-06NITTO DENKO CORP
Patent Information
- Application Number
- JP2024227141
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2024-12-24
- Publication Date
- 2026-07-06
Smart Images
Figure 2026111748000001_ABST
Abstract
To provide a film manufacturing apparatus capable of continuously producing laminated films. [Solution] The film manufacturing apparatus 1 includes a feeding means 2 for feeding out a raw film roll 1010 having a first film and a functional film provided on the first film; a cutting means 3 for forming a functional layer by forming cuts in the functional film of the raw film fed out by the feeding means; a removal means 4 for removing at least a portion of the area other than the functional layer of the functional film from the raw film; an adhesive means 5 for attaching a second film 1020 to the functional layer provided on the first film to obtain a laminated film; a winding means 6 for winding the laminated film obtained by the adhesive means into a roll; and a conveying means 7 provided between the feeding means and the winding means for conveying the laminated body until a laminated film is obtained using the raw film.
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Citation Information
Patent Citations
Dicing film and method
JP1985057642A